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JPS5858342U - hybrid integrated circuit - Google Patents

hybrid integrated circuit

Info

Publication number
JPS5858342U
JPS5858342U JP15164181U JP15164181U JPS5858342U JP S5858342 U JPS5858342 U JP S5858342U JP 15164181 U JP15164181 U JP 15164181U JP 15164181 U JP15164181 U JP 15164181U JP S5858342 U JPS5858342 U JP S5858342U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
package made
covered
whole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15164181U
Other languages
Japanese (ja)
Inventor
鳴海　雄二
Original Assignee
株式会社リコー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社リコー filed Critical 株式会社リコー
Priority to JP15164181U priority Critical patent/JPS5858342U/en
Publication of JPS5858342U publication Critical patent/JPS5858342U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の混成集積回路のパッケージング構造を示
す断面図、第２図は本考案による混成集積回路のパッケ
ージング構造の第１の実施例を示す断面図、第３図はそ
の第２の実施例を示す断面図である。 １・・・絶縁基板、２・・・部品、３・・・第１のパッ
ケージ、５・・・第２のパッケージ。FIG. 1 is a sectional view showing a conventional packaging structure for a hybrid integrated circuit, FIG. 2 is a sectional view showing a first embodiment of the packaging structure for a hybrid integrated circuit according to the present invention, and FIG. FIG. DESCRIPTION OF SYMBOLS 1... Insulating substrate, 2... Component, 3... First package, 5... Second package.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁基板を含む実装部品全体を絶縁材料からなる第１の
パッケージで覆い、さらにその全体を導電材料からなる
第２のパッケージで覆ったことを特徴とする混成集積回
路。A hybrid integrated circuit characterized in that the entire mounted component including an insulating substrate is covered with a first package made of an insulating material, and the whole is further covered with a second package made of a conductive material.
JP15164181U 1981-10-14 1981-10-14 hybrid integrated circuit Pending JPS5858342U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15164181U JPS5858342U (en) 1981-10-14 1981-10-14 hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15164181U JPS5858342U (en) 1981-10-14 1981-10-14 hybrid integrated circuit

Publications (1)

Publication Number Publication Date
JPS5858342U true JPS5858342U (en) 1983-04-20

Family

ID=29944330

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15164181U Pending JPS5858342U (en) 1981-10-14 1981-10-14 hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS5858342U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62235799A (en) * 1986-04-07 1987-10-15 日本電気株式会社 Hybrid integrated circuit device
JPS6426899U (en) * 1987-08-07 1989-02-15
JPH01157498U (en) * 1988-04-06 1989-10-30
JPH04196196A (en) * 1990-11-26 1992-07-15 Hitachi Ltd Electromagnetic wave shield structure for electronic components

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62235799A (en) * 1986-04-07 1987-10-15 日本電気株式会社 Hybrid integrated circuit device
JPS6426899U (en) * 1987-08-07 1989-02-15
JPH01157498U (en) * 1988-04-06 1989-10-30
JPH04196196A (en) * 1990-11-26 1992-07-15 Hitachi Ltd Electromagnetic wave shield structure for electronic components

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