JP2024093476A - Method for manufacturing light-emitting module - Google Patents

Abstract

To provide a method for manufacturing a light-emitting module having a wire connecting between terminals, and a coating member coating the wire, which facilitates arrangement of the coating member in a desired region of a light-emitting module.SOLUTION: A method for manufacturing a light-emitting module that includes a first substrate having light-emitting elements mounted on an element mounting region and a first terminal arranged outside the element mounting region on its upper surface, and a second substrate including a second terminal arranged outside the substrate mounting region where the first substrate is mounted on its upper surface, includes the steps of: preparing an intermediate body where the first substrate is mounted in the substrate mounting region; connecting the first terminal and the second terminal with a wire; arranging a first frame part inside the first terminal; arranging a second frame part outside the second terminal; arranging a first resin coating a part of the wire on the upper surface of the second substrate positioned between the first frame part and the second frame part; and arranging a second resin on the wire exposed from the first resin.SELECTED DRAWING: Figure 15

Description

This disclosure relates to a method for manufacturing a light-emitting module.

Light-emitting devices and light-emitting modules having light-emitting elements such as light-emitting diodes are known. One example is a light-emitting device having a submount substrate, one or more light-emitting elements mounted on the submount substrate, a bonding wire connecting a circuit pattern on the submount substrate to an electrode of the light-emitting element, and a protective resin arranged around the bonding wire so as to enclose the bonding wire. A manufacturing method for this light-emitting device includes a process of mounting one or more light-emitting elements on the submount substrate, connecting the circuit pattern on the submount substrate to an electrode of the light-emitting element with a bonding wire, dripping uncured protective resin around the bonding wire so as to enclose the bonding wire, and then curing the resin (see Patent Document 1).

JP 2017-212301 A

The present disclosure aims to facilitate the placement of a covering member in a desired area of a light-emitting module in a manufacturing method for the light-emitting module having a wire that connects terminals and a covering member that covers the wire.

A method for manufacturing a light-emitting module according to an embodiment of the present disclosure includes a first substrate having, on its upper surface, an element mounting area, a light-emitting element to be mounted on the element mounting area, and a first terminal disposed outside the element mounting area, and a second substrate having, on its upper surface, a substrate mounting area on which the first substrate is mounted, and a second terminal disposed outside the substrate mounting area, the method including the steps of: preparing an intermediate body in which the first substrate is mounted on the substrate mounting area; connecting the first terminal and the second terminal with a wire; and forming a first substrate on the upper surface of the first substrate. The method includes the steps of: arranging a first frame portion surrounding the element mounting region on the inside of the first terminal; arranging a second frame portion surrounding the first substrate on the upper surface of the second substrate on the outside of the second terminal; and arranging a coating member that covers the wire, and the step of arranging the coating member includes the steps of arranging a first resin that covers a part of the wire on the upper surface of the second substrate located between the first frame portion and the second frame portion, and arranging a second resin on the wire exposed from the first resin.

According to one embodiment of the present disclosure, in a manufacturing method for a light-emitting module having a wire that connects terminals and a covering member that covers the wire, it is possible to easily position the covering member in a desired area of the light-emitting module.

1 is a perspective view showing a schematic diagram of a light-emitting module according to an embodiment of the present invention; 1 is a perspective view showing a schematic diagram of a light-emitting module according to an embodiment of the present invention with a portion of its configuration omitted. 1 is a plan view showing a schematic diagram of a light-emitting module according to an embodiment of the present invention; 4 is a cross-sectional view taken along line IV-IV in FIG. 2 is a cross-sectional view taken along line VV in FIG. 1. 1A to 1C are plan views each showing a schematic example of a manufacturing process of a manufacturing method for a light-emitting module according to an embodiment of the present invention. 1A to 1C are plan views each showing a schematic example of a manufacturing process of a manufacturing method for a light-emitting module according to an embodiment of the present invention. 5A to 5C are cross-sectional views illustrating an example of a manufacturing process of a method for manufacturing a light-emitting module according to the present embodiment. 1A to 1C are plan views each showing a schematic example of a manufacturing process of a manufacturing method for a light-emitting module according to an embodiment of the present invention. 1A to 1C are plan views each showing a schematic example of a manufacturing process of a manufacturing method for a light-emitting module according to an embodiment of the present invention. 1A to 1C are plan views each showing a schematic example of a manufacturing process of a manufacturing method for a light-emitting module according to an embodiment of the present invention. 5A to 5C are cross-sectional views illustrating an example of a manufacturing process of a method for manufacturing a light-emitting module according to the present embodiment. 1A to 1C are plan views each showing a schematic example of a manufacturing process of a manufacturing method for a light-emitting module according to an embodiment of the present invention. 1A to 1C are plan views each showing a schematic example of a manufacturing process of a manufacturing method for a light-emitting module according to an embodiment of the present invention. 5A to 5C are cross-sectional views illustrating an example of a manufacturing process of a method for manufacturing a light-emitting module according to the present embodiment. 1A to 1C are plan views each showing a schematic example of a manufacturing process of a manufacturing method for a light-emitting module according to an embodiment of the present invention.

Below, a manufacturing method of an embodiment of the present invention and a light-emitting module obtained by the manufacturing method (hereinafter, sometimes referred to as the "light-emitting module according to the embodiment") will be described with reference to the drawings. In the following description, terms indicating specific directions or positions (for example, "upper", "lower", and other terms including these terms) will be used as necessary. However, the use of these terms is for the purpose of making it easier to understand the invention with reference to the drawings, and the technical scope of the present invention is not limited by the meaning of these terms. In addition, parts that appear with the same reference numerals in multiple drawings indicate the same or equivalent parts or members.

The embodiments shown below are illustrative of light-emitting modules and the like for embodying the technical ideas of the present invention, and are not intended to limit the present invention to the following. Furthermore, unless otherwise specified, the dimensions, materials, shapes, relative positions, etc. of the components described below are intended to be illustrative and not to limit the scope of the present invention. Furthermore, the content described in one embodiment can be applied to other embodiments and modified examples. Furthermore, the size and positional relationship of the components shown in the drawings may be exaggerated to clarify the explanation. Furthermore, in order to avoid the drawings becoming overly complicated, schematic diagrams that omit the illustration of some elements, or end views that show only the cut surface as a cross-sectional view may be used.

<Light-emitting module according to the embodiment>
Fig. 1 is a perspective view showing a light emitting module according to the present embodiment. Fig. 2 is a perspective view showing a light emitting module according to the present embodiment with a portion of the configuration omitted. Fig. 3 is a plan view showing a light emitting module according to the present embodiment. Fig. 4 is a cross-sectional view taken along line IV-IV in Fig. 1. Fig. 5 is a cross-sectional view taken along line V-V in Fig. 1.

As shown in Figures 1 to 5, the light-emitting module 1 according to this embodiment has a first substrate 10, a second substrate 20, a light-emitting element 30, a wire 40, a first frame portion 50, a second frame portion 60, and a covering member 70.

The light-emitting module 1 may include a translucent member 80 that covers the upper surfaces of the multiple light-emitting elements 30. The light-emitting module 1 may also include a reflective member 90 that exposes the upper surfaces of the multiple light-emitting elements 30 and covers the side surfaces in the element mounting area 10r of the upper surface 10a of the first substrate 10. Hereinafter, a case in which the light-emitting module 1 includes a translucent member 80 and a reflective member 90 will be described.

In FIG. 2, for convenience of illustration, parts of the covering member 70, the first frame portion 50, the second frame portion 60, and the translucent member 80 are omitted, and parts of the wire 40 and the light-emitting element 30 are visualized. In FIG. 3, for convenience of illustration, the covering member 70 is omitted, and parts of the wire 40, the first frame portion 50, the second frame portion 60, and the like are visualized.

The first substrate 10 has an element mounting region 10r and a first terminal 11 arranged outside the element mounting region 10r on the upper surface 10a. A light-emitting element 30 is arranged in the element mounting region 10r of the first substrate 10. The second substrate 20 has a substrate mounting region 20r on which the first substrate 10 is mounted, and a second terminal 22 arranged outside the substrate mounting region 20r on the upper surface 20a.

The first substrate 10 is placed on the substrate placement area 20r of the second substrate 20. A first frame portion 50 surrounding the element placement area 10r is disposed inside the first terminal 11 on the upper surface 10a of the first substrate 10. A second frame portion 60 surrounding the first substrate 10 is disposed outside the second terminal 22 on the upper surface 20a of the second substrate 20.

The first terminal 11 of the first substrate 10 is electrically connected to the second terminal 22 of the second substrate 20 by the wire 40. The first terminal 11, the second terminal 22, and the wire 40 are located between the first frame portion 50 and the second frame portion 60 in a plan view. The first terminal 11, the second terminal 22, and the wire 40 are covered by a covering member 70.

The components of the light-emitting module 1 are described below.

(First Substrate 10)
The first substrate 10 includes a flat support member and wiring arranged on the upper surface of the support member. The first substrate 10 has an element mounting region 10r on an upper surface 10a for mounting a plurality of light emitting elements 30, and wiring is arranged in the element mounting region 10r. The first substrate 10 has a plurality of first terminals 11 arranged on the upper surface 10a outside the element mounting region 10r, and the first terminals 11 are electrically connected to the wiring arranged in the element mounting region 10r.

In a plan view, the first substrate 10 and the element mounting region 10r can be, for example, a rectangular region having long and short sides. In the element mounting region 10r, for example, a plurality of light-emitting elements 30 are mounted in a matrix. The plurality of light-emitting elements 30 are electrically connected to one of the first terminals 11. The plurality of light-emitting elements 30 can be, for example, connected in series or in parallel to the first terminals 11 in groups of a predetermined number. For example, the element mounting region 10r can have a long side length of 8 mm or more and 18 mm or less and a short side length of 2 mm or more and 6 mm or less.

Each of the first terminals 11 is, for example, substantially circular, elliptical, or rectangular. The first terminals 11 are spaced apart from one another on the upper surface 10a of the first substrate 10 and arranged in a row along opposing long sides of the rectangular element mounting region 10r, sandwiching the element mounting region 10r. The spacing between adjacent first terminals 11 may or may not be constant. The spacing between adjacent first terminals 11 may be, for example, 20 μm or more and 100 μm or less. One end of a wire 40 is connected to the first terminal 11.

The first substrate 10 is, for example, a semiconductor substrate such as silicon. On the upper surface 10a of the first substrate 10, the area where no wiring is arranged is covered, for example, with an insulating film. The wiring may also be arranged inside or on the lower surface of the support member. For example, the first substrate 10 can be an integrated circuit substrate on which circuits for driving and controlling multiple light-emitting elements 30 are integrated.

Examples of the first terminal 11 and wiring include metals such as Cu, Ag, Au, Al, Pt, Ti, W, Pd, Fe, and Ni, and/or alloys containing at least these metals.

(Second Substrate)
The second substrate 20 includes a flat substrate and wiring arranged at least on the upper surface of the substrate. The second substrate 20 has a substrate mounting area 20r on the upper surface 20a for mounting the first substrate 10, and further includes a second terminal 22 on the upper surface outside the substrate mounting area 20r. The substrate mounting area 20r is an area on which the first substrate 10 is mounted. The substrate mounting area 20r is set as an area having an area substantially equal to the shape of the first substrate 10 in a plan view. If the first substrate 10 is rectangular in a plan view, the substrate mounting area 20r can also be rectangular. Here, substantially equal includes an error caused by a material tolerance or a mounting tolerance as an allowable range.

Each second terminal 22 is, for example, substantially circular, elliptical, or rectangular. The second terminals 22 are spaced apart from one another on the upper surface 20a of the second substrate 20 and arranged in a row along opposing long sides of the rectangle, sandwiching the substrate mounting area 20r. The interval between adjacent second terminals 22 may or may not be constant. The interval between adjacent second terminals 22 may be, for example, 20 μm or more and 100 μm or less. The other end of the wire 40 is connected to the second terminal 22.

The base material constituting the second substrate 20 is preferably a material with high heat dissipation properties, and more preferably a material with high light blocking properties and base material strength. Specific examples include metals such as Al and Cu, ceramics such as aluminum oxide, aluminum nitride, silicon nitride, and mullite, resins such as phenolic resin, epoxy resin, polyimide resin, BT resin (bismaleimide triazine resin), and polyphthalamide (PPA), as well as composite materials composed of resin and metal or ceramics (for example, an inlay substrate in which a metal member is embedded in a resin). The base material may be a flat plate, or a base material with a recess on the upper surface. In this case, the bottom of the recess of the second substrate 20 is used as the substrate mounting area 20r, and the first substrate 10 can be mounted in the recess.

The second substrate 20 may have wiring on the surface of the substrate mounting area 20r for mounting the first substrate 10.

(Wire)
As the wire 40, metals such as Au, Ag, Cu, Pt, Al, etc. and/or alloys containing at least these metals can be used. In particular, it is preferable to use Au, which has excellent thermal resistance, etc. The diameter of the wire 40 can be, for example, 15 μm or more and 50 μm or less. The wire 40 can be arranged across the long side of the first substrate 10, which is substantially rectangular in plan view, for example, so as to be substantially perpendicular to the long side. In addition, among the multiple wires 40 arranged in a row along the long side of the first substrate 10, the wire 40 located at the center of the row can be arranged so as to be substantially perpendicular to the long side of the first substrate 10 in plan view as described above, and the wire 40 located at the end of the row can be arranged diagonally with respect to the long side of the first substrate 10 in plan view. The interval at which the wires 40 are aligned can be 20 μm or more and 100 μm or less.

(Light Emitting Element)
The light emitting element 30 is, for example, substantially rectangular in plan view. The light emitting element 30 can be, for example, square in plan view with one side of 40 μm to 100 μm. The light emitting element 30 includes a semiconductor laminate and positive and negative electrodes disposed on the surface of the semiconductor laminate. The light emitting element 30 includes positive and negative electrodes on the same side, and is flip-chip mounted on the first substrate 10 with the surface including the electrodes as the lower surface. In this case, the upper surface located opposite to the surface on which the electrodes are disposed is the main light extraction surface of the light emitting element 30. In the light emitting module 1, the light emitting elements 30 are aligned and mounted on the first substrate 10 with a predetermined interval in each row and column direction. The size and number of the light emitting elements 30 used can be appropriately selected depending on the form of the light emitting module to be obtained. In particular, it is preferable to mount more small light emitting elements 30 at a higher density. This makes it possible to control the irradiation range of the light emitted from the light emitting module 1 with a larger number of divisions. Such a light emitting module 1 can be used as a light source for a high-resolution lighting system. For example, the number of light-emitting elements 30 included in the light-emitting module 1 can be set to 1,000 or more and 20,000 or less.

The light-emitting element 30 can be selected from those with any wavelength. For example, a light _- emitting element 30 that emits blue light or green light can be selected from those using a nitride semiconductor ( _{InXAlYGa1 -X-YN} , 0≦X, 0≦Y, X+Y≦1). A light-emitting element 30 that emits red light can be a semiconductor represented by GaAlAs or AlInGaP. Furthermore, a semiconductor light-emitting element made of a material other than these can also be used. The composition and emitted color of the light-emitting element 30 used can be appropriately selected depending on the purpose.

The light emitting element 30 is bonded to the wiring arranged in the element mounting region 10r of the first substrate 10 by a conductive bonding member. When flip-chip mounting the light emitting element 30 on the first substrate 10, bumps made of metal materials such as Au, Ag, Cu, and Al can be used as the bonding member. In addition, solder such as AuSn alloy and Sn-based lead-free solder can be used as the bonding member. In addition, a conductive adhesive material containing conductive particles such as metal in resin can be used as the bonding member. A plating method may be used to bond the light emitting element 30 to the first substrate 10. For example, Cu can be used as a plating material. In addition, the electrode of the light emitting element 30 and the wiring of the first substrate 10 may be directly connected to each other without a bonding member.

(Covering member)
The covering member 70 is a light-shielding member that covers the wires 40 outside the element mounting region 10r. As an example, the covering member 70 is arranged in a frame shape in a plan view so as to cover the wires 40 and surround the element mounting region 10r. The covering member 70 is arranged so as to be in contact with a first frame portion 50 and a second frame portion 60, which will be described later.

The covering member 70 is disposed at a distance from the light emitting element 30 in a plan view. The distance between the light emitting element 30 and the covering member 70 can be 100 μm or more and 500 μm or less. In addition, in a plan view, the width of the covering member 70 located on the long side of the first substrate 10 is wider than the width of the covering member 70 located on the short side of the first substrate 10. It is preferable that the height of the covering member 70 (i.e., the distance from the upper surface 20a of the second substrate 20 to the upper surface of the covering member 70) is disposed so that it is highest directly above the top 40t of the wire 40. In other words, it is preferable that the covering member 70 is disposed so that the top 70t of the covering member 70 overlaps the top 40t of the wire 40. It is also preferable that the position of the top 70t of the covering member 70 is disposed so that it is located above the top of the first frame portion 50. In this specification, the width of the covering member 70 located on the long side and short side of the first substrate 10 refers to the width in a direction perpendicular to the long side and short side of the first substrate 10 in a plan view. Also, the height of the covering member 70 refers to the distance from the top surface of the second substrate 20 to the top surface of the covering member 70.

The covering member 70 may be, for example, a resin containing a filler having light-shielding properties. For example, silicone resin, modified silicone resin, epoxy resin, modified epoxy resin, acrylic resin, etc. may be used as the base resin. For the filler having light-shielding properties, light-absorbing substances such as pigments, carbon black, titanium black, graphite, etc., and light-reflecting substances such as titanium oxide, aluminum oxide, zinc oxide, barium carbonate, barium sulfate, boron nitride, aluminum nitride, glass filler, etc. may be preferably used. Specifically, the exterior color of the covering member 70 may be white with excellent light reflectivity, black with excellent light absorption, or gray with light reflectivity and light absorption properties. The covering member 70 may also be formed by laminating multiple resin layers. In particular, in consideration of deterioration of the resin due to light absorption, it is preferable that the covering member 70 use a white resin having light reflectivity at least on the outermost surface.

(First frame portion, second frame portion)
The light-emitting module 1 has a first frame portion 50 that is disposed along the outer periphery of the element mounting region 10r on the upper surface 10a of the first substrate 10 between the element mounting region 10r and the first terminal 11 and that contacts the covering member 70. Furthermore, the light-emitting module 1 has a second frame portion 60 that is disposed on the outer side of the second terminal 22 on the upper surface 20a of the second substrate 20 and that contacts the covering member 70. In other words, the covering member 70 is disposed between the first frame portion 50 and the second frame portion 60, spanning from the upper surface 10a of the first substrate 10 to the upper surface 20a of the second substrate 20.

The covering member 70 is disposed between a first frame portion 50 arranged to surround the element mounting area 10r on the first substrate 10, and a second frame portion 60 arranged to surround the substrate mounting area 20r on the second substrate 20.

In the light-emitting module 1, the first frame portion 50 is disposed on the first substrate 10 so that the top is located above the light-emitting element 30 and the light-transmitting member 80. The height of the first frame portion 50 from the top surface 10a of the first substrate 10 may be the same as or different from the height of the second frame portion 60 from the top surface 20a of the second substrate 20. If they are different, it is preferable to make the second frame portion 60 higher than the first frame portion 50. In this case, the difference between the height from the top surface 20a of the second substrate 20 to the top of the first frame portion 50 and the height from the top surface 20a of the second substrate 20 to the top of the second frame portion 60 can be smaller than the thickness of the first substrate 10 (i.e., the distance from the top surface 10a to the bottom surface of the first substrate 10).

The resin used for the first frame portion 50 and the second frame portion 60 may be any of the resins exemplified as the base material for the covering member 70 described above. The resin for the first frame portion 50 and the second frame portion 60 may preferably have a higher viscosity than the resin for the covering member 70. The viscosity of the resin can be adjusted, for example, by the amount of viscosity adjusting filler contained in the resin. This allows the first frame portion 50 and the second frame portion 60 to be used as a support member for supporting the covering member 70.

The first frame portion 50 is preferably translucent to the light emitted from the light-emitting element 30 and the translucent member 80. The first frame portion 50 is arranged on the first substrate 10 along the outer periphery of the element mounting region 10r in a substantially rectangular frame shape in a plan view. At a position along the longitudinal direction of the element mounting region 10r, the first frame portion 50 is arranged between the longitudinal side of the element mounting region 10r and the multiple first terminals 11. Also, at a position along the lateral direction of the element mounting region 10r, the first frame portion 50 is arranged on the first substrate 10 between the element mounting region 10r and the outer edge of the first substrate 10.

The first frame 50 preferably has an inclined surface that inclines from the first substrate 10 side toward the top of the first frame 50. The inclined surface is preferably a curved surface that is convex outward, and specifically, the first frame 50 preferably has a portion that has a cross-sectional shape that is arc-shaped or elliptical. This allows the surface of the covering member 70 that contacts the first frame 50 to be a curved surface that is concave toward the first frame 50. By having the covering member 70 have such a surface shape, the light that is emitted from the translucent member 80, passes through the first frame 50, and heads toward the covering member 70 can be reflected toward the first substrate 10. This reduces the reflected light from becoming stray light and heading upward (to the light extraction side), and therefore a light-emitting module with reduced unintended light scattering can be obtained.

The second frame portion 60 is disposed below the light-emitting element 30 and the translucent member 80 in the light-emitting module 1, with the upper surface 20a of the second substrate 20 as a reference. Therefore, the second frame portion 60 may or may not be translucent to the light emitted from the light-emitting element 30.

Even if the first substrate 10 is rectangular in plan view and the wires 40 are arranged only on the long sides of the rectangle, it is preferable that the tops 70t of the covering member 70 provided on the short sides of the first substrate 10 are at approximately the same height as the tops 70t of the covering member 70 provided on the long sides of the first substrate 10. Since the first frame 50 of the light-emitting module 1 is translucent, the light emitted from the translucent member 80 can pass through the first frame 50. Furthermore, the light-emitting module 1 can reflect the light that has passed through the first frame 50 toward the first substrate 10 at the interface with the covering member 70, thereby reducing unintended scattering of light.

(Light-transmitting member)
The light-transmitting member 80 covers the upper surfaces of the multiple light-emitting elements 30. The light-transmitting member 80 collectively covers the upper surfaces of the multiple light-emitting elements 30 and the upper surface of the reflective member 90. The upper surface of the light-transmitting member 80 constitutes the light-emitting surface of the light-emitting module 1. The light-transmitting member 80 is substantially rectangular in a plan view, and is disposed so as to enclose the multiple light-emitting elements 30 in a plan view.

The light-transmitting member 80 may be a wavelength conversion member. In this case, the light-transmitting member 80 can convert the wavelength of at least a part of the light emitted from the light-emitting element 30 and extract it to the outside. Examples of the wavelength conversion member include a sintered body of a phosphor, a base material such as resin, glass, or other inorganic material containing phosphor powder. As the base material, a light-transmitting material such as epoxy resin, silicone resin, a resin mixture of these, or glass can be used. The thickness of the light-transmitting member 80 can be, for example, about 20 μm or more and 100 μm or less. The light-transmitting member 80 is formed to a size that covers all of the upper surfaces of the multiple light-emitting elements 30. The light-transmitting member 80 may be provided so as to extend to a position where it abuts against the first frame portion 50. In this case, it is preferable that the outer edge of the light-transmitting member 80 is located between the first frame portion 50 and the first substrate 10, or between the covering member 70 and the first substrate 10. This improves the adhesion between the light-transmissive member 80 and the first substrate 10.

The phosphors include yttrium aluminum garnet phosphors (e.g., (Y,Gd) ₃ (Al,Ga) _5O12 :Ce), lutetium aluminum garnet phosphors (e.g., _Lu3 ( _Al ,Ga) _{5O12 :} Ce), terbium aluminum garnet phosphors (e.g., _Tb3 (Al,Ga) _5O12 :Ce), CCA phosphors (e.g., _Ca10 ( _PO4 ) _6Cl2 :Eu ₎ , SAE phosphors (e.g., _{Sr4Al14O25 :} Eu ₎ , _{chlorosilicate} phosphors (e.g., _{Ca8MgSi4O16Cl2 :} Eu ₎ , silicate phosphors (e.g., (Ba _, Sr,Ca, _Mg ) _2SiO4 oxynitride phosphors such as β-sialon phosphors (e.g., (Si,Al) ₃ (O,N) ₄ :Eu) or α-sialon phosphors (e.g., Ca ₍ Si,Al) ₁₂ ( _O ,N) ₁₆ :Eu); _nitride phosphors such as LSN phosphors (e.g., (La,Y) _3Si6N11 :Ce), BSESN phosphors (e.g., ( _{Ba,Sr)2Si5N8 : Eu} ), SLA phosphors (e.g., _SrLiAl3N4 :Eu), CASN phosphors (e.g., _CaAlSiN3 :Eu) or SCASN phosphors (e.g., ( _Sr ,Ca) _AlSiN3 :Eu) _; Fluoride-based phosphors such as KSAF-based phosphors (e.g., _K2 ( _{Si1-xAlx )} F6 _-x :Mn, where x satisfies 0<x<1) or MGF-based phosphors (e.g., _{3.5MgO.0.5MgF2.GeO2} :Mn), quantum dots having a perovskite structure (e.g., (Cs,FA,MA)(Pb,Sn)(F,Cl,Br,I) ₃ , where FA and MA represent formamidinium and _{methylammonium} , respectively), II-VI quantum dots (e.g., CdSe), III-V quantum dots (e.g., InP), or quantum dots having a chalcopyrite structure (e.g., (Ag,Cu)(In,Ga)(S,Se) ₂ ), etc., can be used.

(Reflective Member)
The reflective member 90 is a member that covers the upper surface 10a of the first substrate 10 and the side surface of the light-emitting element 30. The upper surface of the light-emitting element 30 is exposed from the reflective member 90. The reflective member 90 may cover the area between the lower surface of the light-emitting element 30 and the first substrate 10. The reflective member 90 can reflect light emitted from the side surface of the light-emitting element 30 and emit it from the upper surface of the translucent member 80, which is the light-emitting surface of the light-emitting module 1. This can increase the light extraction efficiency of the light-emitting module 1. In addition, when the light-emitting element 30 is individually turned on, the boundary between the light-emitting area and the non-light-emitting area can be made clear. This improves the contrast ratio between the light-emitting area and the non-light-emitting area.

The reflective member 90 is preferably made of a soft resin with relatively low elasticity and excellent shape-following ability. The reflective member 90 is preferably made of a resin material with good transparency and insulation, such as a thermosetting resin such as an epoxy resin or a silicone resin. The reflective member 90 is preferably made of a white resin containing particles of a light-reflecting material in a base resin. Examples of the light-reflecting material include light-reflecting materials similar to the light-reflecting materials contained in the covering member described above. The reflective member 90 may contain light-absorbing materials such as carbon black, titanium black, and graphite.

The light-emitting module 1 having the above configuration can be used, for example, as a light source for a vehicle headlight. In this case, for example, a configuration is adopted in which light is emitted from the light source to the outside via a lens. The light-emitting module 1 turns on the light-emitting elements 30 by an external power switch. Note that the light-emitting module 1 is configured so that some or all of the preset light-emitting elements 30 can be driven individually.

In the light-emitting module 1, the covering member 70 has light-shielding properties and is disposed in contact with the first frame portion 50, so that the light transmitted through the first frame portion 50 can be absorbed or reflected to the substrate side by the covering member 70. This allows the light-emitting module 1 to have reduced unintended light scattering. Since the light-emitting module 1 reduces stray light, the performance of the optical device can be improved when used in combination with an optical system such as a lens. Furthermore, since the covering member 70 contains a light-reflecting substance and/or a light-absorbing substance as a filler for providing light-shielding properties, the amount of resin in the covering member 70 can be reduced compared to when a translucent resin that does not contain these fillers is used. This allows the load on the wire 40 due to thermal expansion of the resin to be reduced. This improves the connectivity of the wire 40, allowing the light-emitting module to have excellent reliability.

<Method of manufacturing the light emitting module according to the embodiment>
The method for manufacturing a light-emitting module according to the embodiment includes a first substrate having an element mounting area, a light-emitting element mounted in the element mounting area, and a first terminal disposed outside the element mounting area on its upper surface, and a second substrate having a substrate mounting area on which the first substrate is mounted, and a second terminal disposed outside the substrate mounting area on its upper surface, and includes the steps of: preparing an intermediate body in which the first substrate is mounted on the substrate mounting area; connecting the first terminal and the second terminal with a wire; arranging a first frame portion surrounding the element mounting area on the upper surface of the first substrate inside the first terminal; arranging a second frame portion surrounding the first substrate outside the second terminal on the upper surface of the second substrate; and arranging a covering member covering the wire. The covering member arranging step includes the steps of arranging a first resin covering a part of the wire on the upper surface of the second substrate located between the first frame portion and the second frame portion, and arranging a second resin on the wire exposed from the first resin.

Furthermore, the manufacturing method of the light-emitting module according to the embodiment may include a step of placing a translucent member that covers the light-emitting element and exposes the first terminal on the upper surface of the first substrate before the step of placing the first frame portion.

Below, each manufacturing step of the method for manufacturing a light-emitting module according to the embodiment will be explained with reference to the drawings.

Figures 6 to 16 are diagrams that show an example of the manufacturing process of the manufacturing method of the light-emitting module according to this embodiment. Specifically, Figures 6, 7, 9 to 11, 13, 14, and 16 are plan views illustrating the manufacturing process of the light-emitting module. Also, Figures 8, 12, and 15 are cross-sectional views illustrating the manufacturing process of the light-emitting module. Note that in the explanation of the manufacturing method, "preparing" the components does not only mean manufacturing the components, but also includes acquiring the components, such as purchasing the components or receiving the components.

(Step of Preparing an Intermediate)
6, an intermediate body 200 is prepared. In preparing the intermediate body 200, a first substrate 10 is prepared, which has an element mounting region 10r and a first terminal 11 disposed outside the element mounting region 10r on an upper surface 10a. The first substrate 10 can be prepared, for example, by preparing a flat support member made of silicon or the like, and forming wiring and the first terminal 11 by plating, sputtering, vapor deposition, or the like.

Next, the light-emitting element 30 is placed on the element mounting area 10r of the first substrate 10. The light-emitting element 30 can be mounted on the element mounting area 10r on the upper surface 10a of the first substrate 10 by flip-chip mounting. The light-emitting element 30 can be prepared by going through some or all of multiple steps, such as a step of forming a semiconductor laminate and a step of forming an element electrode.

Next, a second substrate 20 is prepared, which has a substrate placement area 20r on which the first substrate 10 is placed, and a second terminal 22 arranged outside the substrate placement area 20r on its upper surface 20a. The second substrate 20 can be prepared, for example, by forming wiring such as Cu and the second terminal 22 on a flat support member made of metal, ceramics, or the like by plating, sputtering, vapor deposition, or the like. Next, the first substrate 10 on which the light-emitting element 30 is placed is placed on the substrate placement area 20r of the second substrate 20, to produce an intermediate body 200. The first substrate 10 and the second substrate 20 can be bonded via a bonding material such as a sintered body containing Ag.

The process of preparing the intermediate body may include a process of placing the light-emitting element 30 on the element mounting region 10r of the first substrate 10, and then covering the side of the light-emitting element 30 with a reflective member 90. For example, after placing the light-emitting element 30 on the first substrate 10, a mask is placed to cover the first terminal 11 and expose the element mounting region 10r. Then, a reflective member 90 such as an uncured white resin is placed in an area separated from the light-emitting element 30, and the white resin is caused to flow and placed between the opposing side surfaces of adjacent light-emitting elements 30 and cured. After placing the reflective member 90, the mask is removed to expose the first terminal 11 from the reflective member 90. The reflective member 90 may further be placed between the lower surface of the light-emitting element 30 and the first substrate 10.

(Wire connection process)
Next, as shown in FIG. 7, the first terminal 11 of the first substrate 10 and the second terminal 22 of the second substrate 20 are connected by the wire 40. For example, the wire 40 is first connected to the first terminal 11 of the first substrate 10, and then connected to the second terminal 22 of the second substrate 20. By connecting the wire 40 in such an order, the top of the wire 40 can be disposed closer to the first terminal 11. This allows the wire 40 to be disposed along the step between the first substrate 10 and the second substrate 20. Therefore, in the process of disposing the covering member 70 described later, the amount of resin disposed below the wire 40 is suppressed, and the risk of the wire 40 being broken due to the thermal expansion of the covering member 70 can be reduced.

(Step of disposing light-transmitting member)
Next, as shown in FIG. 8, a light-transmitting member 80 that covers the light-emitting element 30 and exposes the first terminal 11 is disposed on the upper surface 10a of the first substrate 10. For example, a member processed into a sheet shape of a predetermined size is prepared as the light-transmitting member 80 and disposed on the light-emitting element 30. The light-transmitting member 80 may be fixed on the light-emitting element 30 via a light-transmitting bonding member such as a resin, or may be fixed by utilizing the tackiness of the light-transmitting member 80 without a bonding member. The light-transmitting member 80 may be disposed on the light-emitting element 30 after being processed into a sheet or plate shape, or may be applied on the light-emitting element 30 by spraying or the like. Alternatively, the light-transmitting member 80 may be formed by injection molding using a mold or the like, a transfer molding method, compression molding, or the like.

It is preferable that the light-transmitting member 80 has a size that can contain the element mounting region 10r in a plan view. This allows the outer periphery of the light-transmitting member 80 to be fixed to the upper surface 10a of the first substrate 10. In this way, by covering much of the upper surface 10a of the first substrate 10 with the light-transmitting member 80, the surface of the first substrate 10 can be protected. Note that the process of placing the light-transmitting member 80 may be performed as necessary before the process of placing the first frame portion 50.

(Step of placing the first frame portion)
9, a first frame portion 50 surrounding the element mounting region 10r is disposed inside the first terminal 11 on the upper surface 10a of the first substrate 10. The first frame portion 50 can be disposed along the element mounting region 10r between the element mounting region 10r and the first terminal 11. For example, the first frame portion 50 can be disposed by dispensing uncured resin that forms the first frame portion 50 from a nozzle of a dispenser and moving the nozzle along the element mounting region 10r.

The first frame 50 can be formed to a predetermined height by providing a plurality of overlapping uncured resins in the height direction. For example, the first frame 50 is formed by supplying resin adjusted to a predetermined viscosity from a nozzle onto the first substrate 10 while moving the nozzle once around the element mounting region 10r to arrange one layer. By repeating this operation, the predetermined height can be achieved. The height of one layer of resin can be, for example, about 150 μm. The first frame 50 can be formed, for example, by moving the nozzle twice around (i.e., stacking two layers of resin). It is preferable that the height of the highest position of the first frame 50 is approximately the same as the height of the highest position of the wire 40, based on the upper surface 10a of the first substrate 10. This allows the height of the covering member 70 covering the wire 40 to be lowered in the region of the covering member 70 that is in contact with the first frame 50 and closer to the light emitting element 30, and thus reduces the occurrence of stray light due to the light from the light emitting element 30 being reflected by the covering member 70.

If the manufacturing process of the light-emitting module 1 includes a step of placing the light-transmissive member 80, it is preferable that the first frame portion 50 is arranged so as to cover the outer periphery of the upper surface of the light-transmissive member 80. This improves adhesion between the light-transmissive member 80 and the first substrate. If the manufacturing process of the light-emitting module 1 does not include a step of placing the light-transmissive member 80, the first frame portion 50 can be arranged so as to cover the outer periphery of the upper surface 10a of the first substrate 10.

(Step of placing the second frame portion)
10 , a second frame portion 60 surrounding the first substrate 10 is disposed outside the second terminals 22 on the upper surface 20a of the second substrate 20. For example, the second frame portion 60 can be disposed by moving the nozzle along the outside of the second terminals 22 while supplying uncured resin that forms the second frame portion 60 from the nozzle of a dispenser.

The second frame 60 can be formed to a predetermined height by providing a plurality of overlapping layers of uncured resin in the height direction, similar to the first frame 50. The height of one layer of resin can be, for example, about 150 μm. The second frame 60 can be formed, for example, by moving the nozzle three times (stacking three layers of resin). Using the upper surface 20a of the second substrate 20 as a reference, it is preferable that the height of the highest position of the second frame 60 is equal to or less than the height of the upper surface 10a of the first substrate 10. In order to make the second frame 60 taller, it is necessary to stack resin on the second substrate 20, but the more layers are stacked, the more likely the stacked resin layers are to collapse. In order to stably stack resin in multiple layers, it is necessary to increase the width of the second frame 60. If the width of the second frame 60 is increased, the area of the upper surface 20a of the second substrate 20 must be increased, which leads to an increase in the size of the light-emitting module 1. By making the height of the highest point of the second frame portion 60 equal to or less than the height of the upper surface 10a of the first substrate 10, the risk of the width of the second frame portion 60 becoming larger than necessary and the size of the light-emitting module 1 being increased can be reduced.

In plan view, the second frame portion 60 can be arranged to include a portion that is parallel to each side of the outer edge of the first substrate 10. In plan view, the second frame portion 60 may be arranged to include a portion that is inclined with respect to each side of the first substrate 10 near the corners of the first substrate 10. The second frame portion 60 may be arranged using a material different from that of the first frame portion 50, or may be arranged using the same material as that of the first frame portion 50. When using the same material, the second frame portion 60 and the first frame portion 50 can be arranged in the same process. Note that the process of arranging the first frame portion 50 and the process of arranging the second frame portion 60 may be performed in either order, or may be performed approximately simultaneously.

(Step of placing covering member)
11 to 16, a covering member 70 that covers the wire 40 is placed. The covering member 70 can be placed by supplying uncured resin that constitutes the covering member 70 into a frame surrounded by the first frame portion 50 and the second frame portion 60. At this time, the first frame portion 50 and the second frame portion 60 can be used as a dam that blocks the flow of the uncured resin that supports the covering member 70.

First, as shown in FIG. 11, a first resin 70a that covers a part of the wire 40 is placed on the upper surface 20a of the second substrate 20 located between the first frame 50 and the second frame 60. Specifically, for example, as shown in the upper and middle parts of FIG. 12, the first resin 70a is supplied to the upper surface 20a of the second substrate 20 located between the second terminal 22 and the second frame 60. For example, the first resin 70a can be placed by dispensing uncured resin that forms the first resin 70a from the nozzle 300 of a dispenser while moving the nozzle 300 along the second terminal 22.

The placement of the first resin 70a is preferably performed by waiting a predetermined time until the flow of the resin stabilizes after stopping the supply of the resin from the nozzle 300 onto the second substrate 20. This allows the first resin 70a to move below the wire 40 as shown in the lower part of FIG. 12. The waiting time is preferably 10 seconds or more. This allows the first resin 70a to move below the wire 40 while spreading over the second substrate 20. In the lower part of FIG. 12, the first resin 70a preferably covers at least a part of the side surface of the first substrate 10. The first resin 70a may cover the entire height of the side surface of the first substrate 10. This makes the height of the first resin 70a covering the second substrate 20 approximately uniform, making it easier to form the second resin 70b into a predetermined shape in a later process.

As shown in Fig. 13, for example, the upper surface 10a of the first substrate 10 is a rectangle having a first side ₁₀₁ and a third side ₁₀₃ as mutually opposing short sides, and a second side ₁₀₂ and a fourth side ₁₀₄ as mutually opposing long sides. A plurality of wires 40 are arranged along each of the second side ₁₀₂ and the fourth side _104. In this case, as shown by the arrows in Fig. 13, it is preferable that the first resin 70a is supplied, for example, from a position of a point P1 on the second substrate 20 located between the first side ₁₀₁ and the second frame portion 60, sequentially supplied along the first side ₁₀₁ , the second side ₁₀₂ , the third side ₁₀₃ , and the fourth side ₁₀₄ , and then supplied again along the first side ₁₀₁ , and ends at a position of a point P2 on the second substrate 20 located between the first side ₁₀₁ and the second frame portion 60. Immediately after the start of resin supply, the amount of resin coming out of the nozzle is not stable, so the amount of resin supplied to the first side 10 ₁ is small, and the height of the first resin 70a is likely to be low. Therefore, by supplying the first resin 70a along the fourth side 10 ₄ and then again along the first side 10 ₁ , it is possible to make the amount of resin on the first side 10 ₁ approximately the same as the amount of resin on the other sides, and the height of the first resin 70a on all sides can be made approximately uniform. The first resin 70a may be supplied in a direction inclined with respect to each side of the first substrate 10 in the vicinity of the corner of the first substrate 10. Note that, in the region along the first side 10 ₁ , the end point P2 at which the resin supply is terminated may not reach the start point P1 at which the resin supply is started, or may reach it. In particular, it is more preferable that the end point P2 at which the resin supply is terminated overlaps with the start point P1 at which the resin supply is started, or passes the start point P1 at which the resin supply is started.

14 and 15, the second resin 70b is placed to cover the upper surface of the first substrate 10 located between the first frame 50 and the second frame 60 and the wires 40 exposed from the first resin 70a, forming the covering member 70. Specifically, as shown in the upper and middle parts of FIG. 15, for example, the second resin 70b is supplied from above the wires 40, and the second resin 70b is placed on the wires 40 exposed from the first resin 70a. For example, the second resin 70b can be placed by moving the nozzle 300 of the dispenser along the outer edge of each wire 40 while supplying uncured resin that forms the second resin 70b from the nozzle 300. It is preferable that the second resin 70b is the same resin as the first resin 70a. By supplying the second resin 70b from above the wires 40, the entire wires 40 can be covered with the second resin 70b.

The second resin 70b covers at least a portion of the upper surface 10a of the first substrate 10. It is preferable that the second resin 70b covers the entire upper surface 10a of the first substrate 10 located between the first frame portion 50 and the second frame portion 60.

After supplying an amount of the second resin 70b sufficient to cover the entire wire 40, the first resin 70a and the second resin 70b are cured, and as shown in the lower part of FIG. 15, the coating member 70 in which the first resin 70a and the second resin 70b are integrated is arranged to cover the wire 40. In this way, by curing the first resin 70a and the second resin 70b in the same process, no interface is generated between the first resin 70a and the second resin 70b that cover the wire 40, and the mechanical strength of the wire 40 and the coating member 70 can be improved.

Note that a waiting time may or may not be provided between the supply of the second resin 70b and the hardening of the first resin 70a and the second resin 70b. This is because the second resin 70b is supplied on top of the first resin 70a, and therefore stops flowing earlier than the first resin 70a.

As shown in FIG. 16, the second resin 70b is preferably supplied, for example, from a point P3 on the first substrate 10 located between the third side ₁₀₃ and the first frame portion 50, sequentially along the third side ₁₀₃ , the fourth side ₁₀₄ , the first side ₁₀₁ , and the second side ₁₀₂ , and then again along the third side ₁₀₃ , and ends at a point P4 on the first substrate 10 located between the third side ₁₀₃ and the first frame portion 50. Since the amount of resin coming out of the nozzle is not stable immediately after the start of resin supply, the amount of resin supplied to the third side ₁₀₃ is small, and the height of the second resin 70b is likely to be low. Therefore, by supplying the second resin 70b along the second side ₁₀₂ and then again along the third side ₁₀₃ , it is possible to make the amount of resin on the third side ₁₀₃ approximately the same as the amount of resin on the other sides, and the height of the second resin 70b on all sides can be made approximately uniform. In addition, by making the position where the supply of the first resin 70a is started different from the position where the supply of the second resin 70b is started, the sides where the amount of resin is small do not overlap, so that the height of the covering member 70 can be made approximately the same as the height of the areas along the other sides. In the area along the third side ₁₀₃ , the end point P4 where the supply of the resin ends does not need to reach the start point P3 where the supply of the resin starts, or may reach it. In particular, it is more preferable that the end point P4 where the supply of the resin ends overlaps with the start point P3 where the supply of the resin starts, or passes through the start point P3 where the supply of the resin starts.

In this way, in the manufacturing method of the light-emitting module 1, the process of arranging the covering member 70 includes a process of arranging the first resin 70a and a process of arranging the second resin 70b. This makes it easier to arrange the covering member 70 in the desired area of the light-emitting module 1. For example, in the process of arranging the first resin 70a, the first resin 70a can be easily arranged under the wire 40. This reduces the risk of the resin not being filled under the wire 40. In addition, the first resin 70a is supplied to the upper surface 20a of the second substrate 20 located between the second terminal 22 and the second frame portion 60, and the first resin 70a that has been supplied after waiting for a predetermined time is moved over the second substrate 20 to be arranged under the wire 40, thereby further reducing the risk of the unfilled area and/or void being formed under the wire 40. In addition, in the process of placing the first resin 70a, by supplying the first resin 70a to the extent that it covers the side surface of the first substrate 10, the surface of the first resin 70a tends to be flat, and the risk of voids occurring below the wires 40 when the second resin 70b is placed can be reduced.

In the intermediate body 200, there is a height difference between the upper surface 10a of the first substrate 10 and the upper surface 20a of the second substrate 20. Therefore, if the covering member 70 is supplied all at once between the first frame portion 50 and the second frame portion 60, there is a risk that the resin will overflow from the side of the second frame portion 60, which is lower than the first frame portion 50. However, in the manufacturing method of the light-emitting module 1, the process of arranging the covering member 70 includes a process of arranging the first resin 70a and a process of arranging the second resin 70b. In other words, since a large amount of resin is not supplied all at once from above the wire 40, the risk of the resin leaking from the side of the second frame portion 60 can be reduced.

In addition, by making the second frame portion 60 taller, it is possible to make it less likely for the resin to leak from the side of the second frame portion 60. However, in order to make the second frame portion 60 taller, it is necessary to stack the resin in multiple layers on the second substrate 20, which increases the width of the second frame portion 60 accordingly, leading to an increase in the size of the light-emitting module 1 as described above. By dividing the process of placing the covering member 70 into a process of placing the first resin 70a and a process of placing the second resin 70b, the width of the second frame portion 60 can be reduced, and the light-emitting module 1 can be made smaller.

Although the preferred embodiments have been described above in detail, the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the claims.

In addition to the above-described embodiment, the following supplementary notes are further disclosed.
(Appendix 1)
a step of preparing an intermediate body including a first substrate having, on an upper surface thereof, an element mounting region, a light emitting element to be mounted on the element mounting region, and a first terminal disposed outside the element mounting region, and a second substrate having, on an upper surface thereof, a substrate mounting region on which the first substrate is mounted, and a second terminal disposed outside the substrate mounting region, the first substrate being mounted on the substrate mounting region;
connecting the first terminal and the second terminal with a wire;
disposing a first frame portion surrounding the element mounting region on an inner side of the first terminal on an upper surface of the first substrate;
disposing a second frame portion surrounding the first substrate on an upper surface of the second substrate outside the second terminal;
and disposing a covering member covering the wire.
The step of disposing the covering member includes:
placing a first resin on an upper surface of the second substrate located between the first frame portion and the second frame portion to cover a portion of the wire;
and placing a second resin on the wire exposed from the first resin.
(Appendix 2)
The method for manufacturing the light-emitting module described in Appendix 1, wherein the process of arranging the first resin includes a process of supplying the first resin to an upper surface of the second substrate located between the second terminal and the second frame portion, and a process of moving the supplied first resin below the wire.
(Appendix 3)
In the step of disposing the second resin,
The method for manufacturing a light-emitting module described in Appendix 1 or 2, wherein the second resin is supplied from above the wire.
(Appendix 4)
In the step of disposing the first resin,
4. The method for manufacturing a light-emitting module described in any one of claims 1 to 3, wherein the first resin covers at least a portion of a side surface of the first substrate.
(Appendix 5)
In the step of disposing the second resin,
5. The method for manufacturing a light-emitting module described in any one of claims 1 to 4, wherein the second resin covers at least a portion of an upper surface of the first substrate.
(Appendix 6)
The step of disposing the covering member includes:
6. A method for manufacturing a light-emitting module according to claim 1, further comprising the step of curing the first resin and the second resin.
(Appendix 7)
the top surface of the first substrate is a rectangle having a first side and a third side opposed to each other, and a second side and a fourth side opposed to each other;
A plurality of the wires are arranged along each of the second side and the fourth side,
A method for manufacturing a light-emitting module described in any one of Appendix 1 to 6, wherein in the step of placing the first resin, the first resin is supplied sequentially along the first side, the second side, the third side, and the fourth side, and then supplied again along the first side.
(Appendix 8)
A method for manufacturing a light-emitting module as described in Appendix 7, wherein in the step of placing the second resin, the second resin is supplied sequentially along the third side, the fourth side, the first side, and the second side, and then supplied again along the third side.
(Appendix 9)
A method for manufacturing a light-emitting module described in any one of Appendix 1 to 8, wherein the height of the highest point of the first frame portion is equal to or less than the height of the highest point of the covering member, based on the top surface of the second substrate.
(Appendix 10)
A method for manufacturing a light-emitting module described in any one of Appendix 1 to 9, wherein the height of the highest point of the second frame portion is equal to or lower than the height of the top surface of the first substrate, based on the top surface of the second substrate.
(Appendix 11)
Before the step of disposing the first frame portion,
A method for manufacturing a light-emitting module described in any one of appendix 1 to 10, comprising a step of arranging a translucent member on an upper surface of the first substrate, the translucent member covering the light-emitting element and exposing the first terminal.
(Appendix 12)
In the step of disposing the first frame portion,
12. The method for manufacturing a light-emitting module described in claim 11, wherein the first frame portion covers an upper surface of the translucent member.

REFERENCE SIGNS LIST 1 Light emitting module 10 First substrate 10 ₁ First side 10 ₂ Second side 10 ₃ Third side 10 ₄ Fourth side 10a Top surface 10r Element mounting area 11 First terminal 20 Second substrate 20a Top surface 20r Substrate mounting area 22 Second terminal 30 Light emitting element 40 Wire 40t Top portion 50 First frame portion 50
60 Second frame portion 60
70 Covering member 70a First resin 70b Second resin 70t Top portion 80 Light-transmitting member 90 Reflective member 200 Intermediate body 300 Nozzle

Claims (12)

a step of preparing an intermediate body including a first substrate having, on an upper surface thereof, an element mounting region, a light emitting element to be mounted on the element mounting region, and a first terminal disposed outside the element mounting region, and a second substrate having, on an upper surface thereof, a substrate mounting region on which the first substrate is mounted, and a second terminal disposed outside the substrate mounting region, the first substrate being mounted on the substrate mounting region;
connecting the first terminal and the second terminal with a wire;
disposing a first frame portion surrounding the element mounting region on an inner side of the first terminal on an upper surface of the first substrate;
disposing a second frame portion surrounding the first substrate on an upper surface of the second substrate outside the second terminal;
and disposing a covering member covering the wire.
The step of disposing the covering member includes:
placing a first resin on an upper surface of the second substrate located between the first frame portion and the second frame portion to cover a portion of the wire;
and placing a second resin on the wire exposed from the first resin. The method for manufacturing a light-emitting module according to claim 1, wherein the step of placing the first resin includes a step of supplying the first resin to the upper surface of the second substrate located between the second terminal and the second frame portion, and a step of moving the supplied first resin below the wire. In the step of disposing the second resin,
The method for manufacturing a light-emitting module according to claim 1 , wherein the second resin is supplied from above the wires. In the step of disposing the first resin,
The method for manufacturing a light emitting module according to claim 1 , wherein the first resin covers at least a part of a side surface of the first substrate. In the step of disposing the second resin,
The method for manufacturing a light emitting module according to claim 1 , wherein the second resin covers at least a portion of an upper surface of the first substrate. The step of disposing the covering member includes:
The method for manufacturing a light emitting module according to claim 1 , further comprising the step of curing the first resin and the second resin. the top surface of the first substrate is a rectangle having a first side and a third side opposed to each other, and a second side and a fourth side opposed to each other;
A plurality of the wires are arranged along each of the second side and the fourth side,
7. The method for manufacturing a light-emitting module according to claim 1, wherein in the step of arranging the first resin, the first resin is supplied sequentially along the first side, the second side, the third side, and the fourth side, and then supplied again along the first side. The method for manufacturing a light-emitting module according to claim 7, wherein in the step of placing the second resin, the second resin is supplied sequentially along the third side, the fourth side, the first side, and the second side, and is then supplied again along the third side. The method for manufacturing a light-emitting module according to any one of claims 1 to 6, wherein the height of the highest point of the first frame portion is equal to or less than the height of the highest point of the covering member, based on the top surface of the second substrate. The method for manufacturing a light-emitting module according to any one of claims 1 to 6, wherein the height of the highest position of the second frame portion is equal to or lower than the height of the upper surface of the first substrate, based on the upper surface of the second substrate. Before the step of disposing the first frame portion,
The method for manufacturing the light-emitting module according to claim 1 , further comprising the step of: arranging, on an upper surface of the first substrate, a light-transmitting member that covers the light-emitting element and exposes the first terminal. In the step of disposing the first frame portion,
The method for manufacturing a light-emitting module according to claim 11 , wherein the first frame portion covers an upper surface of the light-transmitting member.

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