WO2021100304A1 - Component mounting system and mounting head, and component mounting method - Google Patents

Abstract

This component mounting system includes: a mounting head; a holding member; and characteristic measuring device. The holding member is provided to the mounting head and is configured to hold a component. The characteristic measuring device measures the electrical characteristics of the component held by the holding member. The characteristic measuring device includes a measuring unit configured so as to be electrically connected to the component held by the holding member. The measuring unit is disposed on the mounting head.

Description

Component mounting system, mounting head, and component mounting method

This disclosure relates to a component mounting system for mounting components on a board, a mounting head for mounting components on a board, and a component mounting method in a component mounting system.

The component mounting device mounts electronic components (hereinafter referred to as components) on the board. Conventionally, a component mounting device having a function of measuring the electrical characteristics of a component before mounting the component on a substrate has been known for the purpose of preventing erroneous mounting of the component and managing traceability. The electrical characteristics are, for example, inductance, capacitance, and resistance (for example, Patent Document 1). The component mounting device described in Patent Document 1 has a characteristic measuring device between a component supply unit that supplies components and a substrate on which components are mounted, and in a transfer area in which the mounting head moves. Then, the characteristic measuring device measures the parts picked up by the mounting head from the parts supply unit, and the parts whose measurement result is out of the predetermined range are excluded from the mounting target. In this way, mismounting of parts is avoided.

Japanese Unexamined Patent Publication No. 2011-159964

The component mounting system of the present disclosure includes a mounting head, a holding member, and a characteristic measuring device. The holding member is provided on the mounting head and is configured to hold the component. The characteristic measuring device measures the electrical characteristics of the parts held by the holding member. The characteristic measuring device includes a measuring unit configured to be electrically connected to a component held by the holding member, and the measuring unit is provided on the mounting head.

The mounting head of the present disclosure includes a holding member configured to hold a component and a measuring unit configured to electrically connect to the component held by the holding member.

The component mounting method of the present disclosure is the component mounting method in the above-mentioned component mounting system. In this component mounting method, the holding member holds the component, and the component held by the holding member is connected to the measuring unit.

According to the present disclosure, it is possible to measure the electrical characteristics of a component without reducing the efficiency of the component mounting work.

Perspective view of the component mounting device which is the component mounting system according to the embodiment of the present disclosure. Configuration diagram of the mounting head included in the component mounting device shown in FIG. Partial sectional view of the mounting head shown in FIG. A view of the mounting head shown in FIG. 2 as viewed from the opposite side surface. Schematic diagram illustrating the configuration of the mounting head shown in FIG. A perspective view of a measurement unit provided in the mounting head shown in FIG. 2 and included in the characteristic measurement device. An exploded perspective view of the measuring unit shown in FIG. 6A. The figure which shows the state of measuring the electrical characteristic of a component by the mounting head which concerns on embodiment of this disclosure. Following FIG. 7A, a diagram showing how the mounting head measures the electrical characteristics of the component. A functional block diagram showing a configuration of a control system of a component mounting device according to an embodiment of the present disclosure. Flow chart of the component mounting method in the component mounting device according to the embodiment of the present disclosure. A process explanatory view of a component mounting method in the component mounting device according to the embodiment of the present disclosure. Perspective view of another mounting head according to the embodiment of the present disclosure. Top view for explaining the process of measuring the electrical characteristics of parts by the mounting head shown in FIG. Side view for explaining the process of measuring the electrical characteristics of a component by the mounting head shown in FIG.

Prior to the explanation of the embodiment of the present disclosure, the background to the idea of the present disclosure will be briefly explained. In the prior art including Patent Document 1, in order to measure the electrical characteristics of a component, it is necessary to move the mounting head to the upper part of the characteristic measuring device in the transfer area and stop it for a certain period of time. Therefore, the work efficiency of the component mounting work is low.

The present disclosure provides a component mounting system, a mounting head, and a component mounting method in a component mounting system that can measure the electrical characteristics of a component without reducing the efficiency of the component mounting work.

The embodiments of the present disclosure will be described in detail with reference to the drawings below. The configurations, shapes, and the like described below are examples for explanation, and can be appropriately changed according to the specifications of the component mounting system and the component mounting device. In the following, the corresponding elements are designated by the same reference numerals in all the drawings, and duplicate description will be omitted. Of the two axes orthogonal to each other in the horizontal plane, the axis parallel to the substrate transport direction (the axis perpendicular to the paper surface in FIG. 2) is the X axis, and the axis orthogonal to the substrate transport direction (extends from left to right in FIG. 2). Axis) is the Y axis. The axis orthogonal to the horizontal plane (the axis extending from the bottom to the top in FIG. 2) is defined as the Z axis. The Z-axis is an axis that extends from bottom to top when the component mounting device is installed on a horizontal plane.

First, the structure of the component mounting device 1 which is a component mounting system will be described with reference to FIG. The component mounting device 1 mounts components on a substrate. At the center of the base 1a, a transport mechanism 2 having a pair of conveyors extending along the X axis is arranged. The transport mechanism 2 receives the board 3 to be mounted on the component from the upstream device, and positions and holds the board 3 at the mounting work position by the component mounting mechanism described below.

Parts supply units 4 are arranged on both sides of the transport mechanism 2. The component supply unit 4 has a feeder table 4a and a plurality of tape feeders 5 arranged side by side on the feeder table 4a. Each of the tape feeders 5 supplies the components to the take-out position by the mounting head 8 by pitch-feeding the carrier tape containing the components mounted on the substrate 3. Further, a component disposal unit T is installed on the upper surface of the base 1a or on one of the feeder tables 4a. In FIG. 1, as an example, the parts disposal unit T is installed on the feeder table 4a on the front side (Y-axis minus side). Parts that are taken out from the tape feeder 5 by the mounting head 8 but are not mounted on the substrate 3 due to poor electrical characteristics or the like are discarded in the component disposal section T.

Next, the component mounting mechanism will be described. At the end of the base 1a on the X-axis, a Y-axis table 6 having a linear drive mechanism is arranged so as to extend along the Y-axis. A beam 7 having a linear drive mechanism is mounted on the Y-axis table 6 so as to be movable along the Y-axis. The beam 7 is arranged so as to extend along the X axis. A plate member 9 is movably mounted on the beam 7 along the X-axis, and a mounting head 8 is mounted on the plate member 9 via a holding frame 10.

The mounting head 8 picks up and holds the components mounted on the board 3 from the component supply unit 4. By driving the Y-axis table 6 and the beam 7, the mounting head 8 moves horizontally along the X-axis and the Y-axis, and mounts the parts to be held on the substrate 3 positioned by the transport mechanism 2. That is, the mounting head 8 constitutes a component mounting mechanism. The Y-axis table 6 and the beam 7 form a moving mechanism 11 for moving the mounting head 8 in a horizontal plane.

Next, the configuration of the mounting head 8 will be described with reference to FIGS. 2 to 5. The mounting head 8 is a rotary type head. FIG. 2 is a side view of the mounting head 8. FIG. 3 is a partial cross-sectional view of the mounting head 8. FIG. 4 is a view of the mounting head 8 as viewed from the side surface opposite to that of FIG. FIG. 5 is a schematic view of the mounting head 8 as viewed from below. As shown in FIG. 2, the side surface and the upper surface of the mounting head 8 are covered with the holding frame 10 and the cover 8a fixed to the holding frame 10. A rotor holding portion 12 is provided at the lower part of the holding frame 10 so as to extend horizontally. As shown in FIG. 3, a cylindrical rotating body 13 which is a rotor is rotatably held in the rotor holding portion 12 via a bearing 12a with the rotating shaft CL along the Z axis as an axis. As shown in FIG. 2, a rotating body driven gear 14 centered on the rotating shaft CL is provided on the upper surface of the rotating body 13.

An index drive motor (hereinafter, first motor) 15 is arranged above the rotor holding portion 12. An index drive gear 15a that meshes with the driven gear 14 of the rotating body is mounted on the rotating shaft of the first motor 15. As shown by the arrow a, the rotating body driven gear 14 is index-rotated via the index drive gear 15a by driving the first motor 15. As a result, the rotating body 13 also undergoes index rotation together with the rotating body driven gear 14. That is, the rotating body 13 rotates intermittently.

As shown in FIG. 3, a plurality of (12 in this case) through holes 16 that vertically penetrate the rotating body 13 are provided at positions on the circumference centered on the rotation axis CL. A cylindrical shaft 17 is inserted into each of the through holes 16 so as to be vertically movable with respect to the rotating body 13.

Bearings 18 that guide the shaft 17 up and down are arranged at two positions apart from each other above and below the gap 16a between the rotating body 13 and the shaft 17 in each of the through holes 16. Nozzle holders 19 are provided below each of the shafts 17, and suction nozzles 20 are detachably attached to the nozzle holders 19. That is, the mounting head 8 has a plurality of (12 in this case) suction nozzles 20. A substantially L-shaped attachment 21a is attached to the upper end of the shaft 17. The cam follower 21 is attached to the attachment 21a toward the outside with a rotation axis extending horizontally as an axis.

As shown in FIG. 2, a cam holding portion 22 for fixing the cylindrical cam 23 extends horizontally from the upper part of the holding frame 10. A groove 23a is provided on the outer peripheral surface of the cylindrical cam 23. The groove 23a is provided so as to be high on the opposite side of the holding frame 10 and gradually lowered as it approaches the holding frame 10. The cam followers 21 attached to each of the shafts 17 are attached to the cylindrical cam 23 so as to be able to move along the groove 23a.

A force for pulling upward is applied to each of the shafts 17 by an elastic body 24 such as a spring provided above the rotating body 13. When the rotating body 13 rotates by index, the cam follower 21 attached to the shaft 17 moves up and down along the groove 23a of the cylindrical cam 23. The shaft 17 moves up and down as the cam follower 21 moves up and down while orbiting horizontally following the index rotation of the rotating body 13. A part of the cylindrical cam 23 is cut off at the position where the groove 23a is the lowest, and the groove 23a is interrupted at the cut-off point.

A holding elevating mechanism 25 is arranged between the holding frame 10 and the cylindrical cam 23. The holding / lifting mechanism 25 includes a screw shaft 25a, a holding / lifting motor (hereinafter referred to as a second motor) 25b, and a nut 25c. The screw shaft 25a extends along the Z axis. The second motor 25b rotates the screw shaft 25a. The nut 25c is screwed onto the screw shaft 25a. The nut 25c is provided with a cam follower holder (hereinafter, holder) 25d that can move up and down along the cut portion of the cylindrical cam 23. The holder 25d moves up and down together with the nut 25c by driving the second motor 25b. The holder 25d has a shape that complements the groove 23a that is interrupted at the cut portion. Therefore, the cam follower 21 that moves along the groove 23a can smoothly transfer to the holder 25d.

The cam follower 21 that has moved along the groove 23a is removed from the groove 23a at the excision point, and is transferred to and held by the holder 25d that stands by at the same height position as the groove 23a. When the second motor 25b is driven in this state, the shaft 17 and the suction nozzle 20 move downward with respect to the rotating body 13 together with the cam follower 21, and then move upward, as shown by the arrow b. The holding / elevating mechanism 25 is not limited to the above structure, and may be a structure using a linear motor or a structure using an air cylinder as long as the shaft 17 is moved up and down.

As described above, the position of the shaft 17 in which the holder 25d holds the cam follower 21 is the station S1 that moves up after the shaft 17 moves down. As shown in FIG. 5, the positions of the 12 points where the rotating body 13 rotates by index rotation (rotating by 30 degrees in this case) and stops are set in the clockwise direction from the station S1 to the station Sn (n = 1, 2, ... , 12).

That is, as shown by the arrow e, the 12 suction nozzles 20 mounted on the lower part of the shaft 17 inserted into the rotating body 13 change from the station Sn to the adjacent station Sn + 1 each time the rotating body 13 rotates by index. After moving, it returns to station S1 after station S12. In this way, when the rotating body 13 rotates by index, the 12 shafts 17 and the suction nozzle 20 revolve around the rotation axis CL. Hereinafter, the trajectory through which the shaft 17 and the suction nozzle 20 pass as the rotating body 13 rotates is referred to as a “circular trajectory”.

As shown in FIG. 3, a mounting hole 13a centered on the rotating shaft CL is provided on the upper surface of the rotating body 13. The cylindrical member 26 penetrates the cylindrical cam 23 up and down. The tip portion 26a of the cylindrical member 26 is fitted into the mounting hole 13a via the bearing 26b. Therefore, the cylindrical member 26 is rotatably arranged with respect to the rotating body 13.

A θ-rotation driven gear 27 centered on the rotation shaft CL is provided near the upper end of the cylindrical member 26. A θ-rotating motor (hereinafter referred to as a third motor) 28 is arranged above the cylindrical cam 23. The θ rotation drive gear 28a is mounted on the third motor 28. The θ-rotation drive gear 28a meshes with the θ-rotation driven gear 27. The θ-rotation driven gear 27 is driven by the third motor 28 and rotates around the Z-axis via the θ-rotation drive gear 28a. As a result, the cylindrical member 26 rotates about the Z axis together with the θ rotation driven gear 27 as shown by the arrow c.

A nozzle drive gear 29 extending vertically and vertically corresponding to the elevating stroke of the shaft 17 is fixed between the rotating body 13 and the cylindrical cam 23 of the cylindrical member 26. A nozzle rotation gear 30 is fixed to each of the shafts 17 at a position where it meshes with the nozzle drive gear 29. When the third motor 28 rotates, the cylindrical member 26 rotates about the Z axis as described above. By this rotation, the nozzle drive gear 29 also rotates around the Z axis. When the nozzle drive gear 29 rotates, each of the shafts 17 rotates all at once around the Z axis via the nozzle rotation gear 30, as shown by the arrow d. The mechanism for rotating the shaft 17 around the Z axis is not limited to the configuration including the θ rotation driven gear 27, the θ rotation drive gear 28a, and the nozzle drive gear 29. For example, each of the nozzle rotation gears 30 may be provided with a nozzle drive gear that independently rotates around the Z-axis, and each of the shafts 17 may be independently rotated around the Z-axis.

Next, the air flow path of the mounting head 8 will be described with reference to FIG. Inside each of the shafts 17, a shaft inner hole 17a is provided. The lower end of the shaft inner hole 17a communicates with the suction nozzle 20. The shaft inner hole 17a communicates with the nozzle flow path 20b provided in the suction nozzle 20 via the ventilation hole 19a provided in the nozzle holder 19. The nozzle flow path 20b is open to the tip 20a of the suction nozzle 20. Above the shaft inner hole 17a, an opening 17b is provided that opens on the outer peripheral surface of the shaft 17 at a position sandwiched between the upper and lower bearings 18 and communicates with the gap 16a. The opening 17b is located within the range of the gap 16a sandwiched between the two upper and lower bearings 18 even if the shaft 17 moves up and down.

As described above, a mounting hole 13a is provided in the center of the upper part of the rotating body 13. Inside the rotating body 13, a common flow path 13b opened at the bottom surface of the mounting hole 13a is provided in the vertical direction along the rotating shaft CL. The common flow path 13b communicates with a cylindrical member inner hole 26c provided inside the cylindrical member 26 that fits into the mounting hole 13a. The cylindrical member inner hole 26c communicates with the negative pressure generation source 32 via a pipe 31 connected to the upper end portion of the cylindrical member 26. The common flow path 13b communicates with the gap portion 16a via a valve 33 provided corresponding to each of the through holes 16.

When the valve 33 is opened with the negative pressure generation source 32 operated, negative pressure is applied to the tip 20a of the suction nozzle 20 through the gap 16a to which the valve 33 is connected. In this state, the suction nozzle 20 can suck and hold the component P on the tip 20a. When the valve 33 is closed while the suction nozzle 20 holds the component P shown in FIG. 2, the path to the negative pressure generation source 32 is closed and the component P is separated from the suction nozzle 20.

As described above, the shaft 17, the nozzle holder 19, and the suction nozzle 20 are holding members H provided on the mounting head 8 and capable of holding the component P. The rotating body 13 holds a plurality of holding members H in the circumferential direction. In the mounting head 8, the plurality of holding members H orbit around the orbit as the rotating body 13 rotates. That is, the mounting head 8 includes a rotating body 13 that rotatably holds a plurality of holding members H along the orbit. Further, on the orbit around the holding member H, the station S1 is a holding position where the part P can be held by the holding member H. The holding / elevating mechanism 25 is provided on the mounting head 8 and functions as a holding / elevating device that elevates / elevates the holding member H at the holding position (station S1).

As shown in FIG. 2, the rotor holding portion 12 is provided with a sensor 34 such as a two-dimensional laser sensor. The sensor 34 detects from the side surface the periphery including the tip 20a of the suction nozzle 20 which is index-rotated and stopped at the station S3. That is, the sensor 34 detects the presence / absence of the component P at the tip 20a of the suction nozzle 20 stopped at the station S3. Further, by comparing the thickness of the component P detected by the sensor 34 with a predetermined thickness, the posture of the adsorbed component P can be determined. That is, when the thickness of the component P detected by the sensor 34 is thicker than a predetermined value, the component P sucked by the suction nozzle 20 is tilted or vertically oriented, and a suction error having a poor posture occurs. Is determined. The sensor 34 is not limited to this, and may have a structure using a camera or the like as long as it detects the presence or absence of the component P.

As shown in FIG. 4, the rotor holding unit 12 is provided with a component recognition unit 35. The component recognition unit 35 includes a camera 35a. The camera 35a takes an image of the component P held by the suction nozzle 20 which is index-rotated and stopped at the station S7 from below. The component recognition unit 35 includes mirrors 35b arranged below the station S7 and below the camera 35a, respectively, and the light from the component P held by the suction nozzle 20 stopped at the station S7 is transmitted by the mirror 35b to the camera 35a. Guided to.

By recognizing the image of the component P taken by the camera 35a, the posture such as the presence / absence of the component P and the displacement of the suction position is recognized. When mounting the component P on the substrate 3, the rotation position of the shaft 17 on the mounting head 8 and the mounting positions on the X-axis and Y-axis by the component mounting mechanism are corrected in consideration of the shooting result of the component P by the component recognition unit 35. Will be done.

A measurement elevating mechanism 36 is arranged above the station S10. The measurement elevating mechanism 36 moves the shaft 17 stopped at the station S10 and the suction nozzle 20 mounted on the shaft 17 downward and then upward, similarly to the holding elevating mechanism 25 of the station S1. The lower side of the cylindrical cam 23 is cut off from the groove 23a at the position of the station S10.

The measurement elevating mechanism 36 includes a screw shaft 36a extending along the Z axis, a measurement elevating motor (hereinafter referred to as a fourth motor) 36b for rotationally driving the screw shaft 36a, and a nut screwed onto the screw shaft 36a (not shown). Includes. The nut screwed to the screw shaft 36a is provided with a cam follower holder (hereinafter, holder) 36c that can move up and down along the cut portion of the cylindrical cam 23. The cam follower 21 that has moved along the groove 23a is transferred to and held by the holder 36c at this position. When the fourth motor 36b is driven in this state, the shaft 17 and the suction nozzle 20 move downward together with the cam follower 21 and then move upward as shown by the arrow f.

Below the suction nozzle 20 that stops at the station S10, a measurement unit 37c having an electrode that can be electrically connected to the terminal of the component P is installed. The measuring unit 37c is installed above the rotation mechanism 37b. The rotation mechanism 37b is provided at the lower end of the arm member 37a extending downward from the rotor holding portion 12. FIG. 6A is a perspective view of the measuring unit 37c, and FIG. 6B is an exploded perspective view of the measuring unit 37c. The electrode 38 included in the measurement unit 37c shown in FIG. 6B is electrically connected to the characteristic measurement unit (hereinafter, measurement unit) 37d installed in the mounting head 8 shown in FIG. 4 via a cable or the like (not shown). ..

The rotation mechanism 37b has a motor or the like capable of rotating the measurement unit 37c (electrode 38) around the Z axis. The rotation mechanism 37b adjusts the misalignment of the component P held by the suction nozzle 20 and the electrode 38 around the Z axis without rotating the suction nozzle 20 around the Z axis when measuring the electrical characteristics of the component P. .. In the above, the mounting head 8 is provided with the rotating mechanism 37b, but the mounting head 8 is not provided with the rotating mechanism 37b. For example, when measuring the electrical characteristics of the component P, the suction nozzle 20 is set to the Z axis. You may rotate it around.

Here, the configuration of the measurement unit 37c will be described with reference to FIGS. 6A and 6B. The measuring unit 37c has an upper cover 40, an anisotropic conductive sheet 41, and a measuring substrate 42. The function of the anisotropic conductive sheet 41 will be described later. As shown in FIGS. 7A and 7B, the component P has a terminal Pt. As shown in FIG. 6B, a plurality of (here, two) electrodes 38 that are electrically connected to the terminal Pt of the component P are provided on the upper surface of the measurement substrate 42. The upper cover 40 is mounted on the measurement substrate 42 from above with the anisotropic conductive sheet 41 placed so as to cover the upper surfaces of the plurality of electrodes 38. A measurement opening 40a penetrating vertically is provided at a position corresponding to the plurality of electrodes 38 of the upper cover 40.

Next, with reference to FIGS. 7A and 7B, a method of measuring the electrical characteristics of the component P using the measuring unit 37c and the function of the anisotropic conductive sheet 41 will be described. FIG. 7A shows a state in which the suction nozzle 20 holding the component P is stopped at the station S10. In this state, the component P is located above the measurement opening 40a formed in the upper cover 40. As shown in FIG. 7B, when measuring the electrical characteristics of the component P, the control device 50, which will be described later with reference to FIG. 8, drives the fourth motor 36b of the measurement elevating mechanism 36. Then, as shown by the arrow g, the suction nozzle 20 is lowered to bring the component P into contact with the upper surface of the anisotropic conductive sheet 41. In this state, the component P is at a position where the two terminals Pt face the two electrodes 38 with the anisotropic conductive sheet 41 interposed therebetween.

The anisotropic conductive sheet 41 has a characteristic that when pressure is applied, the conductivity in the pressure direction becomes high and the conductivity other than the pressure direction is kept low. When no pressure is applied to the anisotropic conductive sheet 41 (for example, in the state of FIG. 7A), the conductivity of the anisotropic conductive sheet 41 is low in all directions. As shown in FIG. 7B, when the suction nozzle 20 is lowered to push the component P into the anisotropic conductive sheet 41, a pressure toward the electrode 38 is applied to the anisotropic conductive sheet 41.

Due to this pressure, in the anisotropic conductive sheet 41, the resistance R of the portion sandwiched between the opposite terminal Pt and the electrode 38 becomes small (the conductivity becomes high), and the terminal Pt of the component P becomes the electrode 38. It will be electrically connected. In this state, the electrical characteristics of the component P are measured by the measuring unit 37d. Even in this state, the portion between the electrodes 38 of the anisotropic conductive sheet 41 remains high resistance (low conductivity) and does not affect the measurement of the electrical characteristics of the component P. By inserting the anisotropic conductive sheet 41 between the component P and the electrode 38 in this way, the terminal Pt of the component P and the electrode 38 can be electrically and stably connected even if the shape of the component P varies. It is possible to reduce the variation in the measurement result of the electrical characteristics.

In the measurement unit 37c described above, the terminal Pt of the component P and the electrode 38 are electrically connected via the anisotropic conductive sheet 41, but the measurement unit 37c is not limited to this configuration. Absent. For example, the measuring unit 37c may have a structure in which the terminal Pt of the component P is directly contacted (connected) to the electrode 38. Further, the electrode 38 may be formed of a pin having a sharp upper end, and the terminal Pt of the component P may be brought into contact with (connect) to this pin. Further, the measuring unit 37c may have a configuration in which it is electrically connected without being in contact with the terminals of the parts.

As described above, the station S10 is on the orbit around the holding member H, and is a measurement position capable of measuring the electrical characteristics of the component P held by the holding member H. The station S10 is provided at a position different from the holding position (station S1) on the orbit of the holding member H. That is, the mounting head 8 has a rotating body 13 that holds a plurality of holding members H in the circumferential direction, and a first motor 15 that can rotate the rotating body 13. The plurality of holding members H can move relative to the holding position and the measuring position as the rotating body 13 rotates. That is, each of the holding members H is movable relative to the measuring unit 37c. Further, the measurement elevating mechanism 36 is provided on the mounting head 8 and functions as a measurement position elevating device for elevating and lowering the holding member H at the measurement position (station S10).

Next, the configuration of the control system of the component mounting device 1 will be described with reference to FIG. The component mounting device 1 has a control device 50. A transport mechanism 2, a tape feeder 5, a mounting head 8, a moving mechanism 11, a touch panel 51, and the like are connected to the control device 50. The touch panel 51 has a display unit that displays various types of information. Further, the touch panel 51 has an input unit in which an operator inputs data or operates the component mounting device 1 by using an operation button or the like displayed on the display unit. Instead of the touch panel 51, an input device such as a keyboard and a display device such as a display may be provided. The control device 50 includes a mounting operation processing unit (hereinafter, processing unit) 52, a mounting possibility determination unit (hereinafter, first determination unit) 53, and a device storage unit (hereinafter, first storage unit) 54. The first storage unit 54 is a storage device and stores mounting data (hereinafter, first data) 54a, measurement result data (hereinafter, second data) 54b, and the like.

The first data 54a includes information necessary for manufacturing the mounting board, such as the type of the component P mounted on the board 3, the standard value of the electrical characteristics of the component P, the coordinates of the mounting position, and the mounting angle. .. The mounting head 8 can be moved in the horizontal plane by the moving mechanism 11. The mounting head 8 includes a first motor 15, a second motor 25b, a third motor 28, a fourth motor 36b, a valve 33, a sensor 34, a camera 35a, a rotation mechanism 37b, and a measuring unit 37d. The mounting head 8 further includes a component presence / absence determination unit (hereinafter, determination unit) 55, a component posture determination unit (hereinafter, second determination unit) 56, a measurable possibility determination unit (hereinafter, third determination unit) 57, and a head storage unit (hereinafter, head storage unit). Hereinafter, the second storage unit) 58 is included. The second storage unit 58 is a storage device, and stores measurable / non-measurable data (hereinafter, third data) 58a and the like.

The measuring unit 37d is electrically connected to the electrode 38 of the measuring unit 37c shown in FIG. 6B. When the component P held by the holding member H stopped at the station S10, which is the measurement position, descends, it is electrically connected to the electrode 38 of the measurement unit 37c. At this time, the measuring unit 37d measures electrical characteristics such as resistance, capacitance, and inductance of the component P. The measuring unit 37d includes, for example, an LCR meter.

That is, the measuring unit 37d, the measuring unit 37c, and the rotating mechanism 37b are provided on the mounting head 8. As shown in FIG. 4, these constitute a characteristic measuring device 37 for measuring the electrical characteristics of the component P held by the holding member H stopped at the measuring position (station S10). In the above, the measuring unit 37d is provided on the mounting head 8, but the present invention is not limited to this, and the measuring unit 37d may be provided inside or outside the component mounting device 1 in a state of being connected to the measuring unit 37c via a network. ..

The characteristic measuring device 37 has a measuring unit 37c that can be electrically connected to the component P at the measuring position, and measures the electrical characteristics of the component P held by the holding member H. Since the measuring unit 37c is provided on the mounting head 8, the characteristic measuring device 37 can measure the electrical characteristics of the component P held by the holding member H while the mounting head 8 is moving. If the measuring unit 37d and the measuring unit 37c are arranged on the mounting head 8, the length of the cable connecting the measuring unit 37d and the measuring unit 37c is shortened, and the measurement error caused by the resistance of the cable or the like is reduced. Can be done.

As shown in FIG. 8, the sensor 34 is provided on the mounting head 8 and is a detection device that detects the state of the component P including the presence / absence of the component P held by the holding member H stopped at the station S3. Functions as. Further, the camera 35a of the component recognition unit 35 is provided on the mounting head 8 and is a detection device that detects the state of the component P including the posture of the component P held by the holding member H stopped at the station S7. Functions as.

The detection device for detecting the presence / absence of the component P and the detection device for detecting the posture of the component P are not limited to the structure provided in the mounting head as separate detection devices, and detect the presence / absence and the posture of the component P. The mounting head may be provided as one detection device. In that case, the detection device may include, for example, a sensor 34 for detecting the presence / absence of the component P and a camera 35a for detecting the posture of the component P, or a camera 35a capable of detecting the presence / absence of the component P and the posture. May have only.

Stations S3 and S7 are detection positions where the state of the component P is detected by the detection device on the orbit around the holding member H. The station S3 and the station S7 are provided between the station S1 and the station S10. That is, the detection position is provided between the holding position of the holding member H on the orbit and the measurement position. In this way, the holding position, the detection position, and the measurement position are arranged in this order on the orbit around the holding member H along the traveling direction of the holding member H.

That is, the detection device detects the state of the component P before measuring the electrical characteristics of the component P by the measuring unit 37c. In the above, the presence / absence of the component P is detected at the station S3, and the posture such as the presence / absence of the component P and the misalignment is detected at the station S7. However, the present invention is not limited to this, and the state of the component P including the presence / absence of the component P, the posture, and the like may be detected at the same station. That is, the detection position may be one station.

The judgment unit 55 functions as a judgment device. The determination unit 55 determines the presence or absence of the component P held by the holding member H based on the detection result obtained by the sensor 34 or the camera 35a. That is, the determination device determines the presence / absence of the component P held by the holding member H based on the detection result obtained by the detection device. The second determination unit 56 functions as a determination device. The second determination unit 56 determines whether or not there is a suction error of the component P held by the holding member H based on the detection result obtained by the detection device. That is, the determination device determines whether or not the posture of the component P held by the holding member H is good based on the detection result obtained by the detection device.

The third determination unit 57 functions as a measurement availability determination device. Based on the information on the presence / absence of the component P obtained by the determination unit 55, the third determination unit 57 determines the electrical characteristics of the component P held by the holding member H by the measurement unit 37d, the measurement unit 37c, and the rotation mechanism 37b. Determine whether to measure. That is, the measurement possibility determination device determines whether or not the characteristic measurement device 37 measures the electrical characteristics of the component P held by the holding member H based on the information on the presence or absence of the component P obtained by the determination device. To do. Alternatively, whether or not the third determination unit 57 measures the electrical characteristics of the component P held by the holding member H by the characteristic measuring device 37 based on the component posture information obtained by the second determination unit 56. To judge. That is, the measurement availability determination device determines whether or not the characteristic measurement device 37 measures the electrical characteristics of the component P held by the holding member H based on the component posture information obtained by the determination device. Alternatively, the third determination unit 57 as the measurement availability determination device may have both of these functions.

Specifically, when the holding member H does not hold the component P or the posture of the component P held by the holding member H is poor, the third determination unit 57 sends the characteristic measuring device 37 to the electricity of the component P. It is determined that the target characteristics are not measured. That is, when the holding member H does not hold the component P, it is not necessary to measure the electrical characteristics. Further, if the posture of the component P held by the holding member H is poor, there is a high possibility that the electrical characteristics cannot be measured correctly. Further, the component P may be separated from the holding member H in the process of lowering the component P having a poor posture to the measuring unit 37c. Therefore, the third determination unit 57 does not allow the characteristic measuring device 37 to measure the electrical characteristics of the component P.

The information regarding the measurableness determined by the third determination unit 57 is stored in the second storage unit 58 as the third data 58a in association with the information for identifying the holding member H or the component P held by the holding member H. Will be done. The processing unit 52 refers to the third data 58a of the holding member H which has rotated the index and stopped at the measurement position (station S10). Then, when the measurement is possible, the characteristic measuring device 37 measures the electrical characteristics of the component P, and when the measurement is not possible, the holding member H (suction nozzle 20) is not lowered.

The measurement result by the measurement unit 37d is transferred to the control device 50, and is stored in the first storage unit 54 as the second data 54b in association with the information for identifying the component P whose electrical characteristics have been measured. At that time, the information of the component P whose electrical characteristics have not been measured is also stored in the second data 54b. The stored second data 54b is used for traceability management of the mounting board and the like. The determination unit 55, the second determination unit 56, and the third determination unit 57 may be provided in the control device 50 instead of the mounting head 8. In that case, the detection result of the sensor 34 and the data captured by the camera 35a are transmitted to the control device 50. The control device 50 determines whether or not the electrical characteristics of the component P can be measured, and the first storage unit 54 stores the third data 58a.

The first determination unit 53 is based on the electrical characteristics of the component P measured by the characteristic measuring device 37 included in the second data 54b and the standard values of the electrical characteristics of the component P included in the first data 54a. , It is determined whether or not the component P held by the mounting head 8 is mounted on the board 3. Specifically, the first determination unit 53 determines that the component P can be mounted on the substrate 3 when the measured electrical characteristics are within the standard value, and determines that the component P cannot be mounted when the measured electrical characteristics are outside the standard value.

The processing unit 52 executes a component holding process on the holding member H stopped at the station S1 while rotating the rotating body 13 by an index of 30 degrees. Further, the processing unit 52 executes the measurement possibility determination process on the holding member H stopped at the station S3 or the station S7. Further, the processing unit 52 executes a characteristic measurement process on the holding member H stopped at the station S10. That is, the processing unit 52 executes a component holding process on the holding member H stopped at the holding position while rotating the rotating body 13 by 30 degrees, and a measurement possibility determination process on the holding member H stopped at the detection position. Is executed, and the characteristic measurement process is executed on the holding member H stopped at the measurement position. Further, when the holding member H holding the component P orbits the orbit and returns to the station S1 (holding position) to stop, the processing unit 52 executes the component mounting process.

That is, every time the rotating body 13 rotates by 30 degrees, a predetermined process is simultaneously executed at the holding position station S1, the detection position stations S3 and S7, and the measurement position station S10. The processing unit 52 controls the tape feeder 5, the mounting head 8, and the moving mechanism 11 to hold and take out the component P from the tape feeder 5 by the suction nozzle 20 of the mounting head 8, and removes the component P held by the mounting head 8. It is mounted on the substrate 3. Further, the processing unit 52 controls the mounting head 8 and the moving mechanism 11 to cause the component disposal unit T to execute the component disposal process of disposing of the component P not mounted on the substrate 3 after the component mounting process.

In this way, the processing unit 52 repeats a series of turns of the component holding process, the characteristic measurement process, the component mounting process, the characteristic measurement process, and the component disposal process to mount the predetermined component P on the substrate 3. Next, the details of the component holding process, the measurable determination process, the characteristic measurement process, and the component mounting process of the processing unit 52 will be described in order.

The processing unit 52 executes a component suction operation as a component holding process. That is, the processing unit 52 attracts the component P to the holding member H. Specifically, the processing unit 52 moves the mounting head 8 so that the station S1 (holding position) becomes the take-out position of the tape feeder 5. Next, the processing unit 52 operates the second motor 25b to lower the holding member H. Then, when the tip 20a of the suction nozzle 20 comes into contact with the upper surface of the component P, the processing unit 52 opens the valve 33 and attracts the component P to the holding member H. After that, the processing unit 52 raises the holding member H to its original height.

The processing unit 52 determines whether or not to measure the electrical characteristics of the component P held by the holding member H as a measurement possibility determination process. Specifically, when the holding member H rotates by index and stops at the station S3 (detection position), the processing unit 52 causes the sensor 34 as a detection device to inspect the tip 20a of the suction nozzle 20. Next, the processing unit 52 causes the determination unit 55 as a determination device to determine the presence or absence of the component P. Further, the processing unit 52 causes the second determination unit 56 as the determination device to determine the posture of the held component P, and whether or not the third determination unit 57 as the measurement possibility determination device can measure the component P. To judge.

Alternatively, the processing unit 52 causes the camera 35a (detection device) to take a picture of the component P held by the holding member H when the holding member H rotates by index and stops at the station S7 (detection position) as a measurement enablement / rejection determination process. Next, the processing unit 52 causes the determination unit 55 to determine the presence or absence of the component P. Further, the processing unit 52 causes the second determination unit 56 to determine the posture of the component P, and the third determination unit 57 determines whether or not the component P can be measured.

As a characteristic measurement process, the processing unit 52 causes the characteristic measuring device 37 to measure the electrical characteristics of the component P determined to be measurable. Specifically, when the holding member H holding the component P determined to be measurable rotates by index and stops at the station S10 (measurement position), the processing unit 52 operates the fourth motor 36b to hold the holding member. H is lowered. As a result, the component P descends toward the electrode 38 of the measuring unit 37c. When the terminal Pt of the component P is electrically connected to the electrode 38, the processing unit 52 causes the measuring unit 37d to measure the electrical characteristics of the component P. After that, the processing unit 52 raises the holding member H to its original height.

The processing unit 52 executes a component mounting operation for mounting the component P held by the holding member H on the substrate 3 as a component mounting process. Specifically, the processing unit 52 moves the mounting head 8 so that the station S1 (holding position) is located above the mounting position of the substrate 3. Next, the processing unit 52 operates the second motor 25b to lower the holding member H, and when the component P held by the tip 20a of the suction nozzle 20 comes into contact with the substrate 3, the valve 33 is closed and the component P is moved to the substrate 3. To be mounted on. Alternatively, just before the component P comes into contact with the substrate 3, the valve 33 is closed and the component P is mounted on the substrate 3. After that, the processing unit 52 raises the holding member H to its original height.

The first storage unit 54 in the control device 50 and the second storage unit 58 in the mounting head 8 are composed of a rewritable RAM, a flash memory, a hard disk, and the like. In addition, these two may be integrally configured. The processing unit 52 and the first determination unit 53 in the control device 50, the determination unit 55 in the mounting head 8, the second determination unit 56, and the third determination unit 57 are CPU (central processing unit) or LSI (large-scale integrated circuit). It is composed of. Alternatively, it may be configured by a dedicated circuit, and general-purpose hardware may be controlled by software read from a transient or non-transient storage device. Further, two or more of these may be integrally configured.

Next, among the component mounting methods in the component mounting device 1, the process for one turn in which the mounting head 8 takes out the component P from the tape feeder 5 and mounts the component P on the substrate 3 will be described with reference to FIGS. 5, 9, and 10. To do. As shown in FIG. 5, the suction nozzle 20 located at the station S1 is defined as the suction nozzle 20 (1), and hereinafter, the suction nozzle 20 (2) is defined as the suction nozzle 20 (12) counterclockwise.

FIG. 9 shows a flow of component mounting in a process in which one of the plurality of suction nozzles 20 included in the mounting head 8, the suction nozzle 20 (for example, the suction nozzle 20 (1)), has one turn. FIG. 10 shows the processing states at each of the station S1, which is the holding position for each index rotation of the rotating body 13, the station S3, which is the detection position, the station S7, and the station S10, which is the measurement position. The state shown in FIG. 5 is defined as the rotor index I0 in FIG. For convenience, in FIG. 10, the suction nozzle 20 (1) is displayed as N1, and the suction nozzles 20 (2) to (12) are displayed as N2 to N12, respectively.

As shown in FIGS. 3 and 9, the processing unit 52 is in a state where the suction nozzle 20 (1) is stopped at the station S1 which is the holding position and is located above the tape feeder 5 in the mounting head 8. 20 (1) (holding member H) is made to execute the component adsorption process. That is, the processing unit 52 sucks the component P supplied by the tape feeder 5 on the suction nozzle 20 (1) (ST1 in FIG. 9). Next, the processing unit 52 rotates the rotating body 13 by an index of 30 degrees. This is the state of the rotor index I1 shown in FIG. 10, the suction nozzle 20 (1) moves to the station S2, and the suction nozzle 20 (2) moves to the station S1.

Next, the processing unit 52 causes the suction nozzle 20 (2) to execute the component suction process to suck the component P. Similarly, the processing unit 52 rotates the rotating body 13 by index (rotor indexes I2 to I11), and when the suction nozzles 20 (N3 to N12) stop at the station S1, the parts suction process is executed, and the parts are sequentially subjected to the parts suction process. P is adsorbed.

When the processing unit 52 rotates the rotating body 13 by index and the suction nozzle 20 (1) stops at the station S3 which is the detection position, the suction nozzle 20 (1) is used by the sensor 34 as shown in the rotor index I2 of FIG. Inspect (ST2 in FIG. 9). Similarly, when the rotating body 13 is index-rotated (rotor indexes I3 to I13) and the suction nozzles 20 (N2 to N12) stop at the station S3, the processing unit 52 uses the sensor 34 to rotate the suction nozzles 20 (2) to (2) to ( 12) are sequentially inspected.

When the detection result by the sensor 34 is obtained, the determination unit 55 determines whether or not the suction nozzle 20 (1) holds the component P. Further, the second determination unit 56 determines whether the posture of the held component P is good or bad, and the third determination unit 57 determines the suction nozzle 20 (1) (1) in which the component P is held based on the determination result by the determination unit 55. It is determined whether or not to photograph the tip 20a) with the camera 35a (ST3 in FIG. 9). These determination processes are executed until the suction nozzle 20 inspected at the station S3 stops at the station S7. The posture determination by the second determination unit 56 may be omitted.

When the processing unit 52 further index-rotates the rotating body 13, the suction nozzle 20 (1) stops at the station S7 (rotor index I6). At this time, if it is determined by the third determination unit 57 that the suction nozzle 20 (1) is imaged by the camera 35a (Yes in ST3 of FIG. 9), the processing unit 52 uses the suction nozzle 20 (1) as the camera 35a. (ST4 in FIG. 9). Similarly, the processing unit 52 rotates the rotating body 13 by the index (rotor indexes I7 to I17), and when the suction nozzles 20 (N2 to N12) determined to be photographed by the camera 35a stop at the station S7, the camera The suction nozzles 20 (2) to (12) are sequentially photographed at 35a.

In the rotor index I4 of FIG. 10, it is determined that the suction nozzle 20 (3) cannot be photographed (no parts or extremely poor holding posture) (No in ST3 of FIG. 9), and is displayed as “x”. Therefore, in the rotor index I8, the photographing of the suction nozzle 20 (3) by the camera 35a is skipped and displayed as “−”. That is, the measurement of the electrical characteristics of the suction nozzle 20 (3) (ST6 in FIG. 9) is skipped.

When the determination unit 55 obtains an image taken by the camera 35a, which is a detection device, it determines whether or not the suction nozzle 20 holds the component P. Further, the second determination unit 56 determines whether or not the posture of the held component P is good or bad based on the above image, and the third determination unit 57 determines whether or not the electrical characteristics of the component P held by the characteristic measuring device 37 are measured. (ST5 in FIG. 9). These determination processes are executed until the suction nozzle 20 inspected at the station S7 stops at the station S10.

In the rotor index I9 of FIG. 10, the processing unit 52 rotates the rotating body 13 by the index, and the suction nozzle 20 (1) stops at the station S10. As a result of photographing by the camera 35a, when it is determined that the third determination unit 57 measures the electrical characteristics of the component P (Yes in ST5 of FIG. 9), the processing unit 52 is held by the suction nozzle 20 (1). The characteristic measuring device 37 is made to measure the electrical characteristics of the component P (ST6 in FIG. 9). At that time, the processing unit 52 moves the rotation mechanism 37b based on the posture of the component P recognized by the camera 35a to correct the misalignment of the component P around the Z axis.

Similarly, the processing unit 52 rotates the rotating body 13 as an index, and when the suction nozzles 20 (N2 to N12) stop at the stations S10 in the rotor indexes I10 to I20, the characteristic measuring device 37 sequentially has electrical characteristics. To measure. The measurement result is transmitted to the control device 50 and stored in the first storage unit 54 as the second data 54b.

In the rotor index I10 of FIG. 10, the suction nozzle 20 (5) is determined to be unmeasurable (poor posture) due to a poor imaging result, and is displayed as “x” (No in ST5 of FIG. 9). Therefore, in the rotor index I16, the measurement of the electrical characteristics of the suction nozzle 20 (5) is skipped and is displayed as “−”. That is, similarly to the suction nozzle 20 (3), the measurement of the electrical characteristics of the suction nozzle 20 (5) (ST6 in FIG. 9) is also skipped.

When the component suction process is completed on all the suction nozzles 20 (N1 to N12), the rotor index I0 to the rotor index I11 shown in FIG. 10 are completed. After this, the mounting head 8 moves above the substrate 3. When the electrical characteristics of the sucked component P are measured (ST6 in FIG. 9), the first determination unit 53 determines the component P held by the suction nozzle 20 based on the quality of the electrical characteristics of the component P. It is determined whether or not to mount the board 3 (ST7 in FIG. 9).

That is, as shown in the rotor index I12 of FIG. 10, the processing unit 52 rotates the rotating body 13 by the index to stop the suction nozzle 20 (1) holding the component P at the station S1. First, as shown in the rotor index I9 of FIG. 10, when the first determination unit 53 determines that the component P held by the suction nozzle 20 (1) has good electrical characteristics and the component P is mounted. (Yes in ST7 of FIG. 9) will be described. In this case, the processing unit 52 executes the component mounting process to mount the component P held by the suction nozzle 20 (1) at a predetermined mounting position on the substrate 3 (ST8 in FIG. 9). Similarly, the processing unit 52 rotates the rotating body 13 by index as shown in the rotor indexes I13 to I23 of FIG. Then, when the suction nozzle 20 of the suction nozzles 20 (N2 to N12), which has been determined by the first determination unit 53 to mount the component P, stops at the station S1, the held component P is sequentially transferred to the substrate 3. Install it.

On the other hand, as shown in the rotor index I16 of FIG. 10, the first determination unit 53 determines that the electrical characteristics of the component P held by the suction nozzle 20 (8) are defective (No. in ST7 of FIG. 9). ). In this case, the component mounting process (ST8) is skipped. In the case of the suction nozzle 20 (3) determined not to hold the component P in this way (No in ST3 of FIG. 9), the suction nozzle 20 (5) determined to have a defective holding posture of the component P. Similarly to the case (No in ST5), the component mounting process (ST8) is skipped in the case of No in ST7.

As shown in the rotor indexes I12 to I23 of FIG. 10, when the component mounting process is completed in all the suction nozzles 20 (N1 to N12) and the rotor index I23 is completed, the mounting head 8 moves above the component disposal unit T. To do. Then, the processing unit 52 causes the component disposal unit T to execute the component disposal process in which the component P not mounted on the substrate 3 is disposed of (ST9 in FIG. 9). In the example of FIG. 10, the suction nozzle 20 (5) in which the component mounting process (ST8) is skipped, and the component P held by the suction nozzle 20 (8) are discarded in the component disposal process. The same applies when the suction nozzle 20 (3) holds the component P. When the component P is discarded, the mounting head 8 moves above the component supply unit 4. As a result, the component mounting process for one turn is completed.

Note that the processing unit 52 does not execute the component disposal process when there is no component P that has not been mounted on the board 3. That is, when the rotor index I23 ends, the mounting head 8 does not move to the component disposal section T, but moves above the component supply section 4. As a result, the component mounting process for one turn is completed.

As described above, the component mounting device 1 includes a mounting head 8, a holding member H, and a characteristic measuring device 37. The holding member H is provided on the mounting head 8 and is configured to hold the component P. The characteristic measuring device 37 measures the electrical characteristics of the component P held by the holding member H. The characteristic measuring device 37 includes a measuring unit 37c configured to be electrically connected to the component P held by the holding member H, and the measuring unit 37c is provided on the mounting head 8. The mounting head 8 is movable in a horizontal plane. The holding member H includes a shaft 17, a nozzle holder 19, and a suction nozzle 20. The characteristic measuring device 37 further includes a measuring unit 37d and a rotating mechanism 37b. As a result, the holding of the component P, the mounting of the component P on the substrate 3, and the measurement of the electrical characteristics of the component P can be performed in parallel, and the component P can be mounted without reducing the efficiency of the component mounting work. The electrical characteristics can be measured.

In the above description, after the determination unit 55 determines whether or not the component P is held by the suction nozzle 20 by the sensor 34, the second determination unit 56 determines the posture of the component P based on the image taken by the camera 35a. Is judged. However, the presence / absence of the component P may be determined by the sensor 34, and the posture of the component P may also be determined. In that case, the camera 35a is unnecessary, and ST4 in FIG. 9 is omitted. Similarly, the presence or absence of the component P may be determined and the posture of the component P may be determined based on the image captured by the camera 35a. In that case, the sensor 34 is unnecessary, and ST4 is executed instead of ST2 in FIG.

Further, depending on the structure of the tape supplied by the tape feeder 5, the posture of the component P may be determined to some extent when it is held by the suction nozzle 20. In such a case, it is not necessary for the second determination unit 56 to determine the posture of the component P. Therefore, ST4 and ST5 in FIG. 9 are omitted, and one of the sensor 34 and the camera 35a is unnecessary.

Next, the multiple head (hereinafter, head) 60, which is another example of the mounting head, will be described with reference to FIGS. 11 to 13. As shown in FIG. 11, the head 60 has a holding frame 61 that extends in a vertical plane. By mounting the holding frame 61 on the plate member 9 shown in FIG. 1, the head 60 is mounted on the component mounting device 1. Hereinafter, the side of the head 60 where the holding frame 61 is provided is referred to as a rear side, and the side opposite to the holding frame 61 is referred to as a front side.

The head 60 has a plurality of nozzle units 62 arranged side by side in front of the holding frame 61 (here, 6 in the horizontal direction and 12 in the front and rear in 2 rows in total). Each of the nozzle units 62 includes a nozzle elevating drive unit (hereinafter, drive unit) 62a and a shaft member 63 extending downward from the drive unit 62a. A nozzle holder 64 is coupled to the lower end of the shaft member 63. A suction nozzle 65 that sucks and holds the component P is detachably attached to the nozzle holder 64.

The drive unit 62a has a nozzle elevating mechanism (not shown) for elevating and lowering the shaft member 63. By driving the nozzle elevating mechanism, the shaft member 63 is driven up and down, whereby the plurality of suction nozzles 65 mounted on the plurality of nozzle holders 64 are individually moved up and down. A θ-axis motor 66 is arranged on the side of the nozzle unit 62 with the drive shaft 66S facing downward. A drive pulley 66a is coupled to the drive shaft 66S. A driven pulley 66b is attached to each of the shaft members 63. A belt 66c is attached to the drive pulley 66a and the driven pulley 66b. Therefore, by driving the θ-axis motor 66, the plurality of shaft members 63 rotate around the Z-axis at the same time together with the suction nozzle 65 mounted on the nozzle holder 64. As a result, the component P held by the suction nozzle 65 is aligned around the Z axis.

The head 60 has a characteristic measuring device 67 for measuring the electrical characteristics of the component P held by the suction nozzle 65, similarly to the mounting head 8 which is the rotary type head described above. The characteristic measurement device 67 includes a measurement unit arrangement unit (hereinafter, arrangement unit) 68 arranged below the head 60, a unit moving unit (hereinafter, movement unit) 69, and a characteristic measurement unit (hereinafter, movement unit) arranged inside the head 60. Hereinafter, it has a measuring unit) 70.

As shown in part (a) of FIG. 12, six measurement openings 68a are provided on the upper surface of the arrangement part 68. The measurement openings 68a are arranged parallel to the axis (X-axis in FIG. 11) in which the six suction nozzles 65 are arranged side by side at the same intervals as the suction nozzles 65. As shown in FIG. 13, a measurement unit 71 is installed at the bottom of each of the measurement openings 68a. The measuring unit 71 has an electrode 72 on the upper portion thereof, which can be electrically connected to the terminal Pt of the component P. That is, the measurement opening 68a penetrates to the electrode 72, and the electrode 72 is exposed through the measurement opening 68a. A rotation mechanism 71a is arranged under each of the measurement units 71. That is, six rotation mechanisms 71a are arranged in the arrangement unit 68 at the same intervals as the suction nozzle 65.

As shown in FIG. 11, the moving unit 69 moves the array unit 68 back and forth. The measuring unit 70 has the same function as the measuring unit 37d of the mounting head 8 shown in FIG. 4, and the measuring unit shown in FIGS. 12 and 13 is provided via a cable, a selector switch, or the like (not shown). It is electrically connected to the electrode 72 of the 71.

The rotation mechanism 71a shown in FIG. 13 has a motor or the like capable of rotating the measurement unit 71 (electrode 72) around the Z axis. When measuring the electrical characteristics of the component P, the rotation mechanism 71a determines the positional deviation between the component P and the electrode 72 held by the plurality of suction nozzles 65 around the Z axis without rotating the suction nozzle 65 around the Z axis. Adjust independently. If each of the nozzle units 62 can rotate the shaft member 63 around the Z axis, the rotation mechanism 71a may be omitted. Further, in this example, the anisotropic conductive sheet 41 is not arranged on the upper surface of the electrode 72, but similarly to the measurement unit 37c shown in FIG. 6, the anisotropic conductive sheet 41 is placed on the upper surface of the electrode 72 of the measurement unit 71. It may be arranged.

Next, the measurement of the electrical characteristics of the component P in the head 60 will be described with reference to FIGS. 12 and 13. As shown in the part (a) of FIG. 12 and the part (a) of FIG. 13, the suction nozzles 65 are taped, respectively, with the arrangement part 68 located at the rear retracting position K0 that does not interfere with the descending suction nozzle 65. Take out the component P from the feeder 5. Next, the head 60 moves on the upper surface of the base 1a of the component mounting device 1 shown in FIG. 1 or on the component recognition camera (not shown) arranged on the feeder table 4a. Then, this component recognition camera photographs the component P held by each of the suction nozzles 65 from below. From the captured image, the presence / absence of the component P, the holding posture, and the like are recognized.

Next, while the head 60 moves above the mounting position of the substrate 3, the electrical characteristics of the component P held by the head 60 are measured. When measuring the electrical characteristics of the component P, first, the moving portion 69 shown in FIG. 11 is arranged as shown by the arrow h1 in the portion (b) of FIG. 12 and the arrow i1 in the portion (b) of FIG. The 68 is moved below the suction nozzle 65 in the back row. As a result, the suction nozzles 65 in the rear row are arranged above the measurement opening 68a of the measurement unit 71, respectively. After that, based on the holding posture of the component P recognized by the component recognition camera, the rotation mechanism 71a is driven to correct the misalignment of the component P around the Z axis.

Next, the nozzle elevating mechanism of the drive unit 62a in the rear row is driven, the suction nozzle 65 in the rear row is lowered as shown by the arrow i2 in the portion (b) of FIG. 13, and the component P is electrically connected to the electrode 72. Nozzle. In this state, the measuring unit 70 measures the electrical characteristics of each component P. As described above, the position where the suction nozzle 65 in the rear row is above the measurement opening 68a is the rear row measurement position K1 (measurement position). Further, the nozzle elevating mechanism of the drive unit 62a in the rear row functions as a measurement position elevating device for elevating and lowering the holding member J at the rear row measurement position K1.

Next, after raising the suction nozzle 65 in the back row to the original height, the array portion 68 sucks in the front row as shown by the arrow h2 in the part (c) of FIG. 12 and the arrow i3 in the part (c) of FIG. It moves below the nozzle 65. Next, as shown by the arrow i4 in the portion (c) of FIG. 13, the suction nozzle 65 in the front row is lowered, and the component P is electrically connected to the electrode 72. In this state, the measuring unit 70 measures the electrical characteristics of each component P. As described above, the position where the suction nozzle 65 in the front row is above the measurement opening 68a is the front row measurement position K2 (measurement position). Further, the nozzle elevating mechanism of the drive unit 62a in the front row functions as a measurement position elevating device for elevating and lowering the holding member J at the front row measurement position K2.

After that, the suction nozzle 65 in the front row rises to the original height, the arrangement portion 68 moves to the retracted position K0, and the measurement of the electrical characteristics of the series of parts P in the head 60 is completed. After that, the component P whose electrical characteristics are within the standard value is mounted at a predetermined mounting position on the substrate 3. If the component P is not held, or if the holding posture of the component P is poor, the measurement of the electrical characteristics is skipped and the component P is not mounted on the substrate 3. The component P that is not mounted on the substrate 3 is discarded by the component disposal unit T. It should be noted that such a series of operations is executed by control by a control device (not shown).

As described above, the shaft member 63, the nozzle holder 64, and the suction nozzle 65 included in the head 60 constitute a holding member J capable of holding the component P. Further, the measuring unit 71 and the rotating mechanism 71a included in the moving unit 69, the measuring unit 70, and the arranging unit 68 constitute a characteristic measuring device 67 for measuring the electrical characteristics of the component P held by the holding member J. In the head 60, the measuring unit 71 moves back and forth with respect to the holding member J. That is, the plurality of holding members J can move relative to the measuring unit 71 of the characteristic measuring device 67.

The head 60 measures the electrical characteristics of the component P while the head 60 moves above the substrate 3 after the component recognition camera photographs the component P. As a result, the electrical characteristics of the component P can be measured without reducing the efficiency of the component mounting work. In the above, the measuring unit 70 is provided on the head 60, but the present invention is not limited to this, and the measuring unit 70 may be provided inside or outside the component mounting device 1 in a state of being connected to the measuring unit 71 via a network.

In the above embodiment, an example in which all the elements constituting the component mounting system are provided in the component mounting device 1 has been described, but the component mounting system is not limited to this. For example, a part of each element constituting the component mounting system may be configured as a device different from the component mounting device 1, and the component mounting system may be configured as a whole.

Further, in the description of the above embodiment, a mounting head having a plurality of suction nozzles has been described as an example, but a measuring unit may be provided on the mounting head having only one suction nozzle. Even in this case, the electrical characteristics of the held parts can be measured while the mounting head is moving. It is possible to measure the electrical characteristics of a component without reducing the efficiency of the component mounting work.

According to the component mounting system, the mounting head, and the component mounting method in the component mounting system of the present disclosure, it is possible to measure the electrical characteristics of the component without lowering the efficiency of the component mounting work. Therefore, it is useful in the field of mounting components on a substrate.

1 Parts mounting device 1a Base 2 Conveying mechanism 3 Board 4 Parts supply part 4a Feeder table 5 Tape feeder 6 Y-axis table 7 Beam 8 Mounting head 8a Cover 9 Plate member 10 Holding frame 11 Moving mechanism 12 Rotor holding part 12a Bearing 13 Rotation Body 13a Mounting hole 13b Common flow path 14 Rotating body driven gear 15 Index drive motor (first motor)
15a Index drive gear 16 Through hole 16a Air gap 17 Shaft 17a Shaft inner hole 17b Opening 18 Bearing 19 Nozzle holder 19a Vent hole 20, 65 Suction nozzle 20a Tip 20b Nozzle flow path 21 Cam follower 21a Fixture 22 Cam holding part 23 Cylindrical cam 23a Groove 24 Elastic body 25 Holding lift mechanism 25a, 36a Screw shaft 25b Holding lift motor (second motor)
25c Nut 25d, 36c Cam Follower Holder (Holder)
26 Cylindrical member 26a Tip 26b Bearing 26c Cylindrical member inner hole 27 θ Rotation driven gear 28 θ Rotation motor (third motor)
28a θ rotary drive gear 29 Nozzle drive gear 30 Nozzle rotary gear 31 Tube 32 Negative pressure source 33 Valve 34 Sensor 35a Camera 35b Mirror 36 Measuring lift mechanism 36b Measuring lift motor (4th motor)
37, 67 Characteristic measurement device 37a Arm member 37b, 71a Rotation mechanism 37c, 71 Measurement unit 37d, 70 Characteristic measurement unit (measurement unit)
38, 72 Electrodes 40 Top covers 40a, 68a Measurement opening 41 Anisotropic conductive sheet 42 Measuring substrate 50 Control device 51 Touch panel 52 Processing unit 53 First determination unit 54 First storage unit 54a First data 54b Second data 55 Judgment Unit 56 Second determination unit 57 Third determination unit 58 Second storage unit 58a Third data 60 Multiple heads (heads)
61 Holding frame 62 Nozzle unit 62a Nozzle elevating drive unit (drive unit)
63 Shaft member 64 Nozzle holder 66 θ-axis motor 66a Drive pulley 66b Driven pulley 66c Belt 66S Drive shaft 68 Measurement unit arrangement part (arrangement part)
69 Unit moving part (moving part)
H, J Holding member P Parts T Parts disposal part

Claims (20)

1. With the mounting head
   A holding member provided on the mounting head and configured to hold a component,
   A characteristic measuring device for measuring the electrical characteristics of the component held by the holding member is provided.
   The characteristic measuring device includes a measuring unit configured to be electrically connected to the component held by the holding member.
   The measuring unit is provided on the mounting head.
   The component mounting system.
2. The characteristic measuring device measures the electrical characteristics of the component held by the holding member while the mounting head is moving.
   The component mounting system according to claim 1.
3. The holding member is one of a plurality of holding members provided on the mounting head.
   Each of the plurality of holding members is movable relative to the measuring unit.
   The component mounting system according to claim 1 or 2.
4. The mounting head includes a rotating body that rotatably holds the plurality of holding members along an orbit.
   The component mounting system according to any one of claims 1 to 3.
5. The characteristic measuring device further includes a characteristic measuring unit for measuring the electrical characteristics of the component electrically connected to the measuring unit.
   The characteristic measurement unit is provided on the mounting head.
   The component mounting system according to any one of claims 1 to 4.
6. The measurement position that can be electrically connected to the measurement unit and the holding position that can hold the component by the holding member are provided at different positions on the orbit.
   The component mounting system according to claim 4 or 5.
7. A holding position elevating device provided on the mounting head and elevating the holding member at the holding position is further provided.
   The component mounting system according to claim 6.
8. A measurement position elevating device provided on the mounting head and elevating the holding member at the measurement position is further provided.
   The component mounting system according to claim 6 or 7.
9. A detection device provided on the mounting head and detecting the presence or absence of the component held by the holding member is further provided.
   The component mounting system according to any one of claims 1 to 8.
10. The detection device detects the presence or absence of the component before measuring the electrical property of the component by the characteristic measuring device.
    The component mounting system according to claim 9.
11. Further, a measurement propriety determination device for determining whether or not to measure the electrical characteristics of the component held by the holding member by the measurement unit based on the information regarding the presence or absence of the component obtained by the detection device. Prepared
    The component mounting system according to claim 9 or 10.
12. The detection device further detects the posture of the component held by the holding member, and further detects the posture of the component.
    The measurement possibility determination device further determines whether or not the measurement unit measures the electrical characteristics of the component held by the holding member based on the information regarding the posture of the component obtained by the detection device. To do
    The component mounting system according to claim 11.
13. A second detection device provided on the mounting head and detecting the posture of the component held by the holding member is further provided.
    Whether or not the measurement possibility determination device measures the electrical characteristics of the component held by the holding member by the measurement unit based on the information regarding the posture of the component obtained by the second detection device. To further determine,
    The component mounting system according to claim 11.
14. A detection device provided on the mounting head and detecting the posture of the component held by the holding member is further provided.
    The component mounting system according to any one of claims 1 to 8.
15. The detection device detects the posture of the component before measuring the electrical property of the component by the characteristic measuring device.
    The component mounting system according to claim 14.
16. Further provided with a measurement propriety determination device for determining whether or not to measure the electrical characteristics of the component held by the holding member by the measurement unit based on the information regarding the posture of the component obtained by the detection device. ,
    The component mounting system according to claim 14 or 15.
17. The holding member is one of a plurality of holding members provided on the mounting head.
    The mounting head includes a rotating body that rotatably holds the plurality of holding members along an orbit.
    The detection position for detecting the state of the component by the detection device is a holding position where the component can be held by the holding member and a measurement position which can be electrically connected to the measurement unit on the orbit. Provided in between
    The holding position, the detection position, and the measurement position are arranged in this order along the traveling direction of the plurality of holding members.
    The component mounting system according to any one of claims 9 to 16.
18. A rotation mechanism configured to rotate the measuring unit is further provided.
    The component mounting system according to any one of claims 1 to 17.
19. A holding member configured to hold the part,
    A measuring unit configured to be electrically connected to the component held by the holding member.
    Mounting head.
20. It is a component mounting method in a component mounting system.
    The component mounting system is
    With the mounting head
    A holding member provided on the mounting head and configured to hold a component,
    A characteristic measuring device for measuring the electrical characteristics of the component held by the holding member is provided.
    The characteristic measuring device includes a measuring unit configured to be electrically connected to the component held by the holding member.
    The measuring unit is provided on the mounting head.
    The component mounting method is
    The step of causing the holding member to hold the component,
    A step of connecting the component held by the holding member to the measuring unit is provided.
    Component mounting method.

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