KR200474740Y1

KR200474740Y1 - Apparatus for Heating a Semiconductor Package Having an Extended Connecting Chamber Structure

Info

Publication number: KR200474740Y1
Application number: KR2020130000067U
Authority: KR
Inventors: 츠-홍 홍
Original assignee: 에이블프린트 테크놀로지 코포레이션 리미티드
Priority date: 2012-11-20
Filing date: 2013-01-03
Publication date: 2014-10-08
Also published as: TWM450049U; KR20140003199U; JP2014103372A; JP5525631B2

Abstract

In the present invention, there is provided a semiconductor packaging heating apparatus having an extended communication chamber structure, which includes a chamber body, a housing space formed therein, and a heater, and is connected to a pressure source through a pressure control assembly, Lt; / RTI > The chamber main body is coupled with the extended communication chamber, and further the motor accommodation chamber is connected to the extended communication chamber, and the motor accommodation chamber maintains the chamber pressure with the chamber body through the extended communication chamber. The turbo fan is coupled to the receiving space of the chamber body, and the turbo fan is driven and rotated through the motor to flow the gas in the accommodating space of the chamber body.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a semiconductor packaging heating apparatus having an extended communication chamber structure,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a design of a heat transfer device used in a semiconductor packaging process, and more particularly to a semiconductor packaging heating device having an extended communication chamber structure.

In a conventional semiconductor packaging process, a chip having a predetermined size must be cut from a wafer and adhered to the substrate. Since many bubbles are generated in the adhesive material during the adhesion process, after aging, pores are generated in the adhesive material, which affects the stability and quality of the product.

In the conventional method, bubbles of the glue layer of the adhesive material are discharged using the temporary high-temperature and high-pressure condition of the molding glue forming process. Or by using a vacuum system, the bubbles are discharged from the glue layer of the adhesive material. Or the process parameters and tools of the chip attaching device are adjusted to prevent foaming at the chip and adhesive material interface.

For example, in Taiwan patent publication No. 257314, an industrial constant-temperature high-pressure kiln apparatus is proposed. In this apparatus, an electric heater is fixed by a plurality of fixed columns at a closed end in a pressure kiln, A fan of a stirring device is provided at the center of the electric heating device and the driving shaft of the fan extends out of the kiln through a shaft bearing coupled to the outer surface of the kiln and connected to the porter through a belt.

The fan at the center of the electric heating device is rotated through the motor outside the kiln to stir the high pressure gas receiving heat in the kiln to control the accuracy of the high pressure gas in the kiln to within 3 ° C. This industrial constant temperature high-pressure kiln apparatus is an apparatus for removing bubbles in a semiconductor chip packaging process.

Technical problems to be solved in the present invention are as follows.

In the prior art, in order to obtain a uniform heating effect, a turbo fan is installed in a kiln and installed in a kiln using a drive shaft, and a shaft sealing unit is provided at a mounting joint portion to block pressure difference inside and outside the kiln.

However, since the shaft sealing unit simultaneously contacts the high temperature and high pressure environment inside the kiln and the outside ambient temperature and pressure environment at the same time, the shaft sealing unit is easily damaged and short time within a short time Must replace. Such a problem raises the cost of the parts, and frequent replacement causes a decrease in productivity due to wasted manpower resources and stoppage of the facilities.

Therefore, the main object of the present invention is to provide a semiconductor packaging heating apparatus having an extended communication chamber structure for solving the above problem and solving the use of the shaft sealing unit through designing on a motor structure.

The present invention provides a heating device that can uniformly heat the semiconductor packaging process so that the heating device maintains a preset pressure through the pressure control assembly and installs a turbo fan in the heating device, Another object of the present invention is to allow a semiconductor material provided in a heating device to uniformly receive heat by allowing the hot gas in the heating device to flow by driving and rotating the semiconductor device.

Means for solving the technical problems of the present invention are as follows.

The present invention has an extended communication chamber that allows the coupling end of the chamber body to receive and pass the power transmission shaft with a predetermined extension length and reduced diameter.

And a motor accommodation chamber for accommodating the motor in the extended communication chamber, wherein the motor accommodation chamber allows the extended communication chamber to maintain an isobaric chamber pressure with the chamber body The motor is placed in a constant pressure environment and the use of the shaft sealing unit is eliminated.

Advantageous effects of the present invention compared to the prior art are as follows.

The present invention is capable of preventing a decrease in productivity due to stoppage of the apparatus due to frequent replacement of parts and waste of manpower due to high pressure and high temperature in the kiln for a long time in the prior art.

And a cooling device is provided on the outer ring surface of the extended communication chamber so that the motor accommodation chamber and the chamber body form a constant temperature difference to prolong the working life of the motor.

And the extended communication chamber is coupled to the chamber body by at least one flange unit and at least one fastening assembly and the motor containment chamber is coupled to the extended communication chamber by at least one fastening assembly to facilitate attachment and detachment of the motor and turbo fan , Maintenance and replacement work time and labor cost of the motor and turbo fan can be reduced.

1 is a partially exploded view of a first embodiment of the present invention.
2 is a combined view of the first embodiment of the present invention.
3 is an operation diagram of the first embodiment of the present invention.
4 is a partially exploded view of a second embodiment of the present invention.
5 is a combined view of a second embodiment of the present invention.

1 and 2, the heating apparatus 100 of the present invention comprises a chamber body 1, a stylet 2, an extended communication chamber 3, and a motor accommodation chamber 4 . Among them, the stylet 2 is movably coupled to the front end of the chamber body 1.

A receiving space 10 and a coupling end 15 are formed in the chamber body 1 and one bracket 11 and at least one heater 12 are provided in the receiving space 10. The bracket 11 may be provided with a target to be heated, and the heating target may be a semiconductor chip.

The heater 12 includes a heating frame 121 and a heating pipe 122. The heating frame 121 is located at a predetermined position in the accommodation space 10 and the heating pipe 122 is connected to the heating frame 121 121) and has a function of heating in the accommodation space (10), so that the accommodation space (10) can be heated to reach a predetermined temperature rise speed.

A turbo fan 43 is provided in the accommodation space 10 of the chamber main body 1. A motor 41 is coupled to the power transmission shaft 42 protruding from the coupling end 15 of the chamber body 1, . The turbo fan 43 is located inside the heating frame 121 and drives the turbo fan 43 through the motor 41 to cause the gas in the accommodation space 10 of the chamber body 1 to flow.

The connecting end 15 of the chamber main body 1 is coupled with an extended communication chamber 3 for receiving and passing the power transmitting shaft 42 with a predetermined extension length and reduced diameter, And at least one bearing 45 for supporting the power transmission shaft 42 in the extended communication chamber 3. The motor accommodation chamber 4 accommodating the motor 41 is coupled to the extended communication chamber 3, (4) is provided with a motor accommodation space (40).

The extended communication chamber 3 is connected to the coupling end 15 of the chamber body 1 by at least one flange unit 8 and at least one fixing assembly 9, Is connected to the extended communication chamber (3) by at least one fixing assembly (9a).

The motor accommodation chamber 4 is connected to the accommodation space 10 of the chamber body 1, the accommodation space 30 of the extended communication chamber 3 and the motor accommodation space 4 of the motor accommodation chamber 4 via the extended communication chamber 3, (40) so that the chamber body (1) maintains the isobaric chamber pressure. And the cooling device 32 is provided on the outer ring surface 31 of the extended communication chamber 3 so that the motor housing chamber 4 and the chamber body 1 form a constant temperature difference.

A pair of wires 411 are connected to the motor 41 to extend to the outside of the motor accommodation chamber 4 and provide electric energy required for the motor 41 by being connected to a power source. The external system of the motor 41 is provided with a copper pipe 412 and connected to a water supply source to cool the motor 41.

A gate 44 is provided at a position adjacent to the extended communicating chamber 3 of the accommodating space 10 of the chamber main body 1 so that when the accommodating space 10 of the chamber main body 1 is heated, Thereby preventing the influence on the motor 41.

3, a temperature sensor 13 and a pressure sensor 14 are also provided in the internal accommodation space 10 of the chamber main body 1 and also connected to the controller 5, respectively.

The temperature sensor 13 senses the temperature of the accommodation space 10 and transmits the temperature signal S1 to the controller 5. [ The controller 5 drives the heater 12 through the heating drive signal S2 and also heats the receiving space 10 by the temperature signal S1 to reach a predetermined temperature and a predetermined temperature rise speed .

The pressure sensor 14 senses the chamber pressure P1 of the chamber body 1 and transmits the pressure signal S3 to the controller 5. [ The accommodation space 10 of the chamber body 1 communicates with the pressure control assembly 6 through the pressure conduit 61 and the pressure control assembly 6 is again connected to the pressure source 62, So that the chamber body 1 is maintained at the predetermined chamber pressure P1.

The pressure source 62 communicating with the pressure control assembly 6 may be an externally connected facility operation line 621 or an air compressor 622 incorporated in the heating apparatus 100. [ The operation of the pressure conduit 61 drives the pressure control assembly 6 by the pressure drive signal S4 of the controller 5 and causes the chamber body 1 to move to a predetermined chamber pressure P1).

The motor accommodation chamber 4 is connected to the accommodation space 10 of the chamber body 1, the accommodation space 30 of the extended communication chamber 3 and the motor accommodation space 4 of the motor accommodation chamber 4 via the extended communication chamber 3, The chamber pressure P2 of the motor accommodation chamber 4 and the chamber pressure P1 of the chamber main body 1 are maintained to maintain the isobaric chamber pressure (that is, P2 = P1) .

In the first embodiment of the present invention, since the chamber pressure P1 of the chamber main body 1 is maintained at 2 atmospheric pressure or higher, the chamber pressure P2 of the motor accommodation chamber 4 also becomes equal to or higher than 2 atmospheric pressure . The temperature of the accommodation space 10 of the chamber main body 1 is 25 ° C to 1000 ° C and the temperature of the motor accommodation chamber 4 is 25 ° C to 500 ° C due to the installation of the extension communication chamber 3 and the cooling device 32 ° C, and forms a temperature difference with the chamber body 1.

A motor temperature sensor 16 is provided in the motor accommodation space 40 of the motor accommodation chamber 4 to sense the temperature of the motor accommodation space 40 and to transmit the motor temperature signal S5 to the controller 5 Allowing the user to monitor the temperature of the motor 41 from time to time.

The controller 5 is provided with an operation panel 7 to manually set a preset temperature, a temperature rise speed and a pressure that the accommodation space 10 desires to reach, so that the heated target is heated uniformly .

As shown in Figs. 4 and 5, the motor housing chamber 4 includes the attaching / detaching end 46 and the cover plate 47. Fig.

The attachment plate 46 is formed at a predetermined position in the motor accommodation chamber 4 and the cover plate 47 is coupled to the motor accommodation chamber 4 through at least one fixing assembly 9b, The motor housing space 40 is formed.

While the present invention has been shown and described with respect to specific embodiments thereof, it will be understood by those skilled in the art that the present invention is not limited to the above-described embodiments, And various modifications may be made without departing from the spirit of the technical idea of the present invention described above.

100: Heating device 1: chamber body
10: accommodation space 11: bracket
12: heater 121: heating frame
122: heating tube 13: temperature sensor
14: Pressure sensor 15: Coupling end
16: Motor temperature sensor 2: Style
3: extended communication chamber 30: accommodation space
31: outer ring 32: cooling device
4: motor accommodating chamber 40: motor accommodating space
41: motor 411: conductor
412: Copper pipe 42: Power transmission shaft
43: Turbo fan 44: Gate
45: Bearing 46:
47: cover plate 5: controller
6: pressure control assembly 61: pressure pipe
62: pressure source 621: facility operation channel
622: Air compressor 7: Operation panel
8: Flange unit 9, 9a, 9b: Fixing assembly
S1: temperature signal S2: heating drive signal
S3: pressure signal S4: pressure drive signal
S5: Motor temperature signal P1, P2: Chamber pressure

Claims

At least one heater is provided in the accommodating space of the chamber body to heat the accommodating space to a predetermined temperature and a predetermined temperature rise speed Wherein the accommodating space communicates with a pressure source through a pressure control assembly to allow the accommodating space of the chamber body to maintain an isochronous chamber pressure, wherein a turbo fan is provided in the accommodating space of the chamber body, A semiconductor packaging heating apparatus having an extended communication chamber structure in which a motor is coupled to a power transmission shaft projected from a coupling end,
And an extended communication chamber for receiving and passing the power transmission shaft with a predetermined extension length and reduced diameter in the coupling end of the chamber body, and a bearing for supporting at least one power transmission shaft in the extended communication chamber, And a motor accommodating chamber for accommodating a motor in the communication chamber, wherein at least one pressure sensor and at least one temperature sensor are provided in the accommodating space of the chamber body, and the motor accommodating chamber is connected to the chamber main body Characterized in that a pressure chamber pressure is maintained and a cooling device is provided on the outer ring surface of the extended communication chamber so as to form a constant temperature difference between the motor accommodation chamber and the chamber body. Packaging heating device.

The method according to claim 1, wherein the temperature of the accommodation space of the chamber body is 25 ° C to 1000 ° C, and the temperature of the motor accommodation chamber is 25 ° C to 500 ° C due to the installation of the extension communication chamber and the cooling device. A semiconductor packaging heating apparatus having a chamber structure.

The semiconductor packaging heating apparatus according to claim 1, wherein a gate is provided in the housing space of the chamber body to prevent the gas in the housing space of the chamber body from affecting the motor.

The apparatus of claim 1, wherein the pressure source of the pressure control assembly is an air compressor.

The apparatus of claim 1, wherein the pressure source of the pressure control assembly is a facility operation conduit.

2. The semiconductor packaging heating apparatus according to claim 1, wherein the motor is surrounded by a copper tube to cool the motor.

The motor according to claim 1, wherein a motor accommodation space is formed in the motor accommodation space, and at least one motor temperature sensor is provided in the motor accommodation space to sense the temperature of the motor accommodation space. Wherein the semiconductor device is a semiconductor device.

2. The semiconductor packaging heating apparatus according to claim 1, wherein the extended communication chamber is coupled to the coupling end of the chamber body by at least one flange unit and at least one fixing assembly.

2. The semiconductor packaging heating apparatus according to claim 1, wherein the motor accommodation chamber is coupled to the extended communication chamber by at least one fixed assembly.

The motorcycle according to claim 1, wherein the motor accommodating chamber further comprises a detachable end and a cover plate, the detachable end is formed at a predetermined position of the motor accommodating chamber, and the cover plate is coupled to the motor accommodating chamber through at least one fixing assembly And a motor accommodating chamber formed in the motor accommodating chamber to form a motor accommodating space.