JP5703663B2 - Light emitting device and method for manufacturing light emitting device - Google Patents

Description

  The present invention relates to a light-emitting device that can be used for lighting fixtures such as LED bulbs and spotlights, and a method for manufacturing the same.

  In general, a light-emitting device using a light-emitting element is known to be small, power efficient, and emit bright colors. Since the light-emitting element according to this light-emitting device is a semiconductor element, the light-emitting element is characterized by not only less fear of ball breakage but also excellent initial drive characteristics and resistance to repeated vibration and on / off lighting. Because of such excellent characteristics, light emitting devices using light emitting elements such as light emitting diodes (LEDs) and laser diodes (LDs) are used as various light sources.

  A light-emitting device mainly includes a light-emitting element, a base material having a conductive wiring in which the light-emitting element is arranged and electrically connected to the light-emitting element, and a sealing member that covers the light-emitting element of the base material. (For example, refer to Patent Document 1). In addition, there is a type in which a resin frame is formed around a light emitting element, such as a surface mount type COB (Chip on Board) (for example, see Patent Documents 2 and 3). Further, there has been proposed a light emitting device that emits mixed color light of light from a light emitting element and light whose wavelength has been converted by the phosphor by including a phosphor in the sealing member (for example, Patent Document 4). reference). Such a light-emitting device can improve light extraction by concentrating the phosphor near the light-emitting element. Such a structure can be formed, for example, by containing a phosphor in the sealing resin and precipitating the phosphor.

JP 2004-40099 A Design Registration No. 1383248 Japanese Patent Laid-Open No. 5-29665 JP 2010-192624 A

However, the conventional techniques have the following problems.
In the case of a light-emitting device that combines light from a light-emitting element and wavelength-converted light from a phosphor to obtain a color mixture of them, a portion where the wavelength-converted light is strong near the outer periphery on the irradiated surface (in the case of a yellow phosphor, “yellow It is easy to occur. The reasons for this are, for example, (1) light distribution unevenness of the light emitting element (many light is emitted from the upper surface and less light is emitted from the side surface), and (2) the light distribution of the light emitting element and the phosphor distribution. There may be a discrepancy (the balance between the light emission of the light emitting element and the wavelength converted light by the phosphor is partially broken).

  Here, the resin frame is formed around the light emitting element, and is used as a dam for blocking the sealing resin. For this reason, the resin frame needs to be formed higher than at least the light emitting element, and the width is required to be reduced to some extent in order to suppress an increase in the size of the light emitting device. For this reason, a resin having a relatively high viscosity is used as the frame material. However, when such a high-viscosity resin is used, the resin does not easily sag and does not spread on the base material, and the surface (wall surface) of the resin frame is inclined as compared with the case where a resin having a lower viscosity is used. It becomes a steep shape (see FIG. 4A). In addition, if the resin has a higher viscosity, the cross section has a substantially elliptical shape. In addition, such a resin frame is formed at a certain distance from the light emitting element so as not to cover the light emitting element in consideration of manufacturing variations. As a result, when the phosphor is settled as described above, the amount of the phosphor positioned between the light emitting element and the resin frame increases. Thereby, since the phosphor is formed thick in the side surface direction of the light emitting element, the yellow ring problem is likely to occur. For example, as a light source for illumination using a secondary optical system such as a lens or a reflector like a spotlight, a light emitting device capable of suppressing such color unevenness on the irradiated surface is required.

  The present invention has been made in view of the above problems, and provides a light emitting device capable of suppressing uneven color of light in a light emitting device in which a phosphor is contained in a sealing resin, and a method for manufacturing the light emitting device. The task is to do.

In order to solve the above-described problems, a light-emitting device according to the present invention includes a light-emitting element, a light-reflective frame disposed around the light-emitting element on a flat substrate, and a filling inside the frame. And a sealing resin containing a phosphor, wherein a first phosphor region on which the phosphor is deposited is provided on the base material, and the first phosphor region is at least It is arranged between the light emitting element and the frame, and the inner surface of the frame is curved in a convex shape at least above the first phosphor region, and is continuously concave to the convex curved portion. And is provided on the base material, and further has a second phosphor region to which the phosphor adheres to the convex curved portion, and the phosphor is deposited on the concave curved portion. It is characterized by that.

  According to such a configuration, in the light emitting device, the phosphor adheres to the convex curved portion, and the amount of the phosphor between the light emitting element and the frame is reduced. Moreover, since the distance between the light emitting element and the frame is shortened by having a concave curved portion, and the amount of sealing resin at this portion is reduced, the amount of phosphor between the light emitting element and the frame is reduced. To reduce. Thereby, the intensity | strength of the wavelength conversion light of the fluorescent substance between a light emitting element and a frame can be suppressed, and it can be set as the light-emitting device by which the color unevenness of the irradiation surface was suppressed.

In addition, it is preferable that the second phosphor region is formed thinner than the first phosphor region.
According to such a configuration, the amount of the phosphor in the convex curved portion and the amount of the phosphor between the light emitting element and the frame become more appropriate.

The light-emitting device further includes a conductive member that applies a voltage to the light-emitting element on the base, the light-emitting element and the conductive member are electrically connected by a conductive wire, and the conductive member The connection portion with the wire may be covered with the frame.
According to such a configuration, in the light emitting device in which the light emitting element and the conductive member are electrically connected by the wire, the connection portion of the conductive member that is connected to the wire is covered with the frame. And a wire bonding region between the light emitting element and the light emitting element are not necessary. Thereby, since the frame can be disposed near the light emitting element, the amount of the phosphor between the frame and the light emitting element is further reduced.

Moreover, it is preferable that the first phosphor region further continuously covers the side surface and the upper surface of the light emitting element.
According to such a configuration, the entire light emitted from the light emitting element can be wavelength-converted by the phosphor.

  In the light emitting device, a plurality of the light emitting elements may be mounted on the base material. If the light-emitting device includes a plurality of light-emitting elements, the amount of light emission can be increased.

The light emitting device manufacturing method according to the present invention includes a die bonding step of placing a light emitting element on a flat substrate, a light reflecting frame forming step of providing a light reflecting frame around the light emitting element, A sealing resin filling step of filling the inside of the frame with a sealing resin containing a phosphor, and in the light reflecting frame forming step, the light reflecting frame is convex at least at an upper portion inside the frame. In the lower part of the inside thereof, and continuously forming the concave curved portion in the concave shape to form the substrate, and in the sealing resin filling step, the phosphor is allowed to settle, The phosphor is deposited on the substrate and adheres to the convex curved portion, and the phosphor is deposited on the concave curved portion.

  According to such a manufacturing method, since the frame is formed so as to be convexly curved at the upper portion inside thereof, the phosphor that has settled in the sealing resin adheres to this portion, and the light emitting element and the frame The amount of phosphor in between. In addition, since the frame is formed to be concavely curved at the lower portion inside thereof, the distance between the light emitting element and the frame is shortened, the amount of sealing resin at this portion is reduced, and the light emitting element and the frame The amount of phosphor during the period is reduced. Thereby, the intensity | strength of the wavelength conversion light of the fluorescent substance between a light emitting element and a frame is suppressed, and the light-emitting device by which the color unevenness of the irradiated surface was suppressed can be manufactured.

In the method of manufacturing a light emitting device according to the present invention, in the sealing resin filling step, the phosphor of the convex curved portion is thinner than the phosphor on the base material between the light emitting element and the frame. It is preferable to form.
According to such a manufacturing method, the amount of the phosphor in the convex curved portion and the amount of the phosphor between the light emitting element and the frame can be made more appropriate.

Furthermore, after the die bonding step, the method includes a wire bonding step of electrically connecting the light emitting element and a conductive member for applying a voltage to the light emitting element by a conductive wire, The frame may be formed so as to cover a connection portion of the conductive member with the wire.
According to such a manufacturing method, a light-emitting device having a configuration in which a light-emitting element and a conductive member are electrically connected by a wire, the frame is disposed near the light-emitting element, and the phosphor between the frame and the light-emitting element A light-emitting device with a reduced amount of can be manufactured.

  According to the light-emitting device of the present invention, the light-reflective frame has a convex curved portion, so that the phosphor adheres to this portion, and the amount of the phosphor between the light-emitting element and the frame is reduced. In addition, since the light-reflective frame has a concave curved portion, the distance between the light-emitting element and the frame is shortened, and the amount of the entire sealing resin at this part is reduced. The amount of phosphor in between. As a result, the intensity of the wavelength-converted light of the phosphor between the light emitting element and the frame can be suppressed, and color unevenness (yellow ring when using a yellow phosphor) in the vicinity of the outer periphery of the light emitting device is suppressed. can do.

  According to the method for manufacturing a light emitting device according to the present invention, since the phosphor can be attached to the convex curved portion of the light reflective frame, the amount of the phosphor between the light emitting element and the frame is reduced. be able to. In addition, by forming a concave curved portion in the light reflective frame, the distance between the light emitting element and the frame can be shortened, and the amount of sealing resin at this part can be reduced. The amount of phosphor between the light emitting element and the frame can be reduced. As a result, the intensity of the wavelength-converted light of the phosphor between the light emitting element and the frame can be suppressed, and color unevenness (yellow ring when using a yellow phosphor) in the vicinity of the outer periphery of the light emitting device is suppressed. A light emitting device that can be manufactured can be manufactured.

It is a perspective view which shows the whole structure of the light-emitting device which concerns on embodiment of this invention. It is a front view which shows the structure of the light-emitting device which concerns on embodiment of this invention. (A) is a cross-sectional photograph which shows the structure of the light-reflective frame in the XX cross section of FIG. 1, and its periphery, (b), (c) is the SEM image which expanded the part. . It is a schematic diagram explaining a light-reflective frame and its peripheral configuration, (a) is a schematic diagram when the light-reflective frame does not satisfy the configuration of the present invention, (b) is a light-reflective frame It is a schematic diagram in case the structure of this invention is satisfy | filled. It is a front view which shows the structure of the light-emitting device which concerns on other embodiment of this invention. (A)-(c) is a schematic diagram which shows another method about the formation method of the light-reflective frame in the light-emitting device of this invention. (A), (b) is a schematic diagram which shows another method about the formation method of the light-reflective frame in the light-emitting device of this invention.

  Hereinafter, a light emitting device and a method for manufacturing the light emitting device according to an embodiment of the present invention will be described with reference to the drawings. Note that the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of explanation. Further, in the following description, the same name and reference sign indicate the same or the same members in principle, and the detailed description will be omitted as appropriate. Further, in FIG. 2 referred to in the following description, the p electrode and the n electrode of the light emitting element are shown in detail in only four places on the mounting area in order to indicate the direction of each light emitting element, and other parts on the mounting area. However, detailed illustration is omitted. In FIG. 5, the p electrode and the n electrode are not shown in detail.

≪Light emitting device≫
A light emitting device 100 according to an embodiment of the present invention will be described in detail with reference to FIGS. In the following description, the overall configuration of the light emitting device 100 is first described, and then each configuration is described. For convenience of explanation, the frame 6 in FIG. 2 shows only the outer shape as a line and transmits it. FIG. 5 described in another embodiment is also illustrated in a state where it is similarly transmitted.

<Overall configuration>
The light emitting device 100 is a device that is used for lighting fixtures such as LED bulbs and spotlights, for example. As shown in FIGS. 1 and 2, the light emitting device 100 is disposed on a base material (here, a substrate) 1, a light emitting element 2 disposed in a mounting region 1 a of the base material 1, and a periphery of the light emitting element 2. A light-reflective frame (hereinafter referred to as “light-reflective resin” as appropriate) 6 and a sealing resin 7 filled inside the frame 6 are mainly provided. Furthermore, here, the conductive member 40 constituting the positive electrode 3 and the negative electrode 4 formed on the substrate 1, the protective element 5, the electronic components such as the light emitting element 2 and the protective element 5, the positive electrode 3 and the negative electrode 4. And the like, a metal film 30 formed in the mounting region 1a, and the relay wiring portion 8 are provided.

<Base material>
The substrate 1 is for arranging electronic components such as the light emitting element 2 and the protective element 5. As shown in FIGS. 1 and 2, the substrate 1 is formed in a rectangular flat plate shape. In addition, a mounting region 1a for arranging a plurality of light emitting elements 2 is defined on the substrate 1 as shown in FIG. In addition, the size of the base material 1 is not specifically limited, It can select suitably according to the objectives and uses, such as the number of light emitting elements 2, an arrangement | positioning space | interval.

As the material of the base material 1, it is preferable to use an insulating material, and it is preferable to use a material that hardly transmits light emitted from the light emitting element 2, external light, or the like. Moreover, it is preferable to use a material having a certain degree of strength. Specifically, ceramics (Al ₂ O ₃ , AlN, etc.), or resins such as phenol resin, epoxy resin, polyimide resin, BT resin (bismaleimide triazine resin), polyphthalamide (PPA), and the like can be given.

<Mounting area>
The mounting area 1 a is an area for arranging a plurality of light emitting elements 2. As shown in FIG. 2, the mounting region 1 a is partitioned into a central region of the base material 1. The mounting region 1a is formed in a predetermined shape having sides facing each other, and more specifically, is formed in a substantially rectangular shape with rounded corners as shown in FIG. The size of the mounting region 1a is not particularly limited, and can be appropriately selected according to the purpose and application such as the number of light emitting elements 2 and the arrangement interval.

  A part of the wiring part 3b and a part of the wiring part 4b are formed around the mounting area 1a along the left side of the mounting area 1a in the front view of FIG. A part of the wiring part 4b is formed along the side of the wiring, and the relay wiring part 8 is formed along the right side of the mounting region 1a. Here, the periphery of the mounting region 1a means a periphery at a predetermined interval from the periphery of the mounting region 1a, as shown in FIG.

<Metal film>
The metal film 30 is a film formed on the mounting region 1a. The mounting region 1a may be a region partitioned on the base material 1 in order to arrange the plurality of light emitting elements 2, that is, a region made of the same material as the base material 1. For example, the mounting region 1a may emit light on the mounting region 1a. It is preferable to form a reflective metal film 30 and dispose a plurality of light emitting elements 2 through the metal film 30. Thus, by forming the metal film 30 on the mounting region 1a and disposing the plurality of light emitting elements 2 thereon, the light directed toward the mounting region 1a of the substrate 1 can also be reflected by the metal film 30. . Therefore, loss of emitted light can be reduced, and light extraction efficiency of the light emitting device 100 can be improved.

The metal film 30 formed on the mounting region 1a is preferably formed by electrolytic plating or electroless plating. The material of the metal film 30 is not particularly limited. For example, Ag (silver) or Au (gold) is preferably used, and Ag is particularly preferably used. Au has a characteristic of easily absorbing light. For example, the light reflectance can be increased by further forming a TiO ₂ film on the surface of Au plating. In addition, since Ag has a higher light reflectivity with respect to visible light than Au, the light extraction efficiency of the light emitting device 100 can be improved as compared with plating with Au alone. The thickness of the metal film 30 formed on the mounting region 1a is not particularly limited and can be appropriately selected according to the purpose and application.

<Light emitting element>
The light emitting element 2 is a semiconductor element that emits light by applying a voltage. As shown in FIG. 2, a plurality of light emitting elements 2 are arranged in the mounting region 1 a of the substrate 1, and the plurality of light emitting elements 2 are integrated to form the light emitting unit 20 of the light emitting device 100. The light emitting element 2 is bonded to the mounting region 1a by a bonding member (not shown). As a bonding method, for example, a bonding method using resin or solder paste as the bonding member can be used. The illustrated light emitting unit 20 merely indicates a region where the light emitting element 2 is placed. Needless to say, the light emitted from the light emitting unit 20 is light emitted from the light emitting element 2.

  Each of the light emitting elements 2 is formed in a rectangular shape as shown in FIG. As shown in FIG. 2, the light emitting element 2 is a face-up (FU) element in which a p electrode 2 a is provided on one side of the upper surface and an n electrode 2 b is provided on the other side of the light emitting element 2.

Specifically, a light-emitting diode is preferably used as the light-emitting element 2, and a light-emitting element having an arbitrary wavelength can be selected according to the application. For example, as the light emitting element 2 of blue (light having a wavelength of 430 nm to 490 nm) and green (light having a wavelength of 490 nm to 570 nm), a nitride semiconductor (In _X Al _Y Ga _1-XY N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) and the like can be used. Further, as the red light emitting element 2 (light having a wavelength of 620 nm to 750 nm), GaAlAs, AlInGaP, or the like can be used.

Here, in the present invention, since a phosphor (fluorescent substance) is introduced into the sealing resin 7 (see FIG. 1) as will be described later, a nitride capable of emitting light with a short wavelength capable of exciting the phosphor efficiently. it is preferable to use a semiconductor _{(In X Al Y Ga 1-} X-Y N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1). For example, white light can be obtained by combining the blue light emitting element 2 and the yellow phosphor and mixing these light emission. However, the component composition, emission color, size, and the like of the light emitting element 2 are not limited to the above, and can be appropriately selected according to the purpose. Moreover, the light emitting element 2 can also be comprised with the element which outputs not only the light of a visible light range but an ultraviolet-ray and infrared rays. In order to increase the output, the number of light emitting elements 2 is preferably in the range of, for example, 10 or more and 20 to 150.

  As shown in FIG. 2, the light emitting elements 2 are arranged at equal intervals in the vertical direction and the horizontal direction on the mounting area 1a. Here, a total of 40 light emitting elements 8 × 5 horizontal elements are arranged. Yes. As shown in FIG. 2, the light emitting elements 2 are connected in series by electrically connecting the light emitting elements 2 adjacent to each other in the horizontal direction with respect to the mounting region 1a by a conductive wire W. Here, the series connection means a state in which the p-electrode 2a and the n-electrode 2b in the adjacent light-emitting elements 2 are electrically connected by a wire W as shown in FIG. Further, when FIG. 2 is viewed from the front, the light emitting element 2 located at the left end of the mounting region 1a and the wiring portions 3b and 4b, which are the conductive members 40, are electrically connected by the wires W. The light emitting element 2 located at the right end of the mounting region 1a and the relay wiring portion 8 are electrically connected by a wire W.

<Conductive members (positive electrode and negative electrode)>
The conductive member (metal member) 40 constitutes the positive electrode 3 and the negative electrode 4, and electrically connects the electronic components such as the plurality of light emitting elements 2 and the protective elements 5 on the substrate 1 to an external power source, This is for applying a voltage from an external power source to these electronic components. That is, the conductive member 40 (the positive electrode 3 and the negative electrode 4) plays a role as an electrode for energizing from the outside or a part thereof.

  As shown in FIG. 2, the positive electrode 3 and the negative electrode 4 have substantially rectangular pad portions (feeding portions) 3a and 4a and linear wiring portions 3b and 4b. The pad portions 3a and 4a The applied voltage is configured to be applied to the light emitting unit 20 including the plurality of light emitting elements 2 through the wiring units 3b and 4b. As shown in FIG. 2, a cathode mark CM indicating the cathode is formed on the wiring portion 4b of the negative electrode 4.

  The pad portions 3a and 4a are for applying a voltage from an external power source. As shown in FIG. 2, the pad portions 3 a and 4 a are formed in a pair at diagonal positions on the corners on the base material 1. The pad portions 3a and 4a are electrically connected to an external power source (not shown) by a conductive wire W.

  The wiring portions 3b and 4b are for transmitting the voltage applied to the pad portions 3a and 4a from the external power source to the light emitting element 2 on the mounting region 1a. As shown in FIG. 2, the wiring portions 3b and 4b are formed so as to extend from the pad portions 3a and 4a, and are formed in a substantially L shape around the mounting region 1a.

  Au is preferably used as the material of the conductive member 40 constituting the positive electrode 3 and the negative electrode 4. This is because, as will be described later, when Au having improved thermal conductivity is used as the material of the wire W, the wire W that is the same material can be firmly bonded.

  As a method for forming the conductive member 40 constituting the positive electrode 3 and the negative electrode 4, it is preferable to form the conductive member 40 by electrolytic plating or electroless plating similarly to the method for forming the metal film 30 on the mounting region 1 a described above. The thickness of the conductive member 40 constituting the positive electrode 3 and the negative electrode 4 is not particularly limited, and can be appropriately selected according to the purpose and application such as the number of wires W.

  Here, a part of the wiring portions 3b and 4b, that is, a part of the conductive member 40 is covered with a light reflecting resin 6 described later, as shown in FIGS. Therefore, even when the wiring portions 3b and 4b are formed of Au that easily absorbs light as described above, the light emitted from the light emitting element 2 does not reach the wiring portions 3b and 4b and is reflected by light. Reflected by the resin 6. Therefore, loss of emitted light can be reduced, and light extraction efficiency of the light emitting device 100 can be improved.

  Furthermore, by covering a part of the wiring portions 3b and 4b with the light reflecting resin 6, the wire W can be protected from dust, moisture, external force and the like. Here, as shown in FIG. 2, the part of the wiring portions 3b and 4b is formed around the mounting region 1a and along the side of the mounting region 1a in the wiring portions 3b and 4b. This means a portion where the wire W is connected. This also eliminates the need for the bonding region of the wire W between the light reflecting resin 6 and the light emitting element 2, and the light reflecting resin 6 can be disposed near the light emitting element 2. Therefore, the amount of the phosphor 9 (see FIG. 3) between the light reflecting resin 6 and the light emitting element 2 can be further reduced.

<Relay wiring section>
The relay wiring part 8 is for relaying the wiring between the positive electrode 3 and the negative electrode 4. As shown in FIG. 2, the relay wiring portion 8 is composed of a conductive member (metal member) on the base material 1. As shown in FIG. 2, the relay wiring portion 8 is formed in a straight line around one side of the mounting area 1a, that is, the right side, around the mounting area 1a.

  As shown in FIG. 2, the relay wiring portion 8 is covered with a light reflecting resin 6. Therefore, as will be described later, even when Au that easily absorbs light is used as the conductive member constituting the relay wiring portion 8, the light emitted from the light emitting element 2 does not reach the relay wiring portion 8. Reflected by the light reflecting resin 6. Therefore, loss of emitted light can be reduced, and light extraction efficiency of the light emitting device 100 can be improved. Furthermore, by covering the relay wiring part 8 with the light reflecting resin 6, the relay wiring part 8 can be protected from dust, moisture, external force and the like.

  As with the positive electrode 3 and the negative electrode 4, it is preferable to use Au as the material of the conductive member constituting the relay wiring portion 8. This is because, as will be described later, when Au having improved thermal conductivity is used as the material of the wire W, the wire W that is the same material can be firmly bonded.

  As a method for forming the conductive member constituting the relay wiring portion 8, it is preferable to form the conductive member by electrolytic plating or electroless plating similarly to the positive electrode 3 and the negative electrode 4. In addition, the thickness of the electrically conductive member which comprises the relay wiring part 8 is not specifically limited, According to the objectives and uses, such as the number of the wires W, it can select suitably.

<Protective element>
The protection element 5 is an element for protecting the light emitting unit 20 including the plurality of light emitting elements 2 from element destruction and performance deterioration due to excessive voltage application. Specifically, the protection element 5 is a Zener diode that is energized when a voltage higher than a specified voltage is applied. Although not shown, the protective element 5 is a semiconductor element having a p-electrode and an n-electrode like the light-emitting element 2 described above, and is antiparallel to the p-electrode 2a and the n-electrode 2b of the light-emitting element 2. Thus, the wire W is electrically connected to the wiring portion 4 b of the negative electrode 4.

<Frame (light reflecting resin)>
The light reflecting resin 6 that is a light reflective frame is for reflecting the light emitted from the light emitting element 2. As shown in FIG. 2, the light reflecting resin 6 is formed so as to cover a part of the wiring portions 3b and 4b, the relay wiring portion 8, the protection element 5, and the wires W connected thereto. Therefore, even when the wiring portions 3b and 4b, the relay wiring portion 8 and the wire W are formed of Au that easily absorbs light as described above or later, light emitted from the light emitting element 2 is transmitted to the wiring portion 3b. , 4b, the relay wiring portion 8 and the wire W are not reflected and are reflected by the light reflecting resin 6. Therefore, loss of emitted light can be reduced, and light extraction efficiency of the light emitting device 100 can be improved. Further, by covering a part of the wiring parts 3b and 4b, the relay wiring part 8, the protection element 5 and the wire W connected thereto with the light reflecting resin 6, these members are protected from dust, moisture, external force and the like. be able to. Further, by disposing the light reflecting resin 6 at a position covering the bonding region of the wire W, it becomes unnecessary to secure a bonding region of the wire W between the light reflecting resin 6 and the light emitting element 2. Can be arranged near the light emitting element 2.

  As shown in FIGS. 1 and 2, the light reflecting resin 6 is preferably formed in a square frame shape so as to surround the mounting region 1 a where the light emitting portion 20 is formed on the substrate 1. By forming the light reflecting resin 6 so as to surround the periphery of the mounting region 1 a in this way, the light reflecting toward the periphery of the mounting region 1 a of the substrate 1 can also be reflected by the light reflecting resin 6. Therefore, loss of emitted light can be reduced, and light extraction efficiency of the light emitting device 100 can be improved.

  Further, as shown in FIG. 2, the light reflecting resin 6 is preferably formed so as to cover a part of the periphery of the mounting region 1a. Thus, the base material 1 was exposed between the wiring parts 3b and 4b and the metal film 30 on the mounting region 1a by forming the light reflecting resin 6 so as to cover a part of the periphery of the mounting region 1a. No region is formed. Therefore, since all the light emitted from the light emitting element 2 can be reflected in the inner region where the light reflecting resin 6 is formed, the loss of the emitted light can be reduced to the maximum, and the light emitted from the light emitting device 100 can be reduced. The taking-out efficiency can be further improved. The light reflecting resin 6 is formed higher than the light emitting element 2.

Next, the shape of the light reflecting resin 6 will be described.
As shown in FIG. 3 and FIG. 4B, the light reflecting resin 6 that is a frame is curved in a convex shape at least above the phosphor region 10a (hereinafter, referred to as the first phosphor region 10a as appropriate) The substrate 1 is provided on the base material 1 by being curved in a concave shape continuously with the convex curved portion. That is, the light-reflecting resin 6 has a cross-sectional shape in the lateral direction (width direction) (for example, the XX cross-section in FIG. 1), the upper part on the inner side thereof has a substantially elliptical arc shape, and the lower part on the inner side thereof. The protrusion 6a is formed so as to expand toward the base material 1 and protrude toward the light emitting element 2 side. The first phosphor region 10a is in contact with the concave curved portion, and the phosphor 9 is deposited in the recess. Further, since the upper part inside the light reflecting resin 6 is curved in a convex shape, as will be described later, the phosphor 9 that has settled in the sealing resin 7 adheres to the curved portion, and the phosphor region 10b ( Hereinafter, the second phosphor region 10b is formed as appropriate. In these phosphor regions 10 a and 10 b, for example, the phosphor 9 is present at a higher concentration than other regions in the sealing resin 7, specifically, sites that are floating in the sealing resin 7. .

  Here, in FIGS. 3 and 4B, the outer side of the frame of the light reflecting resin 6 has the same shape as the inner side, but the phosphor 9 is sealed in the inside of the light reflecting resin 6. Since it is contained in the stopping resin 7, at least the inner side of the light reflecting resin 6 only needs to have such a shape. The degree of curvature is not particularly limited. For example, in the light reflecting resin 6 having a width of about 1000 μm and a height of about 550 μm, the convex curved portion is 220 μm at a curvature radius or an approximate curvature radius. ˜320 μm, and the concave curved portion can be 20 μm to 40 μm. In terms of the ratio with respect to the width of the light reflecting resin 6, the convex curved portion can be 22% to 32% and the concave curved portion can be 2% to 4% with a curvature radius or an approximate curvature radius. . Furthermore, the distance between the light emitting element 2 and the tip of the protruding portion 6a is not particularly limited, but may be, for example, 150 μm to 600 μm. In this way, the amount of the phosphor 9 in the first phosphor region 10a and the second phosphor region 10b is adjusted by adjusting the curvature radius of the curved portion and the distance between the light emitting element 2 and the tip of the protruding portion 6a. can do. Note that the shape of the light reflecting resin 6 may be any shape that satisfies the configuration of the present invention. For example, the shape shown in FIG. 3 or the shape shown in FIG. 6 (c) and a shape as shown in FIG.

As a material of the light reflecting resin 6, an insulating material is preferably used. Moreover, in order to ensure a certain amount of strength, for example, a thermosetting resin, a thermoplastic resin, or the like can be used. More specifically, a phenol resin, an epoxy resin, a BT resin, PPA, a silicon resin, etc. are mentioned. In addition, a reflective member (for example, TiO ₂ , Al ₂ O ₃ , ZrO ₂ , MgO) or the like that hardly absorbs light from the light-emitting element 2 and has a large refractive index difference with respect to the base resin is used in the base resin. By dispersing this powder, light can be reflected efficiently. The size of the light reflecting resin 6 is not particularly limited, and can be appropriately selected according to the purpose and application.

<Sealing resin>
The sealing resin (sealing member) 7 contains the phosphor 9 and is a member for protecting the light emitting element 2 and the wires W arranged on the base material 1 from dust, moisture, external force and the like. is there. As shown in FIGS. 1 and 2, the sealing resin 7 is formed by filling the mounting region 1 a surrounded by the light reflecting resin 6 on the base material 1.

  As the material of the sealing resin 7, a material having translucency capable of transmitting light from the light emitting element 2 is preferable. Specific examples of the material include silicon resin, epoxy resin, and urea resin. In addition to such materials, a colorant, a light diffusing agent, a filler, and the like can be contained as desired.

  The sealing resin 7 can be formed of a single member, or can be formed as a plurality of layers of two or more layers. The filling amount of the sealing resin 7 may be an amount that covers the light emitting element 2, the wire W, and the like disposed in the mounting region 1 a surrounded by the light reflecting resin 6. Further, when the sealing resin 7 has a lens function, the surface of the sealing resin 7 may be raised so as to have a bullet shape or a convex lens shape.

  Here, on the base material 1, it has the fluorescent substance area | region (1st fluorescent substance area) 10a in which the fluorescent substance 9 was deposited. The first phosphor region 10 a is disposed at least between the light emitting element 2 and the frame (light reflecting resin) 6. Furthermore, it has a phosphor region (second phosphor region) 10b in which the phosphor 9 is attached to the inner surface of the frame of the light reflecting resin 6, that is, the convex curved portion inside the light reflecting resin 6, and The phosphor 9 is deposited on the concave curved portion. That is, the phosphor 9 is deposited on the protruding portion 6a which is a concave curved portion. Here, the phosphor regions 10a and 10b are regions where a plurality of particles of the phosphor 9 are formed densely. In addition, the 2nd fluorescent substance area | region 10b should just be formed in at least one part. That is, it may be formed on the entire convex curved portion, or may be formed only on a part. Depending on the amount of the phosphor 9 and the radius of curvature of the convex curved portion, a portion where the phosphor 9 does not adhere may occur. However, even if the phosphor 9 is partially formed, the light-emitting element 2 and the light reflection This is because it is possible to reduce the amount of the phosphor 9 on the substrate 1 between the resin 6. Further, “attachment” includes not only the case where the phosphor 9 is formed of two or more layers on the convex curved portion, but also the case where the phosphor 9 is formed of one layer. That is, the second phosphor region 10b only needs to be formed in one or more layers in the convex curved portion, and the formation portion may be a part of the convex curved portion, or the entire surface. There may be. The “part” includes the case of a plurality of places in addition to the case of one place of a convex curved portion.

  Moreover, it is preferable that the 2nd fluorescent substance area | region 10b of a convex curved part is formed thinner than the 1st fluorescent substance area | region 10a on the base material 1 between the light emitting element 2 and the light reflection resin 6. FIG. Here, the second phosphor region 10b of the convex curved portion has a thickness in which about several particles of the phosphor 9 are adhered in a cross-sectional view, specifically, as shown in FIG. The thickness of the phosphor 9 is preferably about 1 to 2 particles. The thickness of the second phosphor region 10b is preferably 50 μm or less. As described above, by adjusting the thickness of the second phosphor region 10b, the amount of the phosphor 9 in the convex curved portion and the amount of the phosphor 9 between the light emitting element 2 and the light reflecting resin 6 can be adjusted. It can be made more reasonable. And the fluorescent substance 9 of the side surface side of the light emitting element 2 can be made more moderate amount. Moreover, since the intensity | strength of the light by which wavelength conversion is increased by this when the thickness of the 2nd fluorescent substance area 10b of a convex curved part becomes thick, the 2nd fluorescent substance area 10b of a convex curved part is the base material 1. It is preferable to make it thinner than the first phosphor region 10a above, and more preferably, the above-described thickness. Moreover, by setting it as such thickness, the light reflection resin 6 can efficiently reflect the light emitted from the light emitting element 2 and the wavelength converted light by the phosphor 9, and the light extraction efficiency to the outside of the light emitting device 100 can be improved. it can.

  As shown in FIG. 4B, the first phosphor region 10a is preferably provided so as to continuously cover the side surface and the upper surface of the light emitting element 2. That is, it is preferable that the side surface and the upper surface of the light emitting element 2 are covered with the phosphor 9, and the phosphor 9 is continuously integrated to form the first phosphor region 10a. As described above, the phosphor 9 can continuously convert the wavelength of the light emitted from the light emitting element 2 by continuously covering the side surface and the upper surface of the light emitting element 2 with the phosphor 9.

Next, the relationship between the shape of the light reflecting resin 6 and the phosphor 9 and the phosphor regions 10a and 10b will be described with reference to FIG.
FIG. 4A shows an example in which the light reflecting resin 60 is formed using a high-viscosity resin that is difficult to spread on the substrate 1 and is easily formed to provide a dam for blocking the sealing resin 7. . As shown in FIG. 4A, the light reflecting resin 60 has a shape whose viscosity is lower than that of the resin that forms the light reflecting resin 60 in the upper part inside the light reflecting resin 60 (above the first phosphor region 10a). Compared to the shape of the light reflecting resin 6 in FIG. 4B, the inclination is steep and the convex curve is less, and the inner lower part (the part in contact with the first phosphor region 10a) is concavely curved. If not, the phosphor 9 that has settled in the sealing resin 7 is deposited on the substrate 1 between the light emitting element 2 and the light reflecting resin 6 without adhering to the surface of the light reflecting resin 6. Even if the phosphor 9 may adhere to the upper portion, the amount thereof is small compared to the case of the shape of FIG. 4B, and therefore the phosphor 9 in the first phosphor region 10a has a small amount. There is almost no effect of reducing the amount. On the other hand, as shown in FIG. 4 (b), the shape of the light reflecting resin 6 is inclined in the upper portion inside (above the first phosphor region 10a) as compared with the shape of FIG. 4 (a). Is curved in a convex shape and is concavely curved in the inner lower part (the portion in contact with the first phosphor region 10a), the phosphor 9 that has settled in the sealing resin 7 reflects light. The second phosphor region 10b is formed by adhering to the surface of the resin 6, that is, the convex curved portion, and is deposited on the substrate 1 between the light emitting element 2 and the light reflecting resin 6, and the first phosphor Region 10a is formed.

  Thus, since the phosphor 9 adheres to the surface of the light reflecting resin 6, that is, the convex curved portion, the amount of the phosphor 9 deposited between the light emitting element 2 and the light reflecting resin 6 is reduced. Therefore, the intensity of the wavelength-converted light of the phosphor 9 between the light emitting element 2 and the light reflecting resin 6 can be suppressed, and color unevenness (yellow phosphor) near the outer periphery of the irradiated surface when the light emitting device 100 emits light. When yellow is used, yellow ring) is suppressed. Further, since the content ratio of the phosphor 9 with respect to the entire sealing resin 7 is constant, the lower portion of the light reflecting resin 6 is formed so as to spread as it approaches the base material 1, and the protruding portion 6 a that is a concavely curved portion is formed. By providing, compared with the case where there is no concavely curved portion, that is, when there is no protrusion 6a, the amount of the sealing resin 7 is reduced by the amount of the protrusion 6a, and the amount of the phosphor 9 is also reduced. The

<Phosphor>
The sealing resin 7 contains a phosphor (fluorescent member) that emits light having a different wavelength by absorbing at least part of the light from the light emitting element 2 as a wavelength conversion member. As a fluorescent substance, what converts the light from the light emitting element 2 into a longer wavelength is preferable. In addition, as the phosphor, one kind of phosphor (fluorescent substance) may be used, or a mixture of two or more kinds of phosphors (fluorescent substance) may be used.

  As the phosphor material, for example, a YAG phosphor mixed with yttrium, aluminum and garnet, a nitride phosphor or an oxynitride phosphor mainly activated by a lanthanoid element such as Eu or Ce is used. be able to.

<Wire>
The wire W is a conductive wiring for electrically connecting electronic components such as the light emitting element 2 and the protection element 5 to the positive electrode 3, the negative electrode 4, the relay wiring portion 8, and the like. Examples of the material of the wire W include those using metals such as Au, Cu (copper), Pt (platinum), and Al (aluminum), and alloys thereof, and in particular, excellent in thermal conductivity and the like. It is preferable to use Au. In addition, the diameter of the wire W is not specifically limited, It can select suitably according to the objective and a use.

  Here, the connection part of the wire W and the positive electrode 3, the negative electrode 4, and the relay wiring part 8 is covered with the light reflection resin 6, as shown in FIG. Therefore, as described above, even when Au that easily absorbs light is used as the material constituting the wire W, the light emitted from the light emitting element 2 is not absorbed by the wire W and is reflected by the light reflecting resin 6. Is reflected by. Therefore, loss of emitted light can be reduced, and light extraction efficiency of the light emitting device 100 can be improved. Further, by covering the connecting portion between the wire W and the positive electrode 3, the negative electrode 4 and the relay wiring portion 8 with the light reflecting resin 6, the wire W can be protected from dust, moisture, external force and the like. The light extracted from the light emitting device 100 is light extracted from the surface of the sealing resin 7 surrounded by the light reflecting resin 6. That is, when viewed from the light emitting device 100, the surface of the sealing resin 7 becomes a light emitting surface.

≪Method for manufacturing light emitting device≫
Next, a method for manufacturing a light emitting device according to an embodiment of the present invention will be described with reference to the drawings as appropriate, taking the embodiment of FIGS.

The method for manufacturing the light emitting device 100 according to the present invention includes a die bonding step, a light reflecting frame forming step, and a sealing resin filling step. Moreover, as a premise of this manufacturing method, the base material preparation process is included before the die bonding process. Furthermore, here, a plating process, a wire bonding process, and a protective element bonding process are included.
Hereinafter, each step will be described. Note that since the configuration of the light emitting device 100 is as described above, the description thereof will be omitted as appropriate.

<Base material production process>
The base material manufacturing process is a process of manufacturing the base material 1 on which the wiring for plating is formed. In the base material manufacturing step, the mounting region 1a on the base material 1 and the portions to be the positive electrode 3 and the negative electrode 4 are formed by patterning into a predetermined shape. Further, in the base material manufacturing step, a plating wiring for forming the metal film 30 on the mounting region 1a on the base material 1 is formed by electrolytic plating.

<Plating process>
The plating step is a step of forming the conductive member 40 constituting at least the positive electrode 3 and the negative electrode 4 on the base material 1 on which the plated wiring is formed, and preferably the positive electrode 3 and the negative electrode 4 are constituted by electroless plating. In this process, the conductive member 40 is formed and the metal film 30 is formed on the mounting region 1a on the substrate 1 by electrolytic plating. Further, the conductive member constituting the relay wiring portion 8 is formed in the same process as that for forming the positive electrode 3 and the negative electrode 4.

As a specific method of plating, for example, a method of performing Au plating on both the positive electrode 3, the negative electrode 4 and the relay wiring portion 8 and the metal film 30 on the mounting region 1 a, a positive electrode 3, a negative electrode 4 and a relay wiring portion 8 are used. And a method of performing Au plating on the mounting region 1a, and the like. In the case where the metal film 30 is not formed, there is a method in which only the positive electrode 3, the negative electrode 4, and the relay wiring portion 8 are plated with Au, and the metal film 30 on the mounting region 1 a is not formed. Further, on the mounting region 1a, it is preferable to further form a TiO ₂ film on the surface of Au or Ag when performing Au plating or Ag plating, or directly on the surface of the base material 1 when not performing plating.

<Die bonding process>
The die bonding process is a process of placing the light emitting element 2 on the substrate 1. The die bonding process includes a light emitting element mounting process and a heating process.

[Light emitting element mounting process]
The light emitting element mounting step is a step of mounting the light emitting element 2 on the base material 1 (here, on the metal film 30) via a bonding member (not shown).
The light emitting element 2 is joined to the metal film 30 on the substrate 1 by a joining member. Note that a flux may be applied to the back surface of the light emitting element 2 in advance. Here, since the joining member may be provided so as to be interposed between the metal film 30 and the light emitting element 2, the joining member may be provided in a region where the light emitting element 2 is placed in the metal film 30. It may be provided on the second side. Or you may provide in both.

  When a liquid or paste-like joining member is provided on the metal film 30, it can be appropriately selected from methods such as a potting method, a printing method, and a transfer method according to the viscosity and the like. And the light emitting element 2 is mounted in the location which provided the joining member. In addition, also when using a solid joining member, after mounting a solid joining member, the light emitting element 2 is mounted on the metal film 30 in the same way as the case where a liquid or paste-like joining member is used. be able to. In addition, the solid or paste-like joining member may be once melted by heating or the like to fix the light emitting element 2 at a desired position on the metal film 30.

[Heating process]
A heating process is a process of heating a joining member after mounting light emitting element 2, and joining light emitting element 2 on substrate 1 (on metal film 30).
The joining member may be an insulating member, and the heating in the heating step is performed at a temperature higher than a temperature at which at least a part of the joining member volatilizes. Moreover, when a joining member contains a thermosetting resin, it is preferable to heat more than the temperature at which hardening of a thermosetting resin occurs. By doing in this way, the light emitting element 2 can be adhere | attached and fixed with a thermosetting resin. Further, when a resin composition containing, for example, rosin and a low melting point metal are used as the bonding member, when the low melting point metal is placed on the metal film 30, the low melting point metal is used. It is preferable to heat above the temperature at which the metal melts.

Further, in the heating step, a cleaning step can be further performed following the heating.
For example, when a resin composition is used for the joining member, after the resin composition is partially evaporated by heating, the remaining resin composition may be further removed by washing or the like (residual joining member washing) Process). In particular, when the resin composition contains rosin, it is preferably washed after heating. As the cleaning liquid, it is preferable to use a glycol ether organic solvent or the like.

<Protective element bonding process>
The protective element bonding step is a step in which the protective element 5 is placed on and bonded to the wiring portion 3 b of the positive electrode 3.
The bonding of the protective element 5 may be performed simultaneously with the bonding of the light emitting element 2, but may be performed before or after the bonding of the light emitting element 2. Since the method for mounting and bonding the protective element 5 is the same as that in the die bonding step, description thereof is omitted here.

<Wire bonding process>
The wire bonding step is a step of electrically connecting the light emitting element 2 and the conductive member 40 that applies a voltage to the light emitting element 2 by the wire W after the die bonding step. That is, it is a step of electrically connecting the positive electrode 3 of the conductive member 40 and the electrode terminal (pad electrode) on the light emitting element 2 with the wire W. Similarly, this is a step of electrically connecting the electrode terminal (pad electrode) on the light emitting element 2 and the negative electrode 4 of the conductive member 40 with a wire W. Further, in this step, the plurality of light emitting elements 2 are connected to each other through electrode terminals (pad electrodes). Further, the electrical connection between the protective element 5 and the negative electrode 4 may be performed in this step. That is, the electrode terminal on the upper side of the protection element 5 and the negative electrode 4 are connected by the wire W. The connection method of the wire W is not particularly limited, and may be a commonly used method.

<Light reflecting resin formation process>
The light reflecting resin forming step is a step of providing a light reflecting frame (light reflecting resin) 6 around the light emitting element 2. Here, after the wire bonding step, along the peripheral edge of the mounting region 1a, the wire of the conductive member 40 that is a part of the conductive member 40, that is, at least a part of the wiring portions 3b and 4b of the positive electrode 3 and the negative electrode 4. In this step, the light reflecting resin 6 is formed so as to cover the connection portion with W.
In this step, the light-reflective frame (light-reflecting resin) 6 is curved in a convex shape at least at the upper portion inside thereof, and is curved in a concave shape continuously at the convex portion at the inner portion thereof. Formed on the substrate 1. That is, the light reflecting resin 6 is formed so as to be curved in a convex shape at least above the first phosphor region 10a and to be curved in a concave shape in a portion in contact with the first phosphor region 10a.

  Such a shape can be controlled by utilizing a capillary phenomenon depending on the viscosity of the resin and the roughness of the surface of the substrate 1 (here, the surface of the metal film 30). When the viscosity of the resin is large or the roughness of the surface of the metal film 30 is small, as shown in FIG. The lower part of the reflection resin 60 does not curve in a concave shape, and the slope becomes steep above the first phosphor region 10a, so that the convex curve is small. On the other hand, when the viscosity of the resin is small or the roughness of the surface of the metal film 30 is large, as shown in FIG. 4B, the light reflecting resin 6 is inclined at least above the first phosphor region 10a. Becomes loose, is greatly curved in a convex shape, and the lower part of the light reflecting resin 6 is curved in a concave shape continuously with the convex curved portion. It should be noted that the conditions for the shape of the present invention, such as the viscosity of the resin and the roughness of the base material 1 (metal film 30), vary depending on the resin material and the manufacturing conditions (temperature, humidity, etc.). However, it may be adjusted appropriately at the time of manufacture.

The light reflecting resin 6 is formed using, for example, a resin discharging device (not shown) that can be moved (moved) in the vertical direction or the horizontal direction with respect to the base material 1 above the fixed base material 1. (See JP 2009-182307 A).
That is, the light reflecting resin 6 is formed so as to cover a part of the periphery of the mounting region 1a by moving the resin discharging device filled with the resin while discharging the liquid resin from the nozzle at the tip thereof. The moving speed of the resin discharge device can be adjusted as appropriate according to the viscosity and temperature of the resin used. In order for the formed plurality of light reflecting resins 6 to have substantially the same width, it is preferable to move the resin at a constant speed at least during discharging. For example, when the discharge of the resin is temporarily interrupted during the movement, the moving speed during that time can be changed. The amount of resin discharged is also preferably constant. Furthermore, it is preferable that both the moving speed of the resin discharge device and the discharge amount of the resin be constant. The discharge amount can be adjusted by making the pressure applied during the discharge constant.

<Sealing member filling process>
The sealing member filling step is a step of filling the sealing resin containing the phosphor 9 inside the frame (light reflecting resin) 6. That is, a translucent sealing resin 7 that covers the light emitting element 2, the metal film 30, the wire W, and the like is placed inside the frame (wall portion) made of the light reflecting resin 6 formed on the substrate 1. It is a step of forming by pouring and then curing by heating, light irradiation or the like.

  In this step, the phosphor 9 is allowed to settle, and the phosphor 9 is deposited on the substrate 1 (here, the metal film 30), is deposited also on the concave curved portion, and adheres to the convex curved portion. That is, the phosphor 9 is deposited on the substrate 1 to form the first phosphor region 10 a at least between the light emitting element 2 and the light reflecting resin 6, and the concave curved portion is deposited with the phosphor 9. In addition, the second phosphor region 10b is formed by attaching the phosphor 9 to the inner surface of the light reflecting resin 6, that is, the convex curved portion. In addition, here, the fluorescent material 9 (that is, the second fluorescent material region 10 b) having a convex curved portion is arranged so that the fluorescent material 9 (that is, the first fluorescent material 9 on the base material 1 between the light emitting element 2 and the frame (light reflecting resin) 6). It is formed thinner than one phosphor region 10a).

  Specifically, the resin and the phosphor 9 are mixed and injected into the inside of the frame (wall portion) made of the light reflecting resin 6. The phosphor 9 in the resin settles downward due to gravity, and phosphor regions 10a and 10b in which the phosphor 9 is accumulated are formed on the surface of the base material 1 (metal film 30) and the convex curved portion. At this time, by appropriately adjusting the curvature radius of the convex curved portion and the distance between the light emitting element 2 and the tip of the protruding portion 6a by the viscosity of the resin, the roughness of the base material 1 (metal film 30), and the like. The amount of the phosphor 9 in the first phosphor region 10a and the second phosphor region 10b is adjusted. And sealing resin 7 is formed by hardening by heating, light irradiation, etc. after that.

As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment, It can change in the range which does not deviate from the meaning of this invention.
That is, the form of the light emitting device described above exemplifies the light emitting device for embodying the technical idea of the present invention, and the present invention does not limit the light emitting device to the above form. Moreover, the member etc. which are shown by a claim are not specified as the member of embodiment. In particular, the dimensions, materials, shapes, relative arrangements, and the like of the components described in the embodiments are not intended to limit the scope of the present invention only to the extent that there is no specific description. It is just an example.
For example, it is good also as the following structures as other embodiment.

[Other Embodiments]
With reference to FIG. 5, the light-emitting device 101 which concerns on other embodiment is demonstrated. In addition, the same code | symbol is attached | subjected about the thing same as the light-emitting device 100 mentioned above, and only a different point is demonstrated below below.
As shown in FIG. 5, the mounting area 1 a has a substantially rectangular shape in the light emitting device 100, whereas the mounting area 1 a has a circular shape in the light emitting apparatus 101. A plurality of light emitting elements 2 are placed on the circular mounting region 1a. The light reflecting resin 6 is formed in a circular shape so as to surround the mounting region 1 a where the light emitting part 20 is formed on the substrate 1. Further, the light reflecting resin 6 is formed so as to cover a part of the wiring portions 3b and 4b, the protection element 5 and the wire W connected thereto. In addition, code | symbol AM is an anode mark which shows that the pad part 3a is the positive electrode 3, code | symbol 70 is the recognition mark for recognizing the bonding position of the light emitting element 2, and code | symbol 80 is the temperature measurement point of the light-emitting device 101, These are also formed by plating or the like.

Next, regarding the shape of the light reflecting resin 6, another method of forming the light reflecting resin 6 will be described with reference to FIGS.
About the shape of the light reflection resin 6, in the manufacturing method of the light-emitting device 100 described above, by adjusting the viscosity of one kind of resin or adjusting the roughness of the surface of the base material 1 (metal film 30), The light reflecting resin 6 having the convex portions and the concave portions as described above was formed. As described above, if the light reflecting resin 6 is formed of one kind of resin, the resin drawing process is completed once. Therefore, it is preferable that the light reflecting resin 6 is formed of one kind of resin. However, the light reflecting resin 6 having such a shape can be formed by using two types of resins having different viscosities as in the following two methods.

  The first method will be described with reference to FIG. First, the low-viscosity resin 16a is applied to the position where the light reflecting resin 6 is formed (FIG. 6A). Next, a high-viscosity resin 16b is applied onto the resin 16a ((FIG. 6 (b)), and then the resins 16a and 16b are cured, but it is preferable that they are cured at the same time. 16b becomes an integrated light reflecting resin 6 (FIG. 6C) According to such a method, since the resin a has a low viscosity and easily spreads, a large protrusion 6a (see FIG. 4) is formed. Further, by forming the high-viscosity resin 16b on this, it is possible to easily obtain the height required as a dam for damming the sealing resin 7. It is to be noted that only the resin 16a has the same height. 6 (a), the width becomes very large and the size of the light emitting devices 100 and 101 increases, and the resin 16b alone has a high viscosity. Because of the dripping resin Not spread on fried substrate 1, the protrusion is not easily formed.

  Next, a second method will be described with reference to FIG. First, a high-viscosity resin 16b is applied to a position where the light reflecting resin 6 is formed (FIG. 7A). Next, a low-viscosity resin 16a is applied to the surface of the resin 16b (FIG. 7B). Thereafter, the resins 16a and 16b are cured, so that the light reflecting resin 6 in which the resins 16a and 16b are integrated is obtained. Although the case where the resin 16a is applied to both sides of the resin 16b, that is, the outer side and the inner side of the frame is illustrated here, the resin 16a is applied only to the inner side of the resin 16b, and the convex curved portion and the concave shape are applied only to the inner side. It is good also as a shape which has a curved part.

  In addition, although the case where a substrate is used as the base material 1 has been described here, the base material 1 may be a resin package or the like. In the light emitting devices 100 and 101, a plurality of the light emitting elements 2 are mounted. However, the number of the light emitting elements 2 is not limited and may be one or more. Furthermore, although the case where a face-up (FU) element is used as the light-emitting element 2 is described here, a face-down (FD) element or an element having a counter electrode structure may be used. Depending on the form of the light emitting element or the light emitting device, the conductive member 40, the protective element 5, the wire W, the metal film 30, the relay wiring portion 8 and the like may not be provided. The manufacturing method may not include a plating step, a wire bonding step, a protective element bonding step, and the like.

  Furthermore, in the method for manufacturing a light emitting device, in carrying out the present invention, steps other than the steps described above may be included between or before and after the respective steps within a range that does not adversely affect the respective steps. For example, other processes such as a substrate cleaning process for cleaning the substrate, an unnecessary object removing process for removing unnecessary substances such as dust, a mounting position adjusting process for adjusting the mounting position of the light emitting element and the protective element, etc. May be included.

1 Base material (substrate)
DESCRIPTION OF SYMBOLS 1a Mounting area | region 2 Light emitting element 2a P electrode 2b N electrode 3 Positive electrode 3a Pad part 3b Wiring part 4 Negative electrode 4a Pad part 4b Wiring part 5 Protection element 6 Frame (light reflecting resin)
6a Projecting part 7 Sealing resin 8 Relay wiring part 9 Phosphor 10a Phosphor area (first phosphor area)
10b Phosphor region (second phosphor region)
16a, 16b Resin 20 Light emitting portion 30 Metal film 40 Conductive member 60 Frame (light reflecting resin)
70 Recognition mark 80 Temperature measurement point 100, 101 Light emitting device AM Anode mark CM Cathode mark W Wire

Claims (8)

A light emitting device comprising: a light emitting element; a light reflective frame disposed around the light emitting element; and a sealing resin containing a phosphor filled inside the frame on a flat substrate. A device,
A first phosphor region in which the phosphor is deposited is provided on the substrate, and the first phosphor region is disposed at least between the light emitting element and the frame,
The inner surface of the frame is curved in a convex shape at least above the first phosphor region, and is curved in a concave shape continuously to the convex curved portion, and is provided on the base material.
Further, the light emitting device has a second phosphor region to which the phosphor is attached to the convex curved portion, and the phosphor is deposited on the concave curved portion.   The light emitting device according to claim 1, wherein the second phosphor region is formed thinner than the first phosphor region.   Furthermore, a conductive member for applying a voltage to the light emitting element is provided on the base material, the light emitting element and the conductive member are electrically connected by a conductive wire, and the conductive member is connected to the wire. The light emitting device according to claim 1, wherein a connection portion is covered with the frame.   4. The light emitting device according to claim 1, wherein the first phosphor region further covers a side surface and an upper surface of the light emitting element continuously. 5.   The light emitting device according to any one of claims 1 to 4, wherein a plurality of the light emitting elements are mounted on the base material. A die bonding step of placing a light emitting element on a flat substrate;
A light reflecting frame forming step of providing a light reflecting frame around the light emitting element;
A sealing resin filling step of filling a sealing resin containing a phosphor inside the frame,
In the light reflecting frame forming step, the light reflecting frame is curved in a convex shape at least at an upper portion inside thereof, and is bent in a concave shape continuously at the convex portion at the inner lower portion thereof. Formed into the material,
In the sealing resin filling step, the phosphor is allowed to settle, the phosphor is deposited on the base material, adheres to the convex curved portion, and deposits the phosphor on the concave curved portion. A method for manufacturing a light-emitting device.   The said sealing resin filling process WHEREIN: The fluorescent substance of the said convex curved part is formed thinner than the fluorescent substance on the said base material between the said light emitting element and the said frame. The manufacturing method of the light-emitting device of description.   After the die bonding step, the method includes a wire bonding step of electrically connecting the light emitting element and a conductive member for applying a voltage to the light emitting element by a conductive wire, and in the light reflecting frame forming step, 8. The method of manufacturing a light emitting device according to claim 6, wherein the frame is formed so as to cover a connection portion of the conductive member with the wire.