JP7187535B2 - 透明導電性酸化物及び半導体被覆のフラッシュ・アニーリング - Google Patents
透明導電性酸化物及び半導体被覆のフラッシュ・アニーリング Download PDFInfo
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- JP7187535B2 JP7187535B2 JP2020505890A JP2020505890A JP7187535B2 JP 7187535 B2 JP7187535 B2 JP 7187535B2 JP 2020505890 A JP2020505890 A JP 2020505890A JP 2020505890 A JP2020505890 A JP 2020505890A JP 7187535 B2 JP7187535 B2 JP 7187535B2
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Description
変動する圧力及びO2割合を有するアルゴン中で、厚さ3.2mmのフロート・ガラス上への図8に示す厚さまでのITO層のMSVD蒸着によって、ITO被覆ガラス物品を準備した。室温(約22℃)において、500マイクロ秒及び約4~5J/cm2の単一パルスで、これらの物品をフラッシングした。4点プローブを使用してシート抵抗を測定し、図8に結果が提供されている。シート抵抗(30Ω/□未満)は十分であり、125nmを上回る層の場合、シート抵抗は20Ω/□未満である。標準的な方法論によって同じ被覆物品についての放射率を評価し、図9に示す結果は、厚さ150nmを上回る、特に250nm~350nmの範囲内のITO層の場合、放射率は2~5倍を超えて変化し、35Ω/□まで上昇したことを示す。
図10A及び図10Bに示すように圧力、O2割合、及び厚さを変動させたことを除いて、本質的に実例1に示すように、ITO被覆物品を準備した。約4~5J/cm2のキセノン・ランプから約500マイクロ秒のパルスで、サンプルをフラッシングした。標準的な方法によって、ホール測定(キャリア濃度及びキャリア移動度)を測定した。図10A及び図10Bに見ることができるように、フラッシング後にキャリア移動度及び濃度は増大し、これは伝導率の全体的な増大を示すが、キャリア濃度の最大の増大は、4mTorr及び1.5%のO2で堆積されたITOの場合に見られた。
すべてのサンプルが0%、1.5%、又は2.5%のO2を有する4mTorrのアルゴン中でMSVDによって堆積された厚さ250nmのITO層を有したことを除いて、本質的に実例1と同様に、ITO被覆物品を準備した。分光測色により透過率を測定し、透過率及び反射率のデータから正規化吸収度を計算した。結果が図11A及び図11Bに示されている。2つのサンプル・セットについての積分透過率が示されている。約4~5J/cm2で約500マイクロ秒の単一のパルスで、サンプルをフラッシングした。0%及び1.5%のO2のサンプルについての可視及び近赤外スペクトルにおいて、フラッシング前のサンプルとフラッシング済みサンプルとの間には、透過率及び正規化吸収度の大きな違いが見られるが、2.5%のO2ではほとんど効果が見られず、酸素が欠乏しているITOがフラッシングに対してより反応することを示す。
圧力、O2割合が3mTorr及び2.5%のO2であり、厚さが図12に示すように変動したことを除いて、本質的に実例1に示すように、ITO被覆物品を準備した。約4~5J/cm2のキセノン・ランプから約500マイクロ秒のパルスで、サンプルをフラッシングした。標準的な方法によって、シート抵抗及び積分透過率を評価した。図12に見ることができるように、250nmから650nmより大きい範囲のシートに対して、4mTorr及び1.5%のO2で堆積されたITOの場合、フラッシュ・アニーリングによって低いシート抵抗及び透過率を得ることができる。
ITO層厚さが約300nmであったことを除いて、本質的に実例1に記載されているように、ITO被覆物品を準備した。異なるITO堆積条件を使用し、その結果、標準的な方法論によって、図13Aに示す吸収係数スペクトルが判定された。約4~5J/cm2のキセノン・ランプから約500マイクロ秒のパルスで、サンプルをフラッシングした。各サンプルに対して標準的な方法論によって、X線回折(XRD)トレースを得た(図13B)。図13Aに見ることができるように、425nm~500nmの光に対して吸収係数が増大するにつれて、その光の侵入深さが低下し、サンプル2に対してXRDピークの移動及び増大が見られ、サンプル3に対してピークの分割又は分岐が見られ、これは単一のITO層からの2つの副層の形成を示す。
ITO層厚さが図14に示すとおりであり、1.5%のO2を有するITOを4mTorrで堆積させたことを除いて、本質的に実例1に記載されているように、ITO被覆物品を準備した。約4~5J/cm2のキセノン・ランプから約500マイクロ秒のパルスで、サンプルをフラッシングした。XRD回折トレースが図14に提供されている。見ることができるように、フラッシングの結果、すべての厚さが変換を呈したが、たとえばこの特定のITO組成物についての光パルスの有効侵入深さを超えて層の厚さが増大すると、186nmを超える厚さで、2つの物理的に異なる副層への層の分岐が見られた。異なるITO及びTCO組成物並びに異なるフラッシュ・スペクトル及び強度に対して、分岐は異なる厚さで始まることが予期される。
米国特許出願公開第20110117300号に本質的に記載されているように、モノリシック・ガラス上に、基材、第1の誘電体層(40~55nm)、反射層(5.5~8.5nm)、下塗り層(0.5~6nm)、第2の誘電体層(15~45nm)、及び最高15nmの保護層の順で、MSVD被覆製品の30.48cm(12”)×30.48cm(12”)のシートを準備した。これらの厚さはアニーリング済み製品に対するものである。この範囲内の下塗り厚さを使用すると、フラッシング後の曇り及び視覚的品質の損失が生じることが分かった。したがって、上述した公称製品は、1kWによって両方の下塗り厚さを増大させ、1.5kWによって両方の下塗り厚さを増大させ、3kWによって頂部及び中心酸化物を減少させ、又は2kWによって両方の下塗り厚さを増大させ、且つ3kWによって頂部及び中心酸化物を減少させるように修正された。
たとえば図5及び図6に関連して、市販のSOLARBAN(登録商標)70ベースの被覆に対応して、本質的に上述したように、3つの銀層物品を準備し、その目標は、市販の焼き戻し済み製品に密接に整合する未焼き戻し製品を作製することを可能にするのに十分な量のTL*の増大を実現することができるかどうかを判定することであった。
●アニーリング済みレベルの下塗り厚さを有するサンプルは、一般にフラッシュ処理によって損傷され、30%の下塗り増大サンプルで、ある程度の損傷/曇りも観察された。
●VTレベルの下塗りを有するサンプルは、透過率を改善するのに十分なほど多量にフラッシングされた場合、透過色が大きく外れた(Tb*が高い)。
●複数のフラッシュを使用すると、2.3点と同じ高さのTL*の増大が生じ、単一のフラッシュを使用すると1.4と同じ高さの増大が生じた(5mmの透明基線サンプル上の製品SOLARBAN(登録商標)70XLに対して)。
●フラッシュ処理されたサンプルは、VTスタックよりアニーリング済みスタックに光学的に類似していた。
●色を維持するには、より薄い酸化物を必要とするはずである。
●色を維持するには(底部Agについての最大の増大、頂部Agについての最小の増大)、より厚い銀層を必要とするはずである。
たとえば図3及び図4に関連して、市販のSOLARBAN(登録商標)90ベースの被覆に対応して、本質的に上述したように、単一の不連続の(サブクリティカル)銀層を有する4銀層物品を準備し、その目標は、500μ秒で670V、500μ秒で650V、200μ秒で800V、又は2000μ秒で500Vを含む単一のフラッシュを使用して、物品を損傷することなく、TL*の増大を実現することができるかどうか、及び有用な色プロファイルを生成することができるかどうかを判定することである。いくつかのフラッシュ条件では、あまり望ましくない、たとえば高b*(黄変)のCIELAB L*a*b*プロファイルが生じたが、透過率は概して増大し、色プロファイルはフラッシュ処理に応答して、下塗り厚さの増大とともに曇りの低減が得られた。
1.透明導電性酸化物又は半導体を含む層を含む被覆基材を作製する方法であって、
a.不活性雰囲気中で基材の少なくとも一部分の上に、少なくとも1,000cm-1の可視スペクトル内の波長の吸収係数を有する透明金属酸化物又は半導体層を堆積させるステップと、
b.可視スペクトル内の波長で層が少なくとも1,000cm-1の吸収係数を有する光を含む可視スペクトル内の非コヒーレント光の3.5J/cm2~6.0J/cm2の範囲のパルスによって、15℃~40℃又は20℃~30℃の範囲の温度で透明導電性酸化物又は半導体層の少なくとも一部分をフラッシングするステップとを含む方法。
2.パルスが、透明導電性酸化物又は半導体の分割層をもたらす層の厚さより小さい層内の侵入深さを有し、分割層の各層が、異なる物理的特性を有する、条項1に記載の方法。
3.パルスが、4.0J/cm2~5.0J/cm2の範囲である、条項1又は2に記載の方法。
4.透明導電性酸化物又は半導体層が、透明導電性酸化物を含む、条項1又は2に記載の方法。
5.透明導電性酸化物が、チタン、ハフニウム、ジルコニウム、ニオブ、亜鉛、ビスマス、鉛、インジウム、スズ、及びこれらの混合物の酸化物である、条項4に記載の方法。
6.透明導電性酸化物が、インジウム・スズ酸化物、インジウム亜鉛酸化物、アルミニウム亜鉛酸化物、亜鉛スズ酸化物、インジウム・カドミウム酸化物、カドミウム・スズ酸化物、スズ酸バリウム、バナジン酸ストロンチウム、又はバナジン酸カルシウムである、条項4に記載の方法。
7.TCOが、2mTorr~5mTorr又は3mTorr~4mTorrの雰囲気中で堆積される、条項4から6までのいずれか一項に記載の方法。
8.TCOが、3(体積)%以下の酸素、2.5%以下の酸素、たとえば2.5%の酸素、2.5%未満の酸素、又は1.5%以下の酸素を含む雰囲気中で堆積される、条項4から7までのいずれか一項に記載の方法。
9.透明導電性酸化物が、インジウム・スズ酸化物である、条項4に記載の方法。
10.インジウム・スズ酸化物が、2.5%未満の酸素を有する不活性雰囲気中で堆積される、条項9に記載の方法。
11.インジウム・スズ酸化物が、2mTorr~5mTorr又は3mTorr~4mTorrの範囲の圧力で堆積される、条項9又は10に記載の方法。
12.インジウム・スズ酸化物が、150nm~400nm若しくは200nm~300nmの範囲、又は250nmの厚さを有する層内に堆積される、条項9から11までのいずれか一項に記載の方法。
13.インジウム・スズ酸化物が、300nm~2μmの範囲の厚さを有する層内に堆積され、フラッシュの侵入深さが、インジウム・スズ酸化物層の厚さより小さく、透明導電性酸化物又は半導体の分割層をもたらし、分割層の各層が、異なる物理的特性を有する、条項9から11までのいずれか一項に記載の方法。
14.透明導電性酸化物又は半導体層が、酸素が欠乏している透明導電性酸化物を含む、条項1から13までのいずれか一項に記載の方法。
15.基材が透明である、条項1から14までのいずれか一項に記載の方法。
16.基材がガラス又はプラスチック材料である、条項1から14までのいずれか一項に記載の方法。
17.透明導電性酸化物又は半導体層が、3%以下の酸素、2.5%以下の酸素、たとえば2.5%の酸素、2.5%未満の酸素、又は1.5%以下の酸素を含む雰囲気中で、2mTorr~5mTorr又は3mTorr~4mTorrの圧力で、150nm~400nm若しくは200nm~300nmの範囲、又は250nmの厚さを有する層内に堆積されたインジウム・スズ酸化物を含む、条項1又は2に記載の方法。
18.パルスが単一パルスである、条項1から17までのいずれか一項に記載の方法。
19.
a.基材と、
b.基材の少なくとも一部分の上の透明導電性酸化物又は半導体を含む層とを含み、この層が、第1のシート抵抗を有する第1の副層と、第1の副層の真上に位置し、第1のシート抵抗より低い第2のシート抵抗を有する第2の副層とを含む、
透明物品。
20.透明導電性酸化物又は半導体が、インジウム・スズ酸化物を含む、条項19に記載の方法。
21.透明導電性酸化物又は半導体を含む層が、300nm~2μmの範囲の厚さを有する、条項20に記載の方法。
22.透明導電性酸化物層を含む被覆基材を作製する方法であって、
a.基材上に薄層のスタックを堆積させるステップであり、スタックが、基材の少なくとも一部分の上に少なくとも透明導電性酸化物層又は半導体層を含む、堆積させるステップと、
b.最高10ミリ秒のパルス長にわたって1J/cm2~10J/cm2の範囲の強度を有する可視スペクトル内の非コヒーレント光の単一のフラッシュによって、10℃~50℃又は20℃~30℃の範囲の温度で被覆基材をフラッシングするステップとを含み、光源と薄層のスタックとの間にマスクが配置され、したがってフラッシュの少なくとも一部分がマスキングされ、フラッシュからの光が、薄層のスタックに到達しないようにマスクによって部分的に阻止され、薄層のスタックの一部分のみに到達し、それによって薄層のスタック内に反射色、透過色、異なるシート抵抗、及び/又は放射率のパターンを生じさせる、方法。
Claims (19)
- 透明導電性酸化物又は半導体を含む層を含む被覆基材を作製する方法であって、
a.不活性雰囲気中で基材の少なくとも一部分の上に、少なくとも1,000cm-1の可視スペクトル内の波長の吸収係数を有する透明金属酸化物又は半導体層を堆積させるステップと、
b.前記可視スペクトル内の前記波長で前記層が少なくとも1,000cm-1の吸収係数を有する光を含む前記可視スペクトル内の非コヒーレント光の3.5J/cm2~6.0J/cm2の範囲のパルスによって、15℃~40℃の範囲の温度で前記透明導電性酸化物又は半導体層の少なくとも一部分をフラッシングするステップとを含み、
前記パルスが、前記透明導電性酸化物又は半導体の分割層をもたらす前記層の厚さより小さい前記層内の侵入深さを有し、前記分割層の各層が、異なる物理的特性を有する、方法。 - 前記パルスが、4.0J/cm2~5.0J/cm2の範囲である、請求項1に記載の方法。
- 前記透明導電性酸化物又は半導体層が、透明導電性酸化物を含む、請求項1に記載の方法。
- 前記透明導電性酸化物が、チタン、ハフニウム、ジルコニウム、ニオブ、亜鉛、ビスマス、鉛、インジウム、スズ、及びこれらの混合物の酸化物である、請求項3に記載の方法。
- 前記透明導電性酸化物が、インジウム・スズ酸化物、インジウム亜鉛酸化物、アルミニウム亜鉛酸化物、亜鉛スズ酸化物、インジウム・カドミウム酸化物、カドミウム・スズ酸化物、スズ酸バリウム、バナジン酸ストロンチウム、又はバナジン酸カルシウムである、請求項3に記載の方法。
- 前記透明導電性酸化物が、2mTorr~5mTorrの雰囲気中で堆積される、請求項3に記載の方法。
- 前記透明導電性酸化物が、3(体積)%以下の酸素を含む雰囲気中で堆積される、請求項3に記載の方法。
- 前記透明導電性酸化物が、インジウム・スズ酸化物である、請求項3に記載の方法。
- 前記インジウム・スズ酸化物が、2.5%未満の酸素を有する不活性雰囲気中で、2mTorr~5mTorrの範囲の圧力で堆積され、且つ/又は前記インジウム・スズ酸化物が、150nm~400nmの範囲の厚さを有する層内で堆積される、請求項8に記載の方法。
- 前記インジウム・スズ酸化物が、300nm~2μmの範囲の厚さを有する層内に堆積され、フラッシュの侵入深さが、インジウム・スズ酸化物層の前記厚さより小さく、前記透明導電性酸化物又は半導体の分割層をもたらし、前記分割層の各層が、異なる物理的特性を有する、請求項8に記載の方法。
- 前記透明導電性酸化物又は半導体層が、酸素が欠乏している透明導電性酸化物を含む、請求項1に記載の方法。
- 前記基材が透明である、請求項1に記載の方法。
- 前記基材がガラス又はプラスチック材料である、請求項1に記載の方法。
- 前記透明導電性酸化物又は半導体層が、3%以下の酸素を含む雰囲気中で150nm~400nmの範囲の厚さを有する層内に堆積されたインジウム・スズ酸化物を含む、請求項1に記載の方法。
- 前記パルスが単一パルスである、請求項1に記載の方法。
- 光源と前記層のスタックとの間にマスクが配置され、したがって前記フラッシュの少なくとも一部分がマスキングされ、前記フラッシュからの光が、前記層のスタックに到達しないように前記マスクによって部分的に阻止され、前記層のスタックの一部分のみに到達し、それによって前記層のスタック内に反射色、透過色、異なるシート抵抗、及び/又は放射率のパターンを生じさせる、請求項1に記載の方法。
- a.基材と、
b.前記基材の少なくとも一部分の上の透明導電性酸化物又は半導体を含む層とを含み、前記層が、第1のシート抵抗を有する第1の副層と、前記第1の副層の真上に位置し、前記第1のシート抵抗より低い第2のシート抵抗を有する第2の副層とを含む、
透明物品。 - 前記透明導電性酸化物又は半導体が、インジウム・スズ酸化物を含む、請求項17に記載の物品。
- 前記透明導電性酸化物又は半導体を含む層が、300nm~2μmの範囲の厚さを有する、請求項17に記載の物品。
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JP2020529387A (ja) | 2020-10-08 |
BR112020002324A2 (pt) | 2020-09-01 |
KR102611164B1 (ko) | 2023-12-07 |
KR20200038496A (ko) | 2020-04-13 |
MX2020001396A (es) | 2021-02-09 |
WO2019028287A1 (en) | 2019-02-07 |
US20190041550A1 (en) | 2019-02-07 |
SG11202000983PA (en) | 2020-02-27 |
CA3071967A1 (en) | 2019-02-07 |
ES2967924T3 (es) | 2024-05-06 |
EP3662521B1 (en) | 2023-10-11 |
EP3662521A1 (en) | 2020-06-10 |
AU2018310989A1 (en) | 2020-02-20 |
CN111149230B (zh) | 2023-09-19 |
CN111149230A (zh) | 2020-05-12 |
AU2018310989B2 (en) | 2023-06-22 |
CO2020002398A2 (es) | 2020-06-19 |
US12032124B2 (en) | 2024-07-09 |
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