KR20090106777A - Flexible printed circuit having electrode attached conductive particle and Tape carrier package using the same - Google Patents

Abstract

PURPOSE: A flexible printed circuit board including an electrode with a conductive particle and a tape carrier package are provided to reduce a manufacturing cost using NCF(Non-Conductive Film) cheaper than ACF(Anistropic Conductive Film) when packaging the semiconductor. CONSTITUTION: A tape carrier package(100) includes a base film(110), a metal pattern(120), an electrode pad(130), and a drive IC(140). The metal pattern transmits the electrical signal by patterning the conductive material on the base film. The electrode pad is formed by attaching the plurality of conductive particles(132) in one side of an electrode(131) formed in the metal pattern. The drive IC is mounted on the base film. The drive IC is mounted on the base film. The drive IC is electrically connected to the metal pattern.

Description

Flexible printed circuit having electrode attached conductive particle and Tape carrier package using the same}

The present invention relates to a semiconductor device connection technology using a semiconductor circuit board and an adhesive film, and more particularly, to a flexible printed circuit board and a tape carrier package having an improved structure to reduce connection defects.

In general, anisotropic conductive film (ACF) is a connection material that is used when the material of the connected member is special or the pitch of signal wiring is minute so that the member and the member cannot be attached by soldering. . The anisotropic conductive film is typically used as a connection material for packaging LCD panels, printed circuit boards (PCBs), and driving ICs in LCD modules.

In the LCD panel, a plurality of driving ICs are mounted to drive thin film transistor (TFT) patterns. The driving IC is largely mounted on the LCD panel through a COG (Chip On Glass) mounting method, which is a method of mounting the LCD panel in the gate area and the data area without a separate structure, and a tape carrier package (TCP) equipped with the driving IC. It is divided into TAB (Tape Automated Bonding) mounting method, which indirectly mounts the driver ICs in the gate area and the data area.

Regardless of which mounting method is adopted, it is difficult to use means such as soldering because the electrodes on the driver IC element side and the electrodes on the LCD panel side are formed at minute pitch intervals. For this reason, an anisotropic conductive film is used to electrically connect the electrode on the driver IC side, the electrode on the panel side, and the electrode on the printed circuit board.

1 is a plan view illustrating an LCD module according to a general TAB method, and FIG. 2 is a cross-sectional view taken along line II-II ′ of FIG. 1. 1 and 2, in the row direction of the LCD panel 20, a source side printed circuit board 10 for transmitting an external signal to the LCD panel 20 is located, and a TCP in which the driving IC 31 is mounted. 30 electrically connects between the panel 20 and the printed circuit board 10. At this time, between the LCD panel 20 and the TCP 30 and between the TCP 30 and the printed circuit board 10 are connected by an anisotropic conductive film 40.

The anisotropic conductive film 40 is formed by dispersing conductive particles in an insulating adhesive, and thermally crimping the conductive particles to be in contact with each other to form electrical connections between the opposite terminals. That is, it is a connecting material which maintains insulation on the x-y plane and has conductivity on the z-axis. More specifically, referring to FIG. 3, which is a cross-sectional view along the line III-III ′ of FIG. 1, between the TCP 30 and the printed circuit board 10, an insulating adhesive component 41 and an insulating adhesive component 41 are provided. An anisotropic conductive film 40 including a plurality of dispersed conductive particles 42 is interposed. Then, when pressed at a predetermined temperature and pressure, the electrodes 32 and 14 to which the conductive particles 42 interposed between the electrodes 32 of the TCP 30 and the electrodes 14 of the printed circuit board 10 are opposed to each other. Is electrically connected.

However, there exists a problem that the short circuit between the electrodes of a semiconductor device is caused by the agglomeration of the electroconductive particle of an anisotropic conductive film in a crimping process mentioned above. The probability of short circuit between electrodes due to such agglomeration phenomenon is higher for electrodes having a fine pitch.

In addition, in order to maintain the resistance of a certain level or less, the number of conductive particles interposed between the electrodes must be large, the conductive particles have a problem that occupies a large proportion in cost in the production of the anisotropic conductive film.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and structurally improves a connection method using an anisotropic conductive film and an electrode provided in a semiconductor device, thereby improving connection reliability between electrodes of a semiconductor device and cost. An object is to provide a semiconductor device that can be reduced.

Other objects and advantages of the invention will be described below and will be appreciated by the embodiments of the invention. Furthermore, the objects and advantages of the present invention can be realized by means and combinations indicated in the appended claims.

A flexible circuit board according to the present invention for achieving the above object, the base film; A metal pattern on which the conductive material is patterned to transmit an electrical signal; And an electrode pad having a plurality of conductive particles attached to one side of the electrode formed on the metal pattern.

It is preferable that the said electroconductive particle apply | coats an adhesive in the state opened only to the electrode surface using a mask on an electrode pad, and attaches electroconductive particle by air blowing.

In addition, the conductive particles are preferably metal powder or particles coated with gold or nickel on the metal powder.

According to another aspect of the invention, the base film; A metal pattern on which the conductive material is patterned to transmit an electrical signal; An electrode pad having a plurality of conductive particles attached to one side of the electrode formed on the metal pattern; And a driving IC mounted on the base film and electrically connected to the metal pattern.

Preferably, the conductive particles are applied to the conductive particles by applying a pressure-sensitive adhesive in the open state only on the electrode surface using a mask on the electrode pad and air-blowing the conductive particles.

According to another aspect of the present invention, in the semiconductor device having an electrode bonded to the upper or lower surface of the adhesive film used in the semiconductor mounting technology, and arranged in a plurality of fine pitch of a predetermined pattern, A plurality of conductive particles are attached to one side of the electrode facing the connection surface of the adhesive film, the adhesive film is attached to the conductive particles, characterized in that the non-conductive film (NCF) made of an adhesive resin mixture excluding the conductive particles There is provided a semiconductor device having a mounted electrode.

Preferably, the conductive particles are applied to the conductive particles by applying a pressure-sensitive adhesive in the open state only on the electrode surface using a mask on the electrode pad and air-blowing the conductive particles.

According to the present invention, by attaching a plurality of conductive particles on the surface of the electrode provided in the flexible circuit board and the tape carrier package, interconnected by NCF (Non-Conductive Film) without the conductive particles during the semiconductor connection process and packaging The electrode connection reliability between the semiconductor devices can be improved.

In addition, manufacturing cost is reduced by using NCF, which is relatively cheaper than an anistropic conductive film (ACF) containing conductive particles in semiconductor packaging.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in the specification and claims should not be construed as having a conventional or dictionary meaning, and the inventors should properly explain the concept of terms in order to best explain their own invention. Based on the principle that can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention. Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

4 illustrates a tape carrier package according to an embodiment of the present invention. FIG. 5 is a cross-sectional view taken along the line II-II ′ of FIG. 4.

4 and 5, the tape carrier package 100 according to an embodiment of the present invention may include a base film 110, a metal pattern 120 formed on the base film 110, and an electrode formed on the metal pattern ( The electrode pad 130 to which the conductive particles 132 are attached to the 131, and the driving IC 140 connected to the metal pattern 120 and mounted on the base film 110 are included.

The base film 110 is made of a flexible material and is easily bent in a film form. As a main body of the tape carrier package 100 connecting the printed circuit board and the LCD panel, a polyimide film may be used and manufactured in the form of a reel tape. do.

The metal pattern 120 transmits an electrical signal by patterning conductive materials on the base film 110. More specifically, a copper foil is laminated on a predetermined portion of the base film 110, for example, one side of the base film 110, and a photoresist is applied to the copper foil surface. Then, a predetermined portion of the applied photoresist is exposed to remove the exposed photoresist. Next, the copper foil of the part from which the photoresist was removed is removed by etching, and the wiring pattern 120 is formed by removing a photoresist again. After that, a solder resist is applied for the purpose of protecting the final patterned copper foil and preventing short circuit caused by foreign matter. At this time, the lead gold process may be performed before the application of the solder resist. After the application of the solder resist, the oven is thermally cured and then the unplated portion of the solder resist is unplated. At this time, the plating uses tin or gold. However, the present invention is not limited to this method in forming the metal pattern 120, and various modifications may be employed by those skilled in the art.

The electrode pad 130 is a portion in which electrodes 131 formed at the end of the metal pattern 120 are collected and serves to electrically connect with other semiconductor devices such as an LCD panel and a PCB substrate. A plurality of conductive particles 132 are attached to the electrode 131 of the electrode pad 130 to serve to stably conduct when connected to the electrodes of other devices. In addition, the conductive particles 132 attached to the surface of the electrode 131 is formed by being attached by the following process. That is, the mask is placed on the electrode pad 130, the mask is aligned with only the surface portion of the electrode 131 open, and then the adhesive is applied to the surface of the electrode 131. The conductive particles 132 prepared in this state are air blown onto the electrode pad 130 to be attached to the adhesive on the surface of the electrode 131. Through such a process, the conductive particles 132 may be attached and fixed only on the surface of the electrode 131 in the electrode pad 130.

As the conductive particles 132 attached to the electrode 131, metal powders such as gold, silver, iron, copper, and nickel may be used, and metals or metal oxides thereof, and carbon black may be further used. Furthermore, the conductive particles 132 may employ particles coated with gold or nickel on the metal powder.

Due to the structure in which the conductive particles 132 are attached to the electrode 131, the tape carrier package 100 according to the present invention uses non-conductive film (NCF) that does not contain conductive particles when connected to other semiconductor devices. Can be.

The driving IC 140 drives the LCD panel and is mounted on the base film 110 to be electrically connected to the metal patterns 120.

A flexible printed circuit (FPC) according to another embodiment of the present invention includes a plurality of base films 110, metal patterns 120 patterned on the base films, and electrodes 131 formed on the metal patterns 120. Electrode pad 130 with conductive particles 132 attached thereto. In the flexible printed circuit board according to another exemplary embodiment of the present invention, the configuration of the driving IC 140 is excluded from the above-described tape carrier package 100, and the rest of the components are similar, and thus the detailed description thereof will be omitted.

The semiconductor device package according to another embodiment of the present invention attaches a plurality of conductive particles to one side of the electrode facing the adhesive film, thereby replacing the conductive particles included in the conventional anisotropic conductive film (ACF), thereby adhering As the film, NCF without conductive particles other than ACF is used. Referring to FIGS. 6 to 8, a semiconductor device package including an electrode with conductive particles will be described as follows.

6 is a diagram illustrating a configuration of an LCD module that is a semiconductor device package according to an embodiment of the present invention. FIG. 7 is a cross-sectional view showing the III-III 'cross section of FIG. 6 before packaging, and FIG. 8 is a cross-sectional view showing the III-III' cross section of FIG. 6 after packaging.

6 to 8, the LCD module which is a semiconductor device package according to the present invention is a package in which the LCD panel 200 and the PCB 300 are electrically connected by connecting the tape carrier package 100 to the LCD panel 200.

The source side PCB 300 for transmitting an external signal to the LCD panel 200 is positioned in the row direction of the LCD panel 200, and the TCP 100 on which the driving IC 140 is mounted is the panel 200 and the PCB. Electrically connect between the 300. At this time, between the LCD panel 200 and the TCP 100 and between the TCP 100 and the PCB 300 are connected to the NCF 400 that does not contain conductive particles.

That is, a plurality of conductive particles 132 are attached to the surface of the electrode 131 of the TCP (100) can be smoothly electrically connected at the time of connection through the electrode 220 of the LCD panel 200 and the NCF (400) film. Will be.

The NCF 400 is made of an adhesive resin mixture excluding conductive particles, and has characteristics of a thermoplastic or thermosetting adhesive resin. In an embodiment of the invention, the NCF 400 is melt bonded between the LCD panel 200 and the TCP 100 by the heat and pressure applied in the compression process for packaging.

As described above, the semiconductor device package of the present invention is bonded by using the NCF 400, so that short defects due to agglomeration of the conductive particles at the electrode ends generated by the conventional method using ACF or entanglement of the conductive particles between the electrodes are achieved. Short-circuit due to this can be prevented, and the overall cost can be reduced by using an inexpensive NCF 400 material.

In FIG. 6, although the TCP 140 is used in the semiconductor device package of the present invention, a flexible printed circuit board (FPC) having conductive particles attached to an electrode according to another embodiment of the present invention may be used instead of the TCP 140. Can be. At this time, of course, the NCF 400 is used for the connection of each device.

Hereinafter, the operation of the tape carrier package according to the present invention will be described with reference to FIGS. 6 to 8.

The tape carrier package 100 according to the present embodiment drives the LCD panel 200 by connecting between the LCD panel 200 and the printed circuit board 300. At this time, between the tape carrier package 100 and the LCD panel 200 or between the tape carrier package 100 and the printed circuit board 300 is mutually compressed through the NCF (400).

The tape carrier package 100 according to the present embodiment is connected to another connected member such as an LCD panel or a printed circuit board with an NCF 400 containing no conductive particles. At this time, the compression toolbar having a predetermined temperature and pressure is crimped with each electrode aligned and arranged in a state where the NCF 400 is interposed between the tape carrier package 100 and the member 200 to be connected. Along with the compression, the NCF 400 flows to penetrate between the tape carrier package 100 and the connected member 200, and the tape carrier package 100 and the connected member 200 come into contact with each other. Then, the electrode 131 of the tape carrier package 100 and the electrode 220 of the member 200 to be connected are electrically connected to the electrode 131 of the tape carrier package 100 by the conductive particles 132 provided. Is connected, and the NCF 400 is hardened and bonded in that state.

Although the present invention has been described above by means of limited embodiments and drawings, the present invention is not limited thereto and will be described below by the person skilled in the art to which the present invention pertains. Of course, various modifications and variations are possible within the scope of the claims.

The following drawings, which are attached to this specification, illustrate exemplary embodiments of the present invention, and together with the detailed description of the present invention serve to further understand the technical spirit of the present invention, the present invention includes matters described in such drawings. It should not be construed as limited to.

1 is a plan view showing a conventional general LCD module.

FIG. 2 is a cross-sectional view taken along line II-II 'of FIG. 1.

3 is a cross-sectional view taken along line III-III ′ of FIG. 1.

4 illustrates a tape carrier package according to an embodiment of the present invention.

FIG. 5 is a cross-sectional view taken along the line II-II ′ of FIG. 4.

6 is a diagram illustrating a configuration of an LCD module that is a semiconductor device package according to an embodiment of the present invention.

FIG. 7 is a cross-sectional view taken along line III-III ′ of FIG. 6 before packaging.

8 is a cross-sectional view taken along line III-III ′ of FIG. 6 after packaging.

<Explanation of symbols for the main parts of the drawings>

110: base film 120: metal pattern

130: electrode pad 131: electrode

132 conductive particles 140 drive IC

Claims (7)

Base film; A metal pattern on which the conductive material is patterned to transmit an electrical signal; And And an electrode pad having a plurality of conductive particles attached to one side of the electrode formed on the metal pattern. The method of claim 1, The conductive particles, A flexible circuit board, comprising: applying an adhesive in an open state only on an electrode surface using a mask on an electrode pad and attaching conductive particles by air blowing. The method of claim 1, The conductive particles are metal powder or a flexible circuit board, characterized in that the metal powder coated with gold or nickel. Base film; A metal pattern on which the conductive material is patterned to transmit an electrical signal; An electrode pad having a plurality of conductive particles attached to one side of the electrode formed on the metal pattern; And And a drive IC mounted on the base film and electrically connected to the metal pattern. The method of claim 4, wherein The conductive particles, Tape carrier package, characterized in that the adhesive is applied to the electrode surface in the open state only on the electrode pad using a mask, and the conductive particles are attached by air blowing. In a semiconductor device having an electrode bonded to an upper surface or a lower surface of an adhesive film used in a semiconductor mounting technique and arranged in a plurality of fine pitches of a predetermined pattern, A plurality of conductive particles are attached to one side of the electrode facing the connection surface of the adhesive film, And the adhesive film is a non-conductive film (NCF) made of an adhesive resin mixture excluding conductive particles. The method of claim 6, The conductive particles, A semiconductor device provided with an electrode with conductive particles, characterized in that the adhesive is applied on the electrode pad in a state of being open only on the electrode surface, and the conductive particles are attached by air blowing.

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