JP4943930B2

JP4943930B2 - Mounting structure of 3D circuit parts

Info

Publication number: JP4943930B2
Application number: JP2007114739A
Authority: JP
Inventors: 豊西羅; 良幸内野々; 紀公梶
Original assignee: Panasonic Corp; Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Corp; Panasonic Holdings Corp
Priority date: 2007-04-24
Filing date: 2007-04-24
Publication date: 2012-05-30
Anticipated expiration: 2027-04-24
Also published as: JP2008270106A

Description

本発明は、立体回路部品の取付構造に関する。 The present invention relates to a mounting structure for a three-dimensional circuit component.

従来、立体回路部品の取付構造として、一方の面に半導体チップが実装される素子用電極が設けられるとともに他方の面に端子用電極が設けられ、これら素子用電極と端子用電極とが導電性膜によって電気的に接続された板状基板をはんだ付けすることで回路基板に取り付けて、板状基板と回路基板とを電気的に接続させたものが知られている（例えば特許文献１参照）。 Conventionally, as a mounting structure of a three-dimensional circuit component, an element electrode on which a semiconductor chip is mounted is provided on one side and a terminal electrode is provided on the other side. The element electrode and the terminal electrode are electrically conductive. A plate-like substrate electrically connected by a film is attached to a circuit board by soldering, and the plate-like board and the circuit board are electrically connected (for example, see Patent Document 1). .

この特許文献１では、板状基板に一方の面から他方の面に達するスルーホール電極を設け、このスルーホール電極に導電性膜を形成することで素子用電極と端子用電極との電気的接続を行うとともに、板状基板のスルーホール電極が形成された部位と回路基板上に形成された回路パターンとをはんだ付けすることで板状基板が回路基板に取り付けられている。こうして、各取付部位におけるはんだ量が不均一であったとしても、板状基板に一方の端部を浮き上がらせるような応力が生じてしまうのをなくし、導通不良を防止することができるようにしている。
特開２０００−２１６４４０号公報 In this Patent Document 1, a through-hole electrode reaching from one surface to the other surface is provided on a plate-like substrate, and an electrical connection between the element electrode and the terminal electrode is formed by forming a conductive film on the through-hole electrode. In addition, the plate-like substrate is attached to the circuit board by soldering a portion of the plate-like board where the through-hole electrode is formed and a circuit pattern formed on the circuit board. In this way, even if the amount of solder at each attachment site is non-uniform, it is possible to prevent the occurrence of stress that causes one end of the plate-like substrate to float, and to prevent poor conduction. Yes.
JP 2000-216440 A

しかしながら、板状基板の線膨張率と回路基板の線膨張率は互いに異なるものであり、半導体チップの発熱によって板状基板および回路基板に熱が蓄積されると、板状基板と回路基板との線膨張率の相異によってはんだ部分に応力が生じ、当該応力によってはんだが破損してしまうおそれがある。すなわち、はんだ付けによる実装では、導通不良が生じてしまうおそれがある。 However, the linear expansion coefficient of the plate substrate and the linear expansion coefficient of the circuit substrate are different from each other, and when heat is accumulated in the plate substrate and the circuit substrate due to heat generation of the semiconductor chip, the plate substrate and the circuit substrate Stress is generated in the solder portion due to the difference in linear expansion coefficient, and the solder may be damaged by the stress. That is, in mounting by soldering, there is a possibility that poor conduction will occur.

そこで、かかる問題を解決するために接触バネを有するソケットを用いて立体回路部品を取り付け、立体回路部品とソケットとを電気的に接続するものが提案されている。 In order to solve such a problem, there has been proposed one in which a three-dimensional circuit component is attached using a socket having a contact spring and the three-dimensional circuit component and the socket are electrically connected.

しかしながら、特許文献１に記載の板状基板を用いた場合、板状基板をソケットに取り付ける際に、接触バネを板状基板の側面部に接触させるとソケットの幅が広くなってしまい、上面部若しくは下面部に接触させるとソケットが厚くなってしまう。 However, when the plate-like substrate described in Patent Document 1 is used, when the plate-like substrate is attached to the socket, if the contact spring is brought into contact with the side surface portion of the plate-like substrate, the width of the socket becomes wide, and the upper surface portion Or if it contacts a lower surface part, a socket will become thick.

このように、上記従来技術では、立体回路部品の取付構造の小型化が図りにくかった。 Thus, in the above prior art, it is difficult to reduce the size of the mounting structure of the three-dimensional circuit component.

そこで、本発明は、導通不良を抑制することができるとともに、小型化を図ることのできる立体回路部品の取付構造を得ることを目的とする。 Therefore, an object of the present invention is to obtain a mounting structure for a three-dimensional circuit component that can suppress conduction failure and can be miniaturized.

請求項１に記載の発明は、電子部品を電気的に接続する回路パターンが表面に形成されて電子部品が実装される立体回路部品と、前記立体回路部品を収納するフレーム部と前記立体回路部品を保持する接触バネ部とを有するソケットと、を備える立体回路部品の取付構造であって、前記立体回路部品は、当該立体回路部品の側部を傾斜面が形成されるように切り欠いた切欠凹部が設けられているとともに、当該切欠凹部の傾斜面には前記回路パターンの一部である端子部が設けられており、前記接触バネ部は、前記端子部に接触するとともに、前記切欠凹部の傾斜面を上方から押圧して前記立体回路部品を保持する第１の接触バネを備えていることを特徴とする。 According to the first aspect of the present invention, there is provided a three-dimensional circuit component on which a circuit pattern for electrically connecting electronic components is formed on the surface and mounting the electronic component, a frame portion for housing the three-dimensional circuit component, and the three-dimensional circuit component And a socket having a contact spring portion for holding a three-dimensional circuit component, wherein the three-dimensional circuit component has a notch in which a side surface of the three-dimensional circuit component is notched so that an inclined surface is formed. A concave portion is provided, and a terminal portion which is a part of the circuit pattern is provided on the inclined surface of the notched concave portion, and the contact spring portion contacts the terminal portion, and the notched concave portion A first contact spring for holding the three-dimensional circuit component by pressing an inclined surface from above is provided.

請求項２に記載の発明は、請求項１に記載の立体回路部品の取付構造において、前記接触バネ部は、前記立体回路部品を保持する第２の接触バネを備えていることを特徴とする。 According to a second aspect of the present invention, in the mounting structure of the three-dimensional circuit component according to the first aspect, the contact spring portion includes a second contact spring that holds the three-dimensional circuit component. .

請求項３に記載の発明は、請求項２に記載の立体回路部品の取付構造において、前記第２の接触バネと前記フレーム部とが一体に成形されていることを特徴とする。 The invention according to claim 3 is the mounting structure of the molded circuit component according to claim 2, wherein the second contact spring and the frame portion are integrally formed.

請求項４に記載の発明は、請求項１〜３のうちいずれか１項に記載の立体回路部品の取付構造において、前記立体回路部品の少なくとも一部に凹部が形成され、当該凹部内に前記回路パターンが形成されていることを特徴とする。 According to a fourth aspect of the present invention, in the three-dimensional circuit component mounting structure according to any one of the first to third aspects, a recess is formed in at least a part of the three-dimensional circuit component, and the recess is formed in the recess. A circuit pattern is formed.

請求項５に記載の発明は、請求項１〜４のうちいずれか１項に記載の立体回路部品の取付構造において、前記第１の接触バネは前記端子部に当接する屈曲部を備えるとともに、前記端子部はノッチ部を備えており、前記屈曲部を前記ノッチ部に２箇所で接触させたことを特徴とする。 The invention according to claim 5 is the mounting structure of the three-dimensional circuit component according to any one of claims 1 to 4, wherein the first contact spring includes a bent portion that comes into contact with the terminal portion. The terminal portion includes a notch portion, and the bent portion is brought into contact with the notch portion at two locations.

請求項６に記載の発明は、請求項１〜５のうちいずれか１項に記載の立体回路部品の取付構造において、前記ソケットは、前記立体回路部品を支持する突起部を備えていることを特徴とする。 According to a sixth aspect of the present invention, in the mounting structure of the three-dimensional circuit component according to any one of the first to fifth aspects, the socket includes a protrusion that supports the three-dimensional circuit component. Features.

請求項７に記載の発明は、請求項１〜６のうちいずれか１項に記載の立体回路部品の取付構造において、前記立体回路部品の下面部を放熱板に当接させていることを特徴とする。 A seventh aspect of the present invention is the mounting structure of the three-dimensional circuit component according to any one of the first to sixth aspects, wherein the lower surface portion of the three-dimensional circuit component is brought into contact with a heat sink. And

請求項８に記載の発明は、請求項７に記載の立体回路部品の取付構造において、前記ソケットの下部には、当該ソケットを保持する保持金具が設けられており、当該保持金具を介して前記立体回路部品の下面部を前記放熱板に当接させていることを特徴とする。 The invention according to claim 8 is the mounting structure of the molded circuit component according to claim 7, wherein a holding fitting for holding the socket is provided at a lower portion of the socket, and the holding fitting is provided via the holding fitting. The lower surface portion of the three-dimensional circuit component is in contact with the heat radiating plate.

請求項９に記載の発明は、請求項８に記載の立体回路部品の取付構造において、前記立体回路部品の下面部に突部を設けるとともに前記保持金具に挿通孔を設け、前記突部を前記挿通孔に挿通させたことを特徴とする。 According to a ninth aspect of the present invention, in the mounting structure of the molded circuit component according to the eighth aspect, a protrusion is provided on the lower surface portion of the molded circuit component, and an insertion hole is provided in the holding metal fitting. It is characterized by being inserted through the insertion hole.

請求項１０に記載の発明は、請求項８または請求項９に記載の立体回路部品の取付構造において、前記保持金具は、前記放熱板への取付部を備えていることを特徴とする。 According to a tenth aspect of the present invention, in the three-dimensional circuit component mounting structure according to the eighth or ninth aspect, the holding bracket includes a mounting portion to the heat radiating plate.

請求項１１に記載の発明は、請求項７に記載の立体回路部品の取付構造において、前記立体回路部品と前記放熱板とに互いに嵌合する凹凸部を設けたことを特徴とする。 According to an eleventh aspect of the present invention, in the three-dimensional circuit component mounting structure according to the seventh aspect, an uneven portion is provided on the three-dimensional circuit component and the heat radiating plate.

請求項１の発明によれば、立体回路部品の側部を切り欠いて切欠凹部を設けるとともに、当該切欠凹部の内面に回路パターンの一部である端子部を設け、当該端子部にソケットに設けられた第１の接触バネを当接させているため、ソケットの幅を狭くすることができ、以て、立体回路部品の取付構造の小型化を図ることができる。また、第１の接触バネが切欠凹部の内面を押圧して立体回路部品を保持しているため、第１の接触バネと端子部とが接触不良を起こしてしまうのを抑制することができる。 According to the first aspect of the present invention, the side portion of the three-dimensional circuit component is cut out to provide a cutout recess, and the terminal portion that is a part of the circuit pattern is provided on the inner surface of the cutout recess, and the terminal portion is provided in the socket. Since the first contact spring is abutted, the width of the socket can be reduced, and the mounting structure of the three-dimensional circuit component can be reduced in size. Moreover, since the 1st contact spring presses the inner surface of a notch recessed part and hold | maintains a three-dimensional circuit component, it can suppress that a 1st contact spring and a terminal part raise | generate a contact failure.

請求項２の発明によれば、第１の接触バネとは別に立体回路部品を保持する第２の接触バネを設けたため、より確実に立体回路部品を保持することができる上、第１の接触バネによる傾斜面の押圧力を低く設定しても立体回路部品を保持することができるようになる。その結果、第１の接触バネによる傾斜面の押圧で回路パターンが剥離してしまうのを抑制することができ、回路パターンの寿命を向上させることができる。 According to the second aspect of the present invention, since the second contact spring for holding the three-dimensional circuit component is provided separately from the first contact spring, the three-dimensional circuit component can be held more reliably, and the first contact Even if the pressing force of the inclined surface by the spring is set low, the three-dimensional circuit component can be held. As a result, it is possible to prevent the circuit pattern from being peeled off by pressing the inclined surface by the first contact spring, and it is possible to improve the life of the circuit pattern.

請求項３の発明によれば、第２の接触バネとフレーム部とを一体に成形することで、製造工程の簡素化を図ることができるとともに部品点数の低減を図ることができ、コスト的に有利に製造することができる。 According to the invention of claim 3, by integrally molding the second contact spring and the frame portion, the manufacturing process can be simplified and the number of parts can be reduced, and the cost can be reduced. It can be produced advantageously.

請求項４の発明によれば、立体回路部品の少なくとも一部に凹部を形成し、当該凹部内に回路パターンを形成することで、回路パターンが設けられた部位と第２の接触バネが押圧する部位とが重なってしまったとしても、当該第２の接触バネが直接回路パターンを押さえることがなくなるため、回路パターンが剥離してしまうのを抑制することができる。 According to the invention of claim 4, the concave portion is formed in at least a part of the three-dimensional circuit component, and the circuit pattern is formed in the concave portion, whereby the portion where the circuit pattern is provided and the second contact spring are pressed. Even if it overlaps with the part, the second contact spring does not directly hold the circuit pattern, so that the circuit pattern can be prevented from peeling off.

請求項５の発明によれば、第１の接触バネに端子部に当接する屈曲部を設けるとともに端子部にノッチ部を設け、屈曲部をノッチ部に２箇所で接触させているため、第１の接触バネと端子部との相対移動をより抑制することができ、導通不良が生じてしまうのを抑制することができる。 According to the invention of claim 5, the first contact spring is provided with the bent portion that contacts the terminal portion, the terminal portion is provided with the notch portion, and the bent portion is brought into contact with the notch portion at two locations. The relative movement between the contact spring and the terminal portion can be further suppressed, and the occurrence of poor conduction can be suppressed.

請求項６の発明によれば、ソケットに立体回路部品を支持する突起部を設けることで、立体回路部品をより確実に支持することができる。その結果、ソケットと立体回路部品との相対移動をより抑制することができる。また、突起部によって立体回路部品の位置決めがなされるため、立体回路部品を所定位置に精度良く取り付けることができる。 According to the sixth aspect of the present invention, the three-dimensional circuit component can be supported more reliably by providing the socket with the protruding portion that supports the three-dimensional circuit component. As a result, relative movement between the socket and the molded circuit component can be further suppressed. In addition, since the three-dimensional circuit component is positioned by the protrusion, the three-dimensional circuit component can be attached to the predetermined position with high accuracy.

請求項７の発明によれば、立体回路部品の下面部を放熱板に当接させることで、電子部品により発生した熱を放熱板から放熱させることができる。 According to invention of Claim 7, the heat | fever generated by the electronic component can be radiated from a heat sink by making the lower surface part of a three-dimensional circuit component contact | abut to a heat sink.

請求項８の発明によれば、ソケットを保持する保持金具を備えることで、保持金具によってソケットが補強されて強度を高めることができるため、ソケットの薄型化を図ることができる。 According to the invention of claim 8, by providing the holding metal fitting for holding the socket, the socket can be reinforced by the holding metal fitting to increase the strength, so that the socket can be thinned.

請求項９の発明によれば、立体回路部品の下面部に突部を設けるとともに保持金具に挿通孔を設け、突部を挿通孔に挿通させることで、立体回路部品を放熱板に取り付ける際に、上方からだけでなく放熱板の面に沿わせて横方向からも取り付けることができるようになり、立体回路部品の放熱板への取り付け自由度を向上させることができる。 According to the ninth aspect of the present invention, when the three-dimensional circuit component is attached to the heat sink by providing the protrusion on the lower surface portion of the three-dimensional circuit component, providing the insertion hole in the holding metal fitting, and inserting the protrusion through the insertion hole. It becomes possible to attach not only from above but also from the lateral direction along the surface of the heat sink, and the degree of freedom of mounting the three-dimensional circuit component to the heat sink can be improved.

請求項１０の発明によれば、保持金具に、放熱板への取付部が設けられているため、立体回路部品の放熱板への取り付けの際に第１の接触バネと端子部とが接触不良を起こしてしまうのを抑制することができ、導通不良が生じることなく立体回路部品を放熱板に取り付けることができる。 According to the tenth aspect of the present invention, since the attachment part to the heat sink is provided in the holding metal fitting, the first contact spring and the terminal part are in poor contact when the three-dimensional circuit component is attached to the heat sink. The three-dimensional circuit component can be attached to the heat radiating plate without causing poor conduction.

請求項１１の発明によれば、立体回路部品と放熱板とに互いに嵌合する凹凸部を設けることで、立体回路部品を取り付けやすくすることができる上、立体回路部品の位置決めがなされ、立体回路部品を所定位置に精度良く取り付けることができる。 According to the eleventh aspect of the present invention, the three-dimensional circuit component can be easily attached by providing the three-dimensional circuit component and the heat sink so that the three-dimensional circuit component can be easily attached, and the three-dimensional circuit component is positioned. The component can be accurately attached to a predetermined position.

以下、本発明の実施形態について図面を参照しながら詳細に説明する。なお、以下では、電子部品としてＬＥＤチップを用い、立体回路部品を放熱板に取り付ける構造について例示する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, below, it illustrates about the structure which uses a LED chip as an electronic component and attaches a three-dimensional circuit component to a heat sink.

（第１実施形態）図１は、本実施形態にかかる立体回路部品の取付構造の斜視図、図２は、立体回路部品の取付構造の分解斜視図、図３は、立体回路部品の取付構造の平面図、図４は、図３のＡ−Ａ断面図、図５は、図３のＢ−Ｂ断面図である。 (First Embodiment) FIG. 1 is a perspective view of a mounting structure of a three-dimensional circuit component according to this embodiment, FIG. 2 is an exploded perspective view of a mounting structure of the three-dimensional circuit component, and FIG. 3 is a mounting structure of the three-dimensional circuit component. 4 is a cross-sectional view taken along line AA in FIG. 3, and FIG. 5 is a cross-sectional view taken along line BB in FIG.

本実施形態にかかる立体回路部品の取付構造は、下面に正負の電極（図示せず）が形成された略直方体状のＬＥＤチップ４０と、当該ＬＥＤチップ４０が実装される立体回路部品１０と、立体回路部品１０を収納するソケット２０と、ソケット２０を補強する保持金具５０と、ＬＥＤチップ４０から生じた熱を放出する放熱板３０と、を備える。 The mounting structure of the three-dimensional circuit component according to the present embodiment includes a substantially rectangular parallelepiped LED chip 40 having positive and negative electrodes (not shown) formed on the lower surface, and a three-dimensional circuit component 10 on which the LED chip 40 is mounted. A socket 20 that houses the three-dimensional circuit component 10, a holding metal fitting 50 that reinforces the socket 20, and a radiator plate 30 that releases heat generated from the LED chip 40 are provided.

立体回路部品１０は、ＰＰＳ（ポリフェニレンスルフィド）、ＰＥＥＫ（ポリエーテルエーテルケトン）、ポリフタルアミドなどの樹脂材料で形成されており、絶縁性を有している。なお、立体回路部品１０は、絶縁性を有していればよく、樹脂製材料のほかに、アルミナ、窒化アルミ、炭化ケイ素などのセラミック材料を用いることも可能である。また、銅やアルミなどを所定形状に成形し、その上に絶縁材料を被覆したメタルコア基板などを用いることも可能である。 The three-dimensional circuit component 10 is formed of a resin material such as PPS (polyphenylene sulfide), PEEK (polyetheretherketone), polyphthalamide, etc., and has an insulating property. The three-dimensional circuit component 10 only needs to have insulating properties, and a ceramic material such as alumina, aluminum nitride, or silicon carbide can be used in addition to the resin material. It is also possible to use a metal core substrate or the like in which copper or aluminum is formed into a predetermined shape and an insulating material is coated thereon.

本実施形態では、立体回路部品１０は、略直方体状の下段部１１と、平面視で下段部１１よりも一回り小さい長方形状をし、かつ側面視で略台形状をしている上段部１２と、を備えた形状をしている。 In the present embodiment, the three-dimensional circuit component 10 has a substantially rectangular parallelepiped lower step portion 11 and an upper step portion 12 that has a rectangular shape that is slightly smaller than the lower step portion 11 in plan view and has a substantially trapezoidal shape in side view. And has a shape with

すなわち、立体回路部品１０は、略直方体状の下段部１１の上面に下段部１１の上面よりも一回り小さい底面を有する上段部１２を載置した形状をしており、図３に示すように、下段部１１の上面には略枠状の平坦面１１ａが形成されることとなる。そして、平坦面（立体回路部品１０の表面）１１ａの短手方向（図３において上下方向）両側の長手方向（図３において左右方向）略中央部には、溝部（凹部）１１ｃ，１１ｃがそれぞれ設けられている。また、下段部１１は、図５に示すように、その下面の短手方向両端がテーパ状に面取りされている。 That is, the three-dimensional circuit component 10 has a shape in which an upper step portion 12 having a bottom surface slightly smaller than the upper surface of the lower step portion 11 is placed on the upper surface of the lower step portion 11 having a substantially rectangular parallelepiped shape, as shown in FIG. A substantially frame-shaped flat surface 11 a is formed on the upper surface of the lower step portion 11. Then, groove portions (concave portions) 11c and 11c are respectively provided at substantially central portions in the longitudinal direction (left and right direction in FIG. 3) on both sides of the flat surface (surface of the three-dimensional circuit component 10) in the short direction (vertical direction in FIG. 3). Is provided. Further, as shown in FIG. 5, the lower step portion 11 is chamfered at both ends in the short direction in a taper shape.

そして、上段部１２の長手方向両側部には、傾斜面１２ｂ，１２ｂがそれぞれ設けられており、これら傾斜面１２ｂ，１２ｂには、短手方向に沿って略Ｖ字状の溝がそれぞれ形成されている。 In addition, inclined surfaces 12b and 12b are respectively provided on both sides in the longitudinal direction of the upper step portion 12, and substantially inclined V-shaped grooves are formed in the inclined surfaces 12b and 12b in the short direction. ing.

すなわち、本実施形態では、立体回路部品１０の長手方向両側部に、切欠凹部１０ｂが設けられ、上段部１２の傾斜面１２ｂと下段部１１の平坦面１１ａとで切欠凹部１０ｂの内面が形成されている。 That is, in this embodiment, the notch recess 10b is provided on both sides in the longitudinal direction of the molded circuit component 10, and the inner surface of the notch recess 10b is formed by the inclined surface 12b of the upper step portion 12 and the flat surface 11a of the lower step portion 11. ing.

また、上段部１２の上面部（立体回路部品１０の表面）１２ａ、傾斜面（立体回路部品１０の表面）１２ｂおよび側面部（立体回路部品１０の表面）１２ｇには、図２に示すように、一対の回路パターン１２ｃ，１２ｃが形成されている。 Further, as shown in FIG. 2, the upper surface portion 12 (surface of the three-dimensional circuit component 10) 12a, the inclined surface (surface of the three-dimensional circuit component 10) 12b and the side surface portion (surface of the three-dimensional circuit component 10) 12g A pair of circuit patterns 12c and 12c are formed.

本実施形態では、上段部１２の傾斜面１２ｂ，１２ｂに、各回路パターン１２ｃ，１２ｃの一部である接触パネル部（端子部）１２ｄ，１２ｄがそれぞれ設けられている。 In the present embodiment, contact panel portions (terminal portions) 12d and 12d, which are part of the circuit patterns 12c and 12c, are provided on the inclined surfaces 12b and 12b of the upper step portion 12, respectively.

さらに、本実施形態では、接触パネル部１２ｄは、傾斜面１２ｂの形状に対応するように形成されており、この接触パネル部１２ｄには、短手方向に沿って略Ｖ字状のノッチ部１２ｆが設けられている。そして、このノッチ部１２ｆの内側に、後述するリードフレーム（第１の接触バネ）２２ａの屈曲部２２ｃを２箇所で接触させている。 Furthermore, in this embodiment, the contact panel portion 12d is formed so as to correspond to the shape of the inclined surface 12b, and the contact panel portion 12d has a substantially V-shaped notch portion 12f along the short direction. Is provided. The bent portion 22c of a lead frame (first contact spring) 22a described later is brought into contact with the inside of the notch portion 12f at two locations.

また、本実施形態では、図２に示すように、一方の回路パターン１２ｃ（例えば図２において左側の回路パターン１２ｃ）は、接触パネル部１２ｄが傾斜面１２ｂから上面部１２ａの長手方向先端にかけて設けられており、接触パネル部１２ｄから上面部１２ａの中央部に向けて線状に延伸されている。そして、上面部１２ａの中央部近傍で短手方向に屈曲するとともに短手方向側の側面部１２ｇを通るようにして平坦面１１ａの溝部１１ｃに向けて延伸され、回路パターン１２ｃの端部１２ｅが溝部１１ｃ内に収納されている。なお、他方の回路パターン１２ｃも、一方の回路パターン１２ｃと同一の形状をしており、上面部１２ａの中心点に対して点対称となる位置に配置されている。そして、各回路パターン１２ｃ，１２ｃにＬＥＤチップ４０の正負の電極がそれぞれ接触するように、当該ＬＥＤチップ４０を立体回路部品１０上に載置して取り付けることで、ＬＥＤチップ４０が電気的に接続されることとなる。 In the present embodiment, as shown in FIG. 2, one circuit pattern 12c (for example, the left circuit pattern 12c in FIG. 2) is provided such that the contact panel portion 12d extends from the inclined surface 12b to the longitudinal tip of the upper surface portion 12a. It extends linearly from the contact panel portion 12d toward the center of the upper surface portion 12a. Then, it is bent in the lateral direction near the center of the upper surface portion 12a and is extended toward the groove portion 11c of the flat surface 11a so as to pass through the side surface portion 12g on the lateral side, and the end portion 12e of the circuit pattern 12c is formed. It is stored in the groove 11c. The other circuit pattern 12c has the same shape as the one circuit pattern 12c, and is disposed at a position that is point-symmetric with respect to the center point of the upper surface portion 12a. Then, the LED chip 40 is mounted and mounted on the three-dimensional circuit component 10 so that the positive and negative electrodes of the LED chip 40 are in contact with the circuit patterns 12c and 12c, so that the LED chip 40 is electrically connected. Will be.

ソケット２０は、合成樹脂製のフレーム部２１と金属製の接触バネ部２２とを備えている。 The socket 20 includes a frame portion 21 made of synthetic resin and a contact spring portion 22 made of metal.

フレーム部２１は、略枠状をしており、中央部に上記立体回路部品１０が収納されるようになっている。また、フレーム部２１の内側面の長手方向側には、内側に向かって突出した突部２１ａ，２１ａが短手方向略中央部に設けられており、これら突部２１ａ，２１ａが下段部１１の長手方向側の側面部１１ｂ，１１ｂに当接することで、立体回路部品１０をフレーム部２１内に収納した際に、立体回路部品１０の位置決めがなされるようにしている。 The frame portion 21 has a substantially frame shape, and the three-dimensional circuit component 10 is accommodated in the central portion. Further, on the longitudinal direction side of the inner side surface of the frame portion 21, projections 21 a and 21 a projecting inward are provided at a substantially central portion in the short direction, and these projections 21 a and 21 a are provided on the lower step portion 11. The three-dimensional circuit component 10 is positioned when the three-dimensional circuit component 10 is stored in the frame portion 21 by abutting against the side surface portions 11b and 11b on the longitudinal direction side.

また、フレーム部２１の外側面には、後述する保持金具５０にソケット２０を取り付けるための嵌合突部２１ｂが設けられている。本実施形態では、嵌合突部２１ｂは、短手方向両側面に２箇所ずつ設けられている。 Further, a fitting protrusion 21b for attaching the socket 20 to a holding metal fitting 50 described later is provided on the outer surface of the frame portion 21. In the present embodiment, the fitting protrusions 21b are provided at two places on both side surfaces in the short direction.

そして、フレーム部２１の下面部の内周側四隅近傍には、図４に示すように、略円筒状の取付用突部２１ｃが設けられている。そして、この取付用突部２１ｃを後述する放熱板３０に設けられた取付孔３０ｂに挿通させることで、ソケット２０が放熱板３０に取り付けられるようにしている。 As shown in FIG. 4, substantially cylindrical mounting projections 21 c are provided in the vicinity of the four corners on the inner peripheral side of the lower surface of the frame portion 21. The socket 20 is attached to the heat radiating plate 30 by inserting the mounting protrusion 21c into a mounting hole 30b provided in the heat radiating plate 30 described later.

接触バネ部２２は、立体回路部品１０を保持するものであり、本実施形態では、接触バネ部２２として、一対のリードフレーム（第１の接触バネ）２２ａ，２２ａを備えている。このリードフレーム（第１の接触バネ）２２ａは、一方の端部を略フック状に折り曲げて形成した屈曲部２２ｃが設けられており、他方の端部には外部接続部２２ｄが設けられている。さらに、本実施形態では、リードフレーム２２ａの一方の端部が二股に分岐しており、それぞれに屈曲部２２ｃが設けられている。そして、これら一対のリードフレーム２２ａ，２２ａを、屈曲部２２ｃがフレーム部２１の内側面の内側に、外部接続部２２ｄがフレーム部２１の外側面の外側に突出するようにフレーム部２１の長手方向側にそれぞれ配置させている。本実施形態では、一対のリードフレーム２２ａ，２２ａは、インサート成形によりフレーム部２１と一体に成形されている。そして、外部接続部２２ｄが例えばコネクタ（図示せず）等に接続されて外部と電気的に接続されている。 The contact spring portion 22 holds the three-dimensional circuit component 10. In the present embodiment, the contact spring portion 22 includes a pair of lead frames (first contact springs) 22 a and 22 a. The lead frame (first contact spring) 22a is provided with a bent portion 22c formed by bending one end portion into a substantially hook shape, and an external connection portion 22d is provided at the other end portion. . Further, in the present embodiment, one end portion of the lead frame 22a is bifurcated, and a bent portion 22c is provided for each. The pair of lead frames 22 a and 22 a are arranged in the longitudinal direction of the frame portion 21 such that the bent portion 22 c protrudes inside the inner surface of the frame portion 21 and the external connection portion 22 d protrudes outside the outer surface of the frame portion 21. It is arranged on each side. In the present embodiment, the pair of lead frames 22a and 22a are formed integrally with the frame portion 21 by insert molding. The external connection portion 22d is connected to, for example, a connector (not shown) or the like and electrically connected to the outside.

放熱板３０は、板状をしており、保持金具５０を取り付けるための突起部３０ａと、その内周側にフレーム部２１の取付用突部２１ｃを挿通させる取付孔３０ｂが形成されている。また、放熱板３０の中央部には、立体回路部品１０の下段部１１の下面形状に対応する嵌合凹部３０ｃが設けられており、当該嵌合凹部３０ｃに立体回路部品１０の下段部１１を嵌合させている。 The heat radiating plate 30 has a plate shape, and a protrusion 30a for attaching the holding metal fitting 50 and an attachment hole 30b through which the attachment protrusion 21c of the frame portion 21 is inserted are formed on the inner peripheral side thereof. In addition, a fitting recess 30c corresponding to the shape of the lower surface of the lower step portion 11 of the three-dimensional circuit component 10 is provided at the center of the heat sink 30, and the lower step portion 11 of the three-dimensional circuit component 10 is provided in the fitting recess 30c. It is fitted.

保持金具５０は、中央部に立体回路部品１０を挿通するための挿通穴５０ｅが設けられており、フレーム部２１の形状に対応した略枠状の形状をしている。そして、保持金具５０の四隅に、放熱板３０に取り付けるための取付部５０ｆがそれぞれ突設されており、各取付部５０ｆには、放熱板３０に設けられた突起部３０ａに対応する取付孔５０ｂがそれぞれ設けられている。 The holding metal fitting 50 is provided with an insertion hole 50 e for inserting the three-dimensional circuit component 10 at the center, and has a substantially frame shape corresponding to the shape of the frame portion 21. And the attachment part 50f for attaching to the heat sink 30 is each protrudingly provided in the four corners of the holding | maintenance metal fitting 50, and the attachment hole 50b corresponding to the projection part 30a provided in the heat sink 30 is provided in each attachment part 50f. Are provided.

また、挿通穴５０ｅの周縁部には、取付用突部２１ｃを挿入するための挿通孔５０ａが形成されている。 Further, an insertion hole 50a for inserting the mounting projection 21c is formed at the peripheral edge of the insertion hole 50e.

そして、保持金具５０の外周には、ソケット２０を保持金具５０に嵌合固定するための起立片５０ｃが設けられている。本実施形態では、起立片５０ｃは、各辺２箇所ずつ設けられている。さらに、短手方向側の起立片５０ｃには、嵌合突部２１ｂと嵌合する嵌合孔５０ｄが設けられている。 An upright piece 50 c for fitting and fixing the socket 20 to the holding metal fitting 50 is provided on the outer periphery of the holding metal fitting 50. In the present embodiment, the standing piece 50c is provided at two places on each side. Further, the standing piece 50c on the short side is provided with a fitting hole 50d for fitting with the fitting protrusion 21b.

次に、立体回路部品の放熱板への取り付け方法について説明する。 Next, a method for attaching the three-dimensional circuit component to the heat sink will be described.

まず、放熱板３０の突起部３０ａを保持金具５０に設けられた取付部５０ｆの挿通孔５０ａに挿入して、放熱板３０の上方に保持金具５０を取り付ける。本実施形態では、挿通孔５０ａに挿入した突起部３０ａをかしめることで保持金具５０を取り付けている。なお、このかしめ固定は、立体回路部品１０やソケット２０を装着した後に行ってもよい。 First, the protrusion 30 a of the heat radiating plate 30 is inserted into the insertion hole 50 a of the mounting portion 50 f provided on the holding metal 50, and the holding metal 50 is attached above the heat radiating plate 30. In this embodiment, the holding | maintenance metal fitting 50 is attached by crimping the projection part 30a inserted in the insertion hole 50a. The caulking and fixing may be performed after the three-dimensional circuit component 10 and the socket 20 are mounted.

次に、表面にＬＥＤチップ４０を実装した立体回路部品１０の下面部１０ａを放熱板３０の表面部に当接させるように取り付ける。具体的には、立体回路部品１０の下段部１１の下面部を保持金具５０の挿通穴５０ｅに挿通させ、嵌合凹部３０ｃと嵌合させる。こうして、立体回路部品１０の下面部１０ａと嵌合凹部３０ｃの底面３０ｄとが当接するようにしている。なお、本実施形態では、下段部１１の下面部（立体回路部品１０の下面部１０ａ）をテーパ状に面取しているため、立体回路部品１０を放熱板３０の嵌合凹部３０ｃに嵌め込みやすくなっている。 Next, it attaches so that the lower surface part 10a of the three-dimensional circuit component 10 which mounted the LED chip 40 on the surface may contact | abut to the surface part of the heat sink 30. FIG. Specifically, the lower surface portion of the lower step portion 11 of the molded circuit component 10 is inserted into the insertion hole 50e of the holding metal fitting 50, and is fitted into the fitting recess 30c. In this way, the lower surface portion 10a of the molded circuit component 10 and the bottom surface 30d of the fitting recess 30c are brought into contact with each other. In this embodiment, since the lower surface portion of the lower step portion 11 (the lower surface portion 10a of the molded circuit component 10) is chamfered in a tapered shape, the molded circuit component 10 can be easily fitted into the fitting recess 30c of the heat sink 30. It has become.

最後に、嵌合突部２１ｂと嵌合孔５０ｄとを嵌合させて、ソケット２０を保持金具５０に嵌合固定するとともに、リードフレーム２２ａの屈曲部２２ｃを立体回路部品１０の傾斜面１２ｂに設けられた接触パネル部１２ｄのノッチ部１２ｆに２箇所で接触させる。こうして、立体回路部品１０とソケット２０とを電気的に接続するとともに、立体回路部品１０を放熱板３０に取り付けている。 Finally, the fitting protrusion 21b and the fitting hole 50d are fitted to fix the socket 20 to the holding metal fitting 50, and the bent portion 22c of the lead frame 22a is formed on the inclined surface 12b of the three-dimensional circuit component 10. The notch part 12f of the provided contact panel part 12d is brought into contact at two places. In this way, the three-dimensional circuit component 10 and the socket 20 are electrically connected, and the three-dimensional circuit component 10 is attached to the heat sink 30.

以上の本実施形態によれば、立体回路部品１０の長手方向両側部を切り欠いて切欠凹部１０ｂを設けるとともに、当該切欠凹部１０ｂの内面としての傾斜面１２ｂ，１２ｂを立体回路部品１０に設け、当該傾斜面１２ｂ，１２ｂに一対の回路パターン１２ｃの一部である接触パネル部１２ｄ，１２ｄをそれぞれ設け、当該接触パネル部１２ｄ，１２ｄにソケット２０に設けられたリードフレーム２２ａ，２２ａを接触させているため、ソケット２０の幅を狭くすることができる。その結果、立体回路部品１０の取付構造の小型化を図ることができる。また、リードフレーム２２ａ，２２ａが傾斜面１２ｂ，１２ｂをそれぞれ押圧することで立体回路部品１０を保持しているため、リードフレーム２２ａと接触パネル部１２ｄとが接触不良を起こしてしまうのを抑制することができる。 According to the above embodiment, the three-dimensional circuit component 10 is provided with the notched recesses 10b by notching both sides in the longitudinal direction, and the three-dimensional circuit component 10 is provided with the inclined surfaces 12b and 12b as the inner surfaces of the notched recesses 10b. Contact panel portions 12d and 12d, which are part of a pair of circuit patterns 12c, are provided on the inclined surfaces 12b and 12b, respectively, and lead frames 22a and 22a provided on the socket 20 are brought into contact with the contact panel portions 12d and 12d. Therefore, the width of the socket 20 can be reduced. As a result, the mounting structure of the three-dimensional circuit component 10 can be reduced in size. Moreover, since the lead frames 22a and 22a hold the three-dimensional circuit component 10 by pressing the inclined surfaces 12b and 12b, respectively, it is possible to prevent the lead frame 22a and the contact panel portion 12d from causing poor contact. be able to.

また、本実施形態によれば、リードフレーム２２ａに接触パネル部１２ｄに接触するフック状の屈曲部２２ｃを設けるとともに接触パネル部１２ｄに略Ｖ字状のノッチ部１２ｆを設け、屈曲部２２ｃをノッチ部１２ｆの内側に２箇所で接触させることで、リードフレーム２２ａと接触パネル部１２ｄとが相対的に移動してしまうのをより抑制することができ、リードフレーム２２ａと接触パネル部１２ｄとが接触しなくなって導通不良が生じてしまうのを抑制することができる。 Further, according to the present embodiment, the lead frame 22a is provided with the hook-like bent portion 22c that contacts the contact panel portion 12d, the contact panel portion 12d is provided with the substantially V-shaped notch portion 12f, and the bent portion 22c is notched. The contact between the lead frame 22a and the contact panel portion 12d can be further suppressed by contacting the inside of the portion 12f at two locations, and the lead frame 22a and the contact panel portion 12d are in contact with each other. Therefore, it is possible to suppress the occurrence of poor conduction due to the loss.

また、本実施形態によれば、ソケット２０に立体回路部品１０を支持する突部２１ａを設けることで、立体回路部品１０をより確実に支持することができる。その結果、ソケット２０と立体回路部品１０との相対移動をより抑制することができる。また、突部２１ａによって立体回路部品１０の位置決めがなされるため、立体回路部品１０を所定位置に精度良く取り付けることができる。 In addition, according to the present embodiment, the three-dimensional circuit component 10 can be more reliably supported by providing the socket 20 with the protrusion 21 a that supports the three-dimensional circuit component 10. As a result, relative movement between the socket 20 and the molded circuit component 10 can be further suppressed. Further, since the three-dimensional circuit component 10 is positioned by the protrusion 21a, the three-dimensional circuit component 10 can be accurately attached to a predetermined position.

また、本実施形態によれば、立体回路部品１０の下面部を放熱板３０に当接させることで、ＬＥＤチップ４０により発生した熱を放熱板３０から放熱させることができる。 Further, according to the present embodiment, the heat generated by the LED chip 40 can be radiated from the heat radiating plate 30 by bringing the lower surface portion of the molded circuit component 10 into contact with the heat radiating plate 30.

また、本実施形態によれば、ソケット２０を保持する保持金具５０を備えることで、保持金具５０によってソケット２０が補強されて強度を高めることができるため、ソケット２０の薄型化を図ることができる。 In addition, according to the present embodiment, by providing the holding metal fitting 50 that holds the socket 20, the socket 20 can be reinforced by the holding metal fitting 50 and the strength can be increased. Therefore, the socket 20 can be thinned. .

次に、本実施形態の変形例を説明する。 Next, a modification of this embodiment will be described.

図６は、本実施形態の変形例にかかる立体回路部品の取付構造の分解斜視図である。なお、本実施形態の変形例にかかる立体回路部品の取付構造は、上記第１実施形態にかかる立体回路部品の取付構造と同様の構成要素を備える。よって、それら同様の構成要素については共通の符号を付すとともに、重複する説明を省略する。 FIG. 6 is an exploded perspective view of the mounting structure of the three-dimensional circuit component according to the modification of the present embodiment. Note that the mounting structure of the molded circuit component according to the modification of the present embodiment includes the same components as the mounting structure of the molded circuit component according to the first embodiment. Therefore, the same constituent elements are denoted by common reference numerals, and redundant description is omitted.

本変形例では、立体回路部品１４と放熱板３１とに互いに嵌合する凸部１５，凹部３２が設けられている。具体的には、立体回路部品１４の下段部１１の長手方向両端部に、一対の凸部１５，１５を設けるとともに、放熱板３１に一対の凸部１５，１５を嵌合させる凹部３２，３２が設けられている。このとき、立体回路部品１４の下面が放熱板３１の上面に当接するように、凹部３２，３２の深さを凸部１５，１５の厚さと同等若しくは凸部１５，１５の厚さよりも深くするのが好適である。 In the present modification, the three-dimensional circuit component 14 and the heat sink 31 are provided with convex portions 15 and concave portions 32 that fit together. Specifically, a pair of convex portions 15 and 15 are provided at both longitudinal ends of the lower step portion 11 of the molded circuit component 14, and concave portions 32 and 32 for fitting the pair of convex portions 15 and 15 to the heat radiating plate 31. Is provided. At this time, the depth of the recesses 32 and 32 is equal to the thickness of the projections 15 and 15 or deeper than the thickness of the projections 15 and 15 so that the lower surface of the molded circuit component 14 contacts the upper surface of the heat sink 31. Is preferred.

その他の構造は、上記第１実施形態と基本的に同一である。 Other structures are basically the same as those in the first embodiment.

以上の本変形例によっても、上記第１実施形態と同様の効果を得ることができる。 Also according to the above modification, the same effects as those of the first embodiment can be obtained.

また、本変形例によれば、立体回路部品１４と放熱板３１とに互いに嵌合する凸部１５，凹部３２をそれぞれ設けることで、立体回路部品１４を取り付けやすくすることができる上、立体回路部品１４の位置決めがなされ、立体回路部品１４を所定位置に精度良く取り付けることができる。 Moreover, according to this modification, the three-dimensional circuit component 14 can be easily attached by providing the three-dimensional circuit component 14 and the heat sink 31 with the convex portion 15 and the concave portion 32 that are fitted to each other. The component 14 is positioned, and the three-dimensional circuit component 14 can be accurately attached to a predetermined position.

（第２実施形態）図７は、本実施形態にかかる立体回路部品の取付構造の斜視図、図８は、立体回路部品の取付構造の分解斜視図、図９は、立体回路部品の取付構造の平面図、図１０は、図９のＣ−Ｃ断面図、図１１は、図９のＤ−Ｄ断面図である。なお、本実施形態にかかる立体回路部品の取付構造は、上記第１実施形態にかかる立体回路部品の取付構造と同様の構成要素を備える。よって、それら同様の構成要素については共通の符号を付すとともに、重複する説明を省略する。 (Second Embodiment) FIG. 7 is a perspective view of the mounting structure of the three-dimensional circuit component according to the present embodiment, FIG. 8 is an exploded perspective view of the mounting structure of the three-dimensional circuit component, and FIG. 9 is the mounting structure of the three-dimensional circuit component. FIG. 10 is a sectional view taken along the line CC in FIG. 9, and FIG. 11 is a sectional view taken along the line DD in FIG. The mounting structure of the molded circuit component according to the present embodiment includes the same components as the mounting structure of the molded circuit component according to the first embodiment. Therefore, the same constituent elements are denoted by common reference numerals, and redundant description is omitted.

本実施形態にかかる立体回路部品の取付構造は、立体回路部品１０Ａ、ソケット２０Ａ、保持金具５０Ａを図７に示すように、サブアッセンブリすることで立体回路部品取付モジュール１Ａを形成している。そして、この立体回路部品取付モジュール１Ａを例えば上記第１実施形態で例示した放熱板３０に固定するようにしている。 In the mounting structure of the three-dimensional circuit component according to the present embodiment, the three-dimensional circuit component mounting module 1A is formed by sub-assembling the three-dimensional circuit component 10A, the socket 20A, and the holding metal fitting 50A as shown in FIG. And this 3D circuit component attachment module 1A is fixed to the heat sink 30 illustrated in the first embodiment, for example.

本実施形態では、立体回路部品１０Ａは、下段部１１の下面に当該下段部１１よりも一回り小さい略直方体状の突部１３が設けられている。 In this embodiment, the molded circuit component 10 </ b> A is provided with a substantially rectangular parallelepiped protrusion 13 that is slightly smaller than the lower step 11 on the lower surface of the lower step 11.

また、ソケット２０Ａには、フレーム部２１の短手方向側の内側面にも内側に突出する突部２１ａが設けられているとともに、接触バネ部２２として、一対のリードフレーム２２ａ，２２ａと、一対の保持用接触バネ（第２の接触バネ）２２ｂ，２２ｂとが、フレーム部２１と一体に形成されている。そして、一対のリードフレーム２２ａ，２２ａの外部接続部２２ｄ，２２ｄが同一の方向に突出するようにしている。 In addition, the socket 20A is provided with a protruding portion 21a projecting inwardly on the inner side surface of the frame portion 21 on the short side direction, and a pair of lead frames 22a and 22a as a contact spring portion 22 and a pair of The holding contact springs (second contact springs) 22 b and 22 b are formed integrally with the frame portion 21. The external connection portions 22d and 22d of the pair of lead frames 22a and 22a protrude in the same direction.

一対の保持用接触バネ２２ｂ，２２ｂは、図１１に示すように、クランク状に屈曲しており、フレーム部２１の短手方向側の内側面から内側に突出するように設けられている。 As shown in FIG. 11, the pair of holding contact springs 22 b and 22 b are bent in a crank shape and are provided so as to protrude inward from the inner side surface of the frame portion 21 on the short side direction.

保持金具５０Ａは、上記第１実施形態と同様、中央部に挿通穴５０ｅが設けられているが、本実施形態では、この挿通穴５０ｅは、立体回路部品１０Ａの突部１３は挿通させることができるが、下段部１１は挿通させることができない大きさとなるように設定されている。すなわち、立体回路部品取付モジュール１Ａを形成した際に、下段部１１の下面部が保持金具５０Ａの上面に当接するようにしている。また、本実施形態では、突部１３の下面部１３ａが保持金具５０Ａの下面よりも若干下方に突出するようにしている。 As in the first embodiment, the holding metal fitting 50A is provided with an insertion hole 50e at the center. In this embodiment, the insertion hole 50e allows the protrusion 13 of the molded circuit component 10A to be inserted. Although it is possible, the lower part 11 is set to have a size that cannot be inserted. That is, when the molded circuit component mounting module 1A is formed, the lower surface portion of the lower step portion 11 is in contact with the upper surface of the holding metal fitting 50A. Further, in the present embodiment, the lower surface portion 13a of the protruding portion 13 protrudes slightly below the lower surface of the holding metal fitting 50A.

また、本実施形態では、嵌合突部２１ｂと起立片５０ｃは、外部接続部２２ｄ，２２ｄを突出させた方向以外の３方向に設けられている。 Moreover, in this embodiment, the fitting protrusion 21b and the upright piece 50c are provided in three directions other than the direction in which the external connection parts 22d and 22d are protruded.

以上の構成をした立体回路部品１０Ａ、ソケット２０Ａ、保持金具５０Ａをサブアッセンブリすることで立体回路部品取付モジュール１Ａを形成している。 The three-dimensional circuit component mounting module 1A is formed by sub-assembling the three-dimensional circuit component 10A, the socket 20A, and the holding metal fitting 50A configured as described above.

具体的には、表面にＬＥＤチップ４０を実装した立体回路部品１０Ａの突部１３を保持金具５０Ａの挿通穴５０ｅに挿通し、下段部１１の下面部が保持金具５０Ａの上面に当接するように載置する。そして、嵌合突部２１ｂと起立片５０ｃに設けられた嵌合孔５０ｄとを嵌合させて、ソケット２０Ａを保持金具５０Ａに嵌合固定する。 Specifically, the protrusion 13 of the molded circuit component 10A having the LED chip 40 mounted on the surface is inserted into the insertion hole 50e of the holding metal fitting 50A, and the lower surface portion of the lower step portion 11 is in contact with the upper surface of the holding metal fitting 50A. Place. And the fitting protrusion 21b and the fitting hole 50d provided in the standing piece 50c are fitted, and the socket 20A is fitted and fixed to the holding metal fitting 50A.

このとき、リードフレーム２２ａの屈曲部２２ｃが立体回路部品１０の傾斜面１２ｂに設けられた接触パネル部１２ｄのノッチ部１２ｆの内側に２箇所で接触して、立体回路部品１０とソケット２０とが電気的に接続される。また、立体回路部品１０Ａは、リードフレーム２２ａ，２２ａが傾斜面１２ｂ，１２ｂを押圧するとともに、保持用接触バネ２２ｂ，２２ｂが立体回路部品１０Ａの下段部１１の平坦面１１ａを下方に押圧することによって、ソケット２０Ａと保持金具５０Ａとで保持されることとなる。本実施形態では、保持用接触バネ２２ｂ，２２ｂは、回路パターン１２ｃの端部１２ｅが収納される溝部１１ｃが形成された部位を押圧している。 At this time, the bent portion 22c of the lead frame 22a contacts the inside of the notch portion 12f of the contact panel portion 12d provided on the inclined surface 12b of the three-dimensional circuit component 10, so that the three-dimensional circuit component 10 and the socket 20 are connected. Electrically connected. In the molded circuit component 10A, the lead frames 22a and 22a press the inclined surfaces 12b and 12b, and the holding contact springs 22b and 22b press the flat surface 11a of the lower step portion 11 of the molded circuit component 10A downward. Thus, the socket 20A and the holding metal fitting 50A are held. In the present embodiment, the holding contact springs 22b and 22b press the portion where the groove 11c in which the end 12e of the circuit pattern 12c is accommodated is formed.

こうして、立体回路部品取付モジュール１Ａを形成し、上記第１実施形態と同様に放熱板３０に設けられた突起部３０ａを保持金具５０Ａの取付部５０ｆに設けられた取付孔５０ｂに挿通し、突起部３０ａをかしめることで立体回路部品取付モジュール１Ａを放熱板３０に取り付けている。 In this way, the molded circuit component mounting module 1A is formed, and the projection 30a provided on the heat sink 30 is inserted into the mounting hole 50b provided in the mounting portion 50f of the holding metal fitting 50A in the same manner as in the first embodiment. The three-dimensional circuit component mounting module 1 </ b> A is attached to the heat sink 30 by caulking the portion 30 a.

以上の本実施形態によっても、上記第１実施形態と同様の効果を得ることができる。 Also according to this embodiment described above, the same effect as in the first embodiment can be obtained.

また、本実施形態によれば、リードフレーム２２ａ，２２ａとは別に立体回路部品１０Ａを保持する保持用接触バネ２２ｂ，２２ｂを設けたため、より確実に立体回路部品１０Ａを保持することができる上、リードフレーム２２ａ，２２ａによる傾斜面１２ｂ，１２ｂの押圧力を低く設定しても立体回路部品１０Ａを保持することができるようになる。その結果、リードフレーム２２ａ，２２ａによる傾斜面１２ｂ，１２ｂの押圧で回路パターン１２ｃ，１２ｃが剥離してしまうのを抑制することができ、回路パターン１２ｃの寿命を向上させることができる。 In addition, according to the present embodiment, since the holding contact springs 22b and 22b for holding the molded circuit component 10A are provided separately from the lead frames 22a and 22a, the molded circuit component 10A can be held more reliably. Even if the pressing force of the inclined surfaces 12b, 12b by the lead frames 22a, 22a is set low, the molded circuit component 10A can be held. As a result, it is possible to prevent the circuit patterns 12c and 12c from being peeled off due to the pressing of the inclined surfaces 12b and 12b by the lead frames 22a and 22a, thereby improving the life of the circuit pattern 12c.

また、本実施形態によれば、保持用接触バネ２２ｂ，２２ｂとフレーム部２１とを一体に成形することで、製造工程の簡素化を図ることができるとともに部品点数の低減を図ることができ、コスト的に有利に製造することができる。 Further, according to the present embodiment, the holding contact springs 22b, 22b and the frame portion 21 are integrally formed, so that the manufacturing process can be simplified and the number of parts can be reduced. It can be manufactured at an advantageous cost.

また、本実施形態によれば、立体回路部品１０Ａの下段部１１の平坦面１１ａに溝部１１ｃを形成し、当該溝部１１ｃ内に回路パターン１２ｃの端部１２ｅを収納することで、回路パターン１２ｃが設けられた部位と保持用接触バネ２２ｂ，２２ｂが押圧する部位とが重なってしまったとしても、当該保持用接触バネ２２ｂ，２２ｂが直接回路パターン１２ｃを押さえることがなくなるため、回路パターン１２ｃが剥離してしまうのを抑制することができる。 In addition, according to the present embodiment, the groove portion 11c is formed in the flat surface 11a of the lower step portion 11 of the three-dimensional circuit component 10A, and the end portion 12e of the circuit pattern 12c is accommodated in the groove portion 11c. Even if the provided portion and the portion pressed by the holding contact springs 22b and 22b overlap, the holding contact springs 22b and 22b do not directly press the circuit pattern 12c, and therefore the circuit pattern 12c is peeled off. Can be suppressed.

また、本実施形態によれば、保持金具５０に、放熱板３０への取付部５０ｆが設けられているため、立体回路部品１０Ａの放熱板３０への取り付けの際にリードフレーム２２ａと接触パネル部１２ｄとが接触不良を起こしてしまうのを抑制することができ、導通不良が生じることなく立体回路部品１０Ａを放熱板３０に取り付けることができる。 Further, according to the present embodiment, since the holding metal fitting 50 is provided with the attachment portion 50f to the heat sink 30, the lead frame 22a and the contact panel portion are attached when the three-dimensional circuit component 10A is attached to the heat sink 30. 12d can be prevented from causing poor contact, and the three-dimensional circuit component 10A can be attached to the heat sink 30 without causing poor conduction.

また、本実施形態によれば、立体回路部品１０Ａの下面部に突部１３を設けるとともに保持金具５０Ａに挿通穴５０ｅを設け、突部１３を挿通穴５０ｅに挿通させることで、立体回路部品１０Ａを放熱板３０に取り付ける際に、上方からだけでなく放熱板３０の面に沿わせて横方向からも取り付けることができるようになり、立体回路部品１０Ａの放熱板３０への取り付け自由度を向上させることができる。 In addition, according to the present embodiment, the protruding portion 13 is provided on the lower surface portion of the molded circuit component 10A, the insertion hole 50e is provided in the holding metal fitting 50A, and the protruding portion 13 is inserted through the insertion hole 50e, whereby the molded circuit component 10A. Can be attached not only from above but also from the side along the surface of the heat sink 30, improving the degree of freedom of mounting the three-dimensional circuit component 10 </ b> A to the heat sink 30. Can be made.

（第３実施形態）図１２は、本実施形態にかかる立体回路部品の取付構造の外観斜視図、図１３は、立体回路部品の取付構造の分解斜視図、図１４は、立体回路部品の取付構造の平面図、図１５は、図１４のＥ−Ｅ断面図、図１６は、図１４のＦ−Ｆ断面図である。なお、本実施形態にかかる立体回路部品の取付構造は、上記第２実施形態にかかる立体回路部品の取付構造と同様の構成要素を備える。よって、それら同様の構成要素については共通の符号を付すとともに、重複する説明を省略する。 (Third Embodiment) FIG. 12 is an external perspective view of a mounting structure of a three-dimensional circuit component according to this embodiment, FIG. 13 is an exploded perspective view of the mounting structure of the three-dimensional circuit component, and FIG. FIG. 15 is a cross-sectional view taken along the line EE of FIG. 14, and FIG. 16 is a cross-sectional view taken along the line FF of FIG. Note that the mounting structure of the molded circuit component according to the present embodiment includes the same components as the mounting structure of the molded circuit component according to the second embodiment. Therefore, the same constituent elements are denoted by common reference numerals, and redundant description is omitted.

本実施形態にかかる立体回路部品の取付構造は、保持金具５０Ｂに放熱板への取付部が設けられていない点が上記第２実施形態と異なっており、その他の構成は基本的に上記第２実施形態と同様である。 The mounting structure of the three-dimensional circuit component according to the present embodiment is different from that of the second embodiment in that the holding metal fitting 50B is not provided with a mounting portion to the heat sink, and other configurations are basically the second configuration. This is the same as the embodiment.

すなわち、本実施形態では、立体回路部品１０Ａ、ソケット２０Ａ、保持金具５０Ｂを図１２に示すように、サブアッセンブリすることで立体回路部品取付モジュール１Ｂを形成している。 That is, in this embodiment, the molded circuit component mounting module 1B is formed by sub-assembling the molded circuit component 10A, the socket 20A, and the holding metal fitting 50B as shown in FIG.

そして、この立体回路部品取付モジュール１Ｂを例えば放熱板に一対の略Ｌ字状のガイド部（図示せず）を設け、ソケット２０Ａの側面と上面とを当該ガイド部にガイドさせながら立体回路部品取付モジュール１Ｂを挿入して放熱板に固定するようにしている。なお、ガイド部を放熱板以外の他の部材に設け、当該ガイド部にガイドさせながら立体回路部品取付モジュール１Ｂを放熱板に固定するようにしてもよい。 For example, the three-dimensional circuit component mounting module 1B is provided with a pair of substantially L-shaped guide portions (not shown) on the heat sink, and the three-dimensional circuit component is mounted while guiding the side surface and the upper surface of the socket 20A to the guide portion. The module 1B is inserted and fixed to the heat sink. In addition, you may make it provide a guide part in members other than a heat sink, and fix the 3D circuit component attachment module 1B to a heat sink, making it guide to the said guide part.

以上の本実施形態によっても、上記第１および第２実施形態と同様の効果を得ることができる。 Also according to this embodiment described above, the same effects as those of the first and second embodiments can be obtained.

以上、本発明にかかる立体回路部品の取付構造の好適な実施形態について説明したが、本発明は上記実施形態に限ることなく要旨を逸脱しない範囲で種々の実施形態を採用することができる。 As mentioned above, although the suitable embodiment of the attachment structure of the three-dimensional circuit component concerning this invention was described, this invention can employ | adopt various embodiment in the range which does not deviate from a summary, without being restricted to the said embodiment.

例えば、保持金具の放熱板への取り付けは、かしめ固定でなくねじ止めによって取り付けてもよい。 For example, the holding metal fitting may be attached to the heat radiating plate not by caulking but by screwing.

また、電子部品として半導体を用いたりしてもよいし、立体回路部品として様々な回路パターンが形成されたものを用いてもよい。なお、電子部品の種類、回路パターンの形状等は、用途に応じて適宜設定することが可能である。 Moreover, a semiconductor may be used as the electronic component, or a component in which various circuit patterns are formed may be used as the three-dimensional circuit component. The type of electronic component, the shape of the circuit pattern, and the like can be set as appropriate according to the application.

また、立体回路部品は、放熱板以外の部材に取り付けるようにしてもよい。 Moreover, you may make it attach a solid circuit component to members other than a heat sink.

また、屈曲部は、略フック状に折り曲げて形成しているが、屈曲部の形状はこれに限らず、例えば、略コ字状に折り曲げて形成する等、種々の形状とすることが可能である。 In addition, the bent portion is formed by being bent into a substantially hook shape, but the shape of the bent portion is not limited to this, and for example, it can be formed in various shapes such as being bent into a substantially U-shape. is there.

また、立体回路部品として傾斜面が形成された形状のものを用いたが、立体回路部品の形状はこれに限らず、例えば、略直方体状の下段部の上面に下段部よりも一回り小さい略直方体状の上段部を載置した形状のものを用い、上段部の側面に端子部を設けて屈曲部を接触させるようにしてもよい。 Moreover, although the thing of the shape in which the inclined surface was formed was used as a three-dimensional circuit component, the shape of a three-dimensional circuit component is not restricted to this, For example, it is a little smaller than a lower step part on the upper surface of a substantially rectangular parallelepiped lower step part. A shape in which a rectangular parallelepiped upper step portion is placed may be used, and a terminal portion may be provided on a side surface of the upper step portion so that the bent portion is brought into contact.

本発明の第１実施形態にかかる立体回路部品の取付構造の斜視図。The perspective view of the attachment structure of the three-dimensional circuit component concerning 1st Embodiment of this invention. 本発明の第１実施形態にかかる立体回路部品の取付構造の分解斜視図。The disassembled perspective view of the attachment structure of the three-dimensional circuit component concerning 1st Embodiment of this invention. 本発明の第１実施形態にかかる立体回路部品の取付構造の平面図。The top view of the attachment structure of the three-dimensional circuit component concerning 1st Embodiment of this invention. 図３のＡ−Ａ断面図。AA sectional drawing of FIG. 図３のＢ−Ｂ断面図。BB sectional drawing of FIG. 本発明の第１実施形態の変形例にかかる立体回路部品の取付構造の分解斜視図。The disassembled perspective view of the attachment structure of the three-dimensional circuit component concerning the modification of 1st Embodiment of this invention. 本発明の第２実施形態にかかる立体回路部品の取付構造の斜視図。The perspective view of the attachment structure of the three-dimensional circuit component concerning 2nd Embodiment of this invention. 本発明の第２実施形態にかかる立体回路部品の取付構造の分解斜視図。The disassembled perspective view of the attachment structure of the three-dimensional circuit component concerning 2nd Embodiment of this invention. 本発明の第２実施形態にかかる立体回路部品の取付構造の平面図。The top view of the attachment structure of the three-dimensional circuit component concerning 2nd Embodiment of this invention. 図９のＣ−Ｃ断面図。CC sectional drawing of FIG. 図９のＤ−Ｄ断面図。DD sectional drawing of FIG. 本発明の第３実施形態にかかる立体回路部品の取付構造の斜視図。The perspective view of the attachment structure of the three-dimensional circuit component concerning 3rd Embodiment of this invention. 本発明の第３実施形態にかかる立体回路部品の取付構造の分解斜視図。The disassembled perspective view of the attachment structure of the three-dimensional circuit component concerning 3rd Embodiment of this invention. 本発明の第３実施形態にかかる立体回路部品の取付構造の平面図。The top view of the attachment structure of the three-dimensional circuit component concerning 3rd Embodiment of this invention. 図１４のＥ−Ｅ断面図。EE sectional drawing of FIG. 図１４のＦ−Ｆ断面図。FF sectional drawing of FIG.

Explanation of symbols

１Ａ、１Ｂ立体回路部品取付モジュール
１０、１０Ａ立体回路部品
１０ｂ切欠凹部
１１ｃ溝部（凹部）
１２ｂ傾斜面（切欠凹部の内面）
１２ｃ回路パターン
１２ｄ接触パネル部（端子部）
１２ｆノッチ部
１４立体回路部品
１５凸部
２０ソケット
２１フレーム部
２１ａ突部
２２接触バネ
２２ａリードフレーム（第１の接触バネ）
２２ｂ保持用接触バネ（第２の接触バネ）
２２ｃ屈曲部
３０、３１放熱板
３２凹部
４０ＬＥＤチップ（電子部品）
５０保持金具
５０ｆ取付部 1A, 1B 3D circuit component mounting module 10, 10A 3D circuit component 10b Notch recess 11c Groove (recess)
12b Inclined surface (inner surface of notch recess)
12c Circuit pattern 12d Contact panel part (terminal part)
12f Notch part 14 3D circuit component 15 Convex part 20 Socket 21 Frame part 21a Protrusion part 22 Contact spring 22a Lead frame (1st contact spring)
22b Contact spring for holding (second contact spring)
22c Bent part 30, 31 Heat sink 32 Recessed part 40 LED chip (electronic component)
50 Holding bracket 50f Mounting part

Claims

A circuit pattern for electrically connecting the electronic components is formed on the surface, and a three-dimensional circuit component on which the electronic components are mounted, a frame portion for storing the three-dimensional circuit component, and a contact spring portion for holding the three-dimensional circuit component. A mounting structure of a three-dimensional circuit component comprising a socket,
The microwave circuit component, together with cut away cutout recess to the inclined surface of the side of the microwave circuit components are formed is provided, on the inclined surface of the cutout recess is part of the circuit pattern A terminal part is provided,
The contact spring part includes a first contact spring that contacts the terminal part and includes a first contact spring that holds the three-dimensional circuit part by pressing an inclined surface of the notch recess from above. Mounting structure.

The said contact spring part is equipped with the 2nd contact spring holding the said 3D circuit component, The mounting structure of the 3D circuit component of Claim 1 characterized by the above-mentioned.

The mounting structure for a three-dimensional circuit component according to claim 2, wherein the second contact spring and the frame portion are integrally formed.

The mounting of the three-dimensional circuit component according to any one of claims 1 to 3, wherein a concave portion is formed in at least a part of the three-dimensional circuit component, and the circuit pattern is formed in the concave portion. Construction.

The first contact spring includes a bent portion that comes into contact with the terminal portion, the terminal portion includes a notch portion, and the bent portion is brought into contact with the notch portion at two locations. Item 5. The mounting structure for a three-dimensional circuit component according to any one of Items 1 to 4.

The said socket is provided with the projection part which supports the said three-dimensional circuit component, The mounting structure of the three-dimensional circuit component of any one of Claims 1-5 characterized by the above-mentioned.

The mounting structure for a three-dimensional circuit component according to any one of claims 1 to 6, wherein a lower surface portion of the three-dimensional circuit component is brought into contact with a heat sink.

The lower part of the socket is provided with a holding fitting for holding the socket, and the lower surface portion of the molded circuit component is brought into contact with the heat radiating plate via the holding fitting. The mounting structure of the three-dimensional circuit component of Claim 7.

The mounting structure of the three-dimensional circuit component according to claim 8, wherein a protrusion is provided on a lower surface portion of the three-dimensional circuit component, an insertion hole is provided in the holding metal fitting, and the protrusion is inserted into the insertion hole. .

The three-dimensional circuit component mounting structure according to claim 8 or 9, wherein the holding metal fitting includes a mounting portion to the heat radiating plate.

The mounting structure for a three-dimensional circuit component according to claim 7, wherein the three-dimensional circuit component and the heat radiating plate are provided with concave and convex portions that are fitted to each other.