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PH12017500284A1 - Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating - Google Patents

Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating

Info

Publication number
PH12017500284A1
PH12017500284A1 PH12017500284A PH12017500284A PH12017500284A1 PH 12017500284 A1 PH12017500284 A1 PH 12017500284A1 PH 12017500284 A PH12017500284 A PH 12017500284A PH 12017500284 A PH12017500284 A PH 12017500284A PH 12017500284 A1 PH12017500284 A1 PH 12017500284A1
Authority
PH
Philippines
Prior art keywords
protective coating
protective
coating
forming sheet
semiconductor chip
Prior art date
Application number
PH12017500284A
Other versions
PH12017500284B1 (en
Inventor
Daisuke Yamamoto
Naoya Saiki
Hiroyuki Yoneyama
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of PH12017500284A1 publication Critical patent/PH12017500284A1/en
Publication of PH12017500284B1 publication Critical patent/PH12017500284B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Laser Beam Processing (AREA)
  • Laminated Bodies (AREA)
  • Formation Of Insulating Films (AREA)
  • Adhesive Tapes (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

A protective-coating-forming sheet (3) provided with a first support sheet (4) and a protective-coating formation film (1) layered on a first surface side of the first support sheet (4), the protective-coating formation film (1) comprising a curable material, and the protective-coating formation film (1) having the following characteristics: when the protective-coating formation film (1) is cured and a protective coating is obtained, the breaking strain of the protective coating at 50oC is 20 pcnt or less, and the breaking stress thereof at 50oC is 2.0x107 Pa or less.
PH12017500284A 2014-08-22 2017-02-16 Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating PH12017500284B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014169266 2014-08-22
JP2014169267 2014-08-22
PCT/JP2015/073545 WO2016027888A1 (en) 2014-08-22 2015-08-21 Protective-coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating

Publications (2)

Publication Number Publication Date
PH12017500284A1 true PH12017500284A1 (en) 2017-07-03
PH12017500284B1 PH12017500284B1 (en) 2017-07-03

Family

ID=55350823

Family Applications (2)

Application Number Title Priority Date Filing Date
PH12017500284A PH12017500284B1 (en) 2014-08-22 2017-02-16 Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating
PH12017500285A PH12017500285A1 (en) 2014-08-22 2017-02-16 Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating

Family Applications After (1)

Application Number Title Priority Date Filing Date
PH12017500285A PH12017500285A1 (en) 2014-08-22 2017-02-16 Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating

Country Status (8)

Country Link
JP (2) JPWO2016027888A1 (en)
KR (2) KR102368140B1 (en)
CN (2) CN106660332B (en)
MY (2) MY186759A (en)
PH (2) PH12017500284B1 (en)
SG (2) SG11201701270QA (en)
TW (4) TWI672354B (en)
WO (2) WO2016027883A1 (en)

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WO2017073627A1 (en) * 2015-10-29 2017-05-04 リンテック株式会社 Film for protective film formation and composite sheet for protective film formation
CN108778721B (en) * 2016-03-04 2021-06-04 琳得科株式会社 Composite sheet for forming protective film
JP6573841B2 (en) * 2016-03-04 2019-09-11 リンテック株式会社 Semiconductor processing sheet
JP7008620B2 (en) * 2016-03-04 2022-01-25 リンテック株式会社 Sheet for semiconductor processing
JP7042211B2 (en) * 2016-03-04 2022-03-25 リンテック株式会社 Sheet for semiconductor processing
JP6617056B2 (en) * 2016-03-04 2019-12-04 リンテック株式会社 Semiconductor processing sheet, winding body thereof, and method for manufacturing the winding body
KR102574633B1 (en) * 2016-03-04 2023-09-04 린텍 가부시키가이샤 Composite sheet for forming protective film
TWI721158B (en) * 2016-04-28 2021-03-11 日商琳得科股份有限公司 Protective film forming film and composite sheet for forming protective film
TWI778960B (en) * 2016-04-28 2022-10-01 日商琳得科股份有限公司 Film for forming protective film, composite sheet for forming protective film, and method of manufacturing semiconductor chip having protective film
TWI796297B (en) * 2016-04-28 2023-03-21 日商琳得科股份有限公司 Composite sheet for forming protective film
TWI731964B (en) * 2016-04-28 2021-07-01 日商琳得科股份有限公司 Complex sheet for forming protective film
JP6971977B2 (en) * 2016-04-28 2021-11-24 リンテック株式会社 A film for forming a protective film, a composite sheet for forming a protective film, a method for manufacturing a semiconductor chip with a protective film, and a method for packing the semiconductor chip with a protective film.
JP6278164B1 (en) * 2016-05-12 2018-02-14 住友ベークライト株式会社 Adhesive tape for semiconductor substrate processing
JP6776081B2 (en) * 2016-09-28 2020-10-28 リンテック株式会社 Manufacturing method of semiconductor chip with protective film and manufacturing method of semiconductor device
CN110622302B (en) * 2017-05-17 2022-11-22 琳得科株式会社 Semiconductor device and method for manufacturing the same
JP7107946B2 (en) * 2017-08-28 2022-07-27 リンテック株式会社 infrared sensor module
JP7402052B2 (en) * 2018-01-24 2023-12-20 リンテック株式会社 Long laminated sheets and their rolls
KR102487552B1 (en) 2018-02-05 2023-01-11 삼성전자주식회사 Composition for protective film against sawing process and method of manufacturing semiconductor package using the composition
JP7282076B2 (en) * 2018-03-23 2023-05-26 リンテック株式会社 Film adhesives and sheets for semiconductor processing
KR102467148B1 (en) * 2018-03-30 2022-11-14 린텍 가부시키가이샤 Composite sheet for forming support sheet and protective film
KR102524205B1 (en) * 2018-03-30 2023-04-20 린텍 가부시키가이샤 Composite sheet for forming protective film and manufacturing method thereof
KR20210129028A (en) 2019-02-26 2021-10-27 린텍 가부시키가이샤 A sheet for forming a thermosetting resin film and a first protective film
CN113692352A (en) * 2019-04-26 2021-11-23 琳得科株式会社 Method for producing third laminate, method for producing fourth laminate, method for producing semiconductor device with back surface protective film, and third laminate
JP7453879B2 (en) 2020-08-12 2024-03-21 リンテック株式会社 Protective film forming sheet roll and protective film forming sheet roll manufacturing method
JP7484557B2 (en) 2020-08-18 2024-05-16 三菱ケミカル株式会社 Adhesive composition, adhesive sheet and laminate
JP7084972B2 (en) * 2020-10-06 2022-06-15 リンテック株式会社 Composite sheet for forming a protective film

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AU2003211763A1 (en) 2002-03-12 2003-09-22 Hamamatsu Photonics K.K. Method for dicing substrate
JP3857953B2 (en) * 2002-05-16 2006-12-13 株式会社巴川製紙所 Adhesive sheet for semiconductor device manufacturing
CN1280883C (en) * 2002-04-03 2006-10-18 株式会社巴川制纸所 Binding sheet for mfg. semiconductor device
JP4364508B2 (en) * 2002-12-27 2009-11-18 リンテック株式会社 Protective film forming sheet for chip back surface and manufacturing method of chip with protective film
KR101215728B1 (en) * 2003-06-06 2012-12-26 히다치 가세고교 가부시끼가이샤 Semiconductor device producing method
EP1650790B1 (en) * 2003-07-08 2010-04-28 LINTEC Corporation Hardenable pressure sensitive adhesive sheet for dicing/die-bonding and method for manufacturing semiconductor device
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JP2011151362A (en) 2009-12-24 2011-08-04 Nitto Denko Corp Dicing tape-integrated film for semiconductor back surface
JP2012033637A (en) 2010-07-29 2012-02-16 Nitto Denko Corp Dicing tape integrated semiconductor rear face film, and method of manufacturing semiconductor device
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Also Published As

Publication number Publication date
TW201614023A (en) 2016-04-16
TWI672354B (en) 2019-09-21
JPWO2016027888A1 (en) 2017-06-01
TW201940622A (en) 2019-10-16
CN106660332B (en) 2020-08-07
CN106660333A (en) 2017-05-10
TW201614024A (en) 2016-04-16
TWI712670B (en) 2020-12-11
KR20170044108A (en) 2017-04-24
TWI706023B (en) 2020-10-01
PH12017500285B1 (en) 2017-06-28
JP6589209B2 (en) 2019-10-16
SG11201701270QA (en) 2017-03-30
TW201938728A (en) 2019-10-01
PH12017500285A1 (en) 2017-06-28
TWI668290B (en) 2019-08-11
WO2016027888A1 (en) 2016-02-25
MY186759A (en) 2021-08-18
CN106660333B (en) 2018-11-06
KR20170044652A (en) 2017-04-25
MY182846A (en) 2021-02-05
KR102368140B1 (en) 2022-02-25
CN106660332A (en) 2017-05-10
PH12017500284B1 (en) 2017-07-03
WO2016027883A1 (en) 2016-02-25
SG11201701272UA (en) 2017-04-27
JPWO2016027883A1 (en) 2017-06-01
KR102376017B1 (en) 2022-03-17

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