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KR102345450B1 - 펄스-모드 직접-기록 레이저 금속화 - Google Patents

펄스-모드 직접-기록 레이저 금속화 Download PDF

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Publication number
KR102345450B1
KR102345450B1 KR1020167026671A KR20167026671A KR102345450B1 KR 102345450 B1 KR102345450 B1 KR 102345450B1 KR 1020167026671 A KR1020167026671 A KR 1020167026671A KR 20167026671 A KR20167026671 A KR 20167026671A KR 102345450 B1 KR102345450 B1 KR 102345450B1
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KR
South Korea
Prior art keywords
pattern
matrix
substrate
sintering
delete delete
Prior art date
Application number
KR1020167026671A
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English (en)
Korean (ko)
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KR20160144985A (ko
Inventor
미쉘 제노우
지비 코틀러
조나단 엔크리
아브라함 로트네머
올레그 에르마크
Original Assignee
오르보테크 엘티디.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 오르보테크 엘티디. filed Critical 오르보테크 엘티디.
Publication of KR20160144985A publication Critical patent/KR20160144985A/ko
Application granted granted Critical
Publication of KR102345450B1 publication Critical patent/KR102345450B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/705—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1492—Periodical treatments, e.g. pulse plating of through-holes

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Powder Metallurgy (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Thermal Transfer Or Thermal Recording In General (AREA)
KR1020167026671A 2014-04-10 2015-04-05 펄스-모드 직접-기록 레이저 금속화 KR102345450B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461977766P 2014-04-10 2014-04-10
US61/977,766 2014-04-10
PCT/IB2015/052476 WO2015155662A1 (en) 2014-04-10 2015-04-05 Pulsed-mode direct-write laser metallization

Publications (2)

Publication Number Publication Date
KR20160144985A KR20160144985A (ko) 2016-12-19
KR102345450B1 true KR102345450B1 (ko) 2021-12-29

Family

ID=54287371

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167026671A KR102345450B1 (ko) 2014-04-10 2015-04-05 펄스-모드 직접-기록 레이저 금속화

Country Status (7)

Country Link
EP (1) EP3140853A4 (zh)
JP (1) JP6635313B2 (zh)
KR (1) KR102345450B1 (zh)
CN (1) CN106133891B (zh)
IL (1) IL247946B (zh)
TW (1) TWI661752B (zh)
WO (1) WO2015155662A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106575077A (zh) 2014-08-07 2017-04-19 奥宝科技有限公司 Lift印刷系统
WO2016063270A1 (en) 2014-10-19 2016-04-28 Orbotech Ltd. Llift printing of conductive traces onto a semiconductor substrate
CN107208256B (zh) 2015-01-19 2020-08-11 奥博泰克有限公司 使用牺牲支持体的三维金属结构体的打印
KR20180030609A (ko) 2015-07-09 2018-03-23 오르보테크 엘티디. Lift 토출 각도의 제어
EP3377290B1 (en) 2015-11-22 2023-08-02 Orbotech Ltd. Control of surface properties of printed three-dimensional structures
TW201901887A (zh) 2017-05-24 2019-01-01 以色列商奧寶科技股份有限公司 於未事先圖樣化基板上電器互連電路元件
KR102040530B1 (ko) * 2018-04-25 2019-11-05 성균관대학교산학협력단 광소결을 이용해 재배선층을 형성하는 방법
EP3566799B1 (en) * 2018-05-08 2023-09-27 Seco Tools Ab A method for manufacturing a sintered body
CN112201571A (zh) * 2020-10-30 2021-01-08 英诺激光科技股份有限公司 在碳化硅基板上形成欧姆接触的方法及系统

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006038999A (ja) * 2004-07-23 2006-02-09 Sumitomo Electric Ind Ltd レーザ照射を用いた導電性回路形成方法と導電性回路
JP2012023380A (ja) * 2010-07-14 2012-02-02 Korea Advanced Inst Of Sci Technol パターンの製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61290796A (ja) * 1985-06-19 1986-12-20 沖電気工業株式会社 厚膜混成集積回路基板の製造方法
JPS63209193A (ja) * 1987-02-25 1988-08-30 松下電器産業株式会社 導体パタ−ン形成方法
JPH11307914A (ja) * 1998-04-21 1999-11-05 Matsushita Electric Ind Co Ltd 厚膜配線基板のパターン形成方法
US6921626B2 (en) * 2003-03-27 2005-07-26 Kodak Polychrome Graphics Llc Nanopastes as patterning compositions for electronic parts
US7682970B2 (en) * 2003-07-16 2010-03-23 The Regents Of The University Of California Maskless nanofabrication of electronic components
US7294449B1 (en) 2003-12-31 2007-11-13 Kovio, Inc. Radiation patternable functional materials, methods of their use, and structures formed therefrom
TWI324423B (en) * 2005-11-01 2010-05-01 Cymer Inc Laser system
US20070105395A1 (en) * 2005-11-04 2007-05-10 Edward Kinzel Laser functionalization and patterning of thick-film inks
US10231344B2 (en) 2007-05-18 2019-03-12 Applied Nanotech Holdings, Inc. Metallic ink
US8404160B2 (en) * 2007-05-18 2013-03-26 Applied Nanotech Holdings, Inc. Metallic ink
US20090120924A1 (en) * 2007-11-08 2009-05-14 Stephen Moffatt Pulse train annealing method and apparatus
US8476552B2 (en) 2008-03-31 2013-07-02 Electro Scientific Industries, Inc. Laser systems and methods using triangular-shaped tailored laser pulses for selected target classes
JP2009290112A (ja) * 2008-05-30 2009-12-10 Fujifilm Corp 導電性無機膜とその製造方法、配線基板、半導体装置
US8422197B2 (en) * 2009-07-15 2013-04-16 Applied Nanotech Holdings, Inc. Applying optical energy to nanoparticles to produce a specified nanostructure
TW201339279A (zh) * 2011-11-24 2013-10-01 Showa Denko Kk 導電圖型形成方法及藉由光照射或微波加熱的導電圖型形成用組成物
KR102107871B1 (ko) * 2013-02-18 2020-05-08 오르보테크 엘티디. 두-단계, 직접-기록 레이저 금속배선

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006038999A (ja) * 2004-07-23 2006-02-09 Sumitomo Electric Ind Ltd レーザ照射を用いた導電性回路形成方法と導電性回路
JP2012023380A (ja) * 2010-07-14 2012-02-02 Korea Advanced Inst Of Sci Technol パターンの製造方法

Also Published As

Publication number Publication date
IL247946A0 (en) 2016-11-30
CN106133891B (zh) 2020-03-03
TWI661752B (zh) 2019-06-01
JP2017513040A (ja) 2017-05-25
CN106133891A (zh) 2016-11-16
IL247946B (en) 2022-08-01
JP6635313B2 (ja) 2020-01-22
WO2015155662A1 (en) 2015-10-15
TW201543978A (zh) 2015-11-16
EP3140853A1 (en) 2017-03-15
KR20160144985A (ko) 2016-12-19
EP3140853A4 (en) 2018-01-17

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