JP7535737B2 - Component mounting system, mounting head, and component mounting method - Google Patents

Description

The present disclosure relates to a component mounting system that mounts components on a substrate, a mounting head that mounts components on a substrate, and a component mounting method in the component mounting system.

A component mounting device mounts electronic components (hereinafter referred to as components) on a board. Conventionally, component mounting devices have been known that have the function of measuring the electrical characteristics of components before mounting the components on a board for the purpose of preventing erroneous component mounting and traceability management. The electrical characteristics are, for example, inductance, capacitance, and resistance (for example, Patent Document 1). The component mounting device described in Patent Document 1 has a characteristic measuring device in a transfer area where a mounting head moves, between a component supply unit that supplies components and a board on which the components are mounted. The characteristic measuring device measures the components picked up by the mounting head from the component supply unit, and components with measurement results outside a predetermined range are excluded from the mounting target. In this way, erroneous mounting of components is avoided.

JP 2011-159964 A

The component mounting system of the present disclosure includes a mounting head and a characteristic measuring device. The mounting head includes a holding member configured to hold a component , a lifting device capable of moving the holding member from a first height to a second height, and a rotating body that rotates while holding the holding member . The characteristic measuring device measures electrical characteristics of the component held by the holding member. The characteristic measuring device includes a measurement unit configured to electrically connect to the component held by the holding member, the measurement unit being provided on the mounting head , and the lifting device moves the holding member from the first height when the holding member rotates around the rotating body to a second height closer to the measurement unit than the first height, with the holding member positioned to face the measurement unit .

The mounting head of the present disclosure includes a holding member configured to hold a component, a lifting device capable of moving the holding member from a first height to a second height, a rotating body that rotates while holding the holding member, and a measurement unit configured to electrically connect to the component held by the holding member. With the holding member positioned so as to face the measurement unit, the lifting device moves the holding member from the first height when the holding member rotates around the rotating body to a second height that is closer to the measurement unit than the first height.

The component mounting method of the present disclosure is a component mounting method in the component mounting system described above. In this component mounting method, a component is held by a holding member, the holding member located at a first height is moved by rotation of a rotating body so as to face a measurement unit, the holding member is moved from the first height to a second height by a lifting device, and the component held by the holding member is connected to the measurement unit.

According to the present disclosure, it is possible to measure the electrical characteristics of components without reducing the efficiency of component mounting work.

FIG. 1 is a perspective view of a component mounting apparatus that is a component mounting system according to an embodiment of the present disclosure. FIG. 2 is a configuration diagram of a mounting head included in the component mounting device shown in FIG. FIG. 3 is a partial cross-sectional view of the mounting head shown in FIG. 2 . A side view of the mounting head shown in FIG. 2 from the opposite side. FIG. 3 is a schematic diagram illustrating the configuration of the mounting head shown in FIG. 2 . FIG. 3 is a perspective view of a measurement unit provided in the mounting head shown in FIG. 2 and included in the characteristic measurement device; FIG. 6B is an exploded perspective view of the measurement unit shown in FIG. FIG. 1 is a diagram showing how electrical characteristics of a component are measured by a mounting head according to an embodiment of the present disclosure. FIG. 7B is a diagram showing how the electrical characteristics of the components are measured by the mounting head, following FIG. 7A. FIG. 1 is a functional block diagram showing a configuration of a control system of a component mounting apparatus according to an embodiment of the present disclosure. 1 is a flowchart of a component mounting method in a component mounting device according to an embodiment of the present disclosure. FIG. 1 is a process diagram illustrating a component mounting method in a component mounting device according to an embodiment of the present disclosure. FIG. 13 is a perspective view of another mounting head according to an embodiment of the present disclosure; FIG. 12 is a top view illustrating a process of measuring electrical characteristics of components using the mounting head shown in FIG. FIG. 12 is a side view illustrating a process of measuring electrical characteristics of components using the mounting head shown in FIG.

Before describing the embodiments of the present disclosure, we will briefly explain how the idea for the present disclosure was conceived. In conventional techniques including Patent Document 1, in order to measure the electrical characteristics of a component, it is necessary to move the mounting head above a characteristic measuring device in the transfer area and stop it for a certain period of time. This results in low work efficiency in component mounting work.

The present disclosure provides a component mounting system and mounting head that can measure the electrical characteristics of components without reducing the efficiency of component mounting work, as well as a component mounting method in the component mounting system.

The embodiments of the present disclosure will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are illustrative examples and can be changed as appropriate depending on the specifications of the component mounting system and the component mounting device. In the following, the same symbols are used for corresponding elements in all drawings, and duplicated explanations will be omitted. Of the two axes that are orthogonal to each other in the horizontal plane, the axis parallel to the board transport direction (the axis perpendicular to the paper surface in FIG. 2) is the X-axis, and the axis orthogonal to the board transport direction (the axis extending from left to right in FIG. 2) is the Y-axis. The axis orthogonal to the horizontal plane (the axis extending from bottom to top in FIG. 2) is the Z-axis. The Z-axis is the axis that extends from bottom to top when the component mounting device is installed on a horizontal plane.

First, the structure of component mounting device 1, which is a component mounting system, will be described with reference to Figure 1. Component mounting device 1 mounts components onto a board. A transport mechanism 2 having a pair of conveyors extending along the X-axis is located in the center of base 1a. Transport mechanism 2 receives board 3, the target for component mounting, from an upstream device and positions and holds it at a mounting work position by the component mounting mechanism, which will be described below.

Component supply units 4 are arranged on both sides of the transport mechanism 2. The component supply unit 4 has a feeder table 4a and a number of tape feeders 5 arranged side by side on the feeder table 4a. Each tape feeder 5 feeds a carrier tape containing components to be mounted on the board 3 by pitch feeding, thereby supplying the components to a pick-up position by the mounting head 8. In addition, a component disposal unit T is installed on the top surface of the base 1a or on one of the feeder tables 4a. In FIG. 1, as an example, the component disposal unit T is installed on the feeder table 4a at the front (negative side of the Y axis). In the component disposal unit T, components that are picked up by the mounting head 8 from the tape feeder 5 but cannot be mounted on the board 3 due to reasons such as poor electrical characteristics are discarded.

Next, the component mounting mechanism will be described. At the end of the base 1a on the X-axis, a Y-axis table 6 having a linear drive mechanism is arranged so as to extend along the Y-axis. A beam 7 having a linear drive mechanism is attached to the Y-axis table 6 so as to be freely movable along the Y-axis. The beam 7 is arranged so as to extend along the X-axis. A plate member 9 is attached to the beam 7 so as to be freely movable along the X-axis, and a mounting head 8 is attached to the plate member 9 via a holding frame 10.

The mounting head 8 picks up and holds the components to be mounted on the board 3 from the component supply unit 4. As the Y-axis table 6 and beam 7 are driven, the mounting head 8 moves horizontally along the X-axis and Y-axis, and mounts the held components on the board 3 positioned by the transport mechanism 2. In other words, the mounting head 8 constitutes a component mounting mechanism. The Y-axis table 6 and beam 7 constitute a moving mechanism 11 that moves the mounting head 8 in the horizontal plane.

Next, the configuration of the mounting head 8 will be described with reference to Figures 2 to 5. The mounting head 8 is a rotary type head. Figure 2 is a side view of the mounting head 8. Figure 3 is a partial cross-sectional view of the mounting head 8. Figure 4 is a view of the mounting head 8 from the side opposite to that of Figure 2. Figure 5 is a schematic view of the mounting head 8 from below. As shown in Figure 2, the side and upper surface of the mounting head 8 are covered by a holding frame 10 and a cover 8a fixed to the holding frame 10. A rotor holding section 12 is provided at the bottom of the holding frame 10, extending horizontally. As shown in Figure 3, the rotor holding section 12 holds a cylindrical rotor 13, which is a rotor, via a bearing 12a so as to be rotatable about a rotation axis CL along the Z axis. As shown in Figure 2, a rotor driven gear 14 is provided on the upper surface of the rotor 13, with the rotation axis CL as its axis.

An index drive motor (hereinafter, the first motor) 15 is disposed above the rotor holder 12. An index drive gear 15a that meshes with the rotor driven gear 14 is attached to the rotating shaft of the first motor 15. As shown by arrow a, the rotor driven gear 14 rotates indexwise via the index drive gear 15a by being driven by the first motor 15. As a result, the rotor 13 also rotates indexwise together with the rotor driven gear 14. In other words, the rotor 13 rotates intermittently.

As shown in Figure 3, a plurality of (here, 12) through-holes 16 that pass vertically through the rotor 13 are provided at circumferential positions centered on the rotation axis CL. A cylindrical shaft 17 is inserted into each of the through-holes 16 so as to be movable vertically relative to the rotor 13.

In each of the through holes 16, bearings 18 are arranged at two locations spaced apart above and below the gap 16a between the rotor 13 and the shaft 17 to guide the shaft 17 up and down. A nozzle holder 19 is provided below each of the shafts 17, and a suction nozzle 20 is removably attached to the nozzle holder 19. In other words, the mounting head 8 has multiple (here, 12) suction nozzles 20. A roughly L-shaped attachment 21a is attached to the upper end of the shaft 17. A cam follower 21 is attached to the attachment 21a facing outward, with the horizontally extending rotation axis as its axis.

As shown in Figure 2, a cam holder 22 that fixes a cylindrical cam 23 extends horizontally from the top of the holding frame 10. A groove 23a is provided on the outer circumferential surface of the cylindrical cam 23. The groove 23a is provided so that it is higher on the side opposite the holding frame 10 and gradually becomes lower as it approaches the holding frame 10. The cam followers 21 attached to each of the shafts 17 are mounted on the cylindrical cam 23 so that they can move along the groove 23a.

An upward pulling force is applied to each of the shafts 17 by an elastic body 24 such as a spring provided above the rotor 13. When the rotor 13 rotates indexwise, the cam follower 21 attached to the shaft 17 moves up and down along the groove 23a of the cylindrical cam 23. The shaft 17 moves horizontally in a circular motion following the indexwise rotation of the rotor 13, while also moving up and down as the cam follower 21 moves up and down. A portion of the cylindrical cam 23 is cut out at the point where the groove 23a is at its lowest, and the groove 23a is interrupted at the cut-out portion.

A holding and lifting mechanism 25 is disposed between the holding frame 10 and the cylindrical cam 23. The holding and lifting mechanism 25 includes a screw shaft 25a, a holding and lifting motor (hereinafter, the second motor) 25b, and a nut 25c. The screw shaft 25a extends along the Z-axis. The second motor 25b rotates the screw shaft 25a. The nut 25c is screwed onto the screw shaft 25a. The nut 25c is provided with a cam follower holder (hereinafter, the holder) 25d that can move up and down along the cut-out portion of the cylindrical cam 23. The holder 25d moves up and down together with the nut 25c by being driven by the second motor 25b. The holder 25d has a shape that complements the groove 23a that is interrupted at the cut-out portion. Therefore, the cam follower 21 that moves along the groove 23a can smoothly move onto the holder 25d.

The cam follower 21 that has moved along the groove 23a leaves the groove 23a at the cut-out portion, and is transferred to and held by the holder 25d that is waiting at the same height as the groove 23a. When the second motor 25b is driven in this state, the shaft 17 and the suction nozzle 20 move downward together with the cam follower 21 relative to the rotor 13, as shown by the arrow b, and then move upward. Note that the holding and lifting mechanism 25 is not limited to the above structure, and may be a structure using a linear motor or a structure using an air cylinder as long as it moves the shaft 17 up and down.

In this way, the position of the shaft 17 where the retainer 25d holds the cam follower 21 is station S1, where the shaft 17 moves down and then up. As shown in Figure 5, the 12 positions where the rotor 13 stops after making an index rotation (here, rotating 30 degrees at a time) are called stations Sn (n = 1, 2, ..., 12) clockwise from station S1.

That is, the twelve suction nozzles 20 attached to the lower part of the shaft 17 inserted into the rotor 13 move from station Sn to the adjacent station Sn+1 each time the rotor 13 makes an index rotation, as indicated by arrow e, and return to station S1 after station S12. In this way, when the rotor 13 makes an index rotation, the twelve shafts 17 and suction nozzles 20 revolve around the rotation axis CL. Hereinafter, the orbit that the shafts 17 and suction nozzles 20 pass through as the rotor 13 rotates is referred to as the "orbital orbit."

As shown in Figure 3, a mounting hole 13a is provided on the top surface of the rotating body 13, centered on the rotation axis CL. A cylindrical member 26 passes through the cylindrical cam 23 from top to bottom. A tip end 26a of the cylindrical member 26 is fitted into the mounting hole 13a via a bearing 26b. Therefore, the cylindrical member 26 is arranged to be rotatable relative to the rotating body 13.

A θ rotation driven gear 27 with the rotation axis CL as its axis is provided near the upper end of the cylindrical member 26. A θ rotation motor (hereinafter, third motor) 28 is disposed above the cylindrical cam 23. A θ rotation drive gear 28a is attached to the third motor 28. The θ rotation drive gear 28a meshes with the θ rotation driven gear 27. The θ rotation driven gear 27 rotates around the Z axis via the θ rotation drive gear 28a by driving the third motor 28. As a result, the cylindrical member 26 rotates around the Z axis together with the θ rotation driven gear 27, as shown by arrow c.

Between the rotor 13 and the cylindrical cam 23 in the cylindrical member 26, a nozzle drive gear 29 is fixed, which extends vertically in response to the lifting stroke of the shaft 17. A nozzle rotation gear 30 is fixed to each of the shafts 17 at a position meshing with the nozzle drive gear 29. When the third motor 28 rotates, the cylindrical member 26 rotates around the Z axis as described above. This rotation also rotates the nozzle drive gear 29 around the Z axis. When the nozzle drive gear 29 rotates, each of the shafts 17 rotates around the Z axis simultaneously via the nozzle rotation gear 30 as shown by the arrow d. Note that the mechanism for rotating the shaft 17 around the Z axis is not limited to a configuration having a θ rotation driven gear 27, a θ rotation drive gear 28a, and a nozzle drive gear 29. For example, each of the nozzle rotation gears 30 may be provided with a nozzle drive gear that rotates independently around the Z axis, and each of the shafts 17 may be rotated independently around the Z axis.

Next, referring to FIG. 3, the air flow path of the mounting head 8 will be described. A shaft inner hole 17a is provided inside each of the shafts 17. The lower end of the shaft inner hole 17a is connected to the suction nozzle 20. The shaft inner hole 17a is connected to the nozzle flow path 20b provided in the suction nozzle 20 through an air hole 19a provided in the nozzle holder 19. The nozzle flow path 20b opens to the tip 20a of the suction nozzle 20. Above the shaft inner hole 17a, an opening 17b is provided that opens to the outer circumferential surface of the shaft 17 at a position sandwiched between the upper and lower two bearings 18 and communicates with the gap portion 16a. The opening 17b is located within the range of the gap portion 16a sandwiched between the upper and lower two bearings 18 even when the shaft 17 moves up and down.

As described above, the mounting hole 13a is provided in the center of the upper part of the rotor 13. Inside the rotor 13, a common flow path 13b is provided in the vertical direction along the rotation axis CL, opening at the bottom of the mounting hole 13a. The common flow path 13b is connected to a cylindrical member inner hole 26c provided inside a cylindrical member 26 that fits into the mounting hole 13a. The cylindrical member inner hole 26c is connected to a negative pressure generating source 32 via a tube 31 connected to the upper end of the cylindrical member 26. The common flow path 13b is connected to the gap portion 16a via a valve 33 provided corresponding to each of the through holes 16.

When the valve 33 is opened while the negative pressure source 32 is activated, negative pressure is created up to the tip 20a of the suction nozzle 20 through the gap 16a to which the valve 33 is connected. In this state, the suction nozzle 20 can suction and hold the component P at the tip 20a. When the valve 33 is closed while the suction nozzle 20 is holding the component P shown in Figure 2, the path to the negative pressure source 32 is closed and the component P is detached from the suction nozzle 20.

In this way, the shaft 17, nozzle holder 19, and suction nozzle 20 are provided on the mounting head 8 and are holding members H capable of holding components P. The rotating body 13 holds multiple holding members H in the circumferential direction. In the mounting head 8, the multiple holding members H revolve on an orbit as the rotating body 13 rotates. That is, the mounting head 8 includes the rotating body 13 that holds multiple holding members H rotatably along the orbit. Also, on the orbit of the holding members H, station S1 is a holding position where the holding members H can hold components P. The holding and lifting mechanism 25 is provided on the mounting head 8 and functions as a holding position lifting device that lifts and lowers the holding members H at the holding position (station S1).

As shown in FIG. 2, the rotor holding section 12 is provided with a sensor 34 such as a two-dimensional laser sensor. The sensor 34 detects the periphery, including the tip 20a, of the suction nozzle 20 that has been rotated indexwise and stopped at station S3, from the side. That is, the sensor 34 detects the presence or absence of a component P at the tip 20a of the suction nozzle 20 that is stopped at station S3. In addition, the posture of the component P that has been picked up can be determined by comparing the thickness of the component P detected by the sensor 34 with a predetermined thickness. That is, if the thickness of the component P detected by the sensor 34 is thicker than the predetermined thickness, it is determined that the component P picked up by the suction nozzle 20 is tilted or vertical, and a suction error has occurred due to a poor posture. The sensor 34 is not limited to this, and may be a structure using a camera or the like as long as it detects the presence or absence of the component P.

As shown in Fig. 4, the rotor holding unit 12 is provided with a component recognition unit 35. The component recognition unit 35 includes a camera 35a. The camera 35a captures an image of the component P held by the suction nozzle 20 that has made an index rotation and stopped at station S7 from below. The component recognition unit 35 includes mirrors 35b disposed below station S7 and below the camera 35a, and light from the component P held by the suction nozzle 20 that is stopped at station S7 is guided to the camera 35a by the mirror 35b.

The image of component P captured by camera 35a is processed to recognize the presence or absence of component P and its posture, such as the positional deviation of the component P. When component P is mounted on board 3, the result of capturing the image of component P by component recognition unit 35 is taken into account and the rotational position of shaft 17 in mounting head 8 and the mounting position on the X-axis and Y-axis by the component mounting mechanism are corrected.

A measurement lifting mechanism 36 is disposed above station S10. Like the holding lifting mechanism 25 of station S1, the measurement lifting mechanism 36 moves the shaft 17 and the suction nozzle 20 attached to the shaft 17, which are stopped at station S10, downward and then upward. The lower side of the cylindrical cam 23 is cut away from the groove 23a at the station S10 position.

The measurement lift mechanism 36 includes a screw shaft 36a extending along the Z axis, a measurement lift motor (hereinafter, the fourth motor) 36b that rotates the screw shaft 36a, and a nut (not shown) that screws onto the screw shaft 36a. The nut that screws onto the screw shaft 36a is provided with a cam follower holder (hereinafter, the holder) 36c that can move up and down along the cut-out portion of the cylindrical cam 23. The cam follower 21 that has moved along the groove 23a is transferred to and held by the holder 36c at this position. When the fourth motor 36b is driven in this state, the shaft 17 and the suction nozzle 20 move down together with the cam follower 21, as shown by the arrow f, and then move up.

Below the suction nozzle 20 stopped at station S10, a measurement unit 37c having electrodes that can be electrically connected to the terminals of the component P is installed. The measurement unit 37c is installed on the upper part of the rotation mechanism 37b. The rotation mechanism 37b is provided at the lower end of the arm member 37a that extends downward from the rotor holding portion 12. FIG. 6A is a perspective view of the measurement unit 37c, and FIG. 6B is an exploded perspective view of the measurement unit 37c. The electrodes 38 of the measurement unit 37c shown in FIG. 6B are electrically connected to a characteristic measurement unit (hereinafter, the measurement unit) 37d installed in the mounting head 8 shown in FIG. 4 via a cable or the like not shown.

The rotation mechanism 37b has a motor that can rotate the measurement unit 37c (electrode 38) around the Z axis. When measuring the electrical characteristics of the component P, the rotation mechanism 37b adjusts the positional deviation of the component P held by the suction nozzle 20 and the electrode 38 around the Z axis without rotating the suction nozzle 20 around the Z axis. Note that, although the rotation mechanism 37b is provided on the mounting head 8 in the above, the rotation mechanism 37b may not be provided on the mounting head 8, and the suction nozzle 20 may be rotated around the Z axis when measuring the electrical characteristics of the component P, for example.

Now, referring to Figures 6A and 6B, the configuration of the measurement unit 37c will be described. The measurement unit 37c has an upper cover 40, an anisotropic conductive sheet 41, and a measurement board 42. The function of the anisotropic conductive sheet 41 will be described later. As shown in Figures 7A and 7B, the component P has a terminal Pt. As shown in Figure 6B, the upper surface of the measurement board 42 is provided with a plurality of electrodes 38 (two in this case) that are electrically connected to the terminals Pt of the component P. The upper cover 40 is attached above the measurement board 42 from above, with the anisotropic conductive sheet 41 placed thereon so as to cover the upper surfaces of the plurality of electrodes 38. At positions corresponding to the plurality of electrodes 38 of the upper cover 40, measurement openings 40a that penetrate vertically are provided.

Next, referring to Figures 7A and 7B, a method for measuring the electrical characteristics of the component P using the measurement unit 37c and the function of the anisotropic conductive sheet 41 will be described. Figure 7A shows a state in which the suction nozzle 20 holding the component P is stopped at station S10. In this state, the component P is located above the measurement opening 40a formed in the upper cover 40. As shown in Figure 7B, when measuring the electrical characteristics of the component P, the control device 50, which will be described later with reference to Figure 8, drives the fourth motor 36b of the measurement lift mechanism 36. Then, as shown by the arrow g, the suction nozzle 20 is lowered to bring the component P into contact with the upper surface of the anisotropic conductive sheet 41. In this state, the component P is in a position in which the two terminals Pt face the two electrodes 38, respectively, with the anisotropic conductive sheet 41 sandwiched therebetween.

The anisotropic conductive sheet 41 has the property that when pressure is applied, the conductivity in the direction of pressure increases and the conductivity in other directions remains low. When no pressure is applied to the anisotropic conductive sheet 41 (for example, the state shown in Figure 7A), the conductivity of the anisotropic conductive sheet 41 is low in all directions. As shown in Figure 7B, when the suction nozzle 20 is lowered to press the component P into the anisotropic conductive sheet 41, pressure is applied to the anisotropic conductive sheet 41 toward the electrode 38.

This pressure reduces the resistance R (increases the conductivity) of the portion of the anisotropic conductive sheet 41 sandwiched between the opposing terminal Pt and electrode 38, and the terminal Pt of the component P is electrically connected to the electrode 38. In this state, the electrical characteristics of the component P are measured by the measuring unit 37d. Even in this state, the portion between the electrodes 38 of the anisotropic conductive sheet 41 remains highly resistive (has low conductivity), and does not affect the measurement of the electrical characteristics of the component P. In this way, by inserting the anisotropic conductive sheet 41 between the component P and the electrode 38, the terminal Pt of the component P can be electrically connected to the electrode 38 in a stable manner even if there is variation in the shape of the component P, and the variation in the measurement results of the electrical characteristics can be reduced.

In the measurement unit 37c described above, the terminal Pt of the component P and the electrode 38 are electrically connected via the anisotropic conductive sheet 41, but the measurement unit 37c is not limited to this configuration. For example, the measurement unit 37c may have a structure in which the terminal Pt of the component P is directly in contact (connected) with the electrode 38. The electrode 38 may also be configured as a pin with a pointed upper end, and the terminal Pt of the component P may be in contact (connected) with this pin. The measurement unit 37c may also have a configuration in which the terminal Pt of the component is electrically connected without being in contact with the terminal.

Thus, station S10 is on the orbit of the holding member H and is a measurement position where the electrical characteristics of the component P held by the holding member H can be measured. Station S10 is provided at a position different from the holding position (station S1) on the orbit of the holding member H. That is, the mounting head 8 has a rotating body 13 that holds the multiple holding members H in the circumferential direction, and a first motor 15 that can rotate the rotating body 13. The multiple holding members H can move relatively to the holding position and the measurement position as the rotating body 13 rotates. That is, each of the holding members H can move relatively to the measurement unit 37c. In addition, the measurement lifting mechanism 36 is provided in the mounting head 8 and functions as a measurement position lifting device that lifts and lowers the holding member H at the measurement position (station S10).

Next, referring to FIG. 8, the configuration of the control system of the component mounting device 1 will be described. The component mounting device 1 has a control device 50. The control device 50 is connected to the conveying mechanism 2, the tape feeder 5, the mounting head 8, the moving mechanism 11, the touch panel 51, and the like. The touch panel 51 has a display unit that displays various information. The touch panel 51 also has an input unit that allows the operator to input data and operate the component mounting device 1 using operation buttons displayed on the display unit. Note that instead of the touch panel 51, an input device such as a keyboard and a display device such as a display may be provided. The control device 50 has a mounting operation processing unit (hereinafter, processing unit) 52, a mounting possibility determination unit (hereinafter, first determination unit) 53, and a device memory unit (hereinafter, first memory unit) 54. The first memory unit 54 is a memory device that stores mounting data (hereinafter, first data) 54a, measurement result data (hereinafter, second data) 54b, and the like.

The first data 54a includes information necessary for manufacturing the mounting board, such as the type of component P to be mounted on the board 3, the standard value of the electrical characteristics of the component P, the coordinates of the mounting position, and the mounting angle. The mounting head 8 can be moved in a horizontal plane by the moving mechanism 11. The mounting head 8 includes a first motor 15, a second motor 25b, a third motor 28, a fourth motor 36b, a valve 33, a sensor 34, a camera 35a, a rotation mechanism 37b, and a measuring unit 37d. The mounting head 8 further includes a component presence/absence judgment unit (hereinafter, judgment unit) 55, a component attitude judgment unit (hereinafter, second judgment unit) 56, a measurement feasibility judgment unit (hereinafter, third judgment unit) 57, and a head memory unit (hereinafter, second memory unit) 58. The second memory unit 58 is a storage device, and stores measurement feasibility data (hereinafter, third data) 58a and the like.

The measuring unit 37d is electrically connected to the electrode 38 of the measuring unit 37c shown in Fig. 6B. When the component P held by the holding member H stopped at station S10, which is the measurement position, descends, it is electrically connected to the electrode 38 of the measuring unit 37c. At this time, the measuring unit 37d measures electrical characteristics such as the resistance, capacitance, and inductance of the component P. The measuring unit 37d includes, for example, an LCR meter.

That is, the measuring section 37d, the measuring unit 37c, and the rotating mechanism 37b are provided in the mounting head 8. These constitute a characteristic measuring device 37 that measures the electrical characteristics of a component P held by a holding member H stopped at a measurement position (station S10) as shown in Fig. 4. Note that, although the measuring section 37d is provided in the mounting head 8 in the above, this is not limiting, and the measuring section 37d may be provided inside or outside the component mounting device 1 while being connected to the measuring unit 37c via a network.

The characteristic measuring device 37 has a measuring unit 37c at a measuring position that can be electrically connected to the component P, and measures the electrical characteristics of the component P held by the holding member H. By providing the measuring unit 37c on the mounting head 8, the characteristic measuring device 37 can measure the electrical characteristics of the component P held by the holding member H while the mounting head 8 is moving. If the measuring section 37d and the measuring unit 37c are arranged on the mounting head 8, the length of the cable connecting the measuring section 37d and the measuring unit 37c is shortened, and measurement errors arising from cable resistance, etc. can be reduced.

8, the sensor 34 is provided on the mounting head 8 and functions as a detection device that detects the state of the component P, including the presence or absence of the component P held by the holding member H stopped at station S3. The camera 35a of the component recognition unit 35 is provided on the mounting head 8 and functions as a detection device that detects the state of the component P, including the posture of the component P held by the holding member H stopped at station S7.

The detection device for detecting the presence or absence of component P and the detection device for detecting the posture of component P are not limited to a structure in which they are provided in the mounting head as separate detection devices, but may be provided in the mounting head as a single detection device for detecting the presence or absence and posture of component P. In that case, the detection device may have, for example, a sensor 34 for detecting the presence or absence of component P and a camera 35a for detecting the posture of component P, or may have only a camera 35a capable of detecting the presence or absence and posture of component P.

Stations S3 and S7 are detection positions on the orbit of the holding member H where a detection device detects the state of the part P. Stations S3 and S7 are located between stations S1 and S10. In other words, the detection positions are located between the holding position and the measurement position on the orbit of the holding member H. In this way, the holding position, detection position, and measurement position are arranged in this order on the orbit of the holding member H along the traveling direction of the holding member H.

That is, the detection device detects the state of component P before the electrical characteristics of component P are measured by measurement unit 37c. In the above, the presence or absence of component P is detected at station S3, and the presence or absence and posture of component P, such as misalignment, are detected at station S7. However, this is not limited to this, and the state of component P, including the presence or absence, posture, etc. of component P, may be detected at the same station. That is, the detection position may be one station.

The judgment unit 55 functions as a judgment device. The judgment unit 55 judges whether or not a component P is held on the holding member H based on the detection result obtained by the sensor 34 or the camera 35a. That is, the judgment device judges whether or not a component P is held on the holding member H based on the detection result obtained by the detection device. The second judgment unit 56 functions as a judgment device. The second judgment unit 56 judges whether or not there has been an adsorption error of the component P held on the holding member H based on the detection result obtained by the detection device. That is, the judgment device judges whether or not the posture of the component P held on the holding member H is good based on the detection result obtained by the detection device.

The third judgment unit 57 functions as a measurement feasibility judgment device. Based on the information on the presence or absence of the component P obtained by the judgment unit 55, the third judgment unit 57 judges whether or not to measure the electrical characteristics of the component P held on the holding member H by the measurement unit 37d, the measurement unit 37c, and the rotation mechanism 37b. That is, the measurement feasibility judgment device judges whether or not to measure the electrical characteristics of the component P held on the holding member H by the characteristic measurement device 37 based on the information on the presence or absence of the component P obtained by the judgment device. Alternatively, the third judgment unit 57 judges whether or not to measure the electrical characteristics of the component P held on the holding member H by the characteristic measurement device 37 based on the information on the component posture obtained by the second judgment unit 56. That is, the measurement feasibility judgment device judges whether or not to measure the electrical characteristics of the component P held on the holding member H by the characteristic measurement device 37 based on the information on the component posture obtained by the judgment device. Alternatively, the third judgment unit 57 as a measurement feasibility judgment device may have both of these functions.

Specifically, if the holding member H is not holding a component P or if the posture of the component P held by the holding member H is poor, the third judgment unit 57 judges not to cause the characteristic measuring device 37 to measure the electrical characteristics of the component P. In other words, if the holding member H is not holding a component P, there is no need to measure the electrical characteristics. Also, if the posture of the component P held by the holding member H is poor, there is a high possibility that the electrical characteristics cannot be measured correctly. Also, there is a possibility that the component P with poor posture may come off the holding member H in the process of lowering the component P with poor posture to the measurement unit 37c. Therefore, the third judgment unit 57 does not cause the characteristic measuring device 37 to measure the electrical characteristics of the component P.

The information on whether measurement is possible or not determined by the third determination unit 57 is stored in the second memory unit 58 as third data 58a in association with information identifying the holding member H or the component P held by the holding member H. The processing unit 52 refers to the third data 58a of the holding member H that has made an index rotation and stopped at the measurement position (station S10). Then, if measurement is possible, the characteristic measuring device 37 measures the electrical characteristics of the component P, and if measurement is not possible, the holding member H (suction nozzle 20) is not lowered.

The measurement results by the measuring unit 37d are transferred to the control device 50, and are stored in the first memory unit 54 as second data 54b in association with information identifying the component P whose electrical characteristics were measured. At that time, information on the component P whose electrical characteristics were not measured is also stored in the second data 54b. The stored second data 54b is used for traceability management of the mounting board. Note that the judgment unit 55, the second judgment unit 56, and the third judgment unit 57 may be provided in the control device 50 instead of the mounting head 8. In that case, the detection result of the sensor 34 and the data captured by the camera 35a are transmitted to the control device 50. The control device 50 judges whether the electrical characteristics of the component P can be measured, and the first memory unit 54 stores the third data 58a.

The first determination unit 53 determines whether or not the component P held by the mounting head 8 is to be mounted on the substrate 3 based on the electrical characteristics of the component P measured by the characteristic measuring device 37 included in the second data 54b and the standard values of the electrical characteristics of the component P included in the first data 54a. Specifically, the first determination unit 53 determines that the component P can be mounted on the substrate 3 if the measured electrical characteristics are within the standard values, and determines that the component P cannot be mounted if the measured electrical characteristics are outside the standard values.

The processing unit 52 performs a component holding process on the holding member H stopped at station S1 while rotating the rotating body 13 by 30 degrees. The processing unit 52 also performs a measurement feasibility determination process on the holding member H stopped at station S3 or station S7. The processing unit 52 also performs a characteristic measurement process on the holding member H stopped at station S10. That is, the processing unit 52 performs a component holding process on the holding member H stopped at the holding position while rotating the rotating body 13 by 30 degrees, performs a measurement feasibility determination process on the holding member H stopped at the detection position, and performs a characteristic measurement process on the holding member H stopped at the measurement position. The processing unit 52 also performs a component mounting process when the holding member H holding the component P orbits the orbit and returns to station S1 (holding position) and stops.

That is, each time the rotor 13 rotates 30 degrees, predetermined processing is executed simultaneously at station S1, which is the holding position, stations S3 and S7, which are the detection positions, and station S10, which is the measurement position. The processing unit 52 controls the tape feeder 5, the mounting head 8, and the moving mechanism 11 to hold and remove the component P from the tape feeder 5 with the suction nozzle 20 of the mounting head 8, and mount the component P held by the mounting head 8 on the board 3. The processing unit 52 also controls the mounting head 8 and the moving mechanism 11 to execute a component disposal process in which the component P that was not mounted on the board 3 is disposed of in the component disposal unit T after the component mounting process.

In this way, the processing unit 52 repeats a series of turns of component holding processing, characteristic measurement processing, component mounting processing, characteristic measurement processing, and component disposal processing to mount a specified component P on the board 3. Next, the details of the component holding processing, measurement feasibility determination processing, characteristic measurement processing, and component mounting processing of the processing unit 52 will be explained in order.

The processing unit 52 executes a component suction operation as a component holding process. That is, the processing unit 52 causes the holding member H to suction the component P. Specifically, the processing unit 52 moves the mounting head 8 so that station S1 (holding position) becomes the removal position of the tape feeder 5. The processing unit 52 then operates the second motor 25b to lower the holding member H. Then, when the tip 20a of the suction nozzle 20 abuts against the upper surface of the component P, the processing unit 52 opens the valve 33 to cause the holding member H to suction the component P. The processing unit 52 then raises the holding member H to its original height.

As a measurement feasibility determination process, the processing unit 52 determines whether or not to measure the electrical characteristics of the component P held by the holding member H. Specifically, when the holding member H rotates indexwise and stops at station S3 (detection position), the processing unit 52 causes the sensor 34 as a detection device to inspect the tip 20a of the suction nozzle 20. Next, the processing unit 52 causes the judgment unit 55 as a judgment device to determine the presence or absence of the component P. The processing unit 52 also causes the second judgment unit 56 as a judgment device to determine the posture of the held component P, and causes the third judgment unit 57 as a measurement feasibility determination device to determine whether or not measurement of the component P is possible.

Alternatively, as a measurement feasibility determination process, when the holding member H makes an index rotation and stops at station S7 (detection position), the processing unit 52 causes the camera 35a (detection device) to photograph the part P held by the holding member H. Next, the processing unit 52 causes the determination unit 55 to determine whether or not the part P is present. The processing unit 52 also causes the second determination unit 56 to determine the attitude of the held part P, and causes the third determination unit 57 to determine whether or not measurement of the part P is possible.

As a characteristic measurement process, the processing unit 52 causes the characteristic measurement device 37 to measure the electrical characteristics of the component P determined to be measurable. Specifically, when the holding member H holding the component P determined to be measurable rotates indexing and stops at station S10 (measurement position), the processing unit 52 operates the fourth motor 36b to lower the holding member H. This causes the component P to lower toward the electrode 38 of the measurement unit 37c. When the terminal Pt of the component P is electrically connected to the electrode 38, the processing unit 52 causes the measurement unit 37d to measure the electrical characteristics of the component P. The processing unit 52 then raises the holding member H to its original height.

As a component mounting process, the processing unit 52 executes a component mounting operation to mount the component P held by the holding member H on the board 3. Specifically, the processing unit 52 moves the mounting head 8 so that the station S1 (holding position) is located above the mounting position of the board 3. The processing unit 52 then operates the second motor 25b to lower the holding member H, and when the component P held by the tip 20a of the suction nozzle 20 abuts against the board 3, the processing unit 52 closes the valve 33 to mount the component P on the board 3. Alternatively, just before the component P abuts against the board 3, the processing unit 52 closes the valve 33 to mount the component P on the board 3. The processing unit 52 then raises the holding member H to its original height.

The first memory unit 54 in the control device 50 and the second memory unit 58 in the mounting head 8 are composed of rewritable RAM, flash memory, hard disk, etc. These two may be configured as one unit. The processing unit 52 in the control device 50, the first judgment unit 53, the judgment unit 55 in the mounting head 8, the second judgment unit 56, and the third judgment unit 57 are configured as a CPU (Central Processing Unit) or an LSI (Large Scale Integrated Circuit). Alternatively, they may be configured as dedicated circuits, or general-purpose hardware may be controlled by software read from a transient or non-transient storage device. Two or more of these may also be configured as one unit.

Next, with reference to Figures 5, 9, and 10, a process for one turn in which the mounting head 8 picks up a component P from the tape feeder 5 and mounts it on the board 3 will be described as part of the component mounting method in the component mounting device 1. As shown in Figure 5, the suction nozzle 20 located at station S1 is defined as suction nozzle 20(1), and the following suction nozzles are defined counterclockwise as suction nozzles 20(2) to 20(12).

Figure 9 shows the component mounting flow in one turn of one of the multiple suction nozzles 20 (e.g., suction nozzle 20 (1)) of the mounting head 8. Figure 10 shows the processing state at each index rotation of the rotor 13, which is station S1, the holding position, station S3 and station S7, the detection positions, and station S10, the measurement position. The state shown in Figure 5 is defined as rotor index I0 in Figure 10. For convenience, in Figure 10, suction nozzle 20 (1) is represented as N1, and suction nozzles 20 (2) to (12) are represented as N2 to N12, respectively.

As shown in Figures 3 and 9, when the suction nozzle 20 (1) in the mounting head 8 is stopped at station S1, which is the holding position, and positioned above the tape feeder 5, the processing unit 52 causes the suction nozzle 20 (1) (holding member H) to perform a component suction process. That is, the processing unit 52 causes the suction nozzle 20 (1) to pick up the component P supplied by the tape feeder 5 (ST1 in Figure 9). Next, the processing unit 52 indexes the rotating body 13 by 30 degrees. This results in the rotor index I1 state shown in Figure 10, and the suction nozzle 20 (1) moves to station S2, and the suction nozzle 20 (2) moves to station S1.

Next, the processing unit 52 causes the suction nozzle 20 (2) to execute a component suction process to pick up the component P. Similarly, the processing unit 52 then causes the rotor 13 to rotate indexwise (rotor index I2 to I11), and when the suction nozzles 20 (N3 to N12) stop at station S1, the processing unit 52 executes a component suction process to pick up the components P in sequence.

When the processing unit 52 rotates the rotor 13 indexwise and the suction nozzle 20 (1) stops at station S3, which is the detection position, as shown by rotor index I2 in Fig. 10, the processing unit 52 inspects the suction nozzle 20 (1) with the sensor 34 (ST2 in Fig. 9). Similarly, the processing unit 52 then rotates the rotor 13 indexwise (rotor indexes I3 to I13), and when the suction nozzles 20 (N2 to N12) stop at station S3, the processing unit 52 inspects the suction nozzles 20 (2) to (12) in sequence with the sensor 34.

When the detection result by the sensor 34 is obtained, the judgment unit 55 judges whether the suction nozzle 20 (1) is holding a component P. The second judgment unit 56 judges whether the posture of the held component P is good or bad, and the third judgment unit 57 judges whether to have the camera 35a take an image of the suction nozzle 20 (1) holding the component P (the area near the tip 20a) based on the judgment result by the judgment unit 55 (ST3 in FIG. 9). These judgment processes are performed until the suction nozzle 20 inspected at station S3 stops at station S7. Note that the posture judgment by the second judgment unit 56 may be omitted.

When the processing unit 52 further rotates the rotor 13 by an index, the suction nozzle 20 (1) stops at station S7 (rotor index I6). At this time, if the third judgment unit 57 has determined that the suction nozzle 20 (1) should be imaged by the camera 35a (Yes in ST3 in FIG. 9), the processing unit 52 causes the camera 35a to image the suction nozzle 20 (1) (ST4 in FIG. 9). Similarly, the processing unit 52 rotates the rotor 13 by an index (rotor index I7 to I17), and when the suction nozzles 20 (N2 to N12) that were determined to be imaged by the camera 35a stop at station S7, the camera 35a sequentially images the suction nozzles 20 (2) to (12).

At rotor index I4 in Fig. 10, it is determined that suction nozzle 20(3) cannot be photographed (no component or extremely poor holding posture) (No at ST3 in Fig. 9), and is displayed as "X". Therefore, at rotor index I8, photographing of suction nozzle 20(3) by camera 35a is skipped and it is displayed as "-". In other words, measurement of the electrical characteristics of suction nozzle 20(3) (ST6 in Fig. 9) is skipped.

When the judgment unit 55 obtains an image taken by the camera 35a, which is a detection device, it judges whether or not the suction nozzle 20 is holding a component P. The second judgment unit 56 judges whether or not the posture of the held component P is good based on the image, and the third judgment unit 57 judges whether or not to have the characteristic measuring device 37 measure the electrical characteristics of the held component P (ST5 in FIG. 9). These judgment processes are performed until the suction nozzle 20 inspected at station S7 stops at station S10.

At rotor index I9 in Fig. 10, the processing unit 52 rotates the rotor 13 index and the suction nozzle 20(1) stops at station S10. If the third judgment unit 57 judges that the electrical characteristics of the component P should be measured based on the result of the image captured by the camera 35a (Yes in ST5 in Fig. 9), the processing unit 52 causes the characteristic measuring device 37 to measure the electrical characteristics of the component P held by the suction nozzle 20(1) (ST6 in Fig. 9). At that time, the processing unit 52 moves the rotation mechanism 37b based on the attitude of the component P recognized by the camera 35a to correct the positional deviation of the component P around the Z axis.

Similarly, the processing unit 52 rotates the rotor 13 indexwise, and when the suction nozzles 20 (N2 to N12) stop at station S10 at rotor indexes I10 to I20, the processing unit 52 sequentially causes the characteristic measuring device 37 to measure the electrical characteristics. The measurement results are sent to the control device 50 and stored in the first storage unit 54 as second data 54b.

At rotor index I10 in Figure 10, suction nozzle 20 (5) is judged to have a poor imaging result and is therefore not measurable (poor posture), and is displayed as "X" (No at ST5 in Figure 9). Therefore, at rotor index I16, measurement of the electrical characteristics of suction nozzle 20 (5) is skipped, and is displayed as "-". In other words, like suction nozzle 20 (3), measurement of the electrical characteristics of suction nozzle 20 (5) (ST6 in Figure 9) is also skipped.

When the component suction process is completed for all suction nozzles 20 (N1 to N12), rotor index I0 to rotor index I11 shown in Figure 10 is completed. After this, the mounting head 8 moves above the board 3. When the electrical characteristics of the picked-up component P are measured (ST6 in Figure 9), the first judgment unit 53 judges whether or not the component P held by the suction nozzle 20 should be mounted on the board 3 based on whether the electrical characteristics of the component P are good (ST7 in Figure 9).

That is, the processing unit 52 rotates the rotating body 13 indexwise to stop the suction nozzle 20 (1) holding the component P at station S1, as shown by rotor index I12 in FIG. 10. First, as shown by rotor index I9 in FIG. 10, a case will be described in which the first judgment unit 53 judges that the electrical characteristics of the component P held by the suction nozzle 20 (1) are good and the component P is to be mounted (Yes in ST7 in FIG. 9). In this case, the processing unit 52 executes the component mounting process to mount the component P held by the suction nozzle 20 (1) at a predetermined mounting position on the board 3 (ST8 in FIG. 9). Similarly, the processing unit 52 rotates the rotating body 13 indexwise as shown by rotor indexes I13 to I23 in FIG. 10. Then, when the suction nozzle 20 (N2 to N12) that the first judgment unit 53 judged to mount the component P stops at station S1, the held components P are sequentially mounted on the board 3.

On the other hand, as shown by rotor index I16 in FIG. 10, the first judgment unit 53 judges that the electrical characteristics of the component P held by the suction nozzle 20 (8) are defective (No in ST7 in FIG. 9). In this case, the component mounting process (ST8) is skipped. In this way, just as in the case of the suction nozzle 20 (3) that is judged not to be holding the component P (No in ST3 in FIG. 9) and the case of the suction nozzle 20 (5) that is judged to have a defective holding posture of the component P (No in ST5), the component mounting process (ST8) is also skipped when ST7 is No.

As shown by rotor indexes I12 to I23 in FIG. 10, when the component mounting process is completed for all suction nozzles 20 (N1 to N12) and rotor index I23 is completed, the mounting head 8 moves above the component disposal section T. Then, the processing section 52 executes a component disposal process in which the components P that were not mounted on the board 3 are disposed of in the component disposal section T (ST9 in FIG. 9). In the example of FIG. 10, the components P held by suction nozzles 20 (5) and 20 (8) for which the component mounting process (ST8) was skipped are disposed of in the component disposal process. The same applies when suction nozzle 20 (3) is holding component P. Once component P is disposed of, the mounting head 8 moves above the component supply section 4. This completes one turn of the component mounting process.

The processing unit 52 does not execute the component disposal process if there are no components P that have not been mounted on the board 3. In other words, when the rotor index I23 is completed, the mounting head 8 does not move to the component disposal unit T, but moves to above the component supply unit 4. This completes one turn of the component mounting process.

As described above, the component mounting apparatus 1 has a mounting head 8, a holding member H, and a characteristic measuring device 37. The holding member H is provided on the mounting head 8 and configured to hold the component P. The characteristic measuring device 37 measures the electrical characteristics of the component P held on the holding member H. The characteristic measuring device 37 includes a measuring unit 37c configured to electrically connect with the component P held on the holding member H, and the measuring unit 37c is provided on the mounting head 8. The mounting head 8 is movable within a horizontal plane. The holding member H includes a shaft 17, a nozzle holder 19, and a suction nozzle 20. The characteristic measuring device 37 further includes a measuring unit 37d and a rotating mechanism 37b. This allows the holding of the component P, the mounting of the component P on the board 3, and the measurement of the electrical characteristics of the component P to be performed in parallel, and the electrical characteristics of the component P can be measured without reducing the efficiency of the component mounting work.

In the above description, the judgment unit 55 judges whether or not the component P is held by the suction nozzle 20 using the sensor 34, and then the second judgment unit 56 judges the posture of the component P based on the image captured by the camera 35a. However, the sensor 34 may judge the presence or absence of the component P and also judge the posture of the component P. In that case, the camera 35a is not necessary, and ST4 in FIG. 9 is omitted. Similarly, the sensor 34 may judge the presence or absence of the component P and also judge the posture of the component P based on the image captured by the camera 35a. In that case, the sensor 34 is not necessary, and ST4 is executed instead of ST2 in FIG. 9.

Depending on the structure of the tape supplied by the tape feeder 5, the posture of the component P may be determined to some extent when held by the suction nozzle 20. In such a case, it is not necessary for the second determination unit 56 to determine the posture of the component P. Therefore, ST4 and ST5 in FIG. 9 are omitted, and either the sensor 34 or the camera 35a is not necessary.

Next, referring to Figures 11 to 13, we will explain a multiple head (hereinafter referred to as head) 60, which is another example of a mounting head. As shown in Figure 11, the head 60 has a holding frame 61 that extends in a vertical plane. The head 60 is mounted to the component mounting device 1 by attaching the holding frame 61 to the plate member 9 shown in Figure 1. Hereinafter, the side of the head 60 on which the holding frame 61 is provided will be referred to as the rear side, and the side opposite the holding frame 61 will be referred to as the front side.

The head 60 has multiple nozzle units 62 (here, six horizontally and two rows front to back, for a total of 12) arranged side by side in front of the holding frame 61. Each nozzle unit 62 includes a nozzle lifting drive unit (hereinafter, drive unit) 62a and a shaft member 63 extending downward from the drive unit 62a. A nozzle holder 64 is connected to the lower end of the shaft member 63. A suction nozzle 65 that suctions and holds the component P is removably attached to the nozzle holder 64.

The driving unit 62a has a nozzle lifting mechanism (not shown) that raises and lowers the shaft member 63. By driving the nozzle lifting mechanism, the shaft member 63 is driven up and down, and the multiple suction nozzles 65 attached to the multiple nozzle holders 64 are raised and lowered individually. A θ-axis motor 66 is disposed on the side of the nozzle unit 62 with the drive shaft 66S facing downward. A drive pulley 66a is connected to the drive shaft 66S. In addition, a driven pulley 66b is attached to each of the shaft members 63. A belt 66c is attached between the drive pulley 66a and the driven pulley 66b. Therefore, by driving the θ-axis motor 66, the multiple shaft members 63 rotate around the Z axis together with the suction nozzles 65 attached to the nozzle holders 64. This allows the positioning of the part P held by the suction nozzles 65 around the Z axis.

Like the mounting head 8, which is a rotary type head described above, the head 60 has a characteristic measuring device 67 that measures the electrical characteristics of the component P held by the suction nozzle 65. The characteristic measuring device 67 has a measurement unit arrangement section (hereinafter, arrangement section) 68 and a unit movement section (hereinafter, movement section) 69 arranged at the bottom of the head 60, as well as a characteristic measuring section (hereinafter, measurement section) 70 arranged inside the head 60.

As shown in part (a) of FIG. 12, six measurement openings 68a are provided on the upper surface of the arrangement section 68. The measurement openings 68a are arranged parallel to the axis (X-axis in FIG. 11) along which the six suction nozzles 65 are arranged horizontally, at the same intervals as the suction nozzles 65. As shown in FIG. 13, a measurement unit 71 is installed at the bottom of each of the measurement openings 68a. The measurement unit 71 has an electrode 72 at its upper portion that can be electrically connected to the terminal Pt of the component P. That is, the measurement opening 68a penetrates to the electrode 72, and the electrode 72 is exposed through the measurement opening 68a. A rotation mechanism 71a is arranged below each of the measurement units 71. That is, the arrangement section 68 has six rotation mechanisms 71a arranged at the same intervals as the suction nozzles 65.

As shown in Fig. 11, the moving unit 69 moves the arrangement unit 68 back and forth. The measuring unit 70 has a function similar to that of the measuring unit 37d of the mounting head 8 shown in Fig. 4, and is electrically connected to an electrode 72 of the measuring unit 71 shown in Figs. 12 and 13 via a cable, a selector switch, etc. (not shown).

The rotation mechanism 71a shown in FIG. 13 has a motor that can rotate the measurement unit 71 (electrode 72) around the Z axis. When measuring the electrical characteristics of the component P, the rotation mechanism 71a independently adjusts the positional deviation of the component P held by the multiple suction nozzles 65 and the electrode 72 around the Z axis without rotating the suction nozzle 65 around the Z axis. Note that if each nozzle unit 62 can rotate the shaft member 63 around the Z axis, the rotation mechanism 71a may be omitted. In this example, the anisotropic conductive sheet 41 is not arranged on the upper surface of the electrode 72, but the anisotropic conductive sheet 41 may be arranged on the upper surface of the electrode 72 of the measurement unit 71, as in the measurement unit 37c shown in FIG. 6.

Next, the measurement of the electrical characteristics of the component P in the head 60 will be described with reference to Figures 12 and 13. As shown in (a) of Figure 12 and (a) of Figure 13, with the arrangement section 68 positioned at the rear retreat position K0 where it does not interfere with the descending suction nozzle 65, each suction nozzle 65 picks up the component P from the tape feeder 5. Next, the head 60 moves onto a component recognition camera (not shown) arranged on the upper surface of the base 1a of the component mounting device 1 shown in Figure 1 or on the feeder table 4a. Then, this component recognition camera photographs the component P held by each of the suction nozzles 65 from below. From the photographed image, the presence or absence of the component P, the holding posture, etc. are recognized.

Next, while the head 60 moves above the mounting position of the board 3, the electrical characteristics of the component P held by the head 60 are measured. When measuring the electrical characteristics of the component P, first, the moving unit 69 shown in FIG. 11 moves the arrangement unit 68 below the suction nozzles 65 in the rear row, as shown by the arrow h1 in part (b) of FIG. 12 and the arrow i1 in part (b) of FIG. 13. This positions the suction nozzles 65 in the rear row above the measurement openings 68a of the measurement units 71. Then, based on the holding posture of the component P recognized by the component recognition camera, the rotation mechanisms 71a are each driven to correct the positional deviation of each component P around the Z axis.

Next, the nozzle lifting mechanism of the rear row drive unit 62a is driven, and the rear row suction nozzle 65 is lowered as shown by arrow i2 in part (b) of Figure 13, and the component P is electrically connected to the electrode 72. In this state, the measurement unit 70 measures the electrical characteristics of each component P. In this manner, the position where the rear row suction nozzle 65 is above the measurement opening 68a is the rear row measurement position K1 (measurement position). In addition, the nozzle lifting mechanism of the rear row drive unit 62a functions as a measurement position lifting device that lifts and lowers the holding member J at the rear row measurement position K1.

Next, after the rear row suction nozzle 65 is raised to its original height, the arrangement unit 68 moves below the front row suction nozzle 65 as shown by the arrow h2 in part (c) of FIG. 12 and the arrow i3 in part (c) of FIG. 13. Next, as shown by the arrow i4 in part (c) of FIG. 13, the front row suction nozzle 65 descends and the component P is electrically connected to the electrode 72. In this state, the measurement unit 70 measures the electrical characteristics of each component P. In this way, the position where the front row suction nozzle 65 is above the measurement opening 68a is the front row measurement position K2 (measurement position). In addition, the nozzle lifting mechanism of the front row drive unit 62a functions as a measurement position lifting device that lifts and lowers the holding member J at the front row measurement position K2.

Then, the front row of suction nozzles 65 rises to its original height, the arrangement section 68 moves to the retracted position K0, and the series of measurements of the electrical characteristics of components P by the head 60 is completed. After that, components P whose electrical characteristics are within the standard values are mounted at their prescribed mounting positions on the board 3. Note that if a component P is not held, or if the holding posture of the component P is poor, the measurement of the electrical characteristics is skipped and the component P is not mounted on the board 3. Components P that are not mounted on the board 3 are discarded in the component disposal section T. Note that this series of operations is executed under the control of a control device (not shown).

In this way, the shaft member 63, nozzle holder 64, and suction nozzle 65 of the head 60 constitute a holding member J capable of holding a component P. Furthermore, the moving section 69, measuring section 70, and measuring unit 71 and rotation mechanism 71a of the arrangement section 68 constitute a characteristic measuring device 67 that measures the electrical characteristics of the component P held by the holding member J. In the head 60, the measuring unit 71 moves back and forth with respect to the holding member J. That is, the multiple holding members J are movable relative to the measuring unit 71 of the characteristic measuring device 67.

After the component recognition camera photographs the component P, the head 60 measures the electrical characteristics of the component P while the head 60 moves above the board 3. This makes it possible to measure the electrical characteristics of the component P without reducing the efficiency of the component mounting work. In the above, the measurement unit 70 is provided in the head 60, but this is not limited thereto, and the measurement unit 70 may be provided inside or outside the component mounting device 1 while being connected to the measurement unit 71 via a network.

In the above embodiment, an example has been described in which all of the elements constituting the component mounting system are provided within the component mounting device 1, but the component mounting system is not limited to this. For example, some of the elements constituting the component mounting system may be configured as devices different from the component mounting device 1, and the component mounting system may be configured as a whole.

In addition, in the above embodiment, a mounting head having multiple suction nozzles has been described as an example, but a measurement unit may also be provided on a mounting head having only one suction nozzle. Even in this case, it is possible to measure the electrical characteristics of the held component while the mounting head is moving. This makes it possible to measure the electrical characteristics of the component without reducing the efficiency of the component mounting work.

The component mounting system and mounting head disclosed herein, as well as the component mounting method in the component mounting system, make it possible to measure the electrical characteristics of components without reducing the efficiency of component mounting work. This makes them useful in fields where components are mounted on substrates.

REFERENCE SIGNS LIST 1 Component mounting device 1a Base 2 Transport mechanism 3 Substrate 4 Component supply unit 4a Feeder table 5 Tape feeder 6 Y-axis table 7 Beam 8 Mounting head 8a Cover 9 Plate member 10 Holding frame 11 Movement mechanism 12 Rotor holding unit 12a Bearing 13 Rotor 13a Mounting hole 13b Common flow path 14 Rotor driven gear 15 Index drive motor (first motor)
Reference Signs List 15a Index drive gear 16 Through hole 16a Gap 17 Shaft 17a Shaft inner hole 17b Opening 18 Bearing 19 Nozzle holder 19a Vent 20, 65 Suction nozzle 20a Tip 20b Nozzle flow path 21 Cam follower 21a Mounting fixture 22 Cam holding portion 23 Cylindrical cam 23a Groove 24 Elastic body 25 Holding and lifting mechanism 25a, 36a Screw shaft 25b Holding and lifting motor (second motor)
25c Nut 25d, 36c Cam follower holder (holder)
26: Cylindrical member 26a: Tip portion 26b: Bearing 26c: Cylindrical member inner hole 27: θ rotation driven gear 28: θ rotation motor (third motor)
28a θ rotary drive gear 29 Nozzle drive gear 30 Nozzle rotary gear 31 Pipe 32 Negative pressure generating source 33 Valve 34 Sensor 35a Camera 35b Mirror 36 Measurement lift mechanism 36b Measurement lift motor (fourth motor)
37, 67 characteristic measuring device 37a arm member 37b, 71a rotation mechanism 37c, 71 measuring unit 37d, 70 characteristic measuring section (measuring section)
38, 72 Electrode 40 Upper cover 40a, 68a Measurement opening 41 Anisotropic conductive sheet 42 Measurement substrate 50 Control device 51 Touch panel 52 Processing unit 53 First judgment unit 54 First memory unit 54a First data 54b Second data 55 Determination unit 56 Second judgment unit 57 Third judgment unit 58 Second memory unit 58a Third data 60 Multiple head (head)
61: Holding frame 62: Nozzle unit 62a: Nozzle lifting drive unit (drive unit)
63 Shaft member 64 Nozzle holder 66 θ-axis motor 66a Drive pulley 66b Driven pulley 66c Belt 66S Drive shaft 68 Measurement unit arrangement section (arrangement section)
69 Unit Moving Section (Moving Section)
H, J Holding member P Part T Part disposal section

Claims (18)

a mounting head including a holding member configured to hold a component , a lifting device capable of moving the holding member from a first height to a second height, and a rotating body that rotates while holding the holding member;
a characteristic measuring device that measures electrical characteristics of the component held by the holding member,
the characteristic measuring device includes a measuring unit configured to be electrically connected to the component held by the holding member;
the measurement unit is provided on the mounting head ,
the lifting device moves the holding member from the first height when the holding member rotates around the rotating body to the second height, which is closer to the measurement unit than the first height, in a state in which the holding member is positioned so as to face the measurement unit.
Component mounting system. the characteristic measuring device measures electrical characteristics of the component held by the holding member while the mounting head is moving;
The component mounting system according to claim 1 . the holding member is one of a plurality of holding members held by the rotating body ,
Each of the plurality of holding members is movable relative to the measurement unit in association with rotation of the rotating body .
The component mounting system according to claim 1 . a measurement position capable of being electrically connected to the measurement unit and a holding position capable of holding the part by the holding member are provided at different positions on an orbit along which the holding member moves as the rotating body rotates .
The component mounting system according to claim 1 . The measuring apparatus further includes a holding position lifting device that lifts and lowers the holding member at the holding position , and a measurement position lifting device that lifts and lowers the holding member at the measurement position.
The component mounting system according to claim 4 . the characteristic measuring device further includes a characteristic measuring unit that measures an electrical characteristic of the component electrically connected to the measuring unit,
The characteristic measuring unit is provided in the mounting head,
The component mounting system according to claim 1 . a detection device provided in the mounting head and configured to detect the presence or absence of the component held by the holding member as a state of the component ;
The component mounting system according to claim 1 . the detection device detects the presence or absence of the component before the characteristic measuring device measures the electrical characteristic of the component.
The component mounting system according to claim 7 . a measurement feasibility determination device that determines whether or not to measure the electrical characteristics of the component held by the holding member using the measurement unit, based on information regarding the presence or absence of the component obtained by the detection device.
The component mounting system according to claim 7 or 8 . The detection device further detects a posture of the component held by the holding member,
the measurement feasibility determination device further determines whether or not to measure an electrical characteristic of the component held by the holding member using the measurement unit, based on information regarding the posture of the component obtained by the detection device.
The component mounting system according to claim 9 . a second detection device provided on the mounting head for detecting a posture of the component held by the holding member,
the measurement feasibility determination device further determines whether or not to measure an electrical characteristic of the component held by the holding member using the measurement unit, based on information regarding the posture of the component obtained by the second detection device.
The component mounting system according to claim 9 . a detection device provided on the mounting head for detecting a posture of the component held by the holding member as a state of the component ,
The component mounting system according to claim 1 . the detection device detects the posture of the component before the characteristic measuring device measures the electrical characteristic of the component.
The component mounting system according to claim 12 . The present invention further includes a measurement feasibility determination device that determines whether or not to measure electrical characteristics of the component held by the holding member using the measurement unit, based on information regarding the posture of the component obtained by the detection device.
The component mounting system according to claim 12 or 13 . a detection position where the detection device detects the state of the component is provided on the orbit along which the holding member moves in association with the rotation of the rotating body , between a holding position where the holding member can hold the component and a measurement position where the holding member can be electrically connected to the measurement unit;
The holding position, the detection position, and the measurement position are arranged in this order along a direction in which the holding member moves .
The component mounting system according to any one of claims 7 to 14 . further comprising a rotation mechanism configured to rotate the measurement unit.
The component mounting system according to claim 1 . a holding member configured to hold the component;
a lifting device capable of moving the holding member from a first height to a second height;
a rotating body that rotates while holding the holding member;
a measurement unit configured to electrically connect to the component held by the holding member ;
the lifting device moves the holding member from the first height at which the holding member rotates around the rotating body to the second height, which is closer to the measurement unit than the first height, in a state in which the holding member is positioned to face the measurement unit .
Mounting head. A component mounting method in a component mounting system, comprising:
The component mounting system includes :
a mounting head including a holding member configured to hold a component , a lifting device capable of moving the holding member from a first height to a second height, and a rotating body that rotates while holding the holding member;
a characteristic measuring device that measures electrical characteristics of the component held by the holding member,
the characteristic measuring device includes a measuring unit configured to be electrically connected to the component held by the holding member;
the measurement unit is provided on the mounting head,
The component mounting method includes:
causing the holding member to hold the component;
a step of moving the holding member located at the first height by rotating the rotating body, and positioning the holding member so as to face the measurement unit;
and moving the holding member from the first height to the second height by the lifting device, and connecting the part held by the holding member to the measurement unit.
Component mounting method.

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