JP2023111575A - ELECTRICAL INSPECTION DEVICE AND ELECTRICAL INSPECTION METHOD - Google Patents

Abstract

An object of the present invention is to provide an electrical inspection apparatus capable of quickly and easily aligning an electrical inspection head with respect to a printed circuit board.
An electrical inspection apparatus (1) according to one aspect of the present invention includes an electrical inspection head (10) capable of contacting a printed circuit board (W) from the normal direction side, and an electrical inspection head (10) arranged parallel to the normal direction of the printed circuit board (W). and an imaging unit 12 having an optical element 22a that faces the printed circuit board W in the normal direction, and capable of imaging the printed circuit board W. The imaging unit 12 is placed close to each other. A moving mechanism 13 for moving between a position P1 and an avoidance position P2 is provided. The position P2 is a position where the imaging unit 12 does not come into contact with the electrical inspection head 10 when the electrical inspection head 10 rotates.
[Selection drawing] Fig. 1

Description

The present invention relates to an electrical inspection device and an electrical inspection method.

An electrical inspection apparatus is used to inspect the electrical characteristics of printed circuit boards. This electrical inspection apparatus includes an electrical inspection head in which a plurality of probes (electrical contacts) are arranged, and an imaging section capable of imaging a printed circuit board from the normal direction. This electrical inspection apparatus captures an image of a printed circuit board using an imaging unit, aligns an electrical inspection head with an area to be inspected on the printed circuit board, and then brings the electrical inspection head into contact with the printed circuit board from the normal direction. The electrical characteristics of the printed circuit board are inspected (see Patent Document 1).

JP 2015-52511 A

Patent Document 1 describes a configuration in which a positioning mechanism 57 connected to a base plate 51 of an electrical inspection jig 50 a is provided in the fourth embodiment, and an image recognition camera 56 is arranged in the positioning mechanism 57 . It is

The electrical inspection apparatus described in Patent Document 1 can adjust the position of the image recognition camera 56 by the positioning mechanism 57, so it is not necessary to fix the image recognition camera 56 at an accurate position in advance.

On the other hand, in such an electrical inspection apparatus, the electrical inspection head may be rotated around an axis parallel to the normal direction of the printed circuit board when aligning the electrical inspection head with the area to be inspected of the printed circuit board. . However, according to the configuration described in Patent Document 1, when the electrical inspection head is rotated, the image recognition camera rotates together with the electrical inspection head. Therefore, the electrical inspection apparatus described in Patent Literature 1 has room for further improvement in that the imaging by the image recognition camera and the alignment of the electrical inspection head with respect to the area to be inspected are continuously and quickly performed.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an electrical inspection apparatus capable of quickly and easily aligning an electrical inspection head with respect to a printed circuit board. It is in.

An electrical inspection apparatus according to an aspect of the present invention includes an electrical inspection head that can contact a printed circuit board from the normal direction, and a rotation mechanism that rotates the electrical inspection head around a rotation axis parallel to the normal direction. an imaging unit having an optical element facing the printed circuit board in a normal direction and capable of capturing an image of the printed circuit board; and a moving mechanism for moving the imaging unit between an approach position and an avoidance position. The proximity position is a position where the imaging unit can come into contact with the electrical inspection head when the electrical inspection head rotates, and the avoidance position is a position where the imaging unit can contact the electrical inspection head when the electrical inspection head rotates. It is a position out of contact with the electrical test head.

The moving mechanism may move the imaging section independently of the electrical inspection head.

The avoidance position may be a position away from the proximity position in the normal direction of the printed circuit board.

When viewed from the normal direction of the printed circuit board, the distance between the imaging unit and the rotation shaft at the close position may be the same as the distance between the imaging unit and the rotation shaft at the avoidance position.

The electrical inspection apparatus may further include a positioning mechanism capable of positioning the electrical inspection head in a planar direction of the printed circuit board.

The positioning mechanism may simultaneously position the electrical inspection head and the imaging section in the planar direction.

An electrical inspection method according to another aspect of the present invention includes an electrical inspection head capable of contacting a printed circuit board from the normal direction, and rotating the electrical inspection head around a rotation axis parallel to the normal direction. A rotating mechanism, an imaging unit having an optical element facing the printed circuit board in a normal direction and capable of imaging the printed circuit board, and a moving mechanism for moving the imaging unit between an approach position and an avoidance position. wherein the proximity position is a position where the imaging unit can come into contact with the electrical inspection head when the electrical inspection head is rotated, and the avoidance position is a position where the electrical inspection head is rotated. The imaging unit is moved so that the imaging unit does not come into contact with the electrical inspection head when the electric inspection head is pressed.

In the electrical inspection apparatus according to one aspect of the present invention, the electrical inspection head rotates the imaging unit after imaging the printed circuit board from the normal direction with the imaging unit arranged at a close position. can be moved to a avoidance position where it does not come into contact with the electrical inspection head. Therefore, the electrical inspection apparatus can image the printed circuit board from the vicinity of the electrical inspection head by the imaging unit, and then rotate the electrical inspection head independently of the imaging unit. As a result, the electrical inspection apparatus can quickly and easily align the electrical inspection head with respect to the printed circuit board.

FIG. 1 is a schematic side view of an electrical inspection apparatus according to one embodiment of the present invention, viewed from a direction perpendicular to the normal direction of a printed circuit board. 2 is a schematic plan view of the electrical inspection apparatus of FIG. 1. FIG. FIG. 3 is a schematic side view showing a state in which the imaging unit in the electrical inspection apparatus of FIG. 1 has been moved to the avoidance position. FIG. 4 is a flow chart showing an electrical inspection method using the electrical inspection apparatus of FIG. 5 is a schematic plan view showing a state in the middle of rotation of the electrical inspection head in the electrical inspection method of FIG. 4. FIG. 6 is a schematic side view showing a state in which the imaging unit is moved to the close position after the electrical inspection head is rotated in the electrical inspection method of FIG. 4. FIG. 7 is a schematic side view showing a state in which the electrical inspection head is brought into contact with the printed circuit board in the electrical inspection method of FIG. 4. FIG.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as appropriate. For the numerical values described in this specification, it is possible to adopt only one of the described upper limit value and lower limit value, or to arbitrarily combine the upper limit value and the lower limit value.

[Electrical inspection equipment]
The electrical inspection apparatus 1 of FIGS. 1 and 2 includes an electrical inspection head 10 capable of contacting a printed circuit board W from the normal direction (the Z direction in FIG. 1), and an electrical inspection head 10 arranged parallel to the normal direction. A rotating mechanism 11 that rotates around a rotation axis R, an imaging unit 12 that has an optical element 22a that faces the printed circuit board W in the normal direction, and that can capture an image of the printed circuit board W, and the imaging unit 12 is positioned at a close position. and an avoidance position. In addition, the electrical inspection apparatus 1 includes a positioning mechanism 14 capable of positioning the electrical inspection head 10 in the planar direction of the printed circuit board W (the XY plane direction in FIG. 1), and the electrical inspection head 10 in the normal direction of the printed circuit board W. a housing 16 connected to the positioning mechanism 14; In FIG. 1, an electrical inspection head 10 and an imaging unit 12 are arranged on both sides of the printed circuit board W, respectively. However, in the electrical inspection apparatus 1, one or both of the electrical inspection head 10 and the imaging section 12 may be arranged only on one side of the printed circuit board W. FIG. In addition, FIG. 1 illustrates a configuration in which the electrical inspection head 10 and the control section 17 are provided in one-to-one correspondence. However, the electrical inspection apparatus 1 may have a control section 17 common to the pair of electrical inspection heads 10 .

〔Printed board〕
The printed circuit board W is plate-like or sheet-like. As the printed circuit board W, a thin-film substrate on which a circuit pattern is arranged can be used. The printed circuit board W has a plurality of areas to be inspected. The electrical inspection apparatus 1 is configured to perform an electrical inspection for each inspection area by bringing an electrical inspection head 10 into contact with each inspection area. The electrical inspection apparatus 1 is configured to electrically inspect a plurality of areas to be inspected arranged on a printed circuit board W continuously. In the present invention, there is no clear distinction between "plate-like" and "sheet-like", but a "plate-like" is defined as one that does not substantially bend due to its own weight, and has flexibility. A material that bends under its own weight can be called a "sheet". In addition, "sheet-like" is a concept including "film-like".

The printed circuit board W has, for example, a rectangular shape in plan view. The printed circuit board W is horizontally held with its four corners held by the holding tools 31 . The printed circuit board W is held in the air by its peripheral portion being partially gripped by the gripper 31 .

The printed circuit board W is provided with a reference position marker (not shown) to be imaged by the imaging unit 12 . This reference position marker is used to determine the relative positional relationship between the area to be inspected of the printed circuit board W and the electrical inspection head 10 . The reference position marker may be, for example, the circuit pattern itself, or may be a positioning mark provided separately from the circuit pattern.

(electrical inspection head)
The electrical inspection head 10 includes a plurality of probes 21a and a pair of support plates (a bottom plate 21b that can contact the printed circuit board W from the normal direction, and a normal It has a top plate 21c) arranged to face the bottom plate 21b in the direction away from it, and a base 21d fixed to the top plate 21c. A plurality of probes 21a are provided so as to be able to contact the circuit pattern of the printed circuit board W. As shown in FIG.

The electrical inspection head 10 has corners when viewed from the normal direction of the printed circuit board W (hereinafter also referred to as “plan view”). More specifically, the electrical inspection head 10 has a rectangular shape in plan view with four corners. In addition, the base 21d has corners in plan view. The planar shape of the base 21 d is the same as the planar shape of the electrical inspection head 10 . A specific shape of the base 21d is a rectangular parallelepiped whose thickness direction is the normal direction of the printed circuit board W. FIG. Note that the term “rectangular parallelepiped” is not limited to a perfect rectangular parallelepiped, and includes a shape with partial unevenness, a shape with rounded corners, and the like.

The thickness T1 of the base 21d can be set within a range that can appropriately hold the plurality of probes 21a while maintaining the required strength. From this point of view, the lower limit of the thickness T1 of the base 21d is preferably 30 mm, more preferably 40 mm. On the other hand, the upper limit of the thickness T1 of the base 21d is preferably 100 mm, more preferably 80 mm, and even more preferably 60 mm. If the thickness T1 exceeds the upper limit, it may be difficult to sufficiently reduce the moving distance of the imaging unit 12 by the moving mechanism 13 .

The thickness T2 of the electrical inspection head 10 (the thickness defined by the bottom surface of the bottom plate 21b and the top surface of the base 21d) is such that the electrical inspection of the printed circuit board W can be performed by the plurality of probes 21a while maintaining the necessary strength. It can be set within a range that can be performed appropriately. The lower limit of the thickness T2 of the electrical inspection head 10 is preferably 50 mm, more preferably 60 mm, for example. On the other hand, the upper limit of the thickness T2 of the electrical inspection head 10 is preferably 150 mm, more preferably 120 mm, and even more preferably 90 mm.

(rotating mechanism)
The rotation mechanism 11 is configured to rotate the electrical inspection head 10 independently of the imaging unit 12 (more specifically, an imaging terminal 22 described later). The rotating mechanism 11 rotates the electrical inspection head 10 around a rotation axis R orthogonal to the electrical inspection head 10 . The rotation axis R is arranged at the central portion of the electrical inspection head 10 in plan view. A specific configuration of the rotation mechanism 11 is not particularly limited, but a configuration in which the electrical inspection head 10 is directly or indirectly rotatably held by a bearing (not shown) arranged in the housing 16. is mentioned.

(imaging unit)
The imaging unit 12 has an imaging terminal 22 including the aforementioned optical element 22a facing the printed circuit board W in the normal direction, and an image processing unit. The imaging terminal 22 is provided so as to be capable of imaging a digital image. The imaging terminal 22 images the above-described reference position marker provided on the printed circuit board W from the normal direction. The optical element 22a is, for example, a lens. The image processing section processes digital images captured by the imaging terminal 22 .

The imaging terminal 22 is provided so as to be able to image the reference position marker from the side of the electrical inspection head 10 . With this configuration, the distance between the imaging terminal 22 and the printed circuit board W can be reduced during imaging. As a result, the amount of light captured by the imaging terminal 22 can be increased, and the recognition accuracy of the image captured by the imaging terminal 22 can be improved.

The image capturing terminal 22 captures an image of the reference position marker from a position near the electrical inspection head 10 (proximate position P1). More specifically, the imaging terminal 22 images the reference position marker from a position where it can come into contact with the corner of the electrical inspection head 10 when the electrical inspection head 10 is rotated. By arranging the imaging terminal 22 in the vicinity of the electrical inspection head 10 in this manner, the electrical inspection head 10 can be positioned when the electrical inspection head 10 is aligned with the area to be inspected of the printed circuit board W after the reference position marker is photographed. movement distance can be reduced. As a result, errors due to the movement of the electrical inspection head 10 can be suppressed while improving the efficiency of the electrical inspection process.

The image processing section may be included in the control section 17 or may be provided separately from the control section 17 . When the image processing section is included in the control section 17 , the image processing section may be part of a program processed by the control section 17 .

(moving mechanism)
The moving mechanism 13 holds an imaging terminal 22 . As shown in FIGS. 1 and 3, the moving mechanism 13 moves the imaging terminal 22 between the approach position P1 and the avoidance position P2. The proximity position P1 is a position where the imaging unit 12 (more specifically, the imaging terminal 22) can come into contact with the electrical inspection head 10 when the electrical inspection head 10 rotates. The avoidance position P2 is a position where the imaging unit 12 (more specifically, the imaging terminal 22) does not come into contact with the electrical inspection head 10 when the electrical inspection head 10 rotates.

As described above, the electrical inspection apparatus 1 can improve the efficiency of the electrical inspection process by imaging the reference position marker with the imaging terminal 22 from the proximity position P1. On the other hand, if the imaging terminal 22 is arranged at the close position P1, the rotation of the electrical inspection head 10 is restricted, and it may be difficult to align the electrical inspection head 10 with the inspection area. Therefore, the electrical inspection apparatus 1 is configured so that the imaging terminal 22 can be moved to the avoidance position P2 by the moving mechanism 13 .

The moving mechanism 13 preferably moves the imaging section 12 independently of the electrical inspection head 10 . In other words, the moving mechanism 13 is preferably provided so that the imaging terminal 22 does not move following the electrical inspection head 10 when the electrical inspection head 10 rotates and moves up and down. According to this configuration, it is possible to align the electrical inspection head 10 with respect to the printed circuit board W while maintaining the focal length of the optical element 22a with respect to the printed circuit board W, and to perform an electrical inspection with the electrical inspection head 10 after this alignment. can. As a result, electrical inspection can be performed more efficiently and stably.

As shown in FIG. 3, the avoidance position P2 is preferably a position away from the proximity position P1 in the normal direction of the printed circuit board W. As shown in FIG. By being configured in this manner, the electrical inspection apparatus 1 can maintain the moving distance of the imaging terminal 22 even when the imaging terminal 22 is disposed on the side of the electrical inspection head 10 and in close proximity to the electrical inspection head 10. You can prevent it from increasing. As a result, errors due to the movement of the electrical inspection head 10 can be more easily suppressed while promoting the efficiency of the electrical inspection process.

When viewed from the normal direction of the printed circuit board W, the distance between the imaging unit 12 (more specifically, the imaging terminal 22) at the proximity position P1 and the rotation axis R is the distance between the imaging unit 12 (more specifically, the imaging terminal 22) at the avoidance position P2. It is preferably the same as the interval with the rotation axis R. With this configuration, the moving distance of the imaging terminal 22 can be easily reduced.

The moving mechanism 13 is preferably provided so as to linearly move the imaging terminal 22 . According to this configuration, the moving distance of the imaging terminal 22 can be reduced more easily.

The moving distance of the imaging unit 12 between the approach position P1 and the avoidance position P2 is preferably equal to or less than the thickness T2 of the electrical inspection head 10, and more preferably equal to or less than the thickness T1 of the base 21d. The electrical inspection apparatus 1 is configured, for example, to image the reference position marker by the imaging terminal 22 from the side of the base 21d, thereby controlling the movement distance of the imaging unit 12 to be equal to or less than the thickness T1 of the base 21d. can do. According to this configuration, the moving distance of the imaging terminal 22 can be easily reduced while appropriately maintaining the focal length of the optical element 22a with respect to the printed circuit board W at the close position P1.

The moving mechanism 13 holds the imaging terminal 22 while being connected to the housing 16 . The moving mechanism 13 is provided so that the imaging terminal 22 can slide in the normal direction of the printed circuit board W with respect to the housing 16 . With this configuration, the moving mechanism 13 can move the imaging terminal 22 in the normal direction of the printed circuit board W independently of the electrical inspection head 10 . A specific configuration of the moving mechanism 13 includes, for example, a rail member arranged on the housing 16 and a movable member slidably arranged on the rail member and capable of fixing the imaging terminal 22 .

(positioning mechanism)
The positioning mechanism 14 positions the electrical inspection head 10 in the planar direction of the printed circuit board W while maintaining the orientation of the electrical inspection head 10 . Since the electrical inspection apparatus 1 includes the positioning mechanism 14 , the electrical inspection head 10 can be easily aligned with the area to be inspected after the image of the reference position marker is captured by the imaging unit 12 .

A specific configuration of the positioning mechanism 14 is not particularly limited as long as the electrical inspection head 10 can be positioned in the planar direction of the printed circuit board W. For example, an orthogonal coordinate system shown in FIGS. 1 and 2 can be used. be done. The positioning mechanism 14 includes a pair of fixed rails 14a extending parallel to one direction (the Y direction in FIGS. 1 and 2) parallel to the planar direction of the printed circuit board W, and a pair of fixed rails 14a extending parallel to the planar direction of the printed circuit board W and extending parallel to the planar direction of the printed circuit board W. It has a movable rail 14b that spans between the fixed rails 14a, and a movable body 14c that is arranged on the movable rail 14b. A housing 16 is fixed to the moving body 14c.

In the positioning mechanism 14, the movable rail 14b moves along the extending direction (the Y direction in FIGS. 1 and 2) of a pair of fixed rails 14a, and the movable rail 14b moves in the extending direction (the X direction in FIGS. 1 and 2). direction). With such a configuration, the housing 16 is provided so as to be movable in the plane direction while maintaining the orientation of the printed circuit board W in the plane direction. As a result, the electrical inspection head 10 moves along with the housing 16 in the planar direction of the printed circuit board W while maintaining its orientation in the planar direction.

Further, the positioning mechanism 14 is provided so as to be able to position the electrical inspection head 10 and the imaging section 12 in the planar direction of the printed circuit board W at the same time. More specifically, the imaging terminal 22 is connected to the housing 16 via the moving mechanism 13 so as to move in the planar direction of the printed circuit board W together with the housing 16 . As a result, the electrical inspection head 10 and the imaging terminal 22 are configured to be simultaneously positioned in the planar direction of the printed circuit board W by the positioning mechanism 14 via the housing 16 . By being configured in this manner, the electrical inspection apparatus 1 can more easily suppress errors caused by the movement of the electrical inspection head 10 while promoting the efficiency of the electrical inspection process.

(lifting mechanism)
The elevating mechanism 15 is provided so as to be able to elevate a fixing member 18 fixed to the base 21 d of the electrical inspection head 10 . The elevating mechanism 15 moves the electrical inspection head 10 in the normal direction of the printed circuit board W by elevating the fixing member 18 .

The fixing member 18 is arranged slidably with respect to the housing 16 . The fixing member 18 is configured to move up and down independently of the housing 16 . With this configuration, the lifting mechanism 15 is provided so as to lift and lower the electrical inspection head 10 independently of the movement of the imaging unit 12 by the moving mechanism 13 .

(Case)
The housing 16 is fixed to the moving body 14c as described above. Thus, the housing 16 is configured to be movable in the planar direction of the printed circuit board W while maintaining the orientation of the printed circuit board W in the planar direction.

(control part)
The control unit 17 includes, for example, a CPU (Central Processing Unit) that performs data processing and a computer that has a storage unit such as a semiconductor memory that temporarily or permanently stores various types of information.

An example of a control procedure by the control unit 17 will be described. The control unit 17 first causes the imaging terminal 22 to image the reference position marker of the printed circuit board W from the proximity position P1. Next, the control unit 17 moves the imaging terminal 22 to the avoidance position P2, rotates the electrical inspection head 10 about the rotation axis R by 90° in this state, and moves the electrical inspection head 10 to cover the printed circuit board W. Align to the inspection area. Further, the control unit 17 moves the imaging terminal 22 to the proximity position P1 after the electrical inspection head 10 rotates. Further, the control unit 17 brings the electrical inspection head 10 into contact with the printed circuit board W from the normal direction side while maintaining the imaging terminal 22 at the close position P1, and performs an electrical inspection of the area to be inspected of the printed circuit board W. The control unit 17 separates the electrical inspection head 10 from the printed circuit board W after the electrical inspection by the electrical inspection head 10 is finished. The control unit 17 controls the rotating mechanism 11, the moving mechanism 13, the positioning mechanism 14, and the elevating mechanism so as to perform the above-described procedures for each area to be inspected of the printed circuit board W while partially changing the procedures as necessary. 15 operations. In the electrical inspection apparatus 1, the electrical inspection head 10 can be quickly and easily positioned with respect to the printed circuit board W by the control unit 17 performing the above-described control, and the electrical inspection of the printed circuit board W can be appropriately performed. can be done.

[Electrical inspection method]
Next, an electrical inspection method using the electrical inspection apparatus 1 of FIGS. 1 and 2 will be described with reference to each drawing.

The electrical inspection method includes an electrical inspection head 10 that can contact a printed circuit board W from the normal direction, a rotating mechanism 11 that rotates the electrical inspection head 10 around a rotation axis R parallel to the normal direction, An imaging unit 12 having an optical element 22a facing the printed circuit board W in the normal direction and capable of imaging the printed circuit board W, and a movement mechanism for moving the imaging unit 12 between the approach position P1 and the avoidance position P2. 13 using the electrical inspection apparatus 1. As shown in FIG. 4, in the electrical inspection method, the printed circuit board W is imaged by the imaging unit 12 at the proximity position P1 (S1), the imaging unit 12 is moved to the avoidance position P2 (S2), and the electrical inspection head 10 is moved. Rotate (S3), move the imaging unit 12 to the proximity position P1 (S4), and bring the electrical inspection head 10 into contact with the printed circuit board W (S5). The electrical inspection method includes a procedure for separating the electrical inspection head 10 from the printed circuit board W after S5. In the electrical inspection method, the electrical inspection head 10 is applied to the printed circuit board W by repeating the above-described procedure for each inspection area of the printed circuit board W while partially changing the procedure as necessary. The electrical inspection of the printed circuit board W can be properly performed while aligning the position quickly and easily.

(S1)
In S1, as shown in FIG. 1, the image pickup terminal 22 picks up an image of the reference position marker of the printed circuit board W while the image pickup terminal 22 is placed at the proximity position P1.

(S2)
In S2, as shown in FIG. 3, the imaging terminal 22 is moved to the avoidance position P2. In S2, the proximity position P1 is the position where the imaging unit 12 (more specifically, the imaging terminal 22) can come into contact with the electrical inspection head 10 when the electrical inspection head 10 is rotated, and the avoidance position P2 is the position where the electrical inspection head 10 is rotated. The imaging unit 12 (more specifically, the imaging terminal 22) is moved to a position where the imaging unit 12 (more specifically, the imaging terminal 22) does not come into contact with the electrical inspection head 10 when the is rotated.

(S3)
In S3, as shown in FIG. 5, the electrical inspection head 10 is rotated about the rotation axis R with the imaging terminal 22 at the avoidance position P2. More specifically, in S<b>3 , the electrical inspection head 10 is rotated to a position where the imaging terminal 22 does not overlap the electrical inspection head 10 when viewed from the normal direction of the printed circuit board W. The rotation angle of the electrical inspection head 10 is not particularly limited, but can typically be 90°.

(S4)
In S4, as shown in FIG. 6, after rotating the electrical inspection head 10 in S3, the imaging terminal 22 is moved to the proximity position P1. More specifically, in S4, the imaging terminal 22 is moved from the avoidance position P2 to the proximity position P1 along the same route as the imaging terminal 22 was moved from the proximity position P1 to the avoidance position P2 in S2. In the electrical inspection method, the electrical inspection head 10 may be aligned with the area to be inspected of the printed circuit board W by the positioning mechanism 14 at an arbitrary timing from the end of S1 to the start of S5.

(S5)
In S5, as shown in FIG. 7, the electrical inspection head 10 is brought into contact with the printed circuit board W from the normal direction side, and electrical inspection of the area to be inspected is performed by the plurality of probes 21a.

<Advantages>
In the electrical inspection apparatus 1, the imaging unit 12 is arranged at the close position P1, and after the printed circuit board W is imaged from the normal direction by the imaging unit 12, when the electrical inspection head 10 rotates the imaging unit 12, It can move to the avoidance position P<b>2 where it does not come into contact with the electrical inspection head 10 . Therefore, the electrical inspection apparatus 1 can image the printed circuit board W from the vicinity of the electrical inspection head 10 with the imaging unit 12 and then rotate the electrical inspection head 10 independently of the imaging unit 12 . As a result, the electrical inspection apparatus 1 can align the electrical inspection head 10 with respect to the printed circuit board W quickly and easily. Therefore, the electrical inspection apparatus 1 can perform the electrical inspection of the printed circuit board W quickly and stably.

In the electrical inspection method, the imaging unit 12 is placed at the close position P1, and after the printed circuit board W is imaged from the normal direction by the imaging unit 12, when the electrical inspection head 10 rotates the imaging unit 12, the electrical inspection is performed. It can move to the avoidance position P<b>2 where it does not come into contact with the inspection head 10 . Therefore, the electrical inspection method can rotate the electrical inspection head 10 independently of the imaging unit 12 after imaging the printed circuit board W from the vicinity of the electrical inspection head 10 with the imaging unit 12 . As a result, the electrical inspection method can align the electrical inspection head 10 with respect to the printed circuit board W quickly and easily. Therefore, the electrical inspection method can perform the electrical inspection of the printed circuit board W quickly and stably.

[Other embodiments]
The above embodiments do not limit the configuration of the present invention. Therefore, in the embodiment, the components of each part of the embodiment can be omitted, replaced, or added based on the description of the present specification and common general technical knowledge, and all of them are interpreted as belonging to the scope of the present invention. should.

In the above embodiment, the configuration in which the moving mechanism moves the imaging unit in the normal direction of the printed circuit board has been described. However, in the electrical inspection apparatus, the moving direction of the imaging section is not limited to the normal direction of the printed circuit board. For example, the moving mechanism may move the imaging section in a planar direction of the printed circuit board. Further, the moving mechanism does not have to linearly move the imaging section. For example, the moving mechanism may pivotally move the imaging section in a planar direction of the printed circuit board.

In the above embodiment, the configuration in which the printed circuit board is held horizontally has been described. However, the holding direction of the printed circuit board can be changed according to the specifications of the device. Further, in the above embodiment, the configuration for gripping the corners of the printed circuit board with a gripper has been described, but the method for gripping the printed circuit board in the electrical inspection apparatus is not limited to the above configuration.

The specific configuration of the electrical inspection head is not limited to the configurations of the above-described embodiments. For example, the electrical inspection head can employ a configuration that does not have the aforementioned support plate. The structure without the support plate includes a structure without one or both of the bottom plate and the top plate. For example, when the electrical inspection head does not have the bottom plate, the thickness of the electrical inspection head can be determined by the total thickness of the base and the probes. In addition, the thickness of the probe here means the protruding length of the probe in the state before the electrical inspection.

As described above, it is preferable that the moving mechanism can move the imaging section independently of the electrical inspection head. However, if the electrical inspection apparatus can hold the imaging unit so as not to rotate in accordance with the rotation of the electrical inspection head, the imaging unit may move up and down in accordance with the electrical inspection head. is also possible.

The said embodiment demonstrated the structure by which the said electrical inspection head and the said imaging part are simultaneously positioned in the plane direction of the said printed circuit board by the said positioning mechanism. However, the electrical inspection apparatus may employ a configuration in which the electrical inspection head and the imaging section are separately positioned in the planar direction of the printed circuit board.

The said embodiment demonstrated the structure by which the said electrical inspection head is positioned in the plane direction of the said printed circuit board by the said positioning mechanism. However, the electrical inspection apparatus may be configured such that the electrical inspection head is positioned in the planar direction of the printed circuit board by moving the printed circuit board in the planar direction.

As described above, the electrical inspection apparatus according to one aspect of the present invention is suitable for quickly and easily aligning an electrical inspection head with respect to a printed circuit board.

1 electrical inspection device 10 electrical inspection head 11 rotating mechanism 12 imaging unit 13 moving mechanism 14 positioning mechanism 14a fixed rail 14b movable rail 14c movable body 15 lifting mechanism 16 housing 17 control unit 18 fixed member 21a probe 21b bottom plate 21c top plate 21d base Base 22 Imaging terminal 22a Optical element 31 Gripper R Rotational axis W Printed circuit board P1 Approach position P2 Avoidance position T1 Base thickness T2 Electrical inspection head thickness

Claims (7)

an electrical inspection head capable of contacting the printed circuit board from the normal direction;
a rotation mechanism for rotating the electrical inspection head around a rotation axis parallel to the normal direction;
an imaging unit having an optical element facing the printed circuit board in a normal direction and capable of capturing an image of the printed circuit board;
a movement mechanism that moves the imaging unit between an approach position and an avoidance position,
The close position is a position where the imaging unit can come into contact with the electrical inspection head when the electrical inspection head rotates,
The electrical inspection apparatus, wherein the avoidance position is a position where the imaging unit does not come into contact with the electrical inspection head when the electrical inspection head rotates. The electrical inspection apparatus according to claim 1, wherein the moving mechanism moves the imaging section independently of the electrical inspection head. 3. The electrical inspection apparatus according to claim 1, wherein the avoidance position is a position away from the proximity position in the normal direction of the printed circuit board. 1, wherein when viewed from the normal direction of the printed circuit board, the distance between the imaging section and the rotation axis at the close position is the same as the distance between the imaging section and the rotation axis at the avoidance position. The electrical inspection device according to claim 2 or 3. The electrical inspection apparatus according to any one of claims 1 to 4, further comprising a positioning mechanism capable of positioning the electrical inspection head in a planar direction of the printed circuit board. The electrical inspection apparatus according to claim 5, wherein the positioning mechanism simultaneously positions the electrical inspection head and the imaging section in the planar direction. an electrical inspection head capable of contacting the printed circuit board from the normal direction;
a rotation mechanism for rotating the electrical inspection head around a rotation axis parallel to the normal direction;
an imaging unit having an optical element facing the printed circuit board in a normal direction and capable of capturing an image of the printed circuit board;
Using an electrical inspection device comprising a movement mechanism for moving the imaging unit between an approach position and an avoidance position,
The proximity position is a position at which the imaging unit can come into contact with the electrical inspection head when the electrical inspection head is rotated, and the avoidance position is a position where the imaging unit can contact the electrical inspection head when the electrical inspection head is rotated. moving the imaging unit so that it is in a position where it does not come into contact with the inspection head;
Electrical inspection method.

Images