TWI544220B - Electrical inspection device - Google Patents
Electrical inspection device Download PDFInfo
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- TWI544220B TWI544220B TW103130457A TW103130457A TWI544220B TW I544220 B TWI544220 B TW I544220B TW 103130457 A TW103130457 A TW 103130457A TW 103130457 A TW103130457 A TW 103130457A TW I544220 B TWI544220 B TW I544220B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2813—Checking the presence, location, orientation or value, e.g. resistance, of components or conductors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N2021/1765—Method using an image detector and processing of image signal
- G01N2021/177—Detector of the video camera type
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Tests Of Electronic Circuits (AREA)
Description
本發明係關於一種藉由使電性接觸件與電路基板之電路圖案所具備之電性接點接觸而電性檢查電路圖案之電性檢查裝置。 The present invention relates to an electrical inspection apparatus for electrically inspecting a circuit pattern by bringing an electrical contact into contact with an electrical contact provided on a circuit pattern of a circuit board.
自先前以來,根據有無電性導通而判定形成於電路基板之電路圖案是否良好,於該情形時,使電性接觸件與設置於電路基板之電路圖案之電性接點接觸而進行電性檢查(例如,參照專利文獻1)。於該基板檢查裝置(電性檢查裝置)中,與檢查治具一體地移動之主相機拍攝設置於搬送平台之平台定位標記及基板定位標記,並且安裝於搬送平台之輔助相機拍攝設置於檢查治具之治具定位標記。而且,根據以此方式拍攝到之標記圖像自動地求出基板與檢查治具之相對位置關係,而進行基板之檢查。 Since the previous time, it is determined whether the circuit pattern formed on the circuit substrate is good according to the presence or absence of electrical conduction. In this case, the electrical contact is brought into contact with the electrical contact of the circuit pattern disposed on the circuit substrate for electrical inspection. (For example, refer to Patent Document 1). In the substrate inspection device (electricity inspection device), the main camera that moves integrally with the inspection jig captures the platform positioning mark and the substrate positioning mark provided on the transfer platform, and the auxiliary camera attached to the transfer platform is imaged and set in the inspection. Fixture positioning mark. Further, the relative positional relationship between the substrate and the inspection jig is automatically determined based on the mark image captured in this manner, and the inspection of the substrate is performed.
[專利文獻1]日本專利特開2000-55971號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2000-55971
然而,先前之電性檢查裝置中存在如下問題:由於分別進行利用主相機及輔助相機進行之基板與檢查治具之位置之確認、及使基板與電性接觸件接觸之處理,故處理時間變長,並且易於在基板與電性接觸件之位置產生誤差。 However, in the prior electrical inspection apparatus, there is a problem in that the processing time is changed by confirming the position of the substrate and the inspection jig by the main camera and the auxiliary camera, and the process of bringing the substrate into contact with the electrical contact. It is long and easy to cause errors in the position of the substrate and the electrical contacts.
本發明係為了應對上述問題而完成者,其目的在於提供一種電 性檢查裝置,該電性檢查裝置係藉由同時進行電路圖案之位置之識別與檢查,而謀求處理時間之縮短化,並且謀求電路圖案與電性接觸件之定位精度之提高。再者,於下述本發明之各構成要件之記載中,為了使本發明容易理解,而將實施形態之對應部位之符號記載於括弧內,但本發明之構成要件不應限定解釋為由實施形態之符號表示之對應部位之構成。 The present invention has been completed in order to cope with the above problems, and an object thereof is to provide an electric power The electrical inspection apparatus is configured to simultaneously recognize and inspect the position of the circuit pattern, thereby shortening the processing time and improving the positioning accuracy of the circuit pattern and the electrical contact. In the following description of the constituent elements of the present invention, in order to facilitate the understanding of the present invention, the symbols of the corresponding portions of the embodiments are described in parentheses, but the constituent elements of the present invention are not limited to being interpreted as being implemented. The symbol of the form indicates the composition of the corresponding part.
為了解決上述問題,本發明之電性檢查裝置之構成上之特徵在於:其係電性檢查將分別具有第1電性接點群(11c)之複數個第1電路圖案(11b)以固定之間距配置於一直線上而成之電路基板(11)中的複數個第1電路圖案者;且包括:電性檢查治具(20a、30a、40a、50a),其具有與屬於複數個第1電路圖案中之N個第1電路圖案之N組第1電性接點群同時接觸的N組第1電性接觸件群(25),N組第1電性接觸件群以移動至下一個第1電路圖案之位置之方式相對於電路基板依次直線性地移動,並且每當進行上述移動後,使N組第1電性接觸件群與N組第1電性接點群接觸而依次檢查複數個第1電路圖案;及圖像識別用相機(26、36、46、56),其設置於電性檢查治具且與電性檢查治具一併移動,從而依次識別上述所要檢查之複數個第1電路圖案之位置;將電性檢查治具依次移動之各移動距離設為複數個第1電路圖案之間距(P)之N倍,且於電性檢查治具一面移動一面檢查第1電路圖案時,圖像識別用相機係於利用電性檢查治具檢查第1電路圖案之過程中,識別藉由電性檢查治具於之後檢查之第1電路圖案。 In order to solve the above problems, the electrical inspection apparatus according to the present invention is characterized in that the electrical continuity inspection has a plurality of first circuit patterns (11b) each having a first electrical contact group (11c) fixed thereto. a plurality of first circuit patterns arranged in a circuit board (11) having a pitch; and an electrical inspection jig (20a, 30a, 40a, 50a) having a plurality of first circuits N sets of first electrical contact groups (25) in which N sets of first electrical contact groups of the N first circuit patterns in the pattern are simultaneously contacted, and N sets of first electrical contact groups move to the next The manner of the position of the circuit pattern is linearly moved in order with respect to the circuit board, and each time the movement is performed, the N sets of the first electrical contact groups are brought into contact with the N sets of the first electrical contact groups to sequentially check the plural a first circuit pattern; and an image recognition camera (26, 36, 46, 56) disposed on the electrical inspection jig and moving together with the electrical inspection jig to sequentially identify the plurality of the plurality of inspections to be inspected Position of the first circuit pattern; each moving distance in which the electrical inspection jig is sequentially moved is set to plural When the first circuit pattern is inspected while the electrical inspection jig is moving, the image recognition camera checks the first circuit pattern by the electrical inspection jig. In the process, the first circuit pattern that is inspected later by the electrical inspection fixture is identified.
於該情形時,上述值N為1或2以上之整數值。具體而言,例如,若值N為「1」,則第1電性接觸件群分別與屬於1個第1電路圖案之第1電性接點群對應。又,若值N為「2」,則第1電性接觸件群分別與屬於2個第1電路圖案之第1電性接點群對應。而且,使電性檢查治具相對於電路基板依次移動之移動距離係若值N為「1」,則與複數個第1 電路圖案之間距相同,若值N為「2」,則成為複數個第1電路圖案之間距之2倍。 In this case, the above value N is an integer value of 1 or more. Specifically, for example, when the value N is "1", the first electrical contact group corresponds to the first electrical contact group belonging to one first circuit pattern. Further, when the value N is "2", the first electrical contact group corresponds to the first electrical contact group belonging to the two first circuit patterns. Further, when the electric inspection jig is sequentially moved relative to the circuit board, the moving distance is "1", and the plurality of first The circuit patterns have the same distance between each other. If the value N is "2", the distance between the plurality of first circuit patterns is twice.
又,藉由電性檢查治具於之後檢查之第1電路圖案例如為藉由下一次移動而檢查之第1電路圖案。再者,之後檢查之電路圖案即便並非藉由下一次移動而檢查之第1電路圖案,亦可為藉由下下次、或再下一次之移動而檢查之第1電路圖案。 Moreover, the first circuit pattern which is inspected later by the electrical inspection jig is, for example, the first circuit pattern inspected by the next movement. Further, the circuit pattern to be inspected may be the first circuit pattern inspected by the next next or next movement even if it is not the first circuit pattern inspected by the next movement.
於以此方式構成之本發明中,由於電性檢查治具係以第1電路圖案之間距之N倍為單位移動,故於利用電性檢查治具進行之第1電路圖案之檢查結束而電性檢查治具進行下一次移動後,第1電性接觸件群及圖像識別用相機分別與特定之第1電路圖案對向。因此,若使圖像識別用相機位於電性檢查治具相對於電路基板移動時之移動方向之前方側,使第1電性接觸件群位於後方側,則可一面依次確認第1電路圖案之位置一面依次檢查第1電路圖案。又,圖像識別用相機於藉由第1電性接觸件群向第1電性接點群之接觸而檢查電路圖案時,識別藉由第1電性接觸件群於之後檢查之第1電路圖案。因此,同時進行利用圖像識別用相機進行之第1電路圖案之位置之確認、及利用第1電性接觸件群進行之第1電路圖案之檢查,從而謀求處理時間之縮短化。 In the present invention configured as described above, since the electrical inspection jig moves in units of N times the distance between the first circuit patterns, the inspection of the first circuit pattern by the electrical inspection jig is completed and the electric power is checked. After the next movement of the inspection jig, the first electrical contact group and the image recognition camera respectively oppose the specific first circuit pattern. Therefore, when the image recognition camera is positioned on the front side in the moving direction when the electrical inspection jig moves relative to the circuit board, and the first electrical contact group is positioned on the rear side, the first circuit pattern can be sequentially confirmed. The first circuit pattern is inspected one by one in the position side. Further, when the image recognition camera inspects the circuit pattern by the contact of the first electrical contact group with the first electrical contact group, the first circuit that is inspected by the first electrical contact group is identified. pattern. Therefore, the position of the first circuit pattern by the image recognition camera and the inspection of the first circuit pattern by the first electrical contact group are simultaneously performed, and the processing time is shortened.
又,由於將電性檢查治具相對於電路基板移動之距離設定為第1電路圖案之間距之N倍(整數倍),故可於圖像識別用相機識別出特定之第1電路圖案後,在檢查該第1電路圖案之前使電性檢查治具移動之距離為最小。又,藉此,第1電路圖案與第1電性接觸件群之定位之精度亦提高。 Moreover, since the distance by which the electrical inspection jig is moved with respect to the circuit board is set to N times (integer multiple) of the distance between the first circuit patterns, after the image recognition camera recognizes the specific first circuit pattern, The distance by which the electrical inspection jig is moved is minimized before the inspection of the first circuit pattern. Moreover, the accuracy of positioning of the first circuit pattern and the first electrical contact group is also improved.
又,於本發明中,如上所述,若值N為「1」,則1組電性接觸件群與1個第1電路圖案之第1電性接點群接觸,從而一面逐一檢查第1電路圖案,一面圖像識別用相機逐一識別第1電路圖案之位置。又,若值N為「2」,則2組第1電性接觸件群與2個第1電路圖案之第1電性接 點群同時接觸,從而可同時以2個為單位檢查第1電路圖案。而且,於該情形時,若將圖像識別用相機設置於1組第1電性接觸件群之附近,則圖像識別用相機識別每隔1個之第1電路圖案之位置。 Further, in the present invention, as described above, when the value N is "1", the one set of the electrical contact groups is in contact with the first electrical contact group of the one first circuit pattern, and the first one is inspected one by one. The circuit pattern recognizes the position of the first circuit pattern one by one with the camera for image recognition. Further, when the value N is "2", the first electrical contact group of the two sets and the first electrical connection of the two first circuit patterns are connected. The point groups are simultaneously contacted, so that the first circuit pattern can be inspected simultaneously in units of two. Further, in this case, when the image recognition camera is disposed in the vicinity of one set of the first electrical contact groups, the image recognition camera recognizes the position of every other first circuit pattern.
再者,於本發明中,於使電性檢查治具開始移動前之最初之處理中,僅進行利用圖像識別用相機進行之第1電路圖案之位置之識別,於使電性檢查治具結束移動之最後之處理中,僅進行利用第1電性接觸件群進行之第1電路圖案之檢查。而且,所謂本發明之「於電性檢查治具一面移動一面檢查第1電路圖案時,圖像識別用相機係於利用電性檢查治具檢查第1電路圖案之過程中,識別藉由電性檢查治具於之後檢查之第1電路圖案」,意指同時進行上述最初之處理與最後之處理期間之利用電性檢查治具進行之第1電路圖案之檢查、與利用圖像識別用相機進行之第1電路圖案之識別。 Further, in the present invention, in the first process before the electrical inspection jig starts moving, only the position of the first circuit pattern by the image recognition camera is recognized, and the electrical inspection jig is made. In the last process of ending the movement, only the inspection of the first circuit pattern by the first electrical contact group is performed. Further, in the present invention, when the first circuit pattern is inspected while the electrical inspection jig moves, the image recognition camera is in the process of inspecting the first circuit pattern by the electrical inspection jig, and is identified by electrical properties. The first circuit pattern that is inspected after the jig is inspected means that the first circuit pattern is inspected by the electrical inspection jig during the initial processing and the last processing, and the image recognition camera is used. Identification of the first circuit pattern.
又,本發明之電性檢查裝置之另一構成上之特徵在於:第1電性接觸件群處於第1電性接點群之位置時之第1電性接觸件群之中心位置(O1、O2、O1'、O2')、與識別第1電路圖案時之圖像識別用相機之中心位置(O、O')之沿上述電性檢查治具之移動方向的距離係上述複數個第1電路圖案之間距(P)之整數倍。 Further, another aspect of the electrical inspection device according to the present invention is characterized in that the first electrical contact group is located at the center of the first electrical contact group at the position of the first electrical contact group (O1) The distance between O2, O1', O2') and the center position (O, O') of the image recognition camera when the first circuit pattern is recognized along the moving direction of the electrical inspection jig is the plurality of first An integer multiple of the distance between circuit patterns (P).
該情形時之圖像識別用相機之位置係無需特別使第1電路圖案之固定點位於圖像識別用相機拍攝之圖像之中心,只要圖像識別用相機處於可識別第1電路圖案之位置即可。因此,圖像識別用相機之設置位置成為具有略微之寬度之範圍。即,即便第1電路圖案之固定點位於自圖像識別用相機拍攝之圖像之中心偏移之位置,只要於拍攝到各第1電路圖案時該固定點處於所拍攝到之圖像中之相同位置即可。 In this case, the position of the image recognition camera does not need to be particularly such that the fixed point of the first circuit pattern is located at the center of the image captured by the image recognition camera, as long as the image recognition camera is at the position where the first circuit pattern can be recognized. Just fine. Therefore, the position at which the image recognition camera is set becomes a range having a slight width. In other words, even if the fixed point of the first circuit pattern is located at a position offset from the center of the image captured by the image recognition camera, the fixed point is in the captured image when the first circuit pattern is captured. The same position can be.
因此,圖像識別用相機可於能夠拍攝上述固定點之範圍設定設置位置。又,圖像識別用相機既可設置於靠近電路基板之位置,亦可設置於遠離電路基板之位置。根據本發明,可使圖像識別用相機之設 置位置具有某種程度之自由度,並且使圖像識別用相機之設置位置與複數個電性接觸件之設置位置之間隔調合為第1電路圖案之間距之整數倍。 Therefore, the image recognition camera can set the set position in a range in which the fixed point can be captured. Further, the image recognition camera may be provided at a position close to the circuit board or at a position away from the circuit board. According to the present invention, a camera for image recognition can be provided The position has a certain degree of freedom, and the interval between the set position of the image recognition camera and the set position of the plurality of electrical contacts is adjusted to be an integral multiple of the distance between the first circuit patterns.
又,本發明之電性檢查裝置之又一構成上之特徵在於:於第1電路圖案中設置基準標記(11d),圖像識別用相機藉由拍攝包含基準標記之位置識別區域(26c、26c'),而識別第1電路圖案之位置。根據本發明,可使圖像識別用相機拍攝之包含基準標記之位置識別區域為相對於第1電路圖案之面積較窄之區域,故可進而使圖像識別用相機之設置位置具有自由度,並且使圖像識別用相機之設置位置與電性接觸件群之設置位置之間隔調合為第1電路圖案之間距之整數倍。 Further, another aspect of the electrical inspection apparatus according to the present invention is characterized in that a reference mark (11d) is provided in the first circuit pattern, and the image recognition camera captures the position identification area (26c, 26c) including the reference mark. '), and the position of the first circuit pattern is identified. According to the present invention, the position recognition area including the reference mark captured by the image recognition camera can be a region having a narrow area with respect to the first circuit pattern, so that the position of the image recognition camera can be further provided with a degree of freedom. Further, the interval between the set position of the image recognition camera and the set position of the electrical contact group is adjusted to be an integral multiple of the distance between the first circuit patterns.
又,本發明之電性檢查裝置之另一構成上之特徵在於:電路基板以固定之間距於一直線上配置有複數個第2電路圖案(11b),該複數個第2電路圖案(11b)係與配置於一直線上之複數個第1電路圖案平行,進而分別具有第2電性接點群(11c),電性檢查治具進而具有與屬於複數個第2電路圖案中之N個第2電路圖案之N組第2電性接點群同時接觸的N組第2電性接觸件群(25),每當進行相對於電路基板之移動後,使N組第2電性接觸件群與N組第2電性接點群接觸,而與複數個第1電路圖案同時地依次檢查複數個第2電路圖案。藉此,同時檢查配置成複數行之第1及第2電路圖案,從而電路基板之檢查效率提高。 Further, another aspect of the electrical inspection device according to the present invention is characterized in that a plurality of second circuit patterns (11b) are arranged on the circuit board with a fixed distance therebetween, and the plurality of second circuit patterns (11b) are The second electrical contact group (11c) is further provided in parallel with the plurality of first circuit patterns arranged on the straight line, and the electrical inspection jig further has N second circuits belonging to the plurality of second circuit patterns. The N sets of the second electrical contact groups (25) in which the N sets of the second electrical contact groups of the pattern are simultaneously contacted, and the N sets of the second electrical contact groups and the N are made each time the movement with respect to the circuit substrate is performed. The second electrical contact group is in contact with each other, and a plurality of second circuit patterns are sequentially inspected simultaneously with the plurality of first circuit patterns. Thereby, the first and second circuit patterns arranged in a plurality of rows are inspected at the same time, and the inspection efficiency of the circuit board is improved.
又,於該情形時,雖同時檢查配置成複數行之第1及第2電路圖案,但電性檢查治具相對於電路基板移動之間距係由在電性檢查治具之移動方向上相連之第1電性接觸件群之數量決定,故即便於與電性檢查治具之移動方向正交之方向上配置有第2電性接觸件群,亦不會對電性檢查治具之移動之間距造成影響。進而,第2電性接觸件群與圖像識別用相機之間隔可根據電性檢查治具之構造設定,但較佳為設定為與複數個第2電路圖案之間距相同之距離。 Further, in this case, the first and second circuit patterns arranged in a plurality of rows are simultaneously inspected, but the distance between the electrical inspection jigs and the movement of the circuit substrate is connected by the moving direction of the electrical inspection jig. Since the number of the first electrical contact groups is determined, even if the second electrical contact group is disposed in a direction orthogonal to the moving direction of the electrical inspection jig, the movement of the electrical inspection jig is not performed. The spacing is affected. Further, the interval between the second electrical contact group and the image recognition camera may be set according to the structure of the electrical inspection jig, but is preferably set to be the same distance from the plurality of second circuit patterns.
又,本發明之電性檢查裝置之又一構成上之特徵在於:圖像識別用相機(26)係以可與電路基板對向之方式,與第1電性接觸件群並列地設置於電性檢查治具(20a)內。根據本發明,可使圖像識別用相機與第1電性接觸件群相對於電路基板之距離大致相同,故使圖像識別用相機與第1電性接觸件群之間隔準確地調合為所設定之長度變得容易。又,圖像識別用相機相對於電路基板之位置變近,故利用圖像識別用相機進行之電路圖案之識別變得準確。 Further, another aspect of the electrical inspection apparatus according to the present invention is characterized in that the image recognition camera (26) is provided in parallel with the first electrical contact group so as to be opposite to the circuit substrate. Sex check fixture (20a). According to the present invention, since the distance between the image recognition camera and the first electrical contact group is substantially the same with respect to the circuit board, the interval between the image recognition camera and the first electrical contact group is accurately adjusted. The length of the setting becomes easy. Further, since the position of the image recognition camera is close to the position of the circuit board, the recognition of the circuit pattern by the image recognition camera becomes accurate.
又,本發明之電性檢查裝置之又一構成上之特徵在於:於電性檢查治具(30a)中之與電路基板對向之部分設置透孔(32a、33a),圖像識別用相機(36)係設置於電性檢查治具中之透孔之相反側。於該情形時,圖像識別用相機既可設置於與電性檢查治具中之透孔為相反側之外部,亦可一部分向外部突出。根據本發明,即便於在電性檢查治具之內部或側部無供設置圖像識別用相機之空間之情形時,亦可設置圖像識別用相機。又,僅於電性檢查治具中之第1電性接觸件群所處之部分之附近設置透孔即可,故亦可使電性檢查治具之構造簡單。 Further, another aspect of the electrical inspection device according to the present invention is characterized in that a through hole (32a, 33a) is provided in a portion of the electrical inspection jig (30a) opposed to the circuit substrate, and the image recognition camera is provided. (36) is disposed on the opposite side of the through hole in the electrical inspection jig. In this case, the image recognition camera may be disposed outside the through hole in the electrical inspection jig, or may partially protrude to the outside. According to the present invention, even when there is no space for providing an image recognition camera inside or on the side of the electrical inspection jig, an image recognition camera can be provided. Further, it is only necessary to provide a through hole in the vicinity of the portion where the first electrical contact group is located in the electrical inspection jig, so that the structure of the electrical inspection jig can be made simple.
又,本發明之電性檢查裝置之又一構成上之特徵在於:圖像識別用相機(46)係設置於電性檢查治具(40a)之側方。根據本發明,無需用以於電性檢查治具設置圖像識別用相機之空間,故可實現電性檢查治具之小型化或構造之簡單化。 Further, another aspect of the electrical inspection apparatus of the present invention is characterized in that the image recognition camera (46) is provided on the side of the electrical inspection jig (40a). According to the present invention, it is not necessary to provide a space for the image recognition camera in the electrical inspection jig, so that the electrical inspection jig can be miniaturized or the structure can be simplified.
又,本發明之電性檢查裝置之又一構成上之特徵在於:圖像識別用相機(56)係經由定位機構(57)而設置於電性檢查治具(50a)之側方。根據本發明,可藉由定位機構進行圖像識別用相機之位置調節,故即便圖像識別用相機之設置未成為準確之設置位置亦可,從而圖像識別用相機之設置變得容易。又,於本發明中,亦無需用以於電性檢查治具設置圖像識別用相機之空間,故可實現電性檢查治具之小型化或構造之簡單化。 Further, another aspect of the electrical inspection apparatus of the present invention is characterized in that the image recognition camera (56) is provided on the side of the electrical inspection jig (50a) via the positioning mechanism (57). According to the present invention, since the position adjustment of the image recognition camera can be performed by the positioning means, even if the setting of the image recognition camera does not become an accurate installation position, the image recognition camera can be easily installed. Further, in the present invention, since it is not necessary to provide a space for the image recognition camera in the electrical inspection jig, it is possible to reduce the size and structure of the electrical inspection jig.
10‧‧‧電性檢查裝置 10‧‧‧Electrical inspection device
11‧‧‧電路基板 11‧‧‧ circuit board
11a‧‧‧基板 11a‧‧‧Substrate
11b‧‧‧電路圖案 11b‧‧‧ circuit pattern
11c‧‧‧電性接點 11c‧‧‧Electrical contacts
11d‧‧‧基準標記 11d‧‧‧ benchmark mark
12‧‧‧移動裝置 12‧‧‧Mobile devices
13a‧‧‧X軸軌道 13a‧‧‧X-axis orbit
13b‧‧‧X軸軌道 13b‧‧‧X-axis orbit
14‧‧‧X軸裝設部 14‧‧‧X-axis installation department
14a‧‧‧滑動部 14a‧‧‧Sliding section
14b‧‧‧滑動部 14b‧‧‧Sliding section
14c‧‧‧Y軸軌道 14c‧‧‧Y-axis orbit
14d‧‧‧Y軸軌道 14d‧‧‧Y-axis orbit
15‧‧‧Y軸裝設部 15‧‧‧Y-axis installation department
15a‧‧‧滑動部 15a‧‧‧Sliding section
15b‧‧‧安裝部 15b‧‧‧Installation Department
17‧‧‧支持部 17‧‧‧Support Department
17a‧‧‧側框部 17a‧‧‧ Side frame
17b‧‧‧側框部 17b‧‧‧ Side frame
20‧‧‧可動部 20‧‧‧movable department
20a‧‧‧電性檢查治具 20a‧‧‧Electrical inspection fixture
21‧‧‧基底板 21‧‧‧Base plate
21a‧‧‧貫通孔 21a‧‧‧through holes
22‧‧‧中間板 22‧‧‧Intermediate board
23‧‧‧下部板 23‧‧‧ Lower board
24‧‧‧上部支柱 24‧‧‧Upper pillar
24a‧‧‧下部支柱 24a‧‧‧lower pillar
25‧‧‧電性接觸件 25‧‧‧Electrical contacts
25a‧‧‧線纜 25a‧‧‧ Cable
25A‧‧‧電性接觸件群 25A‧‧‧Electrical contact group
25B‧‧‧電性接觸件群 25B‧‧‧Electrical contact group
25C‧‧‧電性接觸件群 25C‧‧‧Electrical contact group
25D‧‧‧電性接觸件群 25D‧‧‧Electrical contact group
26‧‧‧圖像識別用相機 26‧‧‧Image recognition camera
26a‧‧‧透鏡部 26a‧‧‧Lens Department
26b‧‧‧相機本體 26b‧‧‧ camera body
26c‧‧‧位置識別區域 26c‧‧‧Location identification area
26c'‧‧‧位置識別區域 26c'‧‧‧ Location Identification Area
27‧‧‧電性檢查控制部 27‧‧‧Electrical Inspection Control Department
27a‧‧‧基體 27a‧‧‧ base
27b‧‧‧電性零件 27b‧‧‧Electrical parts
27c‧‧‧連接端子 27c‧‧‧Connecting terminal
28‧‧‧電性檢查處理部 28‧‧‧Electrical Inspection and Processing Department
28a‧‧‧資訊傳達纜線 28a‧‧‧Information Communication Cable
30a‧‧‧電性檢查治具 30a‧‧‧Electrical inspection fixture
31‧‧‧基底板 31‧‧‧Base plate
31a‧‧‧貫通孔 31a‧‧‧through hole
32‧‧‧中間板 32‧‧‧Intermediate board
32a‧‧‧透孔 32a‧‧‧through hole
33‧‧‧下部板 33‧‧‧lower board
33a‧‧‧透孔 33a‧‧‧through hole
36‧‧‧圖像識別用相機 36‧‧‧Image recognition camera
36a‧‧‧透鏡部 36a‧‧‧Lens Department
36b‧‧‧相機本體 36b‧‧‧ camera body
40a‧‧‧電性檢查治具 40a‧‧‧Electrical inspection fixture
41‧‧‧基底板 41‧‧‧Base plate
42‧‧‧中間板 42‧‧‧Intermediate board
43‧‧‧下部板 43‧‧‧lower board
46‧‧‧圖像識別用相機 46‧‧‧Image recognition camera
46a‧‧‧透鏡部 46a‧‧‧Lens Department
46b‧‧‧相機本體 46b‧‧‧ camera body
46c‧‧‧反射鏡 46c‧‧‧Mirror
46d‧‧‧反射鏡 46d‧‧‧Mirror
47‧‧‧連結構件 47‧‧‧Connecting components
50a‧‧‧電性檢查治具 50a‧‧‧Electrical inspection fixture
51‧‧‧基底板 51‧‧‧Base plate
56‧‧‧圖像識別用相機 56‧‧‧Image recognition camera
57‧‧‧定位機構 57‧‧‧ Positioning mechanism
57a‧‧‧X軸移動部 57a‧‧‧X-axis moving part
57b‧‧‧Z軸移動部 57b‧‧‧Z-axis moving part
a‧‧‧距離 A‧‧‧distance
b‧‧‧距離 B‧‧‧distance
c‧‧‧距離 C‧‧‧distance
A‧‧‧位置 A‧‧‧ position
A'‧‧‧位置 A'‧‧‧ position
B‧‧‧位置 B‧‧‧ position
B'‧‧‧位置 B'‧‧‧ position
C‧‧‧位置 C‧‧‧ position
C'‧‧‧位置 C'‧‧‧ position
D‧‧‧位置 D‧‧‧ position
D'‧‧‧位置 D'‧‧‧ position
E‧‧‧位置 E‧‧‧ position
H'‧‧‧位置 H'‧‧‧ position
O‧‧‧中心位置 O‧‧‧ central location
O‧‧‧中心 O‧‧ Center
O'‧‧‧中心位置 O'‧‧‧ central location
O'‧‧‧中心 O'‧‧‧ Center
O1‧‧‧中心位置 O1‧‧‧ central location
O1‧‧‧中心 O1‧‧ Center
O1'‧‧‧中心位置 O1'‧‧‧ central location
O1'‧‧‧中心 O1'‧‧‧ Center
O2‧‧‧中心位置 O2‧‧‧ central location
O2‧‧‧中心 O2‧‧ Center
O2'‧‧‧中心位置 O2'‧‧‧ central location
O2'‧‧‧中心 O2'‧‧‧ Center
P‧‧‧間距 P‧‧‧ spacing
R‧‧‧箭頭 R‧‧‧ arrow
X‧‧‧方向 X‧‧‧ direction
Y‧‧‧方向 Y‧‧‧ direction
Z‧‧‧方向 Z‧‧‧ direction
圖1係表示本發明之第1實施形態之電性檢查裝置之主要部分的概略構成圖。 Fig. 1 is a schematic configuration diagram showing a main part of an electrical inspection device according to a first embodiment of the present invention.
圖2係表示形成有電路圖案之電路基板之立體圖。 2 is a perspective view showing a circuit board on which a circuit pattern is formed.
圖3係表示電路圖案之俯視圖。 Fig. 3 is a plan view showing a circuit pattern.
圖4係表示藉由安裝有圖像識別用相機之電性檢查治具檢查電路基板之狀態之剖面圖。 4 is a cross-sectional view showing a state in which a circuit board is inspected by an electrical inspection jig to which an image recognition camera is attached.
圖5係表示電性接觸件群與圖像識別用相機之位置關係之說明圖。 Fig. 5 is an explanatory view showing a positional relationship between an electrical contact group and an image recognition camera.
圖6係表示圖像識別用相機與電性檢查治具之移動之順序之說明圖。 Fig. 6 is an explanatory view showing a procedure of movement of the image recognition camera and the electrical inspection jig.
圖7係表示第1實施形態之變化例之電性檢查裝置所包括之電性接觸件群與圖像識別用相機之位置關係的說明圖。 FIG. 7 is an explanatory view showing a positional relationship between an electrical contact group and an image recognition camera included in the electrical inspection device according to the modification of the first embodiment.
圖8係表示第1實施形態之變化例之電性檢查裝置所包括之圖像識別用相機與電性檢查治具之移動之順序的說明圖。 FIG. 8 is an explanatory view showing a procedure of movement of an image recognition camera and an electrical inspection jig included in the electrical inspection device according to the modification of the first embodiment.
圖9係表示藉由本發明之第2實施形態之安裝有圖像識別用相機之電性檢查治具檢查電路基板之狀態的剖面圖。 FIG. 9 is a cross-sectional view showing a state in which a circuit board is inspected by an electrical inspection jig to which an image recognition camera is attached according to a second embodiment of the present invention.
圖10係表示藉由本發明之第3實施形態之安裝有圖像識別用相機之電性檢查治具檢查電路基板之狀態的剖面圖。 FIG. 10 is a cross-sectional view showing a state in which a circuit board is inspected by an electrical inspection jig to which an image recognition camera is attached according to a third embodiment of the present invention.
圖11係表示藉由本發明之第4實施形態之安裝有圖像識別用相機之電性檢查治具檢查電路基板之狀態的剖面圖。 FIG. 11 is a cross-sectional view showing a state in which a circuit board is inspected by an electrical inspection jig to which an image recognition camera is attached according to a fourth embodiment of the present invention.
以下,使用圖式對本發明之第1實施形態進行說明。圖1係表示該實施形態之電性檢查裝置10之主要部分之概略構成圖。該電性檢查裝置10係用以檢查設置於作為檢查對象物之電路基板11之電路圖案 11b(圖2參照)之適當的導通及絕緣之裝置。如圖2所示,電路基板11係於薄板狀之基板11a上,在前後及左右以固定間隔將複數個電路圖案11b配置於一直線上而構成,且於各電路圖案11b設置有複數個電性接點11c(參照圖4)及1個基準標記11d(參照圖3)。 Hereinafter, a first embodiment of the present invention will be described using the drawings. Fig. 1 is a schematic configuration diagram showing a main part of an electrical inspection device 10 of the embodiment. The electrical inspection device 10 is for inspecting a circuit pattern provided on a circuit substrate 11 as an inspection object. 11b (refer to Figure 2) for proper conduction and insulation. As shown in FIG. 2, the circuit board 11 is formed on a thin plate-shaped substrate 11a, and a plurality of circuit patterns 11b are arranged on a straight line at regular intervals in front, rear, left and right, and a plurality of electrical properties are provided in each circuit pattern 11b. The contact 11c (see Fig. 4) and one reference mark 11d (see Fig. 3).
電路圖案11b係形成為一邊之長度設定為12mm之正方形,相鄰之2個電路圖案11b之間隙之長度係設定為0.5mm。因此,相鄰之2個電路圖案11b之中心位置間之長度即間距P成為12.5mm。又,複數個電性接點11c係分散地配置於電路圖案11b中之形成有電路之部分,基準標記11d係如圖3所示般設置於電路圖案11b中之未形成電路之部分之一角部附近。 The circuit pattern 11b is formed in a square shape in which the length of one side is set to 12 mm, and the length of the gap between the adjacent two circuit patterns 11b is set to 0.5 mm. Therefore, the length P between the center positions of the adjacent two circuit patterns 11b, that is, the pitch P is 12.5 mm. Further, a plurality of electrical contacts 11c are dispersedly disposed in a portion of the circuit pattern 11b where the circuit is formed, and the reference mark 11d is provided at a corner of the circuit pattern 11b where the circuit is not formed as shown in FIG. nearby.
電性檢查裝置10包括:設置裝置(未圖示),其設置電路基板11;移動裝置12;可動部20,其藉由移動裝置12之驅動而沿著電路基板11之表面移動;及電性檢查處理部28,其經由資訊傳達纜線28a而連接於可動部20。 The electrical inspection device 10 includes: a setting device (not shown) that is provided with a circuit substrate 11; a moving device 12; a movable portion 20 that is moved along the surface of the circuit substrate 11 by the driving of the moving device 12; The inspection processing unit 28 is connected to the movable unit 20 via the information transmission cable 28a.
雖省略圖示,但設置電路基板11之設置裝置包括:一對X軸軌道,其等係保持間隔而平行地配置,且於X軸方向(圖1之左右方向且以箭頭X表示之方向)上延伸;一對Y軸軌道,其等係以可分別移動之狀態架設於一對X軸軌道,且於Y軸方向(圖1之前後方向且箭頭Y表示之方向)上延伸;及一對抓持部(合計4個),其等係可分別移動地安裝於一對Y軸軌道。而且,藉由驅動部之驅動,一對Y軸軌道分別獨立地沿著一對X軸軌道移動,4個抓持部分別獨立地沿著一對Y軸軌道之任一者移動。因此,藉由利用4個抓持部抓持電路基板11之四角,可支持電路基板11。 Although not shown in the drawings, the apparatus for arranging the circuit board 11 includes a pair of X-axis rails which are arranged in parallel at intervals and in the X-axis direction (the direction indicated by the arrow X in the left-right direction of FIG. 1). a pair of Y-axis rails, which are erected on a pair of X-axis rails in a movable state, and extend in the Y-axis direction (the direction before and after the arrow 1 and the direction indicated by the arrow Y); and a pair The gripping portions (four in total) are movably mounted to a pair of Y-axis rails, respectively. Further, by the driving of the driving portion, the pair of Y-axis rails are independently moved along a pair of X-axis rails, and the four gripping portions are independently moved along any one of the pair of Y-axis rails. Therefore, the circuit board 11 can be supported by gripping the four corners of the circuit board 11 by the four grip portions.
移動裝置12包括:一對X軸軌道13a、13b,其等沿著X軸方向平行地配置;X軸裝設部14,其架設於X軸軌道13a、13b,且能夠於X軸方向上移動地安裝;及Y軸裝設部15,其安裝於X軸裝設部14且可於Y 軸方向上移動。X軸裝設部14由以下構成:滑動部14a、14b,其等分別可滑動地卡合於X軸軌道13a、13b;及一對Y軸軌道14c、14d,其等保持間隔而平行地架設於滑動部14a、14b之對向之面;且X軸裝設部14藉由驅動裝置(未圖示)之驅動而沿著X軸軌道13a、13b移動。 The moving device 12 includes a pair of X-axis rails 13a and 13b which are arranged in parallel along the X-axis direction, and an X-axis mounting portion 14 which is mounted on the X-axis rails 13a and 13b and is movable in the X-axis direction. Ground mounting; and Y-axis mounting portion 15, which is mounted to the X-axis mounting portion 14 and is s Move in the direction of the axis. The X-axis mounting portion 14 is configured by sliding portions 14a and 14b slidably engaged with the X-axis rails 13a and 13b, respectively, and a pair of Y-axis rails 14c and 14d which are erected in parallel at intervals. The X-axis mounting portion 14 is moved along the X-axis rails 13a and 13b by driving of a driving device (not shown).
Y軸裝設部15由安裝於Y軸軌道14c、14d且可於Y軸方向上移動之安裝用構件構成,且包含架設於Y軸軌道14c、14d之板狀之滑動部15a、及供安裝可動部20之安裝部15b。Y軸裝設部15藉由驅動裝置(未圖示)之驅動而沿著Y軸軌道14c、14d移動。又,於Y軸裝設部15之安裝部15b設置有Z軸可動部及回旋軸(未圖示),可動部20係經由回旋軸及Z軸可動部而連結於安裝部15b。 The Y-axis mounting portion 15 is composed of a mounting member that is attached to the Y-axis rails 14c and 14d and movable in the Y-axis direction, and includes a plate-shaped sliding portion 15a that is mounted on the Y-axis rails 14c and 14d, and is mounted. The mounting portion 15b of the movable portion 20. The Y-axis mounting portion 15 is moved along the Y-axis rails 14c, 14d by driving of a driving device (not shown). Further, a Z-axis movable portion and a turning shaft (not shown) are provided in the mounting portion 15b of the Y-axis mounting portion 15, and the movable portion 20 is coupled to the mounting portion 15b via the turning shaft and the Z-axis movable portion.
Z軸可動部係藉由驅動裝置(未圖示)之驅動而於Z軸方向(圖1之上下方向且以箭頭Z表示之方向)上移動,回旋軸係藉由驅動裝置(未圖示)之驅動而於水平面上在圍繞軸之方向(圖1之以箭頭R表示之方向)上旋轉。因此,可動部20係藉由各驅動裝置之驅動而於X軸方向、Y軸方向及Z軸方向上移動,並且以回旋軸為中心旋轉。又,於安裝部15b安裝有圖4所示之支持部17,該支持部17可於上下方向上移動。支持部17係支持電性檢查治具20a者,由如下之框體構成:包含以保持間隔之狀態對向地配置之左右對稱之側框部17a、17b、及將該等側框部17a、17b之後端部連結之連結部(未圖示),且前部開放。 The Z-axis movable portion is moved in the Z-axis direction (the direction in the upper-lower direction of FIG. 1 and indicated by the arrow Z) by driving by a driving device (not shown), and the rotating shaft is driven by a driving device (not shown). The drive is rotated on the horizontal plane in the direction around the axis (the direction indicated by the arrow R in Fig. 1). Therefore, the movable portion 20 is moved in the X-axis direction, the Y-axis direction, and the Z-axis direction by the driving of each driving device, and is rotated about the turning axis. Moreover, the support portion 17 shown in FIG. 4 is attached to the attachment portion 15b, and the support portion 17 is movable in the vertical direction. The support unit 17 supports the electrical inspection jig 20a, and is configured by a frame including left and right side frame portions 17a and 17b that are disposed to face each other in a state of maintaining a space, and the side frame portions 17a. The connection portion (not shown) to which the end portion is connected after 17b, and the front portion is open.
可動部20包括電性檢查治具20a、圖像識別用相機26、及電性檢查控制部27。電性檢查治具20a係如圖4所示般,於利用上部支柱24及下部支柱24a組裝基底板21、中間板22及下部板23之3個矩形板而成之組裝體安裝複數個電性接觸件25而構成。再者,於圖1中,雖表示有電性檢查治具20a,但該電性檢查治具20a係模式性地表示者,與圖4所示之電性檢查治具20a略微不同。 The movable unit 20 includes an electrical inspection jig 20a, an image recognition camera 26, and an electrical inspection control unit 27. As shown in FIG. 4, the electrical inspection jig 20a is provided with a plurality of electrical components in an assembly in which three rectangular plates of the base plate 21, the intermediate plate 22, and the lower plate 23 are assembled by the upper pillar 24 and the lower pillar 24a. The contact member 25 is constructed. In addition, although the electrical inspection jig 20a is shown in FIG. 1, this electrical inspection jig 20a is shown in a mode, and is slightly different from the electrical inspection jig 20a shown in FIG.
基底板21係形成為於中央部穿設有大致矩形之貫通孔21a之框 狀,且固定於支持部17之側框部17a、17b。中間板22係形成為較基底板21薄且小之板,經由4根上部支柱24而於基板21之下表面固定於4角。下部板23係形成為較中間板22小之板,經由4根下部支柱24a而於中間板22之下表面固定於4角。 The base plate 21 is formed as a frame in which a substantially rectangular through hole 21a is bored in the center portion. The shape is fixed to the side frame portions 17a and 17b of the support portion 17. The intermediate plate 22 is formed as a thinner and smaller plate than the base plate 21, and is fixed to the four corners on the lower surface of the substrate 21 via the four upper pillars 24. The lower plate 23 is formed as a plate smaller than the intermediate plate 22, and is fixed to the four corners on the lower surface of the intermediate plate 22 via the four lower pillars 24a.
因此,包含基底板21、中間板22及下部板23等之組裝體於支持部17向上下移動時,與支持部17一併向上下移動。又,於中間板22與下部板23之除一端部側(於圖1中為右側)以外之部分之相互對向之位置分別穿設複數個貫通孔,於該複數個貫通孔中分別插入有複數個電性接觸件25之兩端部。中間板22之複數個貫通孔、與下部板23之複數個貫通孔之配置分別與形成於電路基板11之電性接點11c之配置相同,因此複數個電性接觸件25之配置亦與電性接點11c之配置相同。 Therefore, the assembly including the base plate 21, the intermediate plate 22, and the lower plate 23 moves up and down together with the support portion 17 when the support portion 17 moves up and down. Further, a plurality of through holes are bored in the mutually opposing positions of the intermediate plate 22 and the lower plate 23 except for one end side (the right side in FIG. 1), and the plurality of through holes are respectively inserted in the plurality of through holes Both ends of the plurality of electrical contacts 25 are provided. The arrangement of the plurality of through holes of the intermediate plate 22 and the plurality of through holes of the lower plate 23 is the same as the arrangement of the electrical contacts 11c formed on the circuit board 11, so that the arrangement of the plurality of electrical contacts 25 is also electrically The configuration of the sexual contact 11c is the same.
該等電性接觸件25係以與相鄰之2個電路圖案11b之電性接點11c對應之方式配置。又,於該等電性接觸件25之上端部電性連接有可撓性之線纜25a之前端部(下端部),該線纜25a之後端部(上端部)係貫通基底板21之貫通孔21a內而向基板21之上方延伸。電性接觸件25之下端部自下部板23之下表面向下方突出,該電性接觸件25之下端部之突出端藉由可動部20之移動而抵接於電路基板11之電性接點11c。 The electrical contacts 25 are disposed so as to correspond to the electrical contacts 11c of the adjacent two circuit patterns 11b. Further, an end portion (lower end portion) of the flexible cable 25a is electrically connected to an upper end portion of the electrical contact member 25, and an end portion (upper end portion) of the cable 25a is penetrated through the base plate 21 The inside of the hole 21a extends above the substrate 21. The lower end portion of the electrical contact member 25 protrudes downward from the lower surface of the lower plate 23, and the protruding end of the lower end portion of the electrical contact member 25 abuts against the electrical contact of the circuit substrate 11 by the movement of the movable portion 20. 11c.
電性接觸件25之下端部係形成為較細之針狀,於藉由可動部20之移動而與電路基板11之電性接點11c接觸時,各電性接觸件25間通電,從而根據其電阻值之大小判定電路基板11之電路圖案11b是否適當地導通。其係基於良品之電路基板11之電阻值設定檢查判定值,以相對於該檢查判定值之比率進行判定。即,於導通檢查之情形時,若檢測出之電阻值相對於檢查判定值為特定比率以下,則判定為良品,若為特定比率以上,則判定為不良品。又,於絕緣檢查之情形時,若檢測出之電阻值相對於檢查判定值為特定比率以上,則判定為良品,若為特定比率以下,則判定為不良品。 The lower end portion of the electrical contact member 25 is formed into a thin needle shape. When the movable portion 20 is in contact with the electrical contact 11c of the circuit substrate 11, the electrical contacts 25 are energized, thereby The magnitude of the resistance value determines whether or not the circuit pattern 11b of the circuit board 11 is properly turned on. This is based on the resistance value setting inspection determination value of the circuit board 11 of the good product, and is determined based on the ratio of the inspection determination value. In other words, in the case of the conduction check, if the detected resistance value is equal to or less than the specific value of the inspection determination value, it is judged to be a good product, and if it is equal to or higher than the specific ratio, it is determined to be a defective product. In the case of the insulation inspection, if the detected resistance value is equal to or higher than the inspection determination value, it is judged to be a good product, and if it is equal to or less than the specific ratio, it is determined to be a defective product.
又,於中間板22與下部板23之一端部側部分之相互對向之位置分別穿設有安裝孔。而且,圖像識別用相機26係將透鏡部26a之下端部固定於下部板23之安裝孔內,將相機本體26b固定於中間板22之安裝孔內而組入至電性檢查治具20a。該圖像識別用相機26於為了進行電性檢查而電性檢查治具20a移動時,配置於成為前方之位置。又。如圖5所示,圖像識別用相機26係與複數個電性接觸件25保持間隔而配置。 Further, mounting holes are formed in the mutually opposing positions of the end portions of the intermediate plate 22 and the lower plate 23, respectively. Further, the image recognition camera 26 fixes the lower end portion of the lens portion 26a in the attachment hole of the lower plate 23, and fixes the camera body 26b in the attachment hole of the intermediate plate 22 to be incorporated into the electrical inspection jig 20a. The image recognition camera 26 is disposed at a position forward when the electrical inspection jig 20a is moved for electrical inspection. also. As shown in FIG. 5, the image recognition camera 26 is disposed at a distance from a plurality of electrical contacts 25.
電性接觸件25以可與左右相鄰之2個電路圖案11b之電性接點11c對應之方式,包含2組電性接觸件群25A、25B,圖像識別用相機26拍攝之位置識別區域26c之中心位置O與電性接觸件群25A之中心位置O1的距離a係設定為電路圖案11b之間距P之2倍之25mm。因此,位置識別區域26c之中心位置O與電性接觸件群25B之中心位置O2之距離b係成為電路圖案11b之間距P之3倍之37.5mm。 The electrical contact member 25 includes two sets of electrical contact groups 25A and 25B corresponding to the electrical contacts 11c of the two circuit patterns 11b adjacent to the left and right, and the position recognition area photographed by the image recognition camera 26 The distance a between the center position O of 26c and the center position O1 of the electrical contact group 25A is set to 25 mm which is twice the distance P between the circuit patterns 11b. Therefore, the distance b between the center position O of the position identifying region 26c and the center position O2 of the electrical contact group 25B is 37.5 mm which is three times the distance P between the circuit patterns 11b.
電性檢查控制部27包含配置於板狀之基體27a之上表面之複數個電性零件27b。基體27a由印刷配線板構成,且以與基底板21之上表面對向之方式,藉由螺紋構件(未圖示)固定於安裝部15b。又,於基體27a之下表面,以與線纜25a之後端部相同之配置設置有複數個導電部。各導電部係於支持部17位於上方時,與各線纜25a之後端部接觸,於支持部17位於下方時,與各線纜25a之後端部分離。 The electrical inspection control unit 27 includes a plurality of electrical components 27b disposed on the upper surface of the plate-shaped base 27a. The base body 27a is formed of a printed wiring board, and is fixed to the mounting portion 15b by a screw member (not shown) so as to face the upper surface of the base plate 21. Further, a plurality of conductive portions are provided on the lower surface of the base 27a in the same arrangement as the rear end portion of the cable 25a. Each of the conductive portions is in contact with the rear end portion of each of the cables 25a when the support portion 17 is located above, and is separated from the rear end portion of each of the cables 25a when the support portion 17 is positioned below.
電性零件27b係於基體27a之上表面配置成格子狀,分別包含於電性檢查時所需之包括CPU(Central Processing Unit,中央處理單元)、ROM(Read Only Memory,唯讀記憶體)、RAM(Random Access Memory,隨機存取記憶體)、計時器等之電路或裝置。又,特定之電性零件27b係經由基體27a之印刷配線而連接。於基體27a之一角部,經由連接端子27c而連接有資訊傳達纜線28a之前端部,於資訊傳達纜線28a之後端部連接有電性檢查處理部28。該電性檢查處理部28進行 電性檢查控制部27不進行之電性檢查所需之其他控制。又,於該電性檢查處理部28連接有周邊設備、例如用以供操作者進行電性檢查裝置10之各操作之操作面板或用以顯示檢查結果之顯示面板等裝置或設備、或X、Y、Z軸之軸控制設備。 The electrical component 27b is arranged in a lattice shape on the upper surface of the base 27a, and includes a CPU (Central Processing Unit), a ROM (Read Only Memory), and a ROM, which are required for electrical inspection. A circuit or device such as a RAM (Random Access Memory) or a timer. Moreover, the specific electrical component 27b is connected via the printed wiring of the base 27a. At the corner of one of the bases 27a, the front end of the information transmission cable 28a is connected via the connection terminal 27c, and the electrical inspection processing unit 28 is connected to the end of the information transmission cable 28a. The electrical inspection processing unit 28 performs The electrical inspection control unit 27 does not perform other controls required for the electrical inspection. Further, the electrical inspection processing unit 28 is connected to peripheral devices, for example, an operation panel for the operator to perform each operation of the electrical inspection device 10, or a display panel such as a display panel for displaying the inspection result, or X, Y, Z axis axis control equipment.
於使用以此方式構成之電性檢查裝置10進行電路基板11之導通及絕緣檢查之情形時,一面自圖6所示之電路基板11之右端向左側,一面自後行(圖6之上行)向前行(圖6之下行)進行以2個為單位之電路圖案11b之檢查。於該導通檢查時,首先,將電路基板11設置於設置裝置。繼而,使各驅動裝置驅動,一面使可動部20相對於電路基板11移動,一面藉由圖像識別用相機26拍攝複數個基準標記11d,藉此調節電路基板11之朝向而使各電路圖案11b之排列沿可動部20之移動方向。 When the electrical inspection apparatus 10 configured in this manner performs the conduction and insulation inspection of the circuit board 11, the right side of the circuit board 11 shown in FIG. 6 is turned to the left side, and the rear side is continued (upward in FIG. 6). The inspection of the circuit pattern 11b in units of 2 is performed in the forward direction (the lower row in Fig. 6). At the time of the continuity check, first, the circuit board 11 is placed in the setting device. Then, by driving the respective driving devices, the movable portion 20 is moved relative to the circuit board 11, and the plurality of reference marks 11d are imaged by the image recognition camera 26, whereby the orientation of the circuit board 11 is adjusted to make the circuit patterns 11b. The arrangement is along the moving direction of the movable portion 20.
接著,藉由使各驅動裝置驅動,而使圖像識別用相機26移動至電路基板11之後行之自右方數為第2個之電路圖案11b的上方(圖6之位置A)。繼而,藉由圖像識別用相機26拍攝包含基準標記11d之位置識別區域26c而識別基準標記11d之位置。該拍攝到之基準標記11d之位置係與預先作為基準位置而求出之基準位置資料進行比較,若於拍攝到之基準標記11d之位置與基準位置資料不存在差,則判斷為處於適當狀態,若產生差,則對電路基板11之設置位置進行微調整。此時,電性接觸件群25A、25B位於電路基板11之後行右端之外部側。 Then, by driving each of the driving devices, the image recognition camera 26 is moved to the upper side of the second circuit pattern 11b (position A in FIG. 6) after moving to the circuit board 11. Then, the position recognition region 26c including the reference mark 11d is imaged by the image recognition camera 26 to recognize the position of the reference mark 11d. The position of the reference mark 11d is compared with the reference position data obtained as the reference position in advance, and if there is no difference between the position of the reference mark 11d and the reference position data, it is determined that it is in an appropriate state. If a difference occurs, the position of the circuit board 11 is finely adjusted. At this time, the electrical contact groups 25A, 25B are located on the outer side of the right end of the circuit board 11.
其次,使電性檢查治具20a與圖像識別用相機26上升,而使可動部20向左側直線性地僅移動電路圖案11b之間距P之2倍之距離(位置B)。其後,使電性檢查治具20a與圖像識別用相機26下降,而使各電性接觸件25之前端部分別與電性接點11c接觸。於該狀態下,進行電路基板11之最初之2個電路圖案11b之電性檢查。又,同時,圖像識別用相機26拍攝後行自右數為第4個之電路圖案11b之位置識別區域26c 並識別基準標記11d之位置。藉此,識別接下來檢查之電路圖案11b之位置適當。 Then, the electrical inspection jig 20a and the image recognition camera 26 are raised, and the movable portion 20 linearly moves only the distance (position B) twice the distance P between the circuit patterns 11b to the left side. Thereafter, the electrical inspection jig 20a and the image recognition camera 26 are lowered, and the front ends of the respective electrical contacts 25 are brought into contact with the electrical contacts 11c, respectively. In this state, the electrical inspection of the first two circuit patterns 11b of the circuit board 11 is performed. Further, at the same time, the image recognition camera 26 captures the position recognition area 26c from the right side of the fourth circuit pattern 11b. And the position of the reference mark 11d is identified. Thereby, the position of the circuit pattern 11b to be inspected next is recognized as appropriate.
於該情形時,各驅動裝置根據自CPU發送之指令信號移動,並且電性接觸件25根據自CPU發送之指令信號作動。即,基於自CPU發送之指令信號,切換線纜25a與導電部之連接而將特定之電性接觸件25設為分別與對向之電性接點11c連接之狀態。其後,將檢查信號經由電性接觸件25輸入至電路圖案11b。將該所輸入之檢查信號自處於與其他電性接點11c連接之狀態之電性接觸件25取出並輸入至計測部,從而計測部進行電阻值之計測。 In this case, each drive unit moves in accordance with a command signal transmitted from the CPU, and the electrical contact 25 operates in accordance with a command signal transmitted from the CPU. In other words, based on the command signal transmitted from the CPU, the connection between the cable 25a and the conductive portion is switched, and the specific electrical contact 25 is connected to the opposite electrical contact 11c. Thereafter, the inspection signal is input to the circuit pattern 11b via the electrical contact 25. The input inspection signal is taken out from the electrical contact 25 in a state of being connected to the other electrical contact 11c, and is input to the measurement unit, whereby the measurement unit measures the resistance value.
又,於進行電路基板11中之接下來之2個電路圖案11b之電性檢查之情形時,藉由再次使各驅動裝置驅動,而使電性檢查治具20a與圖像識別用相機26上升。接著,於再次使可動部20向左側直線性地僅移動電路圖案11b之間距P之2倍之距離後,使電性檢查治具20a與圖像識別用相機26下降(位置C)。繼而,進行後行自右數為第3個與第4個之電路圖案11b之電性檢查,並且拍攝後行自右數為第6個之電路圖案11b之位置識別區域26c而識別基準標記11d之位置。 When the electrical inspection of the next two circuit patterns 11b in the circuit board 11 is performed, the electrical inspection jig 20a and the image recognition camera 26 are raised by driving the respective driving devices again. . Then, the movable portion 20 is linearly moved to the left side by only twice the distance P between the circuit patterns 11b, and then the electrical inspection jig 20a and the image recognition camera 26 are lowered (position C). Then, the electrical inspection of the third and fourth circuit patterns 11b from the right is performed, and the position recognition region 26c of the sixth circuit pattern 11b from the right is taken after the photographing, and the reference mark 11d is recognized. The location.
進而,使電性檢查治具20a與圖像識別用相機26依序直線性地移動至位置D、E而依次重複上述操作,藉此進行電路基板11中之所有電路圖案11b之檢查。再者,於自後方之行向前方之行之電路圖案11b之檢查中移行時,在使電性檢查治具20a與圖像識別用相機26向前方(前行側)移動相當於電路圖案11b之間距P後,進行上述操作。 Further, the electrical inspection jig 20a and the image recognition camera 26 are linearly moved to the positions D and E in order, and the above operations are sequentially repeated to perform inspection of all the circuit patterns 11b in the circuit board 11. In addition, when moving from the rear to the inspection of the circuit pattern 11b of the preceding line, the electrical inspection jig 20a and the image recognition camera 26 are moved forward (forward side) to correspond to the circuit pattern 11b. After the distance P, the above operation is performed.
如此,本實施形態之電性檢查裝置10係於包括包含複數個電性接觸件25之電性接觸件群25A、25B之電性檢查治具20a中設置有圖像識別用相機26。而且,為了進行2個電路圖案11b之電性檢查而使電性接觸件25直線性地移動,並且將用以為了進行電路圖案11b之位置之識別而使圖像識別用相機26直線性地移動之電性檢查治具20a之移動 之間距(移動距離)設為電路圖案11b之間距P之2倍。因此,若電性檢查治具20a按照所設定之間距相對於電路基板11直線性地移動,則電性接觸件群25A、25B與圖像識別用相機26分別與特定之電路圖案11b對向。 As described above, the electrical inspection device 10 of the present embodiment is provided with the image recognition camera 26 in the electrical inspection jig 20a including the electrical contact groups 25A and 25B including the plurality of electrical contacts 25. Further, in order to perform electrical inspection of the two circuit patterns 11b, the electrical contact 25 is linearly moved, and the image recognition camera 26 is linearly moved for recognition of the position of the circuit pattern 11b. The electrical inspection fixture 20a moves The distance (moving distance) is set to be twice the distance P between the circuit patterns 11b. Therefore, when the electrical inspection jig 20a linearly moves with respect to the circuit board 11 in accordance with the set distance therebetween, the electrical contact groups 25A and 25B and the image recognition camera 26 respectively face the specific circuit pattern 11b.
又,圖像識別用相機26係以如下方式設置,即,拍攝之位置識別區域26c之中心位置O與電性接觸件群25A之中心位置O1之距離成為電路圖案11b之間距P之2倍之25mm。因此,首先,若識別電路圖案11b之位置,則藉由繼而進行處理,依次同時進行包含位置已被識別之電路圖案11b之2個電路圖案11b之電性檢查、及接下來要檢查之電路圖案11b之位置之識別。因此,謀求處理時間之縮短化。 Further, the image recognition camera 26 is disposed such that the distance between the center position O of the photographed position recognizing region 26c and the center position O1 of the electric contact group 25A becomes twice the distance P between the circuit patterns 11b. 25mm. Therefore, first, when the position of the circuit pattern 11b is recognized, the processing is performed, and the electrical inspection of the two circuit patterns 11b including the circuit pattern 11b whose position has been recognized is sequentially performed, and the circuit pattern to be inspected next. Identification of the location of 11b. Therefore, the processing time is shortened.
又,由於將電性檢查治具20a移動之間距設定為複數個電路圖案11b之間距P之2倍,故可使於圖像識別用相機26識別出特定之電路圖案11b後,在電性接觸件群25A、25B電性檢查包含該電路圖案11b之電路圖案11b之前電性檢查治具20a移動之距離為最小,藉此,電路圖案11b與電性接觸件群25A、25B之定位之精度亦提高。 Further, since the distance between the movements of the electrical inspection jig 20a is set to be twice the distance P between the plurality of circuit patterns 11b, the image recognition camera 26 can be electrically contacted after recognizing the specific circuit pattern 11b. The device group 25A, 25B electrically checks the circuit pattern 11b including the circuit pattern 11b before the distance of the electrical inspection jig 20a is minimized, whereby the accuracy of the positioning of the circuit pattern 11b and the electrical contact groups 25A, 25B is also improve.
又,於本實施形態中,於電路圖案11b設置基準標記11d,且圖像識別用相機26拍攝包含該基準標記11d之位置識別區域26c,藉此識別電路圖案11b之位置。因此,圖像識別用相機26只要拍攝電路圖案11b之一部分即可,故可使設置位置具有自由度,並且使圖像識別用相機26與電性接觸件群25A、25B之位置關係調合為電路圖案11b之間距P之整數倍。進而,由於將圖像識別用相機26之透鏡部26a與複數個電性接觸件25並列而將相機本體26b設置於電性檢查治具20a內,故圖像識別用相機26相對於電路基板11之位置變近,從而利用圖像識別用相機26進行之電路圖案11b之識別變得準確。 Further, in the present embodiment, the reference mark 11d is provided in the circuit pattern 11b, and the image recognition camera 26 captures the position recognition area 26c including the reference mark 11d, thereby identifying the position of the circuit pattern 11b. Therefore, the image recognition camera 26 only needs to capture a part of the circuit pattern 11b, so that the installation position can have a degree of freedom, and the positional relationship between the image recognition camera 26 and the electrical contact groups 25A, 25B can be adjusted to a circuit. The pattern 11b is an integer multiple of P from each other. Further, since the lens unit 26a of the image recognition camera 26 is arranged in parallel with the plurality of electrical contacts 25 to mount the camera body 26b in the electrical inspection jig 20a, the image recognition camera 26 is opposed to the circuit substrate 11 The position is made closer, so that the recognition of the circuit pattern 11b by the image recognition camera 26 becomes accurate.
於圖7中表示上述第1實施形態之變化例之電性檢查裝置所包括 之圖像識別用相機26(圖示位置識別區域26c')、與包含複數個電性接觸件25之2組電性接觸件群25C、25D之位置關係。電性接觸件群25C、25D係以可與前後相鄰之2個電路圖案11b對應之方式配置於前後,圖像識別用相機26係配置於位於前方之電性接觸件群25D之左側。而且,位置識別區域26c'之中心位置O'與電性接觸件群25C之中心位置O1'及電性接觸件群25D之中心位置O2'之左右方向之距離c係設定為與電路圖案11b之間距P相同之12.5mm。該變化例之電性檢查裝置之除此以外之部分之構成與上述電性檢查裝置10相同。因此,以下,對與上述電性檢查裝置10相同之部分使用與上述電性檢查裝置10相同之符號進行說明。 Fig. 7 shows an electrical inspection device including a modification of the first embodiment. The image recognition camera 26 (the position recognition area 26c' is shown) has a positional relationship with the two sets of electrical contact groups 25C and 25D including a plurality of electrical contacts 25. The electrical contact groups 25C and 25D are disposed in front and rear so as to correspond to the two circuit patterns 11b adjacent to each other, and the image recognition camera 26 is disposed on the left side of the front electrical contact group 25D. Further, the distance c between the center position O' of the position recognizing area 26c' and the center position O1' of the electric contact group 25C and the center position O2' of the electric contact group 25D is set to be the same as the circuit pattern 11b. The pitch P is the same as 12.5 mm. The other components of the electrical inspection device of this modification are the same as those of the electrical inspection device 10. Therefore, the same portions as those of the above-described electrical inspection device 10 will be described below using the same reference numerals as the above-described electrical inspection device 10.
於使用以此方式構成之變化例之電性檢查裝置進行電路基板11之導通檢查之情形時,自圖8所示之電路基板11之右端向左側並且以前後2個為單位之電路圖案11b之檢查係自後行側(圖8之上行)向前行側(圖8之下行)進行。於該導通檢查時,與上述實施形態同樣地,首先,於將電路基板11設置於設置裝置後,一面使可動部20相對於電路基板11移動,一面藉由圖像識別用相機26拍攝複數個基準標記11d,藉此,調節電路基板11之朝向而使各電路圖案11b之排列沿可動部20之移動方向。 In the case where the electrical inspection apparatus of the variation of the configuration is used to perform the conduction inspection of the circuit board 11, the circuit pattern 11b of the circuit board 11 from the right end to the left side and the previous two units is shown in FIG. The inspection is performed from the trailing side (upward of Fig. 8) to the forward side (the lower row of Fig. 8). In the same manner as in the above-described embodiment, first, after the circuit board 11 is placed in the installation device, the movable portion 20 is moved relative to the circuit board 11, and the image recognition camera 26 captures a plurality of images. The reference mark 11d thereby adjusts the orientation of the circuit board 11 so that the arrangement of the circuit patterns 11b is along the moving direction of the movable portion 20.
接著,使圖像識別用相機26移動至電路基板11之自後行數為第2行之行之右端的電路圖案11b之上方(圖8之位置A')。繼而,藉由圖像識別用相機26拍攝包含基準標記11d之位置識別區域26c'而識別基準標記11d之位置。此時,電性接觸件群25C位於電路基板11之最後行之右端之外部側,電性接觸件群25D位於電路基板11之自後行數為第2行之行之右端之外部側。 Next, the image recognition camera 26 is moved to the upper side of the circuit pattern 11b of the circuit board 11 from the right end of the second row (position A' of FIG. 8). Then, the image recognition camera 26 captures the position of the reference mark 11d by capturing the position recognition area 26c' including the reference mark 11d. At this time, the electrical contact group 25C is located on the outer side of the right end of the last row of the circuit board 11, and the electrical contact group 25D is located on the outer side of the right end of the circuit board 11 from the row of the second row.
其次,使電性檢查治具20a與圖像識別用相機26上升,而使可動部20向左側直線性地僅移動與電路圖案11b之間距P相同之距離(位置 B')。其後,使電性檢查治具20a與圖像識別用相機26下降,而使各電性接觸件25之前端部分別與電性接點11c接觸。於該狀態下,進行電路基板11之最初之2個電路圖案11b之電性檢查。又,同時,圖像識別用相機26拍攝自後行數為第2行之自右數為第2個之電路圖案11b的位置識別區域26c'而識別基準標記11d之位置。藉此,識別接下來檢查之電路圖案11b之位置適當。 Next, the electrical inspection jig 20a and the image recognition camera 26 are raised, and the movable portion 20 is linearly moved to the left side only by the same distance (position) from the circuit pattern 11b. B'). Thereafter, the electrical inspection jig 20a and the image recognition camera 26 are lowered, and the front ends of the respective electrical contacts 25 are brought into contact with the electrical contacts 11c, respectively. In this state, the electrical inspection of the first two circuit patterns 11b of the circuit board 11 is performed. At the same time, the image recognition camera 26 captures the position of the reference mark 11d from the position recognition area 26c' in which the number of lines from the second line to the second line is the second line pattern 11b. Thereby, the position of the circuit pattern 11b to be inspected next is recognized as appropriate.
又,於進行電路基板11中之接下來之2個電路圖案11b之電性檢查之情形時,再次使電性檢查治具20a與圖像識別用相機26上升。接著,於再次使可動部20向左側直線性地僅移動與電路圖案11b之間距P相同之距離後,使電性檢查治具20a與圖像識別用相機26下降(位置C')。繼而,進行最後行之自右數為第2個及自後行數為第2行之自右數為第2個之電路圖案11b之電性檢查,並且拍攝自後行數為第2行之自右數為第3個之電路圖案11b的位置識別區域26c'而識別基準標記11d之位置。 Moreover, when the electrical inspection of the next two circuit patterns 11b in the circuit board 11 is performed, the electrical inspection jig 20a and the image recognition camera 26 are again raised. Then, the movable portion 20 is linearly moved to the left side only by the same distance from the circuit pattern 11b by the same distance, and then the electrical inspection jig 20a and the image recognition camera 26 are lowered (position C'). Then, the electrical check of the circuit pattern 11b from the right of the second row and the second row from the right row to the second row is performed, and the number of lines from the back row is the second row. The position of the reference mark 11d is recognized from the position recognition area 26c' of the third circuit pattern 11b from the right.
進而,使電性檢查治具20a與圖像識別用相機26自位置D'依序直線性地移動至H'而依次重複上述操作,藉此進行電路基板11中之所有電路圖案11b之檢查。再者,於該情形時,於自後方之行向前方之行之電路圖案11b之檢查移行時,在使電性檢查治具20a與圖像識別用相機26向前方(前行側)移動相當於電路圖案11b之間距P之2倍後,進行上述操作。 Further, the electrical inspection jig 20a and the image recognition camera 26 are linearly moved from the position D' to H' in order, and the above operations are sequentially repeated to perform inspection of all the circuit patterns 11b in the circuit board 11. In this case, when the inspection of the circuit pattern 11b in the forward direction is performed, the electrical inspection jig 20a and the image recognition camera 26 are moved forward (forward). After the circuit pattern 11b is twice as long as P, the above operation is performed.
根據該變化例之電性檢查裝置,由於一面識別沿電性檢查治具20a與圖像識別用相機26之移動方向之2行電路圖案11b中的一行之所有電路圖案11b之位置,一面進行電性檢查,故利用圖像識別用相機26進行之電路圖案11b之識別變得更準確。該變化例之電性檢查裝置之除此以外之作用效果係與上述實施形態之作用效果相同。又,作為另一變化例,亦可於左右、前後分別配置2個電性接觸件群(合計4 個)。於該情形時,在前後方向上每隔2行進行圖6所示之處理。根據該變化例,可實現高效率之電性檢查。 According to the electrical inspection apparatus of the above-described embodiment, the position of all the circuit patterns 11b in one of the two rows of circuit patterns 11b along the moving direction of the electrical inspection jig 20a and the image recognition camera 26 is recognized. Since the inspection is performed, the recognition of the circuit pattern 11b by the image recognition camera 26 becomes more accurate. The other functions of the electrical inspection device of this modification are the same as those of the above embodiment. Moreover, as another variation, two electrical contact groups may be disposed on the left and right sides and the front and rear sides (total 4 )). In this case, the processing shown in Fig. 6 is performed every two lines in the front-rear direction. According to this variation, a highly efficient electrical inspection can be achieved.
圖9表示藉由本發明之第2實施形態之電性檢查裝置所包括之電性檢查治具30a、與設置於電性檢查治具30a之圖像識別用相機36進行電路基板11之電性檢查之狀態。於該電性檢查治具30a中,在中間板32與下部板33之一端部側部分之相互對向之位置分別穿設透孔32a、33a,於該透孔32a、33a之上方固定有圖像識別用相機36。圖像識別用相機36係使透鏡部36a位於基底板31之貫通孔31a內,且藉由安裝構件(未圖示)將相機本體36b固定於基底板31之上方。關於該第2實施形態之電性檢查裝置之除此以外之部分的構成係與上述電性檢查裝置10相同。因此,對與上述電性檢查裝置10相同之部分標示與上述電性檢查裝置10相同之符號。 FIG. 9 shows an electrical inspection jig 30a included in the electrical inspection device according to the second embodiment of the present invention, and an electrical inspection of the circuit substrate 11 by the image recognition camera 36 provided in the electrical inspection jig 30a. State. In the electrical inspection jig 30a, the through holes 32a and 33a are respectively formed at positions opposite to each other at the end portion side portions of the intermediate plate 32 and the lower plate 33, and a figure is fixed above the through holes 32a and 33a. The image recognition camera 36 is used. The image recognition camera 36 is such that the lens portion 36a is positioned in the through hole 31a of the base plate 31, and the camera body 36b is fixed above the base plate 31 by a mounting member (not shown). The other components of the electrical inspection device according to the second embodiment are the same as those of the electrical inspection device 10. Therefore, the same portions as those of the above-described electrical inspection device 10 are denoted by the same reference numerals as those of the above-described electrical inspection device 10.
再者,圖像識別用相機36與2組電性接觸件群25A、25B之間之距離(沿電性檢查治具30a之移動方向之距離)亦設定為和上述圖像識別用相機26與2組電性接觸件群25A、25B之距離相同。而且,亦可藉由該第2實施形態之電性檢查裝置,利用與上述第1實施形態相同之方法進行電路基板11之電性檢查。根據本實施形態,無需於電性檢查治具30a之內部設置用以設置圖像識別用相機36之空間或用以安裝之構件或構造,而只要於中間板32與下部板33中之複數個電性接觸件25所處之部分之附近設置透孔32a、33a即可,故可使電性檢查治具30a之構造簡單。本實施形態之除此以外之作用效果係與上述電性檢查裝置10相同。 Further, the distance between the image recognition camera 36 and the two sets of the electrical contact groups 25A and 25B (the distance in the moving direction of the electrical inspection jig 30a) is also set to be the same as the image recognition camera 26 described above. The distance between the two sets of electrical contact groups 25A, 25B is the same. Further, the electrical inspection of the circuit board 11 can be performed by the same method as the first embodiment described above by the electrical inspection device of the second embodiment. According to the present embodiment, it is not necessary to provide a space for providing the image recognition camera 36 or a member or structure for mounting inside the electrical inspection jig 30a, as long as it is plural in the intermediate plate 32 and the lower plate 33. The through holes 32a and 33a may be provided in the vicinity of the portion where the electrical contact 25 is located, so that the structure of the electrical inspection jig 30a can be made simple. The other operational effects of the present embodiment are the same as those of the electrical inspection device 10 described above.
又,作為第2實施形態之電性檢查裝置之變化例,亦可將圖像識別用相機36與電性接觸件群之位置關係設為圖7所示之圖像識別用相機26與2組電性接觸件群25C、25D之位置關係。進而,作為另一變化 例,亦可於左右、前後分別配置2個電性接觸件群(合計4個)。 Further, as a variation of the electrical inspection device according to the second embodiment, the positional relationship between the image recognition camera 36 and the electrical contact group may be set as the image recognition camera 26 and the two groups shown in FIG. The positional relationship of the electrical contact groups 25C, 25D. Further, as another change For example, two electrical contact groups (four in total) may be disposed on the left and right sides.
圖10表示藉由本發明之第3實施形態之電性檢查裝置所包括之電性檢查治具40a、及設置於電性檢查治具40a之圖像識別用相機46進行電路基板11之電性檢查之狀態。於該電性檢查裝置中,圖像識別用相機46並非設置於電性檢查治具40a之內部,而設置於側部。因此,不於中間板42與下部板43設置安裝孔或透孔,而將電性檢查治具40a整體形成為小型。又,圖像識別用相機46包含相機本體46b、及於自相機本體46b向下方延伸後彎曲而於水平方向上延伸之透鏡部46a,於透鏡部46a之內部內置有2個反射鏡46c、46d。 FIG. 10 shows an electrical inspection of the circuit board 11 by the electrical inspection jig 40a included in the electrical inspection device according to the third embodiment of the present invention and the image recognition camera 46 provided in the electrical inspection jig 40a. State. In the electrical inspection apparatus, the image recognition camera 46 is not provided inside the electrical inspection jig 40a, but is provided on the side. Therefore, the mounting hole or the through hole is not provided in the intermediate plate 42 and the lower plate 43, and the electrical inspection jig 40a is formed in a small size as a whole. Further, the image recognition camera 46 includes a camera body 46b and a lens portion 46a that extends downward from the camera body 46b and extends in the horizontal direction, and two mirrors 46c and 46d are built in the lens portion 46a. .
反射鏡46c係將自下方進入之光反射並使行進方向變更90度而向反射鏡46d側前進。反射鏡46d係將自反射鏡46c進入之光反射並使行進方向變更90度而向相機本體46b側前進。藉此,圖像識別用相機46可拍攝電路基板11之上表面。又,相機本體46b係藉由連結構件47而連結於基底板41之特定部分。關於該第2實施形態之電性檢查裝置之除此以外之部分之構成係與上述電性檢查裝置10相同。因此,對與上述電性檢查裝置10相同之部分標示與上述電性檢查裝置10相同之符號。 The mirror 46c reflects the light entering from below and changes the traveling direction by 90 degrees to advance toward the mirror 46d side. The mirror 46d reflects the light entering from the mirror 46c and changes the traveling direction by 90 degrees to advance toward the camera body 46b side. Thereby, the image recognition camera 46 can capture the upper surface of the circuit substrate 11. Further, the camera body 46b is coupled to a specific portion of the base plate 41 by a connecting member 47. The other components of the electrical inspection device according to the second embodiment are the same as those of the electrical inspection device 10. Therefore, the same portions as those of the above-described electrical inspection device 10 are denoted by the same reference numerals as those of the above-described electrical inspection device 10.
再者,於本實施形態中,圖像識別用相機46之反射鏡46c之位置與2組電性接觸件群25A、25B之間之距離(沿電性檢查治具40a之移動方向之距離)係設定為和上述圖像識別用相機26與2組電性接觸件群25A、25B之距離相同。亦可藉由該第3實施形態之電性檢查裝置,利用與上述第1實施形態相同之方法進行電路基板11之電性檢查。根據本實施形態,由於無需用以於電性檢查治具40a設置圖像識別用相機46之空間,故可實現電性檢查治具40a之小型化或構造之簡單化。本實施形態之除此以外之作用效果係與上述電性檢查裝置10相同。 Furthermore, in the present embodiment, the distance between the position of the mirror 46c of the image recognition camera 46 and the two sets of the electrical contact groups 25A and 25B (the distance along the moving direction of the electrical inspection jig 40a) The distance between the image recognition camera 26 and the two sets of electrical contact groups 25A and 25B is set to be the same. According to the electrical inspection device of the third embodiment, the electrical inspection of the circuit board 11 can be performed by the same method as in the first embodiment. According to the present embodiment, since it is not necessary to provide a space for the image recognition camera 46 in the electrical inspection jig 40a, it is possible to reduce the size and structure of the electrical inspection jig 40a. The other operational effects of the present embodiment are the same as those of the electrical inspection device 10 described above.
又,作為第3實施形態之電性檢查裝置之變化例,亦可將圖像識別用相機46與電性接觸件群之位置關係設為圖7所示之圖像識別用相機26與2組電性接觸件群25C、25D之位置關係。進而,作為另一變化例,亦可於左右、前後分別配置2個電性接觸件群(合計4個)。 Further, as a variation of the electrical inspection device according to the third embodiment, the positional relationship between the image recognition camera 46 and the electrical contact group may be set as the image recognition camera 26 and the group 2 shown in FIG. The positional relationship of the electrical contact groups 25C, 25D. Further, as another modification, two electrical contact groups (four in total) may be disposed on the right and left sides and the front and rear sides.
圖11表示藉由本發明之第4實施形態之電性檢查裝置所包括之電性檢查治具50a、及設置於電性檢查治具50a之圖像識別用相機56進行電路基板11之電性檢查之狀態。於該電性檢查裝置中,圖像識別用相機56係藉由定位機構57連結於基底板51之特定部分,而並非藉由連結構件。定位機構57包含:X軸移動部57a,其可相對於基底板51於X方向上移動;及Z軸移動部57b,其可相對於X軸移動部57a於Z方向上移動。因此,圖像識別用相機56可於X方向及Z方向上進行位置調節。關於該第4實施形態之電性檢查裝置之除此以外之部分之構成係與上述第3實施形態之電性檢查裝置相同。因此,對與上述電性檢查裝置相同之部分標示與上述電性檢查裝置相同之符號。 FIG. 11 shows an electrical inspection of the circuit board 11 by the electrical inspection jig 50a included in the electrical inspection device according to the fourth embodiment of the present invention and the image recognition camera 56 provided in the electrical inspection jig 50a. State. In the electrical inspection device, the image recognition camera 56 is coupled to a specific portion of the base plate 51 by the positioning mechanism 57, and is not connected by a connecting member. The positioning mechanism 57 includes an X-axis moving portion 57a that is movable in the X direction with respect to the base plate 51, and a Z-axis moving portion 57b that is movable in the Z direction with respect to the X-axis moving portion 57a. Therefore, the image recognition camera 56 can perform position adjustment in the X direction and the Z direction. The other components of the electrical inspection device according to the fourth embodiment are the same as those of the electrical inspection device according to the third embodiment. Therefore, the same portions as those of the above-described electrical inspection device are denoted by the same reference numerals as those of the above-described electrical inspection device.
再者,於本實施形態中,藉由定位機構57將圖像識別用相機46之反射鏡46c之位置與2組電性接觸件群25A、25B之間之距離(沿電性檢查治具40a之移動方向之距離)以和上述圖像識別用相機26與2組電性接觸件群25A、25B之距離相同之方式定位。而且,亦可藉由該第4實施形態之電性檢查裝置,利用與上述第1實施形態相同之方法進行電路基板11之電性檢查。 Furthermore, in the present embodiment, the position of the mirror 46c of the image recognition camera 46 and the distance between the two sets of the electrical contact groups 25A, 25B by the positioning mechanism 57 (along the electrical inspection jig 40a) The distance in the moving direction is positioned in the same manner as the above-described image recognition camera 26 and the two sets of electrical contact groups 25A and 25B. Further, the electrical inspection of the circuit board 11 can be performed by the same method as the above-described first embodiment by the electrical inspection device according to the fourth embodiment.
根據本實施形態,可藉由定位機構57進行圖像識別用相機56之位置調節,故即便圖像識別用相機56之設置未成為準確之設置位置亦可,從而圖像識別用相機56之設置變得容易。又,於本實施形態中,亦無需用以於電性檢查治具50a設置圖像識別用相機56之空間,故可實現電性檢查治具50a之小型化或構造之簡單化。本實施形態之除此 以外之作用效果係與上述電性檢查裝置10相同。 According to the present embodiment, the position adjustment of the image recognition camera 56 can be performed by the positioning mechanism 57. Therefore, even if the setting of the image recognition camera 56 is not an accurate installation position, the image recognition camera 56 can be set. It's easy. Further, in the present embodiment, the space for providing the image recognition camera 56 to the electrical inspection jig 50a is not required, so that the electrical inspection jig 50a can be downsized or the structure can be simplified. In addition to this embodiment The other external effects are the same as those of the electrical inspection device 10 described above.
又,作為第4實施形態之電性檢查裝置之變化例,亦可將圖像識別用相機46與電性接觸件群之位置關係設為圖7所示之圖像識別用相機26與2組電性接觸件群25C、25D之位置關係。進而,作為另一變化例,亦可於左右、前後分別配置2個電性接觸件群(合計4個)。 Further, as a variation of the electrical inspection device according to the fourth embodiment, the positional relationship between the image recognition camera 46 and the electrical contact group may be set as the image recognition camera 26 and the two groups shown in FIG. The positional relationship of the electrical contact groups 25C, 25D. Further, as another modification, two electrical contact groups (four in total) may be disposed on the right and left sides and the front and rear sides.
再者,本發明並不限定於上述實施形態,可適當地變更。例如,於上述各實施形態或其變化例中,將複數個電性接觸件25以可與左右或前後相鄰之2個電路圖案11b對應之方式,包含2組電性接觸件群25A、25B或電性接觸件群25C、25D,或者將複數個電性接觸件25以可與左右及前後相鄰之4個電路圖案11b對應之方式,包含4組電性接觸件群,但該電性接觸件群亦可僅包含1組,或亦可包含3組或5組以上之複數組。 Furthermore, the present invention is not limited to the above embodiment, and can be appropriately changed. For example, in each of the above embodiments or a modification thereof, the plurality of electrical contacts 25 include two sets of electrical contact groups 25A, 25B so as to correspond to the two circuit patterns 11b adjacent to the left and right or the front and rear. Or the electrical contact groups 25C, 25D, or a plurality of electrical contacts 25, including four sets of electrical contact groups, corresponding to the four circuit patterns 11b adjacent to the left and right and the front and rear, but the electrical The contact group may also include only one group, or may also include three or more complex arrays.
又,上述各實施形態係於電路基板11之上方配置電性檢查治具20a及圖像識別用相機26等,而自上方進行電路基板11之電性檢查,但亦可於電路基板11之下方配置電性檢查治具20a及圖像識別用相機26等,而自下方進行電路基板11之電性檢查。進而,若電性檢查裝置為進行於正背兩面形成有電路圖案11b之電路基板11之電性檢查之裝置,則亦可於電路基板11之上下兩方分別配置電性檢查治具20a及圖像識別用相機26等,而自上下兩方進行電路基板11之電性檢查。又,亦可設置複數個圖像識別用相機26等。進而,關於除此以外之部分之構成,亦不限定於上述實施形態,可於本發明之技術範圍內適當地變更。 Further, in each of the above embodiments, the electrical inspection jig 20a, the image recognition camera 26, and the like are disposed above the circuit board 11, and the electrical inspection of the circuit board 11 is performed from above, but may be performed below the circuit board 11. The electrical inspection jig 20a, the image recognition camera 26, and the like are placed, and the electrical inspection of the circuit board 11 is performed from below. Further, when the electrical inspection device is an apparatus for performing electrical inspection of the circuit board 11 on which the circuit patterns 11b are formed on both front and back sides, the electrical inspection fixtures 20a and the diagrams may be disposed on the upper and lower sides of the circuit board 11, respectively. The image inspection substrate 26 or the like is used to perform electrical inspection of the circuit board 11 from the upper and lower sides. Further, a plurality of image recognition cameras 26 and the like may be provided. In addition, the configuration of the other portions is not limited to the above embodiment, and can be appropriately changed within the technical scope of the present invention.
10‧‧‧電性檢查裝置 10‧‧‧Electrical inspection device
11‧‧‧電路基板 11‧‧‧ circuit board
12‧‧‧移動裝置 12‧‧‧Mobile devices
13a‧‧‧X軸軌道 13a‧‧‧X-axis orbit
13b‧‧‧X軸軌道 13b‧‧‧X-axis orbit
14‧‧‧X軸裝設部 14‧‧‧X-axis installation department
14a‧‧‧滑動部 14a‧‧‧Sliding section
14b‧‧‧滑動部 14b‧‧‧Sliding section
14c‧‧‧Y軸軌道 14c‧‧‧Y-axis orbit
14d‧‧‧Y軸軌道 14d‧‧‧Y-axis orbit
15‧‧‧Y軸裝設部 15‧‧‧Y-axis installation department
15a‧‧‧滑動部 15a‧‧‧Sliding section
15b‧‧‧安裝部 15b‧‧‧Installation Department
20‧‧‧可動部 20‧‧‧movable department
20a‧‧‧電性檢查治具 20a‧‧‧Electrical inspection fixture
26‧‧‧圖像識別用相機 26‧‧‧Image recognition camera
27‧‧‧電性檢查控制部 27‧‧‧Electrical Inspection Control Department
27a‧‧‧基體 27a‧‧‧ base
27b‧‧‧電性零件 27b‧‧‧Electrical parts
27c‧‧‧連接端子 27c‧‧‧Connecting terminal
28‧‧‧電性檢查處理部 28‧‧‧Electrical Inspection and Processing Department
28a‧‧‧資訊傳達纜線 28a‧‧‧Information Communication Cable
R‧‧‧箭頭 R‧‧‧ arrow
X‧‧‧方向 X‧‧‧ direction
Y‧‧‧方向 Y‧‧‧ direction
Z‧‧‧方向 Z‧‧‧ direction
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WO2008136395A1 (en) * | 2007-04-27 | 2008-11-13 | Nhk Spring Co., Ltd. | Probe card |
JP5120027B2 (en) * | 2007-09-28 | 2013-01-16 | 東京エレクトロン株式会社 | Probe apparatus and probing method |
JP5088167B2 (en) * | 2008-02-22 | 2012-12-05 | 東京エレクトロン株式会社 | PROBE DEVICE, PROBING METHOD, AND STORAGE MEDIUM |
WO2010073359A1 (en) * | 2008-12-26 | 2010-07-01 | 富士通セミコンダクター株式会社 | Prober, testing apparatus, and method for inspecting semiconductor chip |
-
2013
- 2013-09-06 JP JP2013185066A patent/JP6084140B2/en active Active
-
2014
- 2014-08-12 WO PCT/JP2014/071265 patent/WO2015033744A1/en active Application Filing
- 2014-08-12 CN CN201480060746.XA patent/CN105705955B/en active Active
- 2014-08-12 KR KR1020167008730A patent/KR101810800B1/en active IP Right Grant
- 2014-09-03 TW TW103130457A patent/TWI544220B/en active
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WO2015033744A1 (en) | 2015-03-12 |
CN105705955A (en) | 2016-06-22 |
KR101810800B1 (en) | 2017-12-19 |
KR20160052653A (en) | 2016-05-12 |
JP6084140B2 (en) | 2017-02-22 |
CN105705955B (en) | 2018-12-21 |
TW201514520A (en) | 2015-04-16 |
JP2015052511A (en) | 2015-03-19 |
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