KR20170033266A - 접속체 및 접속체의 제조 방법 - Google Patents
접속체 및 접속체의 제조 방법 Download PDFInfo
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- KR20170033266A KR20170033266A KR1020167033437A KR20167033437A KR20170033266A KR 20170033266 A KR20170033266 A KR 20170033266A KR 1020167033437 A KR1020167033437 A KR 1020167033437A KR 20167033437 A KR20167033437 A KR 20167033437A KR 20170033266 A KR20170033266 A KR 20170033266A
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
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- H01L24/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- G—PHYSICS
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
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Abstract
복수의 단자 (21) 가 배열된 단자열 (22) 이 단자 (21) 의 배열 방향과 직교하는 폭 방향으로 복수 병렬된 회로 기판 (12) 과, 복수의 단자열 (22) 에 따라, 복수의 범프 (25) 가 배열된 범프열 (26) 이 범프 (25) 의 배열 방향과 직교하는 폭 방향으로 복수 병렬된 전자 부품 (18) 을 구비하고, 도전성 입자 (4) 가 배열된 이방성 도전 접착제 (1) 를 통해서 회로 기판 (12) 상에 전자 부품 (18) 이 접속된 접속체 (1) 에 있어서, 회로 기판 (12) 및 전자 부품 (18) 의 각 외측에 배열된 서로 대향하는 단자 (21) 와 범프 (25) 의 거리가, 각 내측에 배열된 서로 대향하는 단자 (21) 와 범프 (25) 의 거리보다 크다.
Description
도 2 는, 투명 기판의 이면에서 본 입출력 단자에 나타나는 압흔 상태를 나타내는 저면도이다.
도 3 은, 액정 구동용 IC 와 투명 기판의 접속 공정을 나타내는 단면도이다.
도 4 는, 액정 구동용 IC 의 전극 단자 (범프) 및 단자간 스페이스를 나타내는 평면도이다.
도 5 는, 이방성 도전 필름을 나타내는 단면도이다.
도 6 은, 도전성 입자가 격자 형상으로 규칙 배열된 이방성 도전 필름을 나타내는 평면도이다.
도 7 은, 실시예에 관련된 평가용 IC 의 범프와 단자의 거리의 측정 위치를 나타내는 평면도이다.
도 8 은, 실시예에 관련된 평가용 IC 의 범프와 단자의 거리의 측정 위치를 나타내는 단면도이다.
도 9 (A) ∼ (C) 는, 요철부가 형성된 범프만을 발출하여 나타내는 단면도이다.
도 10(A) 는 액정 구동용 IC 의 평면도이며, 도 10(B) 는 접속 공정을 나타내는 단면도이다.
도 11 은, 액정 구동용 IC 에 휨이 발생한 상태를 나타내는 단면도이다.
2 : 박리 필름
3 : 바인더 수지층
4 : 도전성 입자
6 : 권취 릴
10 : 액정 표시 패널
11, 12 : 투명 기판
12a : 가장자리부
13 : 시일
14 : 액정
15 : 패널 표시부
16, 17 : 투명 전극
18 : 액정 구동용 IC
18a : 실장면
19 : 입력 단자
20 : 입력 단자열
21 : 출력 단자
22 : 출력 단자열
23 : 입력 범프
25 : 출력 범프
24 : 입력 범프열
26 : 출력 범프열
27 : 실장부
31 : 기판측 얼라인먼트 마크
32 : IC 측 얼라인먼트 마크
33 : 열 압착 헤드
35 : 단자간 스페이스
Claims (15)
- 복수의 단자가 배열된 단자열이 상기 단자의 배열 방향과 직교하는 폭 방향으로 복수 병렬된 회로 기판과,
상기 복수의 단자열에 따라, 복수의 범프가 배열된 범프열이 상기 범프의 배열 방향과 직교하는 폭 방향으로 복수 병렬된 전자 부품을 구비하고,
도전성 입자가 배열된 이방성 도전 접착제를 개재해 상기 회로 기판 상에 상기 전자 부품이 접속된 접속체에 있어서,
상기 회로 기판 및 상기 전자 부품의 각 외측에 배열된 서로 대향하는 단자와 범프의 거리가, 상기 회로 기판 및 상기 전자 부품의 각 내측에 배열된 서로 대향하는 단자와 범프의 거리보다 큰, 접속체. - 제 1 항에 있어서,
상기 회로 기판 및 상기 전자 부품의 각 외측에 배열된 서로 대향하는 단자와 범프의 거리는, 상기 회로 기판 및 상기 전자 부품의 각 내측에 배열된 서로 대향하는 단자와 범프의 거리의 130 % 이내인, 접속체. - 제 2 항에 있어서,
상기 전자 부품의 상기 범프열의 중심부에 있어서, 상기 회로 기판 및 상기 전자 부품의 각 외측에 배열된 서로 대향하는 단자와 범프의 거리가, 상기 회로 기판 및 상기 전자 부품의 각 내측에 배열된 서로 대향하는 단자와 범프의 거리의 130 % 이내인, 접속체. - 제 1 항 내지 제 3 항 중 어느 한 항에 있어서,
상기 회로 기판 및 상기 전자 부품의 각 외측에 배열된 서로 대향하는 단자와 범프의 거리 (Do) 와, 상기 회로 기판 및 상기 전자 부품의 각 내측에 배열된 서로 대향하는 단자와 범프의 거리 (Di) 의 비율 (D) (= Do/Di) 은,
상기 전자 부품의 상기 범프의 배열 방향의 양단에 있어서의, 상기 회로 기판 및 상기 전자 부품의 각 외측에 배열된 서로 대향하는 단자와 범프의 평균 거리 (do) 와, 상기 회로 기판 및 상기 전자 부품의 각 내측에 배열된 서로 대향하는 단자와 범프의 평균 거리 (di) 의 비율 (d) (= do/di) 의 130 % 이내인, 접속체. - 제 4 항에 있어서,
상기 전자 부품의 상기 범프열의 중심부에 있어서의 상기 비율 (D) 이, 상기 비율 (d) 의 130 % 이내인, 접속체. - 제 1 항 내지 제 5 항 중 어느 한 항에 있어서,
상기 회로 기판은, 하나의 상기 단자열이 형성된 제 1 단자 영역과, 상기 단자열이 폭 방향으로 복수 병렬된 제 2 단자 영역을 갖고,
상기 전자 부품은, 하나의 상기 범프열이 형성된 제 1 범프 영역과, 상기 범프열이 폭 방향으로 복수 병렬된 제 2 범프 영역을 갖고,
상기 회로 기판 및 상기 전자 부품의 상기 제 2 단자 영역 및 상기 제 2 범프 영역에 있어서 각 외측에 배열된 서로 대향하는 단자와 범프의 거리 (Do) 는,
상기 회로 기판 및 상기 전자 부품의 상기 제 2 단자 영역 및 상기 제 2 범프 영역에 있어서의 각 외측에 배열된 단자열과 범프열의 양단부에 있어서의 서로 대향하는 단자와 범프의 거리와, 상기 회로 기판 및 상기 전자 부품의 상기 제 1 단자 영역 및 상기 제 1 범프 영역에 있어서의 상기 단자열과 범프열의 양단부에 있어서의 서로 대향하는 단자와 범프의 거리의 평균 거리 (dAVE) 의 110 % 이내인, 접속체. - 제 6 항에 있어서,
상기 제 1 단자 영역 및 상기 제 1 범프 영역에 있어서의 상기 단자열과 범프열은,
상기 제 1 단자 영역에 복수의 상기 단자열이 상기 단자의 배열 방향과 직교하는 폭 방향으로 복수 병렬되고, 또한 상기 제 1 범프 영역에 상기 범프열이 상기 범프의 배열 방향과 직교하는 폭 방향으로 복수 병렬되어 있는 경우, 상기 제 1 단자 영역 및 상기 제 1 범프 영역에 있어서의 각 외측에 배열된 단자열 및 범프열인, 접속체. - 제 6 항에 있어서,
상기 전자 부품의 상기 범프열의 중심부에 있어서의 상기 거리 (Do) 가, 상기 평균 거리 (dAVE) 의 110 % 이내인, 접속체. - 제 1 항 내지 제 3 항 중 어느 한 항에 있어서,
상기 도전성 입자가 배열되어 있는 상기 이방성 도전 접착제를 사용하여 형성되는, 접속체. - 제 1 항 내지 제 3 항 중 어느 한 항에 있어서,
상기 도전성 입자는, 평균 입경이 5 ㎛ 이하인, 접속체. - 제 1 항 내지 제 3 항 중 어느 한 항에 있어서,
상기 범프는, 상기 도전성 입자를 포착하는 범프면에, 상기 도전성 입자의 입자경의 50 % 이내의 고저차를 갖는 요철부가 형성된, 접속체. - 제 4 항 또는 제 5 항에 있어서,
상기 범프는, 상기 도전성 입자를 포착하는 범프면에, 상기 도전성 입자의 입자경의 50 % 이내의 고저차를 갖는 요철부가 형성된, 접속체. - 제 6 항 내지 제 8 항 중 어느 한 항에 있어서,
상기 범프는, 상기 도전성 입자를 포착하는 범프면에, 상기 도전성 입자의 입자경의 50 % 이내의 고저차를 갖는 요철부가 형성된, 접속체. - 복수의 단자가 배열된 단자열이 폭 방향으로 복수 병렬된 회로 기판과,
상기 복수의 단자열에 따라, 복수의 범프가 배열된 범프열이 폭 방향으로 복수 병렬된 전자 부품을 구비하고,
도전성 입자가 배열된 이방성 도전 접착제를 개재해 상기 회로 기판 상에 상기 전자 부품을 탑재하고,
상기 전자 부품을 압압 (押壓) 함과 함께 상기 이방성 도전 접착제를 경화시키는 접속체의 제조 방법에 있어서,
상기 회로 기판 및 상기 전자 부품의 각 외측에 배열된 서로 대향하는 단자와 범프의 거리가, 상기 회로 기판 및 상기 전자 부품의 각 내측에 배열된 서로 대향하는 단자와 범프의 거리보다 큰, 접속체의 제조 방법. - 제 14 항에 있어서,
상기 이방성 도전 접착제는, 상기 도전성 입자를 함유하는 도전성 입자 함유층과, 상기 도전성 입자를 함유하지 않는 절연성 접착제층을 구비하고, 상기 도전성 입자 함유층은, 상기 절연성 접착제층보다 점도가 높은, 접속체의 제조 방법.
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KR20230010274A (ko) | 2023-01-18 |
JP2016029698A (ja) | 2016-03-03 |
CN106664804A (zh) | 2017-05-10 |
US20170207190A1 (en) | 2017-07-20 |
KR102637835B1 (ko) | 2024-02-19 |
WO2016013593A1 (ja) | 2016-01-28 |
US10373927B2 (en) | 2019-08-06 |
TW201618263A (zh) | 2016-05-16 |
CN113079637A (zh) | 2021-07-06 |
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