JP2012094948A - Inlet for non-contact communication recording medium, method of manufacturing the same, and non-contact communication recording medium - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inlet for non-contact communication recording medium and a method of manufacturing the same capable of adjusting a resonance frequency without making a manufacturing process be complicated by using an antenna circuit in which wires are formed on only one side of an insulation film substrate.SOLUTION: In an inlet for non-contact communication recording medium, an antenna circuit has: an insulation film substrate 2 for the antenna circuit; a loop antenna 3 consisting of wound line patterns formed on one side of the insulation film substrate 2; and six adjustment wires 4B, 4C, 4D, 4E, 4F, and 4G connected with the innermost line pattern and respectively having adjustment pads 4b, 4c, 4d, 4e, 4f, and 4g at their front ends. A strap substrate 6 has: an insulation film substrate 7 for the strap substrate; a first pad 8a and a second pad 8b formed on one side of the insulation film substrate 7; and a mounted IC chip 5. The first pad 8a is connected to a connection pad 4a, and the second pad 8b is connected to one selected adjustment pad, and thereby, a loop length can be adjusted.

Description

  The present invention relates to an inlet for a non-contact communication recording medium such as an IC card or an IC tag for performing data communication by connecting an IC chip and an antenna circuit and supplying power by wireless communication using electromagnetic waves transmitted from a reader / writer, and The present invention relates to a manufacturing method and a non-contact communication recording medium.

  In recent years, electronic payments and entrance / exit management using non-contact communication recording media such as non-contact IC cards and non-contact IC tags due to the sophistication of required security, the increase in information volume, and the ease of access by non-contact methods. Various system operations such as product information data management have been introduced.

  These non-contact communication recording media contain an inlet having an IC chip and an antenna circuit connected therein and having a function as a non-contact communication recording medium. A tuning circuit is formed in the inlet by the inductance of the antenna circuit and the capacitance inside the IC chip. In addition, when the capacitance necessary for tuning the target frequency cannot be obtained with only the IC chip, a method of adjusting the capacitance by forming an adjustment capacitor in the antenna circuit as described in Patent Document 1 is generally used. Known.

  4 and 5 are diagrams showing a representative example of a conventional contactless communication recording medium inlet in which an adjustment capacitor is formed. FIG. 4 is a sectional view and FIG. 5 is a plan view. 4 and 5, in the non-contact communication recording medium inlet 17, the IC chip 5 is connected to the loop antenna 13 made of a metal foil formed on the antenna circuit insulating film substrate 2 by the wire bonding mounting method or the flip method. Connected by chip mounting method. A jumper 16 is formed on the back surface of the antenna circuit insulating film substrate 2, and the front and back surfaces of the antenna circuit insulating film substrate 2 are opposed to the front electrode 15 a and the back electrode 15 b for constituting the adjustment capacitor 19. It is formed to do. By cutting these electrodes at arbitrary positions according to the characteristics of the IC chip, the area of the portion sandwiched between the front electrode 15a and the back electrode 15b and connected to the antenna is changed, and the capacitance of the adjustment capacitor 19 is adjusted. The resonance frequency can be adjusted.

  However, adding adjustment capacitors requires processing such as etching on both the front and back sides of the substrate, and requires an additional step of cutting the adjustment capacitor after mounting the IC chip. There is a problem that the increase and the manufacturing process become complicated.

  As methods for avoiding these problems, methods described in Patent Document 2 and Patent Document 3 described below are known as conventional techniques.

  In the method of Patent Document 2, a plurality of line patterns for loop length adjustment are formed in the antenna circuit in advance, and the inductance of the antenna circuit is adjusted by cutting one of the line patterns to obtain a desired resonance frequency. Is to get.

  In the method of Patent Document 3, a plurality of connection pads between the antenna circuit and the IC chip are formed at the tip of the inductance adjustment wiring drawn from different portions of the loop antenna, and the inductance of the antenna circuit is determined depending on the connection position of the IC chip. Is adjusted to obtain a desired resonance frequency.

JP 2000-331137 A JP 2001-251115 A JP 2006-217185 A

  The method of Patent Document 2 has the advantage that the adjustment capacitor can be omitted and the antenna circuit can be formed only on one side of the substrate, but the manufacturing process for cutting the antenna circuit cannot be omitted, and the manufacturing process becomes complicated. The problem cannot be solved.

  Further, the method according to Patent Document 3 has a problem that the installation position of the IC chip cannot be made constant. In the post-processing process, such as carding, a plurality of base materials are stacked on the inlet and processed into a non-contact communication recording medium. In general, a technique for reducing unevenness generated on the surface of a non-contact communication recording medium is known. In this case, if the position of the IC chip changes, it is necessary to change the hole position of the interior base material each time, and the manufacturing process becomes complicated.

  The present invention has been made to solve such problems, the problem of the present invention is to use an antenna circuit in which wiring is formed only on one side of an insulating film substrate, without complicating the manufacturing process, An object of the present invention is to provide an inlet for a non-contact communication recording medium capable of adjusting a resonance frequency, a method for manufacturing the same, and a non-contact communication recording medium including the inlet for the non-contact communication recording medium.

  In order to solve the above problems, an inlet for a non-contact communication recording medium according to the present invention is an inlet having an antenna circuit and a strap substrate installed on the antenna circuit, and the antenna circuit includes a first contact An insulating film substrate; a loop antenna comprising a wound line pattern formed on one side of the first insulating film substrate; and a connection pad formed at one end of the outermost line pattern of the loop antenna; And a plurality of adjustment wires connected to the innermost line pattern of the loop antenna, and adjustment pads formed at the tips of the adjustment wires, and the strap substrate has a second insulating property. A film substrate; a first pad and a second pad formed on one side of the second insulating film substrate; and the first pad and the second pad. And an IC chip mounted on the second insulating film substrate with a terminal connected thereto, the first pad being connected to the connection pad, and the second pad being the adjustment pad. The loop length of the loop antenna connected to the IC chip can be adjusted by selecting the adjustment pad connected to the second pad and connected to the second pad.

  Here, an adjustment pad is also formed in a part of the wound line pattern, and the second pad is the adjustment pad formed at the tip of the adjustment wiring or the wound line. You may connect to one of the pads for adjustment formed in a part of pattern.

  In addition, the inductance of the antenna circuit may be adjusted by selecting the adjustment pad connected to the second pad so that the resonance frequency of the antenna circuit connected to the IC chip can be adjusted.

  A non-contact communication recording medium according to the present invention includes the above-described inlet for a non-contact communication recording medium.

  A method for manufacturing an inlet for a non-contact communication recording medium according to the present invention is a method for manufacturing an inlet having an antenna circuit and a strap substrate placed on the antenna circuit. A loop antenna formed of a wound line pattern on one side of an insulating film substrate, a connection pad disposed at one end of the outermost line pattern of the loop antenna, and an innermost line pattern of the loop antenna Forming a plurality of connected adjustment wirings and an adjustment pad disposed at a tip of the adjustment wiring, wherein the manufacturing process of the strap substrate is performed on one side of the second insulating film substrate. Forming a first pad and a second pad; and connecting the terminals to the first pad and the second pad, respectively, and the second insulating film. Mounting an IC chip on the other surface of the plate, connecting the first pad to the connection pad, and selecting one of the adjustment pads to connect to the second pad. Thus, the loop length of the loop antenna connected to the IC chip is adjusted.

  Here, an adjustment pad is formed on a part of the wound line pattern, and an adjustment pad formed on a tip of the adjustment wiring or an adjustment formed on a part of the wound line pattern One of the pads may be selected and connected to the second pad.

  As described above, the inlet for the non-contact communication recording medium of the present invention uses a strap mounting method, and the loop length of the loop antenna can be adjusted by changing the connection position between the antenna circuit and the pad of the strap substrate. is there.

  In the strap mounting method, a strap substrate having an IC chip mounted on a thin insulating film substrate having a plurality of pads is disposed on an antenna circuit, and the pads provided on the strap substrate and the pads provided on the antenna circuit are arranged. It is a method of connecting and configuring the inlet.

  In the present invention, in order to make the loop length of the loop antenna of the antenna circuit variable, a loop antenna having a plurality of adjustment wirings and an adjustment pad at the tip thereof is formed, and the strap substrate is disposed on the antenna circuit. The second pad is formed so that the second pad of the strap substrate can be connected to an arbitrary adjustment pad of the antenna circuit. By selecting the adjustment pad to be connected to the second pad, the resonance frequency can be adjusted by making the inductance of the antenna circuit variable, so there is no need to mount an adjustment capacitor, and the insulating film substrate for the antenna circuit The wiring of the antenna circuit can be formed only on one side. Further, since there is an insulating film substrate for the strap substrate between the first and second pads of the strap substrate and the loop antenna, the connection pad, the adjustment wiring, and the adjustment pad of the antenna circuit, the strap substrate Everything except the connected pad is insulated between the antenna circuit and the antenna circuit, so there is no need to cut the loop antenna or the unconnected pad. Thereby, the resonance frequency can be easily adjusted at a low cost.

  As described above, according to the present invention, non-contact communication using an antenna circuit in which wiring is formed only on one surface of an insulating film substrate and adjusting the resonance frequency without complicating the manufacturing process. A non-contact communication recording medium provided with an inlet for a recording medium, a manufacturing method thereof, and an inlet for the non-contact communication recording medium can be obtained.

Sectional drawing which shows one Embodiment of the inlet for non-contact communication recording media by this invention. The top view which shows one Embodiment of the inlet for non-contact communication recording media by this invention. Sectional drawing which shows the modification of the inlet for non-contact communication recording media of this Embodiment. Sectional drawing which shows the typical example of the inlet for non-contact communication recording media in which the conventional capacitor for adjustment was formed. The top view which shows the typical example of the inlet for non-contact communication recording media which formed the capacitor | condenser for adjustment conventionally.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1 and 2 are views showing an embodiment of an inlet for a contactless communication recording medium according to the present invention. FIG. 1 is a sectional view and FIG. 2 is a plan view. 1 and 2, the contactless communication recording medium inlet of the present embodiment is an inlet having an antenna circuit 1 and a strap substrate 6 installed on the antenna circuit 1, and the antenna circuit 1 An insulating film substrate 2 for antenna circuit, which is an insulating film substrate 1, a loop antenna 3 having a wound line pattern formed on one side of the insulating film substrate 2 for antenna circuit, Six adjustments having connection pads 4a formed at one end of the outer peripheral line pattern and adjustment pads 4b, 4c, 4d, 4e, 4f, 4g connected to the innermost peripheral line pattern of the loop antenna 3 Wiring 4B, 4C, 4D, 4E, 4F, 4G, and the strap substrate 6 is an insulating film for strap substrate which is a second insulating film substrate. Terminals are connected to the first substrate 8a, the second pad 8b, and the first pad 8a and the second pad 8b formed on one side of the insulating film substrate 7 for the strap substrate, the strap substrate, respectively. An IC chip 5 mounted on the insulating film substrate 7 for the strap substrate, the first pad 8a is connected to the connection pad 4a at the connection point 9a, and the second pad 8b is for adjustment at the connection point 9b. It is connected to the pad 4f.

  Here, the antenna film insulating film substrate 2 and the strap substrate insulating film substrate 7 are made of a general polymer film such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), or polypropylene (PP). However, the material is not particularly limited as long as it has insulating properties. The thickness of the insulating film substrate 2 for antenna circuit and the insulating film substrate 7 for strap substrate is arbitrary, but considering the restrictions on the strength and thickness required for the inlet, the insulating film substrate 2 for antenna circuit is About 20-100 micrometers, the insulating film board | substrate 7 for strap substrates has preferable about 20-50 micrometers.

  Also, the loop antenna 3, the connection pad 4a, the adjustment pads 4b, 4c, 4d, 4e, 4f, 4g, the adjustment wiring 4B, 4C, 4D, 4E, 4F, 4G, the first pad 8a, the second pad 8b can be formed of a metal foil. The material of the metal foil can be aluminum (Al), copper (Cu), etc., and the thickness can be arbitrarily set, but considering the required strength, electrical resistance, thickness restrictions, etc., 10 About ~ 100 μm is preferable. Loop antenna 3, connection pad 4a and adjustment pads 4b, 4c, 4d, 4e, 4f, 4g and adjustment wires 4B, 4C, 4D, 4E, 4F, 4G, first pad 8a and second pad 8b is formed by attaching a metal foil on the insulating film substrate 2 for antenna circuit or the insulating film substrate 7 for strap substrate, and then using a general printing method such as gravure printing, offset printing, or screen printing. A general method in which printing is performed and etching is performed can be used.

  When mounting the IC chip 5, in order to strengthen the electrical and physical bonding, adhesion for IC chips such as thermosetting pastes such as epoxy and acrylic, anisotropic conductive paste, anisotropic conductive film, etc. The adhesive 11 is used, and the first pad 8a and the second pad 8b are applied by a dispenser or printed by a printing method on the first pad 8a and the second pad 8b in a paste state, and by a flip chip mounting method through the bumps 10 of the IC chip 5 It is common to join. However, the method is not necessarily limited to this method, and an optimum method may be selected by a known method such as a wire bonding mounting method.

  The method of connecting the first pad 8a of the strap substrate 6 to the connection pad 4a of the antenna circuit 1 and the method of connecting the second pad 8b to the adjustment pad 4f of the antenna circuit 1 are not particularly limited, and caulking, heat sealing What is necessary is just to remove and connect the strap board insulating film substrate 7 of the connection portion by a known method. In the non-contact communication recording medium inlet shown in FIGS. 1 and 2, the second pad 8b is connected to the adjustment pad 4f at the connection point 9b. However, the adjustment pads 4b and 4c are adjusted according to the adjustment of the resonance frequency. Any one pad may be selected and connected from 4d, 4e, 4f, and 4g. Since the loop length of the loop antenna 3 changes depending on the selected pad, the inductance changes and the resonance frequency can be adjusted. For example, when it is desired to set the resonance frequency low, it is necessary to increase the loop length of the loop antenna 3, and therefore the adjustment pads 4c, 4e, 4g, etc. may be selected.

  FIG. 3 is a cross-sectional view showing a modification of the inlet for the non-contact communication recording medium of the present embodiment. In the non-contact communication recording medium inlet 12 of FIG. 3, a reinforcing plate 18 made of a metal such as a stainless steel material is installed on the IC chip 5 in order to improve durability against the external force of the IC chip 5. For bonding the reinforcing plate 18, an epoxy or acrylic reinforcing plate adhesive 14 is used. The thickness of the reinforcing plate 18 can be arbitrarily set, but is preferably about 30 to 300 μm in consideration of requirements for reinforcing strength and thickness.

  Needless to say, the present invention is not limited to the above-described embodiment, and the design can be changed according to the purpose and application. For example, the material, shape, arrangement, etc. of the insulating film substrate, loop antenna, each pad, adjustment wiring, etc. are not limited to the above embodiment, and various modifications are possible, and other functions, components, etc. Can also be added. In addition, the strap substrate is lengthened and arranged so as to reach the upper part of the loop antenna formed of the line pattern in which the second pad is wound, and the loop antenna is disposed below the second pad. An adjustment pad may be formed, and one of the adjustment pad formed on the tip of the adjustment wiring or the adjustment pad formed on the loop antenna may be selected and connected to the second pad.

DESCRIPTION OF SYMBOLS 1 Antenna circuit 2 Insulating film board | substrate 3 for antenna circuits, 13 Loop antenna 4a Connection pad 4b, 4c, 4d, 4e, 4f, 4g Adjustment pad 4B, 4C, 4D, 4E, 4F, 4G Adjustment wiring 5 IC chip 6 Strap substrate 7 Insulating film substrate for strap substrate 8a First pad 8b Second pad 9a, 9b Connection point 10 Bump 11 IC chip adhesive 12, 17 Non-contact communication recording medium inlet 14 Reinforcing plate adhesive 15a Front electrode 15b Back electrode 16 Jumper 18 Reinforcement plate 19 Adjustment capacitor

Claims (6)

  An inlet having an antenna circuit and a strap substrate placed on the antenna circuit, wherein the antenna circuit is a first insulating film substrate and a winding formed on one side of the first insulating film substrate. A loop antenna having a rotated line pattern, a connection pad formed at one end of the outermost line pattern of the loop antenna, and a plurality of adjustment wirings connected to the innermost line pattern of the loop antenna; And an adjustment pad formed at the tip of the adjustment wiring, the strap substrate being a second insulating film substrate and a first surface formed on one side of the second insulating film substrate. A pad and a second pad; and an IC chip mounted on the second insulating film substrate by connecting terminals to the first pad and the second pad, respectively. The first pad is connected to the connection pad, the second pad is connected to one of the adjustment pads, and the adjustment pad connected to the second pad is selected. An inlet for a non-contact communication recording medium, characterized in that the loop length of a loop antenna connected to the IC chip can be adjusted.   An adjustment pad is also formed on a part of the wound line pattern, and the second pad is one of the adjustment pad formed at the tip of the adjustment wiring or the wound line pattern. The contactless communication recording medium inlet according to claim 1, wherein the inlet is connected to one of the adjustment pads formed in the portion.   The resonance frequency of the antenna circuit connected to the IC chip can be adjusted by adjusting the inductance of the antenna circuit by selecting the adjustment pad connected to the second pad. Item 3. The inlet for a non-contact communication recording medium according to Item 1 or 2.   A non-contact communication recording medium comprising the inlet for the non-contact communication recording medium according to claim 1.   An inlet manufacturing method including an antenna circuit and a strap substrate installed on the antenna circuit, wherein the antenna circuit manufacturing process is based on a line pattern wound on one surface of a first insulating film substrate. A loop antenna, a connection pad disposed at one end of the outermost line pattern of the loop antenna, a plurality of adjustment wirings connected to the innermost line pattern of the loop antenna, and the adjustment wiring A step of forming an adjustment pad disposed at the tip, and the step of manufacturing the strap substrate includes the step of forming the first pad and the second pad on one side of the second insulating film substrate; A step of connecting a terminal to each of the first pad and the second pad and mounting an IC chip on the other surface of the second insulating film substrate, And adjusting the loop length of a loop antenna connected to the IC chip by selecting one of the adjustment pads and connecting the selected pad to the second pad. A method for manufacturing an inlet for a non-contact communication recording medium.   An adjustment pad is formed on a part of the wound line pattern, and an adjustment pad formed on a tip of the adjustment wiring or an adjustment pad formed on a part of the wound line pattern 6. The method of manufacturing an inlet for a contactless communication recording medium according to claim 5, wherein one of them is selected and connected to the second pad.

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