TW202031426A - Slurry supply device, wet blasting device, and slurry supply method - Google Patents
Slurry supply device, wet blasting device, and slurry supply method Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C7/00—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts
- B24C7/0007—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts the abrasive material being fed in a liquid carrier
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C11/00—Selection of abrasive materials or additives for abrasive blasts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C5/00—Devices or accessories for generating abrasive blasts
- B24C5/02—Blast guns, e.g. for generating high velocity abrasive fluid jets for cutting materials
- B24C5/04—Nozzles therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C7/00—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C7/00—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts
- B24C7/0046—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts the abrasive material being fed in a gaseous carrier
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C7/00—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts
- B24C7/0084—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts the abrasive material being fed in a mixture of liquid and gas
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C9/00—Appurtenances of abrasive blasting machines or devices, e.g. working chambers, arrangements for handling used abrasive material
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Weting (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
Abstract
Description
本發明係關於一種漿料供給裝置、濕式噴射加工裝置、及漿料供給方法。The present invention relates to a slurry supply device, a wet jet processing device, and a slurry supply method.
朝向被處理體噴射研磨材而進行被處理體之表面處理之噴射加工被利用於鏽皮去除、消流痕、除鏽、噴塗皮膜去除、基底處理等。在噴射加工中,業已知悉將研磨材與壓縮氣體一起以固氣二相流朝被處理體噴射之乾式噴射加工、及將包含研磨材之漿料與壓縮氣體一起以固氣液三相流朝被處理體噴射之濕式噴射加工。The blasting process of spraying abrasives toward the treated body to perform surface treatment of the treated body is used for scale removal, flow-elimination, rust removal, spray coating removal, base treatment, etc. In jet processing, dry jet processing in which the abrasive material and compressed gas are sprayed toward the object to be processed in a solid-gas two-phase flow, and the slurry containing the abrasive material and compressed gas are sprayed toward the object in a solid-gas-liquid three-phase flow. Wet spray processing of the processed body spray.
近年來,噴射加工也被用於半導體、電子零件、液晶等所使用之構件之微細加工之領域,為組裝入製造線而有在無塵室中使用之情形。由於乾式噴射加工雖然與濕式噴射加工相比加工能力較高,但有在裝置之保養維修及殼體之開閉時,研磨材飛散而污染無塵室之虞,故有利用濕式噴射加工裝置之情形。In recent years, spray processing has also been used in the field of micro processing of components used in semiconductors, electronic parts, liquid crystals, etc., and it is sometimes used in clean rooms for assembly into manufacturing lines. Although dry jet processing has a higher processing capacity than wet jet processing, there is a risk that abrasive materials will scatter and contaminate the clean room during the maintenance of the device and the opening and closing of the housing, so wet jet processing equipment is used The situation.
在濕式噴射加工裝置中存在吸引式噴射裝置及直壓式噴射裝置。在專利文獻1中曾揭示吸引式濕式噴射裝置。具體而言,在專利文獻1中曾記載具備下述部分之裝置,即:槽,其儲存漿料;漿料吸引管,其自槽內吸引用於朝噴嘴供給之漿料;及攪拌液導入管,其朝槽內導入攪拌用之液體。在該裝置中,藉由一面自攪拌液導入管導入攪拌用之液體,一面自漿料吸引管吸引槽內之漿料,而實現穩定之噴射加工。There are suction type spraying devices and direct pressure spraying devices in wet spray processing devices.
作為直壓式濕式噴射裝置,業已知悉專利文獻2及3所記載之直壓式濕式噴射裝置。在專利文獻2中曾揭示濕式噴射加工裝置,該濕式噴射加工裝置具備:槽,其儲存漿料;加壓用導管,其朝槽內導入加壓用之空氣;攪拌翼,其攪拌槽內之漿料;驅動馬達,其使攪拌翼旋轉;及噴嘴,其將漿料與壓縮空氣一起朝工件噴射。在該裝置中,藉由一面利用攪拌翼攪拌槽內之漿料,一面對槽內加壓,而自槽朝噴嘴供給均一之濃度之漿料。As a direct pressure wet spray device, the direct pressure wet spray device described in Patent Documents 2 and 3 is known. Patent Document 2 discloses a wet jet processing device. The wet jet processing device includes: a tank for storing slurry; a pressurizing duct that introduces air for pressurization into the tank; a stirring blade and a stirring tank The slurry inside; the drive motor, which makes the stirring wing rotate; and the nozzle, which sprays the slurry and compressed air toward the workpiece. In this device, the slurry in the tank is stirred by the stirring blade on one side, and the slurry in the tank is pressurized on the other side, and the slurry of uniform concentration is supplied from the tank to the nozzle.
在專利文獻3中曾記載漿料供給裝置,該漿料供給裝置具備:密閉容器,其收容漿料;繼流閥,其將密閉容器之漿料收容部密閉;攪拌用導管,其自密閉容器之底部供給攪拌用空氣;加壓用導管,其對密閉容器內供給加壓用空氣;及漿料供給管,其朝噴槍供給漿料。在該裝置中,藉由自密閉容器之下部供給攪拌用空氣而繼流閥上升,且藉由通過繼流閥之攪拌用空氣而攪拌繼流閥上之研磨材與液體。而且,自漿料供給管朝噴槍供給經攪拌之漿料。 [先前技術文獻] [專利文獻]In Patent Document 3, a slurry supply device is described. The slurry supply device is provided with: a closed container that contains the slurry; a relay valve that seals the slurry storage portion of the closed container; and a stirring pipe that is self-sealed. The bottom part is supplied with stirring air; the pressurizing pipe is used to supply pressurized air into the closed container; and the slurry supply pipe is used to supply the slurry to the spray gun. In this device, the relay valve is raised by supplying stirring air from the lower part of the closed container, and the abrasive material and liquid on the relay valve are stirred by the stirring air passing through the relay valve. Furthermore, the stirred slurry is supplied from the slurry supply pipe to the spray gun. [Prior Technical Literature] [Patent Literature]
專利文獻1:國際公開第2013/046854號公報 專利文獻2:日本特開2004-230535號公報 專利文獻3:日本特開平4-343668號公報Patent Document 1: International Publication No. 2013/046854 Patent Document 2: Japanese Patent Application Publication No. 2004-230535 Patent Document 3: Japanese Patent Laid-Open No. 4-343668
[發明所欲解決之問題][The problem to be solved by the invention]
濕式噴射加工之研磨效率依存於漿料中之研磨材與液體之比率。一般而言,由於若漿料中之研磨材之比例變大,則對被處理體噴射之研磨材之量增加,故噴射加工之加工效率上升。相對於此,在專利文獻1~3所記載之裝置中,由於對噴嘴供給在槽內被攪拌之漿料,故對噴嘴供給研磨材之比例較小之漿料,而加工效率降低。The polishing efficiency of wet jet processing depends on the ratio of the abrasive material to the liquid in the slurry. Generally speaking, if the proportion of the abrasive material in the slurry becomes larger, the amount of abrasive material sprayed on the object to be processed increases, so the processing efficiency of spray processing increases. On the other hand, in the apparatuses described in
因而,謀求提供一種可提高加工效率之漿料供給裝置、濕式噴射加工裝置、及漿料供給方法。 [解決問題之技術手段]Therefore, it is desired to provide a slurry supply device, a wet jet processing device, and a slurry supply method that can improve processing efficiency. [Technical means to solve the problem]
在一態樣中提供一種對噴嘴供給包含研磨材之漿料之漿料供給裝置。該漿料供給裝置具備:槽、滾筒、驅動裝置、噴射部及供給配管。槽在內部儲存漿料。在槽之底部形成有供給口。滾筒可繞旋轉軸旋轉,形成有供自供給口供給之漿料填充之凹部。驅動裝置使滾筒以旋轉軸為中心地旋轉。噴射部對凹部噴射高壓流體。供給配管對噴嘴供給藉由高壓流體之噴射而自凹部取出之漿料。In one aspect, a slurry supply device that supplies slurry containing abrasives to a nozzle is provided. The slurry supply device includes a tank, a roller, a driving device, a spraying part, and a supply pipe. The tank stores the slurry inside. A supply port is formed at the bottom of the tank. The drum is rotatable around a rotating shaft and is formed with a recess for filling with slurry supplied from the supply port. The driving device rotates the drum around the rotating shaft. The injection part injects high-pressure fluid to the concave part. The supply pipe supplies the nozzle with the slurry taken out from the recess by the jet of the high-pressure fluid.
在上述態樣之漿料供給裝置中,自槽之供給口供給之漿料被填充於滾筒之凹部。因研磨材比重較大,隨著時間之經過而沉降至槽之底部,而在槽之底部形成研磨材之比例較高之漿料。在上述態樣中,由於供給口設置於槽之底部,故在滾筒之凹部填充研磨材之比例較高之漿料。所填充之漿料藉由高壓流體之噴射而自凹部取出,且供給至噴嘴。因而,在上述態樣之漿料供給裝置中,可對噴嘴供給研磨材之比例較高之漿料,其結果為可提高濕式噴射加工之加工效率。In the slurry supply device of the above aspect, the slurry supplied from the supply port of the tank is filled in the recess of the drum. Because the specific gravity of the abrasive material is relatively large, it sinks to the bottom of the tank with the passage of time, and a slurry with a higher proportion of abrasive material is formed at the bottom of the tank. In the above aspect, since the supply port is provided at the bottom of the tank, the concave portion of the drum is filled with slurry with a higher proportion of abrasive. The filled slurry is taken out from the recessed portion by the jet of high-pressure fluid, and supplied to the nozzle. Therefore, in the slurry supply device of the above aspect, the slurry with a relatively high proportion of the abrasive can be supplied to the nozzle, and as a result, the processing efficiency of wet jet processing can be improved.
在一實施形態中,噴射部包含液體供給管及空氣供給管。液體供給管連接於供給液體之液體供給裝置。空氣供給管連接於供給壓縮空氣之壓縮空氣供給裝置。而且,噴射部可對凹部噴射包含來自液體供給管之液體及來自空氣供給管之壓縮空氣之混合流體。在該實施形態中,由於利用包含壓縮空氣及液體之混合流體自凹部取出漿料,故可調整對噴嘴供給之漿料中之研磨材與液體之比率。In one embodiment, the ejection part includes a liquid supply pipe and an air supply pipe. The liquid supply pipe is connected to a liquid supply device that supplies liquid. The air supply pipe is connected to a compressed air supply device that supplies compressed air. Furthermore, the spraying part can spray a mixed fluid containing liquid from the liquid supply pipe and compressed air from the air supply pipe to the concave portion. In this embodiment, since a mixed fluid containing compressed air and liquid is used to take out the slurry from the recess, the ratio of the abrasive material to the liquid in the slurry supplied to the nozzle can be adjusted.
在一實施形態中,可更具備閥,該閥設置於液體供給管與液體供給裝置之間,調節在液體供給管中流動之液體之流量。在該實施形態中,由於可與閥之開度相應地調整混合流體中之液體之比例,故可更細緻地調整漿料中之研磨材與液體之比率。In one embodiment, a valve may be further provided. The valve is provided between the liquid supply pipe and the liquid supply device to adjust the flow rate of the liquid flowing in the liquid supply pipe. In this embodiment, since the ratio of the liquid in the mixed fluid can be adjusted according to the opening of the valve, the ratio of the abrasive to the liquid in the slurry can be adjusted more finely.
在一實施形態中,液體可為切削油。在該實施形態中,在利用對噴嘴供給之漿料加工金屬製之被處理體時,可抑制在被處理體產生銹。又,於在噴射加工之前工序中利用切削油對被加工物予以機械加工之情形下,有在被加工物之表面殘留切削油之情形。在此情形下,由於漿料中之液與自被加工物脫離之切削油具有相同之特性,故可使漿料中之液體之黏度穩定化。In one embodiment, the liquid may be cutting oil. In this embodiment, when processing a metal to-be-processed body using the slurry supplied to the nozzle, it is possible to suppress the generation of rust in the to-be-processed body. In addition, in the case of machining the workpiece with cutting oil in the process prior to the jet processing, the cutting oil may remain on the surface of the workpiece. In this case, since the liquid in the slurry and the cutting oil separated from the workpiece have the same characteristics, the viscosity of the liquid in the slurry can be stabilized.
在一實施形態中,凹部為沿平行於旋轉軸之方向、或滾筒之周向延伸之槽,噴射部可構成為沿槽之延伸方向噴射高壓流體。在該實施形態中,藉由沿槽之延伸方向噴射高壓流體,而可確實地自凹部取出漿料。In one embodiment, the concave portion is a groove extending in a direction parallel to the rotation axis or the circumferential direction of the drum, and the spraying portion may be configured to spray high-pressure fluid along the extending direction of the groove. In this embodiment, by spraying the high-pressure fluid along the extending direction of the groove, the slurry can be reliably taken out from the recess.
在一實施形態中,可更具備輔助壓縮空氣供給裝置,該輔助壓縮空氣供給裝置對供給配管供給較高壓流體為低壓之輔助壓縮空氣。在該實施形態中,由於可減小供高壓流體流動之流路內之壓力與供給配管內之壓力之差,故可抑制在不依賴於高壓流體之噴射下取出填充於凹部之漿料。藉此,可對噴嘴穩定地供給漿料。In one embodiment, an auxiliary compressed air supply device may be further provided, and the auxiliary compressed air supply device supplies a higher-pressure fluid, which is a low-pressure auxiliary compressed air, to the supply pipe. In this embodiment, since the difference between the pressure in the flow path through which the high-pressure fluid flows and the pressure in the supply pipe can be reduced, it is possible to prevent the slurry filled in the recesses from being taken out without relying on the jet of the high-pressure fluid. Thereby, the slurry can be stably supplied to the nozzle.
在一實施形態中,可更具備朝槽內導入加壓用空氣之加壓用配管。在該實施形態中,由於藉由自加壓用配管供給之壓縮空氣對槽內加壓,故可將來自槽之漿料密集地填充於凹部,且可防止高壓流體朝槽逆流。In one embodiment, a pressurizing pipe that introduces pressurizing air into the tank may be further provided. In this embodiment, since the inside of the tank is pressurized by the compressed air supplied from the pressurizing pipe, the slurry from the tank can be densely filled in the recesses and the high-pressure fluid can be prevented from flowing back into the tank.
一態樣之濕式噴射加工裝置具備:上述之漿料供給裝置;及噴射自漿料供給裝置供給之漿料之噴嘴。根據該噴射裝置,由於可自噴嘴噴射研磨材之比例較高之漿料,故可提高濕式噴射加工之效率。One aspect of the wet jet processing device includes: the above-mentioned slurry supply device; and a nozzle for spraying the slurry supplied from the slurry supply device. According to this spraying device, since the slurry with a relatively high proportion of the abrasive can be sprayed from the nozzle, the efficiency of wet spray processing can be improved.
在一態樣中提供一種利用漿料供給裝置對噴嘴供給漿料之漿料供給方法。該漿料供給裝置具備:槽,其係在內部儲存包含研磨材之漿料者,在其底部形成有供給口,及滾筒,其可繞旋轉軸旋轉,在其外周面形成有凹部。漿料供給方法包含:在槽內使漿料中之研磨材沉降之工序;在使研磨材沉降之工序後,自供給口對凹部填充漿料之工序;使滾筒繞旋轉軸旋轉之工序;對凹部噴射高壓流體之工序;及對噴嘴供給藉由高壓流體之噴射而自凹部取出之漿料之工序。In one aspect, a slurry supply method using a slurry supply device to supply slurry to a nozzle is provided. This slurry supply device is equipped with a tank which stores a slurry containing an abrasive in its inside, a supply port is formed at the bottom of the tank, and a drum that is rotatable around a rotating shaft and has a recess formed on its outer peripheral surface. The slurry supply method includes: the process of sinking the abrasive in the slurry in the tank; after the process of sinking the abrasive, the process of filling the recessed portion with slurry from the supply port; the process of rotating the drum around the rotating shaft; The process of spraying high-pressure fluid from the recessed part; and the process of supplying the slurry taken out from the recessed part by the spray of the high-pressure fluid to the nozzle.
在上述態樣之漿料供給方法中,由於在漿料中之研磨材沉降後,將漿料自形成於槽之底部之供給口填充於凹部,故在凹部填充研磨材之比例較高之漿料。所填充之漿料藉由高壓流體之噴射而自凹部取出,且供給至噴嘴。因而,根據該方法,可對噴嘴供給研磨材之比例較高之漿料,其結果為可提高濕式噴射加工之效率。In the slurry supply method of the above aspect, since the slurry in the slurry settles, the slurry is filled in the recessed portion from the supply port formed at the bottom of the tank, so the recessed portion is filled with a higher proportion of slurry material. The filled slurry is taken out from the recessed portion by the jet of high-pressure fluid, and supplied to the nozzle. Therefore, according to this method, it is possible to supply the slurry with a high proportion of the abrasive to the nozzle, and as a result, the efficiency of wet jet processing can be improved.
在一實施形態中,可在噴射高壓流體之工序中,對凹部噴射包含液體及壓縮空氣之混合流體。在該實施形態中,由於利用包含壓縮空氣及液體之混合流體自凹部取出漿料,故可調整對噴嘴供給之漿料中之研磨材與液體之比率。 [發明之效果]In one embodiment, in the process of injecting a high-pressure fluid, a mixed fluid containing liquid and compressed air may be injected into the concave portion. In this embodiment, since a mixed fluid containing compressed air and liquid is used to take out the slurry from the recess, the ratio of the abrasive material to the liquid in the slurry supplied to the nozzle can be adjusted. [Effects of Invention]
根據本發明之一態樣及各種實施形態,可提高濕式噴射加工之加工效率。According to one aspect and various embodiments of the present invention, the processing efficiency of wet jet processing can be improved.
以下,參照圖式說明本發明之實施形態。此外,在以下之說明中,對於同一或等效要素賦予同一符號,且重複之說明不再重複。圖式之尺寸比率未必與說明之尺寸比率一致。“上”“下”“左”“右”等措辭係基於圖示之狀態者,且係便於說明者。Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in the following description, the same symbol is assigned to the same or equivalent element, and the repeated description will not be repeated. The size ratio of the drawing may not be consistent with the size ratio of the description. The terms "up", "down", "left", and "right" are based on the state of the illustration and are convenient for explanation.
圖1係概略地顯示一實施形態之噴射加工系統之圖。圖1所示之噴射加工系統1具備噴射加工裝置10、回收裝置50及吸引器42。噴射加工裝置10係朝被處理體噴射包含研磨材及液體之漿料,而加工被處理體W之濕式噴射加工裝置。作為被處理體W之加工,例示切斷加工、槽形成加工、打孔加工等,但可進行任意之加工。圖1所示之噴射加工裝置10為所謂直壓式之噴射裝置,藉由對槽內加壓而對噴嘴供給槽內之研磨材。Fig. 1 is a diagram schematically showing an injection processing system of an embodiment. The
噴射加工裝置10具備容器12及漿料供給裝置60。容器12包含上部容器13及下部容器14。上部容器13之下部被開放。下部容器14之上部被開放。在上部容器13與下部容器14之間設置有通過板23。在通過板23形成有可供後述之漿料S通過之複數個開口。上部容器13與通過板23一起區劃出加工室13s。The
在加工室13s內設置有加工台24。在加工台24上載置有被處理體W。被處理體W例如可能為陶瓷材料、玻璃材料等之硬脆材料、CFRP(Carbon Fiber Reinforced Plastics,碳纖維強化塑膠)材料等之難切削材料。加工台24由輸送機驅動部26支持。輸送機驅動部26設置於通過板23上。輸送機驅動部26為例如X-Y載台之移動機構。該輸送機驅動部26使載置於加工台24上之被處理體W相對於噴嘴30相對地移動。被處理體W之移動方向及移動速度與被處理體W之大小、形狀、材料、加工之圖案之形狀等相應地適宜設定。A processing table 24 is provided in the
在加工台24之上方設置有噴嘴30。噴嘴30係直壓式噴射加工用之噴射噴嘴,具有前端部30a及基端部30b。前端部30a以相對於加工台24之上表面對向之方式設置於加工室13s內。基端部30b配置於加工室13s之外部,且連接有供給配管68之一端。噴嘴30將自供給配管68供給之漿料S與壓縮空氣以氣液固三相流朝被處理體W噴射。A
在上部容器13之上方設置有噴嘴驅動部32。噴嘴驅動部32包含:連接於噴嘴30之連接機構、及驅動該連接機構。噴嘴驅動部32藉由驅動馬達,而使噴嘴30之水平方向之位置相對於載置於加工台24上之被處理體W相對地移動。由噴嘴驅動部32引起之噴嘴30之移動方向及移動速度與被處理體W之大小、形狀、材料、加工之圖案之形狀等相應地適宜設定。A nozzle driving unit 32 is provided above the
在一實施形態中,可在上部容器13之上部以與加工室13s連通之方式連接有回收管34之一端。回收管34之另一端連接於回收裝置50。回收裝置50具備旋風分離器36及捕集器38。在旋風分離器36連接有回收管34之另一端及旋風分離器導管40之一端。在旋風分離器導管40之另一端連接有吸引器42。吸引器42經由旋風分離器導管40及回收管34吸引加工室13s內之空氣而將加工室13s設為負壓。藉由該吸引器42之吸引力而產生自加工室13s朝向回收裝置50之氣流。藉此,自噴嘴30朝被處理體W噴射而成為霧狀之漿料S之一部分通過回收管34被搬送至旋風分離器36。旋風分離器36將霧狀之漿料S與空氣分離,且將霧狀之漿料S選擇性地回收至捕集器38。在旋風分離器36中與霧狀之漿料S分離之空氣通過旋風分離器導管40被吸引至吸引器42。In one embodiment, one end of the
又,可在加工室13s之上部設置遮蔽板44。遮蔽板44以介置於噴嘴30與回收管34之一端之間之方式配置,而捕集漂浮於加工室13s之霧狀之漿料S。由遮蔽板44捕集之漿料S以水滴滴落至通過板23。藉由在噴嘴30與回收管34之一端之間設置遮蔽板44,而提高漿料S之回收率。In addition, a shielding
在上部容器13之下方設置有下部容器14。下部容器14具有隨著朝向下方而寬度變窄之錐形狀之側壁。下部容器14與通過板23一起區劃出回收空間14s。回收空間14s經由形成於通過板23複數個開口與加工室13s連通。因而,自噴嘴30朝被處理體W噴射之漿料S通過形成於通過板23之複數個開口而被回收至下部容器14之回收空間14s。在下部容器14之底部形成有用於對漿料供給裝置60供給所回收之漿料S之下部開口14e。A
漿料供給裝置60設置於下部容器14之下方。以下,參照圖2,針對漿料供給裝置60進行說明。圖2係概略地顯示漿料供給裝置60之部分剖視立體圖。漿料供給裝置60係對噴嘴30供給包含研磨材M之漿料S之裝置。漿料供給裝置60具備:槽62、滾筒65、驅動裝置66、噴射部67及供給配管68。The
槽62設置於下部容器14之下方。槽62在其內部區劃出儲存空間62s,且在儲存空間62s儲存有漿料S。漿料S係包含研磨材M及液體L之流動體,具有相應於研磨材M與液體L之配比之黏性。並非被限定者,作為研磨材M之材料,例示氧化鋁粉、銑鐵砂及模砂。並非被限定者,作為液體L,例示水及機械加工用之切削油。此外,以下,利用“濃度”表示漿料S中所含之研磨材M之比例。亦即,漿料S之濃度較高表示研磨材M對於液體L之量之比率較大,漿料S之濃度較低表示研磨材M對於液體L之量之比率較小。The
槽62包含頂板62a及側壁62b。在圖2所示之實施形態中,槽62具有4個側壁62b。4個側壁62b各者具有:上部62b1,其與對向之側壁62b平行地配置;及下部62b2,其以隨著朝向下方而相對於側壁62b靠近之方式傾斜。亦即,槽62具有隨著朝向下方而寬度變窄之側壁。此外,若在其內部可儲存漿料S,則槽62之側壁62b之形狀並不限定於圖2所示之實施形態,可具有任意之形狀。The
在槽62之頂板62a形成有用於自容器12回收漿料S之上部開口70。上部開口70位於下部容器14之下部開口14e之下方。在槽62與下部容器14之間、更具體而言在下部開口14e與上部開口70之間設置有閥體72。閥體72為例如加壓閥,且為與槽62內部之壓力相應地開閉之加壓閥。具體而言,閥體72在儲存空間62s之壓力大於特定之壓力之情形下被閉合,在儲存空間62s之壓力成為特定之壓力以下時被開放。在閥體72被閉合之情形下,藉由將儲存空間62s與回收空間14s之連通遮斷,而停止被回收至下部容器14之漿料S朝槽62之供給。相反,在閥體72被開放之情形下,儲存空間62s與回收空間14s經由下部開口14e及上部開口70被連通,而將被回收至下部容器14之漿料S被供給至槽62。在一實施形態中,閥體72例如可為放卸閥或藉由氣缸等之驅動而使圓錐形狀之閥體上下顛倒之三角閥。The
又,在槽62之底部形成有下部開口73。更詳細而言,下部開口73形成於側壁62b之下部62b2之下端。下部開口73作為用於對滾筒65供給槽62內之漿料S之供給口而發揮功能。In addition, a
此外,在一實施形態中,可在槽62之內部設置攪拌翼74。攪拌翼74設置於儲存空間62s之上部,藉由馬達之驅動力而旋轉。此處,漿料S中之研磨材M由於與液體L相比比重更大,故隨著時間之經過而研磨材M沉降至槽62之底部。另一方面,藉由來自噴嘴30之漿料S之噴射而產生之被處理體W之切削粉及破碎之研磨材M由於碎片之粒徑較小而漂浮於液體L之表面。藉由利用攪拌翼74之旋轉攪拌漿料S,而可促進被處理體W之切削粉及研磨材M之碎片之漂浮。又,藉由調節攪拌翼74之旋轉速度,而可調整自後述之排出管78排出之被處理體W之切削粉及破碎之研磨材M之碎片之粒徑。In addition, in one embodiment, a
又,在一實施形態中,可在槽62之側壁62b之上部形成排出口76。排出口76經由排出管78連接於排出液槽79(參照圖1)。排出口76回收浮動於漿料S之表面之被處理體W之切削粉及研磨材M之碎片。自排出口76回收之切削粉及研磨材M之碎片通過排出管78而朝排出液槽79排出。Furthermore, in one embodiment, a
在槽62之下部開口73之下方設置有滾筒65。滾筒65被收容於箱型外殼C內。圖3係顯示漿料供給裝置60之滾筒65之周邊部之立體圖。如圖3所示,滾筒65具有圓柱形狀,可繞旋轉軸65x旋轉。在滾筒65之外周面(側面)形成有凹部65a。在圖3所示之實施形態中,在滾筒65形成有複數個凹部65a,在該等複數個凹部65a之間形成有構成滾筒65之外周面之複數個凸部65b。A
複數個凹部65a沿滾筒65之周向以大致相等之間隔排列。複數個凹部65a相互平行地延伸。複數個凹部65a各者呈在平行於旋轉軸65x之方向延伸之槽狀,其兩端形成開放端。凹部65a自與旋轉軸65x正交之剖面觀察形成大致矩形狀。在該等複數個凹部65a中填充自下部開口73供給之漿料S。由於在槽62之底部積壓沉降之研磨材M,故自下部開口73朝凹部65a填充濃度較高之漿料S。The plurality of
在滾筒65之旋轉軸65x連接有驅動裝置66(參照圖1)。驅動裝置66為例如馬達,對滾筒65賦予驅動力,而使滾筒65繞旋轉軸65x旋轉。驅動裝置66自後述之控制裝置CNT接收控制信號,以與該控制信號相應之旋轉速度使滾筒65旋轉。The
在一實施形態中,漿料供給裝置60可更具備填充筒64。填充筒64設置於槽62之下部開口73與滾筒65之間。亦即,填充筒64設置於下部開口73之下方。如圖3所示,填充筒64呈中空之筒狀,具有上端64a及下端64b。In one embodiment, the
填充筒64之上端64a以填充筒64之內部經由下部開口73與儲存空間62s連通之方式連接於槽62之側壁62b。此外,槽62與填充筒64可一體地形成。填充筒64之下端64b以與滾筒65之外周面接近或接觸之方式沿滾筒65之外周面彎曲。亦即,下端64b配置為自滾筒65之徑向外側覆蓋對向之凹部65a。填充筒64之下端64b在平行於旋轉軸65x之方向上具有與沿平行於旋轉軸65x之方向之凹部65a之寬度相同或大於其之寬度。填充筒64將自槽62之下部開口73供給之漿料S填充於對向之滾筒65之凹部65a。The
在滾筒65之附近設置有噴射部67。噴射部67具有藉由對滾筒65之凹部65a噴射高壓流體而自凹部65a取出漿料S之功能。如圖2所示,在一實施形態中,噴射部67具有液體供給管80及空氣供給管82。A
液體供給管80經由配管81連接於液體供給裝置84(參照圖1)。液體供給裝置84為液體80f之供給源,經由配管81對液體供給管80供給藉由壓縮空氣或液體泵而被加壓之液體80f。自液體供給裝置84供給之液體80f具有與儲存於槽62之漿料S之液體L相同之成分。例如,液體80f為水或切削油。空氣供給管82經由配管83連接於空氣供給裝置86。空氣供給裝置86為壓縮空氣82f之供給源,經由配管83對空氣供給管82供給壓縮空氣82f。在一實施形態中,如圖2所示,液體供給管80及空氣供給管82具有將液體供給管80配置於空氣供給管82之內部之雙管構造。The
在一實施形態中,於配管81設置有閥81a及流量計81b。亦即,閥81a及流量計81b設置於液體供給裝置84與液體供給管80之間。閥81a調整自液體供給裝置84供給且在液體供給管80中流動之液體80f之流量。流量計81b檢測自液體供給裝置84供給且在液體供給管80中流動之液體80f之流量。In one embodiment, the
在一實施形態中,如圖2所示,漿料供給裝置60更具備加壓用配管98。加壓用配管98之一端連接於槽62之上部。加壓用配管98之另一端在前端部82t與空氣供給裝置86之間連接於空氣供給管82。因而,自空氣供給裝置86對空氣供給管82供給之壓縮空氣82f之一部分分支,經由加壓用配管98而作為加壓用空氣98f導入至槽62內。In one embodiment, as shown in FIG. 2, the
槽62之內部藉由供給加壓用空氣98f而被加壓。藉由槽62內之壓力上升而閥體72被閉合,將下部容器14之回收空間14s與槽62之儲存空間62s之連通遮斷。在一實施形態中,可構成為以自噴嘴30噴射漿料S之時序自空氣供給裝置86供給壓縮空氣82f,且伴隨於此加壓用空氣98f被供給至槽62內。藉由加壓用空氣98f被供給至槽62內,而槽62內被加壓。藉由該壓力,而槽62內之漿料S經由下部開口73被密集地填充於滾筒65之凹部65a。The inside of the
在一實施形態中,液體供給管80之前端部80t及空氣供給管82之前端部82t可具有隨著朝向前端而直徑變小之錐形形狀。在液體供給管80中流動之液體80f在自液體供給管80之前端部80t噴出時被微細化而成為霧狀,且與在空氣供給管82中流動之壓縮空氣82f合流。合流之液體80f及壓縮空氣82f作為混合流體88自空氣供給管82之前端部82t噴射。該混合流體88係包含液體80f及壓縮空氣82f之高壓流體。In one embodiment, the front end portion 80t of the
噴射部67更具備取出配管90。取出配管90連接於空氣供給管82之前端部82t側。取出配管90沿與凹部65a之延伸方向平行之方向延伸,且與滾筒65鄰接地配置。此外,取出配管90為滾筒65之旋轉方向之下游,可配置於填充於凹部65a之漿料S不會自凹部65a滴落之位置。The
如圖3所示,在取出配管90形成有構成管路之壁面被局部地切下而管路之一部分被開放之缺口部92。缺口部92設置為與滾筒65之外周面對向,在凹部65a之延伸方向上具有與凹部65a大致同一寬度。在缺口部92中,構成為於滾筒65位於特定之旋轉位置時,取出配管90之2個端面與2個凸部65b呈對面。如此,藉由取出配管90之2個端面與2個凸部65b呈對面,而在取出配管90與滾筒65之間形成有由取出配管90之內壁面與滾筒65之凹部65a區劃出之流路93。As shown in FIG. 3, a
自空氣供給管82之前端部82t噴射之混合流體88經由取出配管90流入流路93。在該混合流體88在流路93中流動時,填充於構成流路93內之凹部65a內之漿料S自凹部65a被取出。亦即,自空氣供給管82之前端部82t噴出之混合流體88沿凹部65a之延伸方向噴射。The
取出配管90連接於供給配管68。藉由混合流體88之噴射而自凹部65a掉落之漿料S沿混合流體88之流動被供給至供給配管68。供給配管68將藉由混合流體88之噴射而自凹部65a掉落之漿料S供給至噴嘴30。The take-out
在一實施形態中,可在供給配管68連接有輔助壓縮空氣供給裝置94。輔助壓縮空氣供給裝置94為例如壓縮機,經由輔助導管對供給配管68供給輔助壓縮空氣94f。在一實施形態中,輔助壓縮空氣供給裝置94可將較混合流體88為低壓之輔助壓縮空氣94f供給至供給配管68。例如,輔助壓縮空氣94f與壓縮空氣82f之間之差壓設定為0.01 Mpa以上0.1 Mpa以下。藉由該壓縮空氣82f而自凹部65a掉落之漿料S被搬送至噴嘴30。In one embodiment, an auxiliary compressed
如上述般,被供給至噴嘴30之漿料S朝被處理體W噴射。噴射至被處理體W之漿料S之一部分再次被回收至下部容器14之回收空間14s,且再次供給至漿料供給裝置60。As described above, the slurry S supplied to the
再者,在一實施形態中,噴射加工裝置10可更具備控制裝置CNT。控制裝置CNT例如由可程式化之電腦構成,控制噴射加工系統1之整體之動作。控制裝置CNT例如具備:輸送機驅動部26、噴嘴驅動部32、吸引器42、驅動裝置66、閥81a、液體供給裝置84、空氣供給裝置86及輔助壓縮空氣供給裝置94。Furthermore, in one embodiment, the
控制裝置CNT依照所輸入之程式而動作,且送出控制信號。藉由來自控制裝置CNT之控制信號,而可控制加工台24之移動方向及移動速度、噴嘴30之移動方向及移動速度、吸引器42之作動及作動停止、滾筒65之旋轉速度、調整在液體供給管80中流動之液體80f之流量之液體供給裝置84之作動及作動停止、空氣供給裝置86之作動及作動停止、以及輔助壓縮空氣供給裝置94之作動及作動停止。The control device CNT operates in accordance with the input program and sends a control signal. With the control signal from the control device CNT, it is possible to control the moving direction and moving speed of the processing table 24, the moving direction and moving speed of the
其次,參照圖4,針對一實施形態之濕式噴射加工方法進行說明。該濕式噴射加工方法利用例如上述之噴射加工系統1而執行。圖4係顯示一實施形態之濕式噴射加工方法之流程圖。在一實施形態之濕式噴射加工方法中,首先,在工序ST1中,自漿料供給裝置60對噴嘴30供給漿料S。參照圖5,針對工序ST1之漿料供給方法詳細地說明。Next, referring to FIG. 4, a wet jet processing method according to an embodiment will be described. This wet blasting method is executed using, for example, the
圖5係顯示一實施形態之漿料供給方法之流程圖。該漿料供給方法利用例如圖2所示之漿料供給裝置60執行。如圖5所示,工序ST1包含工序ST11~工序ST16。在一實施形態之漿料供給方法中,首先進行工序ST11。Fig. 5 is a flowchart showing a slurry supply method of an embodiment. This slurry supply method is executed using, for example, the
在工序ST11中,藉由自空氣供給裝置86對槽62內供給加壓用空氣98f,而對槽62內加壓。其次,在工序ST12中,於槽62內,漿料S中之研磨材M沉降。由於研磨材M之比重大於液體L之比重,故藉由在使攪拌翼74之旋轉停止之狀態下放置特定之時間,而漿料S中之研磨材M沉降至槽62之底部。In step ST11, by supplying pressurizing
於在工序ST12中槽62內之研磨材M沉降後,進行工序ST13。在工序ST13中,自下部開口73供給之漿料S藉由填充筒64而填充於滾筒65之凹部65a。由於研磨材M沉降至槽62內之底部,故在工序ST13中填充於凹部65a之漿料S為具有高黏性之高濃度之漿料。After the abrasive material M in the
在接續之工序ST14中,利用驅動裝置66對滾筒65賦予驅動力,而將滾筒65繞旋轉軸65x旋轉。藉此,填充於凹部65a之漿料S朝滾筒65之旋轉方向下游移動,且被搬送至與取出配管90之缺口部92對向之位置。此外,對噴嘴30供給之漿料S之量依存於滾筒65之旋轉速度。在工序ST14中,藉由滾筒65之旋轉速度增大,而每單位時間內被填充漿料S之凹部65a之數目增加。相反,藉由減小滾筒65之旋轉速度,而每單位時間內被填充漿料S之凹部65a之數目減少。因而,藉由使滾筒65之旋轉速度變化,而可控制漿料S對噴嘴30之供給量。In the subsequent step ST14, the driving
其次,進行工序ST15。在工序ST15中,對凹部65a噴射包含來自液體供給管80之液體80f與來自空氣供給管82之壓縮空氣82f之混合流體88。該混合流體88沿凹部65a之延伸方向噴射。藉由如上述般噴射之混合流體88,而填充於凹部65a之漿料S掉落。在一實施形態中,藉由在進行工序ST15前,調整閥81a之開度,而可調整混合流體88中所含之液體80f之量。藉由調整混合流體88中所含之液體80f之量,而可調整自凹部65a掉落之漿料S之濃度。若漿料之濃度過高,則有隨著被處理體W之加工進行而漿料S中之研磨材M積壓於被處理體W之情形。積壓於被處理體W上之研磨材M覆蓋被處理體W之表面,而成為阻礙噴射加工之進行之原因。藉由調整閥81a而調整液體80f之量,而可抑制研磨材M積壓於被處理體W。此外,混合流體88中所含之液體80f之量可藉由調整液體供給裝置84之液體80f之供給壓力而調整。Next, step ST15 is performed. In step ST15, the
在接續之ST16中,將在工序ST15中自凹部65a掉落之漿料S供給至噴嘴30。在一實施形態中,自輔助壓縮空氣供給裝置94供給輔助壓縮空氣94f,藉由該輔助壓縮空氣94f而漿料S被搬送至噴嘴30。In the subsequent ST16, the slurry S dropped from the
再次參照圖4,針對一實施形態之濕式噴射加工方法進行說明。在一實施形態之濕式噴射加工方法中,於在工序ST1中將漿料S供給至噴嘴30後進行工序ST2。在工序ST2中,自噴嘴30朝被處理體W噴射漿料S。此時,自噴嘴以氣液固三相流噴射漿料S及壓縮空氣82f。自噴嘴30噴射之漿料S與被處理體W衝撞,而被處理體W被加工。此時,由於在自噴嘴噴射之漿料S中以較高之比例包含研磨材M,故以高效率加工被處理體W。Referring again to FIG. 4, the wet jet processing method of an embodiment will be described. In the wet jet processing method of one embodiment, the step ST2 is performed after the slurry S is supplied to the
其次,針對變化例之漿料供給裝置進行說明。以下,關於變化例之漿料供給裝置,主要針對與上述之漿料供給裝置60之不同點進行說明。圖6係顯示變化例之漿料供給裝置100之圖。Next, the slurry supply device of the modified example will be described. Hereinafter, regarding the slurry supply device of the modified example, the difference from the above-mentioned
如圖6所示,漿料供給裝置100具備滾筒102而取代滾筒65。滾筒102具有圓柱形狀,可以旋轉軸102x為中心地旋轉。在滾筒102之外周面(側面)形成有沿滾筒102之周向延伸之凹部102a。在圖6所示之實施形態中,沿平行於旋轉軸102x之方向排列有複數個凹部102a。複數個凹部102a各者形成槽狀,形成為周繞滾筒102之外周面。複數個凹部102a相互平行地延伸。As shown in FIG. 6, the
又,漿料供給裝置100具備噴射部110而取代噴射部67。噴射部110更具有對滾筒102噴射混合流體88之噴射器112。在噴射器112連接有液體供給管80及空氣供給管82。在噴射器112之內部形成有供自液體供給管80及空氣供給管82供給之液體80f及壓縮空氣82f合流之合流室114。在噴射器112中形成有與合流室114連通之複數個開口116。複數個開口116形成於與複數個凹部102a對應之位置。In addition, the
若自液體供給管80及空氣供給管82供給液體80f及壓縮空氣82f,則液體80f及壓縮空氣82f在合流室114中合流。合流之液體80f及壓縮空氣82f通過複數個開口116,以混合流體88沿複數個凹部102a之延伸方向朝向複數個凹部102a噴射。在圖6所示之實施形態中,混合流體88自滾筒102之外周向方向觀察朝與複數個凹部102a一致之方向噴射。藉由混合流體88朝複數個凹部102a噴射,而自複數個凹部102a取出填充於複數個凹部102a之漿料S。自複數個凹部102a取出之漿料S被捕集於回收容器118,且自設置於回收容器118之底部之開口被給送至供給配管68。被給送至供給配管68之漿料S藉由輔助壓縮空氣94f而被供給至噴嘴30。When the liquid 80f and the
以上,針對各種實施形態之漿料供給裝置、濕式噴射加工裝置及漿料供給方法進行了說明,但並不限定於上述之實施形態,可在不變更發明之要旨之範圍內構成各種變化態樣。例如,在上述實施形態中,凹部65a、102a呈槽狀,但只要能夠填充漿料S則凹部65a、102a可具有任意之形狀。例如,凹部65a、102a可為具有圓形、橢圓形、多角形狀之平面形狀之孔。又,凹部65a、102a只要在滾筒65、102至少形成1個即可,可不必形成複數個。Above, various embodiments of the slurry supply device, wet jet processing device, and slurry supply method have been described, but they are not limited to the above-mentioned embodiments, and various modifications can be made within the scope of not changing the gist of the invention. kind. For example, in the above embodiment, the
又,在上述實施形態中,利用包含液體80f及壓縮空氣82f之混合流體88自凹部65a、102a取出漿料S,但可藉由朝凹部65a、102a噴射僅液體80f或壓縮空氣82f之一者,而自凹部65a、102a取出漿料S。又,漿料供給裝置60可不必具備輔助壓縮空氣供給裝置94。此情形下,自凹部65a、102a取出之漿料S藉由起因於混合流體88之壓力而被供給至噴嘴30。Furthermore, in the above embodiment, the
在一實施形態中,漿料供給裝置60可更具備回收自凹部65a、102a溢出而未經填充之漿料S之回收槽。回收槽例如配置於滾筒65之下方。又,在一實施形態中,為了調節漿料S之供給量,而可調整凹部65a之深度。In one embodiment, the
以下,基於實驗例更具體地說明本發明,但本發明並非係限定於以下之實驗例者。Hereinafter, the present invention will be explained more specifically based on experimental examples, but the present invention is not limited to the following experimental examples.
(實驗例1)
在實驗例1中,利用圖1所示之噴射加工裝置10對被處理體W進行噴射加工。在本實驗例中,將形成有孔之反轉圖案之乾膜光阻劑配置於被處理體W即玻璃基板上,且藉由自噴嘴30噴射漿料S而進行打孔加工。使用氧化鋁#600而作為漿料S中所含之研磨材M,使用水而作為液體L。(Experimental example 1)
In Experimental Example 1, the body W to be processed was subjected to blast processing using the
實驗例1之加工條件如以下般。
・加壓用空氣98f之壓力:0.3 [MPa]
・輔助壓縮空氣94f之壓力:0.28 [MPa]
・噴嘴30之噴射口之孔徑:ϕ6 [mm]
・在液體供給管80中流動之液體80f之流量:0.05 [L/min]
・液體供給裝置84之供給壓力:0.4 [MPa]
・噴嘴30之移動速度:10 [m/min]
・加工台24之移動速度:20 [mm/min]The processing conditions of Experimental Example 1 are as follows.
・Pressure of
依照上述加工條件加工被處理體W,且測定形成於被處理體W之孔之深度。其結果為,孔之加工深度為430 [μm]。The body W to be processed was processed according to the above processing conditions, and the depth of the hole formed in the body W was measured. As a result, the processing depth of the hole was 430 [μm].
在比較實驗例1中,利用乾式吸引式噴射加工裝置(株式會社Elfotech製EMS-4型)對被處理體W進行噴射加工。使用與實驗例1相同之玻璃基板而作為被處理體W。使用氧化鋁#600而作為研磨材。In Comparative Experimental Example 1, a dry suction jet processing device (EMS-4 type manufactured by Elfotech Co., Ltd.) was used to jet processing the object W. The same glass substrate as in Experimental Example 1 was used as the object W to be processed. Alumina #600 is used as the abrasive.
比較實驗例1之加工條件如以下般。 ・加壓用空氣之壓力:0.3 [MPa] ・噴嘴30之噴射口之孔徑:ϕ6 [mm] ・噴嘴30之移動速度:10 [m/min] ・加工台24之移動速度:20 [mm/min]The processing conditions of Comparative Experimental Example 1 are as follows. ・Pressure of pressurized air: 0.3 [MPa] ・Aperture of nozzle 30: ϕ6 [mm] ・Movement speed of nozzle 30: 10 [m/min] ・Moving speed of processing table 24: 20 [mm/min]
依照上述加工條件加工被處理體W,且測定形成於被處理體W之孔之深度。其結果為,實驗例1之孔之加工深度為38 [μm]。The body W to be processed was processed according to the above processing conditions, and the depth of the hole formed in the body W was measured. As a result, the processing depth of the hole in Experimental Example 1 was 38 [μm].
根據實驗例1及比較實驗例1之結果可確認,一實施形態之噴射加工裝置10與乾吸式噴射裝置相比,具有11.3倍之加工能力。According to the results of Experimental Example 1 and Comparative Experimental Example 1, it can be confirmed that the
<實驗例2>
在實驗例2中,利用圖1所示之噴射加工裝置10對被處理體W進行噴射加工。惟,在本實驗例中,作為漿料供給裝置,使用圖6所示之漿料供給裝置100,而取代圖1所示之漿料供給裝置60。在本實驗例中,對該被處理體W,藉由噴射漿料S而進行去除毛刺加工。使用藉由機械加工而附著有切削油之SUS304製之加工零件,而作為被處理體W。使用Epson Atmix株式會社製之KUAMET-32 μm,而作為漿料S中所含之研磨材M,使用株式會社松村(MORESCO)製之切削油Moresco Seal Mate BS-6S作為液體L。<Experimental example 2>
In Experimental Example 2, the body W to be processed was spray-processed by the spray-processing
實驗例2之加工條件如以下般。
・加壓用空氣98f之壓力:0.2 [MPa]
・輔助壓縮空氣94f之壓力:0.18 [MPa]
・噴嘴30之噴射口之孔徑:ϕ6 [mm]
・在液體供給管80中流動之液體80f之流量:0.05 [L/min]
・液體供給裝置84之供給壓力:0.3 [MPa]
・噴嘴30之移動速度:10 [m/min]
・加工台24之移動速度:30 [mm/min]The processing conditions of Experimental Example 2 are as follows.
・Pressure of
依照上述加工條件進行被處理體W之去除毛刺。在實驗例2中,確認藉由掃描一次被處理體W而自被處理體W去除毛刺。Deburring of the processed body W is performed according to the above processing conditions. In Experimental Example 2, it was confirmed that the burr was removed from the processed body W by scanning the processed body W once.
在比較實驗例2中,利用乾式吸引式噴射加工裝置(株式會社Elfotech製EMS-4型)對同一被處理體W進行噴射加工。In Comparative Experimental Example 2, the same to-be-processed body W was spray-processed using a dry suction jet processing device (EMS-4 type manufactured by Elfotech Co., Ltd.).
比較實驗例2之加工條件如以下般。 ・加壓用空氣之壓力:0.3 [MPa] ・噴嘴30之噴射口之孔徑:ϕ6 [mm] ・噴嘴30之移動速度:10 [m/min] ・加工台24之移動速度:30 [mm/min]The processing conditions of Comparative Experimental Example 2 are as follows. ・Pressure of pressurized air: 0.3 [MPa] ・Aperture of nozzle 30: ϕ6 [mm] ・Movement speed of nozzle 30: 10 [m/min] ・Moving speed of processing table 24: 30 [mm/min]
依照上述加工條件進行被處理體W之去除毛刺。在比較實驗例2中,確認藉由掃描8次被處理體W而自被處理體W去除毛刺。Deburring of the processed body W is performed according to the above processing conditions. In Comparative Experimental Example 2, it was confirmed that the burr was removed from the processed body W by scanning the processed body W eight times.
根據實驗例2及比較實驗例2之結果確認,一實施形態之噴射加工裝置10與乾吸式噴射裝置相比具有8倍之去除毛刺加工能力。According to the results of Experimental Example 2 and Comparative Experimental Example 2, it is confirmed that the
1:噴射加工系統 10:噴射加工裝置 12:容器 13:上部容器 13s:加工室 14:下部容器 14e:下部開口 14s:回收空間 23:通過板 24:加工台 26:輸送機驅動部 30:噴嘴 30a:前端部 30b:基端部 32:噴嘴驅動部 34:噴嘴驅動部 36:旋風分離器 38:捕集器 40:旋風分離器導管 42:吸引器 44:遮蔽板 50:回收裝置 60:漿料供給裝置 62:槽 62a:頂板 62b:側壁 62b1:上部 62b2:下部 62s:儲存空間 64:填充筒 64a:上端 64b:下端 65:滾筒 65a:凹部 65b:凸部 65x:旋轉軸 66:驅動裝置 67:噴射部 68:供給配管 70:上部開口 72:閥體 73:下部開口 74:下部開口 76:排出口 78:排出管 79:排出液槽 80:液體供給管 80f:液體 81:配管 81a:閥 81b:流量計 82:空氣供給管 82f:壓縮空氣 82t:前端部 83:配管 84:液體供給裝置 86:空氣供給裝置 88:混合流體 90:取出配管 92:缺口部 93:流路 94:輔助壓縮空氣供給裝置 94f:輔助壓縮空氣 98:加壓用配管 98f:加壓用空氣 100:漿料供給裝置 102:滾筒 102a:凹部 102x:旋轉軸 110:噴射部 112:噴射器 114:合流室 116:開口 118:回收容器 C:箱型外殼 CNT:控制裝置 L:液體 M:研磨材 S:漿料 W:被處理體1: Jet processing system 10: Jet processing device 12: container 13: upper container 13s: processing room 14: Lower container 14e: lower opening 14s: Reclaim space 23: Pass the board 24: Processing table 26: Conveyor Drive 30: nozzle 30a: Front end 30b: Base end 32: Nozzle drive 34: Nozzle drive 36: Cyclone 38: catcher 40: Cyclone separator duct 42: attractor 44: Shading plate 50: recovery device 60: Slurry supply device 62: Slot 62a: top plate 62b: side wall 62b1: upper part 62b2: lower part 62s: storage space 64: filling cylinder 64a: upper end 64b: bottom 65: roller 65a: recess 65b: convex 65x: rotation axis 66: Drive 67: Jet Department 68: Supply piping 70: upper opening 72: Valve body 73: Lower opening 74: Lower opening 76: Outlet 78: discharge pipe 79: Drain the liquid tank 80: Liquid supply pipe 80f: liquid 81: Piping 81a: Valve 81b: Flowmeter 82: Air supply pipe 82f: compressed air 82t: Front end 83: Piping 84: Liquid supply device 86: Air supply device 88: Mixed fluid 90: Take out the piping 92: Notch 93: Flow Path 94: auxiliary compressed air supply device 94f: auxiliary compressed air 98: Piping for pressurization 98f: Air for pressurization 100: Slurry supply device 102: roller 102a: recess 102x: Rotation axis 110: Jet Department 112: ejector 114: Confluence Room 116: open 118: recycling container C: Box type enclosure CNT: control device L: Liquid M: Abrasive material S: Slurry W: processed body
圖1係概略地顯示一實施形態之噴射加工系統之圖。 圖2係概略地顯示一實施形態之漿料供給裝置之部分剖視立體圖。 圖3係概略顯示滾筒之周邊部之圖。 圖4係顯示一實施形態之噴射加工方法之流程圖。 圖5係顯示一實施形態之漿料供給方法之流程圖。 圖6係顯示變化例之漿料供給裝置之圖。Fig. 1 is a diagram schematically showing an injection processing system of an embodiment. Fig. 2 is a perspective view schematically showing a partial cross-sectional view of a slurry supply device of an embodiment. Figure 3 is a diagram schematically showing the periphery of the drum. Fig. 4 is a flow chart showing an embodiment of the spray processing method. Fig. 5 is a flowchart showing a slurry supply method of an embodiment. Fig. 6 is a diagram showing a slurry supply device of a modified example.
30:噴嘴 30: nozzle
60:漿料供給裝置 60: Slurry supply device
62:槽 62: Slot
62a:頂板 62a: top plate
62b:側壁 62b: side wall
62b1:上部 62b1: upper part
62b2:下部 62b2: lower part
62s:儲存空間 62s: storage space
64:填充筒 64: filling cylinder
65:滾筒 65: roller
65a:凹部 65a: recess
66:驅動裝置 66: Drive
67:噴射部 67: Jet Department
68:供給配管 68: Supply piping
70:上部開口 70: upper opening
72:閥體 72: Valve body
73:下部開口 73: Lower opening
74:下部開口 74: Lower opening
76:排出口 76: Outlet
78:排出管 78: discharge pipe
80:液體供給管 80: Liquid supply pipe
80f:液體 80f: liquid
82:空氣供給管 82: Air supply pipe
82f:壓縮空氣 82f: compressed air
82t:前端部 82t: Front end
88:混合流體 88: Mixed fluid
90:取出配管 90: Take out the piping
94f:輔助壓縮空氣 94f: auxiliary compressed air
98:加壓用配管 98: Piping for pressurization
98f:加壓用空氣 98f: Air for pressurization
C:箱型外殼 C: Box type enclosure
L:液體 L: Liquid
M:研磨材 M: Abrasive material
S:漿料 S: Slurry
W:被處理體 W: processed body
Claims (10)
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JP3391900B2 (en) * | 1994-06-24 | 2003-03-31 | 株式会社アルプスエンジニアリング | Abrasive material supply device |
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