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TWI798403B - 感光性薄膜層合體及其硬化物，以及電子零件 - Google Patents

感光性薄膜層合體及其硬化物，以及電子零件 Download PDF

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Publication number
TWI798403B
TWI798403B TW108111124A TW108111124A TWI798403B TW I798403 B TWI798403 B TW I798403B TW 108111124 A TW108111124 A TW 108111124A TW 108111124 A TW108111124 A TW 108111124A TW I798403 B TWI798403 B TW I798403B
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TW
Taiwan
Prior art keywords
photosensitive film
film
photosensitive
hollow structure
protective film
Prior art date
Application number
TW108111124A
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English (en)
Chinese (zh)
Other versions
TW201947318A (zh
Inventor
荒井康昭
舟越千弘
佐藤和也
Original Assignee
日商太陽油墨製造股份有限公司
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Application filed by 日商太陽油墨製造股份有限公司 filed Critical 日商太陽油墨製造股份有限公司
Publication of TW201947318A publication Critical patent/TW201947318A/zh
Application granted granted Critical
Publication of TWI798403B publication Critical patent/TWI798403B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/03—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers with respect to the orientation of features
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/0427—Coating with only one layer of a composition containing a polymer binder
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/058—Holders; Supports for surface acoustic wave devices
    • H03H9/0585—Holders; Supports for surface acoustic wave devices consisting of an adhesive layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538—Roughness
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW108111124A 2018-03-30 2019-03-29 感光性薄膜層合體及其硬化物，以及電子零件 TWI798403B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018069669 2018-03-30
JP2018-069669 2018-03-30

Publications (2)

Publication Number Publication Date
TW201947318A TW201947318A (zh) 2019-12-16
TWI798403B true TWI798403B (zh) 2023-04-11

Family

ID=68113115

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108111124A TWI798403B (zh) 2018-03-30 2019-03-29 感光性薄膜層合體及其硬化物，以及電子零件

Country Status (4)

Country Link
JP (1) JP7514058B2 (ja)
KR (1) KR102713150B1 (ja)
CN (1) CN110317357B (ja)
TW (1) TWI798403B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240138093A (ko) * 2022-02-17 2024-09-20 도쿄 오카 고교 가부시키가이샤 중공 구조체의 제조 방법 및 적층체
CN114815508B (zh) * 2022-06-30 2022-09-23 杭州福斯特应用材料股份有限公司 感光干膜抗蚀剂层压体和线路板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI308257B (en) * 2004-12-03 2009-04-01 Tokyo Ohka Kogyo Co Ltd Photosensitive composition for forming light blocking film and black matrix formed with the photosensitive composition for forming light blocking film
JP2012068615A (ja) * 2010-05-20 2012-04-05 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性フィルム、リブパターンの形成方法、中空構造の形成方法及び電子部品
US20130076458A1 (en) * 2010-05-20 2013-03-28 Sadaaki Katou Photosensitive resin composition, photosensitive film, rib pattern formation method, hollow structure and formation method for same, and electronic component
JP2017120393A (ja) * 2015-12-28 2017-07-06 旭化成株式会社 積層体

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3522127B2 (ja) * 1998-11-17 2004-04-26 日立化成工業株式会社 感光性フィルム及びその積層方法
JP5707779B2 (ja) * 2010-08-24 2015-04-30 日立化成株式会社 感光性樹脂組成物、感光性フィルム、リブパターンの形成方法、中空構造の形成方法及び電子部品
JP6221204B2 (ja) * 2011-03-28 2017-11-01 日立化成株式会社 感光性樹脂組成物、感光性フィルム、パターン形成方法、中空構造の形成方法、及び電子部品
JP6767154B2 (ja) 2016-04-25 2020-10-14 太陽インキ製造株式会社 ドライフィルム、硬化物およびプリント配線板
JP6748478B2 (ja) 2016-04-25 2020-09-02 太陽インキ製造株式会社 ドライフィルム、硬化物およびプリント配線板
JP6767153B2 (ja) 2016-04-25 2020-10-14 太陽インキ製造株式会社 ドライフィルム、硬化物およびプリント配線板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI308257B (en) * 2004-12-03 2009-04-01 Tokyo Ohka Kogyo Co Ltd Photosensitive composition for forming light blocking film and black matrix formed with the photosensitive composition for forming light blocking film
JP2012068615A (ja) * 2010-05-20 2012-04-05 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性フィルム、リブパターンの形成方法、中空構造の形成方法及び電子部品
US20130076458A1 (en) * 2010-05-20 2013-03-28 Sadaaki Katou Photosensitive resin composition, photosensitive film, rib pattern formation method, hollow structure and formation method for same, and electronic component
JP2017120393A (ja) * 2015-12-28 2017-07-06 旭化成株式会社 積層体

Also Published As

Publication number Publication date
CN110317357A (zh) 2019-10-11
TW201947318A (zh) 2019-12-16
CN110317357B (zh) 2022-07-22
KR102713150B1 (ko) 2024-10-07
JP2019185033A (ja) 2019-10-24
JP7514058B2 (ja) 2024-07-10
KR20190114835A (ko) 2019-10-10

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