JP7219407B2 - Method for manufacturing light emitting device - Google Patents

Description

The present disclosure relates to a method for manufacturing a light emitting device.

2. Description of the Related Art In recent years, high-output light-emitting devices configured using light-emitting elements such as LEDs have been used as light sources for vehicle-mounted applications, and methods for manufacturing light-emitting devices having various characteristics have been proposed. For example, in a high-output light-emitting device used as a light source for a vehicle, a light-reflecting resin is used to cover the upper surface of a light-transmitting member, to completely cover a protective element, or to prevent voids in the light-reflecting resin. A method of manufacturing a device has been proposed (eg, Patent Document 1).

JP 2015-188053 A

An object of the present application is to provide a method for manufacturing a light-emitting device that allows a covering member to be precisely arranged in a desired region of the light-emitting device.

The present application includes the following inventions.
a substrate; a plurality of light emitting elements arranged in a first direction on the upper surface of the substrate; preparing a first intermediate body comprising a protective element and a translucent member bonded to the top surface of each of the light emitting elements;
a first wall and a second wall arranged to sandwich the plurality of light emitting elements and extending in the first direction; and a first wall and a second wall arranged between the first wall and the second wall and extending in the second direction. forming a resin wall on the substrate, the resin wall including a third wall and a fourth wall and surrounding the plurality of light emitting elements and the protective element, wherein a first distance between the first wall and the light emitting element is forming a resin wall larger than a second distance between the third wall and the fourth wall and the light emitting element;
A first resin is applied from the third wall toward the fourth wall in a first region between the first wall and the light emitting element where the protective element is arranged, and the light emitting element and the third wall, between the light emitting element and the fourth wall, between the light emitting elements, and between the light emitting element and the substrate to move the first resin from the first region and forming a first recess and a second recess each having an inner surface made of the first resin or the resin wall in a second region between the second wall and the light emitting element;
Forming a coating member that coats the side surface of the translucent member by applying a second resin to the interior of the first recess and the interior of the second recess, and curing the first resin and the second resin. A method of manufacturing a light emitting device comprising:

According to the manufacturing method of the light emitting device of the present application, the covering member can be precisely arranged on the desired region of the light emitting device.

It is a schematic plan view which shows the manufacturing method of the light-emitting device of one Embodiment of this invention. FIG. 1B is a sectional view along line IB-IB of FIG. 1A; It is a schematic plan view which shows the manufacturing method of the light-emitting device of one Embodiment of this invention. 1D is a cross-sectional view of FIG. 1C; FIG. It is a schematic plan view which shows the manufacturing method of the light-emitting device of one Embodiment of this invention. Figure IE is a cross-sectional view of Figure IE; It is a schematic plan view which shows the manufacturing method of the light-emitting device of one Embodiment of this invention. FIG. 1G is a cross-sectional view of FIG. 1G; 1B is a schematic cross-sectional view corresponding to line IIA-IIA in FIG. 1A, showing a method for manufacturing a light-emitting device according to an embodiment of the present invention; FIG. It is a schematic sectional drawing which shows the manufacturing method of the light-emitting device of one Embodiment of this invention. It is a schematic sectional drawing which shows the manufacturing method of the light-emitting device of one Embodiment of this invention. It is a schematic sectional drawing which shows the manufacturing method of the light-emitting device of one Embodiment of this invention. It is a schematic sectional drawing which shows the manufacturing method of the light-emitting device of one Embodiment of this invention. 1 is a schematic perspective view showing a light-emitting element manufactured by a method for manufacturing a light-emitting device according to one embodiment of the present invention; FIG. 1 is a schematic plan view showing a substrate used in a method for manufacturing a light emitting device according to one embodiment of the present invention; FIG.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings as appropriate. However, the embodiments described below are for embodying the technical idea of the present invention, and unless there is a specific description, the present invention is not limited to the following. The sizes and positional relationships of members shown in each drawing may be exaggerated for clarity of explanation. As a cross-sectional view, an end view showing only a cut surface may be used. Also, members using the same names as in other embodiments in each embodiment represent the same or corresponding members. Unless otherwise specified, such members can employ the materials, sizes, and the like mentioned in the other embodiments. In this specification, "top", "bottom", etc. indicate relative positions between constituent elements in the drawings referred to for explanation, and unless otherwise specified, they indicate absolute positions. not intended. Also, the first direction and the second direction may be any directions indicated by double-headed arrows in the drawings. As used herein, the term "distance" means the distance between the surfaces of the target members that are closest to each other.

[Method for manufacturing light-emitting device]
A method for manufacturing a light-emitting device according to an embodiment of the present application includes:
a substrate; a plurality of light emitting elements arranged in a first direction on the upper surface of the substrate; preparing a first intermediate body comprising a protective element and a translucent member bonded to the top surface of each of the light emitting elements;
a first wall and a second wall arranged to sandwich the plurality of light emitting elements and extending in the first direction; and a first wall and a second wall arranged between the first wall and the second wall and extending in the second direction. forming a resin wall on the substrate, the resin wall including a third wall and a fourth wall and surrounding the plurality of light emitting elements and the protective element, wherein a first distance between the first wall and the light emitting element is forming a resin wall larger than a second distance between the third wall and the fourth wall and the light emitting element;
A first resin is applied from the third wall toward the fourth wall in a first region between the first wall and the light emitting element where the protective element is arranged, and the light emitting element and the third wall, between the light emitting element and the fourth wall, between the light emitting elements, and between the light emitting element and the substrate to move the first resin from the first region and forming a first recess and a second recess each having an inner surface made of the first resin or the resin wall in a second region between the second wall and the light emitting element;
Forming a coating member that coats the side surface of the translucent member by applying a second resin to the interior of the first recess and the interior of the second recess, and curing the first resin and the second resin. including.
With such a method for manufacturing a light-emitting device, it is possible to suppress the resin member from spreading over the light extraction surface of the light-emitting device, and to suppress the generation of voids or the like due to movement of the resin member. That is, according to the method for manufacturing the light emitting device of the present embodiment, the resin member can be precisely arranged in the desired region of the light emitting device.

(Preparation of first intermediate 10)
For example, as shown in FIGS. 1A and 1B, the first intermediate 10 includes a substrate 11, a plurality of light emitting elements 12 arranged in a first direction on the upper surface of the substrate 11, and a second direction orthogonal to the first direction. , a protective element 13 arranged on the upper surface of the substrate 11 so as to be separated from and facing the light emitting elements 12, and a translucent member 14 bonded to the upper surface of each of the light emitting elements 12. As shown in FIG.

(substrate 11)
The substrate 11 is a member that supports the light emitting element 12 and the like. For example, as shown in FIG. 4, the substrate 11 has two or more wirings 11a electrically connected to the electrodes of the light emitting elements 12 on at least its surface.
The planar shape of the substrate 11 may be circular, elliptical, polygonal such as quadrangular and hexagonal, and polygonal with rounded corners. Among them, a rectangular shape is preferable. The size of the substrate 11 can be appropriately adjusted depending on the required performance such as the size and number of the light emitting elements 12 arranged thereon.
The planar shape of the wiring 11a can be appropriately set according to the size, number, etc. of the light emitting elements arranged there. For example, as shown in FIG. 4, it is arranged on the substrate 11 so as to deviate from the center of the width of the substrate 11 (that is, the length in the second direction in FIG. 4) toward the side 11b of the substrate 11. is preferred. In other words, in a plan view, the wiring 11a is preferably arranged to be biased toward the side 11b of the substrate 11 with respect to the centerline of the substrate 11 in the second direction.
The main material of the substrate 11 is preferably an insulating material that hardly transmits the light from the light emitting element 12 and the light from the outside. Examples of such materials include ceramics such as aluminum oxide and aluminum nitride, and resins such as phenol resin, epoxy resin, silicone resin, polyimide resin, BT resin, and polyphthalamide. When a resin is used, inorganic fillers such as glass fiber, silicon oxide, titanium oxide, and aluminum oxide may be mixed with the resin, if necessary. As a result, it is possible to improve the mechanical strength, reduce the coefficient of thermal expansion, and improve the light reflectance. The substrate 11 may be formed by forming an insulating material on the surface of a metal member.
The wiring 11a is formed in a predetermined pattern on an insulating material. Examples of wiring materials include metals such as Au, Ag, Cu, Fe, Ti, Pd, Ni, Cr, Pt, W, and Al, and alloys containing these. The wiring can be formed by plating, vapor deposition, sputtering, or the like. For example, when Au is used as a bonding member between a light emitting element and a substrate, which will be described later, it is preferable to use Au for the outermost surface of the wiring 11a from the viewpoint of improving bondability.

(Light emitting element 12)
A plurality of light emitting elements 12 are arranged on the upper surface of the substrate 11 . In this case, the light emitting elements 12 may be arranged in a line in the first direction, or may be arranged in a matrix. Among them, it is preferable that they are arranged in a row, and as shown in FIG. 1A, it is more preferable that they are arranged in a row in the first direction. As a result, the light emitting device 20 having a horizontally long light distribution pattern suitable for vehicle headlights can be obtained. For example, when the planar shape of the substrate 11 is rectangular as described above, a plurality of light emitting elements may be arranged in a row along the first direction, with the direction in which the long sides extend as the first direction. preferable.
It is preferable that the plurality of light emitting elements be arranged in a line at regular intervals.

The planar shape of the light emitting element 12 may be circular, elliptical, polygonal such as square and hexagonal, and polygonal with rounded corners. Among them, a square shape is preferable, and a rectangular shape is more preferable. As a result, when arranging the plurality of light emitting elements 12 in the first direction, the plurality of light emitting elements can be arranged close to each other while keeping the distance between the side surfaces of adjacent light emitting elements constant. As a whole, it is possible to form a horizontally long rectangular light emitting surface in a plan view.
The length, width, and height dimensions of the light emitting element can be set arbitrarily. In particular, in order to realize a light-emitting device with higher output, it is preferable to use a large-sized light-emitting element. is more preferable. Moreover, from the viewpoint of uniformity of emission intensity, ease of mounting, etc., the vertical and horizontal dimensions are preferably 2000 μm or less.
The light emitting elements 12 are arranged apart from adjacent light emitting elements 12 . In this case, the distance between the light emitting elements 12 is, for example, in the range of 0.1 to 0.5 times the length of one side of the light emitting elements 12 along the first direction. Specifically, when light emitting elements 12 having a substantially square shape in a plan view and having vertical and horizontal dimensions of about 1000 μm are used, the distance between adjacent light emitting elements 12 is in the range of 100 μm to 500 μm.

A light-emitting diode is preferably used as the light-emitting element 12 . A light-emitting element with an arbitrary wavelength can be selected. For example, blue and green light-emitting elements include those using nitride semiconductors (In _X Al _Y Ga _1-XY N, 0≦X, 0≦Y, X+Y≦1), ZnSe, and GaP. . GaAlAs, AlInGaP, or the like can be used as a red light emitting element. Furthermore, semiconductor light-emitting elements made of other materials can also be used. The composition, emission color, size, number, and the like of the light-emitting element to be used can be appropriately selected according to the purpose. In the case of a light-emitting device having a phosphor, it is preferable to use a light-emitting element made of a nitride semiconductor capable of emitting short-wavelength light that can efficiently excite the phosphor.
The light emitting element 12 is formed by stacking semiconductor layers on a translucent support substrate such as a sapphire substrate for growth, for example, and the main light emitting surface of the light emitting element 12 is on the support substrate side. The support substrate may be removed, for example, by polishing, laser lift-off, or the like.

The light emitting element 12 preferably has a first electrode and a second electrode on the same side, that is, on the side opposite to the light emitting surface, for example. As for the first electrode and the second electrode, in the light emitting element 12, for example, the first electrode is arranged in the central portion and the second electrodes are arranged so as to sandwich the first electrode.

The light emitting element 12 is mounted on the substrate 11 so that the surface on which the electrodes are formed faces the substrate 11 with the surface on which the electrodes are formed as the lower surface. Specifically, the first electrode or the second electrode of the light emitting element 12 is connected to the wiring 11a provided on the substrate 11 via the joining member.
Examples of the bonding member include bumps made of Au, Ag, Cu, or alloys containing these; Sn—Bi, Sn—Cu, Sn—Ag, and Au—Sn solder; eutectic alloys such as alloys mainly composed of Au and Si, alloys mainly composed of Au and Ge, or conductive pastes such as Au, Ag, and Pd, ACP, ACF Anisotropic conductive materials, such as low-melting-point metal brazing materials, conductive adhesives combining these, conductive composite adhesives, and the like. Among them, it is preferable to use bumps from the viewpoint of positional accuracy. Moreover, from the viewpoint of bonding strength and heat dissipation, it is preferable that the first electrode and the second electrode are connected to the substrate 11 via a plurality of bumps, respectively.
When the light emitting element is bonded to the wiring by a bonding member such as a bump, a gap corresponding to the thickness of the bonding member is generated between the light emitting element and the substrate. At this time, by disposing a first resin having light reflectivity, which will be described later, in this gap, it is possible to reflect the light directed toward the substrate from the light emitting element, thereby facilitating extraction of the light to the outside.

Considering the area where the protection element 13 described later is arranged on the wiring 11a of the substrate 11, the light emitting element 12 is arranged, for example, from the center ( ) of the width of the wiring 11a in the second direction. It is preferably arranged in a position shifted to the opposite side of the area where the In particular, as described above, when the wiring 11a is arranged to be biased toward the side 11b of the substrate 11 as shown in FIG. It is preferable that it be arranged biased toward the other side 11c side opposite to the side. With this arrangement, as shown in FIG. 1A, the light emitting element 12 is arranged on the substrate 11 along the first direction while securing a region for mounting the protective element 13 on the one side 11b side of the substrate 11. It can be arranged centrally in the second direction. The placement of the light emitting element 12 on the wiring 11a in this manner indicates that the area of the wiring 11a is different between the one side 11b side and the other side 11c side of the substrate 11 facing each other with the light emitting element 12 interposed therebetween. Specifically, with respect to the light emitting elements 12 arranged in a line, the area of the wiring 11a arranged on the one side 11b side of the substrate 11 and the side on which the protective element 13 is mounted is arranged on the other side 11c side. This indicates that the area of the wiring 11a is larger than the area of the wiring 11a.

(protective element 13)
As shown in FIG. 1A, the protective element 13 is placed on the upper surface of the substrate so as to be separated from the light emitting element 12 in a second direction orthogonal to the first direction and to face the light emitting element 12 . The distance between the light emitting element 12 and the protective element 13 is, for example, in the range of 0.1 to 0.5 times the length of one side of the light emitting element 12 along the second direction.
Furthermore, it is preferable that the protective element 13 is arranged in the first direction substantially at the center of the row of the plurality of light emitting elements arranged in the first direction. This makes it easier for the first resin, which will be described later, to spread evenly toward both ends of the row of light emitting elements along the protective element.
Examples of the protective element 13 include capacitors, varistors, Zener diodes, bridge diodes, and the like.
As shown in FIG. 1A, FIG. 2A, etc., the protective element 13 is preferably arranged such that the side surface of the protective element 13 and the side surface of the light emitting element 12 face each other. As a result, the distance between the side surface of the protection element 13 and the side surface of the light emitting element 12 facing each other can be kept constant, and they can be arranged close to each other. Further, the first resin, which will be described later, can easily move to the light emitting element side along the opposing side surfaces of the protection element 13 and the light emitting element 12 .
The planar view shape of the protective element 13 is, for example, a substantially rectangular shape. The length, width, and height dimensions of the protective element can be set arbitrarily. In particular, from the viewpoint of miniaturization of the light-emitting device, it is preferable that the protective element has vertical and horizontal dimensions smaller than those of the light-emitting element in plan view. Moreover, the height of the protective element is preferably lower than the combined height of the light emitting element and the translucent member.

(translucent member 14)
The translucent member 14 is a member that transmits the light emitted from the light emitting element 12 and emits it to the outside, and is bonded to the upper surface of the light emitting element 12 . The translucent member 14 may transmit 60% or more of the light (for example, light in the wavelength range of 320 nm to 850 nm) from the light emitting element 12, and preferably transmit 70% or more of the light. Also, a plate-shaped member is preferable.
Specifically, the translucent member 14 has, for example, a first surface, a second surface opposite to the first surface, and side surfaces between the first surface and the second surface. The first surface corresponds to the light extraction surface of the light emitting device 20 . The second surface is joined to the top surface of the light emitting element 12 . The first and second surfaces are preferably flat and more preferably parallel to each other. The side surface may be a vertical surface perpendicular to the first surface and/or the second surface, or may have an inclined surface that is inclined with respect to the first surface and/or the second surface. Moreover, the translucent member 14 may have a step between the first surface and the second surface.
The second surface of the translucent member 14 preferably has an area about 0.8 to 1.5 times the area of the upper surface of the light emitting element 12 . It is preferable that the outer edge of the second surface of the translucent member coincides with the outer edge of the top surface of the light-emitting element, or is positioned either inside or outside the outer edge of the upper surface. In other words, it is preferable that one of the upper surface of the light-emitting element and the second surface of the translucent member is included in the other in plan view.
The thickness of the translucent member 14 can be, for example, in the range of 50 μm to 300 μm.
The light-transmitting member 14 and the light-emitting element 12 can be bonded using a light-transmitting adhesive or the like that is commonly used in the relevant field. Alternatively, the translucent member 14 and the light-emitting element 12 may be bonded by direct bonding such as pressure bonding, surface activation bonding, atomic diffusion bonding, or hydroxyl group bonding.

The translucent member 14 is made of, for example, glass, ceramics, inorganic materials such as sapphire, silicone resins, modified silicone resins, epoxy resins, modified epoxy resins, acrylic resins, phenolic resins, and fluorine resins. It may be formed of any organic material such as resin.
The translucent member 14 may contain a light diffusing material and a phosphor capable of wavelength-converting at least part of the incident light. Examples of translucent members containing phosphors include sintered bodies of phosphors, resins, glass, ceramics, and other inorganic substances containing phosphors. Alternatively, a resin layer containing a phosphor may be formed on the surface of a molding made of resin, glass, ceramics, or the like.
A phosphor that can be excited by light emitted from the light emitting element 12 is used as the phosphor. For example, phosphors that can be excited by a blue light emitting device or an ultraviolet light emitting device include a cerium-activated yttrium aluminum garnet phosphor (YAG:Ce), a cerium activated lutetium aluminum garnet phosphor. (LAG:Ce), nitrogen-containing calcium aluminosilicate phosphor activated with europium and/or chromium (CaO—Al ₂ O ₃ —SiO ₂ :Eu), silicate phosphor activated with europium ((Sr, Ba) ₂ SiO ₄ :Eu), β-SiAlON phosphor, CASN phosphor represented by CaAlSiN ₃ :Eu, Nitride phosphor such as SCASN phosphor represented by (Sr, Ca)AlSiN ₃ :Eu a KSF-based phosphor represented by K ₂ SiF ₆ :Mn, a sulfide-based phosphor, a quantum dot phosphor, and the like. By combining these phosphors with a blue light-emitting element or an ultraviolet light-emitting element, a light-emitting device with a desired emission color (for example, a white light-emitting device) can be manufactured.
As the light diffusing material, titanium oxide, barium titanate, aluminum oxide, silicon oxide, zirconium oxide, aerosil, filler such as glass, glass fiber or wollastonite, aluminum nitride, etc., which are commonly used in the field. may be used.

(Formation of resin wall)
As shown in FIGS. 1C and 1D, a resin wall 150 is formed on the substrate 11 so as to surround the plurality of light emitting elements 12 and the protective elements 13 with the translucent member 14 bonded to their upper surfaces. For example, when a plurality of light emitting elements 12 are arranged in a row in the first direction on a substrate 11 that is rectangular in plan view, the resin wall preferably has a substantially rectangular frame shape surrounding the plurality of light emitting elements 12.
As shown in FIG. 1C, the resin walls are arranged to sandwich the plurality of light-emitting elements 12 to which the translucent members 14 are joined, and extend in the first direction. It includes a third wall 153 and a fourth wall 154 disposed between the wall 151 and the second wall 152 and extending in the second direction. The third wall 153 and the fourth wall 154 are arranged to face each other with the plurality of light emitting elements 12 interposed therebetween. In other words, the first wall 151, the second wall 152, the third wall 153, and the fourth wall 154 surround the plurality of light-emitting elements 12 and the protective elements 13 to which the translucent member 14 is joined. It is arranged on the substrate 11 apart from the member 14 , the light emitting element 12 and the protection element 13 . Here, the first wall 151, the second wall 152, the third wall 153, and the fourth wall 154 are formed to be connected to each other, and the plurality of light emitting elements 12 and the protective elements 13 to which the translucent member 14 is joined are provided. It is arranged on the substrate 11 as one frame-shaped resin wall surrounding it. In this case, as shown in FIG. 1C, the resin wall has a substantially rectangular annular structure in which the first wall 151, the fourth wall 154, the second wall 152, and the third wall 153 are connected in this order. Note that the rectangular shape in this case may be a rectangular shape with rounded corners, that is, the connecting portion between the first wall 151, the fourth wall 154, the second wall 152, and the third wall 153 may be a so-called rounded shape. .

As shown in FIG. 1C, the distance between the first wall 151 and the light emitting element 12 (D1 in FIG. 1C, hereinafter sometimes referred to as the first distance) is the third wall 153 or the fourth wall 154 and the light emitting element 12 (D2 in FIG. 1C, hereinafter sometimes referred to as a second distance). In other words, the region sandwiched between the first wall 151 and the light emitting element 12 (161 in FIG. 1E, hereinafter sometimes referred to as the first region) is the third wall 153 or the fourth wall 154 and the light emitting element 12. larger than the area between The distance between the first wall 151 and the light emitting element 12 may be different from the distance between the second wall 152 and the light emitting element 12, but it is preferable that they are the same. In other words, the first region 161 may be different from the region sandwiched between the second wall 152 and the light emitting element 12 (162 in FIG. 1E, hereinafter sometimes referred to as the second region), but the same. Preferably. For example, the first distance D1 ranges from 0.5 to 1.5 times the length of one side of the light emitting element along the first direction. Specifically, it is 500 μm to 1500 μm. The second distance D2 is, for example, equal to or greater than the distance between the light emitting elements, and preferably less than three times the distance between the light emitting elements.
The distance between the third wall 153 and the light emitting element 12 and the distance between the fourth wall 154 and the light emitting element 12 are designed to be the same. Even if a plurality of light emitting elements are identical in design, errors occur due to component tolerances, mounting tolerances, and the like during manufacturing. In this specification, when the distance, width, height, and area are said to be the same, such errors are included in the allowable range, and they do not necessarily have to be the same.

The resin wall 150 is made of an insulating resin to cover a portion of the wiring 11a. The resin wall may be formed of, for example, translucent resin, but is preferably formed of a mixed material of resin and light-reflecting substance. As the resin, either a thermosetting resin or a thermoplastic resin may be used. Specifically, epoxy resin, silicone resin, modified epoxy resin, modified silicone resin, polyester resin, polyimide resin, modified polyimide resin, polyphthalamide (PPA), polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP). , ABS resin, phenol resin, acrylic resin, PBT resin, and the like. Among them, thermosetting resins such as epoxy resins and silicone resins, which are excellent in heat resistance and light resistance, are preferably used. As the light-reflecting substance, it is preferable to use a member that hardly absorbs light from the light-emitting element and that has a large difference in refractive index with respect to the resin material. Examples of such light-reflecting substances include titanium oxide, zinc oxide, silicon oxide, zirconium oxide, yttrium oxide, yttria-stabilized zirconia, potassium titanate, aluminum oxide, aluminum nitride, boron nitride, and mullite. These light-reflecting substances can be contained in the range of 5% to 90% by weight with respect to the resin. The viscosity of the mixed material of the resin and the light-reflecting substance forming the resin wall is, for example, in the range of 200 Pa·s to 800 Pa·s, preferably in the range of 350 Pa·s to 450 Pa·s. Alternatively, the resin wall may be formed of a mixed material containing a resin and a light-absorbing substance such as carbon black or graphite.

The first wall 151, the second wall 152, the third wall 153 and the fourth wall 154 may be formed with the same height and the same width, or some or all of them may be formed with different heights and/or different widths. You may When the portions are formed with different heights and/or different widths, two walls facing each other across the light emitting element 12 (specifically, the first wall 151 and the second wall 152, the third wall 153 and the fourth wall). Preferably, the walls 154) are each formed with the same height and width). The height of the resin wall 150 from the top surface of the substrate 11 is preferably higher than the top surface of the light emitting element 12, as shown in FIG. 1D, for example. Also, the height from the top surface of the substrate 11 to the top of the resin wall 150 may be higher than the height from the top surface of the substrate 11 to the top surface of the translucent member 14, but is preferably lower. For example, when the height from the upper surface of the substrate 11 to the upper surface of the translucent member 14 is 350 μm, the height of the resin wall is in the range of 150 μm to 300 μm. The width of the resin wall 150 (that is, the length of the base of the resin wall 150 in the direction orthogonal to the direction in which the resin wall extends) is sufficient as long as it has sufficient strength to stand on its own, depending on the height, the material used, and the like. can be set. The width of the resin wall 150 is, for example, in the range of 200 μm to 600 μm.
The resin wall can be formed, for example, by using a device known in the art, for example, a discharge device (resin discharge device) capable of discharging liquid resin continuously and at a constant discharge flow rate by air pressure or the like (particularly See JP-A-2009-182307). When a discharge device is used, the resin wall 150 having a desired height and width can be formed by adjusting the moving speed and discharge amount of the needle of the discharge device.

(Formation of first recess and second recess)
As shown in FIGS. 2A and 2B, the first resin 18a is applied along the first direction to the first region 161 between the first wall 151 and the light emitting element 12 and where the protective element 13 is arranged. apply. Along the first direction here may be from the third wall 153 to the fourth wall 154 or from the fourth wall 154 to the third wall 153 . When the application of the first resin 18a is performed multiple times, the application may be performed multiple times from the third wall 153 to the fourth wall 154, or the application from the fourth wall 154 to the third wall 153 may be performed multiple times. or a combination of the two. In this case, the first resin 18 a is preferably applied from above the protection element 13 so as to cover the protection element 13 . By applying the first resin 18 a to such a position, it becomes easier for the first resin 18 a to move toward the light emitting element 12 along the protective element 13 . Therefore, the first resin 18a quickly moves in the direction indicated by the arrow P in FIGS. 1E, 1F and 2B. Furthermore, as shown in FIG. 2C, even in the direction indicated by the arrow Q, the first resin 18a extends between the light emitting element 12 and the third wall 153, between the light emitting element 12 and the fourth wall 154, and between the light emitting element 12 and the fourth wall 154. It moves toward the second region 162 from the space between the light emitting element 12 and the substrate 11 along the third wall 153, the fourth wall 154, the light emitting element, the substrate 11 and/or the wiring 11a. At this time, the first resin that has moved to the light emitting element 12 side crawls up between the opposing side surfaces of the light emitting element 12 and between the opposing side surfaces of the translucent member 14 between the light emitting elements 12 due to capillary action. and cover the side surface of the translucent member 14 . Similarly, the first resin that has moved along the light emitting elements arranged in the first direction crawls between the facing side surfaces of the resin wall and the light emitting elements 12 between the third wall and the fourth wall and the light emitting elements. It rises and covers the side surface of the light emitting element 12, the side surface of the translucent member 14, and the side surface of the resin wall. Then, the first resin 18a that has moved into the second region 162 wets and spreads along the side surfaces of the second wall 152 and the light emitting element, as shown in FIGS. 1E and 2C. As a result, a second recess 172 having an inner surface made of the first resin 18a or a resin wall can be formed in the second region 162 . The bottom surface of the second concave portion 172 may be composed of the first resin 18a, or may be the surface of the substrate exposed from the first resin 18a.

The first resin 18a applied to the first region 161 moves toward the light emitting element 12 and moves from the protection element 13 side to the first wall 151 side in the first region 161 in the direction indicated by the arrow R in FIG. 2C. , and wets and spreads along the first wall 151 . As a result, the first recess 171 having an inner surface made of the first resin 18a or the resin wall can be formed in the first region 161 . The bottom surface of the first concave portion 171 may be made of the first resin 18a, or may be the surface of the substrate exposed from the first resin 18a. Here, since the protective element is arranged in the first region, the bottom surface of the first concave portion 171 is two-dimensionally sandwiched between the protective element 13 and the first resin 18a covering the protective element 13, as shown in FIG. 1E. It has one bottom surface.
Thus, in the region surrounded by the resin wall 150, the first region and the second region sandwiching the plurality of light emitting elements arranged in the first direction are provided with the first resin or the resin wall. A first recess and a second recess having sides may be formed.

Since the protection element 13 is arranged in the first area 161 , the first resin applied to the first area covers the surface of the protection element 13 . Therefore, even if the areas of the first region 161 and the second region 162 on the substrate 11 are the same, the amount of the first resin 18a applied to the first region 161 increases. It is considered that the amount of movement of the first resin 18a to the second region is smaller than the amount of the first resin 18a remaining in the region. Therefore, as shown in FIG. 2C, the volume of the first recess 171 is formed smaller than the volume of the second recess 172 by the volume of the protection element 13 and the first resin 18a covering the protection element 13 . Here, the amount of the first resin 18a applied to the first region 161 means the volume of the first resin, and the amount of movement of the first resin 18a to the second region means the amount of the first resin 18a disposed in the second region. 1 shows the capacity of the first resin 18a. Further, as described above, since the wiring 11a is unevenly distributed on the substrate 11, for example, the area of the wiring 11a arranged on the side of the first recess 171 is larger than the area of the wiring 11a arranged on the side of the second recess 172. is also big. In other words, the area of the wiring 11 a in the first region 161 is larger than the area of the wiring 11 a in the second region 162 . Therefore, by using a material having higher wettability with respect to the first resin 18a than the material of the substrate 11 for the outermost surface of the wiring 11a, the first resin 18a can be used as the light emitting element 12 and the resin wall located on the wiring 11a. It can be efficiently moved to the 150 side.

The first resin 18a may be made of, for example, a translucent resin, but is preferably made of a light-shielding resin, and more preferably made of a light-reflective resin. Such a resin can be appropriately selected from the materials exemplified for the resin wall. Although the first resin 18a may be made of a material different from the material forming the resin wall, it is preferable to use the same material. It is preferable that the first resin 18a has a viscosity lower than that of the resin wall. For example, the viscosity of the first resin 18a may be 100 Pa·s or less, preferably 50 Pa·s or less, and in the range of 4 Pa·s to 20 Pa·s, in consideration of ease of movement, ease of wetting and spreading. is more preferred.

Application of the first resin 18a may utilize any method known in the art, as described above. For example, it is possible to use a discharge device (resin discharge device) capable of discharging liquid resin continuously and at a constant discharge flow rate by air pressure or the like (see Japanese Patent Application Laid-Open No. 2009-182307). When using an ejection device, it is preferable to keep the moving speed of the needle of the ejection device constant.
In order to form the first concave portion 171 and the second concave portion 172, the amount of the first resin 18a applied to the first region 161 is, for example, the height of the first wall 151, the first distance D1, and the length of one side of the light emitting element. It can be set as appropriate from the length, the number of light emitting elements to be arranged, etc. number of elements) in the range of 1.5 to 3 times the volume calculated.

(Formation of covering member 18)
As shown in FIGS. 2D and 2E, the first recess 171 and the second recess 172 are coated with the second resin 18b. After applying the second resin 18b, the first resin 18a and the second resin 18b are cured. Thereby, as shown in FIGS. 1G and 1H, a covering member 18 that covers the side surface of the translucent member 14 can be formed.
Here, as described above, the volume of the first recess 171 is formed smaller than the volume of the second recess 172 . Therefore, it is preferable that the amount of the second resin applied to the inside of the first concave portion 171 is smaller than the amount of the second resin applied to the inside of the second concave portion 172 .
It is preferable that the first resin 18a and the second resin 18b are cured in the same step. Although the second resin 18b may be placed after the curing process of the first resin 18a, the first resin 18a and the second resin 18b are continuously applied and the first resin 18a and the second resin 18b are cured at the same time. is preferred.
It is preferable to use the same material as the first resin 18a for the second resin 18b. By using the same material for the first resin 18a and the second resin 18b, they can be cured simultaneously under the same conditions.
By curing the first resin 18a and the second resin 18b substantially simultaneously, the covering member 18 in which the first resin 18a and the second resin 18b are integrated is formed. As a result, an interface is not formed at the boundary between the first resin 18a and the second resin 18b, the adhesion between the first resin 18a and the second resin 18b is improved, and peeling is suppressed.

The second resin 18b can be applied in the same manner as the first resin 18a described above. The application of the second resin 18b to the first concave portions 171 and the second concave portions 172 may be performed in any order.
Here, let A be the amount of the first resin applied to the first region, B be the amount of the second resin applied to the first recess, and C be the amount of the second resin applied to the second recess. The quantities A, B and C can be the same, any one can be different, or all can be different. For example, when the area of the first region and the area of the second region are substantially the same, it is preferable that the coating amount A≈the coating amount C and the coating amount A(C)>the coating amount B.

After the second resin 18b is applied in the first concave portion 171 and the second concave portion 172 formed by applying the first resin 18a, the first resin 18a and the second resin 18b are cured to remove the coating member 18. Form.
The surface of the covering member 18 is preferably substantially flat both inside the first recess 171 and inside the second recess 172 . It is preferable that the height of the surface of the covering member 18 from the substrate be approximately the same height as the upper surface of the translucent member 14 or lower than that.

As described above, in the present embodiment, before applying the second resin 18b, the first resin 18a is arranged between the light emitting elements and between the translucent members, and the first concave portion 171 and the second concave portion 172 are formed. . Thereby, movement of the second resin 18b between the first region 161 and the second region 162 is controlled. In other words, since the movement of the second resin 18b between the adjacent translucent members 14 is controlled, it is possible to effectively suppress the second resin from creeping up to the top surface of the translucent member 14 . Moreover, it is possible to suppress the generation of voids or the like due to movement of the resin between the adjacent light emitting elements and between the translucent members, and it is possible to reliably fill the resin in an appropriate place.

That is, as described above, in the present embodiment, the first concave portion and the second concave portion are formed by applying the first resin, and the second resin is applied to the first concave portion and the second concave portion. Therefore, the first resin 18a and the first resin 18a are provided on the upper surface of the covering member 18 between the first recess and the second recess (that is, between the light emitting element 12 and between the light emitting element and the third and fourth walls). The second resin 18b is arranged on the upper surfaces of the recess and the second recess. On the other hand, by simultaneously curing the first resin 18a and the second resin 18b, the covering member 18 in which the first resin 18a and the second resin 18b are integrated can be obtained. Since the integrated coating member 18 does not form an interface between the first resin 18a and the second resin 18b, cracks, resin breaks, etc. are suppressed, and a highly reliable light emitting device can be obtained.

By forming the covering member 18 in this way, the light-emitting device 20 in which the upper surface of the translucent member 14 is exposed from the covering member 18 as shown in FIG. 3 can be manufactured easily and reliably.

10 First intermediate 11 Substrate 11a Wiring 11b One side 11c Other side 12 Light emitting element 13 Protection element 14 Translucent member 18 Covering member 18a First resin 18b Second resin 20 Light emitting device 151 First wall 152 Second wall 153 Third Wall 154 Fourth wall 161 First region 162 Second region 171 First recess 172 Second recess

Claims (13)

a substrate; a plurality of light emitting elements arranged in a first direction on the upper surface of the substrate; a step of preparing a first intermediate body comprising a protective element attached to the protective element and a translucent member bonded to the upper surface of each of the plurality of light emitting elements;
a first wall and a second wall extending in the first direction; and a third wall and a fourth wall disposed between the first wall and the second wall and extending in the second direction; forming a resin wall surrounding the plurality of light emitting elements and the protective element on the substrate;
A first resin is applied in the first direction between the first wall and the light emitting element and in the first region where the protective element is arranged, and the first resin is applied from the first region to the first region. moving the first resin over a second region between the two walls and the light emitting element to form a first recess having an inner surface made of the first resin or the resin wall in the first region; forming a second recess having an inner surface made of the first resin or the resin wall in the second region;
applying a second resin to each of the first recess and the second recess;
A method of manufacturing a light-emitting device, comprising: forming a covering member covering the side surface of the translucent member by curing the first resin and the second resin. the second distance is the distance between the third wall and the fourth wall and the light emitting element;
2. The method of manufacturing a light emitting device according to claim 1, wherein the second distance is equal to or greater than the distance between the light emitting elements and less than three times the distance between the light emitting elements. the first distance is the distance between the first wall and the light emitting element;
3. The method of manufacturing a light emitting device according to claim 1, wherein the distance between said second wall and said light emitting element is the same as said first distance. the substrate includes wiring on which the plurality of light emitting elements and the protective element are mounted on the upper surface of the substrate;
4. The wiring according to any one of claims 1 to 3, wherein in plan view, the area of the wiring between the first wall and the light emitting element is larger than the area of the wiring between the second wall and the light emitting element. 10. A method for manufacturing the light emitting device according to claim 1. The manufacturing of the light-emitting device according to any one of claims 1 to 4, wherein the amount of the second resin applied to the inside of the first recess is smaller than the amount of the second resin applied to the inside of the second recess. Method. 6. The resin wall according to any one of claims 1 to 5, wherein the resin wall is formed such that the upper end of the resin wall is positioned higher than the upper surface of the light emitting element and lower than the upper surface of the translucent member. A method of manufacturing the described light emitting device. 7. The method of manufacturing a light emitting device according to claim 1, wherein the first resin and the second resin contain a light reflecting material. 8. The method of manufacturing a light emitting device according to claim 1, wherein the same material is used for the first resin and the second resin. The method of manufacturing a light emitting device according to any one of claims 1 to 8, wherein the distance between the light emitting elements is 0.1 to 0.5 times the length of one side of the light emitting elements along the first direction. 10. The method of manufacturing a light-emitting device according to claim 1, wherein the translucent member contains a phosphor. In the step of forming the resin wall, a first distance between the first wall and the light emitting element is longer than a second distance between the third wall and the fourth wall and the light emitting element. A method for manufacturing a light-emitting device according to any one of claims 1 to 10. The first resin is moved from between the light emitting element and the third wall, between the light emitting element and the fourth wall, between the light emitting elements, and between the light emitting element and the substrate. 12. The method for manufacturing the light emitting device according to any one of 11. 13. The method of manufacturing a light-emitting device according to claim 1, wherein the first resin is applied from above the protection element so as to cover the protection element.

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