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KR20080093284A - An apparatus for radiating heat of led light - Google Patents

An apparatus for radiating heat of led light Download PDF

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Publication number
KR20080093284A
KR20080093284A KR1020070037020A KR20070037020A KR20080093284A KR 20080093284 A KR20080093284 A KR 20080093284A KR 1020070037020 A KR1020070037020 A KR 1020070037020A KR 20070037020 A KR20070037020 A KR 20070037020A KR 20080093284 A KR20080093284 A KR 20080093284A
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KR
South Korea
Prior art keywords
heat
heat sink
pipe
heat dissipation
heat pipe
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KR1020070037020A
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Korean (ko)
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KR100891433B1 (en
Inventor
박태문
유형열
김민영
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주식회사 남영전구
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • F21K9/272—Details of end parts, i.e. the parts that connect the light source to a fitting; Arrangement of components within end parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/717—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

An apparatus for discharging heat from an LED(Light Emitting Diode) is provided to increase heat transfer effect by discharging heat with first and second heat sinks receiving heat from a heat pipe. An apparatus for discharging heat from an LED includes a U-type heat pipe(5), a first heat sink(7), and second heat sinks(9). The U-type heat pipe has blades(3) and is directly connected to an electronic device. The blades are formed on both sides of the U-type heat pipe. The first heat sink is composed of vertical pins and is installed between the blades inside the U-type heat pipe. The second heat sinks are cylindrical and are installed on outer sides of both blades respectively. The first and second heat sinks form a space(11) for enlarging an air contacting surface.

Description

ＬＥＤ전구의 방열장치{AN APPARATUS FOR RADIATING HEAT OF LED LIGHT}LED heat dissipation device {AN APPARATUS FOR RADIATING HEAT OF LED LIGHT}

도 1은 본 발명에 따른 히트 파이프를 이용한 전자부품의 방열장치의 원리를 나타낸 측면도,1 is a side view showing the principle of a heat dissipation device of an electronic component using a heat pipe according to the present invention;

도 2는 본 발명에 따른 전자부품의 방열장치에 대한 평면도,2 is a plan view of a heat dissipation device of an electronic component according to the present invention;

도 3은 본 발명에 따른 전자부품의 방열장치에 대한 분해사시도,3 is an exploded perspective view of a heat dissipation device of an electronic component according to the present invention;

도 4는 본 발명에 따른 전자부품의 방열장치에 대한 조립사시도,4 is an assembled perspective view of a heat dissipation device of an electronic component according to the present invention;

도 5는 히트 파이프를 이용한 종래의 전자부품 방열장치에 대한 개념을 나타내는 측면도이다.5 is a side view illustrating a concept of a conventional electronic component heat dissipation apparatus using a heat pipe.

* 도면의 주요부분에 대한 부호설명* Explanation of symbols on the main parts of the drawings

1 - 전자부품 3 - 날개부1-Electronic parts 3-Wings

5 - 히트 파이프 7 - 1차 방열판5-Heat Pipe 7-Primary Heat Sink

9 - 2차 방열판 11 - 공간부9-secondary heat sink 11-space

본 발명은 히트 파이프를 이용한 전자부품의 방열장치에 관한 것으로, 특히 인쇄회로기판 하부면에 히트 파이프가 직접 설치되고, 상기 히트 파이프에 연결된 방열판이 2중 구조로 이루어져 효과적으로 열을 방열시키게 한 LED전구의 방열장치에 관한 것이다.The present invention relates to a heat dissipation device for an electronic component using a heat pipe, and in particular, a heat pipe is directly installed on a lower surface of a printed circuit board, and a heat dissipation plate connected to the heat pipe has a double structure to effectively dissipate heat. It relates to a heat dissipation device.

일반적으로 광고판이나 간판, 조명 등 기타 광학적 소재로 널리 사용되는 발광다이오드(LED)는 광학효율이 개선되어 일반조명분야에 사용되고 있다.In general, light emitting diodes (LEDs), which are widely used as billboards, signs, lights, and other optical materials, have been used in general lighting because of improved optical efficiency.

그러나, 고출력/고효율의 LED는 발열특성에 따라 고온에서는 광학특성이 저하되는 특성을 나타낸다. 따라서, 일정한 광학특성을 유지하기 위해서는 LED에서 발생되는 열을 충분히 방열을 하여야 한다. 충분한 방열이 이루어지지 않으면 광학출력특성이 저하되거나, 장기적인 수명 단축과 효율저하가 초래된다.However, high power / high efficiency LED exhibits a property of deteriorating optical characteristics at high temperatures according to heat generation characteristics. Therefore, in order to maintain constant optical characteristics, the heat generated from the LED must be sufficiently radiated. Insufficient heat dissipation may result in deterioration of optical output characteristics, long term life span and efficiency degradation.

이러한 문제를 해결하기 위해 방열체를 사용하여 상기한 바와 같이 LED 등의 반도체부품에서 발생하는 열을 대기 중으로 방열시키고 있는데, 기존의 방열체로서 열전도성이 좋은 구리나 알루미늄을 사용하여 방열시키는 구조와, 내부에 열전달 액체가 내장되어 열전달 액체가 기화와 액화를 반복 순환하면서 열을 효과적으로 전달하게 이루어진 히트파이프를 이용한 구조가 있다.In order to solve this problem, a heat radiator is used to radiate heat generated from semiconductor components such as LEDs to the atmosphere as described above. As a conventional radiator, a heat radiator is used to radiate heat using copper or aluminum having good thermal conductivity. In addition, there is a structure using a heat pipe in which a heat transfer liquid is built in and heat transfer liquid efficiently transfers heat while repeatedly circulating vaporization and liquefaction.

한편, 상기한 바와 같이 열전도성이 뛰어난 구리와 알루미늄 등과 같은 매질을 이용한 방열체는 재질 자체의 열전도성에 의존하기 때문에, 방열체의 면적에 비례하여 방열특성을 이용하므로, 효과적으로 방열하기 위해서는 큰 면적의 방열체를 사용하거나 통풍구조를 개선시키기 위한 구조로 만들어야 하는데, 이와 같이 구리나 알루미늄 등의 재질을 사용하여 방열체의 면적을 크게 만든 구조의 방열체는 온 도의 전달속도가 낮기 때문에 방열원의 온도를 저하시키는데 시간이 소요되는 단점이 있고, 한편, 히트 파이프를 사용한 방열기술에서는 내장된 열전달 액체의 열전도 특성을 이용하여 다른 구조물에까지 열을 전달하여 방열시킬 수가 있으므로 효과적으로 열을 전도시켜 방열원의 온도를 빠른 시간내에 저하시켜 방열시킬 수 있다.On the other hand, as described above, since the heat dissipator using a medium such as copper and aluminum having excellent thermal conductivity depends on the heat conductivity of the material itself, the heat dissipation property is used in proportion to the area of the heat dissipation body. The radiator should be made to use a radiator or improve the ventilation structure.The radiator, which has a large area of radiator using materials such as copper or aluminum, has a low heat transfer rate, so the temperature of the radiator is On the other hand, in the heat dissipation technology using heat pipes, heat can be transferred to other structures by using heat conduction properties of the built-in heat transfer liquid to dissipate heat, thereby effectively conducting heat and thereby reducing the temperature of the heat dissipation source. It is possible to dissipate the heat within a short time.

그런데, 이러한 히트 파이프를 이용한 기존의 방열장치에서는 히트 파이프의 효과를 충분하게 이용하지 못하여 전자부품의 열을 충분하게 식혀 주지 못하는 문제가 있다.However, in the existing heat dissipation device using the heat pipe, there is a problem that the heat of the electronic component is not sufficiently cooled because the effect of the heat pipe is not sufficiently used.

한편, 컴퓨터분야의 CPU를 냉각시키기 위한 히트 파이프를 이용한 방열기술에서는 원형의 히트파이프를 이용하여 열을 전도시킨 후, 방열원보다 큰 크기를 갖는 방열판에 의해 냉각시키기거나 부가적으로 팬을 부착하여 냉각성능을 개선시키도록 되어 있다. On the other hand, in the heat dissipation technology using a heat pipe for cooling the CPU in the computer field, the heat is conducted using a circular heat pipe, and then cooled by a heat sink having a size larger than that of the heat dissipation source or an additional fan is attached. It is intended to improve the cooling performance.

그러나, 작은 크기의 면적에서 설계되어야 하는 제품에서는 히트 파이프를 사용하더라도 상기와 같은 큰 크기의 방열판을 부착하기 어려우며, 팬을 사용할 수 없는 조건인 경우에는 효과적인 냉각성능을 기대하기가 어렵다.However, in a product that must be designed in a small area, it is difficult to attach such a large heat sink even when using a heat pipe, and it is difficult to expect effective cooling performance when the fan cannot be used.

예컨대, 도면 5에 도시한 바와 같이, 종래의 히트 파이프를 이용한 발광다이오드 인쇄회로기판의 방열구조는 인쇄회로기판과 같은 열 발생원(101)에 구리나 알루미늄 전도체(103)가 접착되고, 상기 전도체(103)에 히트 파이프(105)가 부착되어 있으며, 상기 히트 파이프(105)의 상단에 방열판(107)이 연결된 구조로 되어 있다.For example, as shown in FIG. 5, in the heat dissipation structure of a light emitting diode printed circuit board using a conventional heat pipe, a copper or aluminum conductor 103 is bonded to a heat generating source 101 such as a printed circuit board, and the conductor ( The heat pipe 105 is attached to the 103, and the heat sink 107 is connected to the upper end of the heat pipe 105.

상기한 바와 같은 구조의 종래의 방열장치기술은, 히트파이프(105)에 의해 열을 전달하는 특성은 효과가 우수하나, 전달된 열을 다시 구리나 알루미늄전도체(103)를 통하여 전도되며, 매질전도와 공기와의 표면적에 의해 방열이 이루어지기 때문에 방열효과가 떨어진다는 문제점이 있었다.In the conventional heat dissipation device having the structure as described above, the heat transfer property of the heat pipe 105 is excellent in effect, but the transferred heat is conducted again through the copper or aluminum conductor 103, the medium conduction There is a problem that the heat dissipation effect is reduced because the heat dissipation is made by the surface area of the air.

또한, 종래의 방열장치기술은 상기 히트 파이프(105)를 통하여 전달받은 열을 대기로 방열하는 방열판(107)이 다수개의 방열핀을 갖추고 있기는 하지만, 하나의 몸체로 이루어진 단일 구조물로 이루어져 있기 때문에 공기와 충분한 접촉을 가지지 못하여 대기 중으로 열을 전달하는 효율이 낮아 그만큼 방열 효과가 떨어진다는 단점이 있었다. In addition, in the conventional heat dissipation device technology, although the heat dissipation plate 107 for dissipating heat transferred through the heat pipe 105 to the atmosphere has a plurality of heat dissipation fins, the air dissipation device is formed of a single structure composed of one body. The heat dissipation effect was low because the efficiency of heat transfer to the air was not low due to insufficient contact.

이에 본 발명은 열을 많이 발생하는 LED와 같은 반도체부품이 발생하는 열을 히트 파이프와 방열판을 이용하여 효과적으로 방열시켜 줄 수 있게 하여, LED를 이용한 전구와 같은 제품에 효과적으로 사용할 수 있는 구조의 방열장치를 제공하는데 그 목적이 있다.Accordingly, the present invention can effectively dissipate heat generated by semiconductor components such as LEDs that generate a lot of heat using heat pipes and heat sinks, so that a heat dissipation device having a structure that can be effectively used in a product such as an LED bulb is used. The purpose is to provide.

상기한 바의 목적을 달성하기 위한 본 발명의 장치는, 열 발생원의 전자부품의 하부면에 양쪽 날개부를 갖는 U자형 히트 파이프의 수평부가 직접 연결되고, 상기 U자형 히트 파이프의 양쪽 날개부 사이에 수직핀 형상으로 이루어진 1차 방열판이 설치되며, 상기 히트 파이프의 양단 날개부 바깥쪽에 원통형으로 이루어진 2차 방열판이 설치되어 있는 한편, 상기 1차 방열판과 2차 방열판을 소정의 간격을 두고 배치되어 1차 방열판과 2차 방열판 사이에 공간부가 형성된 구조로 되어 있다.The apparatus of the present invention for achieving the above object, the horizontal portion of the U-shaped heat pipe having both wings on the lower surface of the electronic component of the heat generating source is directly connected, between the two wings of the U-shaped heat pipe A primary heat sink having a vertical fin shape is installed, and a secondary heat sink having a cylindrical shape is installed outside the wings of both ends of the heat pipe, and the primary heat sink and the secondary heat sink are disposed at predetermined intervals. A space portion is formed between the secondary heat sink and the secondary heat sink.

2차 방열판은 원형의 형태로 구성되며, 외부면에서는 요철의 형태로 공기와의 접촉되는 표면적을 넓혀 방열효율을 높게 하였으며, 또한 내부면에도 요철의 형태를 두어 추가적으로 방열특성을 개선할 수 있다.The secondary heat sink has a circular shape, and the outer surface has a concave-convex shape to increase the heat dissipation efficiency by increasing the surface area in contact with the air, and also has a concave-convex shape on the inner surface to further improve heat dissipation characteristics.

열 발생원과 1차 및 2차 방열판까지의 열전도는 히트 파이프에 의해서 이루어지므로 평면형의 히트 파이프를 사용하여 전도면적을 넓히게 된다. Since the heat conduction to the heat generating source and the primary and secondary heat sinks is performed by the heat pipe, the conduction area is widened by using a planar heat pipe.

이러한 구조로 이루어진 본 발명의 방열장치는 상기 히트 파이프가 열을 발생시키는 LED와 같은 반도체 부품에 직접 접촉되어 있으므로 전자부품의 열을 효과적으로 전달받을 수 있으며, 상기 히트 파이프를 통하여 열을 전달받아, 대기 중으로 발산하는 1/2차 방열판으로 열을 전달 및 분산할 수 있다. 또한, 1/2차 방열판에는 공간부를 사이에 두고 배치되어 있는 구조로 상기 1/2차 방열판에 형성된 방열핀이 서로 다른 방향으로 형성되어 있어 히트 파이프의 열을 효과적으로 발산하게 할 뿐만 아니라, 열 발생부의 온도를 효과적으로 낮출 수 있다. Since the heat pipe of the present invention having such a structure is directly in contact with a semiconductor component such as an LED that generates heat, the heat pipe can effectively receive heat from the electronic component, and receives heat through the heat pipe, Heat can be transferred and distributed to the 1/2 heat sink dissipating in the middle. In addition, since the heat dissipation fins formed on the 1/2 heat dissipation plate are formed in different directions in the 1/2 heat dissipation plate, the heat dissipation fins are not only effectively dissipated heat of the heat pipe, The temperature can be lowered effectively.

이하 본 발명을 첨부한 예시도면을 참조하여 자세히 설명한다.Hereinafter, with reference to the accompanying drawings, the present invention will be described in detail.

도면 1은 본 발명에 따른 히트 파이프를 이용한 전자부품의 방열장치의 원리를 나타낸 개념적 측면도로서, 상기 개념도에 나타낸 바와 같이, 본 발명에 따른 전자부품의 방열장치는 열 발생원을 이루는 전자부품(1)에 양쪽 날개부(3)를 갖는 U자형 히트 파이프(5)가 직접 연결되고, 상기 U자형 히트 파이프(5)의 양쪽 날개부(3) 사이에 수직핀 형상으로 이루어진 1차 방열판(7)이 설치되며, 상기 히트 파 이프(5)의 양단 날개부(3)의 바깥쪽에 원통형으로 이루어진 2차 방열판(9)이 설치된 구조로 되어 있다.1 is a conceptual side view showing the principle of the heat dissipation device of the electronic component using the heat pipe according to the present invention, as shown in the conceptual diagram, the heat dissipation device of the electronic component according to the present invention is an electronic component (1) forming a heat source U-shaped heat pipes 5 having both wing parts 3 are directly connected to each other, and between the wing parts 3 of the U-shaped heat pipe 5, a primary heat sink 7 having a vertical fin shape is provided. It is provided, and the secondary heat sink 9 made of a cylindrical shape is installed on the outer side of the wing portion 3 of the heat pipe (5).

그리고, 상기 1차 방열판(7)과 2차 방열판(9)이 소정의 간격을 두고 배치되어 1차 방열판(7)과 2차 방열판(9) 사이에 공간부(11)가 형성되어 있다.The primary heat sink 7 and the secondary heat sink 9 are disposed at predetermined intervals, and a space 11 is formed between the primary heat sink 7 and the secondary heat sink 9.

상기 히트 파이프(5)는 일반적으로 널리 알려진 공지의 것을 그대로 사용하는데 그 내부에는 냉매와 같은 액체가 내장된 구조로서, 상기 전자 부품(1)에 직접 접촉하고 있는 부분의 히트 파이프(5) 내부에는 상기 전자 부품(1)에서 발생하는 열에 의해 냉매가 기화하면서 기화열을 빼앗아 전자 부품(1)을 식혀 주게 되고, 기화된 냉매는 상기 1차 방열판(7)과 2차 방열판(9)과 열교환하여 식어지면서 다시 응축(액화)되어 순환하면서 지속적으로 전자부품(1)의 열을 발산하여 식혀 주게 되는 것이다.The heat pipe 5 is generally used as it is well known in the art as a structure in which a liquid such as a refrigerant is embedded therein, inside the heat pipe 5 of the portion in direct contact with the electronic component (1) The heat generated from the electronic component 1 removes heat of vaporization while the refrigerant vaporizes, thereby cooling the electronic component 1, and the vaporized refrigerant cools by exchanging heat with the primary heat sink 7 and the secondary heat sink 9. It is condensed (condensed) and circulated as it is being formed, and it continuously cools by dissipating heat of the electronic component (1).

이와 같이 본 발명에서는 히트 파이프(5)가 열을 발생하는 전자부품(1)과 직접 접촉되어 있음으로 인하여 전자부품(1)의 열을 충분하게 전달받아 1차 및 2차 방열판(7,9)으로 전달할 수 있게 되므로, 그 만큼 열전달 효과가 커지게 되는 것이다.As described above, in the present invention, since the heat pipe 5 is in direct contact with the electronic component 1 that generates heat, the heat of the electronic component 1 is sufficiently transferred to the primary and secondary heat sinks 7 and 9. Because it can be transferred to, the heat transfer effect will be that much.

또한, 본 발명에 따른 방열장치는 상기 1차 방열판(7)에는 수직 방향으로 형성된 수직 방열핀(7a)이 형성되고, 2차 방열판(9)에는 수평 방열핀(9a)이 형성된 구조로 이루어져 있기 때문에, 히트 파이프(5)의 열을 효과적으로 대기 중으로 전달 할 수 있는 것이다.In addition, since the heat dissipation device according to the present invention has a structure in which the vertical heat dissipation fins 7a are formed in the vertical heat dissipation plate 7 in the vertical direction, and the second heat dissipation plate 9 is formed in the horizontal heat dissipation fins 9a, The heat of the heat pipe (5) can be effectively transferred to the atmosphere.

또, 본 발명에 따른 방열장치는 상기 1차 방열판(7)과 2차 방열판(9)이 공간 부(11)를 사이에 두고 배치되어 있기 때문에, 상기 공간부(11)를 통하여 공기가 충분하게 소통하면서 1차 방열판(7)과 2차 방열판(9)의 열을 대기 중으로 충분하게 전달하여 줄 수 있게 하여 방열효과를 높일 수가 있는 것이다.In the heat dissipation device according to the present invention, since the primary heat dissipation plate 7 and the secondary heat dissipation plate 9 are arranged with the space portion 11 interposed therebetween, air is sufficiently supplied through the space portion 11. While communicating, the heat from the primary heat sink 7 and the secondary heat sink 9 can be sufficiently delivered to the atmosphere, thereby increasing the heat dissipation effect.

도면 2는 본 발명에 따른 전자 부품의 방열장치에 대한 평면도로서, 히트 파이프(5)와 1차 방열판(7) 및 2차 방열판(9)의 배치구조를 나타낸 것이다. 2 is a plan view of the heat dissipation device of the electronic component according to the present invention, and shows the arrangement structure of the heat pipe 5, the primary heat sink 7, and the secondary heat sink 9.

상기 도면2에서 보는 바와 같이 2차 방열판(9)이 1차 방열판(7)을 바깥에서 둥글게 둘러싸고 있는 구조로 되어 있고, 1차 방열판(7)과 2차 방열판(9) 사이에 충분한 공간부(11)가 형성되어 공기 소통이 원활하게 이루어질 수 있는 구조로 되어 있다.As shown in FIG. 2, the secondary heat sink 9 has a structure in which the primary heat sink 7 is rounded from the outside, and a sufficient space portion between the primary heat sink 7 and the secondary heat sink 9 ( 11) is formed to have a structure that can smoothly communicate air.

도면 3은 본 발명에 따른 방열장치의 분해사시도로서, 발광다이오드의 인쇄회로 기판과 같은 전자부품(1)에 히트 파이프(5)가 직접 부착되고, 상기 히트 파이프(5)의 양쪽 날개부(3)사이에 수직 핀형으로 이루어진 1차 방열판(7)이 내장되고, 상기 양쪽 날개부(3)의 바깥쪽에 원형으로 이루어진 2차 방열판(9)이 배치된 구조를 나타낸 것이다.3 is an exploded perspective view of the heat dissipation device according to the present invention, in which a heat pipe 5 is directly attached to an electronic component 1 such as a printed circuit board of a light emitting diode, and both wing portions 3 of the heat pipe 5 are attached. The primary heat sink (7) is built between the vertical fin-shaped, and the secondary heat sink (9) made of a circular shape is disposed on the outer sides of the wings (3).

여기서, 상기 히트 파이프(5)와 전자부품(1)의 부착은 열전도 접착제를 도포하여 경화시킴으로써 부착되어지게 하거나, 또는 이 방법에 부가적으로 나사를 사용하여 취부시킬 수도 있으며, 기타 다른 방법을 사용할 수도 있다.Here, the attachment of the heat pipe 5 and the electronic component 1 may be attached by curing by applying a thermally conductive adhesive, or may be attached by screws in addition to this method, or other methods may be used. It may be.

도면 4는 도면 3의 방법에 의해 결합된 본 발명의 방열장치에 대한 사시도로서, 이 도면에 도시한 바와 같이 2차 방열판(9)의 양쪽 측면을 개방시켜 히트 파이프(5)와 1차 방열판(7)을 측면에서 끼워 넣을 수 있게 하거나, 또는 2차 방열판(9) 의 중앙에 구멍을 뚫고 상기 구멍 속으로 히트 파이프(5)와 1차 방열판(7)을 위쪽에서 삽입하여 설치할 수도 있다.Figure 4 is a perspective view of the heat dissipation device of the present invention coupled by the method of Figure 3, as shown in this figure by opening both sides of the secondary heat sink (9) heat pipe (5) and the primary heat sink ( 7) may be inserted from the side, or a hole may be drilled in the center of the secondary heat sink 9 and the heat pipe 5 and the primary heat sink 7 may be inserted into the hole from above.

그리고, 상기 2차 방열판(9)의 양쪽 측면 상하단에 소정 크기의 홈(13)을 형성시킴으로써, 상기 홈(13)을 통하여 공기의 2차 방열판(9)의 내부로 충분한 공기가 접촉하게 함으로써 방열효과를 증대시킬 수 있다.Then, by forming grooves 13 having a predetermined size on both side surfaces of the secondary heat sink 9, the air is radiated by making sufficient air contact the inside of the secondary heat sink 9 of air through the groove 13. The effect can be increased.

또한, 본 발명에 따른 2차 방열판(9)에는 외측면에서 내측면까지 관통 형성된 다수개의 관통 구멍(15)을 통하여 공기가 소통되어지게 함으로써 방열효과를 더 높일 수 있게 한다.In addition, the secondary heat sink 9 according to the present invention can further increase the heat dissipation effect by allowing air to communicate through a plurality of through holes 15 penetrating from the outer side to the inner side.

한편, 본 발명에 따른 방열 장치에서는 상기 2차 방열판(9)의 외측면을 요철 형상으로 형성시킴으로써 공기와 접촉하는 표피 면적을 증대시켜 냉각효과를 증대시키게 할 수가 있다.On the other hand, in the heat dissipation device according to the present invention, by forming the outer surface of the secondary heat sink 9 in an uneven shape, it is possible to increase the skin area in contact with air to increase the cooling effect.

이상에서 설명한 바와 같이, 본 발명에 따른 LED전구의 방열장치는 히트 파이프(5)가 발열하는 전자부품(1)에 직접 밀착 설치되어 있으므로, 전자 부품(1)의 열을 히트 파이프(5)에 효과적으로 전달할 수가 있으며, U자형으로 이루어진 상기 히트 파이프(5)의 양쪽 날개부(3)사이에 1차 방열판(7)이 장착되고 양쪽 날개부(3)의 바깥쪽에 2차 방열판(9)이 장착되어 있으면서, 상기 1차 방열판(7)과 2차 방열판(9) 사이에 소정의 공간부(11)가 형성된 구조로 이루어져 있으므로, 상기 1차 및 2차 방열판(7,9)이 히트 파이프(5)로부터 열을 전달받아 충분하게 공기와 접촉하면 서 효과적으로 대기로 발산시킬 수가 있으므로, 열전달 효과를 증대시킬 수 있는 것이다.As described above, since the heat dissipation device of the LED bulb according to the present invention is installed in close contact with the electronic component 1 in which the heat pipe 5 generates heat, the heat of the electronic component 1 is transferred to the heat pipe 5. It can transmit effectively, and the primary heat sink 7 is mounted between both wing portions 3 of the U-shaped heat pipe 5, and the secondary heat sink 9 is mounted on the outside of both wing portions 3. While having a structure in which a predetermined space 11 is formed between the primary heat sink 7 and the secondary heat sink 9, the primary and secondary heat sinks 7 and 9 are heat pipes 5. The heat can be effectively transferred to the atmosphere with sufficient heat in contact with the air, thereby increasing the heat transfer effect.

Claims (3)

열 발생원의 전자부품에 양쪽 날개부를 갖는 U자형 히트 파이프의 수평부가 직접 연결되고, 상기 U자형 히트 파이프의 양쪽 날개부 사이에 수직핀 형상으로 이루어진 1차 방열판이 설치되며, 상기 히트 파이프의 양단 날개부 바깥쪽에 원통형으로 이루어진 2차 방열판이 설치되어 있는 한편, 상기 1차 방열판과 2차 방열판을 소정의 간격을 두고 배치되어 1차 방열판과 2차 방열판 사이에 공간부가 형성된 구조로 이루어진 LED전구의 방열장치The horizontal portion of the U-shaped heat pipe having both wings is directly connected to the electronic component of the heat generating source, and a primary heat sink having a vertical fin shape is installed between both wings of the U-shaped heat pipe, and both wings of the heat pipe are installed. A secondary heat sink made of a cylindrical shape is installed on the outer side of the outer portion, while the primary heat sink and the second heat sink are disposed at a predetermined interval so that the heat dissipation of the LED bulb is formed in a space formed between the primary heat sink and the second heat sink. Device 제1항에 있어서, 상기 2차 방열판의 측면에 다수개의 공기소통용 관통구멍이 형성된 것을 특징으로 하는 LED전구의 방열장치The heat dissipation device of claim 1, wherein a plurality of air communication through holes are formed on the side surfaces of the secondary heat sink. 제1항에 있어서, 상기 2차 방열판의 상하단에 공기 소통용 홈이 형성된 것을 특징으로 하는 LED전구의 방열장치The heat dissipation device of claim 1, wherein grooves for air communication are formed at upper and lower ends of the secondary heat sink.
KR1020070037020A 2007-04-16 2007-04-16 An apparatus for radiating heat of led light KR100891433B1 (en)

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