JPS59140395A - Method and device for continuous electroplating - Google Patents

Abstract

PURPOSE:To obtain smooth plating having a uniform thickness in continuous electroplating using a plating member as an anode and a member to be plated as a cathode by maintaining the specified interpolar distance that causes consumption of the anode in the process of plating. CONSTITUTION:A plating member 1 to be used as an anode is un-coiled from an un-coiler 3, is introduced into a plating cell 5 and is taken up on a take-up 4. At least the outside surface of the member 1 is formed of a plating metal. A belt- like metal 2 to be used as a cathode is introduced from the opposite side to the cell 5 where the member 1 and the metal 2 are supported respectively by anode and cathode side conductor rollers 6, 7 disposed in the cell 5 and are run continuously at the prescribed space maintained between both. Electricity is conducted from a power source 8 to the rollers 6, 7 so that the members 1 and the metal 2 act respectively as the anode and the cathode. The distance (interpolar distance) between the member 1 and the metal 2 is thus maintained substantially constant without adjusting the interpolar distance and therefore the plating layer is formed continuously to an approximately uniform thickness.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a method and apparatus for continuous electroplating of metal strips.

[Prior art]

When electroplating the surface of a metal strip, one of the properties generally desired is that the plating be smooth and have a uniform thickness.

One of the factors that satisfies this property is to keep the distance between the strip metal (cathode) and the anode (interpole distance) constant.

That is, the weight W of the plating material deposited on the cathode during electroplating follows Faraday's law regarding electrolysis, and if the surface area of the cathode to be plated is A, then
The plating thickness T is T=W/(A-d)...d
Specific gravity of the plating layer - As stated, it is proportional to the amount of electricity used and the current efficiency as shown by the following equation.

T-I・t-EIfk・・・・・・Work is the strength of the current, t
is the plating time and Ettk is the current efficiency at the cathode.

Therefore, it can be seen that when the distance between the electrodes changes, the liquid resistance changes and the electric current changes, so that the plating thickness T changes. Therefore, in order to keep the plating thickness constant, it is necessary to keep the distance between the poles constant.

However, in conventional continuous electroplating equipment for metal strips, the plating material, which wears out as plating progresses, is simply placed in a position opposite to the metal strip. Since the distance changes, there is a problem in that adjustment work is required to keep this distance constant.

[-j@Ming's purpose]

An object of the present invention is to reduce the change in the distance between electrodes due to consumption of the anode during the plating process and to keep the distance between the electrodes substantially constant in continuous electroplating using the plating member as the anode and the plated member as the cathode. The purpose of the present invention is to provide a continuous electroplating method and an apparatus for the same.

[Summary of the invention]

In the present invention, the plating member is placed at a predetermined distance from the member to be plated, which is continuously immersed in an electrolyte solution, and the member is moved along the member to be plated. It is characterized in that it is supplied into an electrolyte solution.

According to this configuration, the surface of the plating member, which is the anode, is worn out during plating, but a new plating member is supplied by traveling, so the distance between the electrodes can be maintained substantially constant. As a result, the plating layer to be plated on the member to be plated can be continuously plated to a substantially uniform thickness.

[Embodiments of the invention]

Embodiments of the present invention will be explained with reference to FIGS. 1 to 4.

FIG. 1 shows an embodiment of the present invention, in which a plating member l serving as an anode is unwound from an unwinding machine 3 as indicated by the arrow in the figure, and introduced into a plating tank 5. , and is wound up by the winding machine 4. The plated member l has at least its outer surface made of plated metal. The metal band (strip) 2 that becomes the shade (cathode) is
It is introduced into the plating ll-Ii5 from the side opposite to the plating work. These plating parts and the strip 2 are supported by an anode-side conductor roller 6 and a cathode-side conductor roller 7 arranged in the plating chamber 5, respectively, and are configured to run continuously while maintaining the required spacing. . A current is applied to both conductor rows 26.7 by a power source 8 so that the plating members and strips supported thereon serve as an anode and a cathode, respectively.

In such an apparatus, electroplating is carried out as shown in FIG.

Ions 10 of the plating metal are dissolved in the solution from the plating member 1, that is, the anode side, which is continuously introduced into the electrolyte solution, and these metal ions 10 move to the strip 2 on the cathode side. Plating layer 11 on the surface of
is formed.

Therefore, in this embodiment, since the plating member 1 is supplied so as to run continuously along the strip 2 while maintaining a predetermined interval, the distance between the plating member 1 and the strip 2, that is, the distance between the poles is During plating, even if the surface of the plating member 1 is worn out, a new part of the plating member can be continuously supplied, so there is no need to adjust the distance each time based on the wear of the plating member, and the distance can always be adjusted. can be maintained constant. As a result, the plating layer 11 plated on the strip 2 can have a uniform thickness over the entire length of the strip.

In addition, in this example, since the plating member 1 and the strip 2 are running in the electrolyte, the flow rate of the electrolyte on the electrode surface increases, and during the progress of electrolysis, the electrolyte is formed on the electrode interface. The layer with low metal ion deposition, ie, the diffusion layer, can be made thinner, which allows for higher current densities. First, by increasing the flow rate of the electrolytic solution, it is possible to increase the current density, which is the main factor governing high-speed plating, and has the effect of making high-speed electroplating possible.

Needless to say, if a plurality of the methods of this embodiment are combined, even higher speed electroplating becomes possible.

Furthermore, although this embodiment shows an example in which the running directions of the plating member and the strip are opposite, the same effect can be obtained even if the plating member and the strip run in the same direction.

In addition, in this embodiment, the distance between the poles is kept constant across the conductor rollers, but even if the distance between the poles of the conductor rollers before and after the traveling direction of the plated member and the plated member is slightly different, It is clear that almost the same effect can be obtained.

Furthermore, in this example, the plating materials were supplied continuously, but it is clear that almost the same effect can be obtained even if the plating materials are supplied intermittently to the extent that the plating is not affected. It is.

In addition, in this embodiment, as shown in FIG. 2, the plating member 1, which is the positive plating member, is composed of the substrate 11 and the plating metal 12 that covers the surface of the substrate, but all the plating members are composed of the plating metal. You may do so.

FIG. 3 shows a further improvement of the present invention, which is applied to multilayer galvanizing of strips (see Japanese Patent Laid-Open No. 57-26154).

Strip 100 unwound from pay-on reel 103
is guided through an inlet looper 113 and an annealing furnace 114 to a molten zinc bath 115, where it is hot-dip galvanized. The hot-dip galvanized strip 101 is introduced into a continuous electrogalvanizing apparatus via a cooling tower 116 and is further electrogalvanized over the hot-dip galvanized layer as shown in detail in FIG. The hot-dip and electrically double-layer galvanized strips were then processed in a Suginpas Mill 11
7. The coil is wound onto the tension reel 104 via the post-processing device 118 and the output looper 119, respectively, to produce a multi-layer galvanized product coil.

In this example, electroplating is performed as shown in FIG.

The hot-dip lead-plated strip 101 is used as an anode by two contact rollers 108U on the input side.
Furthermore, a loop is formed by the support roller 109 and its traveling direction is changed, so that the cathode conductor row 21 on the exit side
It becomes Kando between 07 and 07. That is, when the hot-dip galvanized strip 101 is used as a plating member, the zinc metal ions 110 in the hot-dip galvanized layer 112 on the surface thereof are dissolved in the electrolyte solution. The zinc metal ions 110 then move to the strip 102 side where the zinc metal ions are dissolved and the hot-dip galvanized layer 112 has become thinner, and electrogalvanized on the thinner hot-dip galvanized layer 112. Galvanized again as layer 111. Although the anode and cathode are directly connected by a strip, the strip is looped in a large manner so that the resistance thereof is increased by the support row 2109, so that it has no effect on electroplating.

Generally, the amount galvanized by hot-dip galvanizing on one side of the strip is 90-150 g/m' thick,
The ratio of the hot-dip galvanized layer 112 and the electrolytic galvanized layer 111 of the product strip is the same as that of the hot-dip galvanized layer 108 on the inlet anode side conductor roller 108! Assuming that the thickness is 100, the electrogalvanized layer is determined to be approximately 30 mm thick, and the hot dip galvanized layer is determined to be approximately 70 mm thick, from an economic standpoint.

This adjustment can be easily done by adjusting the current, time, etc. using Faraday's law regarding electrolysis.

According to this embodiment, both hot-dip galvanizing and electrogalvanizing! You can make good use of the signs. That is, in hot-dip galvanizing, a thick plating layer can be removed in a short time, but when the molten metal solidifies, gas is generated from inside, resulting in the formation of bubbles, which can cause estrus. On the other hand, electrogalvanizing provides a good surface finish, but has the disadvantage that the plating process requires a long time and a considerable amount of electricity in order to obtain the desired thickness for corrosion resistance. By combining these two methods as in this example, pinholes, which are a disadvantage of hot-dip plating, can be repaired by electroplating, and the disadvantages of electroplating, which are the processing time and amount of electricity required, can be repaired by hot-dip plating. Since sufficient plating is applied, it can be used in a short time and with a small amount of electricity. Furthermore, in electrogalvanizing, the anode and the cando are formed by continuous hot-dip galvanized strips, and the upstream hot-dip galvanized strip is used as the anode. There is no need to perform any special anode replenishment work, such as replenishment of the anode that has been used or adjustment work to maintain a constant distance between the poles when the anode is exhausted, and the energy used is Although it is not necessary, it does not require high energy and uses only the energy used in conventional electroplating. It has excellent effects in terms of labor saving, running cost, etc.

This example shows an example of single-sided melting and electric multi-layer lead plating, but the same thing as this example
By combining this embodiment so that the other side is multi-layered galvanized, it is also possible to form a multi-layered galvanized layer on both sides.

〔Effect of the invention〕

According to the present invention, since the plating member is configured to run along the member to be plated, the distance between the plating member and the member to be plated, that is, the distance between the anode and the cathode, can be adjusted without adjusting the distance between the electrodes. The distance can be maintained substantially constant, and therefore, the plating layer to be plated on the material to be plated can be continuously plated to a substantially uniform thickness.

[Brief explanation of the drawing]

Claims (1)

[Claims] 1. A plated member serving as an anode and a member to be plated serving as a cathode are continuously immersed in an electrolyte solution, and an electric current is passed between the anode and the cathode to remove the plated member. In a continuous electroplating method in which a film of plated metal is deposited on the surface of a member, the plated member is placed in the electrolyte solution along the member with a predetermined distance between the plated member and the member to be plated. 1. A continuous electroplating method characterized in that the continuous electroplating method comprises: a continuous electroplating method; 2. The continuous electroplating method according to claim 1, wherein the plating member is entirely formed of plating metal. 3. Claim 1, characterized in that the plating member and the member to be plated are supplied so that the moving directions of the member to be plated and the member to be plated in the electrolyte solution are opposite to each other. Continuous electroplating method. 4. In claim 1, the plated member is a member pre-plated with a plating metal, and the plated member forms a loop after traveling along the plated member. A continuous electroplating method characterized in that the plating member has a traveling direction changed. 5. The continuous electroplating method according to claim 4, wherein the plating member is a hot-dip galvanized metal strip. 6. A plating oak that accommodates an electrolyte solution, a plating member that is immersed in the solution in the plating tank and becomes an anode, and a member to be plated that is continuously immersed in the solution in the plating tank and becomes a cathode; A continuous electroplating device comprising a device for passing tlLR between the anode and the cathode,
A traveling device for the plating member is provided so that the plating member is spaced from the member to be plated at a predetermined distance and can travel along the member to be plated in the electrolyte solution. Continuous electroplating equipment. 7. In claim 6, the plating member traveling device includes a device for supplying the plating member, and a device for guiding the plating member supplied into the electrolyte solution along the member to be plated. 1. A continuous electroplating device comprising: a device; and a device for drawing out the tampering member from the electrolyte solution through the guide device. 8. In claim 7, the device for supplying the plated member is a coiler for winding and unwinding the plated member. A continuous electroplating device characterized in that it is a plating device. 9. A continuous electroplating device characterized in that the device for guiding the plating member comprises a plurality of rollers. Electroplating device. 10. The continuous drowsiness device according to claim 7, characterized in that the device for guiding the plating member has rollers on the entry side and the exit side for supporting the plating member and the member to be plated. Plating equipment. 11. A supplying equipment for supplying Teishokin 1zz4, and an equipment for hot-dipping plating metal onto the supplied strip metal.
a plating tank containing an electrolyte solution that serves to continuously immerse the hot-dip plated metal strip;
a first guide device that guides the running of the strip metal in an electrolyte solution; a turning device that forms a loop in the strip metal that has passed through the first guide device and turns the running direction; and a turning device that A predetermined distance is placed between the metal strip and the metal strip guided by the first guide device, and the metal strip is configured to run along the metal strip in the electrolyte solution in the plating bath. a device for winding up the metal strip that has passed through the second guide device; and a device that winds up the metal strip that has passed through the second guide device; 1. A continuous drowsiness plating device comprising a device for applying current to the metal strips guided by the guide device so that the metal strips become cathodes. 12. The continuous electroplating apparatus according to claim 11, wherein the first and second guide devices are rollers. 13.% Permitted In claim 11, the device for supplying the current is the device for supplying the current. A continuous electroplating apparatus comprising a second guide device and a power source. 14. The continuous electroplating apparatus according to claim 11, wherein the turning device comprises a plurality of rollers. 15. The continuous electroplating apparatus according to claim 11, wherein the apparatus for hot-dipping the metal strip is a hot-dip galvanizing apparatus.