Nothing Special   »   [go: up one dir, main page]

JPS55157250A - Thick film hybrid integrated circuit and its manufacture - Google Patents

Thick film hybrid integrated circuit and its manufacture

Info

Publication number
JPS55157250A
JPS55157250A JP6504679A JP6504679A JPS55157250A JP S55157250 A JPS55157250 A JP S55157250A JP 6504679 A JP6504679 A JP 6504679A JP 6504679 A JP6504679 A JP 6504679A JP S55157250 A JPS55157250 A JP S55157250A
Authority
JP
Japan
Prior art keywords
paste
layer
printed
integrated circuit
conductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6504679A
Other languages
Japanese (ja)
Inventor
Nobuyuki Sugishita
Akira Ikegami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6504679A priority Critical patent/JPS55157250A/en
Publication of JPS55157250A publication Critical patent/JPS55157250A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
    • H01L27/013—Thick-film circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

PURPOSE:To diminish the change of resistance value by the sintering of a multilayered high density packaging thick film hybrid integrated circuit by a method wherein the first layer resistors, the second layer conductors and dielectrics forming insulating layers arranged between them are sintered at the same time. CONSTITUTION:A paste for the first layer conductors 2 is printed on a ceramic substrate 1 and is sintered. Then a paste for the first layer resistors 3, a dielectric paste for insulating layers 4 and a paste for the second layer conductors 5 are printed in succession, and are sintered together. Further, parts and conductors of lead terminal connecting parts are printed on the dielectrics 4 and then a paste for the second layer resistors 6 are printed, and these are sintered together.
JP6504679A 1979-05-28 1979-05-28 Thick film hybrid integrated circuit and its manufacture Pending JPS55157250A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6504679A JPS55157250A (en) 1979-05-28 1979-05-28 Thick film hybrid integrated circuit and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6504679A JPS55157250A (en) 1979-05-28 1979-05-28 Thick film hybrid integrated circuit and its manufacture

Publications (1)

Publication Number Publication Date
JPS55157250A true JPS55157250A (en) 1980-12-06

Family

ID=13275618

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6504679A Pending JPS55157250A (en) 1979-05-28 1979-05-28 Thick film hybrid integrated circuit and its manufacture

Country Status (1)

Country Link
JP (1) JPS55157250A (en)

Similar Documents

Publication Publication Date Title
KR850002682A (en) Ceramic multilayer board and its manufacturing method
US3484654A (en) High-speed printing of electronic components and articles produced thereby
JPS61288498A (en) Electronic component-built-in multilayer ceramic substrate
JPS55157250A (en) Thick film hybrid integrated circuit and its manufacture
JPS5771160A (en) Manufacture of thick film printed circuit substrate
JPS6221260B2 (en)
JPS5645069A (en) Hybrid integrated circuit device
JPS5773959A (en) Manufacture of thick film hybrid integrated circuit board
JPS58204516A (en) Thick film multilayer circuit board
JPH01313908A (en) Laminated electronic part and adjusting method of inductance thereof
JP2853088B2 (en) Ceramic block with composite capacitance
JPS57118660A (en) Manufacture of thick film hybrid integrated circuit
JPS63169798A (en) Multilayer ceramic board with built-in electronic parts
EP0390944B1 (en) Manufacturing method for a multilayer ceramic substrate
JPS55111152A (en) Method of manufacturing multilayer thin film circuit board
JPS62265751A (en) Hybrid integrated circuit device
JPH05152133A (en) Green sheet for inductance component and inductance component using thereof
JPH0544200B2 (en)
GB1438559A (en) Method for manufacturing a composite sintered structure
JPS61154104A (en) Film resistor
JPH04354315A (en) Thick-film capacitor
JPS6011479B2 (en) Manufacturing method of ceramic multilayer circuit board
JPS6453597A (en) Manufacture of ceramic multilayered board
JPS57166716A (en) Lamination delay line
GB1164635A (en) A Process for the Production of Electrical Thin-Layer Circuits