JP4891199B2 - Substrate processing apparatus and semiconductor device manufacturing method - Google Patents

Description

The present invention relates to a substrate processing apparatus and a semiconductor device manufacturing method.
For example, a batch system that forms a thin film such as an insulating film, a metal film, or a semiconductor film on a semiconductor wafer (hereinafter referred to as a wafer) into which a semiconductor integrated circuit device (hereinafter referred to as an IC) is formed or diffuses impurities. The present invention relates to an effective one for use in a vertical diffusion / CVD apparatus.

In a batch type vertical diffusion / CVD apparatus (hereinafter referred to as a batch type CVD apparatus) which is an example of a substrate processing apparatus, a plurality of wafers are handled in a state of being stored in a storage container.
Conventional storage containers include an open cassette and a FOUP (front opening unified pod). The open cassette is formed in a substantially cubic box shape, and a pair of opposed surfaces are opened. The pod is formed in a substantially cubic box shape, and one surface is opened, and a door is detachably attached to the opening surface.
The pod carries the wafer in a sealed state. Therefore, even if particles or the like are present in the atmosphere around the pod, the wafer in the pod can maintain cleanliness. For this reason, it is not necessary to set the cleanliness very high in the clean room where the batch type CVD apparatus is installed. As a result, the cost required for maintaining the cleanliness of the clean room can be reduced.
Therefore, in a recent batch type CVD apparatus, a pod is adopted as a storage container.

A batch-type CVD apparatus using a pod includes a pod opening / closing device (hereinafter referred to as a pod opener) and a mapping device at a wafer transfer port through which a wafer is carried into and out of the pod. (For example, refer to Patent Document 1).
The pod opener opens and closes the wafer inlet / outlet of the pod by attaching and removing the door. The mapping apparatus detects whether the wafer is held in each wafer holding groove (slot) by detecting the wafer in the pod.
Japanese Patent Laid-Open No. 2003-7801

In a conventional batch type CVD apparatus, the pod door is attached / detached at the loading / unloading section for loading / unloading the pod from / to the batch type CVD apparatus casing from the outside of the apparatus (outside the casing). Can not do it.
In order to attach or remove the door of the pod at the carry-in / carry-out unit, a configuration in which a pod opener that can be retracted is provided in the carry-in / carry-out unit can be considered. That is, when the pod is carried into the housing from the outside of the housing or when the pod is carried out of the housing from the inside of the housing, the pod opener is retracted from the loading / unloading section to carry the pod into or out of the housing. Secure a passageway.
However, in this configuration, since the pod opener is retracted from the carry-in / carry-out unit, there is a problem that the batch type CVD apparatus becomes complicated.

  An object of the present invention is to provide a substrate processing apparatus and a semiconductor device capable of mounting and removing a pod door in a loading / unloading section for loading / unloading a pod into / outside of a casing and simplifying the structure. It is to provide a manufacturing method.

Means for solving the above-described problems are as follows.
A storage container in which a plurality of substrates are stored and a substrate outlet is closed by a lid;
A loading / unloading unit in which the storage container is loaded and unloaded between the inside and the outside of the housing;
A mounting section for mounting the storage container in the loading / unloading section;
A storage chamber provided in the housing for storing the storage container;
An opening and closing device for opening and closing the substrate loading / unloading port of the storage container placed on the placement unit;
A holding device that holds the lower surface of the storage container, and a transfer device that transfers the storage container held by the holding mechanism between the storage chamber and the outside via the upper side of the opening and closing device;
The placement unit is moved up and down between a height position of the placement unit when the opening / closing device opens and closes the storage container and a height position at which the transfer device exchanges the storage container. An elevating mechanism;
A substrate processing apparatus comprising:

  According to the above means, by providing the elevating mechanism, the conveying device can convey the storage container from the mounting device into the housing via the upper side of the opening / closing device, so that the delivery can be performed smoothly and the opening / closing device The storage container can be moved without retracting, and the lid of the storage container can be opened and closed at the carry-in / out section.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  In the present embodiment, the substrate processing apparatus according to the present invention is configured as a batch type CVD apparatus, that is, a batch type vertical diffusion / CVD apparatus, as shown in FIGS.

In this embodiment, a pod 2 is used as a storage container for storing the wafer 1 as a substrate.
The pod 2 is formed in a substantially cubic box shape, and as shown in FIG. 3, a wafer loading / unloading port 3 is opened on one side wall of the pod 2. The wafer loading / unloading port 3 is mounted such that a door 4 serving as a lid for closing it can be mounted and removed. A plurality of positioning holes 5 are recessed in the lower surface of the pod 2.

As shown in FIGS. 1, 2, and 3, the batch type CVD apparatus 10 according to the present embodiment includes a main casing 11 as a part of the casing.
The front wall 11 a of the main housing 11 constitutes a partition wall that partitions the inside and outside of the main housing 11. At an intermediate height of the front wall 11a, a pod loading / unloading port 12 is provided that communicates the inside and outside of the main housing 11. The pod loading / unloading port 12 loads the pod 2 or unloads the pod 2. The front shutter 13 closes or opens the pod loading / unloading port 12.

A load port 14 is installed outside the front wall (partition wall) 11 a of the main housing 11. The load port 14 is located substantially directly below the pod loading / unloading port 12. The load port 14 constitutes a loading / unloading unit. The load port 14 aligns the placed pod 2 with the pod loading / unloading port 12. Two load ports 14 are provided in parallel.
The pod 2 is loaded onto the load port 14 by an in-process transfer apparatus (also referred to as an inter-process transfer apparatus) outside the batch type CVD apparatus (outside the casing), and is also unloaded from the load port 14.
As the in-process transfer device, there are a floor travel type local transport vehicle (hereinafter referred to as AGV) 9 shown in FIG. 1, an overhead travel type local transport device (described later) shown in FIG. Can also be applied.

A box 14A as a front housing is provided on the front side of the front wall 11a. The box 14A is formed so as to surround the load port 14 and the upper space. A ceiling opening 14 </ b> B is opened in the ceiling wall of the box 14 </ b> A, and a front opening 14 </ b> C is opened in the front wall of the box 14. In other words, the load port 14 can receive the pod 2 via the front opening 14C and can also receive the pod 2 via the ceiling opening 14B.
The box 14A and the main casing 11 constitute a casing of a batch type CVD apparatus.
As shown in FIG. 1, a controller 77 described later is installed in the box 14A.

A pod elevator 15 is installed in the load port 14. The pod elevator 15 constitutes a mechanism for raising and lowering the pod 2 between the height and the height of the pod loading / unloading port 12.
The pod elevator 15 includes a lift drive device 16 and a shaft 17 that is lifted and lowered by the lift drive device 16. A holding base (storage container placing portion) 18 installed horizontally at the upper end of the shaft 17 and a plurality of receiving kinematic pins 19 as storage container positioning means (also referred to as storage container positioning tool) are provided to the pot elevator 15. It is connected. A plurality of kinematic pins 19 project from the upper surface of the holding table 18, and the pod 2 is positioned on the holding table 18 by being fitted into each positioning hole 5 formed on the lower surface of the pod 2. The pod elevator 15 supports the pod 2 from below by the holding base 18 and raises and lowers the pod 2 with the receiving kinematic pin 19 fitted in the positioning hole 5 of the pod 2.
That is, the holding stand 18 constitutes a holding portion that holds the lower surface of the pod 2 and also constitutes a pod placement portion.

Inside the front wall 11 a of the main housing 11, a sealed housing 21 constituting the load lock chamber 20 is installed. The sealed casing 21 corresponds to the height of the load port 14. The load lock chamber 20 constitutes a pod lid opening / closing chamber that can be filled and maintained with an inert gas such as nitrogen gas.
As shown in FIG. 1, one end of a nitrogen gas supply line 21 </ b> A and one end of an exhaust line 21 </ b> B are connected to the sealed casing 21, respectively. The other end of the nitrogen gas supply line 21A is connected to the nitrogen gas supply device 21A ′, and the other end of the exhaust line 21B is connected to the exhaust device 21B ′. The nitrogen gas supply line 21 </ b> A supplies nitrogen gas into the load lock chamber 20. The exhaust line 21 </ b> B exhausts the load lock chamber 20.
The controller 77 controls the nitrogen gas supply device 21A ′ and the exhaust device 21B ′.

On the front wall 11 a of the main housing 11, a door access opening 22 is opened at a portion facing the upper portion of the load lock chamber 20. The door loading / unloading port 22 is formed in a size corresponding to the wafer loading / unloading port 3 of the pod 2 placed on the load port 14 (larger than the wafer loading / unloading port 3).
A pod opener 23 is installed in the load lock chamber 20 as a storage container lid opening / closing section (also referred to as an opening / closing device). The pod opener 23 opens and closes the wafer loading / unloading port 3 of the pod 2 placed on the load port 14 and the door loading / unloading port 22 of the front wall 11a.
The pod opener 23 includes a moving table 25 and a closure 26. The moving table 25 moves back and forth (vertical direction) and up and down (parallel direction) with respect to the door slot 22. The closure 26 as the lid holding unit is moved by the moving table 25. The closure 26 can hold the door 4 and can close the door entrance 22.
That is, the pod opener 23 opens and closes the wafer loading / unloading port 3 and the door loading / unloading port 22 of the pod 2 by moving the closure 26 holding the door 4 back and forth and up and down.

A mapping device 27 serving as a substrate state detection device is installed at a portion of the sealed casing 21 that faces the door entrance 22.
The mapping device 27 includes a linear actuator 28 that is a driving source, a holder 29, and a plurality of detectors 30. The holder 29 is moved in the front-rear direction with respect to the wafer loading / unloading port 3 of the pod 2 by the linear actuator 28. A plurality of detectors 30 are held by a holder 29.
The mapping device 27 detects the wafer 1 in the pod 2 with each detector 30. Thereby, the mapping device 27 detects whether or not one wafer 1 is held in each of the plurality of slots in the pod 2.

A pod storage chamber 11 b is formed in the front region in the main housing 11. A rotary pod shelf 31 is installed in the pod storage chamber 11b. The rotary pod shelf 31 is disposed in the upper space in the substantially central portion in the front-rear direction in the pod storage chamber 11b. The rotary pod shelf 31 constitutes a storage shelf for storing the storage container in the housing.
The rotary pod shelf 31 includes a support column 32 and a plurality of shelf boards 33. The support column 32 is erected vertically and is intermittently rotated in a horizontal plane. The plurality of shelf boards 33 are supported radially by the support column 32 at each of the upper, middle, and lower positions. A plurality of shelf boards 33 can mount a plurality of pods 2 respectively.
A plurality of receiving kinematic pins 34 project from the upper surface of the shelf plate 33, and the receiving kinematic pins 34 can be fitted into the positioning holes 5 of the pod 2.

A pod transfer device 35 is installed in the pod storage chamber 11b. The pod transfer device 35 constitutes a transfer device that transfers the pod 2 between the load port 14 and the rotary pod shelf 31 via the pod loading / unloading port 12.
The pod transfer device 35 includes a pod elevator 35a as a storage container lifting mechanism and a pod transfer mechanism 35b as a storage container transfer mechanism. The pod transport mechanism 35b has a holding portion (also referred to as a holding mechanism) that holds the lower surface of the pod.
The pod conveying device 35 conveys the pod 2 between the holding table 18, the rotary pod shelf 31, and the mounting table 43 of the pod opener 42, which will be described in detail later, by continuous operation of the pod elevator 35a and the pod conveying mechanism 35b. To do.

As shown in FIG. 2, a sub-housing 40 is constructed over the rear end in the lower part of the substantially central portion in the front-rear direction in the main housing 11.
A pair of wafer loading / unloading ports 41, 41 are opened in two vertical rows on the front wall 40 a of the sub-casing 40, and the pod opener 42 is provided at the upper and lower wafer loading / unloading ports 41, 41. , 42 are installed. The wafer loading / unloading port 41 can carry the wafer 1 into and out of the sub housing 40.
The pod opener 42 includes a mounting table 43 on which the pod 2 is mounted, and an attaching / detaching mechanism 44 that attaches / detaches the door 4 of the pod 2. The pod opener 42 opens and closes the wafer loading / unloading port 3 of the pod 2 by attaching / detaching the door 4 of the pod 2 mounted on the mounting table 43 by the attaching / detaching mechanism 44.

The sub-chassis 40 constitutes a preliminary chamber 45, which is fluidly isolated from the storage chamber 11b in which the pod transfer device 35 and the rotary pod shelf 31 are installed.
A wafer transfer mechanism 46 is installed in the front area of the preliminary chamber 45. The wafer transfer mechanism 46 includes a wafer transfer device 46a, a wafer transfer device elevator 46b, and a tweezer 46c. The tweezer 46 c constitutes a mounting portion for the wafer 1. The wafer transfer device 46a rotates or moves the tweezer 46c holding the wafer 1 in a horizontal plane. The wafer transfer device elevator 46 b is installed at the right end of the front region in the preliminary chamber 45. The wafer transfer device elevator 46b moves the wafer transfer device 46a up and down.
The wafer transfer mechanism 46 transfers the wafer 1 held by the tweezer 46c from the pod 2 to the boat (substrate holder) 47 by the continuous operation of the wafer transfer device elevator 46b and the wafer transfer device 46a. The boat 47 is loaded (charged).
In addition, the wafer transfer mechanism 46 is detached from the boat 47 by holding the wafer 1 of the boat 47 with the tweezer 46 c, transported from the boat 47 to the pod 2, and returned to the pod 2.
The controller 77 includes all the load-type CVD devices such as the load port 14, the pod elevator 15, the pod opener 23, the mapping device 27, the rotary pod shelf 31, the pod transfer device 35, the pod opener 42, and the wafer transfer mechanism 46. Control the behavior.

A boat elevator 48 for raising and lowering the boat 47 is installed in the rear region of the preliminary chamber 45.
A seal cap 50 is horizontally installed on an arm 49 serving as a connecting tool connected to a lifting platform of the boat elevator 48. The seal cap 50 supports the boat 47 vertically and can close the lower end portion of the processing furnace 51 described later.
The boat 47 includes a plurality of holding members. The boat 47 holds a plurality of wafers 1 (for example, about 50 to 125 wafers) horizontally in a state where the centers are aligned in the vertical direction.

Although not shown for convenience, a clean gas supply unit (hereinafter referred to as a clean unit) is installed at the left end of the auxiliary chamber 45 on the opposite side of the wafer transfer device elevator 46b side and the boat elevator 48 side. ing. The clean unit includes a supply fan and a dust filter. The clean unit supplies clean air (clean gas) which is a cleaned atmosphere or inert gas.
Further, a notch aligning device is installed between the wafer transfer device 46a and the clean unit. The notch aligner constitutes a substrate aligner that aligns the circumferential position of the wafer.
The clean air blown out from the clean unit is circulated through the notch aligning device, the wafer transfer device 46a and the boat 47 and then sucked in by a duct (not shown). The sucked clean air is exhausted to the outside of the main housing 11 or is circulated to the primary side (supply side) that is the suction side of the clean unit and blown again into the spare chamber 45 by the clean unit. Do or do.

A processing furnace 51 shown in FIG. 4 is installed on the sub casing 40.
As shown in FIG. 4, the processing furnace 51 includes a heater 52 as a heating mechanism.
The heater 52 has a cylindrical shape and is vertically installed by being supported by a heater base 53 as a holding plate.

Inside the heater 52, a process tube 54 is disposed as a reaction tube concentrically with the heater 52. The process tube 54 includes an outer tube 55 as an external reaction tube and an inner tube 56 as an internal reaction tube provided on the inner side.
The outer tube 55 is made of a heat resistant material such as quartz (SiO ₂ ) or silicon carbide (SiC). The outer tube 55 has an inner diameter larger than the outer diameter of the inner tube 56, and is formed in a cylindrical shape with the upper end closed and the lower end opened. The outer tube 55 is provided concentrically with the inner tube 56.
The inner tube 56 is made of a heat resistant material such as quartz or silicon carbide. The inner tube 56 is formed in a cylindrical shape with an upper end and a lower end opened. A cylindrical hollow portion of the inner tube 56 forms a processing chamber 57. The processing chamber 57 can accommodate a boat 47 that holds the wafers 1 in a horizontal posture and arranged in multiple stages in the vertical direction.
A gap between the outer tube 55 and the inner tube 56 forms a cylindrical space 58.

A manifold 59 is disposed below the outer tube 55 concentrically with the outer tube 55. The manifold 59 is made of stainless steel, for example. The manifold 59 is formed in a cylindrical shape with an upper end and a lower end opened. The manifold 59 is engaged with and supports the outer tube 55 and the inner tube 56.
Since the manifold 59 is supported by the heater base 53, the process tube 54 is vertically installed.
Process tube 54 and manifold 59 form a reaction vessel.
An O-ring 59a as a seal member is provided between the manifold 59 and the outer tube 55.

A nozzle 60 as a gas introduction part is connected to the seal cap 50, and the nozzle 60 communicates with the inside of the processing chamber 57. A gas supply pipe 61 is connected to the nozzle 60.
A gas supply source 63 is connected to the gas supply pipe 61 via an MFC (mass flow controller) 62 on the opposite side (upstream side) to the connection side with the nozzle 60. The MFC 62 constitutes a gas flow rate controller. The gas supply source 63 supplies a desired gas such as a processing gas or an inert gas.
A gas flow rate control unit 64 is electrically connected to the MFC 62 via an electric wiring C. The gas flow rate control unit 64 controls the MFC 62 at a desired timing so that the flow rate of the supplied gas becomes a desired amount.

The manifold 59 is provided with an exhaust pipe 65 that exhausts the atmosphere in the processing chamber 57. The exhaust pipe 65 is disposed at the lower end of the cylindrical space 58 and communicates with the cylindrical space 58.
An exhaust device 68 is connected to the exhaust pipe 65 via a pressure sensor 66 and a pressure adjusting device 67 on the opposite side (downstream side) to the connection side with the manifold 59. The pressure sensor 66 constitutes a pressure detector. The exhaust device 68 is constituted by a vacuum pump or the like. The pressure sensor 66, the pressure adjusting device 67, and the exhaust device 68 exhaust the inside of the processing chamber 57 so that the pressure becomes a predetermined pressure (degree of vacuum).
A pressure control unit 69 is electrically connected to the pressure adjusting device 67 and the pressure sensor 66 by an electric wiring B. The pressure control unit 69 controls the pressure adjusting device 67 at a desired timing so that the pressure in the processing chamber 57 becomes a desired pressure based on the pressure detected by the pressure sensor 66.

The seal cap 50 contacts the lower end of the manifold 59 from the lower side in the vertical direction. The seal cap 50 constitutes a furnace port lid capable of airtightly closing the lower end opening of the manifold 59.
The seal cap 50 is made of a metal such as stainless steel and is formed in a disk shape. An O-ring 50 a as a seal member is provided on the upper surface of the seal cap 50. The O-ring 50 a comes into contact with the lower end of the manifold 59. A rotation mechanism 70 that rotates the boat is installed on the seal cap 50 on the side opposite to the processing chamber 57. A rotation shaft 71 of the rotation mechanism 70 passes through the seal cap 50 and is connected to the boat 47. The rotating shaft 71 rotates the wafer 47 by rotating the boat 47.
A drive control unit 72 is electrically connected to the rotation mechanism 70 and the boat elevator 48 by an electrical wiring A. The drive control unit 72 controls the rotation mechanism 70 and the boat elevator 48 at a desired timing so as to perform a desired operation.

The boat 47 is made of a heat resistant material such as quartz or silicon carbide. The boat 47 holds a plurality of wafers 1 in a multi-stage by aligning the wafers 1 in a horizontal posture and in a state where their centers are aligned with each other.
Note that a plurality of heat insulating plates 73 are arranged in a multi-stage in a horizontal posture at the lower portion of the boat 47. The heat insulating plate 73 is formed in a disk shape using a heat resistant material such as quartz or silicon carbide. The heat insulating plate 73 constitutes a heat insulating member. The plurality of heat insulating plates 73 make it difficult for the heat from the heater 52 to be transmitted to the manifold 59 side.

A temperature sensor 74 is installed in the process tube 54. The temperature sensor 74 constitutes a temperature detector. A temperature controller 75 is electrically connected to the heater 52 and the temperature sensor 74 by an electric wiring D.
The temperature control unit 75 adjusts the power supply to the heater 52 based on the temperature information detected by the temperature sensor 74, thereby setting the heater 52 at a desired timing so that the temperature in the processing chamber 57 has a desired temperature distribution. Control.

The gas flow rate control unit 64, the pressure control unit 69, the drive control unit 72, and the temperature control unit 75 also constitute an operation unit and an input / output unit, and are electrically connected to the main control unit 76 that controls the entire batch CVD apparatus. It is connected to the.
The gas flow rate control unit 64, the pressure control unit 69, the drive control unit 72, the temperature control unit 75, and the main control unit 76 constitute a controller 77.

Next, the case where the batch type CVD apparatus which concerns on the above structure is used for the film-forming process in the manufacturing method of IC which is one embodiment of this invention is demonstrated.
In the following description, the operation of each part constituting the batch type CVD apparatus is controlled by the controller 77.

As shown in FIGS. 1 to 3, the pod 2 is placed on the holding table 18 when the in-process transfer device is loaded into the load port 14 via the front opening 14 </ b> C or the ceiling opening 14 </ b> B. The
At this time, the receiving kinematic pin 19 of the holding table 18 is fitted into the positioning hole 5 on the lower surface of the pod 2, so that the pod 2 is positioned on the holding table 18.

Next, as shown in FIG. 5A, at the load port 14, the pod 2 is moved in the direction of the pod opener 23, and the door 4 is held by the closure 26 of the pod opener 23.
When the closure 26 holds the door 4, the door 4 is removed (detached) from the wafer loading / unloading port 3 by retreating the movable table 25.
After that, as shown in FIG. 5B, the closure 26 leaves the load lock chamber 20 from the position of the wafer loading / unloading port 3 when the moving table 25 is lowered.
When the wafer loading / unloading port 3 is opened, the holder 29 of the mapping device 27 is inserted into the wafer loading / unloading port 3 by the linear actuator 28 as shown in FIG. The detector 30 of the mapping device 27 maps the wafer 1 in the pod 2.

When the predetermined mapping is completed, the holder 29 of the mapping device 27 is returned from the wafer loading / unloading port 3 to the original standby position by the linear actuator 28.
When the holder 29 is returned to the standby position, the closure 26 is moved to the position of the wafer loading / unloading port 3 as the moving table 25 is raised.
After that, as shown in FIG. 5A, the closure 26 attaches (attaches) the door 4 to the wafer loading / unloading port 3 by the advancement of the moving table 25.

If the mapping information read by the mapping device 27 is different from the mapping information provided in advance with respect to the pod (pod to be read) 2, the pod 2 in which the difference is found is transferred from the load port 14 to the wafer. The knitting process or the immediately preceding process or the like is immediately transferred by an in-process transfer device, for example, the AGV 9 shown in FIG.
As described above, the pod 2 in which a difference between the mapping information read by the mapping device 27 and the mapping information provided in advance is found is immediately sent back from the load port 14, so that the inside of the main casing 11, in particular, the mounting table 43 and the rotation Compared with the case where the pod 2 is loaded into the pod rack 31 and then returned to the loading / unloading section, the number of steps can be greatly reduced. As a result, it is possible to suppress an increase in the wafer placement time on the boat 47 and an increase in the wafer processing start waiting time.

If the mapping information read by the mapping device 27 described above matches the mapping information provided in advance for the pod 2, the pod 2 supported by the holding base 18 is shown in FIG. 6. The pod elevator 15 raises the load port 14 to the height of the pod loading / unloading port 12.
Specifically, the holding base 18 is raised to a height above the hermetic casing 21 so that the pod 2 can be scooped from the lower side by the pod transport mechanism 35b.
When the pod 2 is raised to the height of the pod loading / unloading port 12, the pod loading / unloading port 12 is opened by the front shutter 13.
Subsequently, the pod transport mechanism 35b goes under the pod loading / unloading port 12, and the pod 2 supported by the holding base 18 is moved from the lower side by the pod transport mechanism 35b of the pod transport device 35 as shown in FIG. Crawled. That is, the pod 2 is delivered between the holding table 18 and the pod transport mechanism.
The pod 2 scooped up by the pod transport mechanism 35 b is carried into the main main housing 11 from the pod carry-in / out port 12. That is, the pod 2 is carried into the pod opener 23 from the outside of the main casing 11 via the pod opener 23 or the upper side of the sealed casing 21 by the pod transport mechanism. It can be said that the pod opener 23 and the sealed casing 21 are carried into the main casing 11 from the outside.
As shown in FIG. 1 and FIG. 2, the pod 2 that has been carried in is automatically conveyed and delivered to the designated shelf plate 33 of the rotary pod shelf 31 by the pod conveying device 35.
At this time, the receiving kinematic pin 34 of the shelf board 33 is inserted into the positioning hole 5 on the lower surface of the pod 2, so that the pod 2 is positioned and held on the shelf board 33.

The pod 2 is temporarily stored on the shelf board 33.
Thereafter, the pod 2 is transferred from the shelf plate 33 to one pod opener 42 by the pod transfer device 35 and transferred to the mounting table 43.
At this time, the wafer loading / unloading port 41 of the pod opener 42 is closed by the attaching / detaching mechanism 44, and the reserve chamber 45 is filled with clean air.
The preliminary chamber 45 is filled with nitrogen gas as clean air. In this state, the oxygen concentration in the preliminary chamber 45 is, for example, 20 ppm or less, which is much lower than the oxygen concentration inside the main casing 11 (atmosphere).
In some cases, the pod 2 carried into the main casing 11 from the pod loading / unloading port 12 by the transfer mechanism 35 b may be directly transferred to the pod opener 42 installed at the wafer loading / unloading port 41.

The pod 2 mounted on the mounting table 43 is pressed against the opening edge of the wafer loading / unloading port 41 at the opening side end surface of the front wall 40a. Subsequently, the door 4 is removed by the attaching / detaching mechanism 44, and the pod 2 opens the wafer loading / unloading port 3.
At this time, since mapping has already been performed at the load port 14, mapping for the group of wafers 1 in the pod 2 can be omitted.
When the pod 2 is opened by the pod opener 42, the wafer transfer device 46a picks up the wafer 1 from the pod 2 through the wafer loading / unloading port 3 by the tweezer 46c. When the wafer 1 is picked up by the tweezer 46c, the wafer transfer device 46a conveys the wafer 1 to a notch aligning device (not shown). The notch aligner aligns the wafer 1. After the alignment, the wafer transfer device 46 picks up the wafer 1 from the notch alignment device by the tweezer 46 c and conveys it to the boat 47. The wafer transfer device 46 loads (charges) the transferred wafer 1 into the boat 47.
The wafer transfer device 46 a that has transferred the wafer 1 to the boat 47 returns to the pod 2 and loads the next wafer 1 into the boat 47.

  During the loading operation of the wafer 1 to the boat 47 by the wafer transfer mechanism 46 in the one (upper or lower) pod opener 42, the other (lower or upper) pod opener 42 is separated from the rotary pod shelf 31. The pod 2 is transferred by the pod transfer device 35 and transferred. In the other pod opener 42, the opening operation of the pod 2 by the pod opener 42 proceeds simultaneously.

When a predetermined number of wafers 1 are loaded into the boat 47, the lower end portion of the processing furnace 51 that has been closed by a furnace port shutter (not shown) is opened by the furnace port shutter.
Subsequently, the boat 47 holding the group of wafers is loaded into the processing furnace 51 (boat loading) when the seal cap 50 is lifted by the boat elevator 48.

Here, a method for forming a thin film on the wafer 1 by the CVD method using the processing furnace 51 will be described.
In the following description, the operation of each part constituting the processing furnace 51 is controlled by the controller 77.

When a plurality of wafers 1 are loaded into the boat 47 (wafer charge), as shown in FIG. 4, the boat 47 holding the plurality of wafers 1 is lifted by a boat elevator 48, and is processed into a processing chamber. It is carried into 57 (boat loading).
In this state, the seal cap 50 is in a state where the lower end of the manifold 59 is sealed via the O-ring 50a.

The processing chamber 57 is evacuated by an exhaust device 68 so that a desired pressure (degree of vacuum) is obtained. At this time, the pressure in the processing chamber 57 is measured by the pressure sensor 66, and the pressure adjusting device 67 is feedback-controlled based on the measured pressure.
Further, the inside of the processing chamber 57 is heated by the heater 52 so as to have a desired temperature. At this time, the current supply to the heater 52 is feedback-controlled based on the temperature information detected by the temperature sensor 74 so that the inside of the processing chamber 57 has a desired temperature distribution.
Subsequently, the wafer 1 is rotated by rotating the boat 47 by the rotation mechanism 70.

Next, a gas supplied from the gas supply source 63 and controlled to have a desired flow rate by the MFC 62 is introduced into the processing chamber 57 from the nozzle 60 through the gas supply pipe 61.
The introduced gas rises in the processing chamber 57, flows out from the upper end opening of the inner tube 56 into the cylindrical space 58, and is discharged from the exhaust pipe 65.
The gas contacts the surface of the wafer 1 as it passes through the processing chamber 57. At this time, a thin film is deposited (deposited) on the surface of the wafer 1 by a thermal CVD reaction.

  When a preset processing time has elapsed, an inert gas is supplied from the gas supply source 63 through the gas supply pipe 61, the inside of the processing chamber 57 is replaced with the inert gas, and the pressure in the processing chamber 57 is normal pressure. Returned to

  Thereafter, the seal cap 50 is lowered by the boat elevator 48, the lower end of the manifold 59 is opened, and the processed wafer 1 is carried out from the lower end of the manifold 59 to the outside of the process tube 54 while being held by the boat 47 ( Boat unloading).

The processed wafer 1 unloaded by the boat is taken out from the boat 47 by the wafer transfer device 46a (wafer discharge), and returned to the empty pod 2 that has been transferred to the pod opener 42 in advance.
When a predetermined number of processed wafers 1 are stored, a door 4 is attached to a wafer loading / unloading port 3 of the pod 2 by a pod opener 42.

The pod 2 with the wafer insertion / removal port 3 closed is automatically transferred and delivered to the designated shelf plate 33 of the rotary pod shelf 31 by the pod transfer device 35.
The pod 2 is temporarily stored. Thereafter, when the front shutter 13 is opened, the pod transport device 35 transports the pod 2 from the shelf plate 33 to the pod loading / unloading port 12, and the pod loading / unloading port 12 is hidden on the holding table 18 of the pod elevator 15. hand over.
The pod 2 storing the processed wafer 1 may be directly transferred from the pod opener 42 to the pod loading / unloading port 12 by the pod transfer device 35.

When the pod 2 is transferred onto the holding table 18, the front shutter 13 is closed. Further, the shaft 17 of the pod elevator 15 is lowered onto the load port 14 by the elevating drive device 16.
The pod 2 lowered onto the load port 14 is transferred to a predetermined process by an in-process transfer device, for example, the AGV 9 shown in FIG.

  According to the embodiment, the following effects can be obtained.

1) By installing a mapping device at the load port where the pod is carried by the in-process transfer device, load the pod where the difference between the actual mapping information read by the mapping device and the mapping information provided in advance is found Can be sent back immediately from the port. Therefore, compared to the conventional case where the mapping device is installed in the pod opener in the housing, the wafer processing start is as much as it is possible to save the trouble of returning the pod to the load port and then returning it to the load port. It is possible to shorten the time delay from the time when the difference is discovered.

2) When grasping the upper part of the storage container, the handling part of the storage container transport part needs an elevating function (extension function) and a grip function (horizontal extension function). Giving various functions to the handling unit of the storage container transport unit requires the strength of the storage container transport unit itself, which increases the size of the storage container transport unit. In addition, since the structure becomes complicated, high costs and problems are likely to occur. Also, if the grip fails, the storage container is often dropped. In addition, there are many demerits such as longer storage time for container storage by gripping, larger storage shelves due to larger handling parts, and higher equipment height due to the need for upper grip space.
In that regard, by providing a pod loading / unloading port above the load port and installing a pod elevator that raises and lowers a holding base that holds the pod from below between the load port and the pod loading / unloading port, Since the pod can be removed from the lower side, the handling structure can be made simpler and smaller than the case where the upper part of the pod is grasped and handled. Therefore, the CVD apparatus can be reduced in size, weight, simplification, speed, safety, and space utilization.

3) By providing the receiving kinematic pins on the holding table that is raised and lowered by the pod elevator, the holding table can be used as a transport reference for the pod mounting portions in various places. Therefore, it is possible to unify the transport standards.

4) By being divided into the pod elevator and the pod transfer device, the pod transfer device can be operated to stand by immediately before the pod delivery position at the same time as the pod lifting and lowering operation at the load port. That is, since simultaneous parallel processing can be performed, the total transport time can be shortened.

5) Since the pod elevator can raise the holding stand to a height at which the pod can be scooped from the lower side by the pod transport device, the pod can be safely delivered as compared with the case where the upper part of the pod is handled.

6) Since the wafer in the pod at the load port can be mapped in the load lock chamber cleaned with an inert gas, contamination and natural oxide film formation can be prevented.

  FIG. 7 is a side sectional view showing a batch type CVD apparatus according to the second embodiment of the present invention.

The main difference of this embodiment from the above embodiment is that the pod opener is installed only in the load port.
That is, as shown in FIG. 7, the load port 14 is installed on the front wall (partition wall) 40a of the sub-housing 40 that forms the spare chamber 45, and a pod opener 83 is provided on the front wall 40a. is set up. A wafer loading / unloading port 91 is opened on the back wall 81a of the sealed casing 81 in which the load lock chamber 80 of the pod opener 83 is formed, and a door mechanism 92 for opening and closing the wafer loading / unloading port 91 is installed. Yes.
The wafer transfer mechanism 46 installed in the preliminary chamber 45 constitutes a substrate transfer device. When the door mechanism 92 opens the wafer loading / unloading port 91, the wafer transfer mechanism 46 transports the wafer 1 between the pod 2 and the boat 47.
The boat elevator 48 loads the boat 47 into the processing chamber 57 of the processing furnace 51 adjacent to the preliminary chamber 45 and unloads the boat 47 from the processing chamber 51.
In the storage room 11b adjacent to the ceiling surface of the spare room 45, a storage shelf 31A and a pod transfer device 35 are installed.
A pod loading / unloading port 12 is provided at a portion of the front wall 11a of the main housing 11 facing the storage chamber 11b. The front shutter 13 opens or closes the pod loading / unloading port 12.
Similar to the pod opener 42 of the first embodiment, a mapping device 84 is installed in the load lock chamber 80. The mapping device 84 can move back and forth (vertical direction) and up and down (parallel direction) with respect to the door slot 82.

Next, the operation of the pod opener according to the above configuration will be described.
The controller 77 controls the following operations.

As shown in FIG. 7, the pod 2 is placed on the holding table 18 of the pod elevator 15 when the in-process transfer device is carried into the load port 14 via the front opening 14 </ b> C or the ceiling opening 14 </ b> B. .
At this time, the receiving kinematic pin 19 protruding from the holding table 18 is inserted into the positioning hole 5 on the lower surface of the pod 2, so that the pod 2 is positioned on the holding table 18.

Next, at the load port 14, the pod 2 is moved in the direction of the pod opener 83. The closure 86 of the pod opener 83 holds the door 4.
When the door 4 is held, the closure 86 removes the door 4 from the wafer loading / unloading port 3 and the door loading / unloading port 82 by the movement of the moving table 85. After that, the closure 86 is lowered in the load lock chamber 80 by the moving table 85 and is detached from the positions of the wafer loading / unloading port 3 and the door loading / unloading port 82.
When the wafer loading / unloading port 3 is opened, the detector of the mapping device 84 is inserted into the wafer loading / unloading port 3 (see FIG. 5B). The mapping device 84 maps the wafer 1 in the pod 2 by the detector.

When the predetermined mapping is completed, the mapping device 84 returns the detector from the wafer loading / unloading port 3 to the original standby position.
Thereafter, the closure 86 is moved to the position of the wafer loading / unloading port 3 as the moving table 85 is raised. Thereafter, the closure 86 attaches the door 4 to the wafer loading / unloading port 3 and the door loading / unloading port 82 by the advancement of the movable table 85.

  When the actual mapping information read by the mapping device is different from the mapping information provided in advance for the pod 2, the pod 2 in which the difference is found is transferred from the load port 14 to the wafer knitting process or the immediately preceding process. It is immediately transported by an in-process transport device, for example, the AGV 9 shown in FIG.

When the actual mapping information read by the mapping device described above matches the mapping information provided in advance for the pod 2, the pod elevator 15 removes the pod 2 supported by the holding base 18 from the load port 14 to the pod 2. Raise to the height of the carry-in / out port 12.
When the pod 2 is raised to the height of the pod loading / unloading port 12, the front shutter 13 opens the pod loading / unloading port 12.
Subsequently, the pod transport mechanism 35 b of the pod transport device 35 scoops up the pod 2 supported by the holding table 18.
The pod carrying mechanism 35b carries the scooped pod 2 into the main casing 11 from the pod carry-in / out opening 12.
The pod carrying device 35 carries the pod 2 that has been carried to the storage shelf 31A, and automatically delivers it to the designated shelf 33A.

The pod 2 is temporarily stored on the shelf board 33.
Thereafter, the pod carrying device 35 and the pod elevator 15 carry the pod 2 from the storage shelf 31 </ b> A to the load port 14 in the reverse procedure to that described above.
At this time, clean air is circulated and filled in the preliminary chamber 45.

Next, at the load port 14, the pod 2 is moved in the direction of the pod opener 83. The closure 86 of the pod opener 83 holds the door 4.
When the door 4 is held, the closure 86 removes the door 4 from the wafer loading / unloading port 3 by retreating the movable table 85. After that, the closure 86 is lowered in the load lock chamber 80 by the moving table 85 and is detached from the positions of the wafer loading / unloading port 3 and the door loading / unloading port 82.
When the wafer loading / unloading port 3 is opened, the wafer loading / unloading port 91 is opened by the door mechanism 92.
At this time, since the mapping of the wafer in the pod has already been completed, it can be omitted.

When the wafer loading / unloading port 3 and the wafer loading / unloading port 91 are opened, the wafer transfer device 46a picks up the wafer 1 from the pod 2 through the wafer loading / unloading port 3, the door loading / unloading port 82 and the wafer loading / unloading port 91 by the tweezer 46c. The wafer transfer device 46a conveys the picked-up wafer 1 to the notch aligning device. The notch aligner aligns the wafer 1. After the notch alignment, the wafer transfer device 46a picks up the wafer 1 from the notch alignment device by the tweezer 46c. The wafer transfer device 46 a transports the picked-up wafer 1 to the boat 47 and charges (charges) the boat 47.
The wafer transfer device 46 a that has transferred the wafer 1 to the boat 47 returns to the pod 2 and loads the next wafer 1 into the boat 47.
Note that the wafer transfer device 46a may directly transfer the wafer 1 from the pod 2 by the tweezer 46c without performing the step of temporarily storing the pod 2 in the storage shelf 31A. That is, after the mapping is completed and the detector of the mapping apparatus is returned from the wafer loading / unloading port 3 to the original standby position, the wafer loading / unloading port 91 is opened during mapping. The wafer transfer device 46 a inserts the tweezer 46 c into the wafer loading / unloading port 91 to pick up the wafer 1 from the pod 2.

  Subsequent steps are the same as those in the above embodiment, and a description thereof will be omitted.

  According to the present embodiment, since it is sufficient to install a pod opener at the load port, it is possible to contribute to improvement in space efficiency (footprint reduction) and improvement in throughput (possible to reduce the movement range of the pod). .

  FIG. 8 is a side sectional view showing a batch type CVD apparatus according to the third embodiment of the present invention.

This embodiment is different from the second embodiment in that it is configured to hold and handle the upper part of the pod, and the overhead traveling type on-site transfer device (hereinafter referred to as OHT) even during wafer transfer in the pod. A pod stage mechanism that can be taken in and out to receive pods from
That is, as shown in FIG. 8, a pod transfer device 100 that grips and handles the upper part of the pod (hereinafter referred to as a gripping pod transfer device) 100 is placed in the storage chamber 11 b adjacent to the ceiling surface of the spare chamber 45. It is installed together with the storage shelf 31A.
The gripping pod transport apparatus 100 includes a pod elevator 101, a pod transport mechanism 102 that is moved up and down by the pod elevator 101, and a clip unit 103 that is moved by the pod transport mechanism 102. The grip part 103 can extend and contract to grip the flange part 6 protruding from the upper surface of the pod 2 from above.
The pod stage mechanism 105 includes a slide plate 107 that opens and closes an opening 106 opened just above the load port 14. The pod stage mechanism 105 places the pod 2 on the holding base 18 of the load port 14 from the OHT 110 via the ceiling opening 14B and the opening 106 with the opening 106 opened.
On the other hand, when the slide plate 107 closes the opening 106, the OHT 110 places the pod 2 on the slide plate 107 (which serves as a temporary storage shelf).
Thereafter, when the pod 2 is placed on the holding table 18 of the load port 14 from the slide plate 107, the pod stage mechanism 105 slides the slide plate 107 while the pod transport mechanism 102 lifts the pod 2. Open the opening 106. Subsequently, the pod transport mechanism 102 handles the pod 2 and places it on the holding table 18 of the load port 14 through the handled opening 106.

Next, a pod handling step by the gripping pod transfer device 100 and the pod stage mechanism 105 according to the above configuration will be described.
Since other steps such as a mapping step for mapping the wafer in the pod are the same as those in the second embodiment described above, description of those steps is omitted.

As shown in FIG. 8, the OHT 110 supplies the pod 2 directly onto the load port 14 via the ceiling opening 14 </ b> B and the opening 106.
At this time, the receiving kinematic pin 19 of the holding table 18 is fitted into the positioning hole 5 on the lower surface of the pod 2, so that the pod 2 is positioned on the holding table 18.

In the load port 14, the mapping apparatus maps the wafer in the pod (see the first embodiment and the second embodiment).
In this mapping step, when the actual mapping information read by the mapping device is different from the mapping information provided in advance with respect to the pod 2, the pod 2 in which the difference is found is transferred from the load port 14 to the wafer knitting process or Immediately transported by the OHT 110 to the immediately preceding process or the like.

If the actual mapping information read by the mapping device matches the mapping information provided in advance for the pod 2, the front shutter 13 opens the pod loading / unloading port 12, and the pod elevator 101 is pod transport mechanism 102. Is lowered to a position opposite to the pod loading / unloading port 12.
Subsequently, the pod transport mechanism 102 moves the grip portion 103 directly above the pod 2 with the pod loading / unloading port 12 hidden.
Next, the pod transport mechanism 102 lowers the grip portion 103. The clip part 103 extends downward to grip the collar part 6 of the pod 2 from above.
When gripping the collar portion 6 of the pod 2, the grip portion 103 is shortened upward to lift the pod 2, and the pod elevator 101 raises the pod conveyance mechanism 102 to a height corresponding to the pod loading / unloading port 12.
The pod carrying mechanism 102 carries the suspended pod 2 from the pod carry-in / out opening 12 into the pod storage chamber 11b of the main casing 11.
The grip-type pod transfer device 100 transfers the loaded pod 2 to the storage shelf 31A and automatically delivers it to the designated shelf 33A.
The pod 2 is temporarily stored.
Thereafter, the gripping pod carrying device 100 carries the pod 2 from the storage shelf 31 </ b> A to the load port 14 in the reverse procedure to that described above.

For example, when another pod 2 is transported by the OHT 110 during the mapping step, the pod stage mechanism 105 receives the pod 2 from the OHT 110 by the slide plate 107 and temporarily stores it in the slide plate 107.
That is, as indicated by an imaginary line in FIG. 8, the pod stage mechanism 105 slides the slide plate 107 to close the opening 106, thereby receiving the pod 2 of the OHT 110 by the slide plate 107. That is, the slide plate 107 serves as a temporary storage shelf.
Thereafter, when the pod 2 is moved from the slide plate 107 to the holding table 18 of the load port 14, the pod stage mechanism 105 slides the slide plate 107 while the pod transport mechanism 102 lifts the pod 2 from the slide plate 107. To open the opening 106. Subsequently, the pod transport mechanism 102 places the lifted pod 2 on the holding table 18 of the load port 14 through the opening 106.

According to this embodiment, in addition to the effects of the second embodiment described above, the following effects can be obtained.
When the pod is transported by OHT during the mapping step, etc., the pod stage mechanism can receive the pod from the OHT by the slide plate and temporarily store it.

FIG. 9 is a side sectional view showing a batch type CVD apparatus according to the fourth embodiment of the present invention.
The present embodiment is different from the first embodiment in that a pod transport device 200 (hereinafter referred to as a gripping pod transport device) 200 that grips and transports the collar portion 6 of the pod 2 is provided.
That is, as shown in FIG. 9, the gripping pod transfer device 200 is installed in the pod storage chamber 11b. The gripping pod transfer device 200 can transfer the pod 2 between the holding base 18 and the pod storage chamber 11b through the pod loading / unloading port 12 in a state where the grip portion 6 is gripped.
The gripping pod transport apparatus 200 includes a pod elevator 201, a pod transport mechanism 202 that is moved up and down by the pod elevator 201, and a grip unit 203 that is moved by the pod transport mechanism 202. The grip part 203 has a type that grips the collar part 6 by extending and contracting in the horizontal direction, and a hook type that does not have a mechanism that stretches and contracts in the horizontal direction and is formed in a substantially U-shape and is only hooked on the collar part. And a type having a mechanism that expands and contracts in the vertical direction.
The gripping pod transfer device 200 is controlled by a controller 77.

Next, several examples of the operation method of the gripping pod transfer apparatus according to the above configuration will be described.
In the following description, the controller 77 controls the operations of the gripping pod transfer device 200, the pod elevator 15, the front shutter 13, and the like.

FIG. 10 shows a first example of the operation method.
As shown in FIG. 10A, the pod elevator 15 extends the shaft 17 by the elevating drive device 16, and the holding base 18 supporting the pod 2 is positioned at a position where the bottom surface of the pod 2 is higher than the reference height 204. Raise until Simultaneously with the operation of the pod elevator 15 described above, the pod elevator 201 raises and lowers the pod conveyance mechanism 202 and the grip portion 203 so that the height of the grip portion 203 is the same as the height of the flange portion 6.
The reference height 204 is the height of the lower end of the pod loading / unloading entrance 12 (see FIG. 9), and is at least a height position equal to or higher than the height position of the upper end of the sealed casing 21. The height is higher than the height of the upper end of the load lock chamber 20.
The front shutter 13 opens the pod loading / unloading port 12 (see FIG. 9).
As shown in FIG. 10B, the pod transfer mechanism 202 extends and moves horizontally from the pod storage chamber 11b to the grip portion 203 outside the main casing 11 via the pod loading / unloading port 12. As a result, the grip part 203 is replaced under the collar part 6.
As shown in FIG. 10C, when the pod elevator 201 raises the pod conveyance mechanism 202, the grip unit 203 lifts the pod 2 from above the holding table 18.
As shown in FIG. 10D, the gripping pod transfer device 200 shortens the pod transfer mechanism 202 and loads the pod 2 into the pod storage chamber 11b.
On the other hand, the pod elevator 15 shortens the shaft 17 by the elevating drive device 16 and lowers the holding base 18 onto the load port 14.
Thereafter, the gripping pod carrying device 200 carries the pod 2 to the rotary pod shelf 31 and delivers it to the designated shelf 33.
According to this first example, the grip portion 203 only needs to hook the collar portion 6. Therefore, the grip part 203 does not require a mechanism for expanding and contracting in the horizontal direction and the vertical direction, and its structure and operation are simple. As a result, cost reduction, space saving, and operation time reduction can be achieved.

FIG. 11 shows a second example of the operation method.
As shown in FIG. 11A, the pod elevator 15 extends the shaft 17 by the lift drive device 16, and the holding base 18 that supports the pod 2, and the bottom surface of the pod is below the reference height 204. The position is raised to a position where the collar portion 6 is above the reference height 204.
Simultaneously with the operation of the pod elevator 15 described above, the pod elevator 201 raises and lowers the pod conveyance mechanism 202 and the grip portion 203 so that the height of the grip portion 203 is the same as the height of the flange portion 6.
The front shutter 13 opens the pod loading / unloading port 12 (see FIG. 9).
As shown in FIG. 11 (b), the pod transport mechanism 202 extends and horizontally moves from the pod storage chamber 11 b through the pod loading / unloading port 12 to the grip portion 203 outside the main housing 11. As a result, the grip part 203 is replaced under the collar part 6.
As shown in FIG. 11C, when the pod elevator 201 raises the pod conveyance mechanism 202, the grip portion 203 lifts the pod 2 from the top of the holding table 18.
As shown in FIG. 11D, the gripping pod transfer device 200 shortens the pod transfer mechanism 202 and loads the pod 2 into the pod storage chamber 11b.
On the other hand, the pod elevator 15 shortens the shaft 17 by the elevating drive device 16 and lowers the holding base 18 onto the load port 14.
Thereafter, the gripping pod carrying device 200 carries the pod 2 to the rotary pod shelf 31 and delivers it to the designated shelf 33.
Compared with the first example, the pod elevator 201 is inferior in that it requires an operation and an operation time for raising and lowering the pod 2 between the holding base 18 and the height of the pod loading / unloading port 12. The grip part 203 only needs to hook the collar part 6. Therefore, the grip part 203 does not require a mechanism for expanding and contracting in the horizontal direction and the vertical direction, and its structure and operation are simple. As a result, cost reduction, space saving, and operation time reduction can be achieved.

12 and 13 show a third example of the operation method.
As shown in FIG. 12A, the pod elevator 15 has the shaft 17 extended by the elevating drive device 16, and the holding table 18 that supports the pod 2 is positioned at a position where the collar portion 6 is directly below the reference height 204. Raise to. Simultaneously with the operation of the pod elevator 15 described above, the pod elevator 201 raises and lowers the pod conveyance mechanism 202 and the grip portion 203 so that the height of the grip portion 203 is opposite to the pod loading / unloading port 12.
The front shutter 13 opens the pod loading / unloading port 12 (see FIG. 9).
As shown in FIG. 12B, when the pod transport mechanism 202 goes under the pod loading / unloading port 12, the grip portion 203 is positioned directly above the collar portion 6.
As shown in FIG. 12C, when the pod elevator 201 lowers the pod conveyance mechanism 202, the grip part 203 is lowered to the collar part 6. The grip 203 extends in the horizontal direction.
As shown in FIG. 12 (d), the grip portion 203 is shortened in the horizontal direction and replaced under the flange portion 6.
As shown in FIG. 13A, when the pod elevator 201 raises the pod transport mechanism 202, the grip unit 203 lifts the pod 2 from the top of the holding table 18. The pod elevator 201 raises the pod conveyance mechanism 202 to a height at least so that the bottom surface of the pod 2 is above the reference height.
As shown in FIG. 13B, the gripping pod transfer device 200 shortens the pod transfer mechanism 202 and loads the pod 2 into the pod storage chamber 11b.
On the other hand, the pod elevator 15 shortens the shaft 17 by the elevating drive device 16 and lowers the holding base 18 onto the load port 14.
Thereafter, the gripping pod carrying device 200 carries the pod 2 to the rotary pod shelf 31 and delivers it to the designated shelf 33.
According to the third example, as compared with the first example and the second example, an operation and an operation time for moving the pod 2 up and down between the holding table 18 and the height of the pod loading / unloading port 12 by the pod elevator 201 are required. Although it is inferior in that the grip portion 203 requires a mechanism for extending and contracting in the horizontal direction, the grip portion 203 does not require a mechanism for extending and contracting in the vertical direction, and its structure and operation are simplified. As a result, cost reduction, space saving, and operation time reduction can be achieved.

In the fourth embodiment, since the pod elevator in the load port and the gripping pod transfer device are provided, the gripping pod transfer device moves the other pod to the rotary pod shelf during the lifting and lowering operation of the holding table at the load port. Alternatively, other operations such as transport to the pod opener of the sub-casing can be performed. Therefore, the operation rate of the gripping pod transfer device can be increased.
Further, since the pod elevator and the gripping pod transporting device are separated, the gripping pod transporting device can be operated up to just before the pod delivery position at the same time as the pod ascending operation in the load port. That is, since simultaneous parallel processing can be performed, the total transport time can be shortened.
Similarly, the pod delivery time can be shortened by simultaneously raising the gripping pod conveying device and lowering the pod elevator.
The operation method of the fourth embodiment can be applied to the first embodiment and the second embodiment described above. When applied, the same effects as those of the first embodiment and the second embodiment described above can be obtained.

FIG. 14 is a side sectional view showing a preferred embodiment of the pod opener.
FIG. 15 is an exploded perspective view thereof.
As shown in FIG. 14, one end of the nitrogen gas supply line 21 </ b> A is connected to the upper surface wall of the sealed casing 21, and one end of the exhaust line 21 </ b> B is connected to the lower wall of the sealed casing 21. Yes. The nitrogen gas supply line 21 </ b> A blows nitrogen gas 21 </ b> C downward from the blowout port into the load lock chamber 20. The exhaust line 21 </ b> B exhausts the load lock chamber 20.
As shown in FIGS. 14 and 15, a louver 21 </ b> D is laid at the upper end of the load lock chamber 20 at a position facing the air outlet of the nitrogen gas supply line 21 </ b> A. The louver 21D constitutes a deflector that deflects the flow direction of the nitrogen gas 21C blown from the blowout port of the nitrogen gas supply line 21A. The louver 21D is inclined toward the door entrance 22. Due to this inclination, the louver 21 </ b> D deflects the nitrogen gas flow toward the door entrance / exit 22.

Next, the operation and effect of the pod opener according to the above configuration will be described.
Since the nitrogen gas supply line 21A is connected to the upper end of the load lock chamber 20 and the exhaust line 21B is arranged at the lower end, the nitrogen gas flow in the load lock chamber 20 becomes a down flow. The downflow nitrogen gas 21 </ b> C effectively discharges foreign matter such as dust and organic matter in the load lock chamber 20. That is, the downflow nitrogen gas 21C can prevent foreign matters from adhering to the wafer 1 and entering the pod 2 in advance. Examples of the foreign matter in the load lock chamber 20 include dust generated from the moving table 25, the closure 26, and the mapping device 27 installed in the load lock chamber 20, and organic matter.
The louver 21 </ b> D deflects the nitrogen gas 21 </ b> C toward the door inlet / outlet 22 and guides it into the pod 2. The flow of the nitrogen gas 21 </ b> C into the pod 2 prevents foreign substances from being caught by convection from the lower part in the load lock chamber 20.

For example, the following operation method can be implemented.
When the pod 2 is unloaded from the load port 14 by the in-process transfer device, the nitrogen gas 21C is guided into the pod 2 by the louver 21D, so that the atmosphere (air, foreign matter, etc.) in the pod 2 is forced by the nitrogen gas 21C. Purge (replace). Thereafter, the door 4 is attached to the wafer loading / unloading port 3 of the pod 2 by the pod opener 23.
According to this operation method, since the nitrogen gas 21C can be further sealed in the pod 2, contamination in the pod 2 and formation of a natural oxide film can be prevented.
For example, even if the sub housing 40 is not in a nitrogen gas atmosphere, the nitrogen gas 21 </ b> C can be sealed in the pod 2.
Further, when mapping is performed on the wafer 1 in the pod 2 before attaching the door 4 to the wafer loading / unloading port 3, the mapped pod 2 is sent to the next process in a state in which the nitrogen gas 21C is sealed. be able to.

  In addition, the preferable Example of this pod opener is applicable also to 1st embodiment-4th embodiment. When applied, the effects described above can be obtained.

FIG. 16 is a perspective view showing a preferred embodiment of the pod elevator.
FIG. 17 is a perspective view showing the operating state.
As shown in FIG. 16, a cover 300 is installed on the pod elevator 15. The cover 300 includes a top plate 301 arranged horizontally, and a front plate 302 arranged vertically and having an upper end side fixed to a front end side of the top plate 301. The top plate 301 is fixed to the shaft 17 of the elevating drive device 16. The front plate 302 is formed with a width that can cover the load port 14 and a height that is larger than the stroke of the shaft 17 (see FIG. 17).
Although the number of the lift drive device 16 and the shaft 17 may be one, it is preferable to install two or more at predetermined intervals. By doing so, the top plate 301 can be raised and lowered stably with the pod placed.
A triangular relief hole 303 is formed in the top plate 301 at a portion facing the holding table 18 on the load port 14. A kinematic pin 19 projects from each of the triangular vertices of the escape hole 303. Therefore, the top plate 301 constitutes a holding portion that holds the lower surface of the pod 2 and also constitutes a pod placement portion.
The top plate 301 may be expressed as a holding unit, and the cover 300 may be expressed as being fixed to the holding unit.
Further, the cover 300 is not necessarily fixed to the holding portion. For example, a drive device may be provided in the cover 300, and the cover 300 may be moved up and down according to the operation of the holding unit and the lifting mechanism.

Next, the operation and effect of the pod elevator according to the above configuration will be described.
For convenience, illustration of the pod 2 is omitted, but when the state transitions from the state of FIG. 16 to the state of FIG. At this time, the kinematic pins 19 on the top plate 301 are fitted into the positioning holes 5 on the lower surface of the pod 2 on the outside of the kinematic pins 19 on the holding base 18.
During normal standby, the top plate 301 is positioned below the holding base 18 to avoid interference when the holding base 18 moves back and forth with respect to the door access slot 22.
When shifting from the state of FIG. 17 to the state of FIG. 16, the top plate 301 delivers the pod 2 onto the holding table 18.
The cover 300 covering the pod elevator 15 suppresses scattering of particles from the pod elevator 15. In particular, in the state where the pod 2 is raised to the vicinity of the pod loading / unloading port 12 by the top plate 301, the lifting drive device 16 and the shaft 17 are exposed from the front opening 14C from the front of the device, so that the particles are exposed outside the device. Will be scattered. However, the cover 300 can suppress such particle scattering.
The cover 300 covering the pod elevator 15 can suppress the danger of the operator due to the lifting drive device 16 and the shaft 17 being exposed to the work space.
For example, when the operator manually places the pod 2 on the load port 14 from the front opening 14C (see FIG. 1) of the box 14A, the cover 300 prevents contact with the elevating drive device 16 and the shaft 17. Can do.

FIG. 18 is a perspective view showing a further preferred embodiment of the pod elevator.
FIG. 19 is a perspective view showing the operating state.
The present embodiment is different from the above embodiment in that the cover 300 includes a pair of side plates 304 and 304. The pair of side plates 304 and 304 are fixed at right angles to the left and right ends of the front plate 302, respectively. That is, it is provided on three side surfaces excluding the side where the pod opener 23 is present.
According to the present embodiment, since the cover 300 covers not only the front of the pod elevator 15 but also the left and right sides, the effect of preventing particle scattering and the effect of ensuring safety can be further improved.

  In addition, the Example which installs the pod elevator shown in FIGS. 16-19 is applicable also to 1st embodiment-4th embodiment. When applied, the effects described above can be obtained.

  Needless to say, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention.

For example, in consideration of hermeticity of the pod storage chamber and prevention of particle scattering to the outside of the apparatus, it is preferable to provide the front shutter 13 or to form the pod loading / unloading port 12 with a small opening size. However, the front shutter 13 may not be provided.
Further, the pod loading / unloading port 12 may be maximized so that substantially all of the partition walls above the pod opener 23 and the sealed casing 21 are opened.
For example, the holding table 18 (top plate 301) is raised in advance by the pod elevator 15 to a height that can be accessed by the pod transfer device 35, the pod is received from the OHT at that position, the holding table 18 is lowered, and the door 4 The pod may be received from the holding table 18 by the pod transfer device 35 without performing the opening / closing operation.
When operated in this way, the OHT descending range can be reduced as much as the holding base 18 is raised. Further, since the holding table 18 does not need to be raised to a height position accessible by the pod transfer device 35 after receiving the pod from the OHT, the transfer time can be shortened accordingly.
For example, the gripping pod transfer device can be employed in the first embodiment and the second embodiment.
The second partition wall and the pod stage mechanism of the third embodiment can also be employed in the first embodiment and the second embodiment.
The mapping apparatus may apply the first embodiment to the second embodiment, the third embodiment, and the fourth embodiment, and the second embodiment, the third embodiment, and the fourth embodiment to the first embodiment. You may apply.

  In the above-described embodiment, the case where the present invention is applied to a batch type CVD apparatus has been described. However, the present invention is not limited to this, and can be applied to all substrate processing apparatuses such as a diffusion apparatus, an annealing apparatus, and an oxidation apparatus.

  The substrate is not limited to a wafer, but may be a photomask, a printed wiring board, a liquid crystal panel, a compact disk, a magnetic disk, or the like.

Preferred embodiments will be additionally described.
(1) a storage container that stores a plurality of substrates and whose substrate outlet is closed by a lid;
A loading / unloading unit in which the storage container is loaded and unloaded between the inside and the outside of the housing;
A mounting section for mounting the storage container in the loading / unloading section;
A storage room that is provided adjacent to the carry-in / carry-out unit and stores the storage container;
An opening and closing device for opening and closing the substrate loading / unloading port of the storage container placed on the placement unit;
A holding device that holds the lower surface of the storage container, and a transfer device that transfers the storage container held by the holding mechanism between the storage chamber and the outside via the upper side of the opening and closing device;
The placement unit is moved up and down between a height position of the placement unit when the opening / closing device opens and closes the storage container and a height position at which the transfer device exchanges the storage container. An elevating mechanism;
A substrate processing apparatus comprising:
(2) a storage container that stores a plurality of substrates and whose substrate outlet is closed by a lid;
A loading / unloading unit in which the storage container is loaded and unloaded between the inside and the outside of the housing;
A mounting section for mounting the storage container in the loading / unloading section;
A storage room that is provided adjacent to the carry-in / carry-out unit and stores the storage container;
An opening / closing device provided in the storage chamber, for opening and closing the substrate inlet / outlet port of the storage container mounted on the mounting portion;
A transfer device for transferring the storage container between the storage chamber and the outside via the upper side of the opening and closing device;
The placement unit is moved up and down between a height position of the placement unit when the opening / closing device opens and closes the storage container and a height position at which the transfer device exchanges the storage container. An elevating mechanism;
The storage container is placed between the transfer device and the mounting section in a state where the lifting mechanism is raised to a height position where the storage container can be transported between the storage chamber and the outside. A controller for controlling the elevating mechanism and the transport device so that
A substrate processing apparatus comprising:
(3) a storage container that stores a plurality of substrates and whose substrate outlet is closed by a lid;
A loading / unloading unit in which the storage container is loaded and unloaded between the inside and the outside of the housing;
A mounting section for mounting the storage container in the loading / unloading section;
An opening and closing device for opening and closing the substrate loading / unloading port of the storage container placed on the placement unit;
A storage shelf provided in the housing for storing the storage container;
A transport device that is provided in the housing and transports the storage container between the placement unit and the storage shelf via the opening and closing device;
An elevating mechanism that raises the mounting portion to a position accessible by the transfer device;
A substrate processing apparatus comprising:
(4) The substrate processing apparatus according to (1), further including an opening / closing chamber that surrounds the substrate loading / unloading opening and the opening / closing device when the storage container is opened / closed, and the opening / closing chamber can be filled with an inert gas.
(5) The substrate processing apparatus according to (1), wherein the open / close chamber includes a substrate state detection device.
(6) A gas supply line for supplying an inert gas to the open / close chamber and an exhaust line for exhausting the open / close chamber, wherein the gas supply line has a retreat direction when the lid is removed by the open / close device. The substrate processing apparatus according to (4), wherein the substrate processing apparatus is provided on an opposite side, and the exhaust line is provided on the same side as a retracting direction when the lid is removed by the opening / closing device.
(7) The substrate processing apparatus according to (6), wherein the open / close chamber includes a louver (deflecting tool) between the gas supply line and the substrate loading / unloading port.
(8) A method of manufacturing a semiconductor device using the substrate processing apparatus of (1),
Carrying the storage container into the carry-in / out section, and placing the storage container on the placement section;
The opening and closing device removing the lid from the substrate outlet of the storage container placed on the placement unit; and
A step of attaching the lid to the substrate loading / unloading port of the storage container placed on the placement unit;
The lifting mechanism raises the mounting unit between a height position of the mounting unit at the time of attaching and removing the lid and a height position at which the transfer device transfers the storage container; and
Carrying the storage container held by the holding mechanism into the storage chamber via the upper part of the opening / closing device by the transfer device;
Processing the substrate in a processing chamber;
A method for manufacturing a semiconductor device comprising:
(9) a storage container that stores a plurality of substrates and the substrate insertion / exit opening is closed by a lid;
A loading / unloading unit in which the storage container is loaded and unloaded between the inside and the outside of the housing;
A mounting section for mounting the storage container in the loading / unloading section;
A storage room that is provided adjacent to the carry-in / carry-out unit and stores the storage container;
An opening and closing device for opening and closing the substrate loading / unloading port of the storage container placed on the placement unit;
A partition wall that partitions the inside and the outside of the storage room;
Provided in the partition wall above the opening and closing device, an opening through which the storage container is carried in and out between the inside and the outside of the storage chamber;
A transporting device provided in the storage chamber and transporting the storage container from the placement unit via the opening;
An elevating mechanism that raises the mounting unit to a position where the transport device can access the storage container mounted on the mounting unit;
A substrate processing apparatus comprising:
(10) The second partition wall provided opposite to the placement portion above the placement portion, the second opening provided in the second partition wall, and the second opening / closing device that opens and closes the second opening And (9) the substrate processing apparatus.
(11) The substrate processing apparatus according to (10), wherein an upper surface of the second opening / closing device is formed so that the storage container can be placed when the second opening is closed.
(12) The substrate processing apparatus according to (9), further including a second opening / closing device that opens and closes the opening.
(13) When the opening / closing device removes the lid of the storage container, a preliminary chamber in which a substrate transfer device for transferring the substrate between the storage container and the substrate holder is installed;
A processing chamber provided adjacent to the preliminary chamber and processing the substrate held by the substrate holder;
A storage room provided adjacent to the spare room, in which the storage shelf and the transfer device are installed;
The substrate processing apparatus according to (1), comprising:
(14) carrying the storage container into the carry-in / out section and placing the storage container on the placement section;
The opening and closing device removing the lid from the substrate loading / unloading port of the storage container placed on the placement unit;
A substrate state detecting device detecting a substrate arrangement state in the storage container;
From the height of the mounting portion described above when the lid is removed and attached, to the height above the opening / closing device and to the height at which the storage container is exchanged between the mounting portion and the transport device Raising the entry section; and
The transport device holding the storage container and transporting from the placement unit to a storage shelf; and
Processing the substrate in a processing chamber;
A method for manufacturing a semiconductor device comprising:
(15) A storage container for storing a plurality of substrates and having a lid for closing and inserting the substrate;
A loading / unloading unit in which the storage container is loaded and unloaded between the inside and the outside of the housing;
A mounting section for mounting the storage container in the loading / unloading section;
An opening and closing device for opening and closing the substrate loading / unloading port of the storage container placed on the placement unit;
An elevating mechanism that raises and lowers the placement unit between a height position at which the storage container can be opened and closed by the opening / closing device and a height position at which the storage container can be conveyed across the opening / closing device; ,
A transfer device that exchanges the storage container with the placement unit having a height capable of transporting the storage container;
A substrate processing apparatus comprising:
(16) a storage container that stores a plurality of substrates and whose substrate outlet is closed by a lid;
A loading / unloading unit in which the storage container is loaded and unloaded between the inside and the outside of the housing;
A mounting section for mounting the storage container in the loading / unloading section;
An opening and closing device for opening and closing the substrate loading / unloading port of the storage container placed on the placement unit;
An open / close chamber surrounding the open / close device;
Between the height position at which the storage container can be opened / closed by the opening / closing device and the height position where at least a part of the storage container placed on the mounting portion is higher than the upper end of the opening / closing chamber, An elevating mechanism for elevating the placement unit;
A substrate processing apparatus comprising:
(17) The substrate processing apparatus according to (16), further including a cover that covers a lower portion of the placement unit, wherein the cover moves up and down according to the operation of the lifting mechanism.
(18) The substrate processing apparatus according to (17), wherein the cover is disposed on a front side of the mounting portion.
(19) The substrate processing apparatus according to (17), wherein the cover is provided on three side surfaces excluding the side where the opening / closing device is provided.
(20) A storage container that stores a plurality of substrates and whose substrate outlet is closed by a lid;
A loading / unloading unit in which the storage container is loaded and unloaded between the inside and the outside of the housing;
A mounting section for mounting the storage container in the loading / unloading section;
An elevating mechanism that is provided below the placement unit and raises and lowers the placement unit;
A cover provided so as to cover a lower portion of the placing portion, and performing raising and lowering according to the operation of the lifting mechanism;
A substrate processing apparatus comprising:
(21) a storage container that stores a plurality of substrates and whose substrate outlet is closed by a lid;
A loading / unloading unit for loading / unloading the storage container between the inside and the outside of the housing;
A mounting section for mounting the storage container at the loading / unloading section;
A storage chamber provided in the housing for storing the storage container;
An opening and closing device for opening and closing the substrate loading / unloading port of the storage container placed on the placement unit;
A holding device that holds the lower surface of the storage container, and a transfer device that transfers the storage container held by the holding mechanism between the storage chamber and the outside via the upper side of the opening and closing device;
The placement unit is moved up and down between a height position of the placement unit when the opening / closing device opens and closes the storage container and a height position at which the transfer device exchanges the storage container. An elevating mechanism;
While holding the lower surface of the storage container by the holding mechanism, the storage unit is raised to a height position where the lifting mechanism can transport the storage container. A controller for controlling the elevating mechanism and the transport device so that the storage container is exchanged;
A substrate processing apparatus comprising:
(22) A method of manufacturing a semiconductor device using the substrate processing apparatus of (16),
Carrying the storage container into the carry-in / out port, and placing the storage container on the placement unit;
Between the height position of the mounting portion at the time of removing and attaching the lid, and the height position where at least a part of the storage container placed on the mounting portion is higher than the upper end of the open / close chamber, A step by which the elevating mechanism raises or lowers the placing portion;
Processing the substrate in a processing chamber;
A method for manufacturing a semiconductor device comprising:
(23) In the state where the above-described lifting mechanism is raised to a height at which the storage container can be transported, the storage container is exchanged between the transport device and the mounting part. The substrate processing apparatus according to (16), further comprising a controller that controls the lifting mechanism and the transfer device.
(24) A method of manufacturing a semiconductor device using the substrate processing apparatus of (1) or (16),
Carrying the storage container into the carry-in / out section, and placing the storage container on the placement section;
The lifting mechanism ascending or descending the placing portion;
Processing the substrate in a processing chamber;
A method for manufacturing a semiconductor device comprising:

1 is a partially omitted perspective view showing a batch type CVD apparatus according to a first embodiment of the present invention. It is side surface sectional drawing. It is side surface sectional drawing which shows the principal part. It is a longitudinal cross-sectional view which shows a reaction furnace. It is each partially abbreviated side sectional view for explaining operation of a pod opener, (a) shows before the door is removed, and (b) shows at the time of mapping. It is a partially omitted side sectional view showing when the pod is carried. It is side surface sectional drawing which shows the batch type CVD apparatus which is 2nd embodiment of this invention. It is side surface sectional drawing which shows the batch type CVD apparatus which is 3rd embodiment of this invention. It is side surface sectional drawing which shows the batch type CVD apparatus which is 4th embodiment of this invention. It is each side view which shows the 1st example of the operation method. It is each side view which shows the 2nd example of the operation method. It is each side view which shows the 3rd example of the operation method. It is each side view which shows the continuation of a 3rd example. It is side surface sectional drawing which shows the preferable Example of a pod opener. FIG. It is a perspective view which shows the preferable Example of a pod elevator. It is a perspective view which shows the action state. It is a perspective view which shows the preferable Example of a pod elevator. It is a perspective view which shows the action state.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Wafer (substrate), 2 ... Pod (storage container), 3 ... Wafer loading / unloading port, 4 ... Door (lid body), 5 ... Positioning hole, 6 ... Butt part.
DESCRIPTION OF SYMBOLS 10 ... Batch type CVD apparatus (substrate processing apparatus), 11 ... Main housing, 11a ... Front wall (compartment wall), 11b ... Pod storage room, 12 ... Pod loading / unloading port (storage container loading / unloading port), 13 ... Front Shutter (opening / closing body), 14 ... load port (storage container loading / unloading section),
14A ... Box, 14B ... Ceiling opening, 14C ... Front opening.
DESCRIPTION OF SYMBOLS 15 ... Pod elevator (storage container mounting part raising / lowering mechanism part), 16 ... Elevating drive apparatus, 17 ... Shaft, 18 ... Holding stand (storage container mounting part), 19 ... Receiving kinematic pin.
DESCRIPTION OF SYMBOLS 20 ... Load lock chamber, 21 ... Sealed housing (partition wall), 21A ... Nitrogen gas supply line, 21B ... Exhaust line, 21A '... Nitrogen gas supply device, 21B' ... Exhaust device.
22 ... Door entrance / exit (opening), 23 ... Pod opener (storage container lid opening / closing part), 25 ... Moving table, 26 ... Closure, 27 ... Mapping device (substrate state detection part), 28 ... Linear actuator, 29 ... Holder, 30 ... detector.
31 ... Rotary pod shelf (storage shelf), 32 ... support, 33 ... shelf, 34 ... receiving kinematic pin.
35 ... Pod transfer device (storage container transfer unit), 35a ... Pod elevator (storage container lifting mechanism), 35b ... Pod transfer mechanism (storage container transfer mechanism).
DESCRIPTION OF SYMBOLS 40 ... Sub housing | casing, 40a ... Front wall (partition wall), 41 ... Wafer loading / unloading exit, 42 ... Pod opener (storage container lid opening / closing part), 43 ... Mounting table, 44 ... Detachment mechanism.
45 ... Preliminary chamber, 46 ... Wafer transfer mechanism, 46a ... Wafer transfer device, 46b ... Wafer transfer device elevator, 46c ... Tweezer.
47 ... boat (substrate holder), 48 ... boat elevator, 49 ... arm, 50 ... seal cap.
DESCRIPTION OF SYMBOLS 51 ... Processing furnace, 52 ... Heater, 53 ... Heater base, 54 ... Process tube, 55 ... Outer tube, 56 ... Inner tube, 57 ... Processing chamber, 58 ... Cylindrical space, 59 ... Manifold.
60 ... Nozzle, 61 ... Gas supply pipe, 62 ... MFC, 63 ... Gas supply source, 64 ... Gas flow rate control unit, 65 ... Exhaust pipe, 66 ... Pressure sensor, 67 ... Pressure adjustment device, 68 ... Vacuum exhaust device, 69 DESCRIPTION OF SYMBOLS ... Pressure control part, 70 ... Rotation mechanism, 71 ... Rotating shaft, 72 ... Drive control part, 73 ... Thermal insulation board, 74 ... Temperature sensor, 75 ... Temperature control part, 76 ... Main control part, 77 ... Controller.
31A ... Storage shelf, 33A ... Shelves, 80 ... Load lock chamber, 81 ... Sealed housing, 81a ... Back wall, 82 ... Door door, 83 ... Pod opener, 84 ... Mapping device, 85 ... Moving platform, 86 ... Closure, 91 ... wafer loading / unloading port, 92 ... door mechanism.
DESCRIPTION OF SYMBOLS 100 ... Grasp type pod conveyance apparatus, 101 ... Pod elevator, 102 ... Pod conveyance mechanism, 103 ... Grip part,
105 ... pod stage mechanism, 106 ... opening, 107 ... slide plate,
110: Ceiling traveling type on-site transfer device (OHT).
200: Grasping pod transfer device, 201: Pod elevator, 202 ... Pod transfer mechanism, 203 ... Grip part, 204 ... Reference height.
300 ... cover, 301 ... top plate, 302 ... front plate, 303 ... escape hole, 304 ... side plate.

Claims (4)

A storage container in which the substrate loading and unloading opening accommodating a plurality of substrates is closed Ri by the lid,
A loading / unloading unit in which the storage container is loaded and unloaded between the inside and the outside of the housing;
A mounting section for mounting the storage container in the loading / unloading section ;
A closing device for opening and closing the substrate loading and unloading opening of the receiving container placed on the placing portion,
An open / close chamber surrounding the open / close device;
Between the pre Symbol open and open height position of the container by the device, at least a part is higher than the upper end of the closing chamber height position of the receiving container placed on the mounting section, An elevating mechanism for elevating the mounting unit,
A substrate processing apparatus comprising: Before KiHiraki closed from the substrate processing apparatus according to claim 1 which is fillable internal inert gas. The substrate processing apparatus according to claim 2, wherein a deflection tool is provided between the gas supply line for supplying an inert gas and the substrate inlet / outlet in the open / close chamber .   A storage container in which a plurality of substrates are stored and a substrate outlet is closed by a lid;
  A loading / unloading unit in which the storage container is loaded and unloaded between the inside and the outside of the housing;
  A mounting section for mounting the storage container in the loading / unloading section;
  A storage room that is provided adjacent to the carry-in / carry-out unit and stores the storage container;
  An opening / closing device that opens and closes the substrate inlet / outlet port of the storage container placed on the placement unit; and a holding mechanism that holds a lower surface of the storage container, and the storage chamber passes above the opening / closing device. A transport device for transporting the storage container held by the holding mechanism between the outside and the outside;
  The placement unit is moved up and down between a height position of the placement unit when the opening / closing device opens and closes the storage container and a height position at which the transfer device exchanges the storage container. A method of manufacturing a semiconductor device using a substrate processing apparatus comprising an elevating mechanism,
  Carrying the storage container into the carry-in / out section, and placing the storage container on the placement section;
  The opening and closing device removing the lid from the substrate outlet of the storage container placed on the placement unit; and
  A step of attaching the lid to the substrate loading / unloading port of the storage container placed on the placement unit;
  The lifting mechanism raises the mounting unit between a height position of the mounting unit at the time of attaching and removing the lid and a height position at which the transfer device transfers the storage container; and
  Carrying the storage container held by the holding mechanism into the storage chamber via the upper part of the opening / closing device by the transfer device;
  Processing the substrate in a processing chamber;
  A method for manufacturing a semiconductor device comprising:

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