JPWO2014068639A1 - 部品供給装置 - Google Patents
部品供給装置 Download PDFInfo
- Publication number
- JPWO2014068639A1 JPWO2014068639A1 JP2014544070A JP2014544070A JPWO2014068639A1 JP WO2014068639 A1 JPWO2014068639 A1 JP WO2014068639A1 JP 2014544070 A JP2014544070 A JP 2014544070A JP 2014544070 A JP2014544070 A JP 2014544070A JP WO2014068639 A1 JPWO2014068639 A1 JP WO2014068639A1
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- Prior art keywords
- wafer sheet
- guide
- wafer
- support point
- moving
- Prior art date
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- 230000007246 mechanism Effects 0.000 claims abstract description 42
- 230000032258 transport Effects 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 14
- 238000011144 upstream manufacturing Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/043—Feeding one by one by other means than belts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/02—Devices for feeding articles or materials to conveyors
- B65G47/04—Devices for feeding articles or materials to conveyors for feeding articles
- B65G47/06—Devices for feeding articles or materials to conveyors for feeding articles from a single group of articles arranged in orderly pattern, e.g. workpieces in magazines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/021—Loading or unloading of containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7565—Means for transporting the components to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
次に、部品装着システム10の各部について詳細に説明する。まず、ウエハシート補給部160について説明する。図2に示すように、ウエハシート補給部160は、ハウジング162と、マガジン170と、昇降機構168を備えている。
次に、ウエハシート搬送部60について説明する。図2に示すように、ウエハシート搬送部60は、移動テーブル62と、移動テーブル62を昇降するテーブル昇降機構110と、移動テーブル62に対してxy方向に移動可能とされた吸着ヘッド100と、移動テーブル62に載置されたウエハシートW2を撮影するカメラ104を有している。
次に、実装機20について説明する。なお、実装機20には、従来公知のものを使用することができるため、ここでは、実装機20の構成については簡単に説明する。図2に示すように、実装機20は、基板搬送部22a,22bと、装着ヘッド30と、部品カメラ28を有している。基板搬送部22a,22bは、コンベアベルトを回転させることで、コンベアベルト上に載置された基板を搬送する。装着ヘッド30は、部品W1を吸着するための複数の吸着ノズル32と、ウエハシートW2のフィデューシャルマークを読み取るためのマークカメラ34を備えている。装着ヘッド30の吸着ノズル32の配置は、吸着ヘッド100の吸着ノズル114a,114bの配置に対応している。すなわち、装着ヘッド30は、吸着ヘッド100の吸着ノズル114a,114bに保持された複数の部品W1を同時に受取ることができる。なお、装着ヘッド30は、図示しないx方向移動機構とy方向移動機構によって、xy方向に移動可能となっている。部品カメラ28は、装着ヘッド30に吸着された部品W1の読み取り等を行う。
Claims (3)
- 基板に部品を実装する実装機に隣接して配置され、前記実装機に前記部品を供給する部品供給装置であり、
シート上に複数の部品が特定のパターンで配置されたウエハシートが補給されるウエハシート補給部と、
前記ウエハシート補給部に補給されたウエハシートを前記実装機に向かって搬送するウエハシート搬送部と、を有しており、
前記ウエハシート搬送部は、
前記ウエハシート補給部の近傍の位置から前記実装機の近傍の位置までの間を移動する移動スライダと、
前記移動スライダに支持され、前記ウエハシートが載置される載置面を有するテーブルと、
前記載置面に対して直交する特定の回転軸の周りにテーブルを回転させる回転機構と、を有しており、
前記テーブルは、前記回転軸を中心とする円周上に設定された第1の支持点、第2の支持点及び第3の支持点で前記移動スライダに支持されており、
前記回転機構は、
前記第1の支持点を前記回転軸に対して円弧運動させるための第1ガイドと、
前記第1の支持点を前記第1ガイドに沿って移動させるアクチュエータと、
前記第1の支持点が前記第1ガイドに沿って移動するときに、前記第2の支持点を前記回転軸に対して円弧運動させる第1従動ガイドと、
前記第1の支持点が前記第1ガイドに沿って移動するときに、前記第3の支持点を前記回転軸に対して円弧運動させる第2従動ガイドと、
を有する部品供給装置。 - 前記第1ガイドは、
前記移動スライダに設けられたRガイドと、
前記テーブルの前記第1の支持点に取付けられ、前記Rガイドに沿って移動するRスライダと、を有しており、
前記第1ガイドが、前記テーブルの実装機側の端辺に配置されている、請求項1に記載の部品供給装置。 - 前記第1従動ガイド及び前記第2従動ガイドはクロスガイドである、請求項1又は2に記載の部品供給装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2012/077901 WO2014068639A1 (ja) | 2012-10-29 | 2012-10-29 | 部品供給装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP5885856B2 JP5885856B2 (ja) | 2016-03-16 |
JPWO2014068639A1 true JPWO2014068639A1 (ja) | 2016-09-08 |
Family
ID=50626619
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014544070A Active JP5885856B2 (ja) | 2012-10-29 | 2012-10-29 | 部品供給装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9781870B2 (ja) |
EP (1) | EP2914078B1 (ja) |
JP (1) | JP5885856B2 (ja) |
CN (1) | CN104770076B (ja) |
WO (1) | WO2014068639A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9902415B2 (en) * | 2016-02-15 | 2018-02-27 | Lam Research Corporation | Universal service cart for semiconductor system maintenance |
CN108054104B (zh) * | 2018-01-22 | 2024-04-26 | 东莞领杰金属精密制造科技有限公司 | 3c产品颗粒小件自动化贴微小辅料组装设备 |
CN113543511B (zh) * | 2021-08-11 | 2023-08-18 | 常州冯卡斯登智能科技有限公司 | 一种具有自动疏通功能的贴片机进料装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09199519A (ja) | 1996-01-17 | 1997-07-31 | Hitachi Ltd | 回転位置決め機構およびそれを用いる半導体製造方法ならびに装置 |
JPH10123193A (ja) | 1996-10-18 | 1998-05-15 | Micronics Japan Co Ltd | 表示パネル基板の検査装置および検査方法 |
JPH10303224A (ja) | 1997-04-30 | 1998-11-13 | Hitachi Ltd | 回転位置決め機構およびそれを用いた半導体製造装置 |
JPH11300557A (ja) * | 1998-04-15 | 1999-11-02 | Thk Co Ltd | 移動テーブル装置 |
JP2000114204A (ja) | 1998-10-01 | 2000-04-21 | Mitsubishi Electric Corp | ウエハシート及びこれを用いた半導体装置の製造方法並びに半導体製造装置 |
JP4322092B2 (ja) * | 2002-11-13 | 2009-08-26 | 富士機械製造株式会社 | 電子部品実装装置における校正方法および装置 |
JP4085995B2 (ja) | 2004-03-16 | 2008-05-14 | 松下電器産業株式会社 | 回転テーブル機構 |
KR101003845B1 (ko) * | 2008-06-23 | 2010-12-28 | 정석환 | 대형 플랜지용 조립구멍 가공기 |
JP5077254B2 (ja) * | 2009-01-30 | 2012-11-21 | パナソニック株式会社 | パレット自動交換方法 |
KR101690970B1 (ko) * | 2010-02-19 | 2016-12-29 | 주성엔지니어링(주) | 기판 처리 시스템 및 기판 반송 방법 |
-
2012
- 2012-10-29 WO PCT/JP2012/077901 patent/WO2014068639A1/ja active Application Filing
- 2012-10-29 EP EP12887805.5A patent/EP2914078B1/en active Active
- 2012-10-29 JP JP2014544070A patent/JP5885856B2/ja active Active
- 2012-10-29 US US14/438,525 patent/US9781870B2/en active Active
- 2012-10-29 CN CN201280076742.1A patent/CN104770076B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
US9781870B2 (en) | 2017-10-03 |
CN104770076A (zh) | 2015-07-08 |
JP5885856B2 (ja) | 2016-03-16 |
US20150282397A1 (en) | 2015-10-01 |
EP2914078B1 (en) | 2020-05-06 |
EP2914078A1 (en) | 2015-09-02 |
WO2014068639A1 (ja) | 2014-05-08 |
EP2914078A4 (en) | 2015-11-04 |
CN104770076B (zh) | 2018-04-10 |
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