KR102192600B1 - Marking device and pattern generation device - Google Patents

Abstract

Provides a marking device capable of improving processing precision and shortening working time at the same time. Specifically, the marking device 1 includes a first laser processing unit 3a, 3b serving as a first marking unit for marking a workpiece with a first dot diameter, and a first laser processing unit 3a, 3b having a dot diameter smaller than the first dot diameter. 2nd laser processing parts 5a and 5b as second marking parts for marking the workpiece with a dot diameter, and a first drawing pattern for drawing a drawing pattern by the first laser processing units 3a and 3b And a device PC 7 as a divided drawing pattern registration unit that divides and registers a second drawing pattern drawn by the second laser processing units 5a and 5b.

Description

Marking device and pattern generation device {MARKING DEVICE AND PATTERN GENERATION DEVICE}

The present invention relates to a marking device and a pattern generating device.

The marking device is a device that prints (marks) a predetermined shape such as characters, symbols, figures, and wiring patterns on a work piece such as a semiconductor device, a substrate for a liquid crystal display, or an electronic component.

As a specific marking device, a laser marking device has been proposed in which a laser beam is converged to a predetermined dot diameter and scanned in a two-dimensional direction while irradiating the surface of an object to be processed, thereby marking characters or figures on the surface of the object (e.g. For example, Patent Document 1).

In addition, as a configuration of a laser marking device, a configuration in which one pulsed laser light irradiated from one laser unit is assigned to a plurality of optical paths to perform processing is also known (for example, Patent Document 2).

In addition, as a configuration of a laser marking device, a configuration in which the dot diameter is changed to be small when laser printing is performed, and a configuration capable of fine printing with a thin line width and a small size is also proposed (for example, Patent Document 3).

Japanese Patent Publication No. 2005-66611 Japanese Patent Publication No. 2005-74479 Japanese Patent Publication No. 2009-285693

Here, as a requirement for the marking device, high processing precision is mentioned, but in consideration of productivity, reduction of working time is also required.

However, in the techniques disclosed in Patent Documents 1 to 3, there is a problem that it is difficult to achieve both processing precision and reduction in working time.

Specifically, in the technique disclosed in Patent Literature 1, the work time is shortened as the dot diameter of the laser used for marking increases, but there is a problem that the processing accuracy deteriorates since it becomes impossible to draw a fine pattern. On the other hand, since the smaller the dot diameter used for marking, the finer the pattern can be drawn, so that the processing accuracy is improved, but the processing time becomes longer, so that it is difficult to shorten the working time.

That is, in the technique disclosed in Patent Document 1, there is a problem that the processing precision and the reduction in working time become a trade-off relationship.

In addition, as disclosed in Patent Document 2, in the technique of allocating a plurality of laser beams from one laser light source to a plurality of optical paths and marking, the working time can be shortened compared to the case of marking using only one optical path. However, there is a problem that the machining accuracy cannot be improved, and there is a problem that there is no change in the point where the machining accuracy and the reduction of the working time become a trade-off relationship.

In addition, as disclosed in Patent Document 3, in the structure of marking while changing the dot diameter irradiated from one laser light source, both processing precision and shortening of the working time are achieved, but for changing the dot diameter It is necessary to change the setting of the laser optical system or laser output.

For this reason, it is difficult to follow the change of the dot diameter sequentially with the change of these settings, and there is a problem that the processing accuracy is not sufficiently improved.

As described above, all of the marking apparatuses described in Patent Documents 1 to 3 have problems, and there is no technology capable of simultaneously realizing improvement in processing precision and shortening working time.

The present invention has been made in view of the above problems, and an object thereof is to provide a marking device capable of simultaneously realizing improvement in processing precision and reduction in working time.

In order to solve the above-described problem, a first aspect of the present invention is a marking device for drawing a predetermined drawing pattern in a marking area set on a workpiece, wherein a first dot diameter is used to mark the workpiece. A marking unit, a second marking unit for marking the workpiece with a second dot diameter smaller than the first dot diameter, and a first drawing pattern for drawing the drawing pattern by the first marking unit And a divided drawing pattern registration unit that divides and registers a second drawing pattern to be drawn by the second marking unit.

A second aspect of the present invention includes an entire drawing pattern registration unit that registers the entire drawing pattern marked by the marking device according to the first aspect as an entire drawing pattern, and the first drawing pattern and the first drawing pattern from the entire drawing pattern. It is a divided drawing pattern generation apparatus provided with the divided drawing pattern generation part which divides and generates 2 drawing patterns.

Advantageous Effects of Invention According to the present invention, it is possible to provide a marking device capable of simultaneously realizing improvement in processing precision and reduction in working time.

1 is a perspective view showing a schematic configuration of a marking device 1 according to an embodiment of the present invention.
Fig. 2 is a block diagram of a marking device 1 according to an embodiment of the present invention, where thick lines are connected by dedicated lines, waveform lines are connected by communication, and thin lines are connected to I/O (input/output) ports Connection by means of, and dotted line means connection by analog line.
3 is a cross-sectional view of a film 100 according to an embodiment of the present invention.
4 is a plan view showing a marking area 203 on a film 100 according to an embodiment of the present invention.
5 is a perspective view showing a schematic configuration of the first laser processing unit 3a.
6 is a plan view showing an example of a drawing pattern 113 formed on the film 100.
7 is a flowchart showing the procedure of marking using the marking device 1.
FIG. 8 is a plan view showing an example of a drawing pattern 113 formed on the film 100, and is an enlarged view of the vicinity of the wiring pattern 70 in FIG. 6.
9 is an enlarged view of area A of FIG. 8.
10 is a plan view showing an example of the first drawing pattern 115 and is a diagram corresponding to FIG. 8.
11 is a plan view showing an example of the second drawing pattern 117, and is a diagram corresponding to FIG. 8.
12 is a detailed flowchart of S6 in FIG. 7.
13 is a side view of the periphery of the processing table 21 of the marking device 1 according to the embodiment of the present invention, and is a diagram corresponding to each flow in FIG. 12.
14 is a side view of the periphery of the processing table 21 of the marking device 1 according to the embodiment of the present invention, and is a diagram corresponding to each flow in FIG. 12.
Fig. 15 is a plan view showing an example of the first reference mark 73 for positioning and the second reference mark 75 for positioning.

Hereinafter, embodiments suitable for the present invention will be described in detail with reference to the drawings.

First, a configuration of the marking device 1 according to the present embodiment will be described with reference to FIGS. 1 and 2.

Here, as the marking device 1, a laser marking device for marking the surface of the film 100 using a laser is illustrated. As is clear from the drawing, the marking device 1 according to the present invention includes a plurality of marking portions. In this example, the first and second marking portions are provided.

Specifically, the illustrated marking device 1 is a first marking portion for marking a workpiece with a laser having a first dot diameter, which is less than two first laser processing portions 3a and 3b, and a first dot diameter. Two second laser processing units 5a and 5b are provided as a second marking unit for marking a workpiece with a laser having a second dot diameter having a small dot diameter. In addition, the device PC 7 shown in FIG. 2 operates as a control device for controlling marking to be described later together with a PLC (Programmable Logic Controller) 37.

Among them, the device PC 7 has a control unit 6 and a storage unit 7a, and the storage unit 7a includes a storage area 12 for storing a drawing pattern, which is information on the overall pattern shape to be marked, and A first partial storage area 14 for storing a first drawing pattern drawn by the 1 laser processing units 3a and 3b and a second drawing pattern drawn by the second laser processing units 5a and 5b are stored. It has a second partial storage area 16. In this way, in the storage unit 7a, the entire drawing pattern is divided and registered in the first and second partial storage areas 14 and 16. For this reason, the apparatus PC 7 operates as a division drawing pattern registration part which divides and registers drawing patterns.

As described above, in the present embodiment, the device PC 7 performs the process of registering a drawing pattern and generating the first drawing pattern and the second drawing pattern by dividing the drawing pattern, so that the device PC 7 is the entire drawing pattern registration unit. And a function as a divided drawing pattern generation unit. The configuration of the marking device 1 will be described in more detail with reference to FIGS. 1 to 5.

As shown in FIGS. 1 and 2, the marking device 1 winds up the unwinding machine 11 for unwinding the film 100 as a workpiece, and the film 100 unwinding from the unwinding machine 11. It has a take-up machine (13).

The film 100 is, as shown in FIG. 3, in which a metal layer 103 is formed on a substrate 101 such as a polymer film, and the first laser processed portions 3a and 3b on the metal layer 103 and By selectively irradiating a laser from the second laser processing portions 5a and 5b, the irradiated portion is removed to form a predetermined wiring pattern.

On the other hand, in the marking device 1, between the take-up machine 11 and the take-up machine 13, and below the film 100, the marking area 203 (to be described in detail later) of the film 100 is adsorbed. A processing table 21 is provided as a relative moving portion to be held. The processing table 21 is a direction parallel to the transport direction of the film 100, the direction parallel to the direction of +x and -x in FIG. 1, and a direction parallel to the normal direction of the plane of the film 100 by the driving unit 23 It can be moved in the direction of +z and -z.

On the other hand, in the processing table 21, the movable distance in the +x and -x directions is limited to the distance H in FIG. 1, and the film 100 is temporarily adsorbed and held at both ends of the movement limit. The holding table 25 is provided. The holding table 25 is movable in the directions of +z and -z in Fig. 1 by an actuator not shown.

Although it will be described later in detail, the processing table 21 prevents the positional shift of the film 100 by adsorbing the film 100 during marking and following the film 100 during transport of the film.

In addition, when the processing table 21 reaches the movement limit by conveyance of the film 100, the film 100 is temporarily adsorbed by the holding table 25, and the processing table 21 is attached to the film ( 100) and return the processing table to the upstream side (the unwinder 11 side).

In addition, above the processing table 21, the first laser processing units 3a, 3b and the second laser processing units 5a, 5b are provided, and alignment as an overlapping displacement measurement unit for alignment correction described later Unit 27 is installed. As shown in Fig. 2, the alignment unit 27 is provided with an imaging unit 28 such as a CCD (Charge Coupled Device) camera as a reference mark imaging unit.

In addition, in the marking device 1, the first laser processing units 3a and 3b are fixed, but the second laser processing units 5a and 5b are provided with a driving stage 29 such as an XYθ stage or a UVW stage as a marking position correction unit. ) Is installed, and the second laser processing units 5a, 5b with respect to the film 100 and the first laser processing units 3a, 3b rotate (θ) with the horizontal (XY) direction and the z direction as the rotation axis. It is possible to move relative to the) direction.

In addition, the marking device 1 has a laser power meter 33 and a converter 35 for measuring the output of the laser.

The device PC 7 is a computer that drives and controls each component of the marking device 1, and to the device PC 7, a monitor 8 and a keyboard 10 for operating the device PC 7 are input/output. It is installed as a device. These input/output devices may be tablet-type input/output devices.

In addition, the device PC 7 controls the processing table 21 (and the unwinder 11 and the winder 13) to provide the first laser processing units 3a and 3b and the second laser for the film 100. It also has a function as a movement marking control unit that performs marking while relatively moving the processing units 5a and 5b. In addition, as described above, in the present embodiment, the device PC 7 and the PLC 37 operate as control devices that control marking to be described later. More specifically, the device PC 7 has the laser processing conditions (laser current value, laser oscillation frequency, galvano scanning speed, and the first laser processing units 3a and 3b) and the second laser processing units 5a and 5b. Setting of the conveyance speed of the processing table 21, the conveyance distance of the processing table 21, the conditions of the alignment unit 27, the conditions of the laser power meter 33, the layout of laser processing, and precision correction data of laser processing) , In addition to mainly performing processing instruction control that affects the first laser processing units 3a, 3b and the second laser processing units 5a, 5b, information indicating that processing has been completed (processing completion trigger) It is also responsible for transmitting to (37).

In addition, the PLC 37 controls the operation of the processing table 21, the operation control of the holding table 25, the vacuum suction of the processing table 21 and the holding table 25 and control of the release of suction, not shown. Configurations other than the first laser processing units 3a and 3b and the second laser processing units 5a and 5b, such as controlling the operation of a dust collector, laser chiller, and table nip, and controlling the opening and closing operation of the laser mechanism shutter In addition to controlling the operation of the device, it also plays a role of transmitting information (trigger) indicating that the control of the operation is completed to the device PC 7.

The apparatus PC 7 and the 1st laser processing part 3a, 3b, the 2nd laser processing part 5a, 5b, the unwinder 11, the take-up machine 13, the processing table 21, the holding table ( 25), the alignment unit 27, the drive stage 29, and the laser power meter 33 (converter 35) are connected via a PLC (Programmable Logic Controller) 37.

In addition, the illustrated first laser processing units 3a and 3b and the second laser processing units 5a and 5b are formed between the first laser processing units 3a and 3b, and the second laser processing units 5a and 5b. Are arranged in parallel (direction perpendicular to the transport direction) with respect to the transport direction of the film 100.

Therefore, as shown in FIG. 4, the area|region (marking area 203) which marks in the film 100 at a time is a rough processing area processed by the 1st laser processing parts 3a, 3b ( 103a and 103b and the second laser processing units 5a and 5b are divided into four fine processing regions 105a and 105b that are processed.

Thereby, when marking is performed, the marking area 203 is drawn by the first drawing pattern (2 areas) and the second laser processing units 5a, 5b drawn by the first laser processing units 3a and 3b. It is necessary to register information of the pattern divided into the second drawing pattern (2 areas) in advance in the device PC 7.

Here, the configuration and operation of the first laser processing units 3a and 3b will be outlined with reference to FIG. 5.

In addition, since the configurations of the first laser processing unit 3b and the second laser processing units 5a and 5b are the same as those of the first laser processing unit 3a, the description is omitted.

As shown in Fig. 5, the first laser processing unit 3a is provided on a light source 51 for irradiating a laser such as a YAG (Yttrium Aluminum Garnet) laser, and on the optical path of the laser irradiated from the light source, and The beam expander 53, which is a lens that adjusts the diameter, the corner mirrors 55 and 57 for changing the direction of the laser transmitted through the beam expander 53, the Z axis of the laser incident from the corner mirror 57 (see Fig. 5). The Z scanner 59 and the objective lens 61 for adjusting the focus in the) direction, the XY galvano scanner 63 for adjusting the X-axis and Y-axis coordinates of the light transmitted through the objective lens 61, and these components It has a laser processing unit PC (39) that controls the operation of the machine.

That is, in the first laser processing unit 3a, the laser irradiated with a predetermined output from the light source 51 is adjusted to a predetermined dot diameter by the beam expander 53, and the Z scanner 59, the objective lens 61 ), the position coordinates irradiated by the XY galvano scanner 63 and the focus at the position are adjusted, and irradiated to the desired position of the film 100 with the first dot diameter 303. In general, the dot diameter can be varied by adjusting the Z scanner 59, the objective lens 61, or the like. However, it was found that when the dot diameter was adjusted by time-divisionally adjusting the optical system, the beam energy of the film 100 became non-uniform and the quality of the marking deteriorated. For this reason, in the present invention, a plurality of laser processing units are adjusted so that lasers of different dot diameters have substantially equal energy on the film 100. The output of the first laser processing units 3a and 3b in this embodiment is 11 watts, and the repetition frequency is 40 kHz.

On the other hand, the second laser processing units 5a and 5b differ from the first laser processing units 3a and 3b only in that the laser is irradiated with the second dot diameter 304. If the second dot diameter 304 is a dot diameter smaller than the first dot diameter, the size is not particularly limited, but, for example, the ratio of the diameter of the first dot diameter 303 to the diameter of the second dot diameter 304 is It's about 4:1. In this example, the outputs of the second laser processing units 5a and 5b are 2 watts, and the repetition frequency is 40 kHz.

The above is a schematic of the configuration and operation of the first laser processing unit 3a.

Next, the procedure of marking using the marking device 1 will be described with reference to FIGS. 6 to 15.

First, in the following description, an example of a drawing pattern formed on the film 100 will be described with reference to FIG. 6.

As shown in FIG. 6, 16 wiring patterns 70 are formed in the drawing pattern 113 in the rectangular marking area 203, and the position for alignment for alignment is confirmed at four corners of the marking area 203 A reference mark 71 for use is formed.

Next, the procedure of marking will be described.

First, the device PC 7 (the control unit 6) of the marking device 1 registers the drawing pattern 113 and the first drawing pattern and the second drawing pattern corresponding to the drawing pattern in the storage unit 7a. It is determined whether or not (S1 in Fig. 7), and if registered, marking (drawing of the pattern) is performed according to the registered pattern (S2 in Fig. 7).

When the first drawing pattern and the second drawing pattern are not registered, the control unit 6 of the device PC 7 generates a first drawing pattern and a second drawing pattern (divided drawing pattern) according to the following procedure. Register. In addition, although the device PC 7 is used as the divided drawing pattern generating unit (or divided drawing pattern generating device) for generating the divided drawing pattern, the drawing pattern is not produced by the apparatus PC 7 but with another computer (pattern Generator) may be used.

First, the control unit 6 of the device PC 7 reads pattern shape data such as CAD data corresponding to a drawing pattern (S3 in Fig. 7).

Next, the control unit 6 of the device PC 7 converts the read CAD data into Gerber data (S4 in Fig. 7).

Next, the control unit 6 of the device PC 7 divides the Gerber data into a plurality of areas corresponding to the number of laser processing units (S5 in Fig. 7). The method of division and the shape of the region are the same as in FIG. 4. That is, since the marking device 1 has four laser processing units, the first laser processing units 3a and 3b and the second laser processing units 5a and 5b, the Gerber data is divided into four areas.

Next, the control unit 6 of the device PC 7 divides and registers the first drawing pattern and the second drawing pattern from the divided area (S6 in Fig. 7).

Here, a method of dividing the drawing pattern into a first drawing pattern and a second drawing pattern will be described.

As described above, the first laser processing units 3a and 3b for drawing the first drawing pattern are more than the second laser processing units 5a and 5b for drawing the second drawing pattern, the dot diameter of the laser at the time of drawing Since this large, large area can be drawn at high speed, first, a region that can be drawn with the first dot diameter 303 is basically set as a first drawing pattern.

On the other hand, a second drawing pattern is set as an area that complements the area not drawn by the first dot diameter 303.

As such an area|region, the area|region shown in FIG. 8 and FIG. 9 is mentioned.

First, when there is the drawing pattern 113 shown in FIG. 8 and the diameter of the first dot diameter 303 is D, the regions 305, 306, 307, 309 smaller than D (narrow width) are first Since it cannot be drawn by the laser processing units 3a and 3b, it is set as a second drawing pattern to be drawn by the second laser processing units 5a and 5b having the second dot diameter 304.

In addition, as shown in Fig. 8, even within a region larger than D, the dot shape of the laser has a circular planar shape, so a certain gap 315 is created between the outline 313 of the drawing pattern and the first drawing pattern. . This gap is also set as a second drawing pattern. In addition, as shown in Fig. 9, since a region that cannot be drawn with the first dot diameter 303 also occurs in the corner portion 311 of the drawing pattern, this region is also set as the second drawing pattern.

The first drawing pattern 115 generated in this way is shown in FIG. 10 and the second drawing pattern 117 is shown in FIG. 11.

The above is a method of dividing a drawing pattern into a first drawing pattern and a second drawing pattern.

In this way, by using a plurality of laser processing units having individual light sources and having different dot diameters, a portion that needs to be processed on a large area is drawn at high speed by the laser processing unit with the larger dot diameter, and fine processing is required. The marking device 1 can simultaneously realize an improvement in processing accuracy and a reduction in working time by accurately drawing a portion to be denoted by a laser processing unit having a small dot diameter.

Next, a drawing method of a drawing pattern (S2 in FIG. 7) will be described in more detail with reference to FIGS. 12 to 15.

First, the marking device 1 (PLC 37 of the device PC 7) drives the take-up machine 11 and the take-up machine 13 by a motor or the like (not shown), and the first laser processing unit 3a, The film 100 is conveyed so that the marking area 203 of the film 100 may be placed in a position where 3b) can be drawn (S11 in Fig. 12). At this time, the processing table 21 is controlled by the PLC 37 and moves while adsorbing and holding the lower surface of the marking area 203. When the movement of the processing table 21 is completed, the PLC 37 transmits information indicating that the movement is completed (movement completion trigger) and the position information of the processing table 21 to the device PC 7.

Next, the device PC 7 which has received the movement completion trigger and the position information of the processing table 21, based on the position information of the processing table 21, determines the position information and the position information in the processing layout of the storage unit 7a. Matching one (first drawing pattern) is selected, and processing is instructed to the first laser processing units 3a and 3b (laser processing unit PC 39) based on the selected processing layout. The first laser processing units 3a and 3b instructed to irradiate a laser to the rough processing regions 103a and 103b based on the first drawing pattern to perform patterning (S12 in Fig. 12). At this time, the reference mark 71 for positioning is depicted on the rough processing regions 103a and 103b by the first laser processing units 3a and 3b. Here, the reference mark 71 for position confirmation depicted by the first laser processing units 3a and 3b is referred to as a first reference mark 73 for position confirmation. When processing is completed, the device PC 7 transmits information (processing completion trigger) indicating that the processing has been completed to the PLC 37.

Next, the PLC 37, which has received the processing completion trigger, drives the take-up machine 11 and the take-up machine 13 by a motor or the like (not shown), so that the area corresponding to the previous rough processing areas 103a and 103b is The film 100 is conveyed in the direction of +x to a position overlapping the next fine processing regions 105a and 105b (S13 in Fig. 12). At this time, the processing table 21 also moves while adsorbing and holding the lower surface of the marking area 203 following the conveyance.

Next, the PLC 7 uses the alignment unit 27 to capture an image of the first positional reference mark 73 that has moved to the fine machining areas 105a and 105b by the imaging unit 28, The positional deviation is calculated in the alignment unit 27, it is determined whether the positional deviation is within the allowable range, and when the deviation is not the allowable range, alignment correction is performed (S14 in Fig. 12, (a) in Fig. 13). The alignment correction is performed by, for example, the PLC 7 controlling the drive stage 29 to correct the positions of the second laser processing units 5a and 5b. When the alignment correction ends or the calculation of the position misalignment (if the position misalignment is within the allowable range) is finished, the PLC 7 provides information indicating that the alignment has been completed (alignment completion trigger) and the position of the machining table 21 The information is transmitted to the device PC 7.

Next, the device PC 7 which received the alignment completion trigger and the position information of the processing table 21, based on the position information of the processing table 21, determines the position information in the processing layout included in the storage unit 7a. Select the matching first drawing pattern and the second drawing pattern, and based on the selected drawing pattern, the first laser processing units 3a, 3b and the second laser processing units 5a, 5b (the laser processing unit PC 39 )). The first laser processing units 3a, 3b and the second laser processing units 5a, 5b that have received the instruction are roughened areas 103a and 103b and fine processing based on the first drawing pattern and the second drawing pattern. The regions 105a and 105b are irradiated with a laser to perform patterning (S15 in Fig. 12, (b) in Fig. 13). As a result, the second drawing pattern is formed so that the finely processed regions 105a and 105b overlap the region in which the first drawing pattern is formed in S12, and the entire drawing pattern is drawn.

At this time, the 1st laser processing parts 3a, 3b describe the 1st position confirmation reference mark 73 on the rough processing area 103a, 103b similarly to S12.

Further, the second laser processing units 5a and 5b also draw a reference mark 71 for positioning in the fine processing regions 105a and 105b. Here, the reference mark 71 for position confirmation depicted by the second laser processing units 5a and 5b is referred to as a second reference mark 75 for position confirmation.

Thereby, in the fine processing regions 105a and 105b, the first position confirmation reference mark 73 and the second position confirmation reference mark 75 are located at the location where the position confirmation reference mark 71 is to be described. Depicted to overlap.

When machining is completed, the device PC 7 transmits a machining completion trigger to the PLC 37.

Next, the PLC 37, which has received the processing completion trigger, uses the alignment unit 27, and uses the imaging unit 28 to determine the first position confirmation reference mark 73 and the second position confirmation reference mark 75. ) Is captured, and the relative positional shift (G) between the first reference mark 73 for positioning and the second reference mark 75 for positioning shown in FIG. 15 is measured in the alignment unit 27 . When this position shift G is not within the allowable range, alignment correction is performed (S16 in Fig. 12, (c) in Fig. 13). As for the method of specific alignment correction, in addition to the one mentioned in S14, the method of correcting the irradiation condition of a laser using the laser processing unit PC 39 is mentioned.

Next, in this state, the PLC 37 of the marking device 1 determines whether or not the position of the processing table 21 is at the movement limit of the downstream side (the take-up machine 13 side) (S17 in Fig. 12). ), if it is not in the downstream movement limit, it returns to S13, and if it is in the movement limit, proceeds to S18.

When the position of the processing table 21 is within the movement limit on the downstream side, the marking device 1 needs to return the processing table 21 to the upstream side (the take-up machine 11 side), so follow the procedure below. Therefore, the processing table 21 is moved.

First, the PLC 37 of the marking device 1 moves the holding table 25 in the direction of +z using an actuator or the like (not shown) to hold the film 100 by adsorption (S18 in Fig. 12). , Figure 13 (d)).

Next, the PLC 37 of the marking device 1 releases the adsorption of the film 100 by the processing table 21, and moves the processing table 21 in the direction of -z using the driving unit 23. And separated from the film 100 (S19 in Fig. 12, (a) in Fig. 14).

Next, the PLC 37 of the marking device 1 uses the driving unit 23 to move the processing table 21 in the direction of -x, and moves it upstream (S20 in Fig. 12, (b) in Fig. 14). )).

Next, the PLC 37 of the marking device 1 uses the driving unit 23 to move the processing table 21 in the direction of +z to contact the film 100 again and adsorb the film 100. (S21 in Fig. 12, (c) in Fig. 14).

Next, the PLC 37 of the marking device 1 releases the adsorption of the holding table 25 to the film 100, moves the holding table 25 in the direction of -z, and the film 100 (S22 in Fig. 12, (d) in Fig. 14).

Thereafter, S13 to S21 are repeated until all the marking areas are processed.

In this way, since the processing table 21 always adsorbs and holds the marking area 203 from below, the positional shift of the film 100 at the time of marking can be minimized.

The above is the procedure of marking using the marking device 1.

As described above, according to the present embodiment, the marking device 1 includes the first laser processing portions 3a and 3b as the first marking portions for marking the workpiece with the first dot diameter 303, and the first dot Using the second dot diameter 304 smaller than the diameter, the second laser processing units 5a and 5b serving as the second marking unit for marking the workpiece, and the drawing pattern are formed by the first laser processing units 3a and 3b. It has a device PC 7 as a divided drawing pattern registration unit that divides and registers a first drawing pattern to be drawn and a second drawing pattern to be drawn by the second laser processing units 5a and 5b.

For this reason, the marking device 1 can realize improvement in processing precision and shortening of working time at the same time.

As mentioned above, although the present invention has been described based on the embodiments and examples, the present invention is not limited to the above-described embodiments.

For example, in the above-described embodiment, as the marking device 1, a device for performing marking using a laser is illustrated, but the present invention is not limited to this at all, and any device capable of marking on a workpiece, for example It may be a device for marking using an inkjet or a dispensing device such as a dispenser.

In addition, in the above-described embodiment, alignment correction is performed every time the film 100 is moved, but the conditions for performing alignment correction are not limited to this, and a certain time elapses every time the film is moved several times. Alignment correction may be performed under various conditions, such as after or after a new drawing pattern is registered.

In addition, in the above-described embodiment, the first laser processing units 3a and 3b and the second laser processing units 5a and 5b are arranged in parallel to each other to perform marking, but each one or three or more You may arrange a laser processing part.

In addition, in this embodiment, for one drawing pattern, first drawing of the first drawing pattern is performed by the first laser processing units 3a and 3b, and then the film 100 is moved, and the second laser processing unit ( Although the 2nd drawing pattern is drawing by 5a, 5b), drawing of the 1st drawing pattern and the 2nd drawing pattern may be simultaneous. In other words, drawing may be performed without dividing the processing region into a rough processing region and a fine processing region.

In addition, as the marking object (workpiece) to which the present invention can be applied, it is not limited to a long sheet such as the film 100, but a rectangular substrate such as a glass plate or a printed circuit board, or a circular substrate such as a semiconductor wafer or a glass wafer. Etc. can be illustrated.

1: marking device
3a: first laser processing unit
3b: first laser processing unit
5a: second laser processing unit
6: control unit
7: device PC
7a: memory
8: monitor
10: keyboard
11: winding machine
12: storage area
13: take-up machine
14: first partial storage area
16: second partial storage area
21: processing table
23: drive unit
25: holding table
27: alignment unit
28: imaging unit
29: driving stage
33: laser power meter
35: converter
39: laser processing unit PC
51: light source
53: beam expander
55: corner mirror
57: corner mirror
59: Z scanner
61: objective lens
63: XY galvano scanner
70: wiring pattern
71: Reference mark for positioning
73: reference mark for confirming the first position
75: reference mark for confirming the second position
100: film
101: substrate
103: metal layer
103a: rough processing area
105a: fine machining area
113: drawing pattern
115: first drawing pattern
117: second drawing pattern
203: marking area
303: first dot diameter
304: second dot diameter
305: area
311: corner
313: contour
315: gap
G: position misalignment
H: distance

Claims (10)

In a marking device for drawing a predetermined drawing pattern in a marking area set on a workpiece,
A first marking portion for marking the workpiece with a first dot diameter,
A second marking portion for marking the workpiece with a second dot diameter having a dot diameter smaller than the first dot diameter,
A divided drawing pattern registration unit that divides and registers the drawing pattern into a first drawing pattern drawn by the first marking unit and a second drawing pattern drawn by the second marking unit,
A reference mark image pickup unit that is marked by the first marking unit and captures a first positional reference mark indicating a reference position of the marking area;
A marking position correction unit for correcting a position marked by the second marking unit based on positional information of the first positional reference mark imaged by the reference mark image pickup unit,
The marking device, characterized in that the second marking unit performs marking at a position corrected by the marking position correction unit. The method of claim 1,
The marking device, wherein the second drawing pattern is constituted by a pattern that complements a portion of the predetermined drawing pattern that is not drawn by the first drawing pattern. The method of claim 2,
The marking device, wherein the second drawing pattern is constituted by a pattern for drawing a portion of the predetermined drawing pattern which cannot be drawn with the first dot diameter. The method of claim 1,
The marking device, wherein the second drawing pattern comprises a first drawing pattern among the predetermined drawing patterns and a pattern complementing a contour portion of the predetermined drawing pattern. The method of claim 2,
The marking device, wherein the second drawing pattern comprises a first drawing pattern among the predetermined drawing patterns and a pattern complementing a contour portion of the predetermined drawing pattern. The method of claim 3,
The marking device, wherein the second drawing pattern comprises a first drawing pattern among the predetermined drawing patterns and a pattern complementing a contour portion of the predetermined drawing pattern. The method according to any one of claims 1 to 6,
The first position confirmation reference mark marked by the first marking unit and a second position confirmation reference mark marked by the second marking unit and indicating the reference position of the marking area are provided to the reference mark image pickup unit. A marking device comprising: an overlapping displacement measurement unit configured to capture an image and measure a relative positional displacement amount between the first reference mark for positioning and the second reference mark for positioning. The method according to any one of claims 1 to 6,
A relative moving part for relatively moving the workpiece, the first marking part, and the second marking part,
And a movement marking control unit configured to perform marking while controlling the relative movement unit to move the first and second marking units relative to the workpiece. The method according to any one of claims 1 to 6,
A whole drawing pattern registration unit which registers the entire drawing pattern marked on the work piece as a whole drawing pattern;
A marking device comprising a divided drawing pattern generation unit that divides and generates the first drawing pattern and the second drawing pattern from the entire drawing pattern. A whole drawing pattern registration unit that registers the entire drawing pattern marked by the marking device according to any one of claims 1 to 6 as a whole drawing pattern;
A pattern generation apparatus comprising a divided drawing pattern generation unit that divides and generates the first drawing pattern and the second drawing pattern from the entire drawing pattern.

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