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JPS5773959A - Manufacture of thick film hybrid integrated circuit board - Google Patents

Manufacture of thick film hybrid integrated circuit board

Info

Publication number
JPS5773959A
JPS5773959A JP14941480A JP14941480A JPS5773959A JP S5773959 A JPS5773959 A JP S5773959A JP 14941480 A JP14941480 A JP 14941480A JP 14941480 A JP14941480 A JP 14941480A JP S5773959 A JPS5773959 A JP S5773959A
Authority
JP
Japan
Prior art keywords
layer
resistors
temperature
printed
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14941480A
Other languages
Japanese (ja)
Inventor
Nobuyuki Sugishita
Heikichi Tanei
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14941480A priority Critical patent/JPS5773959A/en
Publication of JPS5773959A publication Critical patent/JPS5773959A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/705—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PURPOSE:To achieve high accuracy of resistors arranged at a high density, by a process in which a glass having a crystalization temperature of predetermined temperature range is used as the material of insulating layer between wire conductor layer and resistor layer of a circuit board. CONSTITUTION:Ag/Pd paste is printed on an alumina substrate 1 and sintered under temperature of 850 deg.C, for example, to form first layer wiring conductors 2. Then, RuO2 paste is printed thereon and sintered under temperature of 850 deg.C to form first layer resistors 3. Subsequently, glass paste crystallized at the low melting point and having a crystallizing temperature of 500-600 deg.C is printed thereon and sintered under the crystallizing temperature to coat insulative layers 4 over the resistors 3. Thereafter, second layer wiring conductors 5 and second layer resistors 6 are similarly printed and sintered in sequence to form a complete circuit board. A sintering temperature of the second layer is selected within a ragne of the sintering temperature (preferably 550-500 deg.C) of the insulative layers 4. By so doing, it becomes possible o reduce a change in resistance value of the first layer resistors 3 due to the sintering process for forming the upper layer, thus providing resistors with high- accuracy and high-density.
JP14941480A 1980-10-27 1980-10-27 Manufacture of thick film hybrid integrated circuit board Pending JPS5773959A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14941480A JPS5773959A (en) 1980-10-27 1980-10-27 Manufacture of thick film hybrid integrated circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14941480A JPS5773959A (en) 1980-10-27 1980-10-27 Manufacture of thick film hybrid integrated circuit board

Publications (1)

Publication Number Publication Date
JPS5773959A true JPS5773959A (en) 1982-05-08

Family

ID=15474590

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14941480A Pending JPS5773959A (en) 1980-10-27 1980-10-27 Manufacture of thick film hybrid integrated circuit board

Country Status (1)

Country Link
JP (1) JPS5773959A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS601858A (en) * 1983-06-17 1985-01-08 Sanyo Electric Co Ltd Multilayer hybrid integrated circuit
EP0320824A2 (en) * 1987-12-14 1989-06-21 Matsushita Electric Industrial Co., Ltd. Glaze Resistor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS601858A (en) * 1983-06-17 1985-01-08 Sanyo Electric Co Ltd Multilayer hybrid integrated circuit
JPH023558B2 (en) * 1983-06-17 1990-01-24 Sanyo Electric Co
EP0320824A2 (en) * 1987-12-14 1989-06-21 Matsushita Electric Industrial Co., Ltd. Glaze Resistor

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