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JP6177427B2 - Printed wiring board unit - Google Patents

Printed wiring board unit Download PDF

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Publication number
JP6177427B2
JP6177427B2 JP2016511303A JP2016511303A JP6177427B2 JP 6177427 B2 JP6177427 B2 JP 6177427B2 JP 2016511303 A JP2016511303 A JP 2016511303A JP 2016511303 A JP2016511303 A JP 2016511303A JP 6177427 B2 JP6177427 B2 JP 6177427B2
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Prior art keywords
printed wiring
wiring board
electrode
board unit
unit according
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Expired - Fee Related
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JPWO2015151292A1 (en
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亮平 川端
亮平 川端
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)

Description

本発明は、複数のプリント配線板が一体化したプリント配線板ユニットに関するものである。   The present invention relates to a printed wiring board unit in which a plurality of printed wiring boards are integrated.

従来から２種以上の異なるプリント配線板同士を電気的に接続することが行われており（Ｂｏａｒｄ ｔｏ Ｂｏａｒｄ）、種々の手法が提案されている（例えば特許文献１〜３参照）。特許文献１には、それぞれのプリント配線板にオス側のコネクタが実装され、リード線の両端に接続されたメス側のコネクタがオス側コネクタに取り付けられることにより、プリント配線板同士の電気接続が行われている。   Conventionally, two or more kinds of different printed wiring boards have been electrically connected (Board to Board), and various methods have been proposed (see, for example, Patent Documents 1 to 3). In Patent Document 1, a male connector is mounted on each printed wiring board, and a female connector connected to both ends of a lead wire is attached to the male connector, whereby electrical connection between the printed wiring boards is achieved. Has been done.

特許文献２には、一方のプリント配線板の端部に設けた電極部に対し特殊なリードピンを実装した他方のプリント配線板を挿入し、はんだ付けすることで電気的に接合することが開示されている。特許文献３には、一方のプリント配線板の端部に電極を設置し、他方のプリント配線板にスリット及び電極を設置し、一方のプリント配線板のスリットに他方のプリント配線板を挿入した状態で、それぞれのプリント配線板に設置した電極同士を直接はんだ付けすることで電気的に接合することが開示されている。   Patent Document 2 discloses that the other printed wiring board on which a special lead pin is mounted is inserted into the electrode portion provided at the end of one printed wiring board and is electrically bonded by soldering. ing. In Patent Document 3, an electrode is installed at the end of one printed wiring board, a slit and an electrode are installed in the other printed wiring board, and the other printed wiring board is inserted into the slit of one printed wiring board. Thus, it is disclosed that the electrodes installed on each printed wiring board are electrically joined by directly soldering them.

実開平６−４１０８３号公報Japanese Utility Model Publication No. 6-41083 特開平８−７８６０１号公報JP-A-8-78601 特開平１１−１１２１２０号公報JP-A-11-112120

しかしながら、特許文献１、２の場合、プリント配線板間の接続にコネクタもしくは特殊なリードピン等の部材が必要になり、コストが高くなる。また、特許文献１〜３において、プリント配線板の所定の部位にコネクタ等の外部に接続する電極を集約させる必要があるため、回路を形成する導体パターンを接続箇所に集約する必要があり、設計の自由度も低く基板を小型化できない。   However, in the case of Patent Documents 1 and 2, a member such as a connector or a special lead pin is required for connection between the printed wiring boards, and the cost increases. Further, in Patent Documents 1 to 3, since it is necessary to consolidate electrodes connected to the outside such as connectors at predetermined portions of the printed wiring board, it is necessary to consolidate the conductor pattern forming the circuit at the connection location. The degree of freedom is low and the substrate cannot be miniaturized.

本発明は、上記のよう課題を解決するためになされたもので、安価に接続信頼性を高めながら小型化を実現することができるプリント配線板ユニットを提供することを目的とするものである。   The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a printed wiring board unit capable of realizing downsizing while improving connection reliability at a low cost.

本発明のプリント配線板ユニットは、第１プリント配線板と、第１プリント配線板上に接合された第２プリント配線板とを備えたプリント配線板ユニットであって、第１プリント配線板は、表面に第２プリント配線板が接合される表面電極と、表面から突出した突出部材とを有するものであり、第２プリント配線板は、左右非対称の外形を有し、第１プリント配線板の表面電極にはんだ付けにより一体的に接合されて電気的に接続される接合電極と、外縁において、第１プリント配線板に接合された際に突出部材に当たる部分に一つの切欠部とを備え、突出部材を基準として第１プリント配線板上に位置決めされるものである。 The printed wiring board unit of the present invention is a printed wiring board unit including a first printed wiring board and a second printed wiring board bonded onto the first printed wiring board, and the first printed wiring board is It has a surface electrode to which the second printed wiring board is bonded to the surface and a protruding member protruding from the surface , and the second printed wiring board has an asymmetrical outer shape, and is a surface of the first printed wiring board. comprising a bonding electrode are integrally joined by soldering to the electrodes are electrically connected, at the outer edge, and one of the notch in the portion corresponding to the projecting member when it is joined to the first printed circuit board, the projecting member Is positioned on the first printed wiring board with reference to .

本発明のプリント配線板ユニットによれば、第１プリント配線板の表面電極と、第２プリント配線板の接合電極とがはんだ付けされて第１プリント配線板と第２プリント配線板とが一体的に接合され電気的に接続される。これにより、電気的接続を行うための部材は不要になるとともに、外部へ接続する電極を所定の部位に集約する必要がないため無駄なパターンを引く必要がなく、安価に接続信頼性を高めながら小型化を実現することができる。   According to the printed wiring board unit of the present invention, the surface electrode of the first printed wiring board and the joining electrode of the second printed wiring board are soldered so that the first printed wiring board and the second printed wiring board are integrated. And are electrically connected to each other. This eliminates the need for a member for electrical connection, and eliminates the need to draw a useless pattern because it is not necessary to consolidate electrodes to be connected to the outside, while increasing connection reliability at a low cost. Miniaturization can be realized.

本発明の実施の形態１に係るプリント配線板ユニットを示す斜視図である。It is a perspective view which shows the printed wiring board unit which concerns on Embodiment 1 of this invention. 図１のプリント配線板ユニットの分解斜視図である。It is a disassembled perspective view of the printed wiring board unit of FIG. 図１のプリント配線板ユニットにおける第１プリント配線板の一例を示す斜視図である。It is a perspective view which shows an example of the 1st printed wiring board in the printed wiring board unit of FIG. 図１のプリント配線板ユニットにおける第２プリント配線板の表面側の斜視図である。It is a perspective view of the surface side of the 2nd printed wiring board in the printed wiring board unit of FIG. 図１のプリント配線板ユニットにおける第２プリント配線板の裏面側の斜視図である。It is a perspective view of the back surface side of the 2nd printed wiring board in the printed wiring board unit of FIG. 図１のプリント配線板ユニットにおける第２プリント配線板の一例を示す断面図であるIt is sectional drawing which shows an example of the 2nd printed wiring board in the printed wiring board unit of FIG. 本発明のプリント配線板ユニットにおける第２プリント配線板の実施形態２を示す模式図である。It is a schematic diagram which shows Embodiment 2 of the 2nd printed wiring board in the printed wiring board unit of this invention. 本発明のプリント配線板ユニットにおける第２プリント配線板の実施形態３を示す模式図である。It is a schematic diagram which shows Embodiment 3 of the 2nd printed wiring board in the printed wiring board unit of this invention. 本発明のプリント配線板ユニットの実施形態４を示す模式図である。It is a schematic diagram which shows Embodiment 4 of the printed wiring board unit of this invention. 本発明のプリント配線板ユニットの実施形態５を示す模式図である。It is a schematic diagram which shows Embodiment 5 of the printed wiring board unit of this invention. 本発明のプリント配線板ユニットの実施形態６を示す模式図である。It is a schematic diagram which shows Embodiment 6 of the printed wiring board unit of this invention.

実施形態１．
以下、図面を参照しながら本発明のプリント配線板ユニットについて詳細に説明する。図１は本発明の実施の形態１に係るプリント配線板ユニットを示す斜視図、図２は図１のプリント配線板ユニットの分解斜視図である。図１のプリント配線板ユニット１は、第１プリント配線板１０上に第２プリント配線板２０が一体的に接合され電気的に接続されたものである。この第１プリント配線板１０及び第２プリント配線板２０は、例えばガラス・エポキシ等の公知の材料からなっている。Embodiment 1. FIG.
Hereinafter, the printed wiring board unit of the present invention will be described in detail with reference to the drawings. 1 is a perspective view showing a printed wiring board unit according to Embodiment 1 of the present invention, and FIG. 2 is an exploded perspective view of the printed wiring board unit of FIG. In the printed wiring board unit 1 of FIG. 1, a second printed wiring board 20 is integrally joined and electrically connected to a first printed wiring board 10. The first printed wiring board 10 and the second printed wiring board 20 are made of a known material such as glass or epoxy.

図３は図１のプリント配線板ユニットにおける第１プリント配線板の一例を示す斜視図であり、図２及び図３を参照して第１プリント配線板１０について説明する。第１プリント配線板１０は、例えば矩形状に形成されており、表面１０Ａに第２プリント配線板２０が接合される表面電極１１を有している。表面電極１１は、第１プリント配線板１０の所定の領域に複数設けられており、例えばランドが複数形成されているような所定の導体パターンを有している。なお、第１プリント配線板１０の表面１０Ａには、上述した表面電極１１の他に、他の電子部品ＥＰを実装するための図示しない所定の導体パターンが形成されており、この導体パターン上に電子部品ＥＰが接続可能な構成を有している。   FIG. 3 is a perspective view showing an example of the first printed wiring board in the printed wiring board unit of FIG. 1, and the first printed wiring board 10 will be described with reference to FIGS. The first printed wiring board 10 is formed in, for example, a rectangular shape, and has a surface electrode 11 to which the second printed wiring board 20 is bonded to the surface 10A. A plurality of surface electrodes 11 are provided in a predetermined region of the first printed wiring board 10 and have a predetermined conductor pattern in which, for example, a plurality of lands are formed. In addition to the surface electrode 11 described above, a predetermined conductor pattern (not shown) for mounting other electronic components EP is formed on the surface 10A of the first printed wiring board 10, and the conductor pattern is formed on the conductor pattern. The electronic component EP can be connected.

図４は図１のプリント配線板ユニットにおける第２プリント配線板の表面側の斜視図、図５はプリント配線板ユニット１における第２プリント配線板２０の裏面側の斜視図であり、図１から図５を参照して第２プリント配線板２０について説明する。第２プリント配線板２０は、例えばいわゆる両面プリント配線板であって、矩形状に形成されている。また第２プリント配線板２０は第１プリント配線板１０よりも小さいサイズを有している。そして、第２プリント配線板２０の表面２０Ａ側にはＩＣチップ及びコンデンサ等の電子部品ＥＰが搭載されている。   4 is a perspective view of the front surface side of the second printed wiring board in the printed wiring board unit of FIG. 1, and FIG. 5 is a perspective view of the back surface side of the second printed wiring board 20 in the printed wiring board unit 1. The second printed wiring board 20 will be described with reference to FIG. The second printed wiring board 20 is a so-called double-sided printed wiring board, for example, and is formed in a rectangular shape. The second printed wiring board 20 has a smaller size than the first printed wiring board 10. An electronic component EP such as an IC chip and a capacitor is mounted on the surface 20A side of the second printed wiring board 20.

図６は図１のプリント配線板ユニットにおける第２プリント配線板の一例を示す断面図である。図４から図６の第２プリント配線板２０において、裏面２０Ｂ側には所定の導体パターンを有する接合電極２１が形成されており、表面２０Ａ側には所定の導体パターンを有する実装電極２２が形成されている。特に、接合電極２１は例えば表面電極１１と同一の導体パターンを有しており、表面電極１１の同じ位置に接合電極２１が設置される。なお、表面電極１１と接合電極２１とは、接合するものであればよく、異なる導体パターンを有するものであってもよい。   FIG. 6 is a sectional view showing an example of a second printed wiring board in the printed wiring board unit of FIG. In the second printed wiring board 20 of FIGS. 4 to 6, a bonding electrode 21 having a predetermined conductor pattern is formed on the back surface 20B side, and a mounting electrode 22 having a predetermined conductor pattern is formed on the front surface 20A side. Has been. In particular, the bonding electrode 21 has, for example, the same conductor pattern as the surface electrode 11, and the bonding electrode 21 is installed at the same position of the surface electrode 11. In addition, the surface electrode 11 and the joining electrode 21 should just be joined, and may have a different conductor pattern.

実装電極２２に電子部品ＥＰがはんだ付けＳにより接合されている。また、第２プリント配線板２０には、接合電極２１と実装電極２２とを電気的に接続するスルーホールからなる層間接続部２３が形成されている。そして、接合電極２１と実装電極２２と層間接続部２３とは所定の電気回路を構成している。なお、接合電極２１及び実装電極２２は、例えば層間接続部２３上に形成された構造になっている。   An electronic component EP is joined to the mounting electrode 22 by soldering S. Further, the second printed wiring board 20 is formed with an interlayer connection portion 23 formed of a through hole that electrically connects the bonding electrode 21 and the mounting electrode 22. The junction electrode 21, the mounting electrode 22, and the interlayer connection portion 23 constitute a predetermined electric circuit. Note that the bonding electrode 21 and the mounting electrode 22 have a structure formed on the interlayer connection portion 23, for example.

そして、接合電極２１が第１プリント配線板１０の表面電極１１に接合されることにより、第１プリント配線板１０と第２プリント配線板２０とが一体的に接合されるとともに電気的に接続される。この際、例えば第１プリント配線板１０の表面電極１１にペーストはんだが供給され、第２プリント配線板２０を搭載した後にはんだ付けすることにより、第１プリント配線板１０と第２プリント配線板２０とが接合され、プリント配線板ユニット１を得ることができる。   Then, the bonding electrode 21 is bonded to the surface electrode 11 of the first printed wiring board 10 so that the first printed wiring board 10 and the second printed wiring board 20 are integrally bonded and electrically connected. The At this time, for example, paste solder is supplied to the surface electrode 11 of the first printed wiring board 10, and soldering is performed after the second printed wiring board 20 is mounted, whereby the first printed wiring board 10 and the second printed wiring board 20. And the printed wiring board unit 1 can be obtained.

このように、第１プリント配線板１０と第２プリント配線板２０との接続が表面電極１１及び接合電極２１において行われるため、基板同士を接続するためのコネクタ等の部材を用いる必要がなくなり、安価に接続信頼性を高めながら第１プリント配線板１０と第２プリント配線板２０とを電気的に接続させることができる。すなわち、従来のように、プリント配線板間の接続にコネクタもしくはリードピン等の部材を用いた場合、コストが高くなる。また、回路を形成する導体パターンをコネクタ等の接続箇所に集約する必要があるため、設計の自由度も低く基板を小型化できない。さらに、プリント配線板にコネクタ又はリードピンを取り付けるための設備もしくは製造工程が必要になり、初期コストが高くなってしまう。また、基板の仕様によりリードピンの専用型が必要となるため、汎用性が低くなってしまう。一方、図１から図６のプリント配線板ユニット１において、基板間接続はプリント配線板の面に設置した電極で接続するため、接合のための部材は必要なく安価で接合が可能である。さらに、回路を形成するための導体パターンは基板の両面を使用できることから無駄なパターンを引く必要が無く、小型化が容易である。また、基板の仕様により接続部材の仕様変更を伴わないため、汎用性に優れている。   In this way, since the connection between the first printed wiring board 10 and the second printed wiring board 20 is performed at the surface electrode 11 and the bonding electrode 21, it is not necessary to use a member such as a connector for connecting the substrates, The first printed wiring board 10 and the second printed wiring board 20 can be electrically connected while increasing connection reliability at a low cost. That is, when a member such as a connector or a lead pin is used for connection between printed wiring boards as in the prior art, the cost increases. In addition, since it is necessary to consolidate the conductor pattern forming the circuit at the connection location such as a connector, the degree of freedom in design is low and the substrate cannot be downsized. Furthermore, equipment or a manufacturing process for attaching the connector or the lead pin to the printed wiring board is required, and the initial cost is increased. Moreover, since a dedicated lead pin type is required depending on the specifications of the board, the versatility is lowered. On the other hand, in the printed wiring board unit 1 shown in FIGS. 1 to 6, since the inter-board connection is made by connecting electrodes provided on the surface of the printed wiring board, no joining member is required and joining can be performed at low cost. Furthermore, since the conductor pattern for forming the circuit can use both sides of the substrate, it is not necessary to draw a useless pattern, and the size can be easily reduced. Moreover, since the specification of the connection member is not changed depending on the specification of the substrate, it is excellent in versatility.

さらに、従来のように、プリント配線板を挿入し直接はんだ付けする際、表面張力によりはんだ接合部は導体幅より細くなるため、接合信頼性を確保するために導体幅を広くする必要がある。また、はんだ付け時に発生するブリッジ不良を抑制するために電極間ピッチも広くする必要もあるため、多点接続が困難である。さらに、基板側面にスルーホールを半分に割った電極を設置しはんだ付けする場合、半分に割ることでスルーホールが基材から剥離しやすくなるため強度が弱く、長期接続信頼性に劣るといった課題がある。一方、図１のプリント配線板ユニット１において、第１プリント配線板１０の表面１０Ａに表面電極１１が形成されているとともに、第２プリント配線板２０の裏面２０Ｂに接合電極２１が形成されているため、設置可能な電極点数が多く多点接続が可能となり、基材から導体が剥離する可能性も低いため、長期接合信頼性も高い。   Furthermore, when a printed wiring board is inserted and soldered directly as in the prior art, the solder joint portion becomes thinner than the conductor width due to surface tension. Therefore, it is necessary to increase the conductor width in order to ensure joint reliability. Moreover, since it is necessary to widen the pitch between the electrodes in order to suppress the bridging failure that occurs during soldering, it is difficult to perform multipoint connection. Furthermore, when installing and soldering an electrode that divides the through hole in half on the side of the substrate, the problem is that the through hole is easy to peel off from the base material by splitting it in half, so the strength is weak and the long-term connection reliability is poor. is there. On the other hand, in the printed wiring board unit 1 of FIG. 1, the surface electrode 11 is formed on the front surface 10 </ b> A of the first printed wiring board 10, and the bonding electrode 21 is formed on the back surface 20 </ b> B of the second printed wiring board 20. Therefore, the number of electrodes that can be installed is large and multipoint connection is possible, and the possibility that the conductor is peeled off from the base material is low, so that long-term bonding reliability is high.

実施形態２．
図７は本発明のプリント配線板ユニットにおける第２プリント配線板の実施形態２を示す模式図であり、図７を参照して第２プリント配線板１２０について説明する。なお、図７の第２プリント配線板１２０において第２プリント配線板２０と同一の構成を有する部位には同一の符号を付してその説明を省略する。図７の第２プリント配線板１２０が実施形態１の第２プリント配線板２０と異なる点は、多層プリント配線板からなっている点である。Embodiment 2. FIG.
FIG. 7 is a schematic diagram showing the second embodiment of the second printed wiring board in the printed wiring board unit of the present invention. The second printed wiring board 120 will be described with reference to FIG. In addition, in the 2nd printed wiring board 120 of FIG. 7, the site | part which has the same structure as the 2nd printed wiring board 20 attaches | subjects the same code | symbol, and abbreviate | omits the description. The second printed wiring board 120 of FIG. 7 is different from the second printed wiring board 20 of Embodiment 1 in that it is composed of a multilayer printed wiring board.

図７において、第２プリント配線板１２０はビルドアップ多層プリント配線板等の多層プリント配線板からなっており、接合電極２１と実装電極２２とはビアからなる層間接続部１２３により電気的に接続されている。このような第２プリント配線板１２０として多層プリント配線板を用いた場合であっても、実施形態１と同様、第１プリント配線板１０と第２プリント配線板１２０との基板間の接続が表面電極１１及び接合電極２１において行われるため、基板同士を接続するためのコネクタ又はリードフレーム等の部材を用いる必要がなくなり、安価に第１プリント配線板１０と第２プリント配線板１２０とを電気的に接続させることができる。   In FIG. 7, the second printed wiring board 120 is formed of a multilayer printed wiring board such as a build-up multilayer printed wiring board, and the bonding electrode 21 and the mounting electrode 22 are electrically connected by an interlayer connection portion 123 formed of a via. ing. Even when a multilayer printed wiring board is used as the second printed wiring board 120, the connection between the first printed wiring board 10 and the second printed wiring board 120 is the surface as in the first embodiment. Since it is performed in the electrode 11 and the bonding electrode 21, it is not necessary to use a member such as a connector or a lead frame for connecting the substrates, and the first printed wiring board 10 and the second printed wiring board 120 are electrically connected at low cost. Can be connected to.

実施形態３．
図８は本発明のプリント配線板ユニットにおける第２プリント配線板の実施形態３を示す模式図であり、図８を参照して第２プリント配線板２２０について説明する。なお、図８の第２プリント配線板２２０において実施形態１の第２プリント配線板２０と同一の構成を有する部位には同一の符号を付してその説明を省略する。図８の第２プリント配線板２２０が実施形態１の第２プリント配線板２０と異なる点は、層間接続部（スルーホール）２３と接合電極２２１との形成位置がずれている点である。Embodiment 3. FIG.
FIG. 8 is a schematic diagram showing Embodiment 3 of the second printed wiring board in the printed wiring board unit of the present invention. The second printed wiring board 220 will be described with reference to FIG. In addition, in the 2nd printed wiring board 220 of FIG. 8, the site | part which has the same structure as the 2nd printed wiring board 20 of Embodiment 1 is attached | subjected, and the description is abbreviate | omitted. The second printed wiring board 220 in FIG. 8 is different from the second printed wiring board 20 in the first embodiment in that the formation positions of the interlayer connection part (through hole) 23 and the bonding electrode 221 are shifted.

図８において、接合電極２２１は、層間接続部２３の形成位置からずれた位置に設けられており、接合電極２２１と層間接続部２３とは接続配線パターン２２２により電気的に接続されている。具体的には、接続配線パターン２２２は、第２プリント配線板２２０の内層に形成されており、接合電極２２１は接続配線パターン２２２に繋がる図示しないビアに接続されている。このように層間接続部２３と接合電極２２１とは第２プリント配線板２２０内において内層間接続されている。なお、第２プリント配線板２２０が内層に接続配線パターン２２２を形成した多層プリント配線板を用いた場合について例示しているが、両面プリント配線板を用いて接続配線パターン２２２を裏面１０Ｂ側に形成するようにしてもよい。   In FIG. 8, the bonding electrode 221 is provided at a position shifted from the formation position of the interlayer connection portion 23, and the bonding electrode 221 and the interlayer connection portion 23 are electrically connected by the connection wiring pattern 222. Specifically, the connection wiring pattern 222 is formed in the inner layer of the second printed wiring board 220, and the bonding electrode 221 is connected to a via (not shown) connected to the connection wiring pattern 222. Thus, the interlayer connection 23 and the bonding electrode 221 are connected to each other within the second printed wiring board 220. In addition, although the case where the second printed wiring board 220 uses a multilayer printed wiring board in which the connection wiring pattern 222 is formed on the inner layer is illustrated, the connection wiring pattern 222 is formed on the back surface 10B side using a double-sided printed wiring board. You may make it do.

これにより、表面１０Ａと裏面１０Ｂを貫通する層間接続部２３の位置によらず裏面２０Ｂに接合電極２２１を形成することができるため、設計の自由度を向上させることができる。さらに、このような第２プリント配線板２２０を用いた場合であっても、実施形態１と同様、第１プリント配線板１０と第２プリント配線板２２０との基板間の接続が表面電極１１及び接合電極２２１において行われるため、基板同士を接続するためのコネクタ又はリードフレーム等の部材を用いる必要がなくなり、安価に接続信頼性を高めながら第１プリント配線板１０と第２プリント配線板２２０とを電気的に接続させることができる。   Thereby, since the joining electrode 221 can be formed on the back surface 20B regardless of the position of the interlayer connection portion 23 that penetrates the front surface 10A and the back surface 10B, the degree of freedom in design can be improved. Further, even when such a second printed wiring board 220 is used, the connection between the substrate of the first printed wiring board 10 and the second printed wiring board 220 is similar to that of the first embodiment. Since it is performed at the bonding electrode 221, it is not necessary to use a member such as a connector or a lead frame for connecting the substrates to each other, and the first printed wiring board 10 and the second printed wiring board 220 can be reduced while improving connection reliability at low cost. Can be electrically connected.

実施形態４．
図９は本発明のプリント配線板ユニットの実施形態４を示す模式図であり、図９を参照してプリント配線板ユニット３００について説明する。なお、図９のプリント配線板ユニット３００において実施形態１のプリント配線板ユニット１と同一の構成を有する部位には同一の符号を付してその説明を省略する。図７のプリント配線板ユニット３００が実施形態１のプリント配線板ユニット１と異なる点は、切欠部３０１が設けられている点である。Embodiment 4 FIG.
FIG. 9 is a schematic view showing a printed wiring board unit according to a fourth embodiment of the present invention. The printed wiring board unit 300 will be described with reference to FIG. In addition, in the printed wiring board unit 300 of FIG. 9, the same code | symbol is attached | subjected to the site | part which has the same structure as the printed wiring board unit 1 of Embodiment 1, and the description is abbreviate | omitted. The printed wiring board unit 300 of FIG. 7 is different from the printed wiring board unit 1 of the first embodiment in that a notch 301 is provided.

図９の第２プリント配線板３２０において、切欠部３０１は四隅のうち１つの角部に形成されており、第２プリント配線板３２０は左右非対称または上下非対称の外形を有している。なお、左右非対称または上下非対称の外形を有するものであれば切欠部３０１の形状に限定されず、種々の形状を採用することができる。このように、第２プリント配線板３２０の外形を左右非対称または上下非対称にすることにより、第１プリント配線板１０に第２プリント配線板３２０を取り付ける際に、取り付け方向の間違いを外観で見分けることができる。   In the second printed wiring board 320 of FIG. 9, the notch 301 is formed at one corner of the four corners, and the second printed wiring board 320 has a laterally asymmetric or vertically asymmetric outer shape. In addition, as long as it has a left-right asymmetrical or up-down asymmetrical external shape, it is not limited to the shape of the notch part 301, A various shape is employable. As described above, when the second printed wiring board 320 is attached to the first printed wiring board 10 by making the outer shape of the second printed wiring board 320 left-right asymmetric or up-down asymmetrical, it is possible to distinguish the attachment direction from the appearance. Can do.

さらに、第１プリント配線板１０において、第１プリント配線板１０に第２プリント配線板２０が接合されたときに切欠部３０１の位置に対応する部位に突出部材３１１が設けられている。特に、この突出部材３１１は例えば電子部品ＥＰからなっている。なお、突出部材３１１が電子部品ＥＰからなる場合について例示しているが、ジャンパー部品等からなっていてもよい。   Further, in the first printed wiring board 10, a protruding member 311 is provided at a portion corresponding to the position of the notch 301 when the second printed wiring board 20 is joined to the first printed wiring board 10. In particular, the protruding member 311 is made of, for example, an electronic component EP. In addition, although the case where the protruding member 311 is made of the electronic component EP is illustrated, it may be made of a jumper component or the like.

図９のように、第１プリント配線板１０側にも切欠部３０１に対応する部位に突出部材３１１を設けることにより、物理的に実装の方向間違いを確実に抑制することができる。さらに、このような第２プリント配線板３２０を用いた場合であっても、実施形態１と同様、第１プリント配線板１０と第２プリント配線板３２０との基板間の接続が表面電極１１及び接合電極２１において行われるため、基板同士を接続するためのコネクタ又はリードフレーム等の部材を用いる必要がなくなり、安価に接続信頼性を高めながら第１プリント配線板１０と第２プリント配線板３２０とを電気的に接続させることができる。   As shown in FIG. 9, by providing the protruding member 311 on the first printed wiring board 10 side at a portion corresponding to the notch 301, it is possible to reliably suppress a mounting direction error physically. Further, even when such a second printed wiring board 320 is used, the connection between the substrate of the first printed wiring board 10 and the second printed wiring board 320 is similar to that of the first embodiment. Since it is performed at the bonding electrode 21, it is not necessary to use a member such as a connector or a lead frame for connecting the substrates, and the first printed wiring board 10 and the second printed wiring board 320 can be reduced while improving connection reliability at a low cost. Can be electrically connected.

実施形態５．
図１０は本発明のプリント配線板ユニットの実施形態を示す模式図であり、図１０を参照してプリント配線板ユニット４００について説明する。なお、図１０のプリント配線板ユニット４００において図１のプリント配線板ユニット１と同一の構成を有する部位には同一の符号を付してその説明を省略する。図１０のプリント配線板ユニット４００が実施形態１のプリント配線板ユニット１と異なる点は、第１プリント配線板４１０に突出部材４１１が設けられている点である。Embodiment 5. FIG.
FIG. 10 is a schematic view showing an embodiment of the printed wiring board unit of the present invention. The printed wiring board unit 400 will be described with reference to FIG. In the printed wiring board unit 400 of FIG. 10, parts having the same configurations as those of the printed wiring board unit 1 of FIG. The printed wiring board unit 400 of FIG. 10 is different from the printed wiring board unit 1 of the first embodiment in that a protruding member 411 is provided on the first printed wiring board 410.

図１０において、第１プリント配線板４１０には表面１０Ａから突出した突出部材４１１が複数設けられている。複数の突出部材４１１は、例えばジャンパー部品からなっており、第２プリント配線板２０の外形に合わせる位置に設けられている。なお、突出部材４１１がジャンパー部品からなる場合について例示しているが、表面１０Ａから突起したものであればよく、実施形態４と同様、電子部品ＥＰ等からなるものであってもよい。また、第２プリント配線板２０が、実施形態４のような切欠部３０１を有するものであってもよい。   In FIG. 10, the first printed wiring board 410 is provided with a plurality of protruding members 411 protruding from the surface 10A. The plurality of protruding members 411 are made of jumper parts, for example, and are provided at positions that match the outer shape of the second printed wiring board 20. In addition, although the case where the protruding member 411 is made of a jumper component is illustrated, it may be formed by protruding from the surface 10A, and may be formed of the electronic component EP or the like as in the fourth embodiment. Moreover, the 2nd printed wiring board 20 may have the notch part 301 like Embodiment 4. FIG.

図１０のように、第１プリント配線板４１０側に突出部材４１１を設けることにより、第２プリント配線板２０の位置決めを容易に行うことができる。さらに、このような第１プリント配線板４１０を用いた場合であっても、実施形態１と同様、第１プリント配線板４１０と第２プリント配線板２０との基板間の接続が表面電極１１及び接合電極２１において行われるため、基板同士を接続するためのコネクタ又はリードフレーム等の部材を用いる必要がなくなり、安価に接続信頼性を高めながら第１プリント配線板４１０と第２プリント配線板２０とを電気的に接続させることができる。   As shown in FIG. 10, by providing the protruding member 411 on the first printed wiring board 410 side, the second printed wiring board 20 can be easily positioned. Further, even when such a first printed wiring board 410 is used, the connection between the first printed wiring board 410 and the second printed wiring board 20 between the substrates is the same as in the first embodiment. Since it is performed in the bonding electrode 21, it is not necessary to use a member such as a connector or a lead frame for connecting the substrates, and the first printed wiring board 410 and the second printed wiring board 20 can be connected at low cost while increasing connection reliability. Can be electrically connected.

実施形態６．
図１１は本発明のプリント配線板ユニットの実施形態６を示す模式図であり、図１１を参照してプリント配線板ユニット５００について説明する。なお、図１１のプリント配線板ユニット５００において実施形態１のプリント配線板ユニット１と同一の構成を有する部位には同一の符号を付してその説明を省略する。図１１のプリント配線板ユニット５００が実施形態１のプリント配線板ユニット１と異なる点は、第１プリント配線板５１０側に突出部材５１１が設けられており、第２プリント配線板５２０側に凹部５２１が形成されている点である。Embodiment 6. FIG.
FIG. 11 is a schematic diagram showing a printed wiring board unit according to a sixth embodiment of the present invention. The printed wiring board unit 500 will be described with reference to FIG. In the printed wiring board unit 500 of FIG. 11, parts having the same configuration as the printed wiring board unit 1 of the first embodiment are denoted by the same reference numerals and description thereof is omitted. The printed wiring board unit 500 of FIG. 11 is different from the printed wiring board unit 1 of the first embodiment in that a protruding member 511 is provided on the first printed wiring board 510 side and a recess 521 is provided on the second printed wiring board 520 side. Is formed.

具体的には、第１プリント配線板５１０には、例えばジャンパー部品もしくは電子部品ＥＰ等からなり表面１０Ａから突出した突出部材５１１が設けられている。一方、第２プリント配線板５２０には、例えばスリットからなる凹部５２１が形成されており、凹部５２１は突出部材５１１を収容可能な大きさを有している。そして、第１プリント配線板５１０に第２プリント配線板５２０を搭載した際、凹部５２１に突出部材５１１が嵌め込まれることにより、第１プリント配線板５１０上に第２プリント配線板５２０が位置決めされる。これにより、位置決めと取り付け方向間違いとの両方を同時に防止することができる。なお、図１１において、突出部材５１１と凹部５２１とはそれぞれ１つずつ設けられている場合について例示しているが、設置数はこれに限らず、複数設置することでさらに位置決め精度を向上することができる。   Specifically, the first printed wiring board 510 is provided with a protruding member 511 that is made of, for example, a jumper component or an electronic component EP and protrudes from the surface 10A. On the other hand, the second printed wiring board 520 is formed with a recess 521 made of, for example, a slit, and the recess 521 has a size that can accommodate the protruding member 511. Then, when the second printed wiring board 520 is mounted on the first printed wiring board 510, the protruding member 511 is fitted into the recess 521, whereby the second printed wiring board 520 is positioned on the first printed wiring board 510. . As a result, both positioning and mounting direction mistakes can be prevented at the same time. In addition, in FIG. 11, although the case where the protrusion member 511 and the recessed part 521 are provided one each is illustrated, the number of installation is not restricted to this, and positioning accuracy is further improved by installing multiple. Can do.

さらに、このような第１プリント配線板５１０を用いた場合であっても、実施形態１と同様、第１プリント配線板５１０と第２プリント配線板５２０との基板間の接続が表面電極１１及び接合電極２１において行われるため、基板同士を接続するためのコネクタ又はリードフレーム等の部材を用いる必要がなくなり、安価に接続信頼性を高めながら第１プリント配線板５１０と第２プリント配線板５２０とを電気的に接続させることができる。   Further, even when such a first printed wiring board 510 is used, the connection between the first printed wiring board 510 and the second printed wiring board 520 between the substrates is the same as in the first embodiment. Since it is performed at the bonding electrode 21, it is not necessary to use a member such as a connector or a lead frame for connecting the substrates to each other, and the first printed wiring board 510 and the second printed wiring board 520 can be reduced while improving connection reliability at low cost. Can be electrically connected.

本発明の実施の形態は、上記実施の形態に限定されない。たとえば、上記各実施形態１〜６において、１つの第１プリント配線板１０と１つの第２プリント配線板２０とが一体化される場合について例示しているが、３つ以上の第２プリント配線板２０が一体化されていてもよい。この場合、第１プリント配線板１０の一面に複数の第２プリント配線板２０が接合されてもよいし、第１プリント配線板１０の両面に第２プリント配線板２０が接合されていてもよい。   The embodiment of the present invention is not limited to the above embodiment. For example, in each of the first to sixth embodiments, the case where one first printed wiring board 10 and one second printed wiring board 20 are integrated is illustrated, but three or more second printed wirings are used. The plate 20 may be integrated. In this case, a plurality of second printed wiring boards 20 may be bonded to one surface of the first printed wiring board 10, or the second printed wiring boards 20 may be bonded to both surfaces of the first printed wiring board 10. .

また、上記実施形態において、第１プリント配線板１０上に第２プリント配線板２０が接合された場合について例示しているが、第２プリント配線板２０にさらにプリント配線板が接合されたものであってもよい。この場合、第２プリント配線板２０の表面側に、第１プリント配線板１０と同様、表面電極が形成されることになる。   Moreover, in the said embodiment, although illustrated about the case where the 2nd printed wiring board 20 is joined on the 1st printed wiring board 10, the printed wiring board is further joined to the 2nd printed wiring board 20. There may be. In this case, a surface electrode is formed on the surface side of the second printed wiring board 20 in the same manner as the first printed wiring board 10.

さらに、実施形態４〜６において、第１プリント配線板側に突出部材を設ける場合について例示しているが、第１プリント配線板側に凹部が形成されており、第２プリント配線板の裏面２０Ｂに、凹部に嵌め込まれる凸部が形成されたものであってもよい。   Furthermore, in Embodiment 4-6, although the case where a protrusion member is provided in the 1st printed wiring board side is illustrated, the recessed part is formed in the 1st printed wiring board side, and the back surface 20B of a 2nd printed wiring board. In addition, a convex portion that fits into the concave portion may be formed.

１、３００、４００、５００ プリント配線板ユニット、１０、４１０、５１０ 第１プリント配線板、１０Ａ 第１プリント配線板の表面、１０Ｂ 第１プリント配線板の裏面、１１ 表面電極、２０、１２０、２２０、３２０、５２０ 第２プリント配線板、２０Ａ 第２プリント配線板の表面、２０Ｂ 第２プリント配線板の裏面、２１、２２１ 接合電極、２２ 実装電極、２３ 層間接続部、２２２ 接続配線パターン、３０１ 切欠部、３１１、４１１、５１１ 突出部材、５２１ 凹部、ＥＰ 電子部品。   1, 300, 400, 500 Printed wiring board unit 10, 410, 510 First printed wiring board, 10A Front surface of first printed wiring board, 10B Back surface of first printed wiring board, 11 Front electrode, 20, 120, 220 320, 520 Second printed wiring board, 20A Front surface of second printed wiring board, 20B Back surface of second printed wiring board, 21, 221 Bonding electrode, 22 Mounting electrode, 23 Interlayer connection part, 222 Connection wiring pattern, 301 Notch Part, 311, 411, 511 protruding member, 521 concave part, EP electronic component.

Claims (9)

第１プリント配線板と、前記第１プリント配線板上に接合された第２プリント配線板とを備えたプリント配線板ユニットであって、
前記第１プリント配線板は、
表面に前記第２プリント配線板が接合される表面電極と、
表面から突出した突出部材とを有するものであり、
前記第２プリント配線板は、
左右非対称の外形を有し、
前記第１プリント配線板の前記表面電極にはんだ付けにより一体的に接合されて電気的に接続される接合電極と、
外縁において、前記第１プリント配線板に接合された際に前記突出部材に当たる部分に一つの切欠部とを備え、
前記突出部材を基準として前記第１プリント配線板上に位置決めされるものであるプリント配線板ユニット。 A printed wiring board unit comprising a first printed wiring board and a second printed wiring board bonded on the first printed wiring board,
The first printed wiring board is
A surface electrode to which the second printed wiring board is bonded to the surface ;
And a protruding member protruding from the surface ,
The second printed wiring board is
It has an asymmetrical outer shape,
A joining electrode that is integrally joined to the surface electrode of the first printed wiring board by soldering and electrically connected ;
In the outer edge, when it is joined to the first printed wiring board, provided with one notch in the portion that hits the protruding member ,
A printed wiring board unit that is positioned on the first printed wiring board with reference to the protruding member . 前記第２プリント配線板は、表面側にＩＣチップ及び電子部品を搭載する請求項１に記載のプリント配線板ユニット。 The printed wiring board unit according to claim 1, wherein the second printed wiring board is mounted with an IC chip and an electronic component on a surface side. 前記接合電極は、複数の点状電極からなる請求項１又は２に記載のプリント配線板ユニット。 The bonding electrode, the printed circuit board unit according to claim 1 or 2 comprising a plurality of point-like electrodes. 前記第２プリント配線板は、
電子部品が実装される部品表面に設けられた実装電極と、
前記接合電極と前記実装電極とを電気的に接続する層間接続部と
をさらに有する請求項１〜３のいずれか１項に記載のプリント配線板ユニット。 The second printed wiring board is
Mounting electrodes provided on the component surface on which electronic components are mounted;
Printed circuit board unit according to any one of claims 1 to 3, further comprising an interlayer connection portion for electrically connecting the mounting electrode and the bonding electrode. 前記層間接続部は、スルーホールもしくはビアからなる請求項４に記載のプリント配線板ユニット。 The printed wiring board unit according to claim 4 , wherein the interlayer connection portion includes a through hole or a via. 前記接合電極は、前記層間接続部上に設けられている請求項４又は５に記載のプリント配線板ユニット。 The bonding electrode, the printed circuit board unit according to claim 4 or 5 is provided on the interlayer connection. 前記第２プリント配線板は、前記接合電極と前記層間接続部とを電気的に接続する接続配線パターンを備え、
前記接合電極は、前記層間接続部の形成位置からずれた位置に設けられている請求項４又は５に記載のプリント配線板ユニット。 The second printed wiring board includes a connection wiring pattern that electrically connects the bonding electrode and the interlayer connection portion,
The bonding electrode, the printed circuit board unit according to claim 4 or 5 is provided at a position shifted from the formation position of the interlayer connection portion. 前記第１プリント配線板の前記表面電極と前記第２プリント配線板の前記接合電極とは、同一の導体パターンを有する請求項１〜７のいずれか１項に記載のプリント配線板ユニット。 Wherein said surface electrode of the first printed wiring board and the second printed wiring board the bonding electrode of the printed wiring board unit according to any one of claims 1 to 7 having a same conductive pattern. 前記突出部材は、前記第１プリント配線板に実装された電子部品からなる請求項１〜８のいずれか１項に記載のプリント配線板ユニット。 The printed wiring board unit according to any one of claims 1 to 8 , wherein the protruding member includes an electronic component mounted on the first printed wiring board.
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