JP6554899B2 - Contactless communication inlay - Google Patents

Description

  The present invention is used for asset management, visitor management, process management, article use history traceability, NFC content distribution service, store invitation promotion, smart poster, display card, social network service, various payments, identity authentication, etc. The present invention relates to a contactless communication inlay used for an information storage medium such as an IC tag and a contactless IC card.

  IC tags, non-contact IC cards, and IC tags that perform non-contact reading / writing of data from outside and power supply by electromagnetic waves or the like are widely used. For example, payment processing for product purchases can be performed using a non-contact IC card, or identity authentication can be performed using a non-contact IC card such as identification.

  An information storage medium such as a proximity type or proximity type IC tag or a non-contact type IC card includes an IC module mounted with an IC chip on which various electronic components for data storage, processing, and communication control are mounted, and a reader / writer coil. An inductive electromotive force is generated by a magnetic field generated from the antenna, and an inlet including an antenna that enables power supply and data reception / transmission is combined with an IC chip to manufacture an inlay covered with a resin sheet or the like. Then, an information storage medium such as an IC tag or a non-contact IC card is manufactured by incorporating the inlay into a plastic substrate or the like.

  In an electromagnetic induction communication system in an information storage medium such as an IC tag or a non-contact IC card, a magnetic field generated by a loop antenna on the reader / writer side of a device that performs data communication with the non-contact IC card is generated by the IC tag or the non-contact IC card. An induced electromotive force is generated by passing through a closed loop circuit such as a coil antenna incorporated in the information storage medium.

  With the induced electromotive force, power is supplied to an IC chip built in an information storage medium such as an IC tag or a non-contact IC card, so that the IC chip is operated to communicate with a reader / writer.

  The non-contact IC card increases the sensitivity to a specific frequency by connecting a capacitor to the coil antenna and causing it to resonate. And in order to adjust the resonance frequency to a specific frequency, the electrostatic capacity adjustment means is provided like patent document 1. FIG.

  In Patent Document 1, as a capacitance adjusting means, a coil antenna is installed on one side of a substrate, and a comb-shaped third conductor and a fourth conductor are arranged with a narrow gap on one side of the substrate. Capacitance adjusting means constituted by arranging them alternately was provided.

  The resonance frequency is adjusted by appropriately changing the capacitance of the capacitor remaining without being divided by separating an appropriate portion of the capacitors for adjusting the capacitance arranged in parallel with the capacitance adjusting means. be able to.

JP 2004-287968 A

  Many coil antennas embedded in IC tags and non-contact IC cards are manufactured by bonding a metal foil onto a resin film and patterning it by etching or the like, and winding a metal wire in a coil shape multiple times. The coil antenna that was used is used.

  An information storage medium such as an IC tag or a non-contact IC card is an information storage medium such as an IC tag or a non-contact IC card that is further post-processed on an inlet in which an IC chip is mounted on a substrate on which a coil antenna is formed. The product is formed.

  In non-contact IC cards, insulating materials such as PET, PET-G, PVC, PC and other resin materials or paper materials are integrated on the front and back of the inlet mainly by heat fusion, adhesive, etc. Is manufactured.

  In the case of an IC tag, there is a degree of freedom in shape, and the content of post-processing varies depending on the product, such as forming into a thin card type by post-processing, forming into a label shape, or integrally molding with resin.

  However, when these post-processing is performed, there is a problem that the resonance frequency of the coil antenna system connected to the capacitor changes. The main causes are the inductance change due to the deformation of the coil antenna and the influence of the electrical characteristics (dielectric constant, dielectric loss) of the insulating material covering the inlet.

  The cause of coil antenna deformation is that both IC tags and non-contact IC cards are manufactured by heating and pressurizing to a temperature that softens the resin during processing, but the coil antenna deforms due to stress during processing. .

  In the technique of Patent Document 1, in order to correct the change in the resonance frequency of the coil antenna system, a film-like coil antenna is formed on one side of the substrate, and the comb-shaped antenna is arranged oppositely on the one side of the substrate. The electrostatic capacity adjusting means is formed by alternately arranging the third conductor and the fourth conductor having a narrow gap.

  In other words, a pattern of capacitance adjustment means is provided on a part of a film-like coil antenna, and the resonance frequency deviates from the design value after a product of an information storage medium such as an IC tag or non-contact IC card is completed by post-processing. In this case, the resonance frequency is changed by trimming the pattern of the capacitance adjusting means as much as necessary.

  However, after manufacturing the contactless communication inlay by laminating the inlet with an insulating material, the insulating material covering the inlet is removed when processing the pattern of the capacitance adjusting means on the inlet for frequency adjustment. Since processing is necessary, there is a problem that frequency adjustment is not easy.

  In addition, since it is necessary to provide a capacitance adjusting means pattern with a large dimension on the side of the coil antenna, the size of the antenna system cannot be reduced, and there is a problem that it is difficult to design the antenna system of the information storage medium.

  In particular, even when trying to reduce the size of the antenna system used for the information storage medium, there is a problem that the size of the pattern of the capacitance adjusting means becomes a large obstacle in the antenna system.

Therefore, an object of the present invention is to provide an IC tag having a capacitance adjusting means that can easily adjust the frequency even after manufacturing a non-contact communication inlay in which an inlet is covered with an insulating material and does not become an obstacle in an antenna system. And providing an information storage medium such as a non-contact IC card.

The present invention, in order to solve the above problems, IC module in which an IC chip is mounted is, the inlet coil antenna is wired on a substrate, the sheet comprising a more joined to the antenna bonding pattern, cavity is A non-contact communication inlay formed by sandwiching and laminating the sheet between a provided first resin sheet and a second resin sheet, wherein a capacitance adjusting conductive pattern is formed on a lower surface of the substrate of the IC module. It is formed in series or in parallel with the capacitance of the IC chip through a through hole provided in the substrate, and the capacitance adjusting conductive pattern is inserted through the hole portion of the first resin sheet. A non-contact communication inlay that is exposed to the outside and has a space width adjacent to the line width of the capacitance adjustment conductive pattern that is 1 mm or less. .

  With this configuration, according to the present invention, after the non-contact communication inlay is manufactured by bonding the resin sheet to the inlet, the redundant conductive pattern exposed outside the non-contact communication inlay is electrically connected in series or in parallel to the IC chip. Since the capacitance of the resonance circuit can be changed by connecting to, the resonance frequency can be easily adjusted.

  In addition, the present invention is the non-contact communication inlay described above, wherein the capacitance adjusting conductive pattern is formed in a zigzag shape that does not overlap on the substrate. .

  The present invention is the non-contact communication inlay described above, wherein the capacitance adjusting conductive pattern has a folded spiral shape.

  Moreover, the present invention is the non-contact communication inlay described above, wherein the substrate is rectangular or elliptical.

  According to the present invention, after the non-contact communication inlay is manufactured by bonding the resin sheet to the inlet, the capacitance of the resonance circuit is changed by processing the redundant conductive pattern exposed outside the non-contact communication inlay. Therefore, the resonance frequency can be easily adjusted.

  In addition, since the present invention makes the thickness of the IC module the same as that of the inlet, there is an effect that an inlet having a small thickness can be formed. In addition, the configuration can prevent the unevenness of the non-contact communication inlay caused by embedding the IC module, and the non-contact communication inlay is processed into an information storage medium such as an IC tag or a non-contact IC card in a later process. There is an effect that the manufacturing restrictions due to the unevenness of the non-contact communication inlay can be eliminated.

  Further, according to the present invention, the electrostatic capacitance of the resonance circuit can be precisely adjusted by cutting the zigzag or folded spiral conductive pattern for capacitance adjustment formed on the lower surface of the IC module at an arbitrary position. effective.

Since the capacitance adjustment conductive pattern is formed on the lower surface of the IC module, it does not occupy a large capacitance adjustment area on the side of the coil antenna. For this reason, the capacitance adjusting means does not hinder the design of the antenna system of the non-contact communication inlay, and there is an effect that a non-contact communication inlay having an antenna system with a small size can be manufactured.

It is a schematic sectional drawing which shows the layer structure of the non-contact communication inlay of embodiment of this invention. FIG. 5 is a plan view of the inlet of the non-contact communication inlay according to the embodiment of the present invention as seen through the coil antenna and the IC module 2. (A) It is a top view of the upper surface of the IC module embedded in the non-contact communication inlay of the information storage medium of embodiment of this invention. (B) It is a top view of the lower surface of an IC module.

<First Embodiment>
Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. 1 to 3. An information recording medium such as an IC tag or a non-contact IC card is a non-contact communication inlay 1 in which a coil antenna 8 installed on a resin sheet 7 and an IC module 2 are connected and a resin sheet 6 is laminated and integrated. Form.

  An information recording medium such as an IC tag or a non-contact IC card is manufactured by processing the non-contact communication inlay 1 into a plastic substrate or the like. For example, in a non-contact IC card, a non-contact IC card is manufactured by laminating an outermost layer of the non-contact communication inlay 1 between insulating resin base materials.

(Non-contact communication inlay of information recording media)
FIG. 1 is a schematic cross-sectional view of a non-contact communication inlay 1 of an information storage medium such as an IC tag or a non-contact IC card according to the first embodiment of the present invention. 3A shows a top view of the IC module 2 embedded in the non-contact communication inlay 1, and FIG. 3B shows a bottom view thereof. FIG. 2 is a plan view of the inlet shown through the coil antenna 8 and the IC module 2.

  The non-contact communication inlay 1 of the information recording medium according to this embodiment includes a coil antenna 8 on a resin sheet 7 having the same thickness as the IC module 2 as shown in the side view of FIG. 1 and the plan view of the inlet of FIG. The installed inlet 10 is formed, and the IC module 2 is embedded in the hole formed in the inlet. An IC chip 3 is mounted on the IC module 2.

  Then, the coil antenna 8 of the inlet 10 is joined to the antenna joining patterns 4A and 4B of the IC module 2. The resin sheet 6 is laminated on the inlet 10 and the IC module 2 and integrated with the resin sheet 7 of the lower inlet 10 to form the non-contact communication inlay 1.

(Coil antenna)
The coil antenna 8 is configured by a general coil winding method such as a spiral shape. The coil antenna 8 may be a hollow winding antenna in which a metal wire having a self-bonding coating is wound a plurality of times in a desired hollow shape, or a drawing winding in which a coil is formed on a resin sheet while melting the self-bonding portion. A wire antenna, an etching antenna that forms a coil on a film, or the like can be used.

  The coil antenna 8 adjusts the inner diameter / outer diameter / thickness / number of turns so as to have an appropriate inductance value for the antenna system to have a desired resonance frequency in accordance with the capacitance value of the IC chip 3.

For example, as the coil antenna 8, a hollow coil having a size matching the shape of a non-contact IC card is installed. The size of the coil antenna 8 is about 47 × 7 according to the card shape.
A coil antenna 8 having 8 mm and 5 windings is installed.

(Resin sheet)
Polyethylene terephthalate (PET), PETG, polyvinyl chloride (PVC), polycarbonate (PC), or the like can be used as the material for the resin sheet 7 that supports the coil antenna 8 and the resin sheet 6 laminated thereon. . For example, a polycarbonate (PC) sheet can be used.

  In the resin sheet 7 that supports the bottom of the coil antenna 8, a hole portion 7 A is formed in advance in the size of the substrate 11 of the IC module 2 so that the IC module 2 can be fitted therein.

  In the resin sheet 6 laminated on the coil antenna 8, a hole 6A is opened at a position where the IC chip 3 of the IC module 2 is disposed below the resin sheet 6, so that the IC chip 3 is fitted.

  And after connecting the coil antenna 8 installed on the resin sheet 7 and the IC module 2, the resin sheet 6 was placed, and pressure was applied from above the resin sheet 6 and below the resin sheet 7 with a hot press device. By performing the laminating process for heating for a predetermined time in the state, the non-contact communication inlay 1 in which the upper and lower resin sheets are bonded and integrated is obtained.

  In the laminating process, the surface of the resin sheet has no irregularities even after the laminating process in which the resin sheet is bonded by the hole part 7A formed in the resin sheet 7 and the hole part 6A formed in the resin sheet 6. A flat contactless communication inlay 1 can be formed.

(IC module)
FIG. 3A shows a top view of the substrate 11 of the IC module 2, and FIG. 3B shows a plan view of the bottom surface of the substrate 11. As the shape of the substrate 11 of the IC module 2, a rectangular substrate 11 as shown in FIG. 3 or a substrate 11 with a rectangular corner can be used, and an elliptical or circular substrate 11 is used. You can also.

(Capacitance adjustment means)
Capacitance adjustment by facing the folded conductive pattern 5 for capacitance adjustment to one of the two antenna bonding patterns 4A, 4B on the upper surface side of the substrate 11 of the IC module 2 via the substrate 11 of the IC module 2 Forming capacity for

  That is, antenna joining patterns 4A and 4B are formed on the upper surface of the substrate 11 of the IC module 2 as shown in FIG. 3A, and the lower surface of the substrate 11 is folded in a zigzag manner as shown in FIG. A capacitance adjusting conductive pattern 5 is formed. Capacitance adjustment using the electrostatic capacity adjustment conductive pattern 5 having a zigzag pattern by forming a capacity by making the capacitance adjustment conductive pattern 5 face the antenna joint pattern 4A via the substrate 11. Configure the means.

  The capacitance adjusting conductive pattern 5 is opposed to the antenna joint pattern 4A and connected to the other antenna joint pattern 4B through the through hole 9. That is, both ends of the capacitance adjusting conductive pattern 5 are electrically connected to the antenna bonding pattern 4B through the through holes 9.

  The capacitance adjusting conductive pattern 5 may be made to face one of the antenna bonding patterns 4A or 4B. The capacitance adjusting conductive pattern 5 is made to face the antenna bonding pattern 4B, and the capacitance adjusting conductive pattern 5 5 may be connected to the antenna bonding pattern 4A through the through hole 9.

  The shape of the capacitance adjusting conductive pattern 5 is a pattern that folds back multiple times as shown in FIG. 3B, and forms a zigzag folded pattern that does not overlap in the long side direction of the substrate 11.

  Further, the shape of the capacitance adjusting conductive pattern 5 is not limited to a zigzag folded pattern, and a folded spiral-shaped capacitance adjusting conductive pattern 5 can also be formed.

  The longer the length of the folded electrostatic capacitance adjusting conductive pattern 5 is, the larger the capacitance value of the capacitance adjusting means becomes, and the resonance frequency can be shifted to the low frequency side in a wide frequency range.

  Further, if the adjacent space width of the capacitance adjusting conductive pattern 5 is narrowed to 1 mm or less, the area of the capacitance adjusting conductive pattern 5 can be increased correspondingly, and the capacitance value of the capacitance adjusting means is increased. Thus, the resonance frequency can be shifted to the low frequency side in a wide frequency range.

  Further, by making the line width of the capacitance adjustment conductive pattern 5 1 mm or less, it becomes easy to cut for capacitance adjustment, and the cut position of the capacitance adjustment conductive pattern 5 is fine accuracy of 1 mm or less. By cutting with, there is an effect that the capacitance can be adjusted with high accuracy.

  Therefore, it is desirable that the space width adjacent to the line width of the capacitance adjustment conductive pattern 5 is 1 mm or less.

  By providing a margin in the line / space width of the capacitance adjusting conductive pattern 5, the capacitance adjusting conductive pattern 5 can be manufactured at low cost. For example, when forming the 5-fold folded capacitance adjustment conductive pattern 5 in which the line / space width of the capacitance adjustment conductive pattern 5 is 0.2 mm / 0.2 mm, the capacitance adjustment conductive pattern It is desirable that the width of the space adjacent to the line width of 5 is 0.1 mm or more because the pattern can be easily manufactured.

  The IC module 2 is manufactured by bonding electronic components such as the IC chip 3 on the terminal patterns such as the antenna bonding patterns 4A and 4B formed on the upper surface of the substrate 11 by resistance welding or ultrasonic mounting. In the subsequent manufacturing process of the non-contact communication inlay 1 of the information recording medium, both ends of the coil antenna 8 are joined to the antenna joining patterns 4A and 4B of the IC module 2.

(IC module substrate)
A hard rigid substrate or a soft flexible film substrate is used as the substrate 11 of the IC module 2. As a material of the substrate 11 in the case of using a rigid rigid substrate for the substrate 11, an epoxy resin substrate containing glass fiber such as FR4 or a ceramic substrate can be used.

  As a material of the substrate 11 when a flexible film substrate is used for the substrate 11, a resin film such as polyimide, polyethylene terephthalate (PET), or polyethylene naphthalate (PEN) can be used.

  The dielectric constant of the material of these substrates 11 is between the capacitance adjusting conductive pattern 5 of the capacitance adjusting means and the antenna joint pattern 4A, and forms the capacitance of the capacitance adjusting means. For the dielectric constant and thickness of the substrate 11, an appropriate material is selected so as to appropriately form the capacitance of the capacitance adjusting means.

  The material of the substrate 11 may be a non-contact IC card or an IC tag by a bonding process of the IC chip 3 to the substrate 11, a bonding process of the coil antenna 8 to the antenna bonding patterns 4A and 4B, and a subsequent manufacturing process. In order to prevent the quality from deteriorating due to the manufacturing process in the subsequent process of manufacturing, it is desirable to have heat resistance of 150 ° C. or higher.

  The capacitance used by the capacitance adjusting means is adjusted by adjusting the areas of the capacitance adjusting conductive pattern 5 and the antenna bonding pattern 4A that are opposed to each other with the substrate 11 interposed therebetween.

  The thickness of the substrate 11 is 50 μm or more and 200 μm or less in order to manufacture a non-contact IC card or an IC tag using the non-contact communication inlay 1 of the information recording medium, because it is easy to handle in the manufacturing process. It is desirable to make it small. For example, a polyimide resin sheet having a thickness of 50 μm can be used.

  Method for forming antenna bonding patterns 4A and 4B formed on the upper surface of substrate 11, terminal patterns for bonding other electrodes of other IC chips, conductive pattern 5 for adjusting capacitance, etc. formed on the lower surface of substrate 11 The pattern can be formed by a method of forming a copper foil by punching, a method of forming by patterning by etching, or other methods such as additive plating or conductor printing.

  The conductors such as the antenna bonding patterns 4A and 4B formed on the upper surface of the substrate 11 and the conductive pattern 5 for capacitance adjustment formed on the lower surface of the substrate 11 have a thickness of about 100 μm or less. For example, after adhering a copper foil having a thickness of 20 μm on both surfaces of the substrate 11, a resist is applied, and a conductive pattern 5 for adjusting capacitance is formed on the substrate 11 through an exposure, development, and etching process. Is desirable.

  The antenna bonding patterns 4A and 4B formed on the upper surface of the substrate 11 are made of gold on the surface of the pattern in order to bond the terminals of electronic components such as the coil antenna 8 and the IC chip 3 by resistance welding or ultrasonic mounting. Plating can be applied.

  For example, after a nickel plating layer is applied on a copper conductor pattern by about 1 μm to 5 μm, a gold plating layer having a thickness of about 0.01 μm to 0.5 μm is formed by electrolytic gold plating or electroless gold plating. Is desirable.

(IC chip)
As the IC chip 3, an IC chip 3 for a non-contact IC card or an IC chip 3 for an IC tag is used. As the shape of the IC chip 3, an IC chip 3 such as a bare chip shape, a package module shape, or a chip size package (CSP) shape can be used.

  In addition to the IC chip 3, a capacitor may be mounted on the IC module 2. As a capacitor in this case, for example, a multilayer ceramic chip capacitor is used.

  When it is desired to keep the size of the information recording medium to be manufactured, there is a method of joining the bare chip-shaped IC chip 3 to the substrate 11 by flip chip mounting. As a flip chip mounting method, anisotropic conductive paste (film) mounting, non-conductive paste, ultrasonic bonding, or the like can be used.

  The IC chip 3 having a package shape or chip size package shape is joined to a terminal on the substrate 11 by soldering or reflow soldering.

A COB (chip on board) module can also be formed on the substrate 11. For example, the bare chip-shaped IC chip 3 can be ultrasonically bonded to the electrode terminal of the substrate 11.

(Coil antenna joint to antenna joint pattern)
As a method of joining the coil antenna 8 to the antenna joining patterns 4A and 4B of the IC module 2, it is possible to join using resistance welding, ultrasonic welding, solder joining, silver paste, or the like. For example, the coil antenna 8 is joined to the antenna joining patterns 4A and 4B by resistance welding.

  In the method of joining the coil antenna 8 to the antenna joining patterns 4A and 4B by resistance welding, a current of about several kiloamperes is applied to a high resistance chip such as tungsten of a resistance welding apparatus. Thereby, the high resistance chip of the resistance welding device generates heat, and the high resistance chip is brought into contact with the end of the coil antenna 8 installed on the antenna bonding pattern 4A or 4B.

  When the coil antenna 8 in which a copper wire is coated with an insulating resin is used as the coil antenna 8 and the surface of the antenna bonding patterns 4A and 4B is plated with gold, the following processing is performed.

  That is, a high-temperature high-resistance chip of a resistance welding apparatus is brought into contact with the coil antenna 8 and pressed against the antenna bonding pattern 4A or 4B to apply pressure. Thereby, the insulating resin that covers the copper wire of the coil antenna 8 is melted and vaporized, and the copper wire of the coil antenna 8 is exposed. And the copper of the copper wire and the gold plating layer on the surface of the antenna bonding pattern 4A or 4B are alloyed. Thereby, the coil antenna 8 is metal-bonded to the antenna bonding pattern 4A or 4B.

(Production of contactless communication inlays)
The coil antenna 8 thus placed on the resin sheet 7 is connected to the antenna joining patterns 4A and 4B of the IC module 2, the resin sheet 6 is placed, and the upper resin sheet 6 and the lower resin sheet 7 are bonded together. An integrated non-contact communication inlay 1 is manufactured.

  In the non-contact communication inlay 1 manufactured in this way, the lower surface of the substrate 11 of the IC module 2 is exposed on the lower surface of the resin sheet 7 below the hole 7A. Therefore, the capacitance adjusting conductive pattern 5 on the lower surface of the substrate 11 is exposed on the lower surface of the non-contact communication inlay 1 through the hole portion 7 </ b> A of the resin sheet 7.

  Thereby, the capacitance adjusting conductive pattern 5 on the lower surface of the substrate 11 can be easily processed even after the non-contact communication inlay 1 is manufactured. Therefore, the electrostatic capacity adjustment formed by making the electrostatic capacity adjusting conductive pattern 5 and the antenna joint pattern 4A face each other by cutting a necessary portion of the electrostatic capacity adjusting conductive pattern 5 of the electrostatic capacity adjusting means. There is an effect that the processing for adjusting the capacity of the means can be easily performed.

  As described above, in the non-contact communication inlay 1 for an information storage medium such as an IC tag or a non-contact IC card according to the present embodiment, the non-contact communication inlay 1 is built in after the non-contact communication inlay 1 is completed. Since the capacitance of the resonance circuit composed of the coil antenna 8 and the like can be easily variably adjusted, it is easy to adjust to correct the fluctuation of the resonance frequency of the resonance circuit due to the inductance change due to the deformation of the coil antenna 8. There is an effect that can be done.

Furthermore, in the non-contact communication inlay 1 of the information storage medium of the present embodiment, the capacitance of the resonance circuit can be adjusted by adjusting the capacitance adjusting conductive pattern 5 formed on the lower surface of the IC module 2. Therefore, the separate inlet 10 does not occupy an area for adjusting the capacitance on the side of the coil antenna 8, and the capacitance adjusting means has an effect of not hindering the antenna system of the non-contact communication inlay 1. .

  Therefore, there is an effect that the design for reducing the size of the antenna system of the inlet of the information storage medium can be easily performed.

  A polyimide resin sheet having a thickness of 50 μm is used as the substrate 11 of the IC module 2. Then, a copper foil having a thickness of 20 μm is etched on the lower surface of the substrate 11 so that the capacitance adjusting conductive pattern 5 is a 5-fold pattern with a line / space width of 0.2 mm / 0.2 mm. Formed with. The bare chip-shaped IC chip 3 was ultrasonically bonded to the electrode terminal on the upper surface of the substrate 11.

  The dimension of the coil antenna 8 was about 47 × 78 mm, the number of windings was 5, and a polycarbonate (PC) resin sheet 7 having a thickness of 90 μm was used as the resin sheet 7 that supports the bottom of the coil antenna 8. Then, the coil antenna 8 was joined to the antenna joining patterns 4A and 4B on the upper surface of the substrate 11 of the IC module 2 by resistance welding.

  A non-contact communication inlay in which a resin sheet 6 made of polycarbonate (PC) having a thickness of 90 μm is laminated on the coil antenna 8 by a laminating process of heating and pressurizing for a predetermined time with a hot press device. 1 was obtained.

  In this non-contact communication inlay 1, when the capacitance of the capacitance adjusting means formed by opposing the capacitance adjusting conductive pattern 5 and the antenna joint pattern 4A is maximized, the coil antenna 8 and the IC chip 3 connected to the coil antenna 8 are connected. The resonance frequency due to the capacitance of and the capacitance of the capacitance adjusting means was 13.95 MHz.

  Further, when all of the capacitance adjusting conductive patterns 5 of the capacitance adjusting means were removed, the resonance frequency due to the capacitance of the IC chip 3 and the capacitance of the capacitance adjusting means was 14.52 MHz.

  That is, the capacitance adjusting means of the present embodiment sets the resonance frequency due to the capacitance of the coil antenna 8 and the IC chip 3 connected thereto to a frequency range of 13.95 MHz to 14.52 MHz and a frequency width of 0.57 MHz. The ability to adjust the resonance frequency within the range was obtained. In order to shift the resonance frequency to the high frequency side, the capacitance adjusting conductive pattern 5 on the lower surface of the substrate 11 of the IC module 2 exposed on the lower surface of the non-contact communication inlay 1 may be cut.

  The resonance frequency value can be easily adjusted by processing the capacitance adjusting conductive pattern 5 exposed on the lower surface of the non-contact communication inlay 1.

  The present invention is characterized in that the capacitance adjusting conductive pattern 5 is formed on the lower surface of the substrate 11 of the IC module 2 and exposed on the lower surface of the non-contact communication inlay 1. The capacitance adjusting conductive pattern 5 is opposed to the antenna bonding pattern 4A formed on the upper surface of the substrate 11.

  The capacitance adjusting conductive pattern 5 may not necessarily be directly connected to the antenna bonding pattern 4 </ b> B, and the capacitance adjusting conductive pattern 5 may be bonded to a terminal pattern formed on the substrate 11. By electrically connecting the electrode of the IC chip 3 to the terminal pattern, it is possible to form a capacitance adjusting means for adjusting the frequency of the resonance circuit formed by the IC chip 3.

  That is, the adjustment capacitance is formed by making the antenna bonding pattern 4A formed on the substrate 11 and the capacitance adjustment conductive pattern 5 face each other, and the capacitance adjustment conductive pattern 5 is processed to form an IC. Capacitance adjustment means for adjusting the capacitance connected to the resonance circuit of the chip 3 can be formed.

  The capacitance adjusting means is configured such that the capacitance adjusting conductive pattern 5 which is a redundant conductive pattern exposed outside the non-contact communication inlay is connected in series to the electric circuit of the IC chip 3 through the through hole 9. Connect in parallel. Thereby, the circuit for changing the capacitance of the resonance circuit is formed by processing the conductive pattern 5 for adjusting the capacitance.

  By using the capacitance adjusting means configured as described above, there is an effect that the resonance frequency can be easily adjusted.

DESCRIPTION OF SYMBOLS 1 ... Non-contact communication inlay 2 ... IC module 3 ... IC chip 4A, 4B ... Antenna junction pattern 5 ... Electrostatic capacity adjustment conductive pattern 6 ... Resin sheet 6A ... Hole 7 ... Resin sheet 7A ... Hole 8 ... Coil antenna 9 ... Through hole 10 ... Inlet 11 ... Substrate

Claims (4)

IC module in which an IC chip is mounted is, the inlet coil antenna is wired on a substrate, the sheet comprising a more joined to the antenna bonding pattern, cavity the first resin sheet and the second provided a contactless communication inlay formed by laminating by sandwiching the sheet with a resin sheet, the capacitance adjustment conductive pattern on the lower surface of the substrate of the IC module through a through hole provided in said substrate is formed on the capacitor and electrically in series or in parallel of the IC chip, the and the capacitance adjustment conductive pattern is exposed to the outside through the air hole of the first resin sheet, the electrostatic capacitance adjustment A non-contact communication inlay characterized in that the space width adjacent to the line width of the conductive pattern is 1 mm or less .   2. The non-contact communication inlay according to claim 1, wherein the capacitance adjusting conductive pattern is formed in a zigzag folded shape having no overlap on the substrate.   2. The non-contact communication inlay according to claim 1, wherein the capacitance adjusting conductive pattern has a folded spiral shape. A contactless communication inlay according to any one of claims 1 to 3, the non-contact communication inlay, wherein the substrate is a rectangular or oval.

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