KR100403142B1 - 반도체패키지 - Google Patents
반도체패키지 Download PDFInfo
- Publication number
- KR100403142B1 KR100403142B1 KR10-1999-0044653A KR19990044653A KR100403142B1 KR 100403142 B1 KR100403142 B1 KR 100403142B1 KR 19990044653 A KR19990044653 A KR 19990044653A KR 100403142 B1 KR100403142 B1 KR 100403142B1
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- South Korea
- Prior art keywords
- mounting plate
- chip mounting
- chip
- semiconductor
- semiconductor package
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- H01—ELECTRIC ELEMENTS
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- H01L23/00—Details of semiconductor or other solid state devices
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
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- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (3)
- 삭제
- 다수의 입출력패드가 형성된 반도체칩과, 상기 반도체칩의 저면에 접착제로 접착되고, 하부 측면에는 할프에칭부가 형성된 칩탑재판과, 상기 칩탑재판의 외주연에 일정거리 이격되어 형성된 다수의 내부리드와, 상기 반도체칩의 입출력패드와 내부리드를 전기적으로 접속하는 도전성와이어와, 상기 반도체칩, 도전성와이어, 칩탑재판 및 내부리드 등을 봉지재로 봉지하되, 상기 칩탑재판 및 내부리드의 저면과 측면은 외부로 노출되도록 봉지하여 형성된 패키지몸체로 이루어진 반도체패키지에 있어서,상기 칩탑재판은, 상기 패키지몸체와의 결합력이 강화되도록, 상기 칩탑재판의 할프에칭부에 다수의 장공이 더 형성된 것을 특징으로 하는 반도체패키지.
- 다수의 입출력패드가 형성된 반도체칩과, 상기 반도체칩의 저면에 접착제로 접착되고, 하부 측면에는 할프에칭부가 형성된 칩탑재판과, 상기 칩탑재판의 외주연에 일정거리 이격되어 형성된 다수의 내부리드와, 상기 반도체칩의 입출력패드와 내부리드를 전기적으로 접속하는 도전성와이어와, 상기 반도체칩, 도전성와이어, 칩탑재판 및 내부리드 등을 봉지재로 봉지하되, 상기 칩탑재판 및 내부리드의 저면과 측면은 외부로 노출되도록 봉지하여 형성된 패키지몸체로 이루어진 반도체패키지에 있어서,상기 칩탑재판은, 상기 패키지몸체와의 결합력이 강화되도록, 상기 칩탑재판의 할프에칭부 둘레에 다수의 탭이 더 형성된 것을 특징으로 하는 반도체패키지.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-1999-0044653A KR100403142B1 (ko) | 1999-10-15 | 1999-10-15 | 반도체패키지 |
JP2000015004A JP2001077278A (ja) | 1999-10-15 | 2000-01-24 | 半導体パッケージと、このためのリードフレーム及び、半導体パッケージの製造方法とそのモールド |
US09/687,493 US6853059B1 (en) | 1999-10-15 | 2000-10-13 | Semiconductor package having improved adhesiveness and ground bonding |
US10/868,643 US7067908B2 (en) | 1999-10-15 | 2004-06-15 | Semiconductor package having improved adhesiveness and ground bonding |
US11/408,521 US7535085B2 (en) | 1999-10-15 | 2006-04-21 | Semiconductor package having improved adhesiveness and ground bonding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR10-1999-0044653A KR100403142B1 (ko) | 1999-10-15 | 1999-10-15 | 반도체패키지 |
Publications (2)
Publication Number | Publication Date |
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KR20010037249A KR20010037249A (ko) | 2001-05-07 |
KR100403142B1 true KR100403142B1 (ko) | 2003-10-30 |
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ID=19615436
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR10-1999-0044653A KR100403142B1 (ko) | 1999-10-15 | 1999-10-15 | 반도체패키지 |
Country Status (2)
Country | Link |
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US (3) | US6853059B1 (ko) |
KR (1) | KR100403142B1 (ko) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3895570B2 (ja) | 2000-12-28 | 2007-03-22 | 株式会社ルネサステクノロジ | 半導体装置 |
KR100405272B1 (ko) * | 2001-10-18 | 2003-11-12 | 주식회사 코스타트반도체 | 큐. 에프. 엔(qfn) 반도체 패키지 |
JP2003204027A (ja) * | 2002-01-09 | 2003-07-18 | Matsushita Electric Ind Co Ltd | リードフレーム及びその製造方法、樹脂封止型半導体装置及びその製造方法 |
TWI236126B (en) * | 2002-07-02 | 2005-07-11 | Alpha & Omega Semiconductor | Integrated circuit package for semiconductor devices with improved electric resistance and inductance |
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US7067908B2 (en) | 2006-06-27 |
US20040227217A1 (en) | 2004-11-18 |
US7535085B2 (en) | 2009-05-19 |
US20060186517A1 (en) | 2006-08-24 |
US6853059B1 (en) | 2005-02-08 |
KR20010037249A (ko) | 2001-05-07 |
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