JPS59205496A - Electroplating apparatus - Google Patents

Abstract

PURPOSE:To supply a plating liquid stream uniform in the width direction of a metal strip, by sealing the outlet of the running metal strip from the trough shaped electroplating bath of a plating apparatus so as to allow the running of the metal strip while injecting the plating bath in the vicinity of the seal part. CONSTITUTION:A trough shaped plating bath is formed of upper and lower insoluble anodes and side seals 7 and a pair of rolls 4 are provided to the outlet of the metal strip 1 from the plating bath to substantially perform the sealing of the plating liquid in passing the metal strip. A header 5 and a nozzle 6 for supplying the plating liquid are provided in the vicinity of said rolls 4 and the plating liquid is supplied between the metal strip 1 and the insoluble anodes 3 as a uniform stream in the width direction of the metal strip 1. The plating liquid stream 8 flows at a constant speed through the trough shaped plating bath and flooded from the opposite opening part. By this apparatus, a plating surface uniform in thickness and in the width direction of the metal strip can be formed.

Description

[Detailed description of the invention] The present invention relates to an electroplating apparatus IT.

'10 Using insoluble 1-tanpae, in air plating, the oxygen gas generated from the anode can be quickly removed from the gap between the electrodes, and in alloy plating, it is greatly effective in making the composition uniform in the width direction and the thickness direction of the plating. It is very important to provide the plating solution flow with a uniform flow rate in both the width direction and the length direction, but it has not been possible to achieve a satisfactory gVc in the past.

Typical examples of conventional high-speed plating techniques include those shown in Figures 3 to 5.
In either case, the liquid flow distribution in the width direction and length direction is not uniform. The one shown in Fig. 3 is a horizontal temperature type in which a metal strip 1 is run between insoluble electrodes 3, and the plating solution is jetted onto the metal strip 1 through a header 5 and a nozzle 6 at a distance of ρπ to create a unidirectional flow. However, in this case, it is difficult to provide a sufficient flow velocity, and the flow velocity decreases as the distance from the first nozzle increases.

What is shown in FIGS. 4a and 4b is a box-shaped bath having a tube 5 and a nozzle 6 in the center. Even if the respective flow velocities are fully adjusted, it is difficult to equalize the relative velocities with the surface of the metal band. Also, as shown in Fig. 4b, there is a roll 4 in the center.
However, this roll is for the purpose of stabilizing the pass line of the metal strip, and is not for the purpose of directing the plating solution flow in one direction as in the present invention. Fi, I didn't expect the full sealing effect.

In addition, the one shown in FIG. 5 is one in which plating is applied to a metal strip 1 wound around an energizing roll 10, and the lower header 5 is plated.
The tamping liquid introduced through the nozzle 6 is divided into left and right sides.
It is difficult to equalize the relative speed between the metal strip and the plating liquid on both sides.

In this way, if the flow rate of the plating solution on the surface of the metal strip is uneven, the parts where the oxygen gas generated in the bath-free electrode 3 is removed slowly will come into contact with these bubbles, resulting in poor appearance on the plating surface. Also, in alloy plating, the alloy composition becomes non-uniform, resulting in non-uniformity in the quality of the plating layer in the thickness direction and width direction.

Therefore, the present invention overcomes the drawbacks of the prior art mentioned above and
An object of the present invention is to provide an electroplating apparatus capable of supplying a uniform flow of plating liquid in the width direction of a metal strip to be plated.

According to the present invention, a trough-shaped electroplating bath is provided, which includes a facing wall member whose at least one side facing a traveling metal strip to be plated is comprised of an insoluble anode, and a side wall member that seals the side surface of the facing wall member. At the outlet of the traveling metal strip from this trough-like electroplating bath, a sealing member is provided to allow the entire running of the gold F6 strip while maintaining the plating solution ff in a substantially liquid-tight state, and a sealing member is provided in the vicinity of this sealing member. The above object can be achieved by configuring the entire electroplating apparatus with a plating liquid spout provided to supply a uniform flow of plating liquid over the entire width of the plating bath.

Hereinafter, the electroplating apparatus of the present invention will be described in detail with reference to preferred embodiments shown in the accompanying drawings.

FIG. 1 shows a first configuration example of the electroplating apparatus of the present invention, in which the gutter-like plating bath is composed of upper and lower insoluble anodes 3 and side seals 7. metal band 1
At the exit, a pair of rolls 4 are provided for the threading of the metal strip and for the substantial sealing of the tacking bath. In close proximity to the pair of sealing rolls 4, the plating bath is provided with a header 5 and a nozzle 6 for supplying plating i'' by a pump with a large capacity. A uniform flow is supplied between the metal strip 1 and the anode 3 in the width direction of the metal strip 1, and during plating, this uniform flow flows between the metal plate 1 and the insoluble anode 3 at a constant speed through the metal in the trough-like plating bath. The flow overflows from the opposite opening of the plating bath gutter. Fig. 1 shows an example of the present invention for a metal strip running in a horizontal pass, but in the vertical pass, the electrode 3 is connected to the plating solution. Either a bottom feed or a top feed is possible.Also, in horizontal or vertical passes, the plating solution flow can be parallel to the direction of travel of the metal strip, or countercurrent in the opposite direction. Of course you can.

FIG. 2 shows a second configuration example of the electroplating apparatus of the present invention,
The plating bath is composed of a roll 2, an insoluble anode 3 and a side seal 7, and the plating is performed only on one side of the part of the metal strip 1 wound around the roll 2. The roll 2 can be a rubber roll or a current-carrying roll having a current-carrying ring in the center and having insulating elastic bodies (rubber) on both sides. However, in the former case, separate energization is required, such as by providing an energizing roll like 13 in FIG. 2c.

At the exit of the metal strip from the plating bath, in the example of FIGS. 2a and 2b, as in FIGS. 1a and 1b,
A sealing roll 4 is provided to pass the metal strip between it and the roll 2 in a substantially liquid-tight manner.On the other hand, in the example shown in FIG. 2c, instead of the sealing roll 4, A seal plate 14 is provided to perform the same function as the roll 4. In this case, the side seal 7 is made of an insulating sealing material with good wear resistance (for example,
Polyurethane resin) is used, and the space between the winding roll 2 and the side seal 7 is provided with liquid lubrication that seeps out between the winding roll 2 and the side seal 7. In addition, the sole roll 4 is pressed against the opening/rule 2 and rotates at a surface speed that is synchronized with the surface speed of the gold band so as to minimize the deviation from the metal band.

In order to reduce leakage and air entrainment between the roll 4 and the nozzle 6, and to prevent friction between the roll 41 and the nozzle 6, a slight leakage is provided between the roll 4 and the nozzle 6. It is preferable to leave a small gap in place so that the liquid is completely absorbed by the liquid. By adjusting these 16 relative positions, the distance between electrodes 3 and 3 can be changed.Furthermore, the attachment of electrode 3 to winding roll 2 The winding can be placed at any position on the roll.

In place of the seal opening 4 shown in FIGS. 23 and 2b, a sealing plate 14'f is provided at 5 as shown in FIG. 2c.

It is also possible to use @As mentioned above, the roll roll is useful for stabilizing the entire distance between the poles, but this is
Since this is a secondary effect and tends to make the structure a little complicated, it is possible to create a simpler structure by using the seal plate 14 for sealing.

Rubbing the surface of the metal strip with the seal plate 14 d:
Since there is a risk of damaging the surface of the product, it is preferable to install the seal plate 14 with a slight gap between it and the surface of the metal strip.

If this gap is provided, the plating liquid flows out from this gap in the form of a thin film, but the electrical resistance between the anode 3 and the energized I coil 13 is equal to that of the metal strip between the connecting rolls from the part facing the anode 3. In comparison, if the seal plate is present, it can be made sufficiently large, and the deposition of plating metal on the current-carrying roll can be substantially suppressed to the extent of being burnt.

Next, the present invention will be specifically explained using examples.

[Example 1] A copper strip with a width of 300 square meters was run at a line speed of 100,772/min, and in a horizontal galvanizing bath as shown in Fig. 1, the width of 500 strips of insoluble homopolar material 3, the length of 800 strips, The diameter of the sole roll 4 was 150 mm, and the distance between poles was 15 mm. 0.5n from each header 5? The flow direction is opposite to the running direction of the copper strip, i.e., counterflow. The energized roll was installed at a position 300 m upstream from the seal roll 4. Current: 6000 A″T: Plating was performed on each side of the steel strip. That is, plating was performed on all sides at 1 s. was gotten.

[Example 2] A steel strip with a width of 300 aa was run at a line speed of 100 m/min, and a rubber strip with a diameter of 1,000 aa was Plating was performed on the part that could be wrapped around Roll 2 over 500 rolls. The copper strip descends vertically [-, so that it wraps around roll 2 and moves vertically upward! /CL, A complete set of electrodes with a width of 500 and an arc length of 800 is attached to the roll winding part, and the distance between the electrodes is 811 m. 0.4 from header 5
Supply several sounds of silence/minute, and the flow direction of the liquid is 5 cases 1
Similarly, there is a countercurrent flow and -. The energizing roll was placed 200 cylinders upstream from the seal 1 call 4 and pressed against the copper strip on the rubber roll 2. At a current of 8000A, i.e. 2
00 A/dtr? Uniform beautiful appearance and uniform area weight (3.25'/m'7 per electrode)
, n) were obtained.

[Example 3] A steel strip with a width of 300 mm was run at a line speed of 100 m/min, and a steel strip with a diameter of 10 mm was run in a plating bath as shown in Fig. 2C.
00 tan rubber was wrapped around Roll 2Q and plating was performed on the part where it was wrapped over 500 degrees. Energizing roll 1
3 presses the vicinity of the point where the contact between the roll 2 and the steel strip 1 ends. A seal plate 14 was used in place of the seal roll 4 of Example 2, and the gap between the seal plate 14 and the surface of the steel strip was approximately 0.5 mm. The distance between the contact point between the copper strip and the current-carrying roll and the sealing plate was approximately 200 m in length of the copper strip. The plating thickness was improved under the same conditions as in Example 2. Although the plating liquid flow 8 flowing out from the gap between the lead strip 1 and the seal plate 14 covered the entire lower surface of the energizing roll 13, no zinc precipitation was observed with the naked eye on the surface of the energizing roll.

Further, the damping obtained on the surface of the copper strip was equivalent to that of Example 2.

[Brief explanation of drawings]

1a and 1b are a schematic sectional view and a perspective view, respectively, of a first configuration example of an electroplating apparatus according to the present invention, and FIG.
2B and 2B are a diagrammatic cross-sectional view and a perspective view, respectively, of a second configuration example of the electroplating apparatus of the present invention, and FIG. 2C is a diagram showing a modification of the electroplating apparatus of the present invention shown in FIG. 2A. FIGS. 3, 4 and 5 are diagrammatic cross-sectional views which do not fully explain the conventional high speed plating technique. Explanation of symbols 1...Metal band, 2...Wound on roll, 3...Insoluble anode, 4...Seal roll, 5...Metsu FII header, 6...Plating solution nozzle, 7.- Side seal, 8. Plating solution flow, 9. Plating solution level, 10.
...Electricity roll, 11...Rubber roll, 12...Overflow rapid flow device, 13...Electrification roll, 14-
...Seal plate patent applicant Kawasaki Koshitetsu Co., Ltd. Figure 1, Figure 4 (a) Figure 5, Figure 1

Claims (1)

[Claims] A trough-like structure 1j consisting of a facing wall member 2 whose at least one side facing the running metal strip to be plated is made of insoluble nt4, and a side wall member for sound-opening sealing on the sides of this facing wall member.
At the outlet of the L-air plating bath and the running metal strip from this trough-like electroplating bath, a plate is provided to allow the metal strip to run while maintaining the plating solution in a liquid-tight state. a plating liquid jet L provided in close proximity to the seal member to supply a uniform plating liquid over the entire width of the plating α. An electroplating device characterized by: