JPH0523568U - Small module mounting device - Google Patents
Small module mounting deviceInfo
- Publication number
- JPH0523568U JPH0523568U JP7189091U JP7189091U JPH0523568U JP H0523568 U JPH0523568 U JP H0523568U JP 7189091 U JP7189091 U JP 7189091U JP 7189091 U JP7189091 U JP 7189091U JP H0523568 U JPH0523568 U JP H0523568U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- module
- small module
- mounting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】
【目的】 モジュール基板の両面への部品実装、印刷配
線板の部品実装高さを低くする。
【構成】 印刷配線板１にモジュール基板より小さい穴
４を設け、リード端子３にて印刷配線板１に半田付けす
る。
【効果】 モジュール基板２の両面に部品７を実装する
ことができ、かつ、印刷配線板１の部品実装高さを低く
する。
(57) [Summary] [Purpose] To reduce the component mounting height on both sides of the module board and the printed wiring board. [Structure] The printed wiring board 1 is provided with holes 4 smaller than the module substrate, and the lead terminals 3 are soldered to the printed wiring board 1. [Effect] The component 7 can be mounted on both surfaces of the module substrate 2, and the component mounting height of the printed wiring board 1 can be reduced.
Description
【０００１】[0001]
この考案は、電子機器に実装される小型モジュールの実装方法に関するもので ある。 The present invention relates to a mounting method for a small module mounted on an electronic device.
【０００２】[0002]
図３は従来の小型モジュールの実装方法を示す。図において１はカードバスケ ットに搭載される印刷配線板、２はモジュール基板、５は基板に接続されるピン 端子、６はスルーホール、７は部品である。 FIG. 3 shows a conventional mounting method for a small module. In the figure, 1 is a printed wiring board mounted on a card basket, 2 is a module substrate, 5 is a pin terminal connected to the substrate, 6 is a through hole, and 7 is a component.
【０００３】 従来のモジュールは上記のように構成され、モジュール基板２のスルーホール ６にピン端子５を半田付、次に印刷配線板１のスルーホール６にピン端子５を半 田付することで、モジュール基板２の印刷配線板１への実装が完了する。The conventional module is configured as described above, and by soldering the pin terminals 5 to the through holes 6 of the module substrate 2 and then soldering the pin terminals 5 to the through holes 6 of the printed wiring board 1, Mounting of the module substrate 2 on the printed wiring board 1 is completed.
【０００４】[0004]
上記のような従来の実装方法では、印刷配線板１に対する面に実装した部品７ の交換、調整ができない。また、印刷配線板１の部品実装高さが高くなり、カー ドバスケットなどに印刷配線板１を実装する場合、専有空間が増えるなどの問題 点があった。 With the conventional mounting method as described above, the component 7 mounted on the surface of the printed wiring board 1 cannot be replaced or adjusted. Further, the mounting height of the printed wiring board 1 becomes high, and when the printed wiring board 1 is mounted on a card basket or the like, there is a problem that an occupied space increases.
【０００５】 この考案は上記のような問題点を解消するためになされたもので、モジュール 基板２の両面に部品実装できるとともに、部品実装高さが低くなる小型モジュー ルの実装方法を提供することを目的とする。The present invention has been made in order to solve the above problems, and provides a method for mounting a small module in which components can be mounted on both sides of the module substrate 2 and the mounting height of the components is low. With the goal.
【０００６】[0006]
この考案に係る小型モジュールの実装方法においては、印刷配線板に小型モジ ュールより小さい穴を設けたものである。 In the mounting method of the small module according to the present invention, the printed wiring board is provided with a hole smaller than the small module.
【０００７】[0007]
上記のように構成された印刷配線板にモジュール基板を実装すると、印刷配線 板に設けた穴よりモジュール基板の部品の交換、調整が可能となる。 When the module board is mounted on the printed wiring board configured as described above, the parts of the module board can be exchanged and adjusted through the holes provided in the printed wiring board.
【０００８】[0008]
実施例１． 図１はこの考案の一実施例を示す図であり、図１において１〜２は上記従来の 実装方法と全く同一のものである。３は基板に接続されるリード端子、４は印刷 配線板に設けた小型モジュールより小さい穴である。 Example 1. FIG. 1 is a diagram showing an embodiment of the present invention. In FIG. 1, 1-2 are exactly the same as the conventional mounting method. Reference numeral 3 is a lead terminal connected to the substrate, and 4 is a hole smaller than a small module provided on the printed wiring board.
【０００９】 前記のように構成された小型モジュール実装方法においてはモジュール基板２ の印刷配線板１に対する面に取付けられた部品７の交換、調整が穴４より行なえ る。また、印刷配線板１の穴４にモジュール基板２の部品７を落し込むことによ り部品実装高さを低くすることになる。In the small module mounting method configured as described above, the component 7 mounted on the surface of the module substrate 2 with respect to the printed wiring board 1 can be replaced and adjusted through the hole 4. Further, by dropping the component 7 of the module substrate 2 into the hole 4 of the printed wiring board 1, the component mounting height is lowered.
【００１０】[0010]
以上のように、この考案によれば印刷配線板に小型モジュールより小さい穴を 設けたことにより、小型モジュール基板の両面に部品実装ができ、また、印刷配 線板の部品実装高さを低くする効果がある。 As described above, according to the present invention, by providing the printed wiring board with holes smaller than the small module, components can be mounted on both sides of the small module board, and the mounting height of the printed wiring board can be reduced. effective.
【図１】この考案の実施例１を示す図である。FIG. 1 is a diagram showing a first embodiment of the present invention.
【図２】この考案の実施例１を示す断面図である。FIG. 2 is a sectional view showing a first embodiment of the present invention.
【図３】従来の小型モジュール実装方法を示す図であ
る。FIG. 3 is a diagram showing a conventional small module mounting method.
【図４】従来の小型モジュール実装方法を示す図であ
る。FIG. 4 is a diagram showing a conventional small module mounting method.
１ 印刷配線板 ２ モジュール基板 ３ リード端子 ４ 穴 ５ ピン端子 ６ スルーホール ７ 部品 1 Printed wiring board 2 Module board 3 Lead terminal 4 hole 5 Pin terminal 6 Through hole 7 Parts
Claims (1)
実装方法において、印刷配線板に小型モジュールより小
さい穴を設けたことを特徴とする小型モジュール実装装
置。1. A mounting method for a small module to be mounted on a printed wiring board, wherein a hole smaller than the small module is provided in the printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7189091U JPH0523568U (en) | 1991-09-09 | 1991-09-09 | Small module mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7189091U JPH0523568U (en) | 1991-09-09 | 1991-09-09 | Small module mounting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0523568U true JPH0523568U (en) | 1993-03-26 |
Family
ID=13473588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7189091U Pending JPH0523568U (en) | 1991-09-09 | 1991-09-09 | Small module mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0523568U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2015151292A1 (en) * | 2014-04-04 | 2017-04-13 | 三菱電機株式会社 | Printed wiring board unit |
-
1991
- 1991-09-09 JP JP7189091U patent/JPH0523568U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2015151292A1 (en) * | 2014-04-04 | 2017-04-13 | 三菱電機株式会社 | Printed wiring board unit |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0523568U (en) | Small module mounting device | |
| JPS631093A (en) | Electronic parts mounting board device | |
| JPH01161707A (en) | Chip component | |
| JPS58182430U (en) | Flat package integrated circuit mounting equipment | |
| JPS59180470U (en) | Printed circuit board connection structure | |
| JPH01238091A (en) | Printed board | |
| JPS59123364U (en) | circuit device | |
| JPH0645348U (en) | Hybrid IC lead terminal | |
| JPH02265177A (en) | Connection construction of lead terminal | |
| JPS58138370U (en) | LSI package spacer | |
| JPS6013772U (en) | Printed circuit board for mounting chipped components | |
| JPS6042761U (en) | printed circuit board equipment | |
| JPS596865U (en) | Electrical component | |
| JPS5972706U (en) | Positioning structure of chip parts and board | |
| JPH054574U (en) | Hybrid integrated circuit device | |
| JPS6042460U (en) | Parts repair equipment | |
| JPS63186493A (en) | Construction of mounting electronic component | |
| JPS6094861U (en) | printed circuit device | |
| JPS5956773U (en) | Component mounting structure for double-sided through-hole board | |
| JPS5822764U (en) | Mounting device for chip-shaped parts | |
| JPS60149143U (en) | Substrate for hybrid integrated circuits | |
| JPS6071185U (en) | Insulating sheet structure | |
| JPS60119777U (en) | Assembly structure of parts | |
| JPS58150862U (en) | Chip parts mounting device | |
| JPS6092860U (en) | Printed circuit board component insertion structure |