KR20180035132A - Mounting Method Of Electronic Component, Bonding Structure Of Electronic Component, Substrate Device, Display Device, And Display System - Google Patents

Abstract

The present invention relates to an electronic component mount method, an electronic component coupling structure, a substrate device, a display device, and a display system thereof. The present invention is for aligning the location of an electronic component and a substrate wiring pattern with high precision, accurately and stably coupling the substrate wiring pattern and the electronic component, increasing the electrical conductivity to suppress the connection resistance, stabilizing the quality, and easily executing the coupling operation. The method includes the steps of: arranging self-cohesive soldering units (140) including soldering particles (140b) and a heat-curable resin (140a) between end of a wiring unit (113) and connection electrodes (133) of the electronic component (130), adding film thickness regulating particles (165) made of a material with a higher melting point than the self-cohesive soldering units (140) between the electronic component (130) and the outer peripheral cross-section (110s) of a liquid crystal panel (110), and arranging a temporary bonding material (161) with a lower melting point than the soldering particles (140b) for configuring the self-cohesive soldering units (140); softening the temporary bonding material (161) at a temperature lower than the melting point of the temporary bonding material (161) and lower than the melting point of the soldering particles (140b) to temporarily bond the outer peripheral cross-section (110s) of the liquid crystal panel (110) and the electronic component (130); and heating the temporary bonding material (161) and the self-cohesive soldering units (140) while moving the connection electrode (133) and ends (113s) of the wiring unit (113) close together to bond the same.

Description

TECHNICAL FIELD [0001] The present invention relates to a mounting method of electronic components, a bonding structure of electronic components, a substrate device, a display device, and a display system,

TECHNICAL FIELD The present invention relates to a method of mounting electronic components on a cross section of a substrate, a bonding structure of electronic components, a substrate apparatus, a display apparatus, and a display system.

Electronic components constituting various electronic devices are generally mounted on the surface of a substrate by bonding a terminal portion provided on the electronic component to a wiring pattern formed on the surface of the substrate.

However, in such a configuration, the substrate protrudes to the outer circumferential side more than the electronic component, which leads to the miniaturization of the electronic device, the effective use of the space inside the case of the electronic device, and the like.

Thus, there is a case where the electronic component is connected or mounted on a cross section orthogonal to the surface on the outer peripheral portion of the substrate surface. As a related technique for mounting an electronic component on an end face of a substrate, it is known that a connector is provided on the end face of a substrate, and an electronic component is connected to this connector.

However, such a configuration requires a space for installing the connector. It can not be said that the miniaturization of the electronic device and the effective utilization of the space in the case are effectively realized.

On the other hand, for example, in Patent Document 1, a wiring pattern on the substrate side and a wiring connection portion on the electronic component side are connected to each other with an anisotropic conductive film (ACF) interposed between the outer peripheral end surface of the substrate and the electronic component A method has been proposed. The anisotropic conductive film is a film in which conductive particles are dispersed in a thermosetting resin. The conductive particles of the anisotropic conductive film sandwiched between the outer peripheral end face of the substrate and the electronic component electrically conduct the electrical connection between the board side wiring pattern and the electronic component side wiring connection portion.

However, when the anisotropic conductive film is used as in the configuration disclosed in Patent Document 1, electrical conduction is established by the conductive particles physically coming into contact with the substrate side wiring pattern and the electronic component side wiring connection portion. However, since the conductive particles are dispersed in the thermosetting resin The connection resistance tends to increase.

Further, between the substrate and the electronic component, portions other than the bonding portions of the substrate-side wiring pattern and the electronic-component-side wiring connection portion are insulated, but conductive particles dispersed in the thermosetting resin constituting the anisotropic conductive film are also interposed therebetween. Therefore, the insulating property at the portion other than the bonding portion between the substrate-side wiring pattern and the electronic-component-side wiring connection portion is also deteriorated.

In addition, in recent years, for example, in a display device, the display image has become finer (finer) and the pitch (interval) of the substrate side wiring pattern has narrowed to, for example, 100 μm or less. When such an interconnection pattern having a narrow pitch is used, problems such as an increase in connection resistance and a decrease in insulation due to the use of the anisotropic conductive film become more significant.

Therefore, it is required to increase the electrical continuity while suppressing the connection resistance while firmly bonding the electronic component to the end surface of the substrate.

Patent Document 1: JP-A-2012-226058

However, in the case of connecting the wiring connection portion of the electronic component to the substrate having the narrow pitch wiring pattern as described above, high positioning accuracy of the wiring pattern on the substrate side and the wiring connection portion on the electronic component side is required.

However, when the substrate-side wiring pattern and the electronic component-side wiring connection portion are bonded to each other, the substrate-side wiring pattern and the electronic component-side wiring connection portion may be deviated.

Further, in the case of connecting the wiring connection portions of the electronic parts by soldering to the substrate having the narrow pitch wiring pattern as described above, if the electronic parts are strongly stuck to the substrate, the gap between the liquid crystal panel and the electronic parts becomes narrow, It is pushed out. As a result, solder pushed out to the outer circumferential side may short-circuited to another adjacent electrode or the like to be a defective product.

Therefore, it is necessary to control the pressure applied to the electronic component and the substrate junction with high accuracy.

Disclosure of the Invention An object of the present invention is to provide an electronic component capable of easily aligning electronic components with high accuracy in alignment with a wiring pattern of a substrate to firmly and firmly bond them and to enhance electrical conductivity, A method of mounting an electronic part, a bonding structure of an electronic part, a substrate device, a display device, and a display system.

The present invention is characterized in that the electronic component side wiring connection portion of the electronic component is opposed to the outer peripheral end face of the substrate laminate having the two substrates facing each other and the wiring provided between the two substrates, Wherein a magnetic cohesive solder containing a thermosetting resin and solder particles is interposed between the component side wiring connecting portion and the substrate side wiring connecting portion provided at the end portion of the wiring and between the outer peripheral end face of the substrate laminate and the electronic component, A step of interposing a bonding material comprising a particulate material made of a material having a melting point higher than that of the coagulated solder and made of a material having a melting point lower than that of the solder particles constituting the magnetically agglomerated solder; Is lower than the melting point of the solder particles and is lower than the melting point of the bonding material A step of softening the bonding material to bond the electronic component and the peripheral end face of the substrate to each other; and a step of bonding the electronic component side wiring connecting portion and the substrate side wiring connecting portion to each other while heating the magnetic cohesive solder and the bonding material And a step of pressing and bonding in a direction of approaching the electronic component.

The particulate material may be formed of any one of glass, silica, and hardened plastic.

The bonding material may be arranged around the magnetic cohesive solder interposed between the electronic component side wiring connection portion and the substrate side wiring connection portion between the outer peripheral end face of the substrate laminate and the electronic component.

The bonding material may be provided in advance on at least one of the outer peripheral end surface of the substrate laminate and the electronic component.

The bonding material may be provided on both of the two substrates on the outer peripheral end face of the substrate laminate.

The soldering material may be made of a resin material having a melting point lower than that of the solder particles constituting the magnetically agglomerated solder.

The substrate-side wiring connection portion may be a bonding pad which is connected to the end portion of the wiring and is formed of a conductive material formed along the outer peripheral end face of the substrate laminate.

The substrate-side wiring connection portion may be provided with a step of exposing the wiring exposed between the two substrates.

The self-cohesive solder may be applied to the substrate-side wiring connection portion in paste form.

The self-agglomerated solder on the paste may be applied by any one of screen printing, printing using a mesh mask, and ink jetting.

The electronic component may include a film-like substrate having the electronic-component-side wiring connection portion and a chip component mounted on the film-like substrate.

The wiring having the substrate-side wiring connection portion may be formed on at least one of the two substrates and on the outer peripheral portion.

The two substrates may be at least one of a glass substrate, a resin substrate, and a printed substrate.

At least one display portion of a liquid crystal display, an organic light emitting diode display, or a plasma display panel display device may be formed by the substrate laminate and the electronic component joined to the outer peripheral end face of the substrate laminate.

The present invention is a wiring board comprising: a substrate laminate having two substrate opposing each other and a substrate-side wiring connection portion at an end portion of the wiring provided between the two substrates; and an electronic component side wiring connection portion And a bonding portion for bonding the electronic component to the outer peripheral surface of the substrate laminate, wherein the bonding portion includes: a solder bonding portion interposed between the substrate-side wiring connection portion and the electronic component-side wiring connection portion; A resin adhering portion for adhering the electronic component to the outer peripheral end face of the substrate stacked body at a portion other than the solder joint portion; and a resin adhesive portion provided between the outer peripheral end face of the substrate stack and the electronic component, And a solder joint portion provided inside the low melting point joint portion, And a solder film thickness defining portion formed from a material having a high melting point and having a size corresponding to the thickness of the solder joint portion in the direction in which the board-side wire interconnecting portion and the electronic component- Thereby providing a bonding structure.

The solder film thickness defining portion may be formed of any one of glass, silica, and hardened plastic.

The substrate-side wiring connection portion may be a bonding pad which is connected to the end portion of the wiring and is formed of a conductive material formed along the outer peripheral end face of the substrate laminate.

The substrate-side wiring connection portion may be provided with a step of exposing the wiring exposed between the two substrates.

The thickness of the solder joint portion may be 20 占 퐉 or less.

The distance between the substrate-side wiring connection portions adjacent to each other with a plurality of the above-mentioned substrate-side wiring connection portions may be 10 to 100 mu m.

The present invention provides a substrate apparatus having a bonding structure of the above-described electronic component.

The present invention provides a display device having the above substrate device.

The present invention provides a display system in which a plurality of the above-described display devices are arranged adjacently in the longitudinal direction and in the transverse direction, respectively.

According to the present invention, the following effects can be obtained.

That is, it is possible to align the electronic components with high precision with respect to the wiring pattern of the substrate, firmly and surely bond them to each other, thereby improving the electrical conductivity, restraining the connection resistance, stabilizing the quality, and facilitating the bonding work.

1 is a cross-sectional view showing a part of a configuration of a display device according to a first embodiment of the present invention.
2 is a plan view showing a part of the display device.
3 is a view showing electronic components constituting the display device.
4 is a side view showing a liquid crystal panel in which a bonding pad is formed on an outer peripheral end face.
5 is a plan sectional view showing a state in which an electronic component is attached to an outer peripheral end face of a liquid crystal panel coated with a self-cohesive solder.
6 is a plan sectional view showing a state in which the self-agglomerated solder starts to agglomerate the solder particles.
7 is a plan sectional view showing a state in which the solder particles of the self-agglomerated solder are magnetically agglomerated and the peripheral edge of the liquid crystal panel and the electronic component are bonded.
8 is a perspective view showing a display system constructed from the display device.
9 is a cross-sectional view showing a state in which an outer peripheral end surface of a liquid crystal panel and an electronic component are bonded together by a bonding material.
10 is a cross-sectional view showing a part of the configuration of a display device according to a second embodiment of the present invention.
11 is a plan view showing a part of the display device.
12 is a cross-sectional view showing a state in which an outer peripheral end surface of a liquid crystal panel and an electronic component are bonded together by a bonding material.

Hereinafter, the present invention will be described in detail with reference to the drawings.

≪ First Embodiment >

1 is a cross-sectional view showing a part of a configuration of a display device according to a first embodiment of the present invention. 2 is a plan view showing a part of the display device. 3 is a view showing electronic components constituting the display device. 4 is a side view showing a liquid crystal panel in which a bonding pad is formed on an outer peripheral end face. 5 is a plan sectional view showing a state in which an electronic component is attached to an outer peripheral end face of a liquid crystal panel coated with a self-cohesive solder. 6 is a plan sectional view showing a state in which solder particles of the self-cohesive solder start to coagulate. 7 is a plan sectional view showing a state in which the solder particles of the self-agglomerated solder are magnetically agglomerated and the outer peripheral end surface of the liquid crystal panel is bonded to the electronic component. 8 is a perspective view showing a display system constructed from the display device. Fig. 9 is a cross-sectional view showing a state in which an outer peripheral end surface of the liquid crystal panel and an electronic component are bonded together by a bonding material.

1 and 2, the display device 100A includes a liquid crystal panel (substrate laminate, substrate device) 110, a light source unit (not shown) for providing light to the liquid crystal panel 110, And a light guide unit (not shown) for guiding the emitted light to the back surface of the liquid crystal panel 110.

The liquid crystal panel 110 includes a first substrate 111, a second substrate 112 disposed opposite to the first substrate 111, and a second substrate 112 disposed between the first substrate 111 and the second substrate 112 And a liquid crystal layer (not shown) disposed on the substrate.

The first substrate 111 and the second substrate 112 are each made of a glass substrate, a resin substrate, or a printed substrate.

In at least one of the first substrate 111 and the second substrate 112 (the first substrate 111 in the example of FIG. 1), a signal line composed of a data line and a gate line (not shown) A plurality of wiring portions (wirings) 113 having a plurality of transistors (not shown) are provided. The wiring portion 113 drives the liquid crystal of the liquid crystal layer between the first substrate 111 and the second substrate 112 to form a display image (image) in the liquid crystal panel 110. The wiring portion 113 can be formed by a single layer structure of a single body of a low-resistance conductive material such as aluminum (Al) or copper (Cu). The wiring portion 113 is formed by a laminated structure of a single body of low resistance conductive material such as aluminum (Al) or copper (Cu) and a single body of materials such as chromium (Cr), molybdenum (Mo), titanium You may.

The end portion 113e of each wiring portion 113 is electrically connected to the lead portion of the wiring portion 113 by a conductive material such as tin (Sn), lead (Pb), silver (Ag) It can be formed by a monolayer structure. The end portion 113e of the wiring portion 113 is made of a single material of a conductive material such as tin (Sn), lead (Pb), zinc (Zn), silver (Ag) (Cr), molybdenum (Mo), titanium (Ti), or the like.

In the liquid crystal panel 110 as described above, the outer peripheral end face 111s of the first substrate 111 and the outer peripheral end face 112s of the second substrate 112 are provided so as to be located in the same plane. The outer peripheral end surface 111s of the first substrate 111 and the outer peripheral end surface 112s of the second substrate 112 are arranged on the display surface 110f at the outer peripheral portion of the display surface 110f of the liquid crystal panel 110 And an outer peripheral face 110s orthogonal thereto is formed.

The electronic component 130 is mounted on the outer peripheral face 111s of the liquid crystal panel 110. [ 1 and 3, the electronic component 130 includes a film-like wiring board (film-like substrate) 131 made of COF (Chip on Film) for mounting and a surface 131f of the wiring board 131, For example, a chip component 132 such as an LSI (Large Scale Integration). A plurality of connection electrodes (electronic component side wiring connection portions) 133 are formed on the surface 131f of the wiring substrate 131 so as to be connected to the wiring portions 113 of the liquid crystal panel 110. The connection electrode 133 is formed of a conductive material such as tin (Sn), lead (Pb), zinc (Zn), silver (Ag), copper (Cu)

In order to mount the electronic component 130 on the end portion 113e of each wiring portion 113 located between the first substrate 111 and the second substrate 112 as shown in Figs. 1 and 4, And a bonding pad (substrate-side wiring connection portion) 200 are bonded. The bonding pads 200 are formed in a strip shape extending on the first substrate 111 side and the second substrate 112 side along the outer peripheral end face 110s of the liquid crystal panel 110. [ The bonding pad 200 is formed of a conductive material such as tin (Sn), lead (Pb), zinc (Zn), silver (Ag), copper (Cu)

The bonding pad 200 is preferably formed using a paste or nano ink of silver (Ag), copper (Cu), or the like, using screen printing, printing using a mesh mask, or inkjet do. The bonding pad 200 is preferably formed to have a width of 10 to 100 μm, a length of 0.1 to 1 mm, and a thickness of 10 to 1000 nm, for example.

1 and 2, the electronic component 130 is solder-bonded to the bonding pad 200 provided on the outer peripheral end face 110s of the liquid crystal panel 110 by using the self-cohesive solder 140 . 5, the self-agglomerated solder 140 includes a thermosetting resin 140a and solder particles 140b made of a solder alloy material containing copper (Cu), tin (Sn) or the like in the thermosetting resin 140a ) Are uniformly dispersed in a paste-like material. The thermosetting resin 140a is formed from a material having a melting point lower than that of the solder particles 140b. As the material for forming the thermosetting resin 140a, for example, an epoxy resin, a urethane resin, an acrylic resin, a silicone resin, a phenol resin, a melamine resin and an alkyd resin having a melting point of 90 캜 to 150 캜 Resin, urea resin, unsaturated polyester resin, or the like. Here, the material forming the thermosetting resin 140a is one that exhibits fluidity when the melting point or more is reached.

Examples of the self-agglomerated solder 140 include reflow soldering anisotropic conductive paste EPOWELL, AP series (manufactured by SEKISUI CHEMICAL CO., LTD.), Trade name 'Low-Temperature-Curable conductive Ltd.) can be preferably used.

Solder particles 140b included in the self-agglomerated solder 140 are formed on the top and bottom (periphery) of the self-cohesive solder 140 joining the outer peripheral end face 110s of the liquid crystal panel 110 and the electronic component 130 (Low melting point bonding portion) 160 made of a low melting point resin material having a melting point lower than the melting point of the solder alloy material to be formed. The resin bonding portion 160 is formed of an epoxy resin, a urethane resin, an acrylic resin, a silicone resin, a phenol resin, a melamine resin, an alkyd resin, a urea resin, an unsaturated A polyester resin or the like. The low melting point resin material forming the resin bonding portion 160 is bonded to the outer peripheral end face 110s of the liquid crystal panel 110 by the magnetic cohesive solder 140 It is thermally cured when heated to a temperature not lower than the melting point of the resin bonding portion 160 in order to perform the solder bonding so that the electronic component 130 and the outer peripheral end face 110s of the liquid crystal panel 110 are kept in a bonded state.

The resin bonding portion 160 is provided with film thickness specifying particles (particulate material, solder film thickness specifying portion 165) for defining the film thickness of the self-cohesive solder 140. In this embodiment, the film thickness defining particles 165 are in the form of particles, and are interposed between the outer peripheral end surface 110s of the liquid crystal panel 110 and the wiring substrate 131 of the electronic component 130. Therefore, the film thickness defining particles 165 are formed in such a manner that the film thickness of the magnetic cohesive solder 140, the thickness of the connection electrode 133 formed on the wiring board 131 of the electronic component 130, And has a particle size that agrees with the sum of the film thicknesses.

The film thickness defining particles 165 are formed of a material having a melting point higher than the melting point of the resin bonding portion 160 and the magnetic cohesive solder 140. Here, as the material for forming the film thickness defining particles 165, for example, glass, silica, hardened plastic, or the like can be used.

In order to bond the electronic component 130 to the bonding pad 200 provided on the outer peripheral end face 110s of the liquid crystal panel 110 using the self-cohesive solder 140, the self-cohesive solder 140 is bonded to the bonding pad 200, Is applied to the outer peripheral face 110s of the base 110. For example, a pattern forming technique such as screen printing, printing using a mesh mask, and inkjet method capable of minute ejection of the self-cohesive solder 140 can be used.

4 and 9, the bonding material 161 is applied to the upper and lower surfaces of the self-cohesive solder 140 on the outer peripheral face 110s of the liquid crystal panel 110. [

The bonding material 161 finally forms the resin bonding portion 160. Therefore, the crimping material 161 is made of the same material as the resin crimping portion 160. The bonding material 161 is mixed with the predetermined thickness of the film thickness defining particles 165 in a dispersed state.

At this time, the joining material 161 is formed such that the thickness in the direction in which the outer peripheral end face 110s of the liquid crystal panel 110 and the electronic component 130 face each other is larger than the coating thickness of the self-cohesive solder 140 . The joining material 161 provided on the outer peripheral end face 110s of the liquid crystal panel 110 is surely brought into contact with the electronic component 130 at the time of joining to be described later.

Further, since the bonding material 161 spreads vertically above the application region when the self-cohesive solder 140 is thermocompression bonded, it is preferable that the bonding material 161 is provided at a position that does not interfere with the self-cohesive solder 140 in consideration of this diffusion.

The bonding material 161 is bonded to the peripheral surface of the liquid crystal panel 110 in such a manner that the outer peripheral end face 110s of the liquid crystal panel 110 and the wiring board 131 of the electronic component 130 are bonded in parallel It is desirable to install it. Therefore, the bonding material 161 may be provided so as to surround the entire periphery of the application region of the self-cohesive solder 140.

The joining material 161 may be provided linearly in the direction along the display face 110f of the liquid crystal panel 110 or intermittently in the direction along the display face 110f of the liquid crystal panel 110 It may be installed in a shape.

The bonding material 161 may be provided in advance before the application of the self-cohesive solder 140 at the time of manufacturing the liquid crystal panel 110. When the electronic part is bonded to the liquid crystal panel 110, ) May be provided before or after the application of the coating liquid. Further, the joining material 161 may be attached to the outer peripheral end face 110s of the liquid crystal panel 110 by previously molding the joining material 161 into a predetermined shape.

The connection pad 200 provided on the outer peripheral end face 110s of the liquid crystal panel 110 and the connection pad 200 formed on the wiring board 131 of the electronic component 130 are bonded to each other after the application of the magnetic cohesive solder 140 and the attaching material 161, (133) are aligned with a predetermined precision.

The joining material 161 is heated to a temperature lower than the melting point of the solder particles 140b and lower than the melting point of the joining material 161 by using the same thermocompression bonding apparatus as used in the joining method using the anisotropic conductive film. Then, the self-cohesive solder 140 is not melted and the binding material 161 is softened.

Thereafter, the heating of the bonding material 161 is stopped. The bonding material 161 is hardened and the bonding pad 200 provided on the outer peripheral end face 110s of the liquid crystal panel 110 and the bonding pads 200 on the wiring board 131 of the electronic component 130 The electronic component 130 is bonded to the outer peripheral face 110s of the liquid crystal panel 110 in a state in which the connection electrode 133 formed on the liquid crystal panel 110 is aligned.

In this state, the film thickness defining particles 165 remain dispersed in the bonding material 161.

Next, the outer peripheral end face 110s of the liquid crystal panel 110 and the electronic component 130 are heated while being pressed in a direction approaching each other by using the same thermocompression bonding apparatus as that used in the bonding method using the anisotropic conductive film. As shown in Fig. 1, when the outer peripheral face 110s of the liquid crystal panel 110 and the electronic component 130 are pressed toward each other in this manner, the film thickness defining particles 165 in the bonding material 161, And contacts both the outer peripheral end surface 110s of the liquid crystal panel 110 and the electronic component 130. [ This defines the distance between the outer peripheral end surface 110s of the liquid crystal panel 110 and the wiring substrate 131 of the electronic component 130 and the thickness of the self-cohesive solder 140 is also specified.

A predetermined pressure, temperature, and time are applied to the self-cohesive solder 140 in this manner. For example, a predetermined pressure is applied to the magnetic cohesive solder 140 at 150 DEG C for 15 minutes.

6, the thermosetting resin 140a and the solder particles 140b constituting the self-cohesive solder 140 are melted to form the solder particles 140b in the thermosetting resin 140a having fluidity ) Are closer to the bonding pad (200) and the connection electrode (133). Finally, as shown in Fig. 7, the solder particles 140b magnetically aggregate between the bonding pads 200 made of a metal and the connection electrodes 133, and are metal-bonded. As a result, the bonding pad 200 of the liquid crystal panel 110 and the connection electrode 133 of the electronic component 130 are soldered by the solder metal (solder joint H) formed of a plurality of solder particles 140b which are melted and agglomerated, do. The melted thermosetting resin 140a is gathered between the bonding pads 200 and the connecting electrodes 133 which are adjacent to each other so that the wiring substrate 131 of the electronic component 130 and the outer peripheral surface of the liquid crystal panel 110 (Resin adhering portion, P) made of a thermosetting resin 140a.

After the thermocompression bonding, the joining of the electronic component 130 to the outer peripheral face 110s of the liquid crystal panel 110 is completed.

In addition, in the process of heating and pressing the self-cohesive solder 140 by the above-described thermocompression bonding, the joining material 161 is heated to a temperature not lower than the melting point of the joining material 161 and melted, followed by cooling. At this time, the bonding material 161 heated to a temperature higher than the melting point is thermally cured to maintain the bonding state between the electronic component 130 and the outer peripheral end face 110s of the liquid crystal panel 110.

The bonding pad 200 provided on the outer peripheral end face 110s of the liquid crystal panel 110 and the connection electrode 133 formed on the wiring board 131 of the electronic component 130 are bonded to each other by the magnetic cohesive solder 140, And selectively connected by a solder metal (H) of a solder metal (H). The outer peripheral end surface 110s of the liquid crystal panel 110 and the wiring board 131 of the electronic component 130 are mechanically connected to each other by metallic bonding by the solder metal H and bonding by the insulating resin P Respectively.

The peripheral edge surface 110s of the liquid crystal panel 110 mechanically bonded by the solder metal H and the insulating resin P and the wiring board 131 of the electronic component 130 are bonded to each other by 500 g / cm. < / RTI >

The wiring board 131 of the electronic component 130 and the outer peripheral end face 110s of the liquid crystal panel 110 are also mechanically bonded to each other by the resin bonding portion 160 formed as the bonding material 161 is cured.

The solder metal H formed between the bonding pad 200 provided on the outer peripheral face 110s of the liquid crystal panel 110 and the connection electrode 133 formed on the wiring board 131 of the electronic component 130 The thickness is preferably 20 μm or less, for example.

The electrode pitch of the connection pads 200 provided on the outer peripheral end face 110s of the liquid crystal panel 110 and the connection electrodes 133 formed on the wiring board 131 of the electronic component 130 can be 10 to 100 mu m have.

As shown in Figs. 1 and 2, a bezel 150 for forming an outer frame of the display device 100A is provided on the outer periphery of the liquid crystal panel 110 in which the electronic component 130 is mounted in this manner . The bezel 150 includes a side plate portion 150a positioned on the outer peripheral side of the outer peripheral edge 110s of the liquid crystal panel 110 and a side plate portion 150b extending from one end of the side plate portion 150a toward the inside of the liquid crystal panel 110, And a front plate portion 150b along the outer peripheral portion of the display surface 110f of the liquid crystal panel 110. [ The electronic component 130 is accommodated between the side plate portion 150a of the bezel 150 and the outer peripheral edge 110s of the liquid crystal panel 110. [

The width w of the bezel 150 can be reduced by bonding the outer peripheral end surface 110s of the liquid crystal panel 110 and the wiring board 131 of the electronic component 130 as described above. That is, the display device 100A may be a narrow bezel having a small width w of the bezel 150. [

Furthermore, as shown in Fig. 8, the display system 1 can be configured by using a plurality of narrow-bezel display devices 100A as described above. The display system 1 includes a plurality of display devices 100A which are juxtaposed in the vertical and lateral directions so as to be adjacent to each other. In the display area A formed by the plurality of display devices 100A, Display the image.

In this display system 1, since the respective display devices 100A are narrow-bezels, the gaps between the adjacent display devices 100A in the vertical direction or the horizontal direction can be narrowed, Thus, it becomes possible to perform image display and image display with less discomfort.

According to the mounting method of the electronic component 130 as described above, the first substrate 111, the second substrate 112, the first substrate 111, and the second substrate 112 The connection electrode 133 of the electronic component 130 is opposed to the outer peripheral end surface 110s of the liquid crystal panel 110 having the bonding pad 200 at the end portion 113e of the electronic component 130 Cohesive solder 140 including a thermosetting resin 140a and solder particles 140b is interposed between the connection electrode 133 of the liquid crystal panel 110 and the bonding pad 200 of the liquid crystal panel 110, Thickness defining particles 165 made of a material having a melting point higher than that of the magnetic cohesive solder 140 and the solder particles 140b constituting the magnetic cohesive solder 140 are provided between the electronic part 130 and the electronic part 130, Bonding material 161 made of a material having a lower melting point than the melting point of the solder particles 140b; A step of bonding the electronic component 130 and the outer peripheral end face 110s of the liquid crystal panel 110 by softening the bonding material 161 at a temperature lower than the melting point of the material 161 and the step of bonding the magnetic cohesive solder 140 and And a step of pressing and joining the connection electrode 133 and the bonding pad 200 in a direction approaching each other while heating the bonding material 161.

With this configuration, when the electronic component 130 is bonded to the outer peripheral end face 110s of the liquid crystal panel 110, the outer peripheral end face 110s of the liquid crystal panel 110, The gap of the wiring board 131 of the electronic component 130 is defined, so that the thickness of the solder metal H, that is, the thickness of the solder film can be specified. Therefore, while the electronic component 130 is reliably bonded to the outer peripheral end surface 110s of the liquid crystal panel 110, the self-cohesive solder 140 protrudes to the outer periphery side due to an excessive pressure applied to the self-cohesive solder 140 And the quality can be stabilized. Further, since high precision is not required for the pressure control applied when the electronic component 130 is bonded to the outer peripheral end face 110s of the liquid crystal panel 110, the bonding operation can be easily performed.

Since the electronic component 130 and the outer peripheral end face 110s of the liquid crystal panel 110 are joined together by the bonding material 161 prior to soldering by the magnetic cohesive solder 140, 133 and the bonding pad 200 can be aligned with high accuracy.

The electronic component 130 and the liquid crystal panel 110 are joined together by the joining material 161 and then the joining by the magnetic cohesive solder 140 is performed so that the joining of the electronic component 130 and the liquid crystal panel 110 The joining operation can be performed efficiently.

If the joining by the joining material 161 is performed and then the joining by the magnetic cohesive solder 140 is carried out, the joining material 161 is softened by heating again, 133 and the bonding pad 200 can be aligned.

The solder particles 140b constituting the self-agglomerated solder 140 are agglomerated and soldered between the connection electrode 133 of the electronic component 130 and the bonding pad 200. As a result, the amount of the conductive material interposed between the connection electrode 133 of the electronic component 130 and the bonding pad 200 is increased, and the connection electrode 133 of the electronic component 130 is increased in comparison with the case of using the anisotropic conductive film. And the connection pad 200 can be prevented from increasing.

The electronic component 130 and the outer peripheral end surface 110s of the liquid crystal panel 110 are electrically connected to each other by metal bonding by the solder metal H made of the solder particles 140b of the self- And is bonded mechanically by adhesion with an insulating resin (P) made of a resin. The electronic component 130 and the outer peripheral end surface 110s of the liquid crystal panel 110 are also bonded to each other by the resin bonding portion 160 and the bonding material 161 around the self-cohesive solder 140. Further, Therefore, it is possible to strongly bond the electronic component 130 and the liquid crystal panel 110 to each other.

According to the junction structure of the electronic component 130, the liquid crystal panel 110, the display device 100A and the display system 1 as described above, the first substrate 111 and the second substrate 112 A liquid crystal panel 110 having a bonding pad 200 at an end portion 113e of a wiring portion 113 provided between a first substrate 111 and a second substrate 112, An electronic component 130 having a connection electrode 133 opposed to a cross section 110s and a junction J connecting the outer circumferential section 110s of the liquid crystal panel 110 and the electronic component 130, The joining portion J is formed of a solder metal H interposed between the bonding pad 200 and the connection electrode 133 and an outer peripheral end face 110s of the liquid crystal panel 110 at a portion other than the solder metal H, A resin junction P made of a material having a lower melting point than the solder metal H is provided between the outer peripheral end surface 110s of the liquid crystal panel 110 and the electronic component 130, And the solder metal (H) in the direction in which the bonding pad (200) and the connection electrode (133) are opposed to each other, Thickness regulating particle 165 having a particle diameter corresponding to the thickness of the metal (H).

With such a configuration, the electronic component 130 can be firmly and firmly bonded to the outer peripheral end surface 110s of the liquid crystal panel 110, thereby enhancing the electrical conductivity, restraining the connection resistance and stabilizing the quality, So that it can be easily performed.

≪ Second Embodiment >

Next, a second embodiment of the present invention will be described. In the second embodiment described below, the same components as those in the first embodiment are denoted by the same reference numerals and the description thereof is omitted.

10 is a cross-sectional view showing a partial structure of a display device according to a second embodiment of the present invention. 11 is a plan view showing a part of the display device. 12 is a cross-sectional view showing a state in which an outer peripheral end surface of a liquid crystal panel and an electronic component are bonded together by a bonding material.

10 and 11, the display device 100B includes a liquid crystal panel (substrate laminate, substrate device) 110, a light source unit (not shown) for providing light to the liquid crystal panel 110, And a light guide unit (not shown) for guiding the emitted light to the back surface of the liquid crystal panel 110.

The liquid crystal panel 110 includes a first substrate 111, a second substrate 112 disposed opposite to the first substrate 111, and a second substrate 112 disposed between the first substrate 111 and the second substrate 112 And a liquid crystal layer (not shown) disposed on the substrate.

The first substrate 111 and the second substrate 112 are each made of a glass substrate, a resin substrate, or a printed substrate.

At least one of the first substrate 111 and the second substrate 112 (the first substrate 111 in the example of FIG. 1) is provided with a signal wiring made up of a data line and a gate line (not shown) (Wirings) 113 including a transistor (not shown) are provided. The wiring portion 113 drives the liquid crystal of the liquid crystal layer between the first substrate 111 and the second substrate 112 to form a display image (image) in the liquid crystal panel 110. The wiring portion 113 can be formed by a single layer structure of a single body of a low-resistance conductive material such as aluminum (Al) or copper (Cu). The wiring portion 113 is formed by a laminated structure of a single body of low resistance conductive material such as aluminum (Al) or copper (Cu) and a single body of materials such as chromium (Cr), molybdenum (Mo), titanium You may.

The end portion 113s of each wiring portion 113 is electrically connected to the lead portion of the wiring portion 113 by a conductive material such as tin (Sn), lead (Pb), silver (Ag) It can be formed by a monolayer structure. The end portion 113e of the wiring portion 113 is made of a single material of a conductive material such as tin (Sn), lead (Pb), zinc (Zn), silver (Ag) (Cr), molybdenum (Mo), titanium (Ti), or the like.

In the liquid crystal panel 110 as described above, the outer peripheral end face 111s of the first substrate 111 and the outer peripheral end face 112s of the second substrate 112 are provided so as to be located in the same plane. The outer peripheral end surface 111s of the first substrate 111 and the outer peripheral end surface 112s of the second substrate 112 are arranged on the display surface 110f at the outer peripheral portion of the display surface 110f of the liquid crystal panel 110 And an outer peripheral face 110s orthogonal thereto is formed.

An end portion (a substrate-side wiring connection portion) 113s of the wiring portion 113 is formed on an outer peripheral end face 110s of the liquid crystal panel 110 in such a manner that the outer peripheral end face 111s of the first substrate 111 and the second substrate 112 And is exposed on the same plane as the outer peripheral end face 112s.

The electronic component 130 is mounted on the outer peripheral face 111s of the liquid crystal panel 110. [ The electronic component 130 is mounted on a film-like wiring board (film-like substrate) 131 made of COF (Chip on Film) for mounting and a wiring board 131 on the surface 131f of the wiring board 131, And a chip component 132 such as an integrated circuit. A plurality of connection electrodes (electronic component side wiring connection portions) 133 are formed on the surface 131f of the wiring substrate 131 so as to be connected to the wiring portions 113 of the liquid crystal panel 110. The connection electrode 133 is formed of a conductive material such as tin (Sn), lead (Pb), zinc (Zn), silver (Ag), copper (Cu) The connection electrodes 133 are elongated in the direction in which the first substrate 111 and the second substrate 112 face each other than the end portions 113s.

The electronic component 130 is solder-bonded to the end portion 113s of the wiring portion 113 exposed on the outer peripheral face 110s of the liquid crystal panel 110 by using the self-cohesive solder 140. [ 5, the self-agglomerated solder 140 includes a thermosetting resin 140s and solder particles 140b made of a solder alloy material containing copper (Cu), tin (Sn) or the like in the thermosetting resin 140a ) Are dispersed uniformly in a paste form or the like. The thermosetting resin 140a is formed from a material having a melting point lower than that of the solder particles 140b. As the material for forming the thermosetting resin 140a, for example, an epoxy resin, a urethane resin, an acrylic resin, a silicone resin, a phenol resin, a melamine resin and an alkyd resin having a melting point of 90 캜 to 150 캜 Resin, urea resin, unsaturated polyester resin, or the like. Here, the material forming the thermosetting resin 140a is one that exhibits fluidity when the melting point or more is reached.

Examples of the self-agglomerated solder 140 include reflow soldering anisotropic conductive paste EPOWELL, AP series (manufactured by SEKISUI CHEMICAL CO., LTD.), Trade name 'Low-Temperature-Curable conductive Ltd.) can be preferably used.

The upper and lower surfaces of the magnetic cohesive solder 140 joining the outer peripheral end surface 110s of the liquid crystal panel 110 and the electronic component 130 are respectively formed of a low melting point resin material having a melting point lower than the melting point of the self- The resin bonding portion 160 is formed. The resin bonding portion 160 is formed of an epoxy resin, a urethane resin, an acrylic resin, a silicone resin, a phenol resin, a melamine resin, an alkyd resin, a urea resin, an unsaturated A polyester resin or the like. The low melting point resin material forming the resin bonding portion 160 is bonded to the outer peripheral end face 110s of the liquid crystal panel 110 by the magnetic cohesive solder 140 It is thermally cured when heated to a temperature not lower than the melting point of the resin bonding portion 160 in order to perform the solder bonding so that the electronic component 130 and the outer peripheral end face 110s of the liquid crystal panel 110 are kept in a bonded state.

The resin bonding portion 160 is provided with film thickness specifying particles 165 for defining the film thickness of the self-cohesive solder 140. In this embodiment, the film thickness defining particles 165 are in the form of particles, and the end portions 113s of the wiring portions 113 exposed to the outer peripheral face 110s of the liquid crystal panel 110 and the end portions 113s of the wiring portions 113s of the electronic components 130 And the connection electrode 133 formed on the substrate 131. Therefore, the film thickness defining particles 165 have a particle size that agrees with the film thickness of the self-cohesive solder 140.

The film thickness defining particles 165 are formed of a material having a melting point higher than the melting point of the resin bonding portion 160 and the magnetic cohesive solder 140. Here, as the material for forming the film thickness defining particles 165, for example, glass, silica, hardened plastic, or the like can be used.

In order to solder the electronic component 130 to the end portion 113s exposed to the outer peripheral end face 110s of the liquid crystal panel 110 using the self-cohesive solder 140, the self- Is applied to the outer peripheral face 110s of the base 110. For example, when the magnetic cohesive solder 140 is in a paste form, a pattern forming technique such as screen printing, printing using a mesh mask, and inkjet method capable of minute ejection of the self-cohesive solder 140 can be used.

12, the bonding material 161 is applied on the upper and lower surfaces of the self-cohesive solder 140 in the outer peripheral end face 110s of the liquid crystal panel 110. [

The bonding material 161 finally forms the resin bonding portion 160. Therefore, the crimping material 161 is made of the same material as the resin crimping portion 160. The bonding material 161 is mixed with the predetermined thickness of the film thickness defining particles 165 in a dispersed state.

At this time, the joining material 161 is formed such that the thickness in the direction in which the outer peripheral end face 110s of the liquid crystal panel 110 and the electronic component 130 face each other is larger than the coating thickness of the self-cohesive solder 140 . The joining material 161 provided on the outer peripheral end face 110s of the liquid crystal panel 110 is surely brought into contact with the electronic component 130 at the time of joining to be described later.

Further, since the bonding material 161 spreads vertically above the application region when the self-cohesive solder 140 is thermocompression bonded, it is preferable that the bonding material 161 is provided at a position that does not interfere with the self-cohesive solder 140 in consideration of this diffusion. The bonding material 161 may be provided at a position overlapping the connection electrode 133 of the electronic component 130 as shown in Fig. 12 or may be provided at a position not overlapping with the connection electrode 133 .

The bonding material 161 is provided on the upper and lower portions of the application region of the self-cohesive solder 140 in order to join the outer peripheral end surface 110s of the liquid crystal panel 110 and the wiring substrate 131 of the electronic component 130 in parallel. . Therefore, the bonding material 161 may be provided so as to surround the entire periphery of the application region of the self-cohesive solder 140.

The joining material 161 may be provided linearly in the direction along the display face 110f of the liquid crystal panel 110 or intermittently in the direction along the display face 110f of the liquid crystal panel 110 It may be installed in a shape.

This bonding material 161 may be provided in advance before the application of the self-cohesive solder 140 at the time of manufacturing the liquid crystal panel 110. When the electronic part is bonded to the liquid crystal panel 110, 140 may be applied before or after coating. Further, the joining material 161 may be attached to the outer peripheral end face 110s of the liquid crystal panel 110 by previously molding the joining material 161 into a predetermined shape.

The end portion 113s of the wiring portion 113 exposed to the outer peripheral end face 110s of the liquid crystal panel 110 and the end portion 113s of the wiring portion 113c of the electronic component 130 after the application of the cohesive solder 140 and the connecting material 161 131 are aligned with a predetermined precision.

The joining material 161 is heated to a temperature lower than the melting point of the solder particles 140b and lower than the melting point of the joining material 161 by using the same thermocompression bonding apparatus as used in the joining method using the anisotropic conductive film. Then, the self-cohesive solder 140 is not melted and the binding material 161 is softened.

Thereafter, the heating of the bonding material 161 is stopped. The bonding material 161 is hardened and the end portion 113s of the wiring portion 113 exposed to the outer peripheral end face 110s of the liquid crystal panel 110 and the end portion 113s of the electronic part 130 The electronic component 130 is bonded to the outer peripheral end face 110s of the liquid crystal panel 110 in a state in which the connection electrode 133 formed on the wiring board 131 of the liquid crystal panel 110 is aligned.

In this state, the film thickness defining particles 165 remain dispersed in the bonding material 161.

Next, the outer peripheral end face 110s of the liquid crystal panel 110 and the electronic component 130 are heated while being pressed in a direction approaching each other by using the same thermocompression bonding apparatus as that used in the bonding method using the anisotropic conductive film. When the outer peripheral face 110s of the liquid crystal panel 110 and the electronic component 130 are pressed toward each other in this way, the film thickness defining particles 165 in the bonding material 161 are bonded to the outer periphery of the liquid crystal panel 110 Both the end surface 110s and the connection electrode 133 of the electronic component 130 touch. This defines the distance between the outer peripheral end surface 110s of the liquid crystal panel 110 and the connection electrode 133 of the electronic component 130 and defines the thickness of the self-cohesive solder 140.

A predetermined pressure, temperature, and time are applied to the self-cohesive solder 140 in this manner. The end 113s of the wiring part 113 exposed on the outer peripheral face 110s of the liquid crystal panel 110 and the connection electrode 133 formed on the wiring board 131 of the electronic component 130 are connected to each other, Followed by compression at a predetermined pressure for 15 minutes while heating at 150 占 폚.

When the thermosetting resin 140a and the solder particles 140b constituting the magnetically agglomerated solder 140 are melted by the heating as shown in Figs. 6 and 7, the solder particles 140a and the solder particles 140b of the thermosetting resin 140a, 140b are magnetically aggregated between the end portions 113s of the wiring portion 113 made of a metal and the connection electrode 133 to be metal-bonded. As a result, the end portion 113s of the wiring portion 113 of the liquid crystal panel 110 and the connection electrode 133 of the electronic component 130 are bonded to each other by the solder metal (solder joint portion, H). The melted thermosetting resin 140a is collected between the peripheral edge 110s of the liquid crystal panel 110 and the wiring board 131 of the electronic component 130 except for the portion where the solder metal H is formed, An insulating resin (resin adhering portion, P) made of the thermosetting resin 140a is formed.

After the thermocompression bonding, the joining of the electronic component 130 to the outer peripheral face 110s of the liquid crystal panel 110 is completed.

In addition, in the process of heating and pressing the self-cohesive solder 140 by the above-described thermocompression bonding, the joining material 161 is heated to a temperature not lower than the melting point of the joining material 161 and melted, followed by cooling. At this time, the bonding material 161 heated to a temperature higher than the melting point is thermally cured to maintain the bonding state between the electronic component 130 and the outer peripheral end face 110s of the liquid crystal panel 110.

10 and 11, the end portion 113s of the wiring portion 113 exposed to the outer peripheral end face 110s of the liquid crystal panel 110 and the end portion 113s of the wiring board (not shown) of the electronic component 130 131 are selectively metal-bonded by the solder metal H of the self-cohesive solder 140 to be electrically bonded.

The outer peripheral end surface 110s of the liquid crystal panel 110 and the wiring board 131 of the electronic component 130 are mechanically connected to each other by metallic bonding by the solder metal H and bonding by the insulating resin P .

The peripheral edge surface 110s of the liquid crystal panel 110 mechanically bonded by the solder metal H and the insulating resin P and the wiring board 131 of the electronic component 130 are bonded to each other by 500 g / cm. < / RTI >

The wiring board 131 of the electronic component 130 and the outer peripheral end face 110s of the liquid crystal panel 110 are also mechanically bonded to each other by the resin bonding portion 160 formed as the bonding material 161 is cured.

The solder 113 formed between the end portion 113s of the wiring portion 113 provided on the outer peripheral surface 110s of the liquid crystal panel 110 and the connection electrode 133 formed on the wiring board 131 of the electronic component 130 The thickness of the metal (H) is preferably 20 m or less, for example.

The electrode pitch of the end portion 113s of the wiring portion 113 provided on the outer peripheral face 110s of the liquid crystal panel 110 and the connection electrode 133 formed on the wiring board 131 of the electronic component 130 is 10 to 100 m, 100 mu m.

The bezel 150 that forms the outer frame of the display device 100B is provided on the outer periphery of the liquid crystal panel 110 on which the electronic component 130 is mounted. The bezel 150 includes a side plate portion 150a positioned on the outer peripheral side of the outer peripheral edge 110s of the liquid crystal panel 110 and a side plate portion 150b extending from one end of the side plate portion 150a toward the inside of the liquid crystal panel 110, And a front plate portion 150b along the outer peripheral portion of the display surface 110f of the liquid crystal panel 110. [ The electronic component 130 is accommodated between the side plate portion 150a of the bezel 150 and the outer peripheral edge 110s of the liquid crystal panel 110. [

The width w of the bezel 150 can be reduced by bonding the outer peripheral end surface 110s of the liquid crystal panel 110 and the wiring board 131 of the electronic component 130 as described above. That is, the display device 100B may be a narrow bezel having a small width w of the bezel 150. [

Furthermore, by using a plurality of low-bezel display devices 100B as described above, the display system 1 can be configured as shown in Fig. The display system 1 includes a plurality of display devices 100B which are juxtaposed vertically and horizontally adjacent to each other. A display area A formed by the plurality of display devices 100B is divided into an image Display the image.

In such a display system 1, since the respective display devices 100B are inner low-bezels, the gaps between the adjacent display devices 100B in the vertical direction or the horizontal direction can be narrowed, Thus, it becomes possible to perform image display and image display with less discomfort.

According to the mounting method of the electronic component 130 as described above, the first substrate 111, the second substrate 112, the first substrate 111, and the second substrate 112 The connection electrode 133 of the electronic component 130 and the wiring portion 132 of the electronic component 130 are electrically connected to the outer peripheral end surface 110s of the liquid crystal panel 110 having the connection portion 133 and the connection portion 133 of the electronic component 130, Cohesive solder 140 including a thermosetting resin 140a and a solder particle 140b is interposed between the end 113e of the liquid crystal panel 110 and the end face 113e of the electronic component 130 Thickness-regulated particles 165 made of a material having a melting point higher than that of the magnetic cohesive solder 140 and a material having a melting point lower than that of the solder particles 140b constituting the self-agglomerated solder 140 And a step of bonding the bonding material 161 to the bonding material 161 at a temperature lower than the melting point of the solder particles 140b, A step of bonding the electronic component 130 and the outer peripheral end face 110s of the liquid crystal panel 110 by softening the bonding material 161 at a low temperature and heating the magnetic cohesive solder 140 and the bonding material 161 , And a step of pressing and bonding the connection electrode 133 and the end portion 113s of the wiring portion in a direction approaching each other.

When the electronic component 130 is bonded to the outer peripheral end face 110s of the liquid crystal panel 110, the connection electrode 133 of the electronic component 130 The gap of the end portion 113s of the wiring portion 113 is defined, so that the thickness of the solder metal H can be specified. Therefore, while the electronic component 130 is reliably bonded to the outer peripheral end surface 110s of the liquid crystal panel 110, the self-cohesive solder 140 protrudes to the outer periphery side due to an excessive pressure applied to the self-cohesive solder 140 And the quality can be stabilized. Further, since high precision is not required for the pressure control applied when the electronic component 130 is bonded to the outer peripheral end face 110s of the liquid crystal panel 110, the bonding operation can be easily performed.

Since the electronic component 130 and the outer peripheral end face 110s of the liquid crystal panel 110 are joined together by the bonding material 161 prior to soldering by the magnetic cohesive solder 140, 133 and the end portion 113s of the wiring portion 113 can be aligned with high accuracy.

The electronic component 130 and the liquid crystal panel 110 are joined together by the joining material 161 and then the joining by the magnetic cohesive solder 140 is performed so that the joining of the electronic component 130 and the liquid crystal panel 110 The joining operation can be performed efficiently.

If the joining by the joining material 161 is performed and then the joining by the magnetic cohesive solder 140 is carried out, the joining material 161 is softened by heating again, 133 and the end portion 113s of the wiring portion 113 can be repositioned.

The solder particles 140b constituting the self-agglomerated solder 140 are agglomerated and soldered between the connection electrode 133 of the electronic component 130 and the end portion 113s of the wiring portion 113. This increases the amount of the conductive material interposed between the connection electrode 133 of the electronic component 130 and the end portion 113s of the wiring portion 113 as compared with the case of using the anisotropic conductive film, The connection resistance between the connection electrode 133 and the end portion 113s of the wiring portion 113 can be suppressed from increasing.

The electronic component 130 and the outer peripheral end surface 110s of the liquid crystal panel 110 are electrically connected to each other by metal bonding by the solder metal H made of the solder particles 140b of the self- And is bonded mechanically by adhesion with an insulating resin (P) made of a resin. The electronic component 130 and the outer peripheral end surface 110s of the liquid crystal panel 110 are also bonded to each other by the resin bonding portion 160 and the bonding material 161 around the self-cohesive solder 140. Further, Therefore, it is possible to strongly bond the electronic component 130 and the liquid crystal panel 110 to each other.

The substrate side wiring connection portion is formed as the end portion 113s of the wiring portion 113 exposed between the first substrate 111 and the second substrate 112. As compared with the first embodiment, ). Thus, the process of forming the bonding pads 200 can be reduced, thereby making it possible to improve work efficiency and production cost.

According to the junction structure of the electronic component 130, the liquid crystal panel 110, the display device 100A and the display system 1 as described above, the first substrate 111 and the second substrate 112 And a wiring portion 113 provided between the first substrate 111 and the second substrate 112 and a connection electrode 133 is formed on the outer peripheral surface 110s of the liquid crystal panel 110 And an abutting portion J for abutting the outer peripheral end surface 110s of the liquid crystal panel 110 and the electronic component 130. The abutting portion J abuts on the wiring portion 113, A solder metal H interposed between the end portion 113s of the liquid crystal panel 110 and the connection electrode 133 and a peripheral end face 110s of the liquid crystal panel 110 and the electronic component 130 at portions other than the solder metal H, A resin bonding portion 160 made of a material having a melting point higher than that of the solder metal H is provided between the outer peripheral end face 110s of the liquid crystal panel 110 and the electronic component 130, The solder metal (H) in the direction in which the end portion 113s of the wiring portion 113 and the connection electrode 133 are opposed to each other is made of a material having a melting point higher than that of the solder metal (H) H) having a particle diameter equal to the thickness of the film thickness defining particles (165).

With such a configuration, the electronic component 130 can be firmly and firmly bonded to the outer peripheral end surface 110s of the liquid crystal panel 110, thereby enhancing the electrical conductivity, restraining the connection resistance and stabilizing the quality, So that it can be easily performed.

<Other Embodiments>

The present invention is not limited to the above-described embodiments described with reference to the drawings, but various modifications may be made in the technical scope thereof.

The connection member 161 may be provided on the outer peripheral end surface 110s of the liquid crystal panel 110 but may be provided on the side of the electronic component 130 or may be provided on the outer periphery 110s of the liquid crystal panel 110. [ Or may be provided on both the end surface 110s and the electronic component 130. [

The mounting method of the electronic component 130 and the bonding structure of the electronic component 130 shown in each of the above embodiments can be applied to a substrate device such as various electronic devices in addition to the display devices 100A and 100B.

Further, the display devices 100A and 100B are not limited to liquid crystal display devices, and the present invention can be similarly applied to an organic light emitting diode display device, a plasma display panel display device, and the like.

In addition, it is possible to select the configurations listed in the above embodiments, or change them appropriately to other configurations, without departing from the gist of the present invention.

1: Display system 100A, 100B: Display device
110: liquid crystal panel (substrate laminate, substrate device)
110s: outer circumferential end face 111: first substrate (substrate)
111s: outer peripheral surface 112: second substrate (substrate)
112s: outer peripheral surface 113: wiring portion (wiring)
113e: end portion 113s: end portion (substrate-side wiring connection portion)
130: electronic part 131: wiring board (film-like substrate)
132: Chip parts
133: Connection electrode (electronic component side wiring connection portion)
140: Self-cohesive solder 140a: Thermosetting resin
140b: solder particle 160: resin bonding portion (low melting point bonding portion)
161:
165: Film thickness regulation particle (particulate matter, solder film thickness regulation section)
200: bonding pad (substrate-side wiring connection portion)
H: solder metal (solder joint) P: insulating resin (resin adhesive)

Claims (23)

The electronic component side wiring connection portion of the electronic component is electrically connected to an outer peripheral end face of the substrate stacked body having the two boards facing each other and the wiring provided between the two boards, Between the outer peripheral end surface of the substrate stacked body and the electronic component, between the substrate-side wiring connection portion provided on the wiring end portion and the substrate-side wiring connection portion provided on the wiring end portion, and a magnetic cohesive solder containing thermosetting resin and solder particles, A step of interposing a bonding material comprising a particulate material made of a high material and made of a material having a melting point lower than that of the solder particles constituting the self-agglomerated solder;
Joining the electronic component and the outer peripheral end surface of the substrate laminate by softening the joining material at a temperature lower than the melting point of the solder particles constituting the self-agglomerated solder and lower than the melting point of the joining material;
And a step of pressing and bonding the electronic component side wiring connection portion and the substrate side wiring connection portion in a direction approaching each other while heating the self-cohesive solder and the bonding material.
The method according to claim 1,
Wherein the particulate material is formed of any one of glass, silica, and hardened plastic.
3. The method according to claim 1 or 2,
The bonding material is disposed between the electronic part and the outer peripheral end surface of the substrate laminate and is disposed around the self-cohesive solder interposed between the electronic part side wiring connecting portion and the substrate side wiring connecting portion .
3. The method according to claim 1 or 2,
Wherein the bonding material is previously provided on at least one of the outer peripheral end surface of the substrate laminate and the electronic component.
3. The method according to claim 1 or 2,
Wherein the bonding material is provided on both of the two substrates on the outer peripheral surface of the substrate laminate.
3. The method according to claim 1 or 2,
Wherein the soldering material is made of a resin material having a melting point lower than that of the solder particles constituting the magnetically agglomerated solder.
3. The method according to claim 1 or 2,
Wherein the substrate-side wiring connection portion is a bonding pad which is connected to an end portion of the wiring and is formed of a conductive material formed along the outer peripheral end face of the substrate laminate.
3. The method according to claim 1 or 2,
Wherein the substrate-side wiring connection portion is formed from the end portion of the wiring exposed between the two substrates.
3. The method according to claim 1 or 2,
Wherein the magnetic cohesive solder is applied to the substrate-side wiring connection portion in a paste form.
10. The method of claim 9,
The self-cohesive solder paste is applied by any one of screen printing, printing using a mesh mask, and ink jetting.
3. The method according to claim 1 or 2,
The electronic component includes a film-like substrate having the electronic-component-side wiring connection portion, and a chip component mounted on the film-like substrate.
3. The method according to claim 1 or 2,
Wherein the wiring having the substrate-side wiring connection portion is formed on at least one of the two substrates and on the outer peripheral portion thereof.
3. The method according to claim 1 or 2,
Wherein the two substrates are at least one of a glass substrate, a resin substrate, and a printed substrate.
3. The method according to claim 1 or 2,
And a display portion of at least one of a liquid crystal display, an organic light emitting diode display, and a plasma display panel display device is formed by the electronic component connected to the peripheral edge of the substrate laminate.
A substrate stacked body having two substrate substrates disposed opposite to each other and a substrate-side wiring interconnecting portion at an end of the wiring provided between the two substrates;
An electronic component in which an electronic component side wiring connection portion is arranged opposite to an outer peripheral face of the substrate laminate;
And a joining portion joining the outer peripheral end surface of the substrate laminate and the electronic component,
The joining portion
A solder joint portion interposed between the substrate-side wiring connection portion and the electronic component-side wiring connection portion,
A resin adhering portion for adhering the electronic part to the outer peripheral end face of the substrate laminate at a portion other than the solder joint portion;
A low melting point joint portion provided between the outer peripheral end surface of the substrate stack and the electronic component and made of a material having a melting point lower than that of the solder joint portion;
Wherein the solder joint portion is formed of a material having a melting point higher than that of the solder joint portion and is provided inside the low melting point bonding portion and has a dimension corresponding to the thickness of the solder joint portion in the direction in which the board- And a solder film thickness regulating portion having a diameter of the solder film thickness regulating portion.
16. The method of claim 15,
Wherein the solder film thickness defining portion is formed from any one of glass, silica, and hardened plastic.
17. The method according to claim 15 or 16,
Wherein the substrate-side wiring connection portion is a bonding pad which is connected to an end portion of the wiring and is formed of a conductive material formed along the outer peripheral end face of the substrate laminate.
17. The method according to claim 15 or 16,
Wherein the substrate-side wiring connection portion is composed of the end portions of the wiring exposed between the two substrates.
17. The method according to claim 15 or 16,
Wherein a thickness of the solder joint is 20 mu m or less.
17. The method according to claim 15 or 16,
Wherein a plurality of the substrate-side wiring connection portions are adjacent to each other and the interval between the adjacent substrate-side wiring connection portions is 10 to 100 μm.
A substrate apparatus having a bonding structure of an electronic component according to claim 15 or 16.
A display device comprising the substrate device according to claim 21.
23. A display system comprising a plurality of display devices according to claim 22 arranged in a longitudinal direction and a lateral direction, respectively.

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