KR102319597B1 - 적층 세라믹 전자부품 - Google Patents
적층 세라믹 전자부품 Download PDFInfo
- Publication number
- KR102319597B1 KR102319597B1 KR1020190077325A KR20190077325A KR102319597B1 KR 102319597 B1 KR102319597 B1 KR 102319597B1 KR 1020190077325 A KR1020190077325 A KR 1020190077325A KR 20190077325 A KR20190077325 A KR 20190077325A KR 102319597 B1 KR102319597 B1 KR 102319597B1
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- South Korea
- Prior art keywords
- thickness
- electrode
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- ceramic body
- electronic component
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- 239000000919 ceramic Substances 0.000 title claims abstract description 147
- 238000007747 plating Methods 0.000 claims abstract description 44
- 238000000034 method Methods 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 239000011521 glass Substances 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 20
- 239000003985 ceramic capacitor Substances 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 9
- 239000000843 powder Substances 0.000 description 9
- 229910052759 nickel Inorganic materials 0.000 description 8
- 238000010304 firing Methods 0.000 description 7
- 239000010949 copper Substances 0.000 description 6
- 239000003990 capacitor Substances 0.000 description 5
- 229910010293 ceramic material Inorganic materials 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 229910002113 barium titanate Inorganic materials 0.000 description 3
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
- 229910052454 barium strontium titanate Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 238000000462 isostatic pressing Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
- H01G4/302—Stacked capacitors obtained by injection of metal in cavities formed in a ceramic body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/248—Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020190077325A KR102319597B1 (ko) | 2019-06-27 | 2019-06-27 | 적층 세라믹 전자부품 |
| US16/872,678 US11342123B2 (en) | 2019-06-27 | 2020-05-12 | Multi-layered ceramic electronic component |
| CN202021232560.7U CN212136266U (zh) | 2019-06-27 | 2020-06-29 | 多层陶瓷电子组件 |
| CN202010607665.4A CN112151271B (zh) | 2019-06-27 | 2020-06-29 | 多层陶瓷电子组件 |
| CN202311602218.XA CN117393324A (zh) | 2019-06-27 | 2020-06-29 | 多层陶瓷电子组件 |
| KR1020210123717A KR102437803B1 (ko) | 2019-06-27 | 2021-09-16 | 적층 세라믹 전자부품 |
| US17/726,908 US11699554B2 (en) | 2019-06-27 | 2022-04-22 | Multi-layered ceramic electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020190077325A KR102319597B1 (ko) | 2019-06-27 | 2019-06-27 | 적층 세라믹 전자부품 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020210123717A Division KR102437803B1 (ko) | 2019-06-27 | 2021-09-16 | 적층 세라믹 전자부품 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20190116117A KR20190116117A (ko) | 2019-10-14 |
| KR102319597B1 true KR102319597B1 (ko) | 2021-11-02 |
Family
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020190077325A KR102319597B1 (ko) | 2019-06-27 | 2019-06-27 | 적층 세라믹 전자부품 |
| KR1020210123717A KR102437803B1 (ko) | 2019-06-27 | 2021-09-16 | 적층 세라믹 전자부품 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020210123717A KR102437803B1 (ko) | 2019-06-27 | 2021-09-16 | 적층 세라믹 전자부품 |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US11342123B2 (zh) |
| KR (2) | KR102319597B1 (zh) |
| CN (3) | CN212136266U (zh) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102319597B1 (ko) * | 2019-06-27 | 2021-11-02 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
| KR20220071499A (ko) * | 2020-11-24 | 2022-05-31 | 삼성전기주식회사 | 적층형 전자 부품 |
| KR20220084754A (ko) * | 2020-12-14 | 2022-06-21 | 삼성전기주식회사 | 적층형 전자 부품 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101800212B1 (ko) * | 2015-03-12 | 2017-11-22 | 가부시키가이샤 무라타 세이사쿠쇼 | 적층 세라믹 콘덴서 및 그 제조방법 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06224073A (ja) | 1993-01-25 | 1994-08-12 | Tokin Corp | 積層セラミックコンデンサの製造方法 |
| JP5093351B2 (ja) | 2008-07-29 | 2012-12-12 | 株式会社村田製作所 | 積層セラミックコンデンサ |
| JP2012004480A (ja) | 2010-06-21 | 2012-01-05 | Tdk Corp | 電子部品の製造方法及び電子部品 |
| KR102029468B1 (ko) | 2012-01-18 | 2019-10-07 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 이의 제조방법 |
| KR101983129B1 (ko) * | 2012-01-18 | 2019-05-28 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 이의 제조방법 |
| JPWO2015045625A1 (ja) * | 2013-09-24 | 2017-03-09 | 株式会社村田製作所 | 積層セラミック電子部品 |
| US9892854B2 (en) | 2015-03-12 | 2018-02-13 | Murata Manufacturing Co., Ltd. | Multilayer ceramic capacitor and method for manufacturing the same |
| JP6597008B2 (ja) | 2015-07-16 | 2019-10-30 | 株式会社村田製作所 | 積層セラミックコンデンサ及び積層セラミックコンデンサの製造方法 |
| JP6665438B2 (ja) * | 2015-07-17 | 2020-03-13 | 株式会社村田製作所 | 積層セラミックコンデンサ |
| JP6690176B2 (ja) * | 2015-10-06 | 2020-04-28 | Tdk株式会社 | 電子部品 |
| JP6508098B2 (ja) * | 2016-03-17 | 2019-05-08 | 株式会社村田製作所 | 電子部品及び電子部品の製造方法 |
| JP6496270B2 (ja) * | 2016-04-14 | 2019-04-03 | 太陽誘電株式会社 | セラミック電子部品及びその製造方法 |
| JP6851747B2 (ja) * | 2016-08-17 | 2021-03-31 | 太陽誘電株式会社 | 積層セラミック電子部品 |
| JP6890940B2 (ja) * | 2016-09-16 | 2021-06-18 | Tdk株式会社 | 電子部品 |
| JP2018110185A (ja) * | 2017-01-04 | 2018-07-12 | 株式会社村田製作所 | 積層セラミックコンデンサの製造方法、セラミック積層体及び積層セラミックコンデンサ |
| KR102319597B1 (ko) * | 2019-06-27 | 2021-11-02 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
-
2019
- 2019-06-27 KR KR1020190077325A patent/KR102319597B1/ko active IP Right Grant
-
2020
- 2020-05-12 US US16/872,678 patent/US11342123B2/en active Active
- 2020-06-29 CN CN202021232560.7U patent/CN212136266U/zh active Active
- 2020-06-29 CN CN202010607665.4A patent/CN112151271B/zh active Active
- 2020-06-29 CN CN202311602218.XA patent/CN117393324A/zh active Pending
-
2021
- 2021-09-16 KR KR1020210123717A patent/KR102437803B1/ko active IP Right Grant
-
2022
- 2022-04-22 US US17/726,908 patent/US11699554B2/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101800212B1 (ko) * | 2015-03-12 | 2017-11-22 | 가부시키가이샤 무라타 세이사쿠쇼 | 적층 세라믹 콘덴서 및 그 제조방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN212136266U (zh) | 2020-12-11 |
| US20200411245A1 (en) | 2020-12-31 |
| US11699554B2 (en) | 2023-07-11 |
| US11342123B2 (en) | 2022-05-24 |
| CN112151271B (zh) | 2023-12-08 |
| US20220246360A1 (en) | 2022-08-04 |
| CN117393324A (zh) | 2024-01-12 |
| KR20190116117A (ko) | 2019-10-14 |
| KR20210118784A (ko) | 2021-10-01 |
| CN112151271A (zh) | 2020-12-29 |
| KR102437803B1 (ko) | 2022-08-30 |
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