KR20230117524A - Electrical inspection equipment and electrical inspection method - Google Patents

Abstract

An object of the present invention is to provide an electric inspection apparatus capable of quickly and easily aligning an electric inspection head with respect to a printed circuit board.
An electric inspection apparatus 1 according to one embodiment of the present invention includes an electric inspection head 10 contactable to a printed circuit board W from the normal direction side, and an electric inspection head 10 connected to the normal line of the printed circuit board W. A rotation mechanism 11 for rotating around a rotational axis R parallel to the direction, and an optical element 22a facing the printed board W from the normal direction to the front, the printed board W is imaged. A possible imaging unit 12 and a moving mechanism 13 for moving the imaging unit 12 between the proximity position P1 and the avoidance position P2 are provided, and the proximity position P1 captures an image when the electrical inspection head 10 rotates. It is a position where the part 12 can come into contact with the electrical inspection head 10, and the avoidance position P2 is such that the imaging unit 12 does not come into contact with the electrical inspection head 10 when the electrical inspection head 10 rotates. It is a location.

Description

Electrical inspection device and electrical inspection method {ELECTRICAL INSPECTION EQUIPMENT AND ELECTRICAL INSPECTION METHOD}

The present invention relates to an electrical inspection device and an electrical inspection method.

An electrical inspection device is used to inspect the electrical characteristics of a printed circuit board. This electric inspection device includes an electric inspection head on which a plurality of probes (electrical contacts) are disposed, and an imaging unit capable of imaging a printed circuit board from a normal direction. This electrical inspection device captures an image of a printed circuit board with an imaging unit, aligns an electrical inspection head with respect to an area to be inspected on the printed board, and then contacts the electrical inspection head to the printed circuit board from a normal direction, so that the electrical inspection of the printed circuit board is performed. Inspection of specific characteristics (see Patent Document 1).

Japanese Unexamined Patent Publication No. 2015-52511

Patent Literature 1, in the fourth embodiment, has a positioning mechanism 57 connected to the base plate 51 of the electric inspection jig 50a, and to this positioning mechanism 57 a camera for image recognition ( 56) is described.

Since the electrical inspection device described in Patent Literature 1 can adjust the position of the camera 56 for image recognition by the positioning mechanism 57, the camera 56 for image recognition is fixed to an accurate position in advance. does not require putting

On the other hand, in such an electric inspection apparatus, when aligning the electric inspection head with the area to be inspected of the printed circuit board, there are cases where the electric inspection head is rotated around an axis parallel to the normal direction of the printed circuit board. However, according to the configuration described in Patent Literature 1, when the electric inspection head is rotated, the camera for image recognition rotates together with the electric inspection head. Therefore, the electric inspection apparatus described in Patent Literature 1 has room for further improvement in that it continuously and quickly performs image pickup by an image recognition camera and alignment of the electric inspection head with respect to the area to be inspected.

The present invention has been made based on these circumstances, and an object of the present invention is to provide an electric inspection apparatus capable of quickly and easily aligning an electric inspection head with respect to a printed circuit board.

An electrical inspection apparatus according to one aspect of the present invention includes an electrical inspection head contactable to a printed circuit board from a normal direction side, a rotation mechanism for rotating the electrical inspection head around a rotational axis parallel to the normal direction, and the above. An imaging unit having an optical element that faces the printed circuit board in a frontal direction from a normal line, and capable of capturing an image of the printed circuit board; and a moving mechanism for moving the imaging unit between a proximity position and an avoidance position, the proximity position comprising: A position where the imaging section can come into contact with the electric inspection head when the electric inspection head rotates, and the avoidance position is a position where the imaging section does not contact the electric inspection head when the electric inspection head rotates.

It is only necessary for the moving mechanism to move the imaging unit independently of the electric inspection head.

The avoidance position may be a position away from the proximity position in the normal direction of the printed circuit board.

When viewed in the normal direction of the printed circuit board, the interval between the imaging unit and the rotating shaft at the proximity position may be the same as the interval between the imaging unit and the rotation shaft at the avoidance position.

The electrical inspection device may further include a positioning mechanism capable of positioning the electrical inspection head in the plane direction of the printed circuit board.

The positioning mechanism may position the electric inspection head and the imaging unit simultaneously in the direction of the plane.

An electrical inspection method according to another aspect of the present invention includes: an electrical inspection head contactable to a printed circuit board from a normal direction side; a rotating mechanism for rotating the electrical inspection head around a rotation axis parallel to the normal direction; Using an electrical inspection apparatus having optical elements frontally opposed to the printed board in a direction normal to the printed circuit board, including an imaging unit capable of capturing an image of the printed circuit board, and a moving mechanism for moving the imaging unit between a proximity position and an avoidance position. , The proximity position is a position at which the imaging unit can come into contact with the electrical inspection head when the electrical inspection head is rotated, and the avoidance position is a position where the imaging unit is in contact with the electrical inspection head when the electrical inspection head is rotated. The imaging unit is moved to a non-contact position.

In an electrical inspection apparatus according to one embodiment of the present invention, in a state in which the image pickup unit is disposed at a proximate position, after the image pickup unit captures an image of the printed circuit board from a normal direction, the image capture unit is captured when the electric inspection head rotates. It can be moved to an avoidance position where it does not contact the electrical inspection head. Therefore, the electrical inspection apparatus can rotate the electrical inspection head independently of the image pickup unit after capturing an image of the printed circuit board with the imaging unit from the vicinity of the electrical inspection head. As a result, the electrical inspection apparatus can quickly and easily align the electrical inspection head with respect to the printed circuit board.

1 is a schematic side view of an electrical inspection apparatus according to an embodiment of the present invention viewed from a direction perpendicular to a normal direction of a printed circuit board.
Fig. 2 is a schematic plan view of the electrical inspection device of Fig. 1;
FIG. 3 is a schematic side view showing a state in which the imaging unit in the electrical inspection device of FIG. 1 has been moved to an avoiding position.
4 is a flowchart illustrating an electrical inspection method using the electrical inspection apparatus of FIG. 1 .
Fig. 5 is a schematic plan view showing a state during rotation of the electric test head in the electric test method of Fig. 4;
FIG. 6 is a schematic side view showing a state in which the imaging unit is moved to a proximal position after rotation of the electric inspection head in the electric inspection method of FIG. 4 .
Fig. 7 is a schematic side view showing a state in which an electric test head in the electric test method of Fig. 4 is brought into contact with a printed circuit board.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described in detail, referring drawings suitably. In addition, about the numerical value described in this specification, it is possible to employ only one of the upper limit value and the lower limit value described, or to combine the upper limit value and the lower limit value arbitrarily.

[Electrical Inspection Device]

The electrical inspection apparatus 1 of FIGS. 1 and 2 includes an electrical inspection head 10 contactable to the printed circuit board W from the normal direction (Z direction in FIG. 1 ), and the electrical inspection head 10 as described above. A rotation mechanism (11) for rotating around a rotational axis (R) parallel to the normal direction, and an optical element (22a) facing the printed board (W) in the normal direction from the front, the printed board (W) An imaging unit 12 capable of capturing an image and a moving mechanism 13 for moving the imaging unit 12 between a proximity position and an avoidance position are provided. Further, the electric inspection apparatus 1 includes a positioning mechanism 14 capable of positioning the electric inspection head 10 in the plane direction of the printed board W (XY plane direction in FIG. 1), and the electric inspection head A lifting mechanism 15 for lifting 10 in the normal direction of the printed circuit board W, a housing 16 connected to the positioning mechanism 14, a rotating mechanism 11, a moving mechanism 13, a positioning mechanism A control unit 17 for controlling the operation of the determining mechanism 14 and the lifting mechanism 15 is provided. In addition, in FIG. 1, the electrical inspection head 10 and the imaging part 12 are arrange|positioned on both sides of the printed board W, respectively. However, in the said electric inspection apparatus 1, one or both of the electric inspection head 10 and the imaging part 12 may be arrange|positioned only on the one side side of the printed circuit board W. 1 shows a configuration in which the electric inspection head 10 and the control unit 17 are provided in a one-to-one correspondence. However, the said electric inspection apparatus 1 may have the control part 17 common to a pair of electric inspection heads 10.

[printed board]

The printed board W is plate-shaped or sheet-shaped. As the printed board W, one in which a circuit pattern is arranged on a thin film substrate can be used. A plurality of inspection target areas exist on the printed board W. The electrical inspection apparatus 1 is configured to perform an electrical inspection for each area to be inspected by bringing the electrical inspection head 10 into contact with each area to be inspected. The electrical inspection apparatus 1 is configured to continuously electrically inspect a plurality of areas to be inspected disposed on the printed board W. In the present invention, there is no clear distinction between "plate-like" and "sheet-like", but "plate-like" refers to those that do not substantially bend due to their own weight, and those that have flexibility and cause bending due to their own weight It can be said to be "sheet-like". In addition, "sheet shape" is a concept including "film shape".

The printed board W has, for example, a rectangular shape in plan view. The printed board W is held horizontally by the gripper 31 in a state where the four corners are gripped. The printed board W is held in the air by being partially gripped by the gripper 31 at its periphery.

On the printed circuit board W, a reference position marker (not shown) to be imaged by the imaging unit 12 is provided. This reference position marker is used to obtain the relative positional relationship between the area to be inspected on the printed circuit board W and the electrical inspection head 10 . The reference position marker may be, for example, the circuit pattern itself or a positioning mark provided separately from the circuit pattern.

(Electrical Inspection Head)

The electric inspection head 10 includes a plurality of probes 21a and a pair of support plates having through holes through which the plurality of probes 21a can pass (a base plate 21b contactable from the normal direction to the printed board W), and It has a top plate 21c disposed facing the bottom plate 21b in a direction away from the printed board W in a normal direction, and a base 21d fixed to the top plate 21c. The plurality of probes 21a are provided so as to be able to contact the circuit pattern of the printed board W.

When viewed in the normal direction of the printed circuit board W (hereinafter also referred to as "planar view"), the electric inspection head 10 has a corner portion. More specifically, the electrical inspection head 10 has a rectangular shape in plan view with four corners. Also, the base 21d has a corner portion in plan view. The planar shape of the base 21d is equivalent to that of the electrical inspection head 10 . As a specific shape of the base 21d, a rectangular parallelepiped whose thickness direction is the normal direction of the printed board W is exemplified. In addition, a "rectangular parallelepiped" is not limited to a perfect rectangular parallelepiped, and includes a shape partially having irregularities, a shape with rounded corners, and the like.

The thickness T1 of the base 21d can be set within a range that can appropriately hold the plurality of probes 21a while maintaining necessary strength. From this point of view, the lower limit of the thickness T1 of the base 21d is preferably 30 mm, more preferably 40 mm. On the other hand, as an upper limit of the thickness T1 of base 21d, 100 mm is preferable, 80 mm is more preferable, and 60 mm is still more preferable. When the said thickness T1 exceeds the said upper limit, there exists a possibility that it may become difficult to make the moving distance of the imaging part 12 by the moving mechanism 13 sufficiently small.

The thickness T2 (thickness defined by the bottom surface of the base plate 21b and the top surface of the base 21d) of the electric inspection head 10 is maintained by the plurality of probes 21a while maintaining the required strength. ) can be set to a range where electrical inspection can be performed appropriately. As a lower limit of the thickness T2 of the electrical inspection head 10, 50 mm is preferable and 60 mm is more preferable, for example. On the other hand, as an upper limit of thickness T2 of the electrical inspection head 10, 150 mm is preferable, for example, 120 mm is more preferable, and 90 mm is still more preferable.

(Rotating Mechanism)

The rotating mechanism 11 is configured to be able to rotate the electrical inspection head 10 independently of the imaging unit 12 (more specifically, the imaging terminal 22 described later). The rotating mechanism 11 rotates the electric inspection head 10 with the rotating shaft R orthogonal to the electric inspection head 10 as a rotation center. The rotating shaft R is disposed at the center of the electric inspection head 10 when viewed in plan. The specific configuration of the rotating mechanism 11 is not particularly limited, but a configuration in which the electric test head 10 is directly or indirectly rotatably held by a bearing (not shown) arranged in the housing 16 is employed. can be heard

(imaging unit)

The imaging unit 12 has an imaging terminal 22 including the above-described optical element 22a facing the printed board W from the normal direction to the front, and an image processing unit. The imaging terminal 22 is provided so that imaging of digital images is possible. The imaging terminal 22 captures an image of the reference position marker provided on the printed board W from the normal direction. As an optical element 22a, a lens is mentioned, for example. The image processing unit processes a digital image captured by the imaging terminal 22 .

The imaging terminal 22 is provided so that imaging of the reference position marker is possible from the side of the electrical inspection head 10 . With this structure, it is possible to reduce the distance between the imaging terminal 22 and the printed circuit board W during imaging. As a result, the amount of light introduced into the imaging terminal 22 can be increased, and the recognition accuracy of an image captured by the imaging terminal 22 can be increased.

The imaging terminal 22 captures an image of the reference position marker from a position close to the electrical inspection head 10 (proximity position P1). More specifically, the imaging terminal 22 captures an image of the reference position marker from a position where it can come into contact with a corner portion of the electric inspection head 10 when the electric inspection head 10 is rotated. By arranging the imaging terminal 22 close to the electrical inspection head 10 in this way, after capturing the reference position marker, the electrical inspection head 10 is positioned in the area to be inspected on the printed circuit board W. The movement distance of the electric inspection head 10 can be made small. As a result, the error caused by the movement of the electric inspection head 10 can be suppressed while improving the efficiency of the electric inspection process.

The image processing unit may be included in the control unit 17 or provided separately from the control unit 17 . When the image processing unit is included in the control unit 17, a program processed by the control unit 17 may be part of the image processing unit.

(mobile device)

The moving mechanism 13 holds the imaging terminal 22 . As shown in Figs. 1 and 3, the moving mechanism 13 moves the imaging terminal 22 between the proximity position P1 and the avoidance position P2. The proximity position P1 is a position where the imaging unit 12 (more specifically, the imaging terminal 22) can come into contact with the electrical inspection head 10 when the electrical inspection head 10 rotates. In addition, the avoidance position P2 is a position where the imaging unit 12 (more specifically, the imaging terminal 22) does not come into contact with the electrical inspection head 10 when the electrical inspection head 10 rotates.

As described above, the electrical inspection apparatus 1 can achieve efficiency improvement of the electrical inspection process and the like by capturing an image of the reference position marker with the imaging terminal 22 from the proximate position P1. On the other hand, when the imaging terminal 22 is disposed at the proximal position P1, the rotation of the electric inspection head 10 is restricted, so that it may become difficult to align the electric inspection head 10 to the area to be inspected. Therefore, in the said electric inspection apparatus 1, it is comprised so that the imaging terminal 22 can be moved to the avoidance position P2 by the moving mechanism 13.

The moving mechanism 13 preferably moves the imaging unit 12 independently of the electrical inspection head 10 . In other words, the moving mechanism 13 is preferably provided so that the imaging terminal 22 does not follow the electric inspection head 10 and move when the electric inspection head 10 rotates and moves up and down. According to this configuration, the electrical inspection head 10 is aligned with respect to the printed circuit board W while maintaining the focal distance of the optical element 22a with respect to the printed circuit board W, and after this alignment, the electrical inspection head Electrical inspection can be performed by (10). As a result, electrical inspection can be performed more efficiently and stably.

As shown in Fig. 3, the avoidance position P2 is preferably a position away from the proximity position P1 in the normal direction of the printed circuit board W. By being configured in this way, the electrical inspection device 1 concerned is capable of maintaining the image pickup terminal 22 even when the imaging terminal 22 is disposed on the side of the electrical inspection head 10 and close to the electrical inspection head 10. It is possible to prevent an increase in the moving distance of As a result, the error due to the movement of the electrical inspection head 10 can be more easily suppressed while promoting the efficiency of the electrical inspection process.

When viewed in the normal direction of the printed circuit board W, the distance between the imaging unit 12 (more specifically, the imaging terminal 22) and the rotating shaft R at the proximate position P1 is the image pickup at the avoidance position P2 It is preferable that the distance between the part 12 (more specifically, the imaging terminal 22) and the rotational shaft R is the same. With this configuration, the moving distance of the imaging terminal 22 can be easily reduced.

It is preferable that the moving mechanism 13 is provided so as to linearly move the imaging terminal 22 . According to this structure, the moving distance of the imaging terminal 22 can be made smaller more easily.

As the moving distance of the imaging unit 12 between the proximity position P1 and the avoidance position P2, the thickness T2 or less of the electric inspection head 10 is preferable, and the thickness T1 or less of the base 21d is more preferable. The electrical inspection apparatus 1 is configured so that the reference position marker is imaged by the imaging terminal 22 from the side of the base 21d, for example, so that the moving distance of the imaging section 12 of the base 21d It can be controlled to the thickness T1 or less. According to this configuration, the moving distance of the imaging terminal 22 can be easily reduced while maintaining the focal distance of the optical element 22a with respect to the printed circuit board W in the proximity position P1 appropriately.

The moving mechanism 13 holds the imaging terminal 22 in a state connected to the housing 16 . The moving mechanism 13 is provided so as to be able to slide the imaging terminal 22 relative to the housing 16 in the normal direction of the printed circuit board W. By being configured in this way, the moving mechanism 13 can move the imaging terminal 22 in the normal direction of the printed board W independently of the electric inspection head 10 . As a specific configuration of the moving mechanism 13, for example, a configuration including a rail member disposed on the housing 16 and a movable member disposed slidably on the rail member and capable of fixing the imaging terminal 22 can be cited. there is.

(positioning mechanism)

The positioning mechanism 14 positions the electric inspection head 10 in the direction of the plane of the printed board W while maintaining the orientation of the electric inspection head 10 . The electrical inspection apparatus 1 includes the positioning mechanism 14, so that after the reference position marker is imaged by the imaging unit 12, the electrical inspection head 10 is easily positioned in the area to be inspected. can do.

The specific configuration of the positioning mechanism 14 is not particularly limited as long as the electrical inspection head 10 can be positioned in the plane direction of the printed circuit board W, but is not particularly limited. For example, as shown in FIGS. 1 and 2 An orthogonal coordinate system may be used. The positioning mechanism 14 includes a pair of fixed rails 14a extending in parallel in one direction (Y direction in FIGS. 1 and 2) parallel to the plane direction of the printed board W, and a printed board W It has a movable rail 14b extending parallel to the direction of the plane of the pair and spanning between the pair of fixed rails 14a, and a movable body 14c disposed on the movable rail 14b. The housing 16 is fixed to the moving body 14c.

In the positioning mechanism 14, the movable rail 14b moves along the extension direction of the pair of fixed rails 14a (Y direction in Figs. 1 and 2), and the extension direction of the movable rail 14b ( The movable body 14c is configured to move along the X direction in FIGS. 1 and 2). By being configured in this way, the housing 16 is provided so as to be movable in the plane direction of the printed circuit board W while maintaining its orientation in the plane direction. As a result, the electric inspection head 10 also moves in this plane direction, maintaining the direction in the plane direction of the printed circuit board W together with the housing 16 .

Moreover, the positioning mechanism 14 is provided so that positioning of the electric test head 10 and the imaging part 12 simultaneously in the plane direction of the printed board W is possible. More specifically, the imaging terminal 22 is configured to move along with the housing 16 in the direction of the plane of the printed circuit board W by being connected to the housing 16 via the moving mechanism 13 . As a result, the electrical inspection head 10 and the imaging terminal 22 are configured to be simultaneously positioned in the plane direction of the printed board W by the positioning mechanism 14 through the housing 16 . By being constituted in this way, the electrical inspection device 1 can more easily suppress the error caused by the movement of the electrical inspection head 10 while promoting the efficiency improvement of the electrical inspection process.

(elevating mechanism)

The lifting mechanism 15 is provided so that the fixing member 18 fixed to the base 21d of the electric inspection head 10 can be moved up and down. The lifting mechanism 15 moves the electric inspection head 10 in the normal direction of the printed board W by lifting the fixing member 18 .

The fixing member 18 is slidably disposed relative to the housing 16 . The fixing member 18 is configured to move up and down independently of the housing 16 . By being constituted in this way, the elevating mechanism 15 is provided so as to elevate the electric inspection head 10 independently of the movement of the imaging unit 12 by the moving mechanism 13 .

(housing)

The housing 16 is fixed to the moving body 14c as described above. As a result, the housing 16 is configured to be movable in the plane direction of the printed board W while maintaining its orientation in the plane direction of the printed board W.

(control part)

The control unit 17 includes, for example, a computer having a storage unit such as a CPU (Central Processing Unit) that performs data processing and a semiconductor memory that temporarily or permanently stores various types of information.

An example of a control procedure by the control unit 17 will be described. The control unit 17 first captures an image of the reference position marker on the printed circuit board W from the proximate position P1 using the imaging terminal 22 . Next, the control unit 17 moves the imaging terminal 22 to the avoidance position P2, and in this state rotates the electric inspection head 10 by 90° with the rotating shaft R as the rotation center, and the electric inspection head ( 10) is aligned in the area to be inspected on the printed circuit board (W). Further, the control unit 17 moves the imaging terminal 22 to the proximity position P1 after rotation of the electric test head 10 . Further, the controller 17 brings the electrical inspection head 10 into contact with the printed board W from the normal direction side while holding the image pickup terminal 22 at the proximity position P1, and Conduct an electrical inspection in The control unit 17 separates the electrical inspection head 10 from the printed board W after the electrical inspection by the electrical inspection head 10 is finished. The control unit 17 uses the rotating mechanism 11, the moving mechanism 13, the positioning mechanism ( 14) and the operation of the elevating mechanism 15 are controlled. In the electrical inspection device 1, when the control unit 17 performs the above-described control, the electrical inspection head 10 is positioned quickly and easily with respect to the printed board W while the electrical inspection head 10 Inspection can be done appropriately.

[Electrical inspection method]

Next, with reference to each figure, the electrical inspection method using the electrical inspection apparatus 1 of FIGS. 1 and 2 is demonstrated.

The electrical inspection method includes an electrical inspection head 10 capable of contacting a printed circuit board W from a normal direction side, and rotating the electrical inspection head 10 around a rotation axis R parallel to the normal direction. An imaging unit 12 having a rotation mechanism 11 and an optical element 22a facing the printed circuit board W in the normal direction from the front and capable of capturing an image of the printed circuit board W, and the imaging unit 12 It is performed using the electrical inspection apparatus 1 provided with the moving mechanism 13 which moves between the proximity position P1 and the avoidance position P2. As shown in FIG. 4 , the electrical inspection method involves imaging the printed circuit board W with the imaging unit 12 at the proximity position P1 (S1), moving the imaging unit 12 to the avoidance position P2 ( S2), rotating the electrical inspection head 10 (S3), moving the imaging unit 12 to the proximity position P1 (S4), and bringing the electrical inspection head 10 into contact with the printed circuit board W (S5) . Further, the electrical inspection method includes a procedure of separating the electrical inspection head 10 from the printed board W after S5. In the electrical inspection method, the electrical inspection head 10 is moved to the printed circuit board W by repeating the above-described procedure while changing some of the procedures as necessary for each area to be inspected of the printed circuit board W. Electrical inspection of the printed circuit board W can be appropriately performed while aligning the position quickly and easily.

(S1)

In S1, as shown in FIG. 1, the reference position marker of the printed circuit board W is imaged by the imaging terminal 22 in a state where the imaging terminal 22 is disposed at the proximal position P1.

(S2)

In S2, as shown in FIG. 3, the imaging terminal 22 is moved to the avoidance position P2. In S2, the proximal position P1 is a position where the imaging unit 12 (more specifically, the imaging terminal 22) can come into contact with the electrical inspection head 10 when the electrical inspection head 10 is rotated. Move the imaging unit 12 so that the position P2 is at a position where the imaging unit 12 (more specifically, the imaging terminal 22) does not come into contact with the electrical inspection head 10 when the electrical inspection head 10 is rotated let it

(S3)

In S3, as shown in FIG. 5, in the state where the imaging terminal 22 exists in the avoidance position P2, the electrical inspection head 10 is rotated with rotation axis R as a rotation center. More specifically, in S3, the imaging terminal 22 rotates the electric inspection head 10 to a position where it does not overlap with the electric inspection head 10 when viewed in the normal direction of the printed circuit board W. The angle of rotation of the electrical inspection head 10 is not particularly limited, but is typically 90°.

(S4)

In S4, as shown in FIG. 6, after rotating the electrical inspection head 10 in S3, the imaging terminal 22 is moved to the proximity position P1. More specifically, in S4, the imaging terminal 22 is moved from the avoiding position P2 to the avoiding position P1 through the same route as the one in which the imaging terminal 22 was moved from the proximate position P1 to the avoiding position P2 in S2. Further, in the electrical inspection method, if the electrical inspection head 10 is aligned in the area to be inspected of the printed circuit board W by the positioning mechanism 14 at any timing from the end of S1 to the start of S5, do.

(S5)

In S5, as shown in FIG. 7, the electrical inspection head 10 is brought into contact with the printed circuit board W from the normal direction side, and electrical inspection of the area to be inspected is performed by the plurality of probes 21a.

<Advantages>

In the electrical inspection apparatus 1, in a state where the imaging unit 12 is disposed at the proximal position P1, after imaging the printed circuit board W from the normal direction by the imaging unit 12, the imaging unit 12 When the electric inspection head 10 rotates, it can move to the avoidance position P2 which does not contact the electric inspection head 10. Therefore, the electrical inspection apparatus 1 captures an image of the printed circuit board W with the imaging unit 12 from the vicinity of the electrical inspection head 10, and then moves the electrical inspection head 10 to the imaging unit 12. can be rotated independently of As a result, the electric inspection apparatus 1 can align the electric inspection head 10 with respect to the printed circuit board W quickly and easily. For this reason, the electrical inspection apparatus 1 can quickly and stably perform an electrical inspection of the printed circuit board W.

In the electrical inspection method, in a state in which the imaging unit 12 is disposed at the proximate position P1, the printed circuit board W is imaged from the normal direction by the imaging unit 12, and then the imaging unit 12 is electrically inspected. When the head 10 rotates, it can move to the avoidance position P2 which does not contact the electrical inspection head 10. Therefore, in the electrical inspection method, the printed circuit board W is imaged by the imaging unit 12 from the vicinity of the electrical inspection head 10, and then the electrical inspection head 10 is independently operated from the imaging unit 12. can be rotated As a result, in the electrical inspection method, the electrical inspection head 10 can be positioned quickly and easily with respect to the printed circuit board W. For this reason, the said electrical inspection method can perform electrical inspection of the printed circuit board W rapidly and stably.

[Other embodiments]

The above embodiment does not limit the configuration of the present invention. Therefore, in the above embodiment, omission, substitution or addition of components of each part of the above embodiment is possible based on the description and common knowledge of the present specification, and they should all be interpreted as belonging to the scope of the present invention.

In the above embodiment, the configuration in which the moving mechanism moves the imaging unit in the normal direction of the printed board has been described. However, in the electric inspection apparatus, the moving direction of the imaging unit is not limited to the normal direction of the printed circuit board. For example, the moving mechanism may move the imaging unit in a plane direction of the printed board. Further, the moving mechanism does not have to linearly move the imaging unit. For example, the moving mechanism may pivot and move the imaging unit in the plane direction of the printed circuit board.

In the above embodiment, the configuration in which the printed circuit board is held in the horizontal direction has been described. However, the holding direction of the printed circuit board can be changed according to the specifications of the device. Further, in the above embodiment, the configuration of gripping the corner portion of the printed circuit board with the gripping tool has been described, but the method of holding the printed circuit board in the electric inspection apparatus is not limited to the above configuration.

A specific configuration of the electrical inspection head is not limited to that of the above-described embodiment. For example, it is also possible for the electrical inspection head to adopt a structure not having the aforementioned supporting plate. As a structure not having the said support plate, the structure which does not have one or both of the said bottom plate and the said top plate is mentioned. For example, when the electric inspection head does not have the base plate, the thickness of the electric inspection head can be obtained from the total thickness of the base and the probe. In addition, the thickness of a probe here means the protruding length of a probe in the state before an electric test.

As described above, it is preferable that the moving mechanism can move the imaging unit independently of the electric inspection head. However, in the electrical inspection device, if the imaging unit can be held so as not to rotate in accordance with the rotation of the electrical inspection head, a configuration in which the imaging unit moves up and down in accordance with the electrical inspection head can be employed.

In the above embodiment, a configuration in which the electrical inspection head and the imaging unit are simultaneously positioned in the plane direction of the printed circuit board by the positioning mechanism has been described. However, it is also possible for the electric inspection apparatus to adopt a structure in which the electric inspection head and the imaging section are separately positioned in the plane direction of the printed circuit board.

In the above embodiment, a configuration in which the electrical inspection head is positioned in the plane direction of the printed circuit board by the positioning mechanism has been described. However, the electrical inspection device may be configured so that the electrical inspection head is positioned in the plane direction of the printed circuit board when the printed circuit board moves in the plane direction.

As described above, the electric inspection apparatus according to one embodiment of the present invention is suitable for quickly and easily positioning the electric inspection head with respect to the printed circuit board.

1: Electrical inspection device
10: electric inspection head
11: rotation mechanism
12: imaging unit
13: moving mechanism
14: positioning mechanism
14a: fixed rail
14b: movable rail
14c: mobile body
15: lifting mechanism
16: housing
17: control unit
18: fixed member
21a: probe
21b: bottom plate
21c: top plate
21d: Expect
22: imaging terminal
22a: optical element
31: gripper
R: axis of rotation
W: printed circuit board
P1: Proximity position
P2: avoidance position
T1: thickness of expectation
T2: thickness of electric inspection head

Claims (7)

an electrical inspection head capable of contacting the printed circuit board from a normal direction side;
a rotating mechanism for rotating the electrical inspection head about a rotational axis parallel to the normal direction;
an imaging unit having an optical element frontally opposed to the printed board in a direction normal to the printed board and capable of capturing an image of the printed board;
A moving mechanism for moving the imaging unit between a proximity position and an avoidance position
to provide,
The proximate position is a position where the imaging unit can come into contact with the electric inspection head when the electric inspection head rotates;
The avoidance position is a position in which the imaging section does not come into contact with the electric inspection head when the electric inspection head rotates.
electrical inspection device. According to claim 1,
The electric inspection apparatus, wherein the moving mechanism moves the imaging unit independently of the electric inspection head. According to claim 1 or 2,
The electrical inspection apparatus according to claim 1 , wherein the avoidance position is a position away from the proximity position in a direction normal to the printed circuit board. According to claim 1 or 2,
When viewed in a direction normal to the printed circuit board, an interval between the imaging unit and the rotating shaft at the proximity position is equal to an interval between the imaging unit and the rotation shaft at the avoidance position. According to claim 1 or 2,
The electric inspection apparatus further includes a positioning mechanism capable of positioning the electric inspection head in a planar direction of the printed circuit board. According to claim 5,
The electric inspection apparatus, wherein the positioning mechanism simultaneously positions the electric inspection head and the imaging section in the direction of the plane. an electrical inspection head capable of contacting the printed circuit board from a normal direction side;
a rotating mechanism for rotating the electrical inspection head about a rotational axis parallel to the normal direction;
an imaging unit having an optical element facing the printed board in a normal direction and frontally facing the printed board, and capable of capturing an image of the printed board;
A moving mechanism for moving the imaging unit between a proximity position and an avoidance position
Using an electrical inspection device having a,
The proximity position is a position at which the imaging unit can come into contact with the electric inspection head when the electric inspection head is rotated, and the avoidance position is a position where the imaging unit contacts the electric inspection head when the electric inspection head is rotated. Moving the imaging unit to a position where it does not
electrical inspection method.

Images