JPS6426899U - - Google Patents
Info
- Publication number
- JPS6426899U JPS6426899U JP12173987U JP12173987U JPS6426899U JP S6426899 U JPS6426899 U JP S6426899U JP 12173987 U JP12173987 U JP 12173987U JP 12173987 U JP12173987 U JP 12173987U JP S6426899 U JPS6426899 U JP S6426899U
- Authority
- JP
- Japan
- Prior art keywords
- electromagnetic wave
- wave shielding
- circuit element
- curing
- applying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Conductive Materials (AREA)
Description
第１図は、本考案の実施例に係る電磁波遮蔽処
理を施した回路素子を側面から見た第２図の―
断面図、第２図は、第１図の回路素子の一部を
欠截した底面図、第３図は、第１図の回路素子を
製造するためのマスキング工程を示す側面図、第
４図は、第１図の回路素子を製造するための導電
ペーストの塗布硬化工程を示す一部を欠截した側
面図である。
符号の説明、２……回路素子、６……接続電極
、８……パツケージ、１０……絶縁部、１２……
電磁波遮蔽層、１４……マスキング層、１６……
導電性層。
Figure 1 is a side view of a circuit element subjected to electromagnetic wave shielding according to an embodiment of the present invention, as shown in Figure 2.
2 is a partially cutaway bottom view of the circuit element shown in FIG. 1, FIG. 3 is a side view showing a masking process for manufacturing the circuit element shown in FIG. 1, and FIG. 4 is a cross-sectional view. 2 is a partially cutaway side view showing a process of applying and curing a conductive paste for manufacturing the circuit element of FIG. 1. FIG. Explanation of symbols, 2... Circuit element, 6... Connection electrode, 8... Package, 10... Insulating section, 12...
Electromagnetic wave shielding layer, 14... Masking layer, 16...
conductive layer.
Claims (1)
ーストを塗布硬化して得られた電磁波遮蔽層を設
けたことを特徴とする電磁波遮蔽処理を施した回
路素子。 1. A circuit element subjected to electromagnetic wave shielding treatment, characterized in that an electromagnetic wave shielding layer obtained by applying and curing a conductive paste is provided on the package surface other than around the connection electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987121739U JPH0537516Y2 (en) | 1987-08-07 | 1987-08-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987121739U JPH0537516Y2 (en) | 1987-08-07 | 1987-08-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6426899U true JPS6426899U (en) | 1989-02-15 |
| JPH0537516Y2 JPH0537516Y2 (en) | 1993-09-22 |
Family
ID=31369027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987121739U Expired - Lifetime JPH0537516Y2 (en) | 1987-08-07 | 1987-08-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0537516Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4113371A1 (en) * | 1990-04-24 | 1991-11-07 | Fuji Heavy Ind Ltd | DEVICE AND METHOD FOR PROCESSING A STEERING ANGLE SIGNAL |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5734354A (en) * | 1980-08-08 | 1982-02-24 | Mitsubishi Electric Corp | Packaging method of electronic parts |
| JPS5858342U (en) * | 1981-10-14 | 1983-04-20 | 株式会社リコー | hybrid integrated circuit |
| JPS60163751U (en) * | 1984-04-04 | 1985-10-30 | スタンレー電気株式会社 | semiconductor equipment |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5858342B2 (en) * | 1976-01-19 | 1983-12-24 | エーザイ株式会社 | Dopamine derivatives and medicines containing dopamine derivatives |
-
1987
- 1987-08-07 JP JP1987121739U patent/JPH0537516Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5734354A (en) * | 1980-08-08 | 1982-02-24 | Mitsubishi Electric Corp | Packaging method of electronic parts |
| JPS5858342U (en) * | 1981-10-14 | 1983-04-20 | 株式会社リコー | hybrid integrated circuit |
| JPS60163751U (en) * | 1984-04-04 | 1985-10-30 | スタンレー電気株式会社 | semiconductor equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4113371A1 (en) * | 1990-04-24 | 1991-11-07 | Fuji Heavy Ind Ltd | DEVICE AND METHOD FOR PROCESSING A STEERING ANGLE SIGNAL |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0537516Y2 (en) | 1993-09-22 |