CN117260002B - Hemispherical resonant gyro electrode based on laser processing and processing method and system - Google Patents
Hemispherical resonant gyro electrode based on laser processing and processing method and system Download PDFInfo
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- 238000012545 processing Methods 0.000 title claims abstract description 30
- 238000003672 processing method Methods 0.000 title claims abstract description 17
- 238000005530 etching Methods 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 14
- 238000010330 laser marking Methods 0.000 claims description 11
- 239000011521 glass Substances 0.000 claims description 8
- 238000003754 machining Methods 0.000 claims description 8
- 238000013461 design Methods 0.000 claims description 6
- 238000005498 polishing Methods 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 4
- 238000007514 turning Methods 0.000 claims description 3
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- 230000005284 excitation Effects 0.000 description 9
- 238000005520 cutting process Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
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- 238000000576 coating method Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 238000003698 laser cutting Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 238000010009 beating Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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Abstract
The invention belongs to the technical field of hemispherical resonator gyroscopes, and particularly relates to a hemispherical resonator gyroscopes electrode based on laser processing, a processing method and a processing system, in particular to a hemispherical resonator gyroscopes electrode to be processed, which is subjected to system calibration, marking parameters are set according to a plane part and a curved surface part in a partitioning mode, and a curved surface part is filled with a scribing pattern along a contour line according to a polar coordinate system to carry out path filling, so that electrode processing is completed, marking uniformity and good conductivity of each part of the electrode are ensured, the pattern filling is complete, the scribing is uniform, a saw-tooth pattern at the edge of the scribing region is avoided, and the attractiveness and flatness of the surface of a product are ensured.
Description
Technical Field
The invention belongs to the technical field of precision machining of hemispherical resonator gyroscopes, and particularly relates to a hemispherical resonator gyroscope electrode based on laser machining, a machining method and a machining system.
Background
The hemispherical resonator gyroscope is one of the resonator gyroscopes, adopts electrostatic excitation and capacitance detection, has high-performance and high-precision inertial navigation, is highly concerned by the inertial technology world at home and abroad, and is successfully applied to the fields of navigation, aerospace, aviation and the like at present.
The typical structure of the hemispherical resonator gyroscope comprises various core functional structures such as a hemispherical resonator, an excitation cover, a reading base and the like, the structure is shown in figure 1, the hemispherical resonator is positioned between the excitation cover and the reading base, a small gap (0.1-0.15 mm) exists, a mandrel of the hemispherical resonator and a hemispherical shell are integrally processed, and the inside and the outside of the resonator are plated with metal film layers. The excitation cover and the reading base are subjected to electrode segmentation by laser etching. Manufacturing excitation electrodes (generally 8 or 16) on the inner surface of the excitation cover, so that the conduction or extremely small resistance of the outer cylindrical surface of the excitation cover to the electrodes is ensured, and the insulation resistance of the electrodes is more than hundreds of megaohms; the inner sphere forms 16 equally spaced discrete electrodes with a mutual insulation resistance value of over several hundred megaohms. The outer sphere of the reading base is divided into 8 independent uniform areas, a plurality of small capacitances are formed among the hemispherical harmonic oscillator, the excitation electrode and the reading electrode, wherein the capacitance between the harmonic oscillator and the excitation electrode is used for standing wave vibration and control of the harmonic oscillator, and the capacitance between the harmonic oscillator and the reading electrode is used for detecting displacement of the harmonic oscillator. The hemispherical resonator gyro is driven by static electricity mostly, the larger the capacitance between the electrode and the resonator shell is, the more favorable the starting vibration and signal detection of the gyro are, and the stronger the sensitivity of the electrode to the capacitance change of the resonator of the gyro is, the better the performance of the whole structure is, so the electrode structure is an important factor affecting the performance of the gyro.
However, the traditional method of the hemispherical resonator gyro electrode adopts a rectangular coordinate system to fill a linear path of a reticle pattern by using a numerical control laser reticle system, the integrated marking is carried out, the filling method is simple, but the filling of gaps at corners of the pattern which are filled and punched by the linear filling is incomplete and burrs are carried, so that the gyro performance can be influenced.
Disclosure of Invention
In order to overcome the technical problems of hemispherical resonator gyro electrode processing in the prior art, the invention provides a hemispherical resonator gyro electrode processing method based on laser processing, which ensures uniform marking and good conductivity of each part of an electrode through zonal marking, improves etching effect and ensures the integrity and consistency of marking patterns.
Meanwhile, the invention also provides the hemispherical resonant gyro electrode processed by the method and a processing system corresponding to the processing method.
The technical scheme adopted by the invention is as follows:
a hemispherical resonator gyro electrode processing method based on laser processing comprises the following steps:
(1) Setting a hemispherical resonator gyro electrode to be processed on a working platform, performing system calibration, respectively setting marking parameters according to the plane part and the curved surface part of the hemispherical resonator gyro electrode to be processed, clamping and aligning the hemispherical resonator gyro electrode to be processed, and positioning the zero point position;
(2) Polishing the hemispherical resonator gyro electrode to be processed to align the hemispherical resonator gyro electrode with a light source;
(3) Accurately positioning a part to be marked of the hemispherical resonator gyro electrode to be processed;
(4) Transmitting the position information of the hemispherical resonator gyro electrode to be processed to an industrial personal computer, filling a line pattern along a contour line in a laser marking scanning galvanometer range according to a polar coordinate system to perform path filling, and finishing marking of a curved surface part of the hemispherical resonator gyro electrode to be processed;
(5) And (3) filling a scribing pattern along a contour line in a laser marking scanning vibrating mirror range according to the operations of the steps (2) - (4) to fill a path according to a rectangular coordinate system, and sequentially finishing marking the plane part of the hemispherical resonator gyro electrode to be processed, thereby finishing the hemispherical resonator gyro electrode processing.
Further defined, the step (1) specifically comprises:
(1.1) arranging a hemispherical resonator gyro electrode to be processed on a working platform, and performing system calibration;
(1.2) respectively setting marking parameters according to the plane part and the curved surface part of the hemispherical resonator gyro electrode to be processed;
marking parameters of the plane part are as follows: the laser power is 2-3W, the cutting frequency is 30-70Hz, the X-direction etching speed is 500-700mm/min, and the Y-direction etching speed is 500-700mm/min;
marking parameters of the curved surface part are as follows: the laser power is 2.5-4W, the cutting frequency is 50-90Hz, the X-direction etching speed is 500-700mm/min, and the Y-direction etching speed is 500-700mm/min;
and (1.3) clamping the hemispherical resonator gyro electrode to be processed, finding out a characteristic hole for alignment, and positioning the zero position of the workpiece.
Further defined, the step (3) specifically comprises:
(3.1) utilizing CCD recognition to find out the zero point position of the hemispherical resonator gyro electrode to be processed in the recognition frame;
and (3.2) taking the zero point position as the origin of coordinates, establishing a coordinate system, determining X, Y coordinates and offset angles of the hemispherical resonator gyro electrode to be processed, determining a marking area of the hemispherical resonator gyro electrode and accurately positioning the hemispherical resonator gyro electrode.
Further defined, the method for determining the offset angle is as follows:
the offset angle of the plane part is 0 degree;
the offset angle of the curved surface part is determined according to the following steps:
(a) Setting a model of a hemispherical resonator gyro electrode to be processed, taking a central section of the model, and establishing a coordinate system;
(b) Taking an arc line AB corresponding to a curved surface part on the section, wherein the highest point corresponding to the arc line AB is A, and the lowest point corresponding to the arc line AB is B, and connecting the arc line AB to form a straight line L1;
(c) Taking a straight line L2 which is parallel to the straight line L1 and tangential to the arc line AB;
(d) Measuring straight between straight line L1 and straight line L2Line distance s AB And judge if s AB The included angle between the straight line L1 and the horizontal plane is an offset angle which is less than or equal to 0.5 mm; if s AB > 0.5mm, then step (e) is performed;
(e) Taking the turning point of the arc line AB as C, taking the straight line L3 connecting the point A, C and the straight line L4 connecting the point C, B respectively, taking a straight line L5 parallel to the straight line L3 and tangent to the arc line AC, and taking a straight line L6 parallel to the straight line L4 and tangent to the arc line CB;
(f) Measuring the linear distance s between the straight line L3 and the straight line L5 AC And a linear distance s between the straight line L4 and the straight line L6 CB And judge if s AC The included angle between the straight line L3 and the horizontal plane is the deviation angle of the curved surface corresponding to the arc line AC, which is less than or equal to 0.5 mm; if s CB The included angle between the straight line L4 and the horizontal plane is smaller than or equal to 0.5mm, namely the offset angle of the curved surface corresponding to the arc line CB; otherwise, repeating the sectional line drawing according to the operation of the step (e) until the offset angles corresponding to all the curved surfaces are determined.
Further defined, the filling interval of the contour line filling line pattern in the step (4) is 0.01-0.05mm.
Further defined, the step (4) specifically comprises:
(4.1) transmitting X, Y coordinates and offset angle information of the hemispherical resonator gyro electrode to be processed, which are determined in the step (3), to an industrial personal computer, and determining a marking path by combining a design drawing of the hemispherical resonator gyro electrode to be processed;
and (4.2) filling a scribing pattern along the contour line of the marking area in the range of the laser marking scanning galvanometer according to the marking path determined by the industrial personal computer to finish path filling, and etching the metal layer of the hemispherical resonator gyro electrode to be processed to the conductive layer until the conductive glass is exposed, thereby finishing the marking of the curved surface part of the hemispherical resonator gyro electrode to be processed.
Further defined, the step (5) specifically comprises:
(5.1) polishing the plane part of the hemispherical resonator gyro electrode to be processed, aligning the plane part with a light source, and finding out the zero point position of the hemispherical resonator gyro electrode to be processed in an identification frame by using CCD identification;
(5.2) establishing a rectangular coordinate system by taking the zero point position as the origin of coordinates, determining X, Y coordinates of the hemispherical resonator gyro electrode to be processed, determining a marking area of the hemispherical resonator gyro electrode and accurately positioning the hemispherical resonator gyro electrode;
(5.3) transmitting X, Y coordinate information of the hemispherical resonator gyro electrode to be processed determined in the step (5.2) to an industrial personal computer, and determining a marking path by combining a design drawing of the hemispherical resonator gyro electrode to be processed;
and (5.4) filling a scribing pattern along the contour line of the marking area in the range of the laser marking scanning galvanometer according to the marking path determined by the industrial personal computer to finish path filling, and etching the metal layer of the hemispherical resonator gyro electrode to be processed to the conductive layer until the conductive glass is exposed, thereby finishing the marking of the plane part of the bottom surface or the top surface of the hemispherical resonator gyro electrode to be processed.
Further limiting that the thickness of the plating layer of the metal electrode layer plated on the surface of the hemispherical resonator gyro electrode to be processed is 100-150nm.
The hemispherical resonator gyro electrode processed by the hemispherical resonator gyro electrode processing method based on laser processing.
The hemispherical resonator gyro electrode machining system comprises a memory, a processor and a computer control program stored on the memory and running on the processor, wherein the hemispherical resonator gyro electrode machining method based on laser machining is realized when the processor executes the control program.
Compared with the prior art, the invention has the beneficial effects that:
(1) The hemispherical resonator gyroscope electrode is divided into the top surface, the side surface and the bottom surface by partition marking, marking is carried out on different parts according to the structural characteristics of the plane and the curved surface, marking parameters are respectively set, the partition marking is carried out, the uniformity of marking of each part of the electrode is ensured, the electric conductivity is good, the etching effect is improved, the integrity and the consistency of marking patterns are ensured, the subsequent assembly effect of the hemispherical resonator gyroscope is benefited, and the problems of incomplete patterns, multiple burrs and the like in the planar and curved surface integrated marking linear filling in the prior art are overcome.
(2) The invention combines the curved surface characteristic of the hemispherical resonator gyro electrode, changes the traditional rectangular coordinate system into the polar coordinate system, adjusts the traditional linear filling mode into filling the score line along the contour line of the hemispherical resonator gyro electrode, ensures complete filling, uniform score line, reduces burrs, avoids saw-tooth patterns of a metal layer at the edge of the score line area, and ensures the aesthetic property and the flatness of the surface of the product from the technical level.
Drawings
In order to more clearly illustrate the invention or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a conventional hemispherical resonator gyroscope;
FIG. 2 is a flow chart of a hemispherical resonator gyro electrode processing method based on laser processing;
FIG. 3 is a schematic illustration of determining the offset angle of a curved surface;
FIG. 4 is a schematic diagram of a top pattern distribution.
Fig. 5 is a schematic diagram of a curved pattern distribution.
FIG. 6 is a top pattern marking defect map when the laser power is less than 2W.
FIG. 7 is a top pattern marking defect map when the laser power is greater than 3W.
FIG. 8 is a graph of curved pattern marking defects at a laser power of less than 2.5W.
FIG. 9 is a graph of curved pattern marking defects when the laser power is greater than 4W.
Fig. 10 is a filling pattern comparison chart of the method of the present application and the conventional method.
Fig. 11 is a graph showing the filling effect of the method of the present application compared with that of the conventional method.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The technical scheme of the present application will now be further described with reference to the accompanying drawings and examples.
The metal electrode layer plated on the surface of the hemispherical resonator gyro electrode based on laser processing is a gold and chromium plating layer, the total thickness of the gold and chromium plating layers is 100-150nm, the filling interval of filling the contour line on the electrode surface with the groove pattern is 0.01-0.05mm, the groove filling is complete, and burrs are avoided.
The hemispherical resonator gyro electrode is manufactured by the following processing method, referring to fig. 2, specifically comprising the following steps:
(1) Setting a hemispherical resonator gyro electrode to be processed on a working platform, performing system calibration, respectively setting marking parameters according to a plane part and a curved surface part of the hemispherical resonator gyro electrode to be processed, clamping and aligning the hemispherical resonator gyro electrode to be processed, and then positioning the zero point position of a workpiece; the method comprises the following steps:
setting a hemispherical resonator gyro electrode to be processed on a working platform (a three-dimensional laser reticle machine, model: LS 10P-10T), fastening, and then carrying out system calibration;
(1.2) respectively setting marking parameters according to the plane part and the curved surface part of the hemispherical resonator gyro electrode to be processed:
marking parameters of the plane part are as follows: the laser power is 2-3W, the cutting frequency is 30-70Hz, the X-direction etching speed is 500-700mm/min, and the Y-direction etching speed is 500-700mm/min; marking parameters of the curved surface part are as follows: the laser power is 2.5-4W, the cutting frequency is 50-90Hz, the X-direction etching speed is 500-700mm/min, and the Y-direction etching speed is 500-700mm/min.
(1.3) clamping the hemispherical resonator gyro electrode to be processed, identifying and finding out all characteristic holes on the hemispherical resonator gyro electrode to be processed by using a CCD, and aligning, wherein the center position of any hole is selected as a zero position.
(2) Polishing the hemispherical resonator gyro electrode to be processed to align the hemispherical resonator gyro electrode with a light source;
(3) Accurately positioning a part to be marked of the hemispherical resonator gyro electrode to be processed; the specific operation is as follows:
(3.1) utilizing CCD recognition to find out the zero point position of the hemispherical resonator gyro electrode to be processed in the recognition frame;
and (3.2) taking the zero point position as the origin of coordinates, establishing a polar coordinate system, determining X, Y coordinates and offset angles of the hemispherical resonator gyro electrode to be processed, determining a marking area and accurately positioning.
It should be further noted that the offset angle with respect to the planar portion is 0 °.
The offset angle of the curved surface part is determined according to the following steps:
the laser is simulated by a focal plane in three-dimensional software solidworks, the optical path of the laser is fixed, the focal plane is set, the effect of laser beating on a curved surface is simulated by the focal plane, and the obtained offset angle is actually the angle of a rotating shaft in a five-axis motion platform of a machine tool, which needs to be rotated during marking.
The focal plane is a plane perpendicular to the optical axis through the laser vibrating mirror, a workpiece is cut by the focal plane, the optical path of the laser can be accurately simulated, laser is emitted and then is beaten on the hemispherical resonator gyro electrode to be processed, the effective range of the laser is enabled to cover the curved surface of the hemispherical resonator gyro electrode to be processed entirely, and the included angle between the tangent line of the curved surface irradiated by the laser and the horizontal plane is recorded at the moment to be an offset angle.
Generally, the difficulty of laser scribing is mainly determined at X, Y coordinates and angles of a side portion (curved surface), wherein the Y-axis is the same as the X-axis of the top surface, which is the highest point of the scribing area because the side pattern is connected to the top surface, and then the offset angle is determined, taking fig. 3 as an example, the side is scribed in two sections, and the X-axis is the highest point of two sections of arcs in the drawing, which is obtained through dimension measurement:
(a) Setting a model of a hemispherical resonator gyro electrode to be processed, taking a central section of the model, and establishing a coordinate system;
(b) Taking an arc line AB corresponding to a curved surface part on the section, wherein the highest point corresponding to the arc line AB is A, and the lowest point corresponding to the arc line AB is B, and connecting the arc line AB to form a straight line L1;
(c) Taking a straight line L2 which is parallel to the straight line L1 and tangential to the arc line AB;
(d) Measuring a linear distance s between the line L1 and the line L2 AB And judge if s AB Less than or equal to 0.5mm, the included angle between the straight line L1 and the horizontal plane is an offset angle, see FIG. 3 (1); if s AB > 0.5mm, step (e) is performed, see FIG. 3 (2);
(e) Taking the turning point of the arc line AB as C, taking the straight line L3 connecting the point A, C and the straight line L4 connecting the point C, B respectively, taking a straight line L5 parallel to the straight line L3 and tangent to the arc line AC, and taking a straight line L6 parallel to the straight line L4 and tangent to the arc line CB;
(f) Measuring the linear distance s between the straight line L3 and the straight line L5 AC And a linear distance s between the straight line L4 and the straight line L6 CB And judge if s AC The included angle between the straight line L3 and the horizontal plane is the deviation angle of the curved surface corresponding to the arc line AC, which is less than or equal to 0.5 mm; if s CB The included angle between the straight line L4 and the horizontal plane is smaller than or equal to 0.5mm, namely the offset angle of the curved surface corresponding to the arc line CB; otherwise, repeating the sectional line drawing according to the operation of the step (e) until the offset angles corresponding to all the curved surfaces are determined.
(4) Transmitting the position information of the hemispherical resonator gyro electrode to be processed to an industrial personal computer, filling a line pattern along a contour line in a laser marking scanning galvanometer range according to a polar coordinate system to perform path filling, and finishing the top surface marking of the hemispherical resonator gyro electrode to be processed; the filling interval of the contour line filling groove patterns is 0.01-0.05mm.
(4.1) transmitting X, Y coordinates and offset angle information of the hemispherical resonator gyro electrode to be processed, which are determined in the step (3), to an industrial personal computer, and determining a marking path by combining a design drawing of the hemispherical resonator gyro electrode to be processed;
and (4.2) filling a scribing pattern along the contour line of the marking area in the range of the laser marking scanning galvanometer according to the marking path determined by the industrial personal computer to finish path filling, and etching the metal layer of the hemispherical resonator gyro electrode to be processed to the conductive layer until the conductive glass is exposed to finish curved surface marking of the hemispherical resonator gyro electrode to be processed.
(5) Marking other parts of the hemispherical resonator gyro electrode to be processed is sequentially completed according to the same operation of the steps (2) - (4), and then the hemispherical resonator gyro electrode is processed, specifically:
(5.1) polishing the plane part of the hemispherical resonator gyro electrode to be processed, aligning the plane part with a light source, and finding out the zero point position of the hemispherical resonator gyro electrode to be processed in an identification frame by using CCD identification;
(5.2) establishing a rectangular coordinate system by taking the zero point position as the origin of coordinates, determining X, Y coordinates of the hemispherical resonator gyro electrode to be processed, determining a marking area of the hemispherical resonator gyro electrode and accurately positioning the hemispherical resonator gyro electrode;
(5.3) transmitting X, Y coordinate information of the hemispherical resonator gyro electrode to be processed determined in the step (5.2) to an industrial personal computer, and determining a marking path by combining a design drawing of the hemispherical resonator gyro electrode to be processed;
and (5.4) filling a scribing pattern along the contour line of the marking area in the range of the laser marking scanning galvanometer according to the marking path determined by the industrial personal computer to finish path filling, and etching the metal layer of the hemispherical resonator gyro electrode to be processed to the conductive layer until the conductive glass is exposed, thereby finishing the marking of the plane part of the bottom surface or the top surface of the hemispherical resonator gyro electrode to be processed.
Taking the electrode curved surface of the hemispherical resonator gyro marked ϕ as an example, the top surface pattern and the curved surface pattern marked as shown in fig. 4 and 5 are specifically as follows:
the top surface patterns are a plurality of groups of small rectangular patterns uniformly distributed on the same circle, each group comprises two parallel rectangular patterns, the minimum distance between the long sides of the two rectangles is 1mm, the edge distance of the long sides of the outer sides of the two rectangles is 2mm, the distance between the short sides of the inner sides of the rectangles and the center point of the top surface is 6.5mm, the distance between the short sides of the outer sides and the center point of the top surface is 7.5mm, namely the size of a single small rectangle is 1 x 0.5mm. When the top surface position pattern is marked, when the laser cutting frequency is set to be 50Hz and the laser power is smaller than 2W, the laser power is too small to be used for marking the metal coating, so that the surface of the metal coating has gyro marks, but the gyro marks are not completely fallen off, and the metal coating is shown in fig. 6; when the laser cutting frequency is set to 50Hz and the laser power is more than 3W, the glass surface is damaged as shown in fig. 7.
The curved surface pattern is a convex pattern, the minimum line interval of the pattern is 1mm, the next is 3mm, and the maximum line interval is 4mm. When the laser cutting frequency is set to be 50Hz and the laser power is smaller than 2.5W, the laser power is too small to thoroughly penetrate the metal coating at the corner part, so that the metal coating is left, and the resistance of about 300 megaohms exists when the electrodes at the left side and the right side are measured, and the subsequent gyro assembly and precision performance are influenced, as shown in fig. 8; when the laser cutting frequency is set to be 50Hz and the laser power is larger than 4W, the laser power is too large, so that fine point-like damage occurs on the surface of the glass, as shown in FIG. 9.
Therefore, the marking parameters in the step (1) need to set different parameters according to different marking positions of the plane and the curved surface, and the marking parameters in the plane position are as follows: the laser power is 2-3W, the cutting frequency is 30-70Hz, the X-direction etching speed is 500-700mm/min, and the Y-direction etching speed is 500-700mm/min; marking parameters of the curved surface part are as follows: the laser power is 2.5-4W, the cutting frequency is 50-90Hz, the X-direction etching speed is 500-700mm/min, and the Y-direction etching speed is 500-700mm/min. And the marking parameter range can be adjusted according to the material thickness and the size specification of the hemispherical resonator gyro electrode to be processed.
Taking the side surface (curved surface) of the spherical base of the hemispherical resonator gyro electrode as an example, the filling paths of the marking patterns after the traditional linear filling mode processing and the contour line filling mode respectively processing are used for experimental comparison, and the obtained results are shown in fig. 10 and 11 under the condition that the same filling interval is 0.02 mm:
as can be seen by comparing fig. 10 and 11, the filling of the gaps at the corners of the pattern which is punched in the process of linear filling is incomplete and has burrs, and the effect of filling the scribing lines by the contour lines is obviously more uniform, and the burrs are correspondingly reduced.
Corresponding to the hemispherical resonator gyro electrode processing method based on laser processing, the application also provides a hemispherical resonator gyro electrode processing system, which comprises a memory, a processor and a computer control program stored on the memory and capable of running on the processor, wherein the hemispherical resonator gyro electrode processing method based on laser processing is realized when the processor executes the control program.
The logic instructions in the memory described above can be implemented in the form of software functional units, and based on this understanding, the technical solution of the present invention is essentially or partly contributing to the prior art, embodied in a software control program, which computer software product is stored in an industrial personal computer or in a microprocessor of a processing device, for performing all or part of the steps of the above-described method of the present invention.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (8)
1. The hemispherical resonator gyro electrode processing method based on laser processing is characterized by comprising the following steps of:
(1) Setting a hemispherical resonator gyro electrode to be processed on a working platform, performing system calibration, and respectively setting marking parameters according to the planar part and the curved surface part of the hemispherical resonator gyro electrode to be processed, wherein the marking parameters of the planar part are as follows: the laser power is 2-3W, the marking frequency is 30-70Hz, the X-direction marking speed is 500-700mm/min, and the Y-direction marking speed is 500-700mm/min; marking parameters of the curved surface part are as follows: the laser power is 2.5-4W, the marking frequency is 50-90Hz, the X-direction marking speed is 500-700mm/min, and the Y-direction marking speed is 500-700mm/min; clamping and aligning the hemispherical resonator gyro electrode to be processed, and positioning the zero point position;
(2) Polishing the hemispherical resonator gyro electrode to be processed to align the hemispherical resonator gyro electrode with a light source;
(3) Precisely positioning a part to be marked of the hemispherical resonator gyro electrode to be processed; the method comprises the following steps:
(3.1) utilizing CCD recognition to find out the zero point position of the hemispherical resonator gyro electrode to be processed in the recognition frame;
(3.2) taking the zero point position as the origin of coordinates, establishing a coordinate system, determining X, Y coordinates and offset angles of the hemispherical resonator gyro electrode to be processed, determining a marking area of the hemispherical resonator gyro electrode and accurately positioning the hemispherical resonator gyro electrode; wherein the offset angle of the plane part is 0 degree;
(4) Transmitting the position information of the hemispherical resonator gyro electrode to be processed to an industrial personal computer, filling a line pattern along a contour line in a laser marking scanning galvanometer range according to a polar coordinate system to perform path filling, and finishing marking of a curved surface part of the hemispherical resonator gyro electrode to be processed;
(5) And (3) filling a groove pattern along a contour line in a laser marking scanning vibrating mirror range according to the operation of the steps (2) - (4) for path filling, and sequentially finishing marking of the plane part of the hemispherical resonator gyro electrode to be processed, thereby finishing hemispherical resonator gyro electrode processing.
2. The method for processing the hemispherical resonator gyro electrode based on laser processing according to claim 1, wherein the offset angle of the curved surface part is determined according to the following steps:
(a) Setting a model of a hemispherical resonator gyro electrode to be processed, taking a central section of the model, and establishing a coordinate system;
(b) Taking an arc line AB corresponding to a curved surface part on the section, wherein the highest point corresponding to the arc line AB is A, and the lowest point corresponding to the arc line AB is B, and connecting the arc line AB to form a straight line L1;
(c) Taking a straight line L2 which is parallel to the straight line L1 and tangential to the arc line AB;
(d) Measuring a linear distance s between the line L1 and the line L2 AB And judge if s AB The included angle between the straight line L1 and the horizontal plane is an offset angle which is less than or equal to 0.5 mm; if s AB > 0.5mm, then step (e) is performed;
(e) Taking the turning point of the arc line AB as C, taking the straight line L3 connecting the point A, C and the straight line L4 connecting the point C, B respectively, taking a straight line L5 parallel to the straight line L3 and tangent to the arc line AC, and taking a straight line L6 parallel to the straight line L4 and tangent to the arc line CB;
(f) Measuring the linear distance s between the straight line L3 and the straight line L5 AC And a linear distance s between the straight line L4 and the straight line L6 CB And judge if s AC The included angle between the straight line L3 and the horizontal plane is the deviation angle of the curved surface corresponding to the arc line AC, which is less than or equal to 0.5 mm; if s CB The included angle between the straight line L4 and the horizontal plane is smaller than or equal to 0.5mm, namely the offset angle of the curved surface corresponding to the arc line CB; otherwise, repeating the sectional line drawing according to the operation of the step (e) until the offset angles corresponding to all the curved surfaces are determined.
3. The hemispherical resonator gyro electrode processing method based on laser processing according to claim 1, wherein the filling interval of the contour line filling scribe line pattern in the step (4) is 0.01-0.05mm.
4. The hemispherical resonator gyro electrode processing method based on laser processing according to claim 1, wherein the step (4) specifically comprises:
(4.1) transmitting X, Y coordinates and offset angle information of the hemispherical resonator gyro electrode to be processed, which are determined in the step (3), to an industrial personal computer, and determining a marking path by combining a design drawing of the hemispherical resonator gyro electrode to be processed;
and (4.2) filling a scribing pattern along the contour line of the marking area in the range of the laser marking scanning galvanometer according to the marking path determined by the industrial personal computer to finish path filling, and etching the metal layer of the hemispherical resonator gyro electrode to be processed to the conductive layer until the conductive glass is exposed, thereby finishing the marking of the curved surface part of the hemispherical resonator gyro electrode to be processed.
5. The hemispherical resonator gyro electrode processing method based on laser processing according to claim 1, wherein the step (5) specifically comprises:
(5.1) polishing the plane part of the hemispherical resonator gyro electrode to be processed, aligning the plane part with a light source, and finding out the zero point position of the hemispherical resonator gyro electrode to be processed in an identification frame by using CCD identification;
(5.2) establishing a rectangular coordinate system by taking the zero point position as the origin of coordinates, determining X, Y coordinates of the hemispherical resonator gyro electrode to be processed, determining a marking area of the hemispherical resonator gyro electrode and accurately positioning the hemispherical resonator gyro electrode;
(5.3) transmitting X, Y coordinate information of the hemispherical resonator gyro electrode to be processed determined in the step (5.2) to an industrial personal computer, and determining a marking path by combining a design drawing of the hemispherical resonator gyro electrode to be processed;
and (5.4) filling a scribing pattern along the contour line of the marking area in the range of the laser marking scanning galvanometer according to the marking path determined by the industrial personal computer to finish path filling, and etching the metal layer of the hemispherical resonator gyro electrode to be processed to the conductive layer until the conductive glass is exposed, thereby finishing the marking of the plane part of the bottom surface or the top surface of the hemispherical resonator gyro electrode to be processed.
6. The method for processing the hemispherical resonator gyro electrode based on laser processing according to any one of claims 1 to 5, wherein the thickness of the plating layer of the metal electrode layer plated on the surface of the hemispherical resonator gyro electrode to be processed is 100 to 150nm.
7. A hemispherical resonator gyro electrode fabricated by the laser-machining-based hemispherical resonator gyro electrode processing method of any one of claims 1 to 5.
8. A hemispherical resonator gyro electrode processing system comprising a memory, a processor and a computer control program stored on the memory and running on the processor, wherein the processor, when executing the computer control program, implements the laser processing based hemispherical resonator gyro electrode processing method of any of claims 1-5.
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