KR20100055735A

KR20100055735A - Method for manufacturing antenna for radio frequency identification

Info

Publication number: KR20100055735A
Application number: KR1020080114596A
Authority: KR
Inventors: 김용필
Original assignee: 강승오
Priority date: 2008-11-18
Filing date: 2008-11-18
Publication date: 2010-05-27

Abstract

PURPOSE: The RF ID production method for antenna forms the loop pattern without the via hole plating process. The fabrication cost reduces and environmental contamination is minimized. CONSTITUTION: The conductive metal foil is laminated in one side of the thin-film substrate(10). The antenna unit equipped with weld balls is formed. The insulating layer(30) is laminated on the loop(21) of the part crossing the second terminal(23) and the second terminal connection part(24) interval. The thin-film substrate is out cut according to the circumference of the second terminal connection part and the fold part is formed.

Description

RFID antenna manufacturing method {Method for Manufacturing Antenna for Radio Frequency Identification}

The present invention relates to a method of manufacturing an RFID (Radio Frequency Identification) antenna, and more particularly, to a manufacturing method of an RFID antenna applied to an RFID system installed in a limited space such as a mobile communication terminal, and a manufacturing process is simple. And to a method that can reduce the manufacturing cost.

As is widely known, smart cards equipped with electronic chips equipped with storage, computing and security functions are used to record or identify information in almost all fields of the information and communication society such as finance, communication, education, administration, and transportation. It is widely used in payment methods and ubiquitous such as electronic money, credit card or electronic bank account.

Smart cards are classified into various types according to their classification criteria, but may be classified into contact smart cards, contactless smart cards, and combined smart cards, depending on how the data is read.

The contact smart card refers to a form in which the electronic chip is activated by contacting the contact point of the electronic chip with the contact point of the interface device. In the contactless smart card, the operation element and the memory element required for the information processing function are the same as the contact type. It is a form of power supply through the antenna connected to the electronic chip and electromagnetic induction is used for communication with the interface device.Combined smart card is a smart card that supports both contact and non-contact functions. It is a smart card configured to share parts that can be shared in a contactless / contactless manner within an electronic chip of a chip.

Traditionally, smart cards were generally embedded in plastic cards such as credit cards and transportation cards. However, as smart card applications are expanded and various mobile communication terminals represented by mobile phones are becoming a necessity, plastic cards It has developed into a form that is embedded in a mobile communication terminal rather than a form.

As a representative example of applying a smart card to a mobile communication terminal, a non-contact smart card (or a combined card such as a combination card) is embedded in the mobile phone, so that the cellular phone can be pre-paid after a 13.56 MHz contactless wireless communication with a card reader. It is intended to be used for various purposes such as transportation fee payment, credit settlement, electronic bank account, loyalty management, and identity verification.

In addition to mounting a smart card (contactless smart card or combination card) that has a non-contact function in a mobile communication terminal, recently, an RFID reader that can read information recorded on an RFID tag is also equipped with a mobile terminal for reading an RFID tag. Also, a technology that can utilize the RFID reader is proposed, and a representative example in which an RFID reader is applied is not only a function of an RFID tag that is mounted on a mobile communication terminal and reads information stored through wireless communication with an external RFID reader, but also with an external RFID tag. A standard NFC (Near Field Communication) technology has also been proposed, which also serves as an RFID reader capable of reading information of an external RFID tag through wireless communication.

As the RFID system is integrated into the mobile communication terminal, the RFID mobile communication terminal needs to have an RFID system in addition to its own circuit. In general, in such an RFID mobile communication terminal, an electronic chip is installed in the main body of the mobile communication terminal and an antenna Is installed in the battery detachably mounted to the mobile communication terminal body.

In the case of a conventional credit card (or transportation card, etc.) in which an RFID system is mounted on a plastic card, since there are no elements in the card that interfere with the induced electromotive force of the antenna, only the copper coil has the desired antenna characteristics. The RFID antenna was relatively easy to design because it could be wound several times in a loop pattern. RFID antenna is also referred to as loop antenna because the copper wire is wound around the loop pattern several times to show the desired antenna characteristics.

However, in arranging an RFID antenna in a mobile communication terminal such as a cellular phone, it is necessary to minimize the influence of the electromagnetic shielding device applied to the mobile communication terminal on wireless communication of the RFID antenna in order to block the risk of electromagnetic waves. Due to the compactness, one of the trends of terminals, the RFID antenna is generally mounted on a battery.

In addition, even when the RFID antenna is installed in the battery of the mobile communication terminal, there is not enough space for the antenna to be placed in the battery. In order to reduce the occupied volume and increase the reliability of the product, the RFID antennas used in the mobile communication terminal are etched in a loop pattern on the copper foil (thin copper plate) laminated on the thin film substrate. Designing an antenna is common.

9 is a front and back schematic view of a conventional exemplary RFID antenna applied to a cell phone battery.

As shown, the conventional RFID antenna 100 is a copper foil (101, copper film: for example, about 35㎛ thickness) laminated on the front and back surfaces of the polyimide thin film substrate 110 (for example, about 25㎛ thickness) The antenna unit 120 is designed by etching a loop pattern, and the loop unit 121 and the first terminal unit 122 are formed on one side of the thin film substrate 110, and the other side of the thin film substrate 110 is formed. While forming the second terminal part 123, the via hole 111 is drilled in the thin film substrate 110 to plate copper in the via hole 111, and one end of the loop part 121 positioned on different surfaces. One end of the second terminal portion 123 is electrically connected.

A method of manufacturing the conventional RFID antenna 100 of FIG. 9 will be described with reference to FIG.

As shown, the conventional RFID antenna 100, with respect to the polyimide thin film substrate 110, the copper foil 101 is laminated on the entire surface of the front and rear surfaces (see A in Fig. 10), the loop portion 121 and Drilling the via hole 111 at a position corresponding to the connection point of the second terminal portion 123 (see FIG. 10B); The via hole 111 is copper plated to be disposed on the front and rear surfaces of the thin film substrate 110 to electrically connect the electrically disconnected loop part 121 and the second terminal part 123 (see FIG. 10C). ); Through the process of exposing, developing and etching the copper foil 101 on the surface and the back surface of the thin film substrate 110 using a photoresist film (photoresist) to match the pattern of the entire antenna unit 120, Forming a loop portion 121 and a first terminal portion 122 on the surface and forming the second terminal portion 123 on the back surface of the thin film substrate 110 (D of FIG. 10); And after coating (stacking) the polyimide cover sheet 130 (eg, 12.5 μm) on the front and rear surfaces of the thin film substrate 110 on which the antenna unit 120 is formed, the first terminal portion 122 and the second terminal portion 123. ) Forming terminals 122a and 123a in the step C), and pressing and removing unnecessary portions around the formed antenna 100 (Fig. 10E); Is prepared by.

In general, the conventional RFID antenna 100, after forming a plurality of antennas on the sheet-like large-scale thin film substrate 110, which can design a plurality of RFID antennas at the same time, finally pressing to fit the contour of the individual antenna unit 120 By cutting, a plurality of RFID antennas are produced at one time.

The conventional manufacturing process of the RFID antenna includes some additional processes in addition to the above-described main process, but the above manufacturing process outlines the processes in contrast to the features of the RFID antenna according to the present invention and is directly related to the present invention. Processes without these will be omitted.

In the manufacture of a conventional RFID antenna, a material (double-sided copper foil material) in which copper foils were laminated on both sides of the polyimide thin film substrate 110 was inevitably used. In the case of using a single-sided copper foil material, when the second terminal portion 123 is drawn out from the inside of the roof portion 121 to the outside, a short occurs because the loop portion 121 and the second terminal portion 123 cross each other. will be.

As a result, the conventional RFID antenna is a 'double-sided copper foil' material in order to avoid the short circuit occurring in the unavoidable cross wiring of the second terminal portion 123 and the roof portion 121 in the design of the loop antenna RFID antenna, For this reason, the complicated process of plating via holes and forming a via hole could not be avoided, and an expensive material in which copper foil was laminated on both sides of the thin film substrate may not be used to form the antenna unit 120 having the loop pattern. In addition, since much of the copper foil laminated on both sides is removed and discarded by etching, it is not only difficult to reduce the cost of the RFID antenna, but also causes waste of resources, environmental pollution, and increased wastewater treatment costs.

The inventors of the present invention, in order to solve the above-mentioned problems related to the RFID antenna of the loop pattern used in the limited space, the Republic of Korea Patent Application No. 10-2007-0027908 (file date: March 22, 2007: June 28, 2007 Patent No. 735618 has proposed a 'RFID antenna and a manufacturing method thereof.

An object of the present invention is to solve the above-mentioned problems related to the conventional RFID antenna of the loop pattern applied to a limited environment, such as a mobile communication terminal, the manufacturing process can be simplified to reduce the manufacturing cost, resource waste and environmental pollution An object of the present invention is to provide an RFID antenna manufacturing method that can minimize misunderstanding.

Another object of the present invention relates to an RFID antenna of a method of etching a metal foil (for example, copper foil) laminated on a thin film substrate to form a loop pattern, while using a material in which metal foil is laminated only on one side, such as via hole plating. By providing an RFID antenna manufacturing method capable of forming a short loop pattern without a complicated process, it is intended to reduce the manufacturing cost of the RFID antenna and minimize resource waste and environmental pollution.

According to the present invention, an RFID antenna manufacturing method is provided.

RFID antenna manufacturing method according to the invention, the step of laminating a conductive metal foil on one side of the thin film substrate perforated terminal exposure hole; The conductive metal foil is etched to form a loop portion, a first terminal portion extending outward from the loop portion so as not to intersect the loop portion and continuous to an outer end of the loop portion, and to the outside of the loop portion in an electrically disconnected state from the inner end of the loop portion. A second terminal portion formed in parallel with the first terminal portion, a second terminal portion connecting portion extending into the loop portion so as not to intersect the loop portion and being continuous with an inner end of the loop portion, and corresponding to the second terminal portion and the second terminal portion connecting portion Forming an antenna unit having welding holes formed at positions respectively; Stacking an insulating layer on the loop portion in a portion intersecting between the second terminal portion and the second terminal portion connecting portion; Forming a folding portion by cutting the thin film substrate along a circumference of the second terminal portion connecting portion to fold the second terminal portion connecting portion; Folding the folding part and overlapping the second terminal part and the second terminal part connection part so as to vertically coincide with the welding hole across the insulating layer to electrically connect each other; Stacking a cover sheet having a perforated terminal exposure hole on the antenna unit of the thin film substrate; Thermally bonding the thin film substrate and the cover sheet to fix the antenna unit therebetween, and welding the thin film substrate abutted through the welding hole; And cutting the circumference of the antenna unit to complete the RFID antenna. .

Preferably, the insulating layer may be formed by a stencil printing method in which a printing plate having a perforation corresponding to the position and size of the insulating layer is laminated on the antenna unit and then coated with an insulating material on the printing plate to cure.

The method of manufacturing an RFID antenna according to the present invention relates to manufacturing an RFID antenna mounted in a restricted environment such as a mobile communication terminal by etching the conductive metal foil stacked on the thin film substrate in a loop pattern. While the conductive metal foil is laminated, the loop pattern can be simply formed without a short and complicated via hole plating process, thereby significantly reducing the manufacturing cost and reducing resources and environmental pollution compared to the conventional RFID antenna. Can be minimized.

In the RFID antenna manufacturing method according to the present invention, when the folding portion is folded to electrically connect the second terminal portion and the second terminal portion connection portion, the welding holes are respectively provided at corresponding positions of the second terminal portion and the second terminal portion connection portion. By forming and allowing the thin film substrates to be welded to each other through the welding hole, it is possible to reliably ensure the electrical connection between the second terminal portion and the second terminal portion connecting portion which is not joined by soldering and is connected only by vertical overlap. Electrical resistance at the connecting portion of the second terminal portion and the connection portion of the second terminal portion can be minimized, and as a result, there is an effect of obtaining a normal induced electromotive force from the completed RFID antenna.

Hereinafter, a method of manufacturing an RFID antenna according to the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are merely illustrative of the RFID antenna manufacturing method according to the present invention, and are not intended to limit the scope of the present invention.

The RFID antenna 1 manufactured according to the present invention shown in Figs. 1 to 8 is mounted in a battery of a mobile communication terminal such as a mobile phone, for example, and is electrically connected to an electronic chip installed in the mobile communication terminal base. For example, RFID antenna that enables certain non-contact functions (e.g. payment of prepaid and post-paid transportation fee, credit settlement, electronic bank account, loyalty management, identity verification, etc.) to be realized through 13.56MHz short-range wireless communication, etc. to be.

The RFID antenna 1 manufactured according to the present invention structurally includes a thin film substrate 10, an antenna portion 20 formed by etching of a conductive metal foil 2, an insulating layer 30, and a cover sheet 40. The antenna unit 20 is structurally provided with a loop unit 21, a first terminal unit 22, a second terminal unit 23, a second terminal unit connection unit 24, and welding holes 25a and 25b. .

In manufacturing the RFID antenna 1, instead of manufacturing one by one, instead of forming a plurality of antennas 1 on the thin film substrate 10 having a constant length and width in which the conductive metal foils 2 are laminated, respectively, and finally, It is common to increase the manufacturing productivity by pressing and cutting the antenna (1) of the plurality of antennas (1) at the same time, the embodiment shown in the figure for the convenience of understanding the number of six antennas (1) It is assumed to manufacture at the same time.

As shown in FIG. 1, the first process of the present invention is a process of laminating the conductive metal foil 2 on one side (upper side in the figure) of the thin film substrate 10 on which the terminal exposure holes 11 are perforated.

As the thin film substrate 10, a substrate made of a thin sheet (eg, a thickness of about 25 μm) made of polyimide or the like can be used as in the conventional RFID antenna.

The terminal exposure holes 11 of the thin film substrate 10 are holes previously drilled in order to form the terminals 22a and 23a in the RFID antenna 1, so that the terminals 22a and 23a can be formed more easily. It is for.

Terminals 22a and 23a may be electrically connected to an electronic chip located in a main body of a mobile communication terminal by connecting the RFID antenna 1 to a battery of a mobile communication terminal such as a cellular phone, for example, by connecting a battery protection circuit. For example, tin copper plating or gold plating is applied to the ends of the first terminal portion 22 and the second terminal portion 23 so that the oxide film is not formed.

Therefore, the terminal exposure hole 11 of the thin film substrate 10 is a position corresponding to the terminals 22a and 23a formed at the ends of the first terminal portion 22 and the second terminal portion 23 in the final RFID antenna 1. In the illustrated example, two are drilled side by side at positions corresponding to the ends of the first terminal portion 22 and the second terminal portion 23.

As the terminal exposure hole 11 is drilled in advance on the thin film substrate 10, the thin film substrate 10 is not present in the portions of the terminals 22a and 23a in the first terminal portion 22 and the second terminal portion 23. Therefore, when forming the terminals (22a, 23a), it is possible to easily perform the operation of forming the terminal (plating operation, etc.) without a separate cumbersome process of peeling off the thin film substrate 10.

For the same reason as the terminal exposure hole 11 of the thin film substrate 10, the terminal exposure hole 41 is previously drilled in the cover sheet 40, which will be described again in the stacking process of the cover sheet 40.

Laminating the conductive metal foil 2 represented by copper foil on one side of the thin film substrate 10 may be performed by laminating and bonding the conductive metal foil 2 on one side of the thin film substrate 10.

As shown in FIG. 2, the second process of the present invention is a process of etching the conductive metal foil 2 stacked on one side of the thin film substrate 10 to form the antenna unit 20.

As the etching of the conductive metal foil 2, a conventional etching method applied to a conventional circuit board manufacturing technique or the like can be applied. The specific process of forming the antenna unit 20 by exposing, developing, and etching the conductive metal foil 2 is not directly related to the present invention, and a printed circuit board (PCB) manufacturing technology widely used in the related art is described. It can be applied and executed according to the specific description thereof will be omitted.

The antenna portion 20 formed by the etching of the conductive metal foil 2 is a single configuration which is formed in a loop pattern as a whole to generate a desired induced electromotive force, but structurally the loop portion 21 and the first terminal portion 22 And a second terminal portion 23, a second terminal portion connecting portion 24, and welding holes 25a and 25b.

The roof portion 21 is a portion in which the conductive metal foil 2 is spirally wired a plurality of times without being shorted, and the outer end 21a and the inside of the loop portion 21 located outside the roof portion 21 are formed. It has the inner end 21b located in. The outer end 21a and the inner end 21b mean both ends of the loop part 21.

The first terminal portion 22 extends to the outside of the roof portion 21 so as not to intersect the loop portion 21 by being continuous to the outer end 21a of the loop portion 21 without disconnection.

The second terminal portion 23 is formed in parallel with the first terminal portion 22 on the outside of the loop portion 21 in a state of being electrically disconnected from the inner end 21b of the loop portion 21.

The second terminal portion connecting portion 24 extends into the loop portion 21 so as not to intersect the loop portion 21 by being continuous to the inner end 21b of the loop portion 21 without interruption.

The second terminal part 23 should ultimately be electrically connected to the inner end 21b of the loop part 21. As described later, the second terminal part 23 is connected to the second terminal part connecting part 24. As a result, it is connected to the inner end 21b of the loop portion 21.

That is, in the antenna portion 20 formed by the present process, the second terminal portion 23 is not electrically connected to the inner end 21b of the loop portion 21 but is electrically disconnected so that the antenna portion 20 of the loop portion 21 is formed. Separately formed on the outside, the electrical disconnection of the inner end 21b of the roof portion 21 and the second terminal portion 23 is connected by the second terminal portion connecting portion 24 in a later process.

The welding holes 25a and 25b are formed at one end of the second terminal portion 23 and the end of the second terminal portion connecting portion 24 so that the second terminal portion 23 and the second terminal portion connecting portion 24 are secured without excessive electrical resistance. By being connected to each other, the resulting RFID antenna 1 serves to form the desired normal induced electromotive force, which will be described in more detail later.

According to the third process of the present invention, as shown in FIGS. 3 and 4, the insulating layer 30 is disposed on the loop portion 21 in a portion intersecting between the second terminal portion 23 and the second terminal portion connecting portion 24. Forming process.

The insulating layer 30 is electrically insulated from the loop portion 21 by the second terminal portion connection portion 24 when the second terminal portion connection portion 24 is electrically connected to the second terminal portion 23 across the loop portion 21. It acts to prevent shorting.

The method of forming the insulating layer 30 on the roof portion 21 of the corresponding part is not particularly limited, and as shown in FIGS. 3 and 4, for example, in the position and size where the insulating layer 30 is to be formed. After laminating the printing plate 50 having the perforated holes 51 formed on the antenna unit 20, a stencil printing method of applying an insulating material of, for example, a paint (ink) type on the printing plate 50, and applying it may be applied. Can be. That is, the insulating layer can be formed by heating in an oven or the like after printing the insulating layer 30 at the corresponding position with a thermosetting insulating ink using a stencil printing method.

Of course, a method of adhering an insulating sheet such as a polyimide sheet on the roof portion 21 of the corresponding part may also be applied, but in this case, the stencil printing method is preferable because the work productivity decreases.

In the fourth process of the present invention, as shown in FIG. 4, the foldable portion 12 that can fold the second terminal portion connecting portion 24 by cutting the thin film substrate 10 along the circumference of the second terminal portion connecting portion 24. ) Is the process of forming. In the illustrated embodiment, the thin film substrate 10 around the second terminal connection portion 24 forms a folding portion 12 that is cut in a ∩ shape and folds upward and downward. Reference numeral 13 is a cut line formed in the thin film substrate 10 in accordance with the formation of the folding portion (12).

The folding part 12 is for solving the electrical disconnection between the loop part 21 and the second terminal part 23 by folding the second terminal part connecting part 24 connected to the loop part 21 and connecting the second terminal part 23 to the second terminal part 23. Configuration.

Of course, the 3rd process and the 4th process can also be performed in reverse order.

As shown in FIG. 5, the fifth step of the present invention is a step of folding the folding part 12 to electrically connect the second terminal part 23 and the second terminal part connection part 24.

When the folding unit 12 is folded upward and downward across the insulating layer 30, the second terminal connection unit 24 is folded down so that the end of the second terminal connection unit 24 is connected to one end of the second terminal unit 23. Over a certain distance, the two are electrically connected.

At this time, the welding hole 25a formed at one end of the second terminal portion 23 and the welding hole 25b formed at the distal end of the second terminal portion connecting portion 24 are exactly matched up and down, and are formed through the welding holes 25a and 25b. Both sides of the thin film substrate 10 come into contact with each other.

As shown in FIGS. 6 and 7, the sixth process of the present invention is a process of stacking the cover sheet 40 in which the terminal exposure holes 41 are perforated on the antenna unit 20 of the thin film substrate 10. .

The cover sheet 40 is a sheet that protects the antenna unit 20 by being stacked on the antenna unit 20 formed on one side of the thin film substrate 10. As the cover sheet 40, a thin sheet of a material such as polyimide (eg, a thickness of about 12.5 μm) may be used.

As described above, the cover sheet 40 is also provided with a terminal exposure hole 41 having the same purpose as that of the terminal exposure hole 11 of the thin film substrate 10. That is, the cover sheet 40 has a terminal exposure hole 41 at a position corresponding to the position of the terminals 22a and 23a formed at the ends of the first terminal portion 22 and the second terminal portion 23 in the RFID antenna 1. ) And two are drilled side by side at positions corresponding to the ends of the first terminal portion 22 and the second terminal portion 23 in the illustrated example.

In the seventh process of the present invention, as shown in FIG. 7, the thin film substrate 10 and the cover sheet 40 are thermally pressed up and down to fix the antenna unit 20 therebetween, and a welding hole ( It is a process of welding the thin film substrate 10 which contacted through 25a, 25b.

This process is a step of firmly fixing the antenna portion 20 formed between the thin film substrate 10 and the cover sheet 40 made of polyimide between the thin film substrate 10 and the cover sheet 40. For example, when the thin film substrate 10 and the cover sheet 40 made of a material such as polyimide are heated and pressurized using a heat press or the like, the abutting thin film substrate 10 and the cover sheet 40 are welded to each other to form an antenna unit ( 20) is firmly fixed between the two.

The welding hole 25a formed at one end of the second terminal portion 23 and the welding hole 25b formed at the end of the second terminal portion connecting portion 24 are exactly matched up and down so that both thin film substrates are formed at the welding holes 25a and 25b. 10 is brought into contact with each other, and the thin film substrate 10 which is abutted in this step is welded by thermal pressure.

Since the end of the second terminal portion connecting portion 24 and one end of the second terminal portion 23 are not firmly joined like solder, but are only in contact with each other over a predetermined distance, their electrical connection may be incomplete. When the RFID antenna is manufactured in a state, an electrical resistance value may increase due to an incomplete connection, and as a result, a defect may occur in which the induced electromotive force of the antenna is reduced.

However, the antenna 1 manufactured according to the present invention is formed by welding the thin film substrates 10 above and below the welding holes 25a and 25b formed at the overlapping portions of the second terminal portion connecting portion 24 and the second terminal portion 23. The overlapping portion of the second terminal portion connecting portion 24 and the second terminal portion 23 is formed at the upper and lower welding and welding holes 25a and 25b of the thin film substrate 10 and the cover sheet 40 around the thin film substrate 10. Since it is firmly adhered by the vertical welding of), the problem of lowering the induced electromotive force due to the increase of resistance can be solved.

Although the example in which the welding hole 25a, 25b was formed in the circular shape in the 2nd terminal part 23 and the 2nd terminal part connection part 24 is shown in the specific example, the welding hole 25a, 25b is shown, respectively. If the upper and lower thin film substrates 10 are welded and overlapping portions of the second terminal portion 23 and the second terminal portion connecting portion 24 can be firmly adhered to, the shape and number of welding holes are not limited, and furthermore, the shape of the hole Rather than forming the cutouts of a predetermined shape such as, for example, a comb-tooth shape at each overlapping portion, the thin film substrate 10 is welded through the cutouts.

As shown in FIG. 8, the eighth process of the present invention is a process of cutting the circumference of the antenna unit 20 to finally complete the RFID antenna 1.

In this process, terminals 22a and 23a are formed at the ends of the first terminal portion 22 and the second terminal portion 23, respectively. As described above, since the ends of the first terminal portion 22 and the second terminal portion 23 are exposed through the terminal exposure holes 11 and 41, the thin film substrate 10 and the cover sheet 40 to form the terminal. There is no need to peel off.

As described above, the RFID antenna manufactured by the present invention is the antenna unit 20 by welding the thin film substrate 10 and the cover sheet 40 and the thin film substrate 10 through the welding holes 25a and 25b. Bar is in a state of being closely fixed to the thin film substrate 10 and the cover sheet 40, the cross-sectional view of Figure 8 simplified the illustration for the convenience of understanding the interlayer structure of the respective components.

According to the RFID antenna manufacturing method according to the present invention as described above, using a material in which the conductive metal foil 2 is laminated only on one side instead of both sides, the RFID antenna of the loop pattern can be simply formed without a short hole without a via hole plating process. Compared to the conventional RFID antenna, the manufacturing cost can be significantly reduced and resource waste and environmental pollution can be minimized.

In addition, when the folding unit 12 is folded to electrically connect the second terminal unit 23 and the second terminal unit connecting unit 24, respectively, at the corresponding positions of the second terminal unit 23 and the second terminal unit connecting unit 24, respectively. By forming the welding holes 25a and 25b to allow the thin film substrates 10 to be welded to each other through the welding holes 25a and 25b, the electrical connection between the second terminal portion 23 and the second terminal portion connecting portion 24 is securely performed. As a result, electrical resistance at the connection portion between the second terminal portion 23 and the second terminal portion connection portion 24 can be minimized, and as a result, normal induced electromotive force can be obtained from the manufactured RFID antenna.

1 to 8 are exemplary process diagrams of an RFID antenna manufacturing method according to the present invention;

9 is a front and back schematic view of a conventional exemplary RFID antenna applied to a mobile phone battery;

10 is a manufacturing process diagram of the RFID antenna of FIG.

1: RFID antenna 2: conductive metal foil

10: thin film substrate 11, 41: terminal exposure hole

12: folding portion 20: antenna portion

21: loop portion 21a: outer end of the loop portion

21b: inner end of loop portion 22: first terminal portion

22a, 23a: terminal 23: second terminal portion

24: 2nd terminal part connection part 25a, 25b: Welding hole

30: insulating layer 40: cover sheet

50: printing plate 51: hole

Claims

Stacking the conductive metal foil 2 on one side of the thin film substrate 10 on which the terminal exposure holes 11 are perforated;

The conductive metal foil 2 is etched so as to be continuous with the loop portion 21 and the outer end 21a of the loop portion 21 so as not to intersect the loop portion 21 to the outside of the loop portion 21. The second terminal portion 23 formed parallel to the first terminal portion 22 on the outside of the roof portion 21 in a state of being electrically disconnected from the extended first terminal portion 22 and the inner end 21b of the loop portion 21. ), A second terminal portion connecting portion 24 extending into the loop portion 21 so as not to intersect the loop portion 21 and continuing to the inner end 21b of the loop portion 21, and the second terminal portion. Forming an antenna portion (20) having welding holes (25a, 25b) formed at corresponding positions of said (23) and said second terminal portion connecting portion (24), respectively;

Stacking an insulating layer (30) on the loop portion (21) at a portion intersecting between the second terminal portion (23) and the second terminal portion connecting portion (24);

Forming a folding portion (12) by cutting the thin film substrate (10) along a circumference of the second terminal portion connecting portion (24) to fold the second terminal portion connecting portion (24);

The folding part 12 is folded to overlap the second terminal part 23 and the second terminal part connecting part 24 so that the welding holes 25a and 25b coincide with each other across the insulating layer 30. To electrically connect with each other;

Stacking a cover sheet 40 on which the terminal exposure holes 41 are perforated on the antenna unit 20 of the thin film substrate 10;

Thermally bonding the thin film substrate 10 and the cover sheet 40 to fix the antenna unit 20 therebetween, and welding the thin film substrate 10 abutted through the welding holes 25a and 25b. Making process; And

Cutting the circumference of the antenna unit 20 to complete the RFID antenna 1;

Characterized in that it comprises a, RFID antenna manufacturing method.

The printing plate of claim 1, wherein the insulating layer 30 is formed by stacking a printing plate 50 having holes 51 corresponding to the position and size of the insulating layer 30 on the antenna unit 20. (50) A method of manufacturing an RFID antenna, characterized in that formed by a stencil printing method to apply the insulating material on the cured.