TWI673803B - Mounting device and mounting method for electronic parts, and manufacturing method of package parts - Google Patents

Abstract

The mounting device (1) according to the embodiment is provided with a platform portion (20) for placing a plurality of mounting areas of the supporting substrate (W) in a predetermined mounting position in order to be placed The platform (21) with the supporting substrate (W) moves; and the mounting section (50) moves the first and second mounting heads respectively holding and mounting the electronic parts in the mounting area to the mounting positions individually; And the first identification section (22) are for identifying the entire position of the supporting substrate (W) on the platform (21); and the second identification section are for the electronic parts held at the first or second mounting head The position of the platform (21) and the first and second mounting heads are determined based on the correction data of the movement position error of the platform (21) caused by the moving mechanism, the position data of the supporting substrate (W), and the electronics. The position data of the parts are controlled.

Description

Device and method for mounting electronic parts, and method for manufacturing packaged parts

Embodiments of the present invention relate to a mounting device and a mounting method for an electronic component, and a manufacturing method for a packaged component.

From the prior art, the manufacturing process of a semiconductor package using a general interposer substrate (relay substrate) such as CSP (Chip Size Package) or BGA (Ball Grid Array) is well known. In addition, a manufacturing process called Wafer Level Package (WLP), which does not use an interposer substrate and does not divide the wafer into individual semiconductor wafers, is a manufacturing process called Wafer Level Package (WLP). Know well. WLP, because it does not use an interposer, has the advantages of reducing the thickness of semiconductor packages and reducing manufacturing costs.

In WLP, a so-called fan-in wafer-level package that forms a rewiring layer including a semiconductor package's I / O terminals on a semiconductor wafer in such a way that it does not exceed the area on the surface of the semiconductor wafer on which the electrode pads are formed ( fan in-WLP (FI-WLP) is well known. Also, in recent years, a so-called fan-out wafer-level package has been proposed that forms a redistribution layer including I / O terminals of a semiconductor package beyond the area of a semiconductor wafer. WLP: FO-WLP). FO-WLP is a multi-chip package (Multi Chip Package) that can be used to mount semiconductor chips such as RAM, flash memory, and CPU in one package, or multiple types of electronic components such as diodes and capacitors. : MCP).

Here, the so-called MCP refers to a case where a plurality of types of electronic components are mounted in a single package, as described above. In this type of MCP, the displacement of the individual mounting positions of the electronic components mounted in the same package will affect each other's electrical characteristics of the package. Therefore, the installation of each electronic component is required. Has high position accuracy. In the aforementioned manufacturing process of the semiconductor package using the interposer substrate, since the alignment marks for position identification are set at each mounting area on the interposer substrate, it is applicable to each of the mounting areas by applying The method of identifying the alignment marks and positioning the electronic components in the installation area (hereinafter, referred to as a local identification method) is to achieve installation with high position accuracy.

In the manufacturing process of FO-WLP, first, a plurality of semiconductor wafers are mounted on a support substrate in a state of being spaced apart from each other, and then the spaces between the semiconductor wafers are sealed with resin to seal the plurality of semiconductor wafers. The semiconductor wafer is integrated to form a pseudo wafer which is shaped like a wafer formed by a semiconductor manufacturing process. On this pseudo-wafer, a redistribution layer for forming I / O terminals is formed. After the plurality of semiconductor wafers are sealed with resin and integrated, the supporting substrate is peeled off and removed. However, when it comes to manufacturing with FO-WLP In the case of MCP, since the support substrate does not have a pattern that can be used to identify the position of each mounting area where a semiconductor wafer is mounted, it is generally applicable to image recognition. Therefore, it is applicable. As for the general local identification method for the interposer, it lacks practicality.

When local identification is not possible, it becomes applicable to identify the entire position of the supporting substrate by identifying the alignment marks representing the outer position of the supporting substrate or the entire position of the substrate, and based on the entire position of the supporting substrate. A method of mounting a semiconductor wafer at each mounting area on a support substrate (hereinafter referred to as a global identification method). In addition, in the case where the mounting position of the semiconductor wafer in the MCP is shifted, for example, when a semiconductor wafer having a standard electrode pad diameter (20 μm) and a pitch (35 μm) is taken into consideration, the It is desirable that the contact area between the terminals of the chip and the terminals formed by the wiring layer and the contact between adjacent terminals be suppressed to within 5 μm.

However, it is attempting to apply a global identification method to a mounting device for mounting a semiconductor wafer on a substrate having an alignment mark on each of the mounting areas, such as an interposer substrate, and to directly use it in FO-WLP. After the manufacturing process, as a result, a mounting error of more than ± 5 μm was generated in the mounting accuracy, and the semiconductor wafer could not be mounted with good accuracy on each of the mounting areas. On a support substrate provided with a registration mark. Therefore, in the manufacturing process to which the FO-WLP with global identification method is applied, there is no such thing as ± 5μm. A mounting device for mounting a semiconductor wafer with the following position accuracy.

If it is only necessary to improve the mounting accuracy, it may be considered to set a registration mark in advance corresponding to each mounting area for the supporting substrate used in the FO-WLP manufacturing process, and apply a local identification method. However, the supporting substrate of FO-WLP is not used as a product because it is peeled and removed from the pseudo wafer after the pseudo wafer is formed. The installation of equipment and processes for forming marks to support such substrates will not only cause an increase in the number of processes, etc., but also will require identification of local marks each time a semiconductor wafer is installed in the installation process. This will increase the installation time for one semiconductor wafer. According to this point, the application of the local identification method will increase the manufacturing cost of the semiconductor package, and damage the advantages of the WLP.

In addition, in order to take measures against mounting errors of semiconductor wafers, a technique has been proposed for forming a rewiring layer in consideration of mounting errors of semiconductor wafers. This technology is to individually install the error (position shift from the ideal position) of each semiconductor wafer on the pseudo wafer before the exposure when the circuit pattern of the redistribution layer is exposed to the pseudo wafer. When the laser light for exposure is scanned for each semiconductor wafer, the position information of each circuit pattern included in the drawing data is corrected based on the mounting error of the semiconductor wafer to be exposed. By. This technology is applicable to a single crystal package in which one semiconductor wafer is incorporated in one semiconductor package. However, in the case of MCP, since the drawing information of the circuit pattern is enclosed Therefore, when relative positional deviations occur between semiconductor wafers in the same package, it cannot be done only by correcting the position information of the circuit pattern drawn. correspond.

Furthermore, for a mounting device used in a manufacturing process of FO-WLP, it is required to reduce the mounting time of a semiconductor wafer. That is, the formation process of the redistribution layer on the pseudo-wafer is usually performed in batches for one pseudo-wafer. In contrast, for the installation process of the semiconductor wafer supporting the substrate, it is performed for one wafer. One semiconductor wafer. If these processing times are considered, compared with the formation process of the redistribution layer, the installation process of the semiconductor wafer will take longer, so it is required to shorten the installation time of the semiconductor wafer. If it is only necessary to shorten the installation time, it may be considered to apply a mounting device having a plurality of mounting heads. However, if only a plurality of mounting heads are simply applied, the accuracy of mounting the semiconductor wafer will be further reduced due to the influence of a movement error generated at each of the mounting heads. As such, the mounting devices used in the manufacturing process of FO-WLP are required to simultaneously improve the mounting accuracy of electronic components such as semiconductor wafers and shorten the mounting time.

[Prior technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2008-041976

[Patent Document 2] Japanese Patent Laid-Open No. 2009-259917

[Patent Document 3] International Publication No. 2007/072714

[Patent Document 4] Japanese Patent Laid-Open No. 2013-058520

The problem to be solved by the present invention is to provide a support substrate that can be used for each mounting area even when a supporting substrate having a pattern such as a mark for position detection is not formed at each of the mounting areas. A mounting device and a mounting method for electronic parts that use electronic parts such as semiconductor wafers to be mounted with good accuracy and efficiency, and a method for manufacturing a packaged part to which such a mounting method is applicable.

The mounting device for an electronic component according to the embodiment includes a platform unit having a platform on which a supporting substrate having a plurality of mounting areas for mounting electronic components is mounted, and the plurality of mounting areas are sequentially arranged. A platform moving mechanism for moving the aforementioned platform in a manner of being positioned at a certain mounting position; and a mounting section having first and second mounting heads respectively holding the aforementioned electronic components and mounted on the aforementioned mounting area of the supporting substrate And a mounting head moving mechanism for interactively moving the first and second mounting heads holding the electronic parts to the mounting position; and a first identification section for the support substrate placed on the platform. And the second identification unit is for identifying the position of the electronic part held at the first or second mounting head; and the memory unit is for memorizing the position caused by the platform moving mechanism. Correction data for correcting the moving position error of the aforementioned platform; and a control section based on the aforementioned support base identified by the aforementioned first identifying section The location The data and the position data of the electronic components identified by the second identification unit and the correction data are used to control the movement of the platform and the first and second mounting heads.

The method for mounting an electronic component according to the embodiment includes: obtaining a moving position error of a platform on which a supporting substrate having a plurality of mounting areas for mounting the electronic component is mounted, and allowing a memory section to memorize the aforementioned moving position error A project for correcting the correction data; and a project for placing the aforementioned supporting substrate on the aforementioned platform and identifying the entire position of the aforementioned supporting substrate placed on the aforementioned platform; and one side based on the use of the aforementioned supporting substrate The position data of the support substrate and the correction data obtained by the position identification project are used to correct the movement of the platform while the plurality of installation areas are sequentially positioned at a certain installation position to move the platform. Engineering; and interactively receiving the aforementioned electronic parts through the first and second mounting heads, and identifying the positions of the aforementioned electronic parts held at the aforementioned first or second mounting heads, and one side based on the identified Position data of the aforementioned electronic parts to correct the movement of the aforementioned first and second mounting heads The first and second mounting heads are interactively moved to the mounting position, and the first and second mounting heads are used to interactively mount the electronic components to the mounting area sequentially positioned at the mounting position. Office works.

The method for mounting package parts according to the embodiment includes the steps of: mounting electronic components on each of the plurality of mounting areas at a support substrate having a plurality of mounting areas; and mounting the plurality of mounting areas on the plurality of mounting areas. The aforementioned electronic parts at the installation area are densely packed in batches. Encapsulation to form a pseudo wafer-like process; and a process of manufacturing a packaged part by forming a redistribution layer on the aforementioned electronic part of the pseudo wafer. The installation process of the aforementioned electronic parts in the manufacturing method of the packaged parts according to the embodiment includes: obtaining the moving position error of the platform on which the supporting substrate is placed, and causing the memory to memorize the correction of the moving position error. Projects for correcting data; and projects for placing the aforementioned supporting substrate on the aforementioned platform and identifying the entire position of the aforementioned supporting substrate placed on the aforementioned platform; and one side based on the position identification through the aforementioned supporting substrate The project of moving the aforementioned platform by the position data of the aforementioned supporting substrate and the aforementioned correction data obtained by the engineering to correct the movement of the aforementioned platform so that the aforementioned plural installation areas are sequentially positioned at a certain mounting position; The first and second mounting heads receive the electronic components interactively, and identify the position of the electronic components held at the first or second mounting heads, and based on the identified electronic components. The position data of parts is used to correct the movement of the first and second mounting heads so that the first And the second mounting head moves interactively to the aforementioned mounting position, and the first and second mounting heads are used to interactively mount the electronic parts to the process of the aforementioned mounting area sequentially positioned at the aforementioned mounting position .

1‧‧‧Installation device

10‧‧‧ Parts Supply Department

11‧‧‧wafer ring

12‧‧‧ Wafer ring holder

13‧‧‧The first camera

20‧‧‧Platform Department

21‧‧‧platform

22‧‧‧ 2nd camera

23‧‧‧ 4th camera

30‧‧‧ Substrate Transfer Department

40, 40A, 40B‧‧‧Transfer Department

43‧‧‧Reversal mechanism

44‧‧‧ adsorption nozzle

47‧‧‧Reverse arm

50, 50A, 50B‧‧‧Installation Department

51‧‧‧ Support Box

52‧‧‧X moving block

53‧‧‧Y-direction mobile device

55‧‧‧mounting head

56‧‧‧Installation tools

60‧‧‧Control Department

61‧‧‧Memory Department

W‧‧‧Support substrate

t‧‧‧semiconductor wafer

[Fig. 1] is a plan view showing a mounting device of an embodiment.

[Fig. 2] It is a front view showing a mounting device of an embodiment.

[Fig. 3] A right side view showing the mounting device of the embodiment.

[Fig. 4] It is a plan view showing a part of the mounting device of the embodiment by a two-point chain line, and is a diagram for explaining the carrying-in and carrying-out state of the supporting substrate.

[FIG. 5] It is a front view showing a part of the mounting device of the embodiment and omitting it, and is a diagram for explaining the position recognition state of the electronic part.

[Fig. 6] A block diagram showing the installation device of the embodiment.

7A is a plan view showing a wafer ring that supplies a semiconductor wafer to a mounting device according to an embodiment.

7B is a cross-sectional view of the wafer ring taken along the line X-X in FIG. 7A.

[Fig. 8] It is a diagram showing a preparation process for a calibration process of a substrate platform in the mounting device of the embodiment.

[Fig. 9] It is a diagram showing the calibration process of the substrate platform in the mounting device of the embodiment.

[FIG. 10] It is a figure explaining the correction method of the movement position error of the board | substrate platform in the mounting apparatus of embodiment.

[FIG. 11] It is a figure explaining the correction method of the position shift of the board | substrate platform in the mounting apparatus of embodiment.

[Fig. 12] A plan view showing an example of an electronic component mounted in one mounting area using the mounting device of the embodiment.

13 is a plan view showing a supporting substrate on which a semiconductor wafer is mounted using the mounting apparatus of Example 1 and Comparative Example 1. FIG.

[Fig. 14] It is a flowchart showing the manufacturing process of the packaged parts of the embodiment.

Hereinafter, a mounting device and a mounting method for an electronic component according to an embodiment will be described with reference to the drawings. The drawings are for illustrative purposes. The relationship between the thickness and the plane size, the thickness ratio of each part, etc. may be different from the real thing. In the description, the term representing the up and down direction refers to the relative direction when the mounting surface of the electronic component supporting substrate to be described later is set to the up and down direction when it is not specifically stated. When the term is not specifically stated, it refers to the direction based on the front view of FIG. 2.

[Configuration of Mounting Device]

FIG. 1 is a plan view showing the structure of a mounting device for electronic parts caused by an embodiment. FIG. 2 is a front view of the mounting device shown in FIG. 1, and FIG. 3 is a view shown in FIG. 1. The right side view of the mounting device shown. In FIGS. 1 and 2, they are arranged around the mounting device 1. The transfer sections 40A and 40B at the same position as the mounting sections 50A and 50B which are also arranged on the left and right sides are shown by the two-point chain line on the left transfer section 40A and the mounting section 50A, and the right shift The loading portion 40B and the mounting portion 50B are shown by a solid line. FIG. 4 is a diagram showing the left and right mounting portions 50A and 50B with a two-dot chain line in the same plan view as that in FIG. 1, and is used to explain the loading and unloading states of the support substrate W. FIG. FIG. 5 is a diagram illustrating the state of the identification camera by omitting the illustration of the transfer portion 40A and the mounting portion 50A on the left in the same front view as in FIG. 2. FIG. 6 is a block diagram showing the structure of the mounting device according to the embodiment. 7A and 7B are diagrams showing a wafer ring supplied with a semiconductor wafer as an electronic component. During these steps, the left-right direction is set to the X direction, the front-back direction is set to the Y direction, and the up-down direction is set to the Z direction with respect to the mounting device 1.

The mounting device 1 shown in FIGS. 1 to 6 includes a component supply unit 10 provided with electronic components for supplying a semiconductor wafer t, etc., a platform unit 20 provided with a platform 21 on which a supporting substrate W is placed, and 21 and a substrate transfer unit 30 for carrying in and out the support substrate W, a transfer unit 40 for one pair of semiconductor wafers t taken out from the component supply unit 10, and a semiconductor wafer taken out by the transfer unit 40 that receives a pair. A pair of mounting portions 50 mounted on the support substrate W on the platform 21 and a control portion 60 that controls the operation of each portion.

The component supply unit 10 includes a wafer ring 11 (FIGS. 7A and 7B) that holds a resin sheet S on which a semiconductor wafer T that has been sliced into individual semiconductor wafers t is held, and a wafer ring 11 Free loading and unloading A wafer ring holder 12 that is held on the ground and can be moved in the XY direction by an XY moving mechanism (not shown), and a first camera 13 that images a semiconductor wafer t attached to the wafer ring 11 And a protruding mechanism (not shown) that lifts out the semiconductor wafer t to be taken out from below the wafer ring 11 when the semiconductor wafer t is taken out by the transfer portion 40.

The upward protrusion mechanism is fixedly provided at a take-out position of the semiconductor wafer t caused by the transfer portion 40. Each semiconductor wafer t on the wafer ring 11 is sequentially positioned at the take-out position by the wafer ring holder 12. The first camera 13 is disposed directly above the take-out position, and is used for imaging the semiconductor wafer t positioned at the take-out position and identifying the position of the wafer.

The component supply unit 10 further includes an exchange device including a wafer ring 11 (not shown). The exchange device is provided with a receiving portion (also called a magazine having a plurality of groove portions for accommodating the wafer ring 11 in the up-down direction) provided on the front side of the mounting device 1 and a wafer ring. Transport Department. The exchange device is to supply the unused wafer ring 11 to the wafer ring holder 12, and to store the wafer ring 11 after the semiconductor wafer has been taken out in the storage section, and then supply a new wafer ring to Wafer ring holder 12

The electronic components mounted on the support substrate are not limited to one type of semiconductor wafer t, and may be a plurality of types of semiconductor wafers, and may be semiconductor wafers, diodes, and capacitors. The mounting device 1 according to the embodiment is manufactured by mounting a plurality of types of electronic components including a semiconductor wafer, a diode, and a capacitor on a support substrate W. For MCP, it is suitable for use. As examples of the configuration of the MCP, those who have a plurality of types of semiconductor wafers, those having one type of semiconductor wafers, diodes, and capacitors, and even those having a plurality of types of semiconductor wafers, diodes, and capacitors are listed. Wait.

The component supply unit 10 is not limited to a wafer supply mechanism using a wafer ring 11 on which a semiconductor wafer T formed into individual pieces is attached. The parts supply unit 10 may be a wafer supply mechanism using a tape feeder or a tray, for example. The so-called tape feeder is a semiconductor contained in each pocket of a carrier tape (also called an embossed carrier tape) in which concave (embossed) pockets are continuously formed on a belt-shaped resin sheet. The wafers t are suppliers one by one. The carrier tape is stored in a state in which a pocket containing the semiconductor wafer t is covered from above with a cover tape and wound on a reel. Moreover, it is comprised so that a carrier tape may be sent out from this reel, and a cover tape may be peeled, and each pocket will be sequentially located at the take-out position of a semiconductor wafer t.

When using such a tape feeder, the semiconductor wafer t can be picked up alternately by the left and right transfer sections 40A and 40B from one tape feeder, or it can be set as Two tape feeders are arranged side by side, and the semiconductor wafer t is picked up from the left-side tape feeder by the left-side transfer portion 40A, and the right-side transfer portion 401B is used to remove the semiconductor wafer t. The semiconductor wafer t is picked up by a feeder. Furthermore, it may be configured such that a plurality of types of tape feeders that accommodate semiconductor wafers t of different types can be configured as a plurality of types of equipment, and that a plurality of types of semiconductor wafers t can be selectively supplied. This kind of structure, for one branch This is effective when a plurality of types of semiconductor wafers t are mounted while holding the substrate W.

It is also possible to set both the supply of the semiconductor wafer t by the wafer ring 11 and the supply of the semiconductor wafer t by the tape feeder. Specifically, the belt feeder for the transfer part 40A on the left side is arranged on the left side of the wafer ring holder 12, and the belt feeder for the transfer part 40B on the right side is arranged on the right side. If an XY moving device is provided at each of the transfer sections 40A and 40B, the transfer nozzles of the transfer sections 40A and 40B can be moved to the take-out position of the semiconductor wafer t from the wafer ring 11 and the tape type. It is preferable that the semiconductor wafer is taken out by a feeder.

The stage unit 20 includes a stage 21 on which a support substrate W having a plurality of mounting areas is placed, and an XY moving mechanism (not shown) that moves the stage 21 in the XY direction. The XY moving mechanism moves the platform 21 in such a manner that each mounting area of the supporting substrate W placed on the platform 21 is sequentially positioned at a certain mounting position described in detail later. The stage 21 is configured to be capable of sucking and holding the support substrate W placed thereon by a suction suction mechanism (not shown). Above the platform 21, a second camera 22 is arranged to capture an image of the support substrate W. The second camera 22 is, for example, a person who takes an image of a global mark provided on the support substrate W, recognizes the entire position of the support substrate W, and functions as a first identification unit. The entire position of the support substrate W may be configured to image and recognize the shape of the outside of the support substrate W by the second camera 22.

The support substrate W placed on the platform 21 is, for example, a substrate for forming a wafer-like substrate suitable for use in the manufacture of FO-WLP, and is formed of a glass substrate, a silicon substrate, a metal substrate such as stainless steel, or the like. . The pseudo-wafer is a state in which electronic components such as a plurality of semiconductor wafers that have been singulated are arranged in a plane, and the electronic components are sealed with resin and formed into a plate shape. Thing. Therefore, the shape of the support substrate W used in the formation of the pseudo-wafer is not limited to a circle, but may be a quadrangle or other polygons, ellipses, etc., and its shape is not particularly limited. Make restrictions. The support substrate W is ideally the substrate used when the MCP is manufactured in the FO-WLP process as described above, that is, a plurality of semiconductor wafers and capacitors are mounted at each mounting area. Substrate for electronic parts.

The support substrate W includes a plurality of mounting areas on which electronic components such as a semiconductor wafer t are mounted. However, the plurality of mounting areas are assumed to be set on the support substrate W in an imaginary manner, and a mark, a pattern, or the like representing each of the mounting areas is not formed. The support substrate W may be provided with an alignment mark for global identification representing the position of the entire substrate, but it is not provided with an alignment mark for local identification representing the position of each mounting area. The so-called global identification method refers to a method of mounting electronic components to a plurality of mounting areas on the substrate by performing a single position detection of the substrate when mounting electronic components separately at a plurality of mounting areas supporting the substrate. The so-called local identification method refers to the mounting area of the electronic parts once and for all electronic parts when the electronic parts are respectively mounted at a plurality of mounting areas supporting the substrate. Way of position detection.

The substrate transfer unit 30 is provided with a transfer-in conveyor 31, a transfer-out conveyor 32, and a first transfer unit 33 that supports the transfer of the substrate W between the transfer-in conveyor 31 and the platform 21, and the platform 21 and transfer-out The second delivery unit 34 that delivers the support substrate W between the conveyor belts 32 is provided from the arrangement position of the conveyance belt 31 to the arrangement position of the conveyance belt 32, and the first and second deliveries are provided. The parts 33, 34 are movably supporting the guide part 35. The first and second delivery sections 33 and 34 are each configured to be individually movable along the guide section 35 by a timing belt (neither of which is shown) driven by a rotary motor. However, the driving of the delivery units 33 and 34 is not limited to the timing belt, but may be implemented by other driving devices such as a linear motor.

The first and second delivery sections 33 and 34 have the same structure, and include movable sections 33a and 34a that move along the guide section 35, and are movable up and down at the movable sections 33a and 34a. The horizontal arms 33b, 34b are provided, and four suction nozzles 33c, 34c are provided at the horizontal arms 33b, 34b so as to attract and hold the support substrate W from the upper side. The suction nozzles 33c and 34c are fixed to the horizontal arms 33b and 34b so as to be able to suck the remaining portions of the outer edge portion of the support substrate W that are not mounted with the semiconductor wafer t.

The pair of transfer sections 40 is configured by placing two transfer sections 40A and 40B in a state where they are reversed left and right. The two transfer sections 40A and 40B are in addition to being reversed left and right. To have the same structure. Referring to Fig. 1, Fig. 2 and Fig. 3, for the transfer part on the right The structure of 40B will be described. The transfer portion 40B is provided with a lifting device 41, an arm body 42 supported vertically and movably at the lifting device 41, a reversing mechanism 43 provided at an end portion in front of the arm body 42, and An adsorption nozzle (transfer nozzle) 44 is provided at the reversing mechanism 43. The lifting device 41 is provided with a rotation motor 45 and moves the arm body 42 up and down through a ball screw mechanism (not shown).

The reversing mechanism 43 is fixed to the front side of the device at the front end portion of the arm body 42 and includes a rotation driving portion 46 provided with a rotation shaft extending in the Y direction penetrating the arm body 42. And a reversing arm 47 connected to a rotation shaft of the driving unit 46. The reversing arm 47 is a 180-degree reversal between a horizontal state with its front end facing the left direction of the device and a horizontal state toward the right direction, with a circular track drawn on the upper side. The suction nozzle 44 is mounted on the reversing arm 47 so that the suction surface that vacuum-sucks the semiconductor wafer t faces downward when the reversing arm 47 is in a horizontal state facing the left direction. The transfer portion 40A on the left side has the same configuration except that the arrangement of each portion is reversed left and right.

The left and right transfer portions 40A and 40B are arranged such that the suction surface of the suction nozzle 44 is positioned on the protrusion mechanism when the reversing arm 47 is rotated so that the suction surface of the suction nozzle 44 faces downward. General positional relationship directly above (take-out position). Therefore, if the suction nozzles 44 of the two transfer sections 40A and 40B are simultaneously positioned at the take-out position and reversed, the suction nozzles 44 (the reverse arms 47 and each other) will collide with each other. Therefore, the adsorption nozzle 44 The state where the face is turned upward is reversed as the standby state, and is controlled so as to be interactively moved from the standby state to the take-out position.

The pair of mounting portions 50 are the same as those of the pair of transfer portions 40, and are arranged in a state where the two mounting portions 50A and 50B having the same configuration are reversed left and right. The configuration of the right mounting portion 50B will be described with reference to FIGS. 1, 2 and 3. The mounting portion 50B is provided with a support frame 51 that is gate-shaped when viewed from the side, an X-direction moving block 52 supported on the support frame 51 so as to be movable in the X direction, and is provided at the X The Y-direction moving device 53 on the left side of the direction-moving block 52, and the movable body 54 provided in the Y-direction moving device 53 so as to be movable in the Y-direction, and the movable body 54 can be directed upward and downward. The mounting head 55 is provided so as to move in a direction. At the lower end of the mounting head 55, a mounting tool 56 is provided. The mounting tool 56 is provided on the lower surface with a holding surface of the semiconductor wafer t. The mounting tool 56 is configured to be exchangeable in accordance with the type (especially the size) of the semiconductor wafer t. The mounting portion 50B may be an automatic exchanger provided with a mounting tool 56.

The frame material of the mounting portion 50 is generally a metal material such as aluminum. However, there is a possibility that a displacement may occur in the moving position of the mounting head 55 due to thermal expansion of aluminum or the like due to heat generated by the driving portion. In order to reduce such positional displacement caused by thermal expansion as much as possible, it is desirable to use a composite material between a metal material such as aluminum and a ceramic. Specifically, it is ideal to move the block in the X direction The body of the 52 and Y-direction moving device 53 is composed of a composite material between aluminum and ceramics. Examples of the composite material between aluminum and ceramics include a composite material between aluminum and silicon carbide (SiC). By using such a composite material, for example, the thermal expansion coefficient can be reduced to about 60% compared with aluminum.

Furthermore, the thermal expansion amount of the frame material caused by the movement of the device may be measured in advance, and the thermal expansion amount may be considered in the correction data of the mounting head 55. The correction data due to the thermal expansion of the frame material of the mounting portion 50 is obtained, for example, as described below. First, a target (not shown) for confirming the position of the mounting tool 56 is provided in the vicinity of the mounting tool 56 of the mounting head 55, and a third camera 57 to be described later is used to position the semiconductor wafer t. The position of the target at the receiving position is identified. Next, the mounting head 55 is moved to the mounting position, and the position of the target at this time is identified by the second camera 22. After the mounting head 55 is moved a specific number of times from the mounting position toward the mounting position, the position identification of such a target is performed again. With this operation, the amount of positional displacement of the mounting head 55 caused by the thermal expansion of the frame material caused by the movement of the device is obtained. The correction data obtained based on the positional offset of the mounting head 55 is taken into consideration when correcting the position of the mounting head 55 described later.

The X-direction moving block 52 is mounted on the support frame 51 via an X-direction guide member 52a, and is movable in the X direction by a ball screw mechanism (not shown) driven by a motor. The Y-direction moving device 53 is provided with a movable body 54 that can move freely in the Y-direction. The Y-direction guide member 53a supported by the ground and a ball screw mechanism (not shown) driven by the motor are capable of moving the movable body 54 in the Y-axis direction. Although not shown, the mounting portion 50B is provided with a moving device that moves the mounting head 55 in the vertical direction (Z direction). As the up-down direction moving device (moving guidance means), for example, linear movement guidance (LM guidance) and cross roller guidance are known, and any of these may be used. Among them, when the cross-roller guide is used as a guide means in the up-down direction, compared with the case where the LM guide is used, it has a level when it is repeatedly lowered to the same height position. The reproducibility of the position in the direction is high, that is, it is a feature that it is difficult to generate a position shift in the horizontal direction. The mounting head 55 is provided with a correction mechanism for a rotation direction (θ direction) (not shown). The mounting portion 50A on the left side has the same configuration except that the arrangement of each portion is reversed left and right.

The mounting section 50B receives the semiconductor wafer t taken out from the component supply section 10 by the transfer section 40B from the suction nozzle 44 and mounts the received semiconductor wafer t on a support placed on the stage 21. On the substrate W. Similarly, the mounting section 50A receives the semiconductor wafer t taken out from the component supply section 10 by the transfer section 40A from the suction nozzle 44 and mounts the received semiconductor wafer t on the stage to be placed on the stage. 21 places on the support substrate W. The mounting position where the mounting tool 56 mounts the semiconductor wafer t on the support substrate W on the stage 21 is set at a fixed position. Therefore, the platform 21 is controlled for movement so that each mounting area on the support substrate W is sequentially positioned at the mounting position. Here, the so-called fixed position is The center of the range in which the stage 21 can be moved in the XY direction is set. The second camera 22 is, for example, disposed directly above the mounting position. In addition, FIG. 1 shows the state where the platform 21 is located at a loading / unloading position where the substrate W is loaded / unloaded by the substrate transfer unit 30. Therefore, the platform 21 exists in a movable range. From the center, with a slight offset towards the rear side of the device.

The mounting position is not only the fixed position where the mounting tool 56 of the right mounting portion 50B is mounted on the supporting substrate W, but also the left mounting portion 50A and the right mounting portion 50B. For the same fixed position. That is, the position where the semiconductor wafer t is mounted on the support substrate W by the mounting portion 50A on the left side is the same as the position where the semiconductor wafer t is mounted on the support substrate W by the mounting portion 50B on the right side, and At the same mounting position, the mounting of the semiconductor wafer t is performed interactively by a pair of mounting portions 50A and 50B.

Each mounting area of the supporting substrate W is sequentially positioned at a certain mounting position by the XY moving mechanism of the platform portion 20, and therefore, the mounting tools 56 of the left and right mounting portions 50A and 50B are respectively received from the receiving positions. It then moves to a certain mounting position. The receiving position is a position where the semiconductor wafer t is received from the suction nozzles 44 of the transfer sections 40A and 40B. Below these moving paths of the mounting tools 56, there are disposed third cameras 57 for imaging the semiconductor wafer t held by the mounting tools 56 from below, respectively. Photo 3 The camera 57 is disposed at a lower level than the moving path of the mounting tool 56 and at an upper level than the wafer ring holder 12. The third camera 57 is provided at each of the moving path of the mounting tool 56 on the left mounting portion 50A and the moving path of the mounting tool 56 on the right mounting portion 50B. The third camera 57 functions as a second recognition unit.

The mounting device 1 according to the embodiment is provided with a control unit 60 as shown in FIG. 6. The control unit 60 controls the operations of the component supply unit 10, the platform unit 20, the substrate transfer unit 30, the transfer unit 40, and the mounting unit 50 based on the information stored in the memory unit 61, and includes a semiconductor wafer. The electronic components of t are sequentially mounted to each mounting area of the supporting substrate W. At the memory portion 61, data for correcting the movement position error of the platform 21 obtained through the acquisition process of the movement position error of the platform 21 described later is also stored. Based on the correction data, the movement system of the platform 21 is used as control.

[Motion of mounting device (installation of electronic parts)]

Next, a mounting process of electronic components such as the semiconductor wafer t using the mounting device 1 will be described. When electronic components such as a semiconductor wafer t are mounted at each mounting area of the support substrate W, when only the global identification method is applied, the position identification of the mounting area is not performed. Therefore, for each mounting The positioning accuracy of the semiconductor wafer t in the region becomes the recognition accuracy depending on the global mark and the like supporting the substrate W, and the machining accuracy of the XY moving mechanism of the stage 21. Of course However, from the perspective of metal processing, it is essentially impossible to complete the processing with a precision of ± 5 μm or less covering a desired length, such as a guide rail for guiding the movement of the platform 21. . Needless to say, it is even more impossible to assemble a guide rail having a desired length on a metal frame or the like with a linearity and undulation of ± 5 μm or less. Therefore, the movement position error of the platform 21 is measured, and data (correction) for correcting the movement of the platform 21 are obtained.

{Acquisition process (correction process) of the movement position error (correction data) of platform 21}

The data for correcting the movement position error of the platform 21 is obtained by using a general correction substrate 71 as shown in FIG. 8. The correction substrate 71 is, for example, one in which dot marks 72 for position identification are arranged in a matrix at a predetermined interval on a glass substrate. The dot marks 72 of the correction substrate 71 are set at, for example, 3 mm intervals within a range of 300 mm in length × 300 mm in width. The dot mark 72 is formed by a metal thin film or the like, and can be formed by a film forming technique such as etching or sputtering. The diameter of the dot mark is, for example, 0.2 mm. Such a correction substrate 71 is correctly set on the stage 21. The method of arranging the correction substrate 71 is not particularly limited, but it is performed by a general method shown below, for example. Here, the correction substrate 71 has the same size as the support substrate W, and the range in which the dot marks are set is the same size as the range including all the mounting areas on the support substrate W.

(Placement of the correction substrate 71)

The calibration substrate 71 as described above is set on the platform 21 by manual operation by an operator. The positioning of the correction substrate 71 is performed after the correction substrate 71 is placed on the stage 21 by performing parallel adjustment of the correction substrate 71 (adjustment in which the side-by-side direction of the dot mark 72 matches the XY direction). The parallel adjustment is performed using the second camera 22 used for imaging the global mark supporting the substrate W. First, on the calibration substrate 71 placed on the platform 21, for example, as shown in FIG. 8, the dot mark 72 at the corner on the left front of the calibration substrate 71 will become the second camera 22 The method of imaging the center of the field of view 22a adjusts the position of the platform 21.

From this state, the platform 21 is moved toward the left side in the X direction at a low speed (the dot mark 72 is moved slowly within the field of view 22a of the camera 22 to a normal speed). At this time, the operator monitors the captured image of the second camera 22 through the monitor. If the position of the dot mark 72 captured by the second camera 22 is directed upward or downward relative to the imaging field of view 22a, When the offset is achieved, the movement of the platform 21 is stopped, and the inclination of the correction substrate 71 is manually adjusted to a direction in which the offset is eliminated. The imaging field of view 22a in FIG. 8 shows an example of a state where the position of the dot mark 72 appearing in the imaging field of view 22a gradually shifts to the lower side as the platform 21 moves.

If the inclination of the correction substrate 71 is adjusted, the platform is adjusted again so that the dot mark 72 at the corner on the left front will be the center of the imaging field 22a of the second camera 22 21, and move the platform 21 to the left in the X direction at a low speed. Similarly, the operator monitors whether the position of the dot mark 72 gradually shifts by a monitor. After that, if the position is shifted, the movement of the platform 21 is stopped, and the inclination of the correction substrate 71 is adjusted. This operation is repeated until the dot mark 72 at the corner of the front right corner of the position of the correction substrate 71 does not appear on the monitor screen without being missed. If the dot mark 72 can be adjusted from the dot mark 72 in the front left corner to the dot mark 72 in the right front corner, the dot mark 72 can be introduced in the field of view 22a of the camera 22, and then the placement system of the correction substrate 71 is completed. The movement of the platform 21 by the operator is performed by the operation of a touch panel and a joystick, and the like.

(Acquisition of the movement position error (correction data) of platform 21)

Next, the position of the dot mark 72 of the calibration substrate 71 placed on the stage 21 by the general method as described above is sequentially detected to obtain the movement position error and the correction data obtained based thereon. The imaging of the dot mark 72 on the correction substrate 71 is, for example, as shown in FIG. 9, and the dot mark 72 located at the center of the correction substrate 71 is used as the initial dot mark (the first dot mark) 72 a. From this point mark 72a, it moves to the outside in a vortex-like trajectory in order, until it reaches the last point mark 72n.

First, the operator moves the calibration substrate 71 while operating the platform 21 while observing the monitor so that the first point mark 72a becomes the center of the field of view of the camera 22. Central The dot mark 72a is distinguishable from other dot marks 72, and a mark for identification is provided adjacent to the dot mark 72a. In FIG. 9, instead of displaying adjacent symbols, the dot symbol 72 a is indicated by a cross circle. If the first dot mark 72a is positioned so that it will become the center of the field of view of the camera 22, the detection operation of the dot mark 72 is started. From this stage, first, it is performed by the automatic control by the control part 60. When the operator presses (touches) the start key of the detection action displayed on the touch panel, the detection action is started.

If the detection operation of the dot mark 72 is started, first the first dot mark 72a is imaged. The image of the first dot mark 72a that has been captured is processed using a known image recognition technique, and the positional deviation of the dot mark 72 relative to the center of the field of view of the camera 22 is detected. The detected positional deviation is stored in the memory 61 as information paired with the movement position (XY coordinates) of the stage 21. When the position detection of the central point mark 72a is completed, the platform 21 is moved in such a manner that the next (second) point mark 72 is positioned within the field of view of the camera in accordance with the introduction sequence. In the example of FIG. 9, since the second dot mark 72 is located to the left of the first dot mark 72a, the platform 21 is moved toward the right side in the X direction by 3 mm.

The movement of the platform 21 is performed based on the read value of the linear encoder provided at the XY moving mechanism of the platform 21. At the scale of the linear encoder, as a thermal measure, it is ideal to use a glass scale with a small thermal expansion coefficient. If the movement of platform 21 ends, it is related to the first Similarly, one dot mark 72a is detected, and the position deviation of the second dot mark 72 is detected and stored in the memory 61 as information paired with the XY coordinates of the platform 21 at this time. The imaging of the dot mark 72 is performed after the platform 21 is stopped, and after waiting for a time capable of converging the vibration generated when the platform 21 is stopped. This operation is performed with respect to all the dot marks 72 on the substrate 71, and the movement position shift data of the dot marks 72 corresponding to the respective positions is obtained, and stored in the memory unit 61 as the correction data.

(Acquisition of correction data accompanying thermal expansion of the supporting substrate W)

In order to improve the bonding property of the die-bond film used for bonding the semiconductor wafer t, a heater may be provided on the stage 21 and the supporting substrate may be heated. In this case, since the temperature of the support substrate W changes (rises) before and after it is placed on the stage 21, the support substrate W generates thermal expansion corresponding thereto. If the thermal expansion of the support substrate W occurs, even if the platform 21 and the mounting head 55 are moved with good accuracy, the mounting position will shift by an amount corresponding to the extension amount of the support substrate W.

Therefore, it is preferable to grasp the thermal expansion amount of the support substrate W caused by heating of the heater in advance by measurement or the like, and when the semiconductor wafer t is mounted on the support substrate W, the correction data is multiplied by A coefficient (%) corresponding to the thermal expansion amount grasped in advance, and the movement of the platform 21 is controlled. At this time, the substrate is supported by factors such as the shape and arrangement of the heater, the structure of the stage 21, and the like. The entire W system does not necessarily have uniform thermal expansion. Therefore, the system can also be configured to grasp the distribution of thermal expansion together. For example, it may be configured such that a region on the support substrate W is divided into a plurality of grid-like regions such as 10 rows × 10 columns, and the thermal expansion amount is measured for each of the divided regions (each measurement The point is due to the displacement caused by thermal expansion). After that, for each of the regions, the coefficients multiplied on the correction data of the platform 21 are switched respectively.

In addition, the system may be configured such that the support substrate W is first placed on the stage 21, and thereafter, the thermal expansion of the support substrate W is saturated with respect to the temperature of the stage 21 at a specific elapsed time. The thermal expansion amount of the supporting substrate W is measured, and a coefficient corresponding to the thermal expansion amount at each specific elapsed time is obtained in advance. At this time, the coefficient corresponding to the thermal expansion amount may be obtained for each of the regions after the support substrate W is divided into a plurality of regions. Thereafter, when mounting the semiconductor wafer t, at each specific elapsed time from when the support substrate W is placed on the stage 21, it is switched to a coefficient corresponding to the elapsed time, and the correction data is multiplied by This coefficient causes the platform 21 to move. With such a configuration, the semiconductor substrate t can be mounted on the support substrate W without waiting for the thermal expansion of the support substrate W to become saturated with respect to the temperature of the stage 21, and can be efficiently implemented. Mounting of the semiconductor wafer t.

(Modification of the moving position of platform 21)

When moving the platform 21, refer to the movement position of the platform 21 The correction data required by the acquisition process of the error is used to correct the moving position of the platform 21. First, the stage 21 is moved in order to position the mounting area where the semiconductor wafer t is initially mounted on the support substrate W at the mounting position. At this time, the control unit 60 refers to the position information (XY coordinates) of the first installation area stored in the storage unit 61 and the above-mentioned correction data, and selects what is needed when positioning the first installation area at the installation position. Correction value. The amount of movement of the platform 21 when the initial installation area is positioned at the installation position is corrected by an amount corresponding to the selected correction value. When the stage 21 is provided with a heater, it is preferable that the stage 21 is configured to multiply the coefficient obtained based on the thermal expansion amount of the support substrate W by the correction data of the stage 21.

In FIG. 10, an example in which the mounting area (xi, yi) MA is moved to the mounting position P is shown. If the mounting area MA is directly moved to the mounting position P, when a position shift (Δni, Δmi) occurs based on the accuracy of machining, etc., the position shift amount is obtained based on the correction data ( △ ni, △ mi), and a correction value (-△ ni,-△ mi) that offsets the position offset is added to the movement amount of the platform 21 to move the platform 21. In this way, each mounting area on the supporting substrate W is sequentially positioned at the mounting position P. In the above example, since the correction data is acquired at 3 mm intervals, the installation area system does not necessarily absolutely coincide with the position where the correction data was obtained. Therefore, when the installation area is between the positions where the positional deviation of the dot mark 72 has been obtained, linearly interpolate the data of the two adjacent positional deviations, and will conform to the installation area. Position offset data is calculated approximately It is used as a correction value.

The above-mentioned acquisition process of the movement position error (correction data) of the platform 21 is basically performed when the installation device 1 is started, and the movement of the platform 21 is controlled based on the measurement result. However, at the stage 21 or the mounting head 55, there may be a case where a heater or the like is installed to assist the mounting of the semiconductor wafer t, and the temperature of each part of the device rises and mechanical accuracy is caused by thermal expansion. Worry of reduction. In addition, as the mounting process of the semiconductor wafer t caused by the mounting device 1 progresses, heat generated by a motor or the like that moves the mounting head 55 may cause a reduction in mechanical accuracy of each part of the device. When considering such a movement error caused by a temperature rise, it is not limited to only one time when the device starts to operate, but a process of obtaining a movement position error (correction data) is performed periodically. With this, the positioning accuracy of the semiconductor wafer t and the like can be further improved.

{Installation Engineering of Electronic Parts}

After obtaining the above-mentioned movement position error (correction data) of the platform 21 and memorizing the correction data in the memory portion 61, the mounting process of the electronic component such as the semiconductor wafer t to the supporting substrate W is performed.

(1) Move-in project of wafer ring 11

First, an unused wafer ring 11 is moved into the wafer ring holder 12 from a storage section (not shown), and the wafer ring 11 is fixed on the wafer ring holder 12.

(2) Supporting the placement of substrate W (2-1: Supply of support substrate W)

The support substrate W that has been carried on the carrying-in conveyor 31 is held by the first delivery unit 33 by suction, and is placed on the platform 21 positioned at the carrying-in / out position. The support substrate W is delivered to the first delivery unit 33 at the platform 21, and is moved to a position where it is carried into the conveyor 31 and stands by. In this operation, the second delivery unit 34 stands by at a position where the conveyor 32 is unloaded. Project (2) can be performed in parallel with Project (1) or individually.

A support substrate W is carried into a loading conveyor 31 from a loader (not shown). The loader is the same as the wafer ring supply unit, and is provided with a compartment capable of accommodating the support substrate W in an up-down direction with a space for storage, and is positioned by a pusher. The support substrate W at the same height as the conveyance height of the carry-in conveyor 31 is pushed out or pulled out by a jig, etc., and supplied to the carry-in conveyor 31. An unloader having the same configuration as the loader is arranged at the side of the unloading conveyor 32, and the support substrate W (the supporting substrate W on which the semiconductor wafer t is mounted) is sequentially housed from the unloading conveyor 32 to Compartment.

(2-2: Detection of Global Marks)

The global mark of the support substrate W placed on the platform 21 is detected, and the position of the support substrate W is identified. For example, as in Figure 11 As shown generally, for the global marks A, B, and C provided at the corners of three of the four corners of the support substrate W, the second camera 22 is sequentially moved downward to capture an image. The movement of the support substrate W is performed by the platform 21. Based on the positions of the three global marks A, B, and C detected by each of the captured images captured by the second camera 22, and based on the positions of the three global marks A, B, and C detected, To find out the positional displacement in the XY direction and the positional displacement in the θ direction of the support substrate W. The position deviation of the support substrate W can be obtained by various known methods, and the method is not particularly limited. Hereinafter, an example of a method for detecting a position shift will be described.

In FIG. 11, the solid line represents the support substrate W that is actually placed on the platform 21, and the two-point chain line represents the support substrate W that has been placed without positional displacement on the platform 21. . The support substrate W described by the two-point chain line is an ideal position state. At this time, the center of the support substrate W is consistent with the center position O (x0, y0) of the platform 21.

First, the known image recognition technology is used to detect the positions of the three marks A, B, and C placed on the support substrate W, and according to the inclination of the line segment AB connecting the marks A and B with respect to the X direction The average value of θ1 and the inclination θ2 of the line segment BC connecting the symbols B and C with respect to the Y direction is obtained to obtain the inclination θ (= (θ1 + θ2) / 2) of the support substrate W. Next, the center position O of the stage 21 is used as a rotation center, and the support substrate W is rotated imaginarily so that the inclination θ disappears. This state is shown by a dotted line in FIG. 11. Find out The amount of movement (Δx1, Δy1) of the point M1 (x1, y1) between the marks A and C at the diagonal position. After that, the value (△ x2, △ y2) obtained by adding the movement amount (△ x1, △ y1) and the difference between the midpoint M2 (x2, y2) and the coordinate O after the movement (△ x2, △ y2) is added (△ x1 + △ x2, △ y1 + △ y2) are obtained as the positional deviation in the XY direction of the support substrate W.

If the position deviation of the support substrate W on the platform 21 is calculated, the position deviation is corrected while positioning the mounting area of the support substrate W where the semiconductor wafer t was originally mounted at the mounting position. Way to move the platform 21. At this time, the movement of the platform 21 for positioning each installation area at the installation position is based on the correction data obtained by correcting the positional deviation of the support substrate W and the above-mentioned movement position error of the platform 21 While being amended. The tilting of the substrate W is supported when the moving mechanism of the platform 21 does not have a θ table as in this embodiment. The θ adjustment mechanism provided by the mounting head 55 is used to adjust the Inclination was adjusted and corrected.

(3) Transfer of semiconductor wafer t (3-1: Position detection of semiconductor wafer t)

When the wafer ring 11 is fixed to the wafer ring holder 12, the semiconductor wafer t which is initially taken out on the wafer ring 11 is positioned at the take-out position. The order in which the semiconductor wafer t on the wafer ring 11 is taken out is stored in the memory section 61 in advance. Therefore, the control section 60 Based on this sequence, the movement of the wafer ring holder 12 is controlled. Therefore, after the first semiconductor wafer t is taken out, the pitch movement of the wafer ring holder 12 is performed based on the order stored in the memory section 16. In general, as indicated by an arrow in FIG. 7A, the movement is performed on a trajectory that switches the moving direction at each line.

When the semiconductor wafer t is positioned at the take-out position, the first camera 13 is used to image the two alignment marks of the semiconductor wafer t. The imaging of the two alignment marks can be performed once or divided into two as long as the two alignment marks can be simultaneously introduced into the imaging field of view of the first camera 13. The position of the semiconductor wafer t is detected based on the positions of the two alignment marks taken out based on the captured image. When the position of the semiconductor wafer t is shifted relative to the take-out position, the wafer ring holder 12 is moved by correcting the position thereof. The transfer process (3) of the semiconductor wafer t may be performed in parallel with the placement process (2) of the support substrate W, or may be performed individually.

The detection of the positional deviation of the semiconductor wafer t positioned at the take-out position is not particularly limited, and can be implemented according to various known methods. For example, the position of each alignment mark can be detected using a known image recognition technique based on a photographic image of two alignment marks provided at diagonal positions on the semiconductor wafer t. According to the position of the obtained mark, the inclination of the line segment connecting the two marks is obtained, and the inclination is stored in advance with the memory portion 61 when there is no position deviation. Line connecting the marks at the semiconductor wafer t The inclination of the segments is compared, and the difference between the two is detected as the inclination deviation of the semiconductor wafer t. In addition, the position of the midpoint between the actual alignment marks and the position of the midpoint between the alignment marks of the semiconductor wafer t in which there is no positional offset stored in the memory section 61 are in between. The difference is obtained as a positional deviation in the XY direction of the semiconductor wafer t.

(3-2: Take-out of semiconductor wafer t)

The reversing mechanism 43 of one of the transfer portions 40A (for example, the left side) is driven, and the suction nozzle 44 in the standby state is reversely moved to the removal position. Next, the lifting device 41 is driven to lower the suction nozzle 44 together with the arm body 42 and bring the suction surface of the suction nozzle 44 into contact with the upper surface (electrode formation surface) of the semiconductor wafer t. When the adsorption nozzle 44 is in contact with the semiconductor wafer t, the semiconductor wafer t is adsorbed and held at the adsorption nozzle 44. The timing at which the suction force is applied at the suction nozzle 44 may be before the suction nozzle 44 and the semiconductor wafer t are brought into contact with each other, or simultaneously with the contact, or after the contact, as long as it is set to an appropriate timing. Just fine.

When the suction nozzle 44 holds and holds the semiconductor wafer t, the suction nozzle 44 is raised to the original height. At this time, the lifting of the suction nozzle 44 cooperates with a protrusion mechanism (not shown) to assist the peeling of the semiconductor wafer t from the resin sheet S. If the suction nozzle 44 that has held and held the semiconductor wafer t has been raised to the original height, the reversing arm 47 is reversed and the suction nozzle 44 is returned to the standby state. In this state, the semiconductor wafer t is such that The lower surface (the surface opposite to the electrode formation surface) is on standby while facing upward.

(3-3: Submission of semiconductor wafer t)

The mounting tool 56 on one side (left side) is moved to a position directly above the suction nozzle 44 holding the semiconductor wafer t in a standby state, that is, a receiving position. If the mounting tool 56 is positioned at the receiving position, the lifting device 41 is driven to raise the arm body 42 and the semiconductor wafer t held at the suction nozzle 44 is delivered to the holding surface of the mounting tool 56. The suction nozzle 44 is lowered to the original height after the semiconductor wafer t is delivered to the mounting tool 56, and is placed in a standby state. At the time of submission, the timing of applying the attraction force at the mounting tool 56 may be before the semiconductor wafer t is brought into contact with the mounting tool 56, or at the same time as the contact, or after the contact ( However, it is before the suction nozzle 44 starts to fall), and it may be set to an appropriate timing. The suction and suction force of the suction nozzle 44 is released during the period from the time when the semiconductor wafer t is delivered to the mounting tool 56 until the suction nozzle 44 starts to descend.

(4) Installation of semiconductor wafer t (4-1: Movement and position detection of semiconductor wafer t)

The mounting tool 56 that has received the semiconductor wafer t moves toward the mounting position with a movement trajectory set in the memory section 61 in advance. The semiconductor wafer t is such that the electrode formation surface (the upper surface of the wafer) faces downward. The state is maintained at the installation tool 56. While moving the mounting tool 56 holding the semiconductor wafer t toward the mounting position, the mounting tool 56 is passed above the third camera 57. At this time, the movement of the mounting tool 56 is temporarily stopped above the third camera 57, and the third camera 57 is used to image the two alignment marks of the semiconductor wafer t. The position of each registration mark is detected based on the imaged image, and the positional deviation of the semiconductor wafer t from the mounting tool 57 is obtained based on the detected position. If the imaging is completed, the movement of the installation tool 56 is resumed.

(4-2: Mounting of semiconductor wafer t)

After the semiconductor wafer t held at the mounting tool 56 is imaged, the mounting tool 56 is moved to the mounting position, and the semiconductor wafer t is mounted at the mounting area on the support substrate W positioned at the mounting position. At this time, as a result of the position detection of the semiconductor wafer t by the third camera 57, if the semiconductor wafer t is shifted relative to the mounting tool 56, it is determined that the position is shifted relative to the detected position. The correction method is to correct the movement of the installation tool 56 and position the installation tool 56 at the installation position. When the tilt θ of the support substrate W is detected in the process (2-2), the tilt θ is also corrected by the mounting tool 56. After that, the mounting tool 56 is lowered, and the semiconductor wafer t is mounted on a specific mounting area of the support substrate W by pressing.

For the bonding of the semiconductor wafer t supporting the substrate W, This is performed using an adhesive force of a die attach film (DAF) that is previously attached to the surface of the support substrate W or the lower surface of the semiconductor wafer t. The joining of the semiconductor wafer t can be performed by providing a heater in advance on the stage 21 and applying pressure to the heated support substrate W by the semiconductor wafer t. The heater may be built into the installation tool 56. When the semiconductor wafer t is pressurized for a predetermined time, the adsorption of the semiconductor wafer t is released, and the mounting tool 56 is raised to the original height. The installation tool 56 after the installation is completed is moved toward the receiving position.

In parallel with the operation of the above-mentioned installation process of the semiconductor wafer t, the pitch feeding of the semiconductor wafer t held on the wafer ring 11 at the wafer ring holder 12 is performed (the next semiconductor wafer to be taken out) The operation of positioning at the take-out position), the position detection of the semiconductor wafer t (the same operation as in (3-1) in the process (3)), and the suction nozzle of the transfer part 40B of the other side (right side) Take out the semiconductor wafer t caused by 44 (the same operation as in (3-2) in the process (3)), and the semiconductor wafer t caused by the mounting tool 56 of the mounting portion 50B on the other side (right side) Receive (same action as (3-3) in process (3)).

Simultaneously with moving the mounting tool 56 of the mounting section 50A that has finished mounting toward the receiving position, the mounting tool 56 of the other mounting section 50B that has received the semiconductor wafer t at the receiving position is moved toward the mounting position. Start. The platform 21 starts the pitch movement in order to position the next installation area at the installation position. Be located The mounting tool 56 of the mounting portion 50B at the mounting position performs the same operation as the mounting portion 50A (same operation as (4-1) and (4-2) in the process (4)), and The semiconductor wafer t is mounted by applying pressure to a specific mounting area of the support substrate W. The installation tool 56 after the installation is completed is moved toward the receiving position.

The receiving operation and mounting operation of the semiconductor wafer t by the mounting tool 56 of the mounting portion 50A and the receiving operation and mounting operation of the semiconductor wafer t by the mounting tool 56 of the mounting portion 50B described above are performed interactively and repeatedly Until the semiconductor wafer t of the wafer ring 11 is exhausted. That is, the suction nozzles 44 of the left and right transfer sections 40A and 40B are used for interactively taking out the semiconductor wafer t, and the mounting tools 56 of the left and right mounting sections 50A and 50B are used for receiving and mounting the semiconductor wafer t alternately. As such, the mounting of the semiconductor wafer t is performed alternately by the two mounting portions 50A and 50B until the semiconductor wafer t of the wafer ring 11 is exhausted.

In addition, as shown in FIG. 12 described later, when a plurality of semiconductor wafers t1 to t3 are mounted in one mounting area MA, the first semiconductor wafer t1 ends as described above. After the mounting, the wafer ring 11 on which the second semiconductor wafer t2 is mounted is placed in the parts supply section 10, and the first semiconductor wafer t1 on which the second semiconductor wafer t1 is mounted is placed in the loader of the substrate transfer section 30 Support substrate W. Thereafter, by performing the same operation as described above, the second semiconductor wafer t2 is sequentially mounted on each mounting area MA where the first semiconductor wafer t1 is mounted. So this, if it ’s the second Individual semiconductor wafers t2 are mounted at all the mounting areas MA where t1 is mounted, the wafer ring 11 on which the third semiconductor wafer t3 is mounted is placed at the component supply section 10 and the substrate transfer section At the loader 30, the supporting substrate W on which the semiconductor wafers t1 and t2 are mounted is set, and the third semiconductor wafer t3 is mounted by the same operation. In this manner, a plurality of semiconductor wafers t1 to t3 are mounted in each mounting area MA of the support substrate W.

When a plurality of semiconductor wafers t1 to t3 are mounted in one mounting area MA, it is not limited to the mounting of all the supporting substrates W at the end of the first semiconductor wafer t1 as described above. After that, it is switched to the second semiconductor wafer t2 mounting method. For example, the system may be configured to switch to the second semiconductor wafer t2 when the mounting of the first semiconductor wafer t1 is completed for one support substrate W. The third semiconductor wafer t3 is also the same, and may be configured to switch to the third semiconductor wafer t3 if the mounting of the second semiconductor wafer t2 is completed for one support substrate W. That is, the semiconductor wafers t may be configured to mount a plurality of types of semiconductor wafers in a unit that supports the substrate W. In this case, the support substrate W is not removed from the platform 21 until the mounting of the semiconductor wafers t of all the varieties is completed for one support substrate W. Therefore, it is possible to make a plurality of varieties. The mounting accuracy of the semiconductor wafer t is further improved.

In the above-mentioned method of mounting the semiconductor wafers 1 of each type on all the support substrates W, the semiconductor of the first type is completed The supporting substrate W on which the wafer t1 is mounted is temporarily carried out from the stage 21 and is mounted on the stage 21 again when the second-type semiconductor wafer t2 is mounted. Therefore, when the semiconductor wafer t1 of the first type is mounted and when the semiconductor wafer t2 of the second type is mounted, the position of the support substrate W on the platform 21 is offset, that is, there is a position. Offset. Even if the same position is occasionally placed on the platform 21, the situation will generally be offset. Although the position of the support substrate W is identified by global identification, there is still a possibility that an offset may occur in the identification position of the support substrate W due to factors such as identification errors. Therefore, it can be presumed that the relative position accuracy between the first variety and the second variety is reduced accordingly. On the other hand, when the first type semiconductor wafer t1 and the second type semiconductor wafer t2 are successively mounted without removing the support substrate W from the platform 21, it is possible to prevent the cause due to the identification error. The resulting position shift. Therefore, the system can improve the relative position accuracy between the first variety and the second variety.

The semiconductor wafer t mounted on each of the plural mounting areas of the support substrate W is not limited to one product. One support substrate W may be divided into a plurality of regions, and different types of semiconductor wafers t may be mounted in each region. For example, the semiconductor wafer ta of type A may be mounted in the first region of the half of the supporting substrate W, and the semiconductor wafer tb of type B may be mounted in the second region of the remaining half. A type A semiconductor package is manufactured from the first area where the type A semiconductor wafer ta is mounted. From being installed half of the B variety In the area of the conductor wafer tb, a semiconductor package of type B is manufactured.

In this case, since the circuit pattern of the rewiring layer formed in the subsequent process is different between the semiconductor wafer ta of type A and the semiconductor wafer tb of type B, the exposure pattern for rewiring formation will also become Different. Therefore, it can be estimated that it is more difficult to correct the mounting errors of the semiconductor wafers ta and tb by exposure engineering. When the mounting device and the mounting method of the embodiment are applied, even if the semiconductor wafer ta of type A and the semiconductor wafer tb of type B can be mounted with high relative position accuracy. Therefore, the exposure processing performed on the area where the semiconductor wafer ta of type A is mounted and the exposure processing performed on the area where the semiconductor wafer tb of type B is mounted can be performed in a coordinated manner. Increased production efficiency.

When the semiconductor wafer ta of type A is mounted in the first area and the semiconductor wafer tb of type B is mounted in the second area, there is also a size between the semiconductor wafer ta of type A and the semiconductor wafer tb of type B. This is the case where the installation pitch of the A type and the installation pitch of the B type are different. In this case, when the semiconductor wafer ta of type A is mounted, and the semiconductor wafer tb of type B is mounted, by switching the feed amount of the platform 21, a plurality of types of semiconductor wafers ta, tb can be switched. It is well mounted in a plurality of areas of the support substrate W. Similarly, the system may be configured to mount a combination of the C-type and D-type semiconductor wafers constituting the first multi-chip package in the first region of the support substrate W, and install and constitute the second multi-chip package in the second region. The combination of E and F semiconductor wafers. It is the same regardless of the mounting of any of them, and it can be configured to mount one type of semiconductor wafer at a time to mount on a plurality of support substrates W, or it can be configured to use a unit of support substrate W To mount a plurality of types of semiconductor wafers. These specific installation works are as before.

In addition, in this case, the identification of the global mark supporting the substrate W may be performed only once at the beginning, and the area where the semiconductor wafer t is mounted can be moved from the first area to the first. In the 2 area, it is not necessary to re-identify the global mark of the supporting substrate W. In addition, when a heater or the like is provided on the stage 21 to heat the support substrate W, it may be configured so that the semiconductor wafer t can be mounted in the first area and then the second area can be mounted later. And switch the correction data of the platform 21. With such a configuration, the amount of thermal expansion in the portion corresponding to the second region on the support substrate W is increased even when the semiconductor wafer ta of the A type is being mounted on the first region. It is also possible to take countermeasures against this, and therefore, it is possible to maintain the mounting accuracy of the semiconductor wafer t (tb) at a high accuracy. In the case where a plurality of types of semiconductor wafers t are mounted in a unit that supports the substrate W as described above, if the wafer supply mechanism by the tape feeder is used as the component supply unit 10, and equipped with a plurality of types Corresponding plural belt feeders are ideal.

One of the above-mentioned types of semiconductor wafers t or a plurality of types of semiconductor wafers t1, t2, t3, or semiconductor wafers ta, tb The mounted supporting substrate W is sent to a subsequent process described below, and a packaging component like a semiconductor package is manufactured by using it. That is, the support substrate W that has finished mounting the semiconductor wafer is sequentially sent to the sealing process and the formation process of the redistribution layer. In the sealing process, the space between the semiconductor wafers mounted on the support substrate W is filled with a resin, and a pseudo wafer is thereby formed. Like a wafer, it is sent to the formation engineering office of the redistribution layer. In the formation process of the redistribution layer, the formation process of the circuit in the manufacturing process of the semiconductor wafer is implemented, that is, the coating process of the photosensitive material with a photoresist material and the like, the exposure of the photosensitive material, and the development process , Etching process, ion implantation process, stripping process of photoresist, etc. With these processes, a redistribution layer is formed on a semiconductor wafer that resembles a wafer. The pseudo-wafer on which the rewiring layer is formed is sent to a dicing engineering office, where the pseudo-wafer is singulated, and thereby a package part like a semiconductor package is manufactured.

In this way, the method of mounting package components according to the embodiment is as shown in FIG. 14, and includes: a mounting process S1 for mounting electronic components on each of a plurality of mounting areas supporting a substrate W; and The electronic parts installed in the plurality of mounting areas are sealed in batches to form a sealing process S2 similar to a wafer; and a rewiring process S3 for forming a redistribution layer on the electronic parts similar to the wafer; The cutting process S4 for manufacturing a package part by dicing the wafer. The formation process S3 of the redistribution layer is provided with a coating process S31 of a photosensitive material, an exposure and development process of the photosensitive material S32, an etching process S33, an ion implantation process S34, and a stripping process of the photoresist as described above. S35 and so on. The mounting process of the electronic parts in the manufacturing method of the packaged parts of the embodiment is performed based on the mounting method of the electronic parts of the embodiment. In the method for manufacturing a packaged part according to the embodiment, the electronic parts mounted on each mounting area of the support substrate W are as described above, and may be one semiconductor wafer t or plural types of semiconductor wafers. Or multiple semiconductor wafers of the same type. The variety and quantity of electronic parts are not particularly limited.

In the mounting device 1 of the embodiment, the mounting tool 56 of the two mounting portions 50A and 50B is moved to a certain path from the receiving position of the semiconductor wafer t to the mounting position, and the two The mounting position by the mounting tool 56 of the mounting portions 50A and 50B is set to a fixed position. Further, each mounting area of the supporting substrate W is sequentially positioned at the mounting position by the XY moving mechanism of the stage portion 20. At this time, the movement of the platform 21 caused by the XY moving mechanism of the platform unit 20 is corrected using correction data obtained based on the movement position error of the platform 21 obtained in advance. Therefore, it is possible to reduce as much as possible the mounting error of the semiconductor wafer t caused by the movement error of the two mounting portions 50A and 50B and the movement position error of the stage 21. In this way, it is possible to achieve the mounting time of the semiconductor wafer t caused by the use of two mounting portions 50A and 50B simultaneously (the tact time required for mounting one semiconductor wafer t as the mounting device 1) (tact time)) The purpose of reducing and improving the mounting accuracy of the semiconductor wafer t.

That is, two mounting tools 50A, 50B 56, because they only move on a certain path from the receiving position of the semiconductor wafer t to the mounting position, even if a movement error occurs, it can be adjusted with a single adjustment (correction). The positioning of the installation position is corrected. Furthermore, since the two mounting portions 50A and 50B perform the mounting operation at the same mounting position, the mounting accuracy can be improved compared to the case where the mounting is performed at the respective mounting positions, and It is possible to adjust (correct) the moving position of the mounting head in a short time.

In addition, since the correction position data is used to correct the movement position error of the stage 21, it is possible to move with good accuracy at a preset pitch, thereby enabling each of the supporting substrates W to be moved. The positioning accuracy of the mounting area for the mounting position is improved. Therefore, it is possible to achieve a mounting accuracy of ± 5 μm or less and a cycle time of 0.6 seconds or less at the same time. As a result, the electronic component including the semiconductor wafer t can be set for the supporting substrate W in which the mark for position detection is not provided in each of the mounting areas so that the interval between them can be set in advance. It is possible to mount the electronic components including the semiconductor wafer t on the support substrate W with good accuracy by mounting them at a spaced interval with good accuracy. That is, the interactive mounting by the two mounting sections 50A and 50B can shorten the tact time required for the mounting of the semiconductor wafer t, and it can be performed at a certain common location. The installation and the correction of the movement error of the platform 21 can obtain the effect of improving the installation accuracy and preventing the reduction of productivity.

For example, a case where a semiconductor wafer is mounted with two mounting heads at different predetermined positions will be considered. In this case, it is necessary to adjust (correct) the moving position of each of the two mounting heads toward a certain position. Generally, such adjustments are performed using cameras arranged at respective predetermined positions. If an error occurs when the coordinates between the cameras are consistent with each other, the error will appear as a mounting error between the two mounting heads.

When a semiconductor wafer is mounted with two mounting heads at different positions, the semiconductor wafer is mounted on a support substrate at two locations. Since the movement error varies depending on the place, it is necessary to measure the movement error separately at two places. It takes about 3 hours to measure the movement error at one place, for example. Specifically, for a 300mm × 300mm support substrate, when measuring the movement error of the measurement points set in a matrix at 3mm intervals, the number of measurement points on the substrate is in the vertical direction: 300mm / 3mm = 100 points, horizontal direction: 300mm / 3mm = 100 points, and a total of 100 points × 100 points = 10000 points. If it takes 2 seconds to measure at one point, 10000 points × 2 seconds = 20,000 seconds = approximately 5 hours and 33 minutes. In addition, the reason why it takes 2 seconds to measure at one point is that it can be estimated that in order to converge the vibration that occurs when the platform is stopped, a waiting time of more than 1 second is required. Therefore, when the two mounting heads are mounted at different fixed positions to mount a semiconductor wafer, compared with the mounting device 1 of the embodiment, an extra preparation time of about 5 hours and 30 minutes is consumed. Production Department A reduction corresponding to the amount of time is produced.

In addition, if two cameras are used to perform measurements at two locations in parallel at the same time, the measurement time can be made to be slightly equivalent to the case of one location. However, it is necessary to perform a correction to coordinate the coordinate systems of the two cameras. At this time, the system may cause errors. This system will be an important reason for the decrease in position accuracy. In addition, since the system requires two cameras, the cost also increases.

Furthermore, if the configuration in which the mounting head is moved to each mounting area without moving the platform 21 supporting the substrate W and the correction data is created on the side of the mounting head is considered, compared to the case of the substrate platform When correction data is created from the side, a large amount of correction data is required, and the time required for correction will increase. That is, the mounting head is different from the substrate platform. Since the semiconductor wafer is mounted on the substrate, it is necessary to have a vertical movement mechanism. Therefore, in preparing the correction data, in addition to the movement error caused by the fluctuation of the XY moving device of the mounting head, it is also necessary to consider the positional displacement in the XY direction caused by the up and down movement of the mounting head.

Specifically, even if the frame supporting the mounting head (for example, the Y-axis moving device) is located in the same position in the left-right direction, when the movable body supporting the mounting head swings toward the right side and swings toward the left side In this case, there is also a large difference in the horizontal position of the front end of the mounting head when the semiconductor wafer t is lowered to the position where the semiconductor wafer t is mounted on the support substrate W on the stage 21. Therefore, it is not only necessary to consider when the mounting head moves in the X direction or Y The meandering motion when moving in the direction also needs to consider the rocking motion of the movable body supporting the mounting head as an important factor of the displacement of the mounting position. Therefore, even if the movement on the platform 21 side is less than the 3 mm pitch of the point mark 72 as the correction substrate 71 that does not cause a large movement error, it will still be on the mounting head side. There may be a large movement error (for example, 5 μm or more) at the installation tool.

Therefore, when the correction data is prepared at the side of the mounting head, it is conceivable that there will be a need to measure the displacement of the moving position at intervals shorter than 3 mm, for example, at short intervals such as every 1 mm pitch. Assuming that the movement position deviation is measured at a pitch of 1 mm for a movement range of 300 mm × 300 mm, it is necessary to perform a measurement of 300 points × 300 points = 90,000 points, as compared with a measurement of 3 mm pitch. In the case of a pitch of 3 mm, the number of measurement sites is 9 times. Therefore, the measurement time is also 9 times, and it takes 5 hours and 33 minutes × 9 = 49 hours and 30 minutes. As a result, the system lacks practicality.

In addition, when there are fluctuations in the vertical direction on the substrate platform side in addition to the shaking of the movable body, when the semiconductor wafer is mounted on the support substrate, the height position becomes a place that depends on the support substrate. It's different. If the movable body of the mounting head is tilted, and the direction in which the mounting head moves up and down is tilted relative to the vertical direction, the mounting position will be in the horizontal direction due to the difference in height of the mounting surface (substrate surface). And a bit offset. If such a situation is also considered, the measurement system of the revised data will become more complicated, It will take more time to create the master data. In addition, there is a possibility that the correction accuracy itself may decrease.

From the above point of view, it can be seen that it is provided that the mounting positions caused by the two mounting portions 50A and 50B are set to the same constant position and the platform 21 on which the supporting substrate W is placed is moved to separate each mounting area. The installation device 1 which is positioned at the installation position in sequence and uses correction data to correct the movement error of the platform 21 can achieve both improvement in installation accuracy and reduction in tact time, and achieve high productivity. Speech is effective.

The mounting device 1 according to the embodiment is as shown in FIG. 12. When a plurality of types of semiconductor wafers t1, t2, and t3 are mounted on one mounting area MA, or when one type or a plurality of types are mounted, This type is effective when mounting a semiconductor wafer t and a diode or a capacitor. As described above, when a plurality of types of electronic parts are mounted in one mounting area, the relative positional deviation of the plurality of electronic parts in one mounting area (package) may be shifted. Therefore, it is not applicable to the technique of "correcting mounting errors during exposure" that can be applied to a single crystal package in which a single semiconductor wafer is incorporated into one mounting area (package). Therefore, it is necessary to improve the positional accuracy of a plurality of electronic parts by themselves. In view of this, the mounting device 1 of the embodiment can improve the individual mounting accuracy of the electronic components including the semiconductor wafer t. Therefore, even when plural electronic components are mounted in one mounting area, Time, it can also be used for multiple electric power in one installation area. The relative position accuracy of the sub-parts is improved.

{Position shift correction by a pair of mounting portions 50}

When two mounting portions 50A and 50B are used, there is a possibility that a relative position shift may occur between the mounting tools 56 of the mounting portions 50A and 50B. Aiming at this point, a camera is arranged below the installation position, and the positions of the installation tools 56 positioned at the installation positions are respectively detected, and then the relative position deviations of the installation tools 56 are detected and a correction method is performed. Is valid. In the detection of the relative positional shift between the two mounting tools 56, a fourth camera shown in FIG. 4 is used. The fourth camera 23 is mounted upward at the end on the side on the front side of the platform 21. The fourth camera 23 images the mounting tool 56 positioned at the mounting position from below. When imaging by the fourth camera 23 is performed, the fourth camera 23 is moved directly below the installation position by the movement of the platform 21. The fourth camera 23 functions as a third recognition unit.

The displacement detection of the two mounting tools 56 is performed while the semiconductor wafer t is held at the mounting tool 56. In addition, for detecting the position shift, a fake semiconductor wafer prepared for calibration can also be used. Furthermore, instead of using a semiconductor wafer, the positional deviation of the mounting tool 56 may be detected using the suction hole of the mounting tool 56 or a mark formed on the holding surface of the mounting tool 56. First, the semiconductor wafer t is held at the mounting tool 56 by the operation of the aforementioned process (3), and the movement of (4-1) of the process (4) is performed. To detect the positional deviation of the semiconductor wafer t and correct the detected positional deviation, the mounting tool 56 is positioned at the mounting position (4-2). The fourth camera 23 images the semiconductor wafer t held at the mounting tool 56 positioned at the mounting position. The control unit 60 detects the position of the semiconductor wafer t based on the captured image of the fourth camera 23, and compares the position data with the correct position stored in the memory unit 61 in advance to detect the position of the semiconductor wafer t. Position offset. If there is no position shift at the mounting tool 56, the semiconductor wafer t system is positioned at the mounting position without causing a position shift. When a position shift occurs, the position shift becomes the shift position of the mounting head 55.

The imaging of the semiconductor wafer t positioned at the mounting position and the detection of the position shift described above are performed separately for the mounting tools 56 of the left and right mounting portions 50A and 50B. For the comparison of the shifting positions of the mounting tools 56 of the two parties, when there is a gap, the mounting tool 56 of one of the mounting sections 50A is used as a reference, and the mounting tool 56 of the other mounting section 50B is used as a reference. The position is moved, and correction is performed by an amount that eliminates the gap to be taken out. With this configuration, it is possible to eliminate the occurrence of mounting errors due to the use of two mounting portions 50A and 50B.

The correction of the positional displacement of the mounting tool 56 is not limited to the method of matching the moving position of the mounting tool 56 of the other mounting portion 50B with the moving position of the mounting tool 56 of the one mounting portion 50A. . For example, it can also be used for left and right installation tools 56. In both cases, the correction is performed in such a manner that the moving position is matched with the predetermined mounting position. When such a configuration is adopted, the alignment accuracy can be further improved. This is because, when the movement position of the other installation tool 56 is matched with the movement position of the one installation tool 56, the movement position of the one installation tool 56 which becomes the reference will become Contains a certain amount of deviation. Even if it seems to move to the same position, an offset such as 1 μm or 2 μm may occur due to a mechanical error or the like. When the other installation tool 56 is aligned with such a position including a deviation, it becomes difficult to make the other installation tool with an accuracy greater than the deviation of the moving position of the one installation tool 56 The moving position of 56 is aligned. The positioning accuracy of the other installation tool 56 relative to the installation position will be worse than that of the one installation tool 56. On the other hand, when the moving positions of the mounting tools 56 on both sides are aligned with respect to the reference mounting position, the position of the reference mounting position itself does not include a positional deviation. Therefore, It is possible to align the two mounting tools 56 with respect to the mounting position with the same degree of accuracy.

The detection of the displacement of the mounting head 55 (the mounting tool 56) may be performed, for example, when the posture of the mounting head 55 may be deformed due to the heat generated by the motor. Thereafter, the presence or absence of a shift in the movement position of the mounting head 55 is detected at each set timing (a set time or a set number of installations). With this, the mounting accuracy of the semiconductor wafer t can be made more accurate. Further improvement. As described above, when a heater assisting the mounting (bonding) of the semiconductor wafer t is used, the thermal expansion (thermal deformation) caused by the heating of the heater may occur at the mounting head 55. Case of moving position error. In this regard, it is also the same that the fourth camera 23 is used to perform the imaging of the semiconductor wafer t held at the mounting tool 56 and the detection of the position shift by the fourth camera 23 each time. Is valid.

In the above-mentioned embodiment, the case where the mounting tools 56 of each mounting area of the support substrate W and the left and right mounting portions 50A and 50B are positioned at a fixed mounting position which is a fixed mounting position has been described. . The certain mounting position may be the same position in the mounting device 1 that does not change constantly, or a position that can be changed according to conditions such as the size of the support substrate W, as long as it is It suffices to be held at a certain position for at least the period from the start of mounting of the electronic component to be mounted to the end of the mounting. In addition, when a fixed installation position is configured as a position where the setting can be changed, if it is configured to obtain the correction data for correcting the movement error of the platform 21 in advance for each set position, When the setting is changed, it is preferable to switch the correction data used for correcting the movement error of the platform 21 to the correction data corresponding to the installation position after the setting change.

In addition, correction data for correcting the movement error of the platform 21 can be obtained in the entire area of the movable range of the platform 21 as long as it is constituted at least in each mounting area on the supporting substrate W. It can be obtained by moving within the range where the platform 21 is positioned at the installation position. Further, for the correction data for correcting the movement position error of the platform 21, the measured value itself of the movement error position of the platform 21 may be used, or the measured value may be processed using a correction value such as a movement position error offset. As long as it is data for correcting the movement error of the platform 21.

In the above-mentioned embodiment, the so-called face-down bonding is directed to a state in which the electrode formation surface (upper surface) of the semiconductor wafer t faces downward, that is, in a state facing the upper surface of the support substrate W. The description is given by way of example, but the mounting device and mounting method of the embodiment are not limited to this. The method of manufacturing the packaged parts of the embodiment is also the same. The mounting device and mounting method of the embodiment and the manufacturing method of the packaged parts can also be applied to a state where the electrode formation surface of the semiconductor wafer t faces upward, that is, the lower surface of the semiconductor wafer t (opposite to the electrode formation surface) (Side surface) The upward-facing surface mounted on the support substrate W is applicable. Furthermore, the mounting device of the embodiment may be a combined device for face-up bonding and face-down bonding.

In the case where the face-up bonding is applicable, a delivery platform for temporarily placing the semiconductor wafer t is provided between the transfer portion 40 and the mounting portion 50. This is because the semiconductor wafer t is supported on the wafer ring 11 with the electrode formation surface facing upward. The transfer nozzle 44 of the transfer portion 40 holding and holding the semiconductor wafer t must transfer the semiconductor wafer t to the mounting portion 50 with the electrode formation surface facing upward. However, due to the transfer, The nozzle 44 is a semiconductor crystal Since the electrode formation surface of the sheet t is held by suction, the semiconductor wafer t cannot be directly delivered to the mounting tool 56 of the mounting portion 50.

In the case where the face-up joining is applicable, the reversing mechanism 43 of the transfer unit 40 is unnecessary, and instead, an XY moving mechanism that makes the transfer nozzle 44 move in the XY direction is provided, and the transfer is performed The nozzle 44 is movable between the take-out position and the delivery platform. The delivery platforms are provided corresponding to the left and right transfer sections 40A and 40B, respectively. When a combined device for face-up bonding and face-down bonding is applied, it is set to maintain the setting of the reversing mechanism 43 of the transfer section 40, a delivery platform, and a transfer nozzle 44 so that the transfer nozzle 44 can be mounted in XY. The structure of the XY moving mechanism that moves in the direction. When face-down bonding is performed, the semiconductor wafer t is mounted by the same operation as in the embodiment without using a delivery platform.

In the case of face-up bonding, after the semiconductor wafer t is taken out by the transfer nozzle 44, the transfer nozzle 44 is not reversed by the reversing mechanism 43 and is moved by the XY moving mechanism. The transfer nozzle 44 is moved to the delivery platform. The semiconductor wafer t is placed on the delivery platform by the transfer nozzle 44 that has been moved. After that, the mounting tool 56 of the mounting section 50 is moved to the delivery platform, and the semiconductor wafer t on the delivery platform is held by suction. The semiconductor wafer t is placed on the delivery platform with the electrode formation surface facing upward. Therefore, the mounting tool 56 of the mounting portion 50 adsorbs the upper surface (electrode formation surface) of the semiconductor wafer t. The lower surface of the semiconductor wafer t (the surface opposite to the electrode formation surface) is mounted on the support substrate W surface. The specific mounting process of the semiconductor wafer t is the same as the embodiment described above.

[Example]

Next, examples and evaluation results of the present invention will be described.

(Example 1)

The mounting device 1 of the above-described embodiment is used to actually mount a semiconductor wafer on a support substrate under the following conditions. In FIG. 13, a state where the semiconductor wafer t is mounted on the support substrate W is shown. In addition, the target mounting accuracy is set within ± 5 μm, and the target cycle time is set within 0.6 seconds.

<Installation conditions>

‧Dimension of semiconductor wafer t: 4mm × 4mm

‧Installation pitch (vertical × horizontal): 36mm × 36mm

‧Number of installations (vertical × horizontal): 5 × 5 (25 in total)

As shown in FIG. 13, with the upper left as the starting point and the order of numbers attached to the semiconductor wafer t, the odd-numbered semiconductor wafer t is mounted by the mounting portion 50A on the left, and the first An even number of semiconductor wafers t are mounted by the mounting portion 50B on the right side, and are mounted interactively. The elapsed time from when the first semiconductor wafer t was taken out from the component supply unit 10 to the end of the mounting of the last (25th) semiconductor wafer t was 14.5 seconds. So this In general, an inspection device was used to measure the displacement of the mounting position of the 25 semiconductor wafers t mounted on the support substrate W. The results are shown in Table 1. In Table 1, the mounting area number corresponds to the number of the semiconductor wafer t in FIG. 13. The ○ mark in the column of the mounting head indicates the mounting head used in the installation. For example, at the installation area number "1", the installation is performed using the installation head 55 on the left side. The column of position shift represents the amount of position shift of the semiconductor wafer t at each mounting area toward the X direction and the Y direction. The unit system is micrometer [μm].

As shown in Table 1, the maximum value of the positional deviation of the semiconductor wafer t in the X direction is 3.0 μm at the position of the mounting area number 15 and the minimum value is at the position of the mounting area number 10. -1.8 μm. The maximum value of the positional displacement in the Y direction is 2.0 μm at the position of the installation area number 7, and the minimum value is -0.8 μm at the position of the installation area number 19. It was confirmed that the mounting accuracy of the 25 semiconductor wafers t all fell within ± 5 μm of the target. Since the time required for mounting is 14.5 seconds, the time required for mounting one semiconductor wafer t is 14.5 seconds / 25 pieces = 0.58 seconds. Therefore, the cycle time is 0.58 seconds, and within 0.6 seconds of achieving the goal. In addition, the time required for mounting refers to receiving the first time from the "suction nozzle 44 of the transfer unit 40A on the left side that picks up the first semiconductor wafer t from the component supply unit 10". The mounting tool 56 of the mounting portion 50A on the left side of the semiconductor wafer t moves to the position immediately above the mounting position and starts to descend "until" the mounting tool 56 of the mounting portion 50A on the left side is final (25th) " The semiconductor wafer t is mounted on the support substrate W and rises to the original height to end the operation ". By dividing this time by the number of semiconductor wafers (25) mounted during this period, the tact time can be obtained.

(Comparative example 1)

Except that the movement correction data of the stage on which the supporting substrate W is placed is not used, the semiconductor crystal is processed under the same conditions as in Example 1. The sheet t is mounted on a support substrate W. The inspection device was used to measure the deviation of the mounting position of the 25 semiconductor wafers t mounted on the support substrate W. The results are shown in Table 2.

As shown in Table 2, the maximum value of the positional deviation of the semiconductor wafer t in the X direction is 19.5 μm at the position of the mounting area number 21, and the minimum value is at the position of the mounting area number 10. -24.4 μm. The maximum value of the position shift in the Y direction is 11.8 μm at the position of the mounting area number 3, and the minimum value is -11.7 μm at the position of the mounting area number 16. Therefore, it was confirmed that the mounting accuracy of the semiconductor wafer t cannot meet the target within ± 5 μm. The time required for mounting one semiconductor wafer t is 0.58 seconds, which is the same as that of the first embodiment.

(Example 2)

The mounting device 1 of the above-described embodiment is used to actually mount a semiconductor wafer on a support substrate under the following conditions. The target mounting accuracy is set to within ± 5 μm.

<Installation conditions>

‧Dimension of semiconductor wafer t: 4mm × 4mm

‧Number of installations (vertical × horizontal): 20 × 20 (400 in total)

‧Installation pitch (vertical and horizontal): 6mm

As in Example 1, the mounting area on the upper left is used as the starting point, and the odd-numbered semiconductor wafer t is mounted by the mounting portion 50A on the left in the order of the number of the semiconductor wafer t, and the even-numbered The individual semiconductor wafers t are mounted by the mounting portion 50B on the right side, and are mounted interactively. So this, from mounting on the support substrate Of the 400 semiconductor wafers t at W, 48 semiconductor wafers t were extracted, and an inspection device was used to measure these mounting position shifts. The results are shown in Table 3 in the same manner as in Example 1.

(Example 3)

The mounting device 1 of the above-described embodiment is used to actually mount a semiconductor wafer on a support substrate under the following conditions. The target mounting accuracy is set to within ± 5 μm.

<Installation conditions>

‧Semiconductor wafer size: 1mm × 1mm

‧ Number of installations (vertical × horizontal): 40 × 51 (total 2040)

‧Installation pitch (vertical and horizontal): 3mm

As in Example 1, the mounting area on the upper left is used as the starting point, and the odd-numbered semiconductor wafer t is mounted by the mounting portion 50A on the left in the order of the number of the semiconductor wafer t, and the even-numbered The individual semiconductor wafers t are mounted by the mounting portion 50B on the right side, and are mounted interactively. In this manner, 48 semiconductor wafers t were extracted from the 2040 semiconductor wafers t mounted on the support substrate W, and these mounting position deviations were measured using an inspection device. The results are shown in Table 4 in the same manner as in Example 1.

(Example 4)

The mounting device 1 of the above-described embodiment is used to actually mount the first semiconductor wafer and the second semiconductor wafer on each mounting area of the support substrate under the following conditions. The target mounting accuracy is set to within ± 5 μm.

<Installation conditions>

‧Dimension of the first semiconductor wafer t: 4mm × 4mm

‧Dimension of the second semiconductor wafer t: 1mm × 1mm

‧Number of mounted first semiconductor wafers t (vertical × horizontal): 5 × 5 (25 in total)

‧Number of mounted second semiconductor wafers t (vertical × horizontal): 5 × 5 (25 in total)

‧Pitch for mounting the first semiconductor wafer (vertical and horizontal): 36mm

‧The distance between the first semiconductor wafer and the second semiconductor wafer: 0.5mm

As in Example 1, the mounting area on the upper left is used as the starting point, and the odd-numbered semiconductor wafer t is performed by the mounting portion 50A on the left in the order of the number of the first semiconductor wafer (wafer A) t. The even-numbered semiconductor wafer t was mounted on the right mounting portion 50B, and the mounting was performed interactively. Next, in the order of the number of the second semiconductor wafer (wafer B) t, the odd-numbered semiconductor wafer t is mounted by the mounting portion 50A on the left side, and The even-numbered semiconductor wafers t are mounted interactively by the mounting portion 50B on the right. In this manner, a total of 50 (first semiconductor wafers: 25, second semiconductor wafers: 25) mounting position deviations mounted on the support substrate W were measured using an inspection device. The mounting position shift is measured for the respective position shifts of the first and second semiconductor wafers (wafers A and B) and the relative positions of the first and second semiconductor wafers (wafers A and B). These results are shown in Table 5.

In the above-mentioned embodiment, although the support substrate W is not provided with a position detection mark at each mounting area, and is removed in the process of manufacturing a packaged part, The explanation is given, but the system is not limited to this. According to the mounting device and the mounting method according to the embodiment, it is a matter of course that even if there is a mark for position detection in each of the mounting areas, for example, it is a substrate used as a part of a package part. It is also possible to mount a semiconductor wafer (electronic component) with good accuracy and good efficiency without relying on the mark for position detection.

In addition, although several embodiments of the present invention have been described, these embodiments are only suggested as examples and are not intended to limit the scope of the present invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the gist of the present invention. These embodiments or their modifications are included in the scope or gist of the invention, and are also included in the invention described in the scope of patent application and its equivalent scope.

Claims (10)

An electronic component mounting device, characterized in that it is provided with: a platform portion having a platform on which a supporting substrate having a plurality of mounting areas for mounting electronic components is mounted, and a plurality of the mounting areas A platform moving mechanism for sequentially moving the platform by being positioned at a certain mounting position in sequence; and an installation section including the first and second parts that respectively hold the electronic parts and are mounted on the mounting area of the supporting substrate A mounting head, and a mounting head moving mechanism that alternately moves the first and second mounting heads holding the electronic parts to the mounting position; and the first identification unit is for the aforesaid mounted on the platform Identify the overall position of the support substrate; and the second identification section, which identifies the position of the electronic component held at the first or second mounting head; and the memory section, which memorizes the position of the platform moving mechanism Correction data for correcting the movement position error of the aforementioned platform; and the control section based on the position data of the support substrate identified by the first identification section and the aforementioned identification by the second identification section The position data of the electronic parts and the correction data are used to control the movement of the platform and the first and second mounting heads, and further include: a third identification unit for positioning at the mounting position The positions of the first and second mounting heads are individually identified, and the control section is based on the position data of the first and second mounting heads identified by the third identification section to identify the first The positional deviation between the mounting head and the aforementioned second mounting head is corrected. The mounting device as described in item 1 of the patent application range, wherein the mounting portion mounts a plurality of the electronic components in the mounting area of one of the support substrates. The mounting device as described in item 1 of the patent application scope, wherein the control unit executes the position data of the first and second mounting heads caused by the third identification unit based on a predetermined time sequence Identification. The mounting device as described in any one of the items 1 to 3 of the patent application scope, wherein the mounting device further includes: a component supply unit that supplies the electronic component; and a transfer unit that includes a separate component from the foregoing component The supply unit receives the electronic parts and delivers the electronic parts to the first and second transfer nozzles at the first or second mounting head. The first and second mounting heads are controlled by the first and second mounting heads. 2 The delivery position of the aforementioned electronic parts caused by the transfer nozzle moves to a certain path from the installation position to the aforementioned installation position. The mounting device as described in item 4 of the patent application scope, wherein the second identification unit is provided with a pair of cameras arranged on the moving path of the first and second mounting heads. An electronic component mounting method, characterized in that it is provided with: acquiring a moving position error of a platform on which a support substrate having a plurality of mounting areas for mounting electronic components is mounted, and causing the memory section to memorize the aforementioned movement Engineering of correction data for correction of position errors; and engineering of placing the support substrate on the platform and identifying the overall position of the support substrate placed on the platform; and based on The position data of the support substrate and the correction data obtained by the position identification project of the support substrate are used to correct the movement of the platform so that the plurality of installation areas are sequentially positioned at a certain installation position, so that the aforementioned The platform moving process; and the first and second mounting heads to interactively receive the aforementioned electronic parts, and to identify the position of the aforementioned electronic parts held at the aforementioned first or second mounting heads, based on Recognizing the position data of the electronic component to correct the movement of the first and second mounting heads to move the first and second mounting heads to the mounting position interactively, and by the first and second 2 A mounting head to interactively install the aforementioned electronic parts to the project at the aforementioned installation area sequentially positioned at the aforementioned installation position. The installation method as described in Item 6 of the patent application scope, wherein the installation process is a process of installing a plurality of the electronic components in the installation region of one of the support substrates. The installation method as described in item 6 or item 7 of the patent application scope, which further includes: individually identifying the positions of the first and second mounting heads positioned at the mounting position, and Based on the identified position data of the first and second mounting heads, a process of correcting the positional deviation between the first mounting head and the second mounting head is performed. A mounting method for packaged parts, characterized by including: a process of mounting electronic parts at each of the aforementioned plural mounting areas at a supporting substrate having plural mounting areas; and by being mounted on A process in which the electronic parts at the plural mounting areas are sealed in batches to form a pseudo-wafer; and a process for manufacturing packaged parts by forming a redistribution layer on the electronic parts in the pseudo-wafer, the foregoing The installation process of the electronic parts includes: obtaining the moving position error of the platform on which the support substrate is mounted, and causing the memory section to store correction data for correcting the movement position error; and placing the support substrate On the platform, and a process of identifying the overall position of the support substrate placed on the platform; and based on the position data of the support substrate and the aforesaid position obtained by the position identification process of the support substrate Correcting the data to correct the movement of the platform while moving the platform in order to locate the plural installation areas at a certain installation position; and interacting with the first and second mounting heads Receiving the electronic parts, and identifying the position of the electronic parts held at the first or second mounting head, and based on the identified position data of the electronic parts, the first and second parts The movement of the mounting head is modified so that the first and second mounting heads are alternately moved to the mounting position, and the first and second mounting heads are used to interactively mount the electronic components to be sequentially positioned at Works at the aforementioned installation area at the aforementioned installation location. The method of manufacturing a packaged component as described in item 9 of the patent application scope, wherein the installation process of the electronic component is a process of installing a plurality of the electronic components in the mounting area of one of the support substrates.