JPS58182427U - Envelopes for semiconductor devices - Google Patents
Envelopes for semiconductor devicesInfo
- Publication number
- JPS58182427U JPS58182427U JP7948082U JP7948082U JPS58182427U JP S58182427 U JPS58182427 U JP S58182427U JP 7948082 U JP7948082 U JP 7948082U JP 7948082 U JP7948082 U JP 7948082U JP S58182427 U JPS58182427 U JP S58182427U
- Authority
- JP
- Japan
- Prior art keywords
- envelopes
- semiconductor devices
- envelope
- semiconductor device
- recorded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図及び第２図はそれぞれ半導体装置用外囲器を示す
図、第３図及び第４図はそれぞれこの考案の一実施例を
示す単導体装置用外囲器を示す図、第５図Ａは従来の半
導体装置用外囲器の絶縁物の断面図、同図Ｂはこの考案
に係る半導体装置用外囲器の絶縁物の断面図である。
１１・・・第１の電極、１２・・・第２の電極、１３・
・・絶縁物、１４・・・エレメント、１５・・・内部電
極。1 and 2 respectively show an envelope for a semiconductor device, FIGS. 3 and 4 respectively show an envelope for a single conductor device showing an embodiment of this invention, and FIG. A is a sectional view of an insulator of a conventional envelope for a semiconductor device, and FIG. 2B is a sectional view of an insulator of an envelope for a semiconductor device according to this invention. 11...first electrode, 12...second electrode, 13.
...Insulator, 14...Element, 15...Internal electrode.
Claims (1)
上記外囲器の内側に凹凸を設けたことを特徴とする半導
体装置用外囲器。In a semiconductor device that incorporates a semiconductor element into an envelope,
An envelope for a semiconductor device, characterized in that an unevenness is provided on the inside of the envelope.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7948082U JPS58182427U (en) | 1982-05-29 | 1982-05-29 | Envelopes for semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7948082U JPS58182427U (en) | 1982-05-29 | 1982-05-29 | Envelopes for semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58182427U true JPS58182427U (en) | 1983-12-05 |
Family
ID=30088662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7948082U Pending JPS58182427U (en) | 1982-05-29 | 1982-05-29 | Envelopes for semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58182427U (en) |
-
1982
- 1982-05-29 JP JP7948082U patent/JPS58182427U/en active Pending
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