JPH0351988Y2 - - Google Patents

Description

[Detailed description of the invention] "Purpose of the invention" (Field of industrial application) The present invention relates to a connection structure for connecting two double-sided printed wiring boards by overlapping them, and in particular, the positioning of both printed wiring boards. It concerns the structure for making relationships and their connections appropriate.

(Prior art) Generally, electronic circuits that handle microwaves are wired using double-sided printed wiring boards, but in recent years there have been various types of circuits in which multiple double-sided printed wiring boards are bonded together to obtain the desired circuit characteristics. provided.

Conventionally, the connection structure between double-sided printed wiring boards of this type has generally been as shown in FIGS. When attaching the wiring board (hereinafter referred to as a sub-board) 21, the sub-board 21 is placed at an appropriate position on the mother board 20 using a positioning jig or the like, and then a jet soldering process is performed.
The sub-board 21 is provided with a through-horn 24 that penetrates the printed pattern 22 formed on the upper surface of the sub-board 21 and the printed pattern 23 formed on the mother board 20. Through-holes 27 are drilled through the ground-side conductor layer 25 formed on the back surface of the motherboard 21 and the ground-side conductor layer 26 provided on the back surface of the motherboard 20, respectively, and the solder is applied to the through-holes 24, 27 and connect the corresponding printed patterns 22, 23, etc., respectively.

In addition, as another conventional example, as shown in FIG.
Some are equipped with a pin for fitting in a corresponding manner.

(Problem that the invention attempts to solve) However, in the conventional method mentioned above,
Each method had its own drawbacks. In other words, in the case where the solder that has penetrated into the through-holes is used for both mechanical fixing and wiring, a jig is required for positioning the sub-board 21, which of course reduces productivity. The wiring used had the disadvantage that poor contact was likely to occur, reducing reliability.

In addition, a connection hole is drilled on the motherboard 20 side,
In the case where pins are provided on the sub-board 21 side and fitted into the pins, a new process for attaching the pins has to be added, resulting in high costs.

The present invention has been developed in view of the above points, and its purpose is to facilitate alignment of both printed wiring boards and ensure reliable wiring when multiple double-sided printed wiring boards are overlapped and wired. It is an object of the present invention to provide a connection structure between double-sided printed wiring boards that can be implemented at low cost.

"Structure of the invention" (Means for solving the problems) The connection structure between double-sided printed wiring boards according to the invention has a printed pattern formed on the upper surface and a ground side conductor layer formed on the lower surface. A second double-sided printed wiring board, which has a printed pattern on the upper surface and a ground side conductor layer on the lower surface, is placed on top of the first double-sided printed wiring board in the same way as the first double-sided printed wiring board. A connection structure for interconnecting printed wiring boards,
The first double-sided printed wiring board is provided with pins that also serve as wiring and are electrically connected to the printed pattern on the top surface, and the second double-sided printed wiring board is provided with pin holes corresponding to the pins. The double-sided printed wiring board is provided with through holes so that the ground side conductor layers of both printed wiring boards can be connected with a jet of solder when solder-dipped.

(Example) An example of the double-sided printed wiring board according to the present invention will be described based on FIGS. 1 to 5.

In the figure, reference numeral 1 denotes a first double-sided printed wiring board (hereinafter abbreviated as the first board), with a printed pattern 2 on its upper surface and a ground side conductor layer (so-called ground plane) 3 on its lower surface. are formed respectively.

Reference numeral 4 denotes a second double-sided printed wiring board (hereinafter referred to as the second board) to be placed on the first board, and like the first board 1, there is a printed wiring board on the top surface. A ground side conductor layer 6 is formed on the lower surface of the pattern 5. Reference numeral 7 denotes pins which are also used for wiring and which are installed upright on the first substrate 1, and in the illustrated example, four pins are installed so as to be in contact with the printed pattern 2.
The area around pin 7 is removed so that it does not come into contact with pin 7.

On the other hand, pin holes 8 to 8 corresponding to the pins 7 to 7 are provided on the second substrate 4 so as to be located on the printed pattern 5, and by inserting these into the pins 7, The second substrate 4 is temporarily fixed at a predetermined position.

The first substrate 1 has the ground side conductor layers 3 and 6.
Through hole 9 for joining via solder
is provided, and in the illustrated example, the second substrate 4
They are provided at four locations corresponding to the corners of the board 1 and 4 so that both the substrates 1 and 4 can be firmly joined.

The second board 4 arranged as described above is transferred to the jet soldering process together with the first board 1, and the other parts inserted into the first board 1 are soldered together through the through holes 9. Soldering 11 is performed on both ground side conductor layers 3 and 6, respectively, and soldering 12 is also performed on the printed pattern 2 and pin 7 at the same time. Thereafter, the printed pattern 5 is soldered 10 to the pin 7 to complete the process.

As mentioned above, the second substrate 4 is the same as the first substrate 1.
Since the wiring can be accurately fixed at a predetermined position on the top and can be reliably wired using pins, reliability can be improved compared to conventional wiring that relies only on solder. Moreover, since the erecting of the pin 7 can be carried out simultaneously with the erecting process of other wrapping pins (not shown) erected on the first substrate 1, there is no particular increase in the number of manufacturing steps, and the cost is reduced. It can be implemented.

"Effect of the invention" According to the connection structure between double-sided printed wiring boards according to the present invention, the first double-sided printed wiring board has a printed pattern formed on the upper surface and a ground side conductor layer on the lower surface. Similarly to the first double-sided printed wiring board, a second double-sided printed wiring board having a printed pattern on the upper surface and a ground side conductor layer on the lower surface is arranged in an overlapping manner to connect the two printed wiring boards to each other. , the second double-sided printed wiring board can be temporarily fixed in a predetermined position by fitting the pin holes of the second double-sided printed wiring board to the pins set up on the first double-sided printed wiring board, and the wiring is In addition to the pins described above, the mechanical connection between the first and second double-sided printed wiring boards can be strengthened by soldering through through holes.

Therefore, it is possible to improve not only productivity but also the reliability of the circuit, and since no special process is required for implementation, there is no increase in costs. It has its features.

[Brief explanation of the drawing]

1 to 5 show an embodiment of the connection structure between double-sided printed wiring boards according to the present invention, FIG. 1 is an exploded perspective view, FIG. 2 is a perspective view showing an assembled state, and FIG. 3 is a perspective view showing an assembled state. 4 is a bottom view, FIG. 5 is a cross-sectional view, FIGS. 6 to 8 show the connection structure between conventional double-sided printed wiring boards, FIG. 6 is a top view, and FIG. 7 is a bottom view. A side perspective view and FIG. 8 are perspective views showing another example. 1...first double-sided printed wiring board, 2, 5...
...Printed pattern, 3,6...Ground side conductor layer,
4...Second double-sided printed wiring board, 7...Pin, 9...Through hole.

Claims (1)

[Claims for Utility Model Registration] On a first double-sided printed wiring board, on which a printed pattern is formed on the upper surface and a ground side conductor layer is formed on the lower surface, similar to the first double-sided printed wiring board, , a connection structure for connecting both printed wiring boards by overlappingly arranging second double-sided printed wiring boards each having a printed pattern on the upper surface and a ground side conductor layer on the lower surface, the first double-sided printed wiring board The wiring board has a pin that serves as a wiring conductor connected to the printed pattern on the upper surface, and a pin hole for the pin is bored in the second double-sided printed wiring board.
The first double-sided printed wiring board is provided with a through hole so that the ground side conductor layers of both printed wiring boards are connected by jet solder when solder-dipped. connection structure.