JPH07243090A - Method for electroplating one side of metallic strip - Google Patents

Abstract

PURPOSE:To obtain a metallic strip with one side plated uniform in coating weight in the width direction and free from infiltration of the plating on the unplated surface. CONSTITUTION:A metallic strip 1 is energized by conductor rolls 2 and 2' and vertically traveled. Electrodes 3 and 3' are oppositely arranged on the plating side at a specified distance from the strip 1 on the down-path side and up-path side of the strip 1, respectively, belts 4 and 4' are formed on the opposite side, i.e., on the unplated surface, and traveled at the same speed at that of the strip 1, and the belts 4 and 4' are brought into contact with the unplated surface with the length in the width direction made larger than the width of the strip 1.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to a method for electroplating one side of a metal strip in a vertical electroplating bath.

[0002]

2. Description of the Related Art Conventionally, when performing vertical electroplating on a metal strip in a down pass and an up pass with a sink roll interposed in between, a metal strip running vertically while being energized by a conductor roll in each pass. It is general that the electrodes are arranged at regular intervals and the plating solution is made to flow down from above between the strip and the electrodes. As a method of causing the plating solution to flow down from the upper portion, for example, (A) a method of causing the plating solution to flow between the strip and the electrode by gravity and continuously performing electroplating on one side or both sides of the metal strip Sho 59-897
No. 92), (B) similarly, electrodes are vertically arranged between running strips, and a plating solution is forcibly flown down at a predetermined flow velocity from a nozzle provided above the electrodes into a gap between the electrode and the strip. An electroplating method for plating a strip (Japanese Patent Publication No. 4-9876) has been proposed.

[0003]

However, in the case of plating only one surface of the metal strip, in the method A, firstly, since the plating solution is supplied only to one side of the strip, the liquid pressure is reduced. When it fluctuates, the strip in the section facing the electrode is deformed in an arc shape in the width direction (C warpage),
The distance between the electrode and the strip changes. For this reason, there is a drawback that the coating amount in the width direction tends to be non-uniform. Secondly, in the method of flowing the plating solution between the electrodes by gravity, only the plating solution injected between the electrodes at the upper part of the electrode is used for plating, and the plating solution is supplied to both sides of the metal strip at the plating solution supply part. The liquid is discharged without being used for plating. At this time, since the flow rate of the plating solution flowing down due to gravity is accelerated as it flows down to the lower part of the electrode, the filling degree of the plating solution decreases at both widthwise end portions of the strip, and the amount of plating adhered decreases. There is also the drawback that it is easy.

Further, the method B is also different from the method A in that the plating solution is forced to flow down at a predetermined flow rate,
Similar to the method A, there is a problem that the amount of coating adhered in the strip width direction is non-uniform due to the variation of the plating solution pressure and the amount of coating adhered at both ends in the strip width direction due to the acceleration of the plating flow velocity due to gravity. An object of the present invention is to provide an electroplating method that advantageously solves these problems.

[0005]

SUMMARY OF THE INVENTION The gist of the present invention is to provide a plating solution from the upper part of an electrode between a metal strip which runs vertically while being energized by a conductor roll and an electrode arranged at a constant interval. In the method of electroplating one side of the metal strip while flowing down, the non-plated surface of the metal strip in the section facing the electrode is run at the same speed as the running speed of the metal strip, and the length in the width direction of the metal strip is A method for single-sided electroplating of a metal strip, which comprises contacting a belt longer than the width.

[0006]

According to the method of the present invention, the electrodes are arranged on the down-pass side and the up-pass side of the metal strip which runs vertically while being energized by the conductor rolls so as to face the metal strip on the side to be plated at a constant interval. , On the opposite non-plated surface, a belt that runs at the same speed as the running speed of the metal strip is provided,
The belt is brought into contact with the non-plated surface with its length in the width direction being longer than the width of the metal strip. The belt that is brought into contact with the non-plating side runs vertically at least between the plating supply port on the upper part of the electrode and the lower end of the electrode.

It is essential that the belt width be longer than the width of the metal strip. If the belt width is less than the width of the metal strip, the plating solution supplied to the upper portion of the electrode and diverted to both sides of the metal strip is discharged without being used for plating, so that the effect of arranging the belt is reduced. When contacting the belt with the non-plated surface of the metal strip to maintain the shape of the metal strip, it is advantageous to apply back pressure to the belt to strengthen the contact with the metal strip. The back pressure may be a support roll or a gas pressure, and is not particularly limited. The belt that runs together with the metal strip when the plating solution is filled between the electrodes may be held flat, and may be determined according to the length and width of the vertical running section of the belt.

With this structure, even if the pressure of the plating solution is applied when plating one surface of the metal strip, the traveling belt prevents the metal strip from bending,
The running metal strip can be held flat. As a result, it is possible to make the plating adhesion amount distribution in the width direction uniform. Further, since the non-plated surface does not come into contact with the plating solution by coming into contact with the belt surface, it is possible to secure a metal surface in which the adhesion of plating is suppressed. In addition, since the plating solution is supplied between the electrodes at a supply width wider than the width of the metal strip at the upper part of the electrode, the width direction plating solution fullness of the metal strip is ensured at the lower part of the metal strip, and the amount of the plating adhered at both ends of the metal strip is secured. It does not come down.

[0009]

EXAMPLE An example of the present invention will be described with reference to FIG. As shown in FIG. 1, the metal strip 1 travels in the direction of the arrow in the figure, the metal strip 1 is energized to the cathode by the conductor roll 2, and then the traveling direction of the metal strip 1 is passed through the conductor roll 2. The direction is changed vertically downward, and the non-plated surface of the metal strip 1 is brought into contact with the belt 4 running at the same speed as the metal strip 1 while going down to the sink roll 7 via the electrode 3. The belt is driven by the drive roll 6. In this example, the belt contacts the metal strip 1 under back pressure from the support roll 5. Then, the sink roll 7 changes the direction of the metal strip 1 by 180 ° so that the metal strip 1 travels in the up-pass, and the belt 4'running at the same speed as the metal strip 1 is driven by the belt driving roll 6'in the same manner as the down-pass. While being in contact with the non-plated surface, the squeeze roll 8 is passed between the electrode 3 ′ and the squeeze roll 8 in this order, and the conductor roll 2 ′ re-energizes the cathode to change the direction of the next step.

The electrodes 3 and 3'are arranged at a constant distance from the metal strip 1 vertically or inclined at a predetermined angle so as to face the side of the metal strip to be plated, and the plating solution supply port 9 at the top of each of them. , 9 ', the plating solution is injected between the electrodes, and is made to flow downward. Plating is performed when the metal strip 1 passes between the electrodes filled with the plating solution. The plating solution that has flowed out between the electrodes is dropped downward and allowed to flow to the bottom of the plating tank 10.

[0011]

According to the present invention described above, the problems of the conventional method can be solved and the following effects can be obtained. First
In addition, since the metal strip runs while being held flat during plating, the gap between the metal strip and the electrode in the width direction is kept constant, and a single-sided plating strip with a uniform coating amount in the width direction is used. Obtainable. Second
In addition, since the non-plating surface is not brought into contact with the plating solution during the plating on one side of the metal strip, it is possible to obtain a single-sided plating strip that does not wrap around the non-plating surface. Thirdly, since the plating solution can be supplied between the electrodes from the upper part with a plating solution supply width wider than the width of the metal strip, the width direction plating solution fullness of the metal strip is ensured even at the lower part of the electrode, and the plating adheres at both ends of the metal strip. The amount does not decrease.

[Brief description of drawings]

FIG. 1 is a schematic explanatory view of a vertical electroplating bath apparatus to which the method of the present invention is applied.

[Explanation of symbols]

 1 metal strip 2,2 'conductor roll 3,3' electrode 4,4 'belt 5,5' support roll 6,6 'belt drive roll 7 sink roll 8 squeeze roll 9,9' plating solution supply port 10 plating tank

Claims (2)

[Claims] 1. A method of electroplating one surface of a metal strip while flowing a plating solution from the upper part of the electrode between a metal strip that runs vertically while being energized by a conductor roll and an electrode arranged at a fixed interval. In the above, the metal is characterized in that the non-plated surface of the metal strip in the section facing the electrode is brought into contact with a belt running at the same speed as the running speed of the metal strip and having a length in the width direction longer than the width of the metal strip. One-sided electroplating method for strips. 2. The method of electroplating one side of a metal strip according to claim 1, wherein the belt has a back pressure toward the non-plated surface.