JP4665863B2 - Electronic component mounting method - Google Patents

Description

The present invention relates to that electronic component mounting method to mount electronic components on a substrate.

For the purpose of improving mounting efficiency in an electronic component mounting apparatus, an electronic component mounting apparatus that mounts electronic components in parallel on a plurality of substrates by a plurality of mounting heads is known. For example, in the electronic component mounting apparatus disclosed in Patent Document 1, two mounting heads are provided for one wafer sheet in which a plurality of electronic components are stored. It is configured so that it can be mounted in parallel on a plurality of substrates arranged corresponding to the mounting head. The two mounting heads can be independently controlled in operation, and each mounting head is provided with a substrate camera together with a nozzle.
JP 2005-72444 A

  By the way, if two mounting heads are provided for one wafer sheet, the other mounting head may be in an idling state while any one of the mounting heads performs a pickup operation. Also, if the error stops for some reason during mounting and the board regulation is released, the position data obtained by imaging all the position recognition marks on the board at the stage of mounting operation is discarded and not mounted It was necessary to image again the position recognition mark of the mounting location, and during that time, the pickup operation and mounting operation could not be performed. As described above, there is a possibility that the mounting efficiency may be reduced due to an increase in the idling state in which the mounting head cannot perform the mounting operation for recognizing the position of the mounting location.

Accordingly, the present invention aims at providing a with improved mounting efficiency electronic component mounting method.

According to the first aspect of the present invention, there is provided a substrate conveyance path provided with a substrate holding portion for holding a substrate, a first mounting head and a second mounting head each having a plurality of nozzles mounted thereon, A first mounting head and a second orthogonal robot mounted on the first orthogonal robot and the second orthogonal robot, respectively mounted on the mounting head and the second mounting head, respectively. The first substrate recognition camera and the second substrate recognition camera that are horizontally movable integrally with the mounting head, one component supply unit, and the first component recognition camera that images the electronic components of the component supply unit And a second component recognition camera that images the electronic component that is arranged in the moving path of the first mounting head and picked up by the first mounting head from below, and the movement of the second mounting head An electronic component mounting method using an electronic component mounting apparatus, comprising: a third component recognition camera that is arranged in the middle of a road and picks up an image of an electronic component picked up by a second mounting head from below. The mounting head includes a substrate recognition step (ST1) by the first substrate recognition camera, a pickup step (ST2) for picking up the electronic component of the component supply unit, and a component for recognizing the picked-up electronic component by the second component recognition camera. A unit mounting operation consisting of a recognition step (ST3) and a mounting step (ST4) for mounting electronic components on a substrate is repeatedly performed, and the second mounting head is a substrate recognition step (second substrate recognition camera). ST5), a pick-up step (ST6) for picking up the electronic components in the component supply unit, and a third component recognition camera for picking up the electronic components A unit mounting operation consisting of a component recognition step (ST7) for more recognition and a mounting step (ST8) for mounting an electronic component on a substrate is repeatedly performed. In the substrate recognition step (ST1, ST5), the first step In the unit mounting operation of the mounting head and the second mounting head, the position recognition is performed only for the mounting location where the electronic component is to be mounted, and the pickup process (ST2) by the first mounting head is started. The substrate recognition step (ST5) by the second substrate recognition camera is performed after the mounting to the substrate (ST4) is completed, and the pickup step (ST6) by the second mounting head is started. The board recognition process (ST1) by the first board recognition camera is performed after the mounting process to the board (ST8) is completed .

According to a second aspect of the present invention, in the first aspect of the invention, the component supply unit moves to a position close to either the first mounting head or the second mounting head during the pickup process. The first component recognition camera is mounted on a component recognition movement table so that the component supply unit can move in a direction orthogonal to the moving direction of movement, and this orthogonal movement is combined. Thus, the electronic component of the component supply unit is imaged by the first component recognition camera .

  According to the present invention, position recognition is performed for the number of mounting locations of the unit mounting number for each unit mounting operation of two mounting heads provided for one component supply unit, so that the unit mounting operation is performed in one mounting head. During this time, the board recognition unit provided in the other mounting head can recognize the position of the mounting location of the number of unit mounting. As a result, the idling state in which the mounting head cannot perform the mounting operation for position recognition is avoided, and the mounting efficiency is improved.

  Embodiments of the present invention will be described with reference to the drawings. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a side view of the electronic component mounting apparatus according to the embodiment of the present invention, and FIG. 3 is an electronic component mounting apparatus according to the embodiment of the present invention. FIG. 4 is a flowchart of the mounting operation in the electronic component mounting apparatus according to the embodiment of the present invention.

  The configuration of the electronic component mounting apparatus will be described with reference to FIGS. 1 and 2, an electronic component mounting apparatus 1 includes two independent mounting heads for one component supply unit, and a dual head type mounting apparatus in which a plurality of substrates are arranged corresponding to each mounting head. It is. On one end side of the electronic component mounting apparatus 1, conveyance rails 3 and 4 that convey and hold the substrate 2 are extended in one direction. In the middle of the transport path by the transport rails 3 and 4, there are first substrate holding places 3 a and 4 a that hold and correct the substrate 2 on the downstream side with respect to the transport direction of the substrate (see arrow A), and on the upstream side. Second substrate holding portions 3b and 4b for holding and correcting the substrate 2 are provided. The transport rails 3 and 4 not only transport the substrate 2, but also serve as a substrate holder that holds and regulates the substrate 2 at the first substrate holding locations 3a and 4a and the second substrate holding locations 3b and 4b. The board 2 that functions and is carried into the electronic component mounting apparatus 1 is temporarily stopped by the board stopper 5 at the board holding places 3a, 3b, 4a, and 4b, and is put at the board holding places 3a, 3b, 4a, and 4b. After being held and the electronic component is mounted, the electronic component is unloaded from the electronic component mounting apparatus 1. The substrate stopper 5 is movable between a position where the conveyance of the substrate 2 is allowed and a position where the substrate 2 is restricted, and stops the substrate 2 at each of the substrate holding locations 3a, 3b, 4a, 4b when the substrate stopper 5 is in the restricted position.

A substrate sensor 6 is provided corresponding to each substrate holding location 3a, 3b, 4a, 4b, and detects the substrate 2 held in each substrate holding location 3a, 3b, 4a, 4b. A substrate heating unit is provided corresponding to each substrate holding location 3a, 3b, 4a, 4b, and heats the substrate 2 held in each substrate holding location 3a, 3b, 4a, 4b. The substrate heating unit includes a substrate heating stage 7 having a heat generating unit such as a sheath heater or a ceramic heater, and a substrate heating stage elevating mechanism 8. The substrate heating stage 7 is located at the substrate holding locations 3a, 3b, 4a, and 4b. By moving up and down below the substrate 2, it is brought into contact with and separated from the lower surface of the substrate 2. Heating of the substrate 2 is started by bringing the substrate heating stage 7 into contact with the lower surface of the substrate 2, and heating of the substrate 2 is interrupted or stopped by moving the substrate heating stage 7 away from the lower surface of the substrate 2. When the substrate sensor 6 detects that the substrate 2 carried into the electronic component mounting apparatus 1 has arrived at each of the substrate holding locations 3a, 3b, 4a, 4b, the substrate heating stage elevating mechanism 8 operates, and the substrate heating stage Raise 7 As a result, the substrate 2 is heated from the lower surface side, and the resin adhesive applied to the upper surface shifts to an adhesive state that exhibits an adhesive force for joining the electronic components, so that the electronic component 10 can be mounted. Is to be maintained.

  The other end side of the electronic component mounting apparatus 1 serves as a component storage unit, and a wafer sheet 9 is disposed apart from the transport rails 3 and 4. A plurality of electronic components 10 are attached to the upper surface of the wafer sheet 9 and stored in a regularly arranged state. The wafer sheet 9 is set on a wafer sheet holding table 11 that can reciprocate in the same direction as the extending direction of the transport rails 3 and 4 (see arrow B). An ejector 12 is disposed on the lower surface side of the wafer sheet 9. The ejector 12 includes an ejector head 12 a that protrudes upward and downward. The ejector 12 can move in synchronization with the movement of the wafer sheet holding table 11, and can be moved below any electronic component 10. When picking up the electronic component 10, the ejector head 12 a protrudes below the arbitrary electronic component 10 to push up the electronic component 10, thereby promoting the peeling of the electronic component 10 attached to the upper surface of the wafer sheet 9. To do.

  The electronic component mounting apparatus 1 can be set on the wafer sheet holding table 11 while exchanging a plurality of wafer sheets 9 prepared in advance. A plurality of wafer sheets 9 storing electronic components 10 of a desired type are stored in a wafer sheet holding unit (not shown), and the wafer sheet 9 set on the wafer sheet holding table 11 is converted into a wafer sheet by a wafer sheet changing unit (not shown). The wafer sheet 9 is temporarily returned to the storage section, and instead, the wafer sheet 9 storing the desired type of electronic component 10 is set on the wafer sheet holding table 11. As a result, the electronic component mounting apparatus 1 can mount a variety of electronic components on the substrate 2, and can smoothly replace the wafer sheet 9 that has run out of components with a new wafer sheet 9.

  The electronic component mounting apparatus 1 includes two mounting heads, a first mounting head 13 and a second mounting head 14 each having a plurality of nozzles (three in the present embodiment) 17 and 18 mounted thereon. Yes. The first mounting head 13 is mounted on the first orthogonal robot 15 and can be moved horizontally above the two substrates 2 held by the component storage portion and the first substrate holding locations 3a and 4a. ing. The second mounting head 14 is mounted on the second orthogonal robot 16 and can be moved horizontally above the two substrates 2 held by the component storage portion and the second substrate holding locations 3b and 4b. It has become. Since only one wafer sheet 9 is provided for the two mounting heads 13 and 14 in the component storage unit, the pickup is moved to a position close to any of the mounting heads 13 and 14. (See arrow B). The nozzles 17 and 18 of the first mounting head 13 and the second mounting head 14 respectively pick up electronic components from the wafer sheet 9 and hold the two substrates 2 held at the first substrate holding locations 3a and 4a, respectively. Then, mounting is performed on the mounting locations provided on the two substrates 2 held by the second substrate holding locations 3b and 4b. The first mounting head 13 and the second mounting head 14 mount the electronic component on the unmounted portion of the substrate 2 by repeatedly performing a unit mounting operation consisting of a series of operations for picking up and mounting the electronic component. Go.

The electronic component mounting apparatus 1 includes a plurality of cameras that capture images of predetermined objects. Mounting accuracy is improved by analyzing the image of the object imaged by each camera and recognizing the exact position of the object. The first substrate recognition camera 19 and the second substrate recognition camera 20 are respectively mounted on the first orthogonal robot 15 and the second orthogonal robot 16 and integrated with the first mounting head 13 or the second mounting head 14. It is possible to move horizontally. The first substrate recognition camera 19 and the second substrate recognition camera 20 image a plurality of position recognition marks 2b corresponding to a plurality of mounting locations 2a preset on the substrate 2 (see FIG. 3).
The position of the mounting location 2a is recognized by image analysis of the imaged position recognition mark 2b, and the electronic components attracted by the nozzles 17 and 18 can be accurately positioned and mounted on the mounting location 2a.

  The first component recognition camera 21 is disposed at a position above the movement path of the wafer sheet 9. The first component recognition camera 21 is mounted on a component recognition camera moving table 22 and can move horizontally in a direction orthogonal to the moving direction of the wafer sheet 9 (see arrow B). By combining the movement of the wafer sheet 9 orthogonal to the movement of the first component recognition camera 21, all the electronic components 10 attached to the upper surface of the wafer sheet 9 are imaged by the first component recognition camera 21. . Thereby, each nozzle 17 and 18 can be correctly positioned and adsorbed to an arbitrary electronic component 10.

  The second component recognition camera 23 is disposed in the middle of the movement path when the first mounting head 13 that picks up the electronic component 10 from the wafer sheet 9 moves to the substrate 2. The second component recognition camera 23 is fixed to the electronic component mounting apparatus 1 and picks up an image of the electronic component 10 picked up by the first mounting head 13 passing therethrough from below. Thereby, the amount of positional deviation of the electronic component 10 with respect to the central axis of each nozzle 17 and 18 is recognized. This recognized positional deviation amount is corrected when the electronic component 10 is mounted on the mounting location of the substrate 2. The third component recognition camera 24 is disposed in the middle of the movement path of the second mounting head 14 and has the same function as the second component recognition camera 23.

  Next, the mounting operation of the electronic component in the electronic component mounting apparatus 1 will be described with reference to the flowchart of FIG. FIG. 4 shows the correlation of the three operations performed in the first mounting head 13, the second mounting head 14, and the component supply unit in time series.

  First, a series of operations in the first mounting head 13 will be described. First, substrate recognition (ST1... First recognition step) for recognizing the position of the mounting location 2a on the substrate 2 held in any of the first substrate holding locations 3a and 4a is performed. In this substrate recognition, position recognition is performed only for the mounting location 2a where the first mounting head 13 is to mount the electronic component in the unit mounting operation. For example, in FIG. 3, twelve mounting locations 2 a are provided on the substrate 2, but the position of all the twelve mounting locations 2 a is not recognized at a time, and the electronic component is used in the unit mounting operation. The position recognition is performed only for the mounting locations 2a corresponding to the number of unit mountings (three in the present embodiment) that are to be mounted. The unit mounting number may be a numerical value equal to or less than the number of nozzles, which is the maximum number of electronic components that can be picked up in the unit mounting operation, but the same number as the number of nozzles is preferable in terms of mounting efficiency.

  Next, the electronic component 10 is attracted to each nozzle 17 provided in the first mounting head 13 (ST2... First pickup process). Next, the picked-up electronic component 10 is imaged from below by the second component recognition camera 23, and the amount of displacement of each nozzle 17 with respect to the central axis is recognized (ST3). Next, each electronic component 10 is aligned and mounted on each of the three mounting locations 2a whose positions are recognized in the substrate recognition (ST1) (ST4... First mounting step). The electronic component 10 is mounted on the three mounting locations 2a by the series of operations from ST1 to ST4, that is, the unit mounting operation. In FIG. 3, when 12 mounting locations 2 a are provided on one substrate 2, if the number of unit mountings is 3, the electronic component 10 is mounted on all mounting locations 2 a by performing unit mounting operation 4 times. Can be implemented.

Next, a series of operations in the second mounting head 14 will be described. First, substrate recognition (ST5... Second recognition step) for recognizing the position of the mounting location 2a on the substrate 2 held in any of the second substrate holding locations 3b and 4b is performed. Also in this board recognition, as in the case of the first mounting head 13, position recognition is performed only for the mounting location 2a where the second mounting head is to mount the electronic component in the unit mounting operation. Next, the electronic component 10 is attracted to each nozzle 18 provided in the second mounting head 14 (ST6... Second pick-up process). Next, the picked-up electronic component 10 is imaged from below by the third component recognition camera 24, and the amount of positional deviation with respect to the central axis of each nozzle 18 is recognized (ST7). Next, each electronic component 10 is aligned and mounted on each of the three mounting locations 2a whose positions are recognized in the substrate recognition (ST5) (ST8... Second mounting step). By repeating the unit mounting operation consisting of the above ST5 to ST8, the electronic component 10 is mounted in all the mounting locations 2a.

  Next, a series of operations performed in the component supply unit will be described. The series of operations performed in the component supply unit is performed while adjusting the timing of the series of operations performed in the first mounting head 13 and the second mounting head 14. Before the pickup (ST2) is performed in the first mounting head 13, wafer recognition (ST9) for recognizing positions of the three electronic components 10 picked up in the unit mounting operation of the first mounting head 13 is performed. . At the time of pickup (ST2), the three nozzles 17 and each electronic component 10 are aligned based on the position recognition by this wafer recognition (ST9). In addition, when picking up (ST2), component separation (ST10) by the ejector 12 is performed synchronously. After the component peeling (ST10), before the pickup (ST6) is performed in the second mounting head 14, the positions of the three electronic components 10 picked up in the unit mounting operation by the second mounting head 14 are recognized. Wafer recognition (ST9) is performed. In the pickup (ST6), the three nozzles 18 and each electronic component 10 are aligned based on the position recognition by the wafer recognition (ST9). Further, when picking up (ST6), component separation (ST10) by the ejector 12 is performed synchronously.

  The series of operations in the first mounting head 13 and the series of operations in the second mounting head 14 are controlled so that the respective pickups (ST2, ST6) are not performed simultaneously. Then, after the pickup (ST2... First pickup process) is started in the first mounting head 13, the second mounting is performed after the mounting (ST4... First mounting process) is completed. Substrate recognition (ST5... Second recognition process) is performed in the head 14, and mounting is performed after the pickup (ST6... Second pickup process) is started in the second mounting head 14 (ST8... -Until the second mounting step) is completed, the first mounting head 13 is controlled so as to perform substrate recognition (ST1... First recognition step). It becomes possible to perform substrate recognition, and it is not necessary to provide a special time for substrate recognition. In particular, it is possible to contribute to the improvement of the mounting efficiency by synchronizing the pick-up process of one mounting head and the recognition process of the mounting head with the other.

  As described above, the electronic device is a dual head type mounting apparatus that includes two independent mounting heads 13 and 14 for one component supply unit, and a plurality of substrates 2 are arranged corresponding to the mounting heads 13 and 14. In the component mounting measure 1, the mounting heads 13 and 14 perform operation control so that the electronic components 10 are alternately picked up from one component supply unit, thereby preventing the idling state waiting for the operation as much as possible. ing. In addition, the mounting heads 13 and 14 perform position recognition in the stage before pickup only for the mounting locations 2a corresponding to the number of unit mountings where electronic components are mounted in the unit mounting operation. The operation of recognizing the position of the mounting location 2a is unnecessary. In addition, the holding position of the substrate 2 may be displaced with time due to the influence of heat, mechanical vibration, etc. applied to the substrate 2, but by mounting only at the mounting location 2a whose position is recognized immediately before the pickup, A positional shift due to the displacement of the substrate 2 can be suppressed as much as possible, and a reduction in mounting accuracy can be prevented.

Further, even if an error stop occurs due to some factor during the mounting operation and the board regulation is released, it is possible to recover by re-recognizing only the mounting location 2a of the number of unit mountings. Can be prevented.

  According to the present invention, since the substrate recognition unit provided in the other mounting head can perform the position recognition of the mounting positions of the number of unit mountings while the unit mounting operation is performed in one mounting head. There is an advantage that the mounting head can not perform an idling state where the mounting operation cannot be performed for recognition, and the mounting efficiency is improved. In the electronic component mounting field in which electronic components are mounted alternately by two mounting heads. Useful.

The top view of the electronic component mounting apparatus of embodiment of this invention The side view of the electronic component mounting apparatus of embodiment of this invention The top view of the board | substrate arrange | positioned at the electronic component mounting apparatus of embodiment of this invention Flowchart of mounting operation in the electronic component mounting apparatus according to the embodiment of the present invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Board | substrate 2a Mounting location 9 Wafer sheet 10 Electronic component 13 1st mounting head 14 2nd mounting head 19 1st board | substrate recognition camera 20 2nd board | substrate recognition camera

Claims (2)

A substrate transport path provided with a substrate holding portion for holding a substrate, a first mounting head and a second mounting head each having a plurality of nozzles mounted thereon, and a first mounting head and a second mounting head. The first orthogonal robot and the second orthogonal robot mounted on the first orthogonal robot and the second orthogonal robot respectively mounted on the first orthogonal robot and the second orthogonal robot are horizontally integrated with the first mounting head and the second mounting head. Moveable first substrate recognition camera and second substrate recognition camera, one component supply unit, a first component recognition camera that images the electronic components of this component supply unit, and movement of the first mounting head A second component recognition camera that images from below the electronic component that is disposed in the middle of the path and picked up by the first mounting head, and a second component recognition camera that is disposed in the middle of the movement path of the second mounting head. A third component recognition camera and the electronic component mounting method according to the electronic component mounting apparatus provided with a for imaging an electronic component picked up in the mounting head from below,
The first mounting head includes a substrate recognition step (ST1) by the first substrate recognition camera, a pickup step (ST2) for picking up the electronic component of the component supply unit, and the picked-up electronic component by the second component recognition camera. A unit mounting operation consisting of a component recognition step (ST3) for recognizing and a mounting step (ST4) for mounting an electronic component on a substrate is repeated.
The second mounting head includes a substrate recognition step (ST5) by the second substrate recognition camera, a pickup step (ST6) for picking up an electronic component of the component supply unit, and a third component recognition camera for picking up the electronic component. The unit mounting operation consisting of the component recognition step (ST7) recognized by the above and the mounting step (ST8) for mounting the electronic component on the substrate is repeated.
In the substrate recognition step (ST1, ST5), position recognition is performed only for the mounting location where the electronic component is to be mounted in the unit mounting operation of the first mounting head and the second mounting head.
In addition, a substrate recognition step (ST5) by the second substrate recognition camera is performed between the start of the pickup step (ST2) by the first mounting head and the end of the mounting step (ST4) on the substrate. Further, the substrate recognition step (ST1) by the first substrate recognition camera is performed after the pickup step (ST6) by the second mounting head is started and the mounting step (ST8) on the substrate is completed. A method for mounting electronic components. The component supply unit moves to a position close to either the first mounting head or the second mounting head during the pickup process, and the first component recognition camera is a component recognition moving table. The component supply unit can be moved in a direction orthogonal to the moving direction of movement, and the electronic component of the component supply unit is imaged by the first component recognition camera by combining this orthogonal movement. The electronic component mounting method according to claim 1, wherein:

Images