JP2019197921A - Substrate processing device, substrate carrier, and substrate processing system - Google Patents

Abstract

To achieve simplification and high speed in a system that moves substrates to different process modules carrying out various process steps, with respect to ability to provide higher cleanliness within a carrier and across an interface.SOLUTION: A substrate processing system of the present application includes: a load port configured for allowing access to a processing environment of a substrate processing apparatus through at least one sealable load port opening that is sealable with a load port door, the at least one sealable load port opening being disposed in a load port opening plane; and a load port BOLTS interface located substantially along and defining the load port opening plane and defining the load port opening plane, and configured to interface with a side of a carrier on which a carrier opening is located.SELECTED DRAWING: Figure 21

Description

  The disclosed embodiments relate to an interface system for reducing particle contamination of a substrate during processing.

  This application includes US Provisional Application No. 60 / 930,634, filed May 17, 2007, US Provisional Application No. 61 / 024,152, filed January 28, 2008, and 2008. Claiming the benefit of US Provisional Patent Application No. 61 / 043,097, filed on April 7, 2007, and US Provisional Patent Application No. 60 / 916,912, filed May 9, 2007 The disclosure content of the above application is incorporated herein as part of this specification.

  In the semiconductor industry, it is desired to shorten the cycle time of a wafer via FAB, to reduce the quantity of work in progress (WIP), and to improve the safety of the wafer. Traditionally, the physical interface between the carrier and the load port is a multi-step process with up to six mechanisms for performing carrier loading and unloading operations. In this environment, load port cycle times range from, for example, 12 to 18 seconds, depending on the manufacturer, and can reach 2 million cycles over a 7 year service life in extreme applications. Conventionally, a lot size of 25 wafers in a carrier is used to optimize tool utilization and minimize the impact of tool settings and wafer handling overhead. In conventional semiconductor manufacturing, an emphasis has generally been placed on flowing high-capacity product types with a low mixing rate to the production line. On the other hand, the actual manufacturing environment tends to shift to a configuration with multiple product types that include both high and low capacity. Basically, changes in the semiconductor business model are driving FAB managers to minimize inventory and shorten manufacturing cycle times. The latter is greatly affected by the lot size in the wafer carrier. Some suggest that if the lot size is less than 13 wafers, a substantial gain in cycle time can be realized. One goal of this approach is to push the lot size down to, for example, one wafer. The realization of a single wafer may be ideal in theory, but the current state of the process tool structure does not correspond to the degree of recipe change associated with the realization of a single wafer, Setting time becomes longer. In some tools, the set time may be equal to or longer than the processing time for one wafer, and the original intention is negated. Also, because the characterization of advanced process tools is complex, it is desirable to confirm that the process is operating within specifications with several test or qualified wafers. These non-product wafers may be used and handled in conjunction with a single wafer strategy.

  Lot size reduction of multiple wafer lots can be effectively used to boost a single wafer strategy. However, as can happen, changing the carrier lot size has a corresponding effect on the design of the load port. Specifically, the load port cycle time may be generally linearly proportional to the lot size. For example, in order not to limit the throughput of the process tool, if the cycle time for a lot of 25 wafers is 12 seconds, a cycle time of 2.4 seconds can be used for a lot of 5 wafers. Recalculating the service life of the load port with a reduced cycle time yields 10 million cycles with a 7 year service life for the same steady state throughput. A load port that can open and close a carrier in one-fifth time has an additional aspect of the need for inherent reliability. Otherwise, the load port mean time between failures (MCBF) will adversely affect the tool level MCBF.

  On the other hand, there are two factors in the influence of the reduction of the lot size and the reduction of the cycle time on the carrier. First, reducing the lot size affects the carrier opening and closing time on the load port. Second, the manufacturing cycle time affects the desired number of opening and closing cycles of the carrier. The total carrier cycle can be estimated with a simple calculation based on the number of mask layers, the number of process steps per layer, and the number of days per mask layer. At present, 27 mask layers with 32 process steps each are common. The number of days per mask layer varies by equipment and manufacturer, but a reasonable estimate is 1.5 days per mask layer. As a calculation example, it can be assumed that each process step can load the carrier into another tool (a conservative assumption).

Number of process steps / number of days per mask layer = cycle carrier / day 32 / 1.5 = 21.33 cycle carrier / day In an extreme case, in order to realize optimum productivity, the number of days per mask layer is 1 to 0.0. Device manufacturers have suggested that shortening to 7 days is highly desirable and that future devices can accommodate up to 45 mask layers. These predicted changes are incorporated into the previous calculation example to calculate the next new value for the carrier cycle time. It is assumed that there is no change in the number of process steps per mask layer.

Number of process steps / number of days per mask layer = cycle carrier / day 32 / 0.7 = 45.7 cycle carrier / day Based on the above calculation example, 54,498 to 116 as the number of cycles over the useful life of the carrier of 7 years , 764 cycles are obtained. That is, the carrier may be subjected to an opening / closing cycle every 31.5 minutes. Conventional load ports, carriers, and interfaces between the two cannot meet this expected operating parameter. Withstands the need for a more robust carrier and carrier-tool interface (eg, with a significantly higher number of cycles (such as x2 to x10), thereby increasing cleanliness within the carrier and across the interface) It is desired to simplify and speed up the system to move the substrate to various process modules that perform various process steps by modifying what can be achieved with conventional loadports and carriers) Yes.

  In one exemplary embodiment, a substrate processing system is provided. The substrate processing system includes a processing unit configured to hold a processing atmosphere in the substrate processing system and an internal volume for holding at least one substrate for transport to the processing unit. A shell configured to allow the volume to be pumped down to a predetermined vacuum pressure that is different from the external atmosphere outside the substrate processing system, and connected to the processing unit in order to isolate the processing atmosphere from the external atmosphere. A load for loading a substrate into the processing unit via a load port coupled to the carrier for pumping down the internal volume of the carrier and configured to connect the carrier to the processing unit in a communicable manner. Port.

  According to another exemplary embodiment, a substrate carrier configured to couple the substrate processing system to the load port is provided. The substrate carrier includes a shell and an internal volume formed by the shell so that the shell can pump down the internal volume to a predetermined vacuum pressure when the carrier is substantially positioned in the atmospheric environment. It is configured.

  According to yet another exemplary embodiment, a method is provided. The method includes coupling a substrate carrier to a load port of a substrate processing system and reducing the internal volume of the substrate carrier to a predetermined vacuum pressure while one or more external surfaces of the substrate carrier are exposed to an atmospheric environment. Pumping down.

  According to yet another exemplary embodiment, a substrate processing system is provided. The substrate processing system is configured to connect a carrier having first and second carrier positioning mechanisms for holding a substrate in the substrate processing system, and the carrier so as to communicate with a processing unit of the substrate processing system. A first positioning mechanism configured to form a first kinematic coupling with the first carrier positioning mechanism to couple the carrier to the first carrier interface. Forming a second kinematic coupling with a first carrier interface having a second carrier positioning mechanism for coupling the carrier to the second carrier interface, the first carrier interface being disposed at an angle relative to the first carrier interface Second carrier having a second positioning mechanism configured as described above And the second positioning mechanism is configured such that when the carrier is coupled to the second carrier interface by the second kinematic coupling, the second carrier positioning mechanism is the first positioning mechanism. And the first carrier positioning mechanism are configured to allow movement of the carrier relative to the second carrier interface.

  According to yet another exemplary embodiment, a method is provided. The method includes positioning the carrier at a first positioning interface and contact between the carrier and the second positioning interface to move the positioning of the carrier from the first positioning interface to the second positioning interface. Moving the first positioning interface so that the carrier advances toward the second positioning interface, wherein a relative movement is caused between the carrier and the first positioning interface.

  The foregoing aspects and other features of the exemplary embodiments are described in the following specification text in conjunction with the accompanying drawings.

1 is a schematic elevation view illustrating a substrate processing tool and one or more substrate carriers or pods having features according to one exemplary embodiment. FIG. 1 is a schematic elevation view illustrating a substrate processing tool and one or more substrate carriers or pods having features according to one exemplary embodiment. FIG. FIG. 2 is a partial schematic elevation view showing a load port of the processing tool in FIG. 1 and a carrier interfaced with the load port. FIG. 6 is another partial schematic elevation view showing the load port interface and carrier. 2 illustrates an exemplary latch according to an exemplary embodiment. 2 illustrates an exemplary latch according to an exemplary embodiment. 2 illustrates an exemplary latch according to an exemplary embodiment. 2 illustrates an exemplary latch according to an exemplary embodiment. 2 illustrates an exemplary latch according to an exemplary embodiment. 2 illustrates an exemplary latch according to an exemplary embodiment. 2 illustrates an exemplary latch according to an exemplary embodiment. 2 illustrates an exemplary latch according to an exemplary embodiment. 2 illustrates an exemplary latch according to an exemplary embodiment. 2 illustrates an exemplary latch according to an exemplary embodiment. 2 illustrates an exemplary latch according to an exemplary embodiment. 2 illustrates an exemplary latch according to an exemplary embodiment. FIG. 6 is another partial schematic elevational view showing the load port interface and carrier, showing the load port interface and carrier in one position. FIG. 6 is another partial schematic elevational view showing the load port interface and carrier, showing the load port interface and carrier in different positions. FIG. 6 is another partial schematic elevational view showing the load port interface and carrier, showing the load port interface and carrier in different positions. FIG. 6 is another partial schematic elevational view showing the load port interface and carrier, showing the load port interface and carrier in different positions. FIG. 6 is another partial schematic elevational view showing the load port interface and carrier, showing the load port interface and carrier in different positions. FIG. 6 is a flowchart illustrating an interface process between a carrier and a load port according to an exemplary embodiment. FIG. 3 is a schematic diagram showing an interface between a carrier and a load port at one position. FIG. 2 is a schematic diagram showing an interface between a carrier and a load port at different positions. FIG. 6 is a schematic elevation view illustrating a load port interface and carrier according to another exemplary embodiment. FIG. 5 is a flowchart illustrating an interface process between a carrier and a load port according to another exemplary embodiment. FIG. 2 is a partial schematic elevational view showing a load port interface and one or more carriers. FIG. 2 is a partially enlarged schematic elevation view showing a load port interface and one or more carriers. FIG. 6 is a schematic perspective cross-sectional view illustrating a load port interface and carrier according to another exemplary embodiment. FIG. 6 is a schematic perspective view showing a carrier according to another exemplary embodiment. FIG. 6 is a side view of a carrier according to another exemplary embodiment. It is a schematic perspective view which shows a load port interface. FIG. 6 is a cross-sectional view illustrating portions of a load port interface with engaged carriers according to another exemplary embodiment. FIG. 6 is a cross-sectional view of a portion of a load port interface with engaged carriers according to another exemplary embodiment. It is a top sectional view showing a load port interface and a carrier. FIG. 7 is a schematic perspective view showing an engagement mechanism of a kinematic coupling between a carrier and a tool interface according to another exemplary embodiment. FIG. 6 is a schematic elevation view illustrating an interface connection between a carrier and a tool according to another exemplary embodiment. FIG. 6 is a partial elevation view showing an interface connection between a carrier and a tool according to another exemplary embodiment. FIG. 6 is another schematic elevation view illustrating a carrier-to-tool interface illustrating a carrier and port door travel path according to one exemplary embodiment. FIG. 6 is a schematic diagram illustrating a carrier and tool interface according to yet another exemplary embodiment. FIG. 6 is a schematic diagram illustrating a carrier and tool interface according to yet another exemplary embodiment. FIG. 6 is a partial view showing a carrier interface according to still another exemplary embodiment. FIG. 6 is a schematic elevation view illustrating a substrate processing tool and a carrier connected to the substrate processing tool according to another exemplary embodiment. FIG. 6 is a schematic elevation view illustrating a substrate processing tool and a carrier connected to the substrate processing tool according to another exemplary embodiment. It is a schematic plan view which shows the substrate connected to the substrate processing tool which concerns on other exemplary embodiment, and the said substrate processing tool. It is a schematic plan view which shows the substrate connected to the substrate processing tool which concerns on other exemplary embodiment, and the said substrate processing tool. It is a schematic plan view which shows the substrate connected to the substrate processing tool which concerns on other exemplary embodiment, and the said substrate processing tool. FIG. 6 is a schematic elevation view illustrating a substrate processing tool and a carrier connected to the substrate processing tool according to another exemplary embodiment. It is a schematic plan view which shows the substrate connected to the substrate processing tool which concerns on other exemplary embodiment, and the said substrate processing tool. It is a schematic plan view which shows the substrate connected to the substrate processing tool which concerns on other exemplary embodiment, and the said substrate processing tool. It is a schematic plan view which shows the substrate connected to the substrate processing tool which concerns on other exemplary embodiment, and the said substrate processing tool. 1 is a perspective view of an actuator according to one exemplary embodiment. FIG. FIG. 6 is a side view of an actuator according to one exemplary embodiment. For example, an object coupled to a first interface surface of a load port according to one exemplary embodiment is shown. FIG. 22 illustrates a kinematic coupling between the object of FIG. 21 and a load port according to one exemplary embodiment. FIG. 22 illustrates a kinematic coupling between the object of FIG. 21 and a load port according to one exemplary embodiment. FIG. 22 illustrates another interface surface of the load port of FIG. 21 according to one exemplary embodiment. FIG. 22 illustrates an example of the object and load port kinematic coupling mechanism of FIG. 21 according to one exemplary embodiment. FIG. 22 illustrates an example of the object and load port kinematic coupling mechanism of FIG. 21 according to one exemplary embodiment. FIG. 23 illustrates the coupling of an object from the first interface surface to the second interface surface of FIGS. 21 and 22 according to one exemplary embodiment. FIG. 23 illustrates the coupling of an object from the first interface surface to the second interface surface of FIGS. 21 and 22 according to one exemplary embodiment. FIG. 23 illustrates the coupling of an object from the first interface surface to the second interface surface of FIGS. 21 and 22 according to one exemplary embodiment. FIG. 2 illustrates a schematic diagram of a substrate carrier according to an exemplary embodiment. FIG. 2 illustrates a schematic diagram of a substrate carrier according to an exemplary embodiment.

  1A-1B show a schematic elevation of a substrate processing apparatus 2 and a substrate carrier or pod 100 that incorporates features according to exemplary embodiments described below.

Still referring to FIGS. 1A-1B, the processing tool 2 illustrated here is merely representative, and in alternative embodiments, the processing tool can be of any desired type and configuration. can do. By way of example (note that the examples described herein are not intended to limit the features of the exemplary embodiments), the processing tool can be used for material deposition, ion implantation, etching, It can be configured to perform lithography, polishing, or any other desired process. This tool may also serve as a measurement tool, for example. In the illustrated exemplary embodiment, the tool 2 can generally have a process section 6 and a front end module (FEM) 4 (a reference convention that allows for loading a wafer into the tool from the front). If used). The process unit 6 is isolated and can maintain a desired process atmosphere (vacuum, inert gas (N 2), etc.). The FEM 4 can be connected to a process unit. In an exemplary exemplary embodiment, the FEM 4 can include an atmosphere common to the process section (eg, a process atmosphere such as an inert gas). In this exemplary embodiment, the FEM 4 can be communicatively communicated with the process section 6 via a load lock (eg, if a portion of the process section may be a vacuum). In an alternative embodiment, the FEM can have a clean air atmosphere, and in yet another alternative embodiment, the processing tool cannot have an FEM and interface the process part directly with the substrate carrier. Can do. The carrier 100 can be configured to interface the carrier directly to the process unit 6 regardless of the process unit or the type of gas in the carrier, or whether the process unit is vacuum, as described below. . As shown in FIGS. 1A-1B, the FEM 4 has an interface for the substrate carrier 100. This interface, which may also be referred to as load port 10, allows the carrier to interface with FEM 4 and hence tool 2 to allow wafer / substrate loading and unloading to the tool. The FEM 4 can include desired environmental controls (as described below) so that the wafer can be loaded into the tool (from the environment outside the tool) without degrading the process atmosphere. The carrier can define a chamber that holds the substrate in a gas type (eg, a clean atmosphere, which may be the same as or different from the process atmosphere. The interface between the carrier and the load port is described in detail below. As described, what can be referred to as a clean tunnel that transports a substrate between the carrier chamber and the process atmosphere, such as within the FEM 4 or the process unit 6, without degrading the process atmosphere can be defined.

  Referring to FIG. 2, which is a partially enlarged schematic elevational view of the load port 10 and the carrier 100, the communication interface I (such as a clean tunnel) between the carrier chamber and the FEM atmosphere is illustratively a carrier shell-carrier wafer interface. 103, the carrier shell-load port flange interface 101, the carrier door-load port door interface 105, and the load port door-load port flange interface 13 can generally be included. . In alternative embodiments, the interface that provides communication between the carrier chamber and the FEM atmosphere or process atmosphere or vacuum can be any other desired configuration with more or less interfaces (eg, as described above). Two or more interfaces may be combined into a common interface). As is feasible, the exemplary embodiment can open and close the clean tunnel (between the carrier chamber and the process atmosphere) provided by the multi-interface I (open when the carrier is interfaced with the load port, and interface the carrier) Etc.) at all other times until the completion. A clean tunnel remains clean (eg, there is no substantial degradation in the internal atmosphere) when the tunnel is opened and closed, and while the tunnel is opened and closed. Therefore, a possible interface to establish and maintain a clean tunnel is to provide a given interface to isolate the carrier chamber atmosphere or process atmosphere from the external atmosphere or dirty surfaces (such as those that may be exposed to the external atmosphere). As each is closed, each interface of the communicating multi-interface I can be sealed. For example, the carrier shell-carrier door interface 103 can be sealed to isolate the carrier atmosphere, and the load port door-load port flange interface 13 can be FEM or process part atmosphere or vacuum (clean tunnel It can be sealed to isolate (eg when closed). Also, the carrier door-load port door interface 105 can be sealed to isolate the exterior (eg, filthy conditions / surfaces on the carrier door and load port door, etc.) from the clean tunnel atmosphere. The inter-port flange interface 101 can be sealed to isolate the process atmosphere from the external atmosphere (such as when the clean tunnel is open), and in this exemplary embodiment minimizes moving parts exposed to the clean tunnel. Interfaces such as carrier shell-to-door 103, shell-to-load port flange 101, carrier door-to-load port door 105, and load port flange-to-door 13 are at least partially solid as described below. No. 11 / 207,231, filed Aug. 19, 2005, both of which are U.S. patent applications, an example suitable as an interface between a carrier and a load port. No. 11 / 21,236 filed on May 24, No. 11 / 210,918 filed on August 23, 2005, No. 11 / 594,365 filed on November 7, 2006 No. 11 / 787,981 filed Apr. 18, 2007 and 11 / 803,077 filed May 11, 2007, all of which are incorporated herein by reference. It is incorporated as a part of

  Still referring to FIGS. 1A-1B and FIG. 2, in this exemplary embodiment, load port 10 may be configured to interface with a reduced or low capacity carrier 100. A suitable example of a small capacity carrier with features similar to the carrier 100 and a suitable example of a load port interface with features similar to the load port 10 were previously incorporated as part of this specification. No. 11 / 207,231 filed on August 19, 2005, 11 / 11,236 filed on August 24, 2005, August 23, 2005, both of which are US patent applications. No. 11 / 210,918 filed on Nov. 7, 2006, No. 11 / 594,365 filed Nov. 7, 2006, No. 11 / 787,981 filed Apr. 18, 2007, and 2007. No. 11 / 803,077, filed on May 11, 1999. In this exemplary embodiment, the load port interface 11 can be arranged to meet, for example, current equipment front end module (EFEM) interface standards. For example, the load port 10 can be fitted into a BOLTS interface established by SEMI standard E63, such as a conventional load port for 25 wafers, and is a spatial envelope specified by SEMI standard E15.1. The carrier 100 can be disposed inside. In this exemplary embodiment, the load port 10 has a general laminated load port configuration capable of interfacing with the laminated carrier 100 and seated on the SEMI standard E151 load port in the carrier. The substrate is fed to the tool transfer device, such as the height between the lowest and highest wafers in a stack of 25 wafers of a carrier compliant with SEMI standard E47.1. This exemplary embodiment shows three load port portions 10A, 10B, 10C, each capable of interfacing the carrier 100 to the FEM (this is for illustrative purposes and in an alternative embodiment) , Can have more or fewer loadports). In an alternative embodiment, the load port portion can be configured to interface more or fewer carriers to the FEM. In this exemplary embodiment, load port portions 10A-10C and corresponding interfaces 11A-11C may be substantially similar. Each loadport section 10A-10C and corresponding interface 11A-11C provides a substantially unrestricted FEM access for wafer transfer and an automated transfer system (AMHS) to undock the carrier on the loadport section. Can be enabled individually and simultaneously to provide substantially random access. In alternative embodiments, the load port can be any other desired configuration. The substrate handled by the carrier and load port should be of any other desired type, including any desired size semiconductor wafer such as a 450 mm, 300 mm, or 200 mm reticle or pellicle, or a flat panel for flat displays. Can do.

  Referring now to FIG. 3, another schematic elevation view of the carrier 100 is shown. In the exemplary embodiment illustrated in FIG. 3, the carrier 100 is mounted on the load port portion 10A. The carrier 100 shown in each figure is representative, and in alternative embodiments, the carrier can have any other suitable features. In this exemplary embodiment, the carrier comprises a seal 102 (see also FIG. 8) that generally defines a chamber that encloses the substrate. The shell is encapsulated with an optically transparent material, for example with one or more viewports (eg, the viewport allows the wafer to be mapped through the window with a beam sensor outside the carrier shell. Can be made of non-metallic materials such as optically clear thermoplastics, composite materials such as polyvinylidene chloride (PVDC), aluminum alloys or non-magnetic metals, magnesium alloys, and metallized plastics that can be placed In alternative embodiments, the shell can be made of any suitable material that can maintain a sealed environment within the carrier, as shown most clearly in FIG. As described below, a substrate transfer opening that can be closed by a door 104 is defined on one side of the shell. Can have couplings or attachments 110, 112 for handling and placement of the carrier, such as on an interface, etc. In this exemplary embodiment, the carrier 100 is automatically gripped from the top of the carrier, such as AMHS. There may be a handle or flange 112. In an alternative embodiment, the upper handle 112 may be used to engage the carrier with the load port interface (see, eg, FIGS. 7A-7C). In alternative embodiments, the carrier can have any other desired handling mechanism on the shell, hi this exemplary embodiment, the carrier shell can carry the carrier repeatedly, such as on a load port interface. Arrangement coupling 110 For example, the coupling 110 may be a kinematic coupling (substantially automatic repetitive placement) located on the bottom mating surface of the carrier, such as one having a function substantially compliant with SEMI standard E57.1. In this exemplary embodiment, the coupling between the carrier and the load port interface with coupling 110 is an excess in the positioning of the carrier with respect to the load port interface as described below. In an alternative embodiment, the carrier mating surface and the positioning coupling can be coupled to an optional portion of the carrier, as well as to relax the desired constraints and ensure the desired positioning between the carrier flange and load port interface flange. Can be placed on the other side The As shown in FIG. 3, in this exemplary embodiment, carrier 100 can interface with a load port at interface 110 and interface 101, but when implemented in a conventional configuration, interface surfaces of different interfaces Due to contention, excessive constraints can occur in conventional carrier positioning on the load port. In this exemplary embodiment, carrier 100 can be interfaced with the load port at interface 110 and interface 101 without creating excessive constraints, as described below.

  As shown in FIG. 3 and as described above, in this exemplary embodiment, carrier shell 102 and door 104 are mated / interfaced at interface 103 (shown schematically in FIG. 3) to close the carrier chamber. Is done. In this exemplary embodiment, interface 103 can be sealed with seal 103S and door latch 106 can hold the door to the shell when closed. Also, as shown in FIG. 3 and as described above, the door 104 in this exemplary embodiment may also define at least a portion of the interface 105 to the load port door 12. Thus, in this exemplary embodiment, carrier door 104 interfaces with both the carrier shell (at interface 103) and the load port door (at interface 105), thereby further competing for carrier positioning at the load port. Can have an interface mechanism for creating possible constraints with the interface (eg, in addition to the interface 110 and the interface 101 defined between the carrier shell flange and the load port flange as described above) ). In the exemplary embodiment shown in FIG. 3, the carrier shell-to-door interface 103 is such that the carrier door is interfaced to the load port door (in order to interface the carrier door to both the carrier shell and the load port door. When the constraints that arise are eliminated), the carrier door can be released relative to the shell by providing flexibility. Flexibility in the interface 103 addresses inconsistencies in the mating surfaces of the door and shell (so that the internal cleanliness is not compromised and can withstand the desired pressure differential between the carrier chamber and the external atmosphere) However, this can be provided by the seal 103S having appropriate flexibility that can compensate for this. The door latch 106 can be configured to generate a sufficient latching force to withstand the bias on the door from pressure compression, the pressure differential across the door, and the substrate bias on the door, as described below. The door latch 106 can be a substantially solid state device (such as the operation of the latch being brought about by a non-contact method) to avoid the generation of particulates. The flexible seal 103S can be incorporated into the latch device such that the flexible deflection of the seal results in a latch and / or the latch device 106 can be integrated into the seal. As an example, as shown in the schematic diagram of FIG. 3, the seal 103S may be a combination of a seal and a magnet. The seal 103S may be a face seal placed around the door periphery, with a magnetic ribbon located on the door in the seal that operates on the magnetic material in the shell flange to compress the seal. . In an alternative embodiment, a radial or curved door seal (such as a cross section of the seal surface) can be used at the interface between the shell and the carrier door. In other alternative embodiments, the seal may be any other desired configuration.

  In this exemplary embodiment, the latch device 105 in the carrier can be passive and the actuation (to open and close the latch) can be provided by the active side present in the load port, for example. In alternative embodiments, the active side of the latching device may be present in the carrier 100. Although feasible, in order to effect the operation of the latch device, it is necessary to provide power and control to the device. For example, identifying the active part of the device within the load port can avoid or minimize the need for carrier power and control. In the exemplary embodiment shown in FIG. 3, the transfer of energy to drive the passive portion of the latch causes an electromagnet to generate a sufficient magnetic field to pull the permanent magnet on the carrier door away from the magnetic material in the shell 102 upon excitation. (E.g., position within load port door), etc., can be magnetic. In other exemplary embodiments, energy transfer to the latch device can be effected by induction or an electrical contact pad between the carrier 100 and the load port 10A. In other alternative embodiments, operating energy can be stored on the carrier 100 and control instructions can be wirelessly transmitted to the carrier 100 for operation of the latch. In this exemplary embodiment, an actuation input for actuating the latch 106 can be applied via the carrier door 104, but in alternative embodiments, the actuation input may be applied to the carrier shell. 3A-3E are partial cross-sectional views of the carrier shell-to-door interface 105 and door latch according to various exemplary embodiments. In the illustrated exemplary embodiment, the operation of the door latch is magnetic and the active portion of the device is shown, for example, in the load port door 12. Thus, in the illustrated exemplary embodiment, actuation of the active portion results in actuation of the door latch 106 from the shell or carrier along with actuation of the carrier door-load port door latch 106D. Although feasible, the latch configuration shown in FIGS. 3A-3E is exemplary only, and in alternative embodiments, the carrier door latch (for both shell and load port doors) can be of any other desired configuration. Can have. In the exemplary embodiment shown in FIG. 3A, the magnetic latch can include a permanent magnet 9050 in the carrier door that operates on a steel material 9051 in the carrier shell. In an alternative embodiment, the permanent magnet may be in the shell and the magnetic material may be in the carrier door. This configuration can provide, for example, a closed magnetic circuit when the carrier door latch is closed (active portion off), thereby minimizing the possibility of stray magnetic fields. In this exemplary embodiment, steel material 9050A may also partially surround permanent magnet 9050, as also shown in FIG. 3K. This steel material can be configured to form what can be referred to as a shield around the magnet to prevent or minimize stray magnetic fields inside and outside the carrier as required. Although FIG. 3K illustrates a steel shield 9050A used in the latch magnet arrangement of FIG. 3A, this steel shield may be any other desired as shown in FIGS. 3B-3H and 3K-3L. It can be used to shield a latch magnet having a configuration. The configuration of the steel shield (and magnet) shown in FIG. 3K is a schematic illustration, and in an alternative embodiment, the steel shield 9050A (and magnet) can prevent or minimize stray magnetic fields from inside and outside the carrier. Can have any suitable configuration. Note that magnet 9050 and / or steel / plate 9051, 9050A may be embedded in other non-ferrous materials or may be coated for corrosion resistance.

  In such exemplary embodiments, the active portion can be an electromagnet 9052, which can be located, for example, in the load port door as shown. When the active part is actuated (turned on), the actuating force between the permanent magnet 9050 in the carrier door 104 and the magnetic material 9051 in the shell 102 is caused by the effect of the magnetic field from the electromagnet 9052 in the load port door 12. Overcoming, the carrier door / shell latch 106 is released and the carrier door-load port door latch 106D is closed. As can be realized, the carrier door 104 can be moved with the load port door 12, such as when the load port is opened, so that it is away from the board mounting opening in the load port when in the unlatched position. An open magnetic circuit can be defined (e.g., to minimize undesirable magnetic fields) and the permanent magnet 9050 in the carrier door can be moved. As shown in FIG. 3B, according to another exemplary embodiment, the carrier door 104 includes a permanent magnet 9050 connected to one side of the flexor 9060 and a steel material connected to the other side of the flexor 9060. 9050D can be included. Flexor 9060 can be made of any suitable elastically flexible material. When actuated, the electromagnet 9052 can interact with the steel 9051D to move the flexor and the permanent magnet 9050 is moved relative to the steel 9051 in the door (releasing the carrier door / carrier shell latch). Latch between the carrier door and the load port door). In the example shown in FIG. 3C, when the electromagnet 9052 is actuated, the permanent magnet 9050 rotates, and the carrier door / carrier shell latch 106 is released by the interaction of the steel material 9051, the permanent magnet 9050, and the electromagnet 9052. The permanent magnet 9050 in the carrier door 104 can be rotatable so that the port door / carrier door latch 106D is engaged. In the exemplary embodiment illustrated in FIGS. 3D-3E, the latch portion within the carrier door is positioned within the port door 12 to activate the induction electromagnet, thereby latching / unlatching the carrier door from the carrier shell. Inductive electromagnets 9050 ′, 9050 ″ with coils 9052 ′. As also shown in FIG. 3E, in one exemplary embodiment, the carrier shell interacts with the induction electromagnet 9050 ″. May include a permanent magnet 9051 ′. The configuration of the induction electromagnets in FIGS. 3D-3E can operate in a manner that is substantially similar to that described above with respect to FIGS. 3A-3B. The induction electromagnet and passive and active element configurations illustrated in FIGS. 3A-3E are merely exemplary, and in an alternative embodiment, the solid state (or between the carrier shell and the door and between the carrier door and the port door) (or The passive and active elements of the latch (close to solid state) may have any other suitable configuration and may include more or fewer elements.

  Referring to FIG. 3L, in another exemplary embodiment, the magnetic latch between the carrier and the door can be mechanically unlatched. For example, the magnetic latch / seal shown in FIG. 3L includes a magnet 9090 and a magnetic (such as steel) material 9091 located in the door 104 and carrier shell 102, respectively, in an arrangement generally similar to that shown in FIGS. 3A-2C. In alternative embodiments, the latch may be in any other desired configuration. The magnetic latch / seal can be released mechanically, for example, via actuation of latch fingers 9092. The latch finger 9092 can be pivotally mounted within the door 104 at least partially about the pivot 9093. Latch fingers 9092 are operatively coupled to, for example, a movable latch keyhole 9094 in door 104 (which can be movable in any other desired manner, such as translation, but is shown as rotatable, for example). can do. The keyhole can be engaged and moved by a key from a load port door or the like. In the exemplary embodiment, as the latch key 9094 is rotated in the direction of arrow 9095, the latch member or finger is moved to the arrow 9096, for example to urge the door 1042 away from the carrier shell 102 and thereby release the magnetic latch. It is pivoted in the direction of Note that the configuration shown in this figure is exemplary only, and in alternative embodiments, the magnetic latch / seal between the door and the carrier can be mechanically released in any suitable manner. For example, the magnet or magnetic material can be attached or coupled to the latch finger such that movement of the latch finger moves the magnet / magnetic material of the carrier door latch away from each other to release the latch. Conversely, engagement of the latch can be effected by reverse movement of the latch finger.

  Referring now to FIG. 3F, another partial schematic cross-sectional view of a carrier shell and door interface and latch 106 according to another exemplary embodiment is shown. In the illustrated exemplary embodiment, the latch is provided by any positive displacement (such as by a flex member or a piezoelectric effect) between the carrier shell 102 and the carrier door 104 along the interface, substantially the outer periphery of the interface. In the vicinity, the interference between the carrier shell 102 and the carrier door 104 is substantially compressed. Interference between the carrier shell 102 and the door 104, for example, to coordinate with a biasing force on the carrier door 104 (such as from a pressure differential across the door) and increase compression, thereby causing the shell 102 and the carrier door 104 to Can be configured to increase the latching force between. The displacement can be located on the carrier shell 102, the carrier door 104, or both. To release the latch 106, the displacement can be actuated to release the compression on the carrier door 104. In this exemplary embodiment, the displacement can have a flexor member 9099 that can be actuated to provide latching and unlatching. The actuation of the flexor member 9099 may be, for example, by vacuum (vacuum bladder), magnetic, electroactive polymer, shape memory alloy (SMA), or any other suitable actuation means. .

  Referring to FIGS. 3I and 3J, an example of an SMA member that can be used, for example, to actuate a flexor member 9099 or similar latch member is shown. As can be realized, the SMA has a memory but does not store energy. On the other hand, in these exemplary embodiments, the SMA may be an effective solid state actuator. In these exemplary embodiments, the latch mechanism can be biased to a closed position, typically by material deflection, springs, magnetic inputs, etc., and is pre-stressed by a closing bias (or wire (which is a carrier) Can be actuated to overcome the closing bias to open the latch and displace the flexor member, such as via electrical or heat input from a load port. In one exemplary embodiment shown in 3I, an SMA member, such as wire 10200, can be connected to a latch that is normally biased to a “latched” state, such as a horizontal or vertical latch. It may be a pivotally mounted finger 106 'that rotates in a plane.In one alternative embodiment, the pivot is flexed. In another exemplary embodiment, as shown in Figure 3J, it is folded by the SMA member 10200 'in operation with sufficient elasticity to pre-stress the SMA member 10200'. A gasket 10201 that can be used may be used, and a foldable gasket variant would be one that employs a wiper-type gasket that is bent by an SMA member that pulls the tip of the wiper. Sufficient separation can be achieved for door opening and removal.

  In another example, using a vacuum (such as a bladder actuator) having a configuration similar to the actuator 5000 in the exemplary embodiment shown in FIGS. 19 and 20 to actuate a latch member similar to the flexor member 9099, for example. Can do. A bladder actuator similar to the actuator 5000 includes a flexor member 9099 (see FIG. 3F), or any suitable for processing tools and carriers, including but not limited to load ports or substrate carrier doors, gate valves, and latches. An actuable mechanism or device (see also FIGS. 3A-3L) can be configured to be activated. In this example, actuator 5000 is typically configured as a vacuum or partial vacuum bladder. In alternative embodiments, the actuator can be in any suitable configuration. Actuator 5000 can be configured to minimize the outer dimensions of actuator 5000 with respect to the stroke of actuator 5000 (eg, maximizing the ratio of stroke to actuator size). In this exemplary embodiment, actuator 5000 can be controlled to operate in a controlled clean environment, such as inside a carrier or inside a process tool. In the illustrated exemplary embodiment, the actuator generally provides a movement of the base or substantially stationary surface 5020, movable surface 5030, and movable surface 5030, and thus power or drive that can actuate the actuator 5000. A surface 5035 can be provided. As shown in this figure, the fixed surface can have a seal 5010 to seal the actuator to any suitable surface, such as to create a pressure differential on one side of the actuator, for example. In this exemplary embodiment, a power surface 5035 is shown, which is referred to as a bladder by way of example only. In alternate embodiments, the power surface 5035 can be any other suitable shape or configuration. As is feasible, the fixed surface 5020 illustrated in FIGS. 19-20 can be mated to a fixed surface or member of a tool or carrier frame, and the movable or actuator surface 5030 can be applied to the entire pressure of the drive surface 5035. It may be connected to the actuating mechanism so that the movement of the movable surface that receives the kinetic force of the difference (such as the pressure difference between the pressure P1 and the pressure P2 located on the opposite side surfaces of the driving surface 5035) activates the mechanism. it can. In this exemplary embodiment, the drive surface 5035 can be shaped to form an interior space or volume 5002 that substantially separates the interior space 5002 bounded by a separation boundary or membrane from the space outside the drive surface 5035. Isolation boundaries or membranes to be isolated, and movable parts located therein, for example as described below, can be formed. The drive surface can be made of any suitable material so as to eliminate or minimize particulate formation when the drive surface 5035 moves during operation. In this exemplary embodiment, the drive surface 5035 is connected to the fixed surface 5020 of the actuator 5000 and the movable surface 5030 of the actuator, and a portion of the drive surface 5035 (eg, as shown in FIGS. 19-20, In alternative embodiments (which may be any other surface arrangement), it is configured to move relative to stationary surface 5020 when a desired pressure differential is applied across drive surface 5035. . The degree of freedom and operating rate can be controlled as described below, and can be achieved without electrical control or power as needed.

  As described above, the actuation (e.g., expansion and contraction) of the actuator 5000 can be controlled, for example, via a pressure differential on the actuator bladder, and the actuation rate is illustratively the size of 5000 orifices in the flow line 5055. Alternatively, it can be controlled by a leak point 5056 located around the actuator 5000 via a drive surface 5035. The locations of the leak point 5056 and the flow line 5055 are exemplary only, and in alternative embodiments, the flow line and leak point can be any suitable location on or relative to the actuator. The orifice can be connected to, for example, any suitable atmosphere of the processing tool 2 (or an external environment such as the surrounding environment around the tool) and can be in communication with the internal volume of the actuator. In one example, the pressure difference P1, P2 between the vacuum environment and the ambient environment of the processing tool 2 results in a linear motion of the vacuum actuator 5000, for example. For example, the outside of the bladder 5001 can be exposed to the vacuum environment of the processing tool, while the interior 5002 of the bladder is exposed to the ambient environment of the processing tool 2. By way of example only, a vacuum environment may be provided at the flow line 5055, for example as shown in FIG. 20 (as described below, the flow line causes pumping down of the chamber in communication with the drive surface 5035). Etc.) As can be realized, as the vacuum pressure rises, the differential pressures P1, P2 between the vacuum pressure and the atmospheric pressure also increase, causing the actuator to operate (and vice versa). In other embodiments, one side of the actuator can be pressurized to move the actuator, as described below. In an alternative embodiment, the interior of the bladder 5002 can be exposed to a vacuum environment while the exterior of the bladder 5001 can be exposed to an ambient environment. In one exemplary embodiment, in order to prevent or minimize particles generated in actuator 5000 from entering, for example, a load lock or any other suitable controlled clean environment, and / or Or any suitable filter can be placed at the leak point. In an alternative embodiment, the actuator 5000 may have its own pump system that causes the bladder to expand and contract for actuation of the actuator 5000. The operating speed (such as acceleration and deceleration) of the actuator 5000 may be, for example, by a restriction of an orifice that may be fixed or variable, including but not limited to a valve, within a flow line and / or leak point around the actuator 5000. Can be controlled in any suitable manner.

  In one exemplary embodiment, the extension and retraction of the actuator can be guided to define a predetermined number of degrees of freedom movement of the actuator 5000. For example, as most clearly shown in FIG. 20, actuator 5000 extends and retracts substantially linearly in the direction of arrow 5050, while in other directions, such as the direction indicated by arrows 5040-5042. It can be configured such that the movement of the actuator (such as linear and rotational) is limited. In alternative embodiments, the actuator 5000 can have any suitable number of degrees of freedom for actuation in one or more directions. In this example, the actuator 5000 can include any suitable link 5005 for guiding the movement of the actuator 5000. The links here may be “scissor” or “accordion” links, but in alternative embodiments the links may be of any suitable configuration. The scissor or accordion link can have a compact outer shape when retracted or folded while maximizing the extension of the link when deployed, ie, maximizing the reach (e.g., maximizing the storage ratio to the actuator reach). . In an alternative embodiment, one or more rails are connected to the link in sequence and configured to have different widths and heights so that the smaller rails in the series of rails are slid into the larger rails. An extensible rail can be included that provides telescoping expansion and contraction of the rail. In another alternative embodiment, the bladder is self-guided, eg, a mesh material, configured such that the mesh guides the linear movement of the actuator 5000 as the drive surface is moved through the pressure differential. Can be composed of materials. In still other alternative embodiments, actuator movement can be guided in any suitable manner.

  The link 5005 here is located in the interior 5002 of the bladder so that particulates produced by the link are not exposed to a vacuum or otherwise clean environment within the processing tool. In an alternative embodiment, the link may be located outside the bladder. In still other alternative embodiments, particulates that may be generated by the link may be contained in any suitable manner. Although the actuator is described as a linear actuator, in alternative embodiments, the actuator may be configured for rotational actuation. In still other embodiments, the linear motion of the actuator may be converted to rotational motion in any suitable manner. In yet another alternative embodiment, the actuator can include two bladders connected to a common actuator chamber to provide two degrees of freedom with any spatial relationship to each other. For example, while configuring the second bladder such that the door moves substantially parallel to the door interface surface so that the substrate passage opening is not obstructed by the door, one of the bladders is connected to the substrate passage opening. Can be configured to move substantially perpendicular to the door interface surface of the part. The plurality of bladders can be configured with different characteristics, including the material and thickness of the bladder material, so that the bladder can be operated at different times depending on the predetermined operating pressure difference of each bladder. As feasible, the bladders described herein can be configured in any suitable direction and can be arranged parallel or continuous with each other to provide the desired actuation.

  Reference is now made to FIGS. 3G-3H, which are partial schematic cross-sectional views of the carrier shell-to-door interface and latch, each illustrating an exemplary configuration of a displacement-type latch according to various exemplary embodiments. In the example shown in FIG. 3G, the latch includes a steel material 10001 located in the carrier shell 102 and a permanent magnet 10002 in the carrier door 104. A flexible material or gasket 10003 can be attached to the carrier door 104 so as to surround the magnet 10002 within the door 104. For example, an actuator 10005 similar to the actuator 5000 described above or other actuators described above, when activated, pulls the magnet 10002 away from the steel material 10001 to overcome the magnetic force between them and release the door 104 from the carrier shell 102. Can be positioned within the door 104. In the example shown in FIG. 3H, the latch includes, for example, a rotatable ring-shaped multipole magnet 10100 in the carrier shell 102 and a stationary ring-shaped multipole magnet 10102 in the carrier door 104. The shape of the magnets 10100, 10102 is merely illustrative and can be any other shape suitable for the operations described herein. In an alternative embodiment, the magnet in the door 104 can be rotatable and the magnet in the carrier shell 102 can be fixed. In still other alternative embodiments, the magnet can be movable in any manner suitable for operation as described herein. To release the latch, the handle 10101 connected to the rotating magnet 10100 can be rotated so that the poles of the magnets 10100 and 10102 repel each other and the latch is released. In alternative embodiments, any suitable manner, such as manually or through automation such as solenoids, springs, coils, latch keys similar to the latch key holes illustrated in FIG. 3L, or in other suitable devices. The magnet 10100 can be moved. In alternate embodiments, the latch can be in any other desired configuration.

  Referring now to FIGS. 4A-4E, the carrier 100 at each position as it is mated to the load port interface 10 is shown. Referring also to FIG. 4F, a flowchart illustrating the process of fitting a carrier to a load port interface according to this exemplary embodiment is shown. The locations and processes depicted in FIGS. 4A-4F are exemplary, and in alternative embodiments, the carrier can be interfaced with the load port in any other desired process. In the embodiment shown in FIG. 4A, the carrier 100 is located away from the load port interface, such as when the carrier arrives at the process tool (FIG. 4F, 10600). The carrier can be handled, for example, with an AMHS (not shown) supporting the carrier from the upper handle 112, but in alternative embodiments the carrier can be handled in any other desired manner. Although feasible, in the position illustrated in FIG. 4A, both the carrier chamber and the load port are closed. In FIG. 4B, the carrier 100 can be initially positioned at the load port (FIG. 4F, 10601). As an example, the positioning coupling portion 110 (on the mating surface of the bottom in this exemplary embodiment) of the carrier engages the complementary positioning coupling portion 20 of the load port 10. In this position, the side interface of the carrier is in an unmated state away from the load port flange 10500. Referring once again to FIG. 3, in this exemplary embodiment, the kinematic coupling mechanism 110 and the carrier positioning reference point or surface defined thereby may be located near the substrate seating surface or the center plane of the carrier, As a result, the effect of angular disposition between the constraint interfaces can be reduced. In the position shown in FIG. 4B, the carrier advances the carrier (FIG. 4F, reference numeral 10602) so that the carrier shell flange 10501 is roughly mated with the load port flange 10500 at the interface 101 (shown in FIG. 4C). ) Can be clamped against the load port interface 20A to hold the carrier in place (FIG. 4F, 10603). In this exemplary embodiment, carrier flange 10501 and load port flange 10500 include a kinematic coupling mechanism that defines repetitive positioning reference points, for example (as described below and also see FIG. 8) in interface 101. Can do. As described above, repetitive positioning at the carrier interface to the load port flange can establish and open a clean tunnel from the carrier chamber into the FEM without degrading the process atmosphere. As an example, referring to FIG. 4C, the carrier door 104 can be interfaced with the load port door 12 in the coarsely engaged position. As a feasible, the flexible interface 103 between the carrier shell and the door may cause positional differences that occur with respect to the carrier positioning at the interface 110, and the mating of the carrier door and the load port door at the interface 105. So that the interface 105 can be closed and the carrier door can be clamped to the load port door (FIG. 4F, 10604). In this exemplary embodiment, the load port door may have a vacuum port to purge any volume of interface 105 before clamping the carrier door to the load port door, but in an alternative embodiment, The interface 105 may be substantially free of volume. In this exemplary embodiment, the carrier door 104 can provide a clamp to the load port door of the carrier door at substantially the same time as the release of the latch between the carrier shell and the door, such as a latching device as described above, Can be clamped to the port door. In an alternative embodiment, independent clamps can be used to secure the carrier door and the load port door. In other alternative embodiments, a vacuum clamp can be used that acts on the entire carrier, such as via a vacuum bellows. The carrier door surface or local vacuum cup can clamp the carrier door to the load port door and assist in uncoupling the carrier door from the carrier shell. FIG. 4A shows how the load port door retracts and moves the carrier door into the FEM via the load port, as will be described later. In the exemplary embodiment shown in FIG. 4D, positioning between the carrier shell and load port at interface 110 can be relaxed. For example, it is possible to release an arbitrary holding clamp that holds the carrier shell in the positioning position, and to couple the kinematic couplings 110 and 20 by lowering the coupling pin 20A from the groove or raising the mating surface. It can be released at least partially (FIG. 4F, 10605). Since positioning at the interface 110 can be relaxed, the positioning coupling mechanism 101 (between the shell flange and load port flange) at the interface 101 can be engaged to position the shell 102 to the load port flange 10500. (FIG. 4F, code | symbol 10607). In this exemplary embodiment, the actuation input for positioning at interface 101 (and relaxation of positioning at interface 110) may be retraction of the load port door. As an example, due to the loose coupling (such as partial coupling) of the kinematic coupling mechanism at the interface 101 and the relaxed positioning at the interface, the slight pulling force that can be generated by the carrier door on the carrier shell as the door is retracted. The carrier can be suspended positionally in a manner sufficient to drive the carrier shell to complete engagement of the kinematic coupling mechanism at the interface 101, thereby providing complete positioning. Full positioning at the interface 101 can be effected by actuation of a clamp (not shown) that clamps the carrier shell to the load port flange (with yaw and pitch shown in the schematic diagrams of FIGS. 5A-B). In the positioning position at the interface 101, the carrier and load port doors 104, 12 can be lowered as shown in FIG. 4E (FIG. 4F, reference 10608).

Referring now to FIGS. 8-8A, there are shown a schematic perspective view and a side view, respectively, of a carrier 100 according to another exemplary embodiment. As described above and most clearly shown in FIG. 8A, the carrier shell defines the coupling portion 101B of the interface 101 (between the shell flange 102F and the load port flange 14, see also FIG. 3). It can have a fitting flange with a coupling mechanism. Referring now to FIG. 9A, there is shown a partial schematic perspective view showing the fit between the load port flange 14 and the carrier shell flange 102F in the load port flange interface 101, according to another exemplary embodiment. Yes. The interface configurations shown in these figures are exemplary, and in alternative embodiments, the carrier flange-load port interface can be in any other desired configuration. In the exemplary embodiment illustrated in FIG. 9A, the load port flange 14 may be disposed on a frame member or septum that defines the load port of the load port portion. An interface seal can be provided around the load ports 16A-16C to seal the interface when closed, and a clamping device (eg, shown as magnetic clamp pad 10700) engages the carrier shell 102. The carrier shell 102 can be positioned to hold it on the load port. In alternative embodiments, the interface seal and clamping device can be in any desired configuration, such as a vacuum clamp. In the exemplary embodiment shown in FIG. 9A, the load port flange 14 may have a coupling mechanism that defines a complementary coupling portion 101 A of the interface 101. In this exemplary embodiment, each of the coupling mechanisms 101A, 101B defines a kinematic coupling for repetitive positioning of the carrier shell 102 at the interface 101 with respect to the load port. As mentioned above, the features of the kinematic coupling 101 shown in FIGS. 8, 8A, 9A-9C, and 10 are merely exemplary, and in alternative embodiments, the kinematic coupling may be any other suitable Can be configured. In this exemplary embodiment, the kinematic coupling 101 includes pins 22, 24 (coupling portion 101A) on the load port flange 14 and grooves or detents 122, 124 (coupling portion 101B) on the carrier shell flange 102F. ). Pins 22, 24 and grooves 122, 124 repetitively place the carrier shell 102 in the X, Y, Z direction relative to the load port, and shell flange 102F and load port flange 14 (eg, for seating interface seals) Arranged so that the carrier shell 102 can be given pitch and yaw degrees of freedom when moving to the interface 101 (see FIGS. 4C and 5A) so as to overcome the gradient difference between them (shown in FIG. 5A). be able to. For example, the pins and grooves can be positioned substantially in the center plane of the carrier shell 102 and load ports 16A-16C. When the carrier shell 102 and the load ports 16A-16C are roughly coupled at the interface 101, the coupling relaxes restrictions from the kinematic coupling 110, such as by decoupling the coupling pin 20A of the coupling 110. For example, it can be arranged as shown to provide sufficient Z support to do so. Decoupling of the coupling 110 may be performed on the carrier (eg, via a shuttle or other suitable lifting mechanism) to transfer the Z load onto the coupling pins 22, 24 to decouple the coupling pin 20A. Can be supported by the Z 'movement. FIG. 10 is a schematic plan view showing the carrier in the fitting position on the interface 101.

  Referring now to FIGS. 21-25, one example of transferring carrier positioning from the kinematic coupling 110 to the interface 101 without over-constraining the object 6000 is detailed according to one exemplary embodiment. To do. As can be seen from FIG. 21, for example, an object 6000 located on the coupling plate 6010 (second carrier interface) of the load port 6099 is shown. Although object 6000 may be representative of carrier 100, in alternative embodiments, object 100 may be any suitable object. Coupling plate 6010 may include a kinematic coupling 6030 for coupling object 6000 to plate 6010. The kinematic coupling 6030 may be substantially similar to that described above with respect to FIG. For example, as shown in FIGS. 21A and 21B, the carrier 100 is configured to interface with pins 6031A-6031C (generally referred to as pins 6031) (second positioning mechanism) of the coupling plate 6010. Substantially V-shaped grooves 6032A-6032C (generally referred to as grooves 6032) (second carrier positioning mechanism) can be included. In alternative embodiments, the kinematic coupling may be any pin, groove in the carrier and coupling plate, or any other desired combination of pins, grooves, or other suitable kinematic coupling mechanisms. Other suitable configurations can be used. As most clearly shown in FIG. 21B, in this exemplary embodiment, the pin 6031 can have a curved interface surface and is at least partially within the V-groove 6032 to position the carrier 100 with respect to the load port 6099. It has a shape suitable for fitting. In alternative exemplary embodiments, the pins and grooves can be in any suitable configuration. The coupling may be compliant with SEMI (Semiconductor Equipment and Materials International) standard E57-0600. In alternative embodiments, the kinematic coupling can be any suitable kinematic coupling.

  Returning again to FIG. 21, the load port 6099 may be any suitable for moving the object 6000 toward or away from the interface 6013 to couple and uncouple the object 6000 to the interface 6013 (first carrier interface). A simple actuator 6020 (second carrier interface) can be included. In one embodiment, interface 6013 can be substantially similar to interface 101 and can include any suitable kinematic coupling. In alternative embodiments, the interface can be any suitable interface having any suitable coupling mechanism for coupling object 6000 to interface 6013. Referring to FIG. 22, in one example, a motion surface 6050 is included in the interface 6013, which may be a coupling or a coupling surface oriented obliquely relative to the plane of the plate 6010 (illustrated). As shown, this coupling surface is shown as being substantially perpendicular to the coupling surface of plate 6010). In alternate embodiments, the motion surface 6050 can be in any suitable angular relationship to the coupling plate 6010.

  The interface 6013 can be properly positioned on the moving surface and includes, for example, a kinematic coupling mechanism 6035, a preload 6060 for at least partially securing the object 6000 to the interface 6013, a port door, and a carrier And a suitable seal to seal the environment from the outside atmosphere (and within the chamber of the tool component to which the object is interfaced). Note that interface 6013 can include a latch to secure object 6000 to interface 6013 as described above with respect to FIGS. 3A-3I. The latch can be operated in conjunction with a preload 6060 or the like for fixing the object 6000 to the interface 6013. In this example, the preload 6060 can be a vacuum preload, but in alternative embodiments the preload includes any suitable, including but not limited to a magnetic or mechanical preload. It can be a preload. Suitable examples of preload include those described below with respect to FIGS. 12-12B.

  The kinematic coupling mechanism may be any suitable kinematic coupling, including but not limited to the kinematic pin 6035 (first positioning mechanism) shown in FIGS. 21-23. In this example, two pins are positioned on opposite sides of the interface 6013, but in alternative embodiments, any suitable number of pins can be positioned at any suitable location around the interface. The object 6000 (carrier) can have a corresponding recess or gap 6001 (first carrier positioning mechanism) for interfacing with the pin 6035 as shown in FIG. 23 (see also FIG. 22A). Pin 6035 and recess 6001 can be configured to hold and position object 6000 on moving surface 6050 in a predetermined relationship to interface 6013. The kinematic couplings 6035, 6001 create a repetitive position of the object 6000 relative to the interface, which can stabilize the object 6000 coupled to the interface without a preload system 6060 if necessary. Can be held.

  Referring now to FIGS. 22A and 22B, the interface (such as pins and recesses) between the object 6000 and the moving surface 6050 is shown in more detail. As is feasible, the pins and recesses shown in FIGS. 22A and 22B are exemplary only, and in alternate embodiments, the pins and recesses can be in any suitable configuration. In this example, the object 6000 can have an interface surface or surface 22000 that includes recesses 6001A, 6001B that substantially complement the pin 6035 to jointly define the kinematic coupling of the interface 6013. Recess 6001A can be configured to have a substantially conical shape, for example with a pilot hole (defining the Z position). Recess 6001B can be slot-shaped, for example, a substantially V-shaped groove having a pilot slot (defining the Y position). Pin 6035 (which can be the same on both sides of the load port) includes kinematic coupling lead pin 6035B (which gives slot 6001B freedom of transfer in the X and Z directions) and X axis, as shown in FIG. 22B. Kinematic parts are included that provide freedom of transfer along (restricted with respect to the Y and Z axes). In this example, the kinematic part 6035A of the pin 6035 is shown as having a substantially spherical shape; however, in alternative embodiments, the kinematic part may be any suitable, such as a substantially V-shaped. Can have various shapes. The interface can also optionally include a mechanical sensing pin for sensing, for example, the object 6000 and its placement relative to the interface 6013 when it is coupled to the motion surface 6050. In this example, the lead pin 6035B engages the pilot hole in the recess 6001A while the kinematic component 6035A engages the conical shape of the recess 6001A to position an object (generally similar to that shown in FIG. 9B). Can do. Recess 6001B can be provided with flexibility to engage a pin on the opposite side of the load port through the slot / groove while remaining in motion only in the X-axis direction. For example, lead pin 6035B can engage the pilot slot while kinematic component 6035A engages the V-groove (generally similar to that shown in FIG. 9C) of recess 6001B.

  Still referring to FIG. 23, the object 6000 can be conveyed or advanced toward the interface 6013 by the actuator 6020. If the movement of the object 6000 is constrained, for example, through contact with the interface 6013, while the coupling plate 6010 continues to advance, both the object 6000 and the coupling plate 6010 are advanced or moved toward the interface 6013. Can do. In an alternative embodiment, the pin 6031 can be movable relative to the coupling plate 6010 such that the pin 6031 advances with the object 6000 while the coupling plate is constrained at a predetermined distance. For example, the pin can be positioned on a sub-plate that is movable relative to the coupling plate 6010 and extends through a slot on the coupling plate 6010. In alternate embodiments, the object 6000 is provided with relative movement between the object 6000 and the pin 6031 in any suitable manner such that the object 6000 is engaged with the interface 6013 and substantially lifts away from the pin 6031. Can do.

  When the coupling plate 6010 advances beyond the engagement point between the object 6000 and the interface 6013, the object 6000 (and its groove 6032) and the pin 6031 (eg, as shown as arrows 6033 and 6034 in FIG. 24) Relative motion occurs in between, causing the object to ride on the motion pin 6031 as the kinematic pin 6031 is advanced further in the direction of arrow 6033 towards the interface. For example, referring also to FIG. 24, when the pin 6031 is moved relative to the V-groove 6032, the object 6000 is lifted from the coupling plate 6010 to engage the kinematic pin 6035 of the interface 6013. A gap 6070 is formed between the object and the object. V-groove 6032 is oriented so that both lifting and guiding forces (such as forces substantially parallel to coupling plate 6010) are generated by relative movement between grooves 6032 and pins 6031. be able to. The guiding force moves the object 6000 along the centerline CL relative to the pin 6031 as the object is lifted away from the coupling plate 6010 (see FIG. 21A) and advanced to engage the interface 6013. It can act to hold. In alternative embodiments, any suitable force can be generated via contact between the pin 6031 and the groove 6032 to guide the object 6000 towards the interface 6013.

  The interface between the pin 6031 and the groove 6032 lifts the object 6000 while allowing the object 6000 to pivot and move so that the object 6000 is not over constrained when the object 6000 is mated to the interface 6013. Can be configured. Referring to FIG. 25, the relationship between the pin 6031 and the V-groove 6032 when the object 6000 is coupled to the interface 6013 is shown. As shown in FIG. 25, a gap is formed between the pin 6031 and the V-shaped groove 6032 so that the pin 6031 does not substantially contact the groove 6032. In an alternative embodiment, coupling plate 6010 (after coupling object 6000 to interface 6013 to form gap 6071, for example by centering pin 6031 below and / or within one of grooves 6032. And / or the pin 6031) can be moved relative to the object. The gap 6071 allows the V-groove 6032 to be lowered and centered with respect to the pin 6031 so that the object can be removed from the coupling plate 6010, for example, when the object 6000 is released from the interface 6013. May be. To provide both engagement of object 6000 and interface 6013 and release of object 6000 from the interface and recombination of object 6000 and coupling plate 6010, the kinematic cup of interface 6013 and coupling plate 6010 Note that the ring can be properly constrained.

  Referring to FIG. 6, a schematic elevation view of a carrier 100 'according to another exemplary embodiment is shown. The carrier 100 ′ may be similar to the carrier 100 described above. In this exemplary embodiment, carrier 100 ′ can provide six degrees of freedom flexibility between kinematic coupling 110 ′ (similar to kinematic coupling 110) and kinematic coupling 101 ′. It has a flexible connection 130 '. In this exemplary embodiment, the kinematic coupling 110 'can be secured to the bottom surface of the carrier shell and the kinematic coupling 101' can be secured to the carrier shell flange. Thus, the flexible connection can be placed at any suitable location on the carrier shell between the flange and the bottom surface of the carrier shell. The positions shown in FIG. 6 are merely illustrative. In this exemplary embodiment, the wafer support structure can be secured to the flange. The flowchart shown in FIG. 6A illustrates an exemplary locking process between the carrier 100 'and the load port. For example, the carrier 100 ′ is conveyed to a load port (FIG. 6A, reference number 11001), and optionally to the load port (FIG. 6A, reference number 11002) in a manner substantially similar to that described above with respect to FIG. 4F, reference numbers 10600 and 10601. To be clamped. The load port shuttle advances the carrier 100 'to the carrier / load port interface (FIG. 6A, 11003). The load port door vacuum can be activated during advancement of the carrier 100 'so that particulate matter on the carrier surface can be removed during the carrier and load port interface connection. The load port shuttle presses the carrier 100 'against the carrier / load port interface in order to loosely couple the carrier to the load port (FIG. 6A, 11004). The carrier door is clamped to the load port door (FIG. 6A, 11005) and the shell flange clamp vacuum is activated (FIG. 6A, 11006). With the shell flange clamp, the carrier is engaged with the kinematic coupling so as to be clamped to the load port (FIG. 6A, reference numeral 11007), and the retraction of the carrier door is started (FIG. 6A, reference numeral 11008). The carrier door separates from the carrier (FIG. 6, reference numbers 11009 and 11010) and is lowered into the load port door storage area (FIG. 6A, reference number 11011). In alternative embodiments, the carrier can be positioned at the load port in any suitable manner.

  Referring now to FIG. 11, a schematic plan view of a portion of a coupling interface 110 'according to another exemplary embodiment is shown. In this exemplary embodiment, the coupling 110 ′ is flexible (eg, along the three main axes of X, Y, Z) to allow six degrees of freedom of the carrier shell, and hence the shell flange. You may have. In an alternative embodiment, the flexibility of the coupling can be less flexible. The flexibility of the coupling is schematically represented in FIG. 11 by the flexibility of the coupling pin 20A in the X, Y, and Z directions. In alternative embodiments, the flexibility of the interface 110 '(see also FIG. 3) can be transferred to the shuttle plate, load port flange coupling, shell flange, shell coupling groove for bottom coupling, or coupling groove. It can be provided at one or more other suitable locations, such as a shell attachment. As can be achieved, the flexibility can be distributed in a number of locations, such as Z flexibility at the pin, X and Y flexibility at other locations such as the shell flange.

  Referring now to FIGS. 12-12B, there are shown schematic elevation views of a carrier 1100 and a load port 1010, respectively, according to another exemplary embodiment. In this exemplary embodiment, the load port and carrier can have a generally wedge-shaped door that can interface with each other. The carrier and load port door can be clamped and opened by movement of a single axis such as the Z axis. In this exemplary embodiment, the carrier and load port positioning mechanism 1107 for carrier vertical loading (kinema) positioned on a load port flange (such as the same surface on which the door / carrier / load port) can be positioned). For example, positioning between a carrier and a load port corresponding to tick coupling). As can be realized, the positioning interface mechanism can be any arrangement that does not over-limit the interface, including the V-groove and pin mechanism shown in FIGS. 12-12A. In the exemplary exemplary embodiment, the interface is configured to preload the coupling while the carrier CG is mechanically stable. In this exemplary embodiment, the door arrangement can form the pod door opening diagonally. This angle is defined by the direction in which the load port pulls the door out of the carrier. This may form a continuous plane that allows each of the port and port door to be sealed to the carrier. The movement axis of the load port can be inclined at the angle of the opening. In an alternative embodiment, this motion can be performed with two vectors, producing a short angled motion that changes to a pure vertical motion, as shown in FIG. 12B. The drive for the door movement can be from a single source and the cam motion can be performed to form two motion vectors with one action line, for example. As is feasible, in this exemplary embodiment, all physical interfaces between the carrier and the load port can be on the same surface, similar to the bottom opening pod, and with a single axis of motion. The door can be opened. Further details of carrier-to-load port positioning for kinematic coupling are described in US patent application Ser. No. 11 / 855,484, filed Sep. 14, 2007, all of this disclosure. Is incorporated as part of this specification.

  Referring now to FIG. 13, there is shown a schematic elevation view of a carrier and load port interface in accordance with yet another exemplary embodiment. The carrier 7000 can be configured to hold a self-contained gas supply device 7001 for purging the carrier or the like. The gas supply device can include any suitable gas, such as nitrogen, by way of example only. In this exemplary embodiment, a hollow volume can be provided that forms a chamber 7002 made of a material that can be integrated with a carrier and contain a purge gas. The material density may be of metal or polymer but with a thin cross section. Thereby, the increase in weight due to the higher density material can be minimized. The chamber 7002 can be connected to the internal cavity 7003 of the pod 7000 when the wafer is present, for example, via a check valve. The check valve can play a role of adjusting the pressure inside the pod and preventing excessive pressurization. The chamber can be pressurized at the load port or other nest locations in strategic areas within the process. Once pressurized, the carrier 7000 can be stored without being connected to the gas supply device for an extended period of time. This period can be determined depending on the size of the chamber and the quality of the seal in the pod.

  As shown in FIG. 13A, in an alternative embodiment, the gas supply device 7001 'can be external to the carrier 7000'. The gas supply device 7001 ′ can be removably coupled to the carrier 7000 by any suitable coupling. In this example, as described above with respect to FIG. 13, the gas supply device can be reloaded or replaced with another gas supply device when fewer gas supply devices are available.

  According to another exemplary embodiment, a low power pressure sensor 7004 can be integrated on the carrier 7000. The sensor 7004 can measure the pressure in the carrier and issue an alarm if the pressure falls below a critical value. The AMHS system can be instructed to retrieve the carrier 7000 from its current location and place it on the purge nest for reloading.

  Suitable examples of carrier gas supply devices can be found in US patent application Ser. No. 11 / 855,484, which is already incorporated as part of this specification.

  When the carrier is pressurized with gas via, for example, the gas supply devices 7001 and 7001 ′ when the wafer is stored or transferred, contamination of the wafer can be minimized when there is a leak in the carrier seal. For example, if there is a leak in the door seal, the pressurized gas in the carrier is exhausted from the carrier through the leak without allowing contaminants to enter the carrier, but the carrier is in a vacuum environment. In such a case, an external atmosphere (including contaminants) tends to be drawn into the carrier on which the wafer exists. In one embodiment, for example when the carrier is positioned at a load port or designated carrier cleaning station, the carrier is pumped down and reloaded with a predetermined gas to remove contaminants from within the carrier. be able to. As feasible, wafer contaminants in the carrier can also be removed during pump down and reload with a given gas.

  Referring now to FIG. 14, there is shown a partial schematic cross-sectional view of a carrier and load port interface according to another exemplary embodiment. As may occur, there may be a pressure differential between the carrier environment and the load port environment before the carrier 8000 is opened. As the carrier door 8001 opens, the pressure becomes uniform and undesirable airflow can be introduced throughout the wafer carrier. This air turbulence can deposit particulate matter and damage or destroy the wafer in the carrier 8000. When the carrier door 8001 is closed, the exhaust air volume in the carrier is pushed outward. This air volume can pass over the wafer before it exits into the loadport environment and can deposit harmful particulates.

  In this exemplary embodiment, an airflow channel 8010 may be provided within the carrier shell shape that defines a low resistance path for passage through the interior upon entry or exit of air or any other gaseous fluid. Channel 8010 can be located around the periphery of the carrier shell or at any other suitable location to allow outflow of gas from carrier 8000. Channel 8010 provides a path for air / gas to flow when carrier door 8001 opens and closes, pressure relief during opening and closing door 8001, ports for exhausting oxygen or other undesirable particulates, and / or wafers. Actively control the airflow around the cassette (such as by draining or injecting fluid). In this exemplary embodiment, these channels can be exposed to a vacuum source and / or a fluid source as needed when placed on a load port (or other interface). In an alternative embodiment, these ports can be opened to the appropriate environment so that gas can flow through the channel to / from the carrier to the environment. To prevent back flow of gas to / from the carrier through channel 8010, a suitable valve, such as check valve 8020, can be placed in channel 8010. In an alternative embodiment, a separate positive pressure port can be used to introduce gas into carrier 8000 through channel 8010.

  As an example, as carrier 8000 is placed on the load port surface, the area around flow channel 8010 is sealed with any suitable seal, such as seal 8025. Prior to opening the carrier door 8001, a vacuum flow is initiated to remove debris or trapped gas that may remain on the carrier surface. Because the flow range is large and the pressure is low, the pressure difference between the load port and the carrier environment is easily equalized as the door 8001 is opened. In an alternative embodiment, the pressure can be equalized by introducing gas into the carrier through the channel so that the pressure in the carrier matches the pressure of the processing environment in which the carrier is installed. When the carrier door 8001 is closed, a large amount of air / gas present in the carrier must be exhausted. The flow channel 8010 and associated vacuum provide a low resistance path for fluid movement. This alleviates the “piston effect” that could otherwise occur in the gas in the carrier 8000 and eliminates air turbulence across the wafer.

  Referring now to FIGS. 7A-7C, there are shown a cross-sectional view and a partial perspective view, respectively, of a load port plate 14, ie a septum and a carrier, according to another exemplary embodiment. The plate defining the load port or load port 14 in this exemplary embodiment may be similar to the load port described above. As shown in FIG. 7A, the load port 14 can be fitted to the FEM 4 that may conform to the SEMI standard E63 on the BOLTS surface. In this exemplary embodiment, load port 14 is positioned to provide a door opening (such as load port door 12 with carrier door 104 clamped) outside the BOLTS interface surface. As most clearly shown in FIGS. 7B-7C, the load port bulkhead can define a recess or cavity that accommodates door movement. The cavity can be shielded from the FEM, as illustrated, so that the cavity is substantially hidden from within the FEM. Also, in this exemplary embodiment, the septum surface can be substantially continuous along the BOLTS interface (other than the port), minimizing structures that can inhibit gas flow in the FEM. In this exemplary embodiment, a return flow path for recirculation of gas in the FEM at the load port partition, as shown, for example, in FIGS. 1A-1B, to assist in maintaining the door cavity in a clean area. Can be formed. The gas can be directed into the cavity with a suitable resistor. In an alternative embodiment, an injection or discharge line for introducing or removing gas from an external gas supply can be plumbed directly to the load port. Referring also to FIG. 10, in this exemplary embodiment, the door opener mechanism 111 can be positioned outside the clean area. In this exemplary embodiment, the door opener mechanism or door actuator may be similar to the actuator 5000 shown in FIGS. 19-20, but in alternative embodiments, the door actuator may be any actuation system. Alternatively, a combination of a plurality of operating systems may be used. As can be realized from FIGS. 7A and 7B, in this exemplary embodiment, the interface surface of the load port bulkhead interfaced to the carrier shell can be offset from the BOLTS interface to accommodate the door cavity between the two. it can. Thus, referring now also to FIG. 3, in this exemplary embodiment, when the carrier shell is docked to the BOLTS interface according to the SEMI specification, it corresponds to an offset in the load port interface and a reference on the surface of the carrier. Can be configured to maintain.

In one embodiment, the latch that couples the carrier door 104 to the load port door 12 can be actuated by, for example, any suitable actuator, such as the actuator described above with respect to FIGS. As one example, in an alternative embodiment, the door actuator may include a bladder actuator similar to the bladder actuator described herein, and the door (or other actuating component) in any desired manner. Can be combined with, for example, an electric motor, lead screw, pneumatic cylinder, or any other suitable drive. In another example, when the carrier is mated with the load port, the atmosphere in the carrier can be adjusted to match the atmosphere of the processing tool with an appropriate flow line such as a vacuum line or purge line. . In one example, the interior of the carrier can be pumped down to a predetermined vacuum to create a pressure differential between the interior of the carrier and a cavity, for example, to accommodate door movement. This pressure differential can cause the actuator drive surface 5035 to move, thereby actuating a latch mechanism or device that couples the carrier door 104 to the load port door 12. In another embodiment, when the carrier door 104 is repositioned on the carrier, the latch between the carrier door and the load port door can be released, for example, by pressurizing one side of the actuator. For example, the carrier can be filled with an inert gas such as nitrogen to transport the substrate in the carrier. The pressure created in the carrier by filling the carrier with inert gas exerts a force on the drive surface of the door actuator (similar to the surface 5035 of the actuator (similar to 5000, see FIGS. 19-20)). The actuator can be moved, thereby releasing the latch between the carrier door 104 and the load port door 12. By actuating the same or another actuator 5000, substantially The carrier door 104 can also be latched to the carrier in a manner similar to that of FIG .. In an alternative embodiment, one side of the actuator 5000 can be pressurized to latch the carrier door to the load port door. However, in other alternative embodiments, the carrier door and load port may be used. A pressure differential may be used to release the latch between the door and the door.In yet another alternative embodiment, the pressure differential is applied in a manner suitable for moving the actuator, or one side of the actuator. It is feasible that the vacuum source or pressure source for actuating the actuator 5000 is a cavity to accommodate, for example, a flow line or door movement for the carrier purge or pump described above. It can be from any suitable source, such as a register located within. In other embodiments, the linear motion of the actuator can be converted to rotational motion in any suitable manner. In an alternative embodiment, the actuator has two degrees of freedom that have any spatial relationship to each other. Two bladders connected to a common actuator chamber can be included, for example, the second bladder can be substantially connected to the door interface surface such that the substrate passage opening is not obstructed by the door. While configured to move in parallel, one of the bladders can be configured to move the door substantially perpendicular to the door interface surface of the substrate passage opening.

  The mapping of the carrier substrate can be effected in any desired manner. As a non-limiting example, the substrate mapping can be done optically with a through beam sensor (flip-in sensor), a through beam sensor through a transparent window on the side of the carrier, or any other suitable optical sensor. it can. As another non-limiting example, the sensor mapping is mechanically with an air sensor implanted in the support, opto-mechanically with a plunger actuated by a wafer whose motion is sensed with any suitable sensor, and proximity. It can be done mechanically by sensors and by strain gauges that measure the strain of the support substrate support under the weight of the support and wafer. In alternate embodiments, the substrate can be mapped in any suitable manner.

  Referring now to FIGS. 15 and 15A, there is shown a schematic elevation view of a substrate processing apparatus or tool 1002, and a carrier 1100 connected thereto, according to another exemplary embodiment. In the exemplary embodiment illustrated in FIG. 15, the processing apparatus 1002 is generally similar to the previously described substrate processing tool 2 illustrated in FIG. 1, and similar features are labeled with similar reference numerals. The process tool 1002 can generally have a process portion 1006 and an FEM 1004 (following a reference convention that can be considered as an example, but loading a wafer into the tool from the front). In this exemplary embodiment, process unit 1006 and FEM 1004 may share a common controlled environment or atmosphere (such as inert gas (N 2), (Ar), or very clean dry air). . The process unit 1006 is shown in schematic form, and one or more process units or modules connected to the FEM 1004 (the arrangement shown in FIG. 15 is merely exemplary, and in an alternative embodiment, the FEM and process unit Modules can be connected to each other in any desired arrangement). The process portion or module 1006 can be separable from the FEM 1004, such as by a closeable opening (such as a gate valve). Therefore, the process unit can also have a process atmosphere different from the FEM atmosphere. In an alternative embodiment, the process section can include a load lock that allows connection of the process module with a dissimilar atmosphere or holding a vacuum to the FEM, as described below.

  The FEM 1004 in the exemplary embodiment shown in FIG. 15 may be similar to FEM 4 (see FIGS. 1-14) except as otherwise noted. The FEM 1004 can include appropriate environmental controls to maintain the desired controlled environment or atmosphere within the FEM as the substrate is transferred to / from the process unit 1006. For example, the FEM 1004 may include a controller 31000, one or more fluid control valves 31010, 31020, a pressure relief or check valve 31030, and sensors such as, for example, a pressure sensor 31040, a contamination sensor 31041, a temperature sensor 31042. it can. The controller can be configured to adjust or control attributes such as temperature, pressure, and gas flow rate of the controlled environment within the FEM (and process unit 1006). For example, the controller 31000 can receive signals from the pressure sensor 31040, the temperature sensor 31042, and the environmental pollution sensor 31041. The controller can increase or decrease the pressure in the FEM or increase or decrease the airflow 31050 in the FEM by actuating appropriate valves 31010 and 31030 according to the environmental information in such signals. The controller 31000 can also be configured to raise or lower the gas temperature in the FEM based on the temperature measurement provided by the temperature sensor 31042 (such as through adjustment of the coolant flow through the radiator 31060). Although the controller 31000 and associated valves and sensors are described with respect to FIGS. 15 and 15A, as feasible, the controller 31000 can be used to control the environment of other embodiments disclosed herein. can do.

  The FEM 1004 can include a substrate transport apparatus or robot 1004R that can hold and transport a substrate, which robot can be of any desired type as feasible. Similar to FEM 4 described above, in this exemplary embodiment, FEM 1004 includes a carrier for interfacing one or more carriers 1100 to tool 1002 to allow loading and unloading of substrate to tool 1002. An interface 1010 can be included. The FEM 1004 interface, sometimes referred to herein as a load port, and the corresponding complementary interface portion of the carrier 1100, without degrading the controlled environment within the FEM 1005 and process unit 1006, The substrate can be configured to be loaded and unloaded between the carrier and the FEM. The complementary interface portion of the FEM load port 1010 and carrier 1100, sometimes collectively referred to as the carrier-to-FEM interface, can be arranged so that the carrier 1100 interfaced to the FEM is integrated into the tool. . By way of example, a carrier so integrated via an interface shares the same controlled atmosphere as the FEM so that the FEM transfer robot 1004R can transfer a substrate directly from the carrier 1100 to a process unit or process module. Thus, a chamber can be defined that can hold the substrate in the same controlled atmosphere as the FEM. Similar to the previous exemplary embodiment, the carrier-to-FEM interface in the exemplary embodiment shown in FIG. 15 is a clean tunnel (FEM and process unit) of the entire process unit that continues from within the carrier chamber through the interface into the FEM. Defined above) with substantially the same cleanliness as the whole. The clean tunnel can be freely closed (such as when the carrier is removed from the load port) and opened without degrading the clean tunnel. In the exemplary embodiment shown in FIG. 15, the carrier-to-FEM interface can be directly integrated into the tool (substantially described above), regardless of the carrier environment prior to interface connection, as described below. It can also be arranged. Thus, in the exemplary embodiment illustrated in FIG. 15, as described below, the carrier 1100 is interfaced to a process tool having a variety of dissimilar environments (clean air to inert gas environment, or clean air to vacuum). Once connected and directly integrated, it can be transported directly between tools with different dissimilar environments and interfaced and integrated again with the tool. Thus, a substrate in one tool with a controlled environment can be transported directly from the process unit (similar to the process unit 1006) through the clean tunnel into the carrier by the FEM robot, and in some cases the carrier 1100 can be Directly transport and interface to other tool FEMs (similar to FEM 1004) that may involve dissimilar / different controlled environments, and the substrate through a clean tunnel defined at this point in the other tool, The controlled environment in the other process tool can be directly transferred to the process unit by the FEM robot without deteriorating the controlled environment. In effect, a carrier-FEM interface combined with a carrier can be considered as defining an external load lock or a carrier load lock.

  Still referring to FIG. 15 and as described above, the load port 1010 of the FEM 1004 may be similar to the load port 10 described above. In the exemplary embodiment illustrated in FIG. 15, load port 1010 is shown interfaced to one carrier 1100 as an example, but in alternative embodiments, the load port can include any desired number of carriers. It can be arranged to be interfaced with. For example, in an alternative embodiment, the load port can have a general laminate structure that can interface to multiple carriers arranged in a stack similar to the arrangement shown in FIG. In this exemplary embodiment, the load port 1010 is on the load port to pump down the carrier when the carrier is on the load port, eg, to remove molecular contaminants from within the carrier and the substrate within the carrier. A vacuum source 1010V that can be connected to the carrier 1100 held in the circuit can be provided. Conversely, the carrier may be interfaced with a load port to communicate with the vacuum source 1010V and positioned to withstand the atmospheric pressure in the carrier casement when the carrier is pumped down to vacuum. As described above, the vacuum source 1010V for pumping down the carrier loads the carrier door via a pressure differential in a manner substantially similar to that described above with respect to FIG. 7 (see also FIGS. 19 and 20). Actuation of the actuator 5000 for coupling to the door can also be provided. For example, the load port door can be interfaced to the carrier door via a vacuum interface. The internal volume of the carrier may be pumped to a higher vacuum than the load port / carrier door vacuum interface to create a pressure differential to effect actuator movement between them. In another exemplary embodiment, a vacuum interface between the load port door and the carrier door can provide movement of the actuator 5000 to latch the carrier door and the load port door together. In alternative embodiments, the surface of the actuator can be pressurized in any suitable manner, such as when the carrier is purged with an inert gas, as already described above. In an alternative embodiment, a vacuum / purge flow line (actuator seals around the flow line) that interfaces directly with the actuator to create a pressure differential on the load port door or to pressurize one face of the actuator. Etc.).

In the exemplary embodiment shown in FIG. 15, the carrier is illustrated as a side opening carrier (having a carrier door positioned within the side wall of the carrier), but in an alternative embodiment, the carrier door is positioned above the carrier. Or it can be located in any carrier wall, such as the bottom wall. The carrier 1100 can be of any desired size and can be a small lot carrier (such as one corresponding to 5 or fewer substrates), or 13, 25, or any other desired number of substrates. It can have any corresponding desired transport capability. The carrier may be a metal housing, such as aluminum or stainless steel, or any other material (including metals for non-metallic materials or lined non-metallic materials), such that the housing is substantially impermeable to gas molecules. Can have. As described above, a vacuum is maintained within the carrier housing with the exterior of the carrier housing under atmospheric pressure (eg, a sufficiently high vacuum for effective removal of molecular contaminants in the carrier). And a vacuum such as 1 × 10 ⁻³ Torr comparable to a vacuum process). The carrier housing structure can be configured to have any suitable wall thickness (such as, but not limited to, about 1/8 inch in the case of stainless steel) and to minimize carrier housing deflection. Can have stiffeners 10950 appropriately dimensioned and positioned along one or more of the side, top, and / or bottom surfaces of the carrier shown in FIG. The stiffener 10950 can be configured as a rib or any other suitable reinforcing member to minimize carrier wall deflection. In another exemplary embodiment, the carrier wall can be a dome wall 10960 so that, for example, circumferential stress can be used to reinforce the wall and minimize carrier deflection as shown in FIG. In alternative embodiments, the carrier wall can be any suitable configuration for minimizing wall deflection. The carrier 1100 has a coupling mechanism similar to the carrier 100 described above (e.g., for docking with a load port upon delivery from an aerial transport and for providing a clean tunnel through the load port, at a corresponding load port opening. Kinematic couplings, etc.) for engaging the carrier side openings. The carrier housing can be suitably configured so that the deflection of the carrier housing does not degrade the operation of the coupling when the interior of the carrier is exposed to a vacuum. The carrier 1100 may have suitable passages and orifices or ports so that when the carrier and load port are connected or coupled, the load port vacuum source 1010V is automatically coupled to the carrier housing and communicates with the interior of the carrier. The location of the vacuum port shown in FIG. 15 is merely exemplary, and in alternative embodiments, the vacuum port can be arranged as needed. For example, in an alternative embodiment, the vacuum passages and ports on the carrier (and conversely on the load port) may be similar to that shown in FIG. 14 (between the carrier side and the load port rim). For example, a flow channel formed on the mating surface of the carrier in the sealing interface region of As feasible, the carrier seal (see FIG. 3) has the desired integrity to withstand a vacuum across the seal.

  As shown in FIG. 15, in the illustrated exemplary embodiment, the carrier 1100 can be communicatively connected to a gas supply such as a vent or purge gas. In the exemplary embodiment shown in FIG. 15, the carrier 1100 can be communicatively connected to the gas source 1010G when seated on the carrier support of the load port 1010. As achievable, the carrier may be connected to an appropriate intake port (plug (and, for example) automatically (eg automatically) coupled to the nozzle of the gas supply 1010G, such as when the carrier is placed on the surface of the load port support. The arrangement of the gas source interface between the load port and the carrier shown in FIG. 15 is merely exemplary, and in an alternative embodiment, the carrier and load are shown in FIG. The gas source interface to the port can be in any other desired position and configuration, as described above, the gas source 1010G can be purged and placed on a carrier seated or positioned at the load port 1010, for example. And / or the ability to provide a vent gas, for example, a carrier In a state where 100 is properly placed in the load port 1010 (such as from an aerial transporter) and the gas supply nozzle is connected to the carrier in order to supply gas into the carrier housing, purge gas (such as N2) is used as necessary Can be fed into the carrier (depending on the carrier's internal atmosphere when placed in the load port and with the environment in the FEM maintained), so that the carrier can have some process atmosphere (e.g. If the FEM 1004 is maintained in an inert gas or very clean air atmosphere that does not have to resemble the carrier atmosphere, such as from the tool interface, the placement at the carrier load port Sometimes, a desired purge gas is supplied into the carrier, such as through the gas supply device 1010G, to The carrier atmosphere can be purged so that the rear is interfaced to the load port opening and integrated into the previously described tool 1002. Further, the carrier atmosphere is not compatible with the FEM environment or provides undesirable contaminants. If the carrier is placed in the load port (but before opening the carrier interior to the FEM environment, for example), a vacuum is used to remove any possible contaminants from the carrier. The inside of the carrier is pumped to a sufficient vacuum via the source 1010V and filled with an inert gas (N2, very clean air, etc.) similar to the environment in the FEM, and the carrier can be integrated with the tool as described above. As described above, the purge gas supply device 1010G is provided with the vacuum source 101. In addition to the V or alternatively to this, it is possible to operate the actuator 5000 in a substantially similar manner to the embodiments described above. Information regarding the carrier atmosphere can be read (or accessed) with a suitable reader at or adjacent to the load port 1010 used when loading the carrier, or an RFID (wireless IC) tag or other suitable data storage device Can be stored on top. Therefore, appropriate information about the inside of the carrier can be obtained by the tool controller (see also FIG. 16) and confirmed with the desired protocol, and if necessary, the carrier can be Can be pumped and vented. For example, information about the carrier atmosphere can be recorded on the carrier-mounted storage device when the carrier is docked in the load port or at another suitable time. Such information can also be tracked by the FAB wide controller as necessary. As can be realized, the carrier 1100 can also be interfaced to a FEM, which can have no vacuum and gas supply connection. In alternative embodiments, the carrier can include an internal or built-in source of purge gas to cause the carrier to be purged when placed in the load port. As is feasible, in an alternative embodiment, the load port interface interfaced to the carrier can comprise a vacuum connection, for example with a gas supply by providing gas from a gas source built in the carrier. It can not be. Thus, as feasible, the carrier can now serve as a substrate cleaning chamber for the tool by storing the substrate in the tool such that the substrate is cleaned. As feasible, carrier pump / venting can also be performed prior to removing the carrier from the load port, such as during relocation to a conventional tool.

  As mentioned above, the placement of the load port and carrier on the tool interface shown in FIG. 15 is merely exemplary, and in alternative embodiments, the interface can be in any other desired configuration. For example, the gas supply device can be arranged to vent the gas in the FEM environment into the carrier as needed after the pump inside the carrier. Referring now also to FIG. 16, a plan view of another processing tool 7002 according to another exemplary embodiment is shown, and the tool 2002 in the exemplary embodiment shown in FIG. (Similar features are labeled with similar symbols) and the tool 2002 has a desired controlled atmosphere (inert gas or very clean air). Can have processing modules 2006, 2006A, and FEM 2004. Connecting one or more process modules 2006 to the FEM so that the FEM transport robot 2004R can pick up / place a substrate in the process modules (as shown in FIG. 16 and similar to the embodiment shown in FIG. 15) Can do. Process module 2006, 2006A (FIGS. 15, 16, 16A show one process module, but in an alternative embodiment, the stacked process modules are coupled to each of the FEM or one or more transfer modules. Can share a common atmosphere with FEM 2004. The FEM 2004 may have a loading interface or load port for loading and interfacing the carrier 2100 to the tool in an integrated manner similar to that previously described. The FEM transfer robot 2004R in this exemplary embodiment can pick up / place the substrate directly between the carrier 2100 and one or more process modules 2006 via a clean tunnel similar to the previously described clean tunnel. it can. In the exemplary embodiment shown in FIG. 16, the clean tunnel 2005 defined into the carrier via the FEM interface 2010 and extending into the process modules 2006, 2006A can be of different lengths or configurations (eg, U.S. Application No. 11 / 442,511, filed May 26, 2006, and U.S. Application filed July 22, 2003, both of which are incorporated herein by reference. No. 10 / 624,987, U.S. Application No. 10 / 962,787, filed October 9, 2004, U.S. Application No. 11 / 442,509, filed May 26, 2006, and 2006. In a manner similar to US application Ser. No. 11 / 441,711 filed May 26, In this exemplary embodiment, the transfer module 2008 can be connected to the FEM so that the FEM robot can pick up / place the substrate into the transfer module. The location of the transfer module is merely illustrative. As is feasible, the clean tunnel can continue to extend from the FEM through the transfer module. More or fewer transfer modules 2008, 2008A can be connected to each other (such as those shown in dotted lines in FIG. 16, for example, in series) to change the length and configuration of the clean tunnel as needed. Process modules (similar to modules 2006, 2006A) can be transferred to / from the carrier 2010 and any desired process module or via a clean tunnel between any desired process modules, for example, Can be combined with a clean tunnel. In an exemplary exemplary embodiment, the transfer module 2008 may have a transfer robot within the module, eg, to transfer a substrate to / from the process module 2006A or to an adjacent transfer module / chamber 2006A. In an alternative embodiment, the transfer module can have no internal robot, and the substrate can be placed / taken therefrom by a robot inside the module adjacent to the clean tunnel 2005, as described below with respect to FIGS. 16A, 16B. It is done. In still other exemplary embodiments, the transfer module can be any suitable length and can include any suitable substrate transfer device. For example, as shown in FIG. 16A, the clean tunnel 2005 ′ can be substantially similar to the clean tunnel described above with respect to FIG. 16 and has an elongated chamber having a transfer carriage configured to traverse the chamber. A module can be included. The transfer carriage is a transfer carriage described in US patent application Ser. No. 10 / 962,787 filed Oct. 9, 2004, the entire disclosure of which is incorporated by reference. It can be a similar passive trolley. For example, the transfer carriage can be a moving carriage that can be integrated with the chamber. The carriage can be configured to move back and forth in the chamber between the front 18F and the rear 18B. The trolley can define multiple independent transport paths within the clean tunnel (such as one for each load port door or one for each processing module in a module stack coupled to the clean tunnel). The trolley can be configured to traverse the chamber so that particulates (which may contaminate the substrate) are not introduced into the clean tunnel 2005 '. By way of example only, in one embodiment, the carriage may be a magnetically suspended carriage, or any other suitable for moving the carriage without releasing contaminants into the clean tunnel. It is also possible to have a simple drive. The carriage of the transport apparatus 2004R ′ has an end effector for holding one or more substrates. As also shown in FIG. 16A, transfer chamber 2004T is coupled to a clean tunnel 2005 '. One or more transfer chambers 2004T may include a transfer arm 2004R (configured for operation in a vacuum environment or the like) for transferring substrates from the carriage 2004C into the processing chambers 2006, 2006A coupled to the transfer chamber 2004T. Can do. In this exemplary embodiment, transfer arm 2004R in the transfer chamber defines a plurality of transfer paths, such as transfer paths that are vertically stacked or offset to vertically offset process modules in communication with the transfer chamber. be able to. To pick or release the substrate from the trolley 2004C, the trolley 2004C can be aligned to the desired module / port, and the arm 2004R places an end effector for picking / releasing the substrate on / from the trolley 2004C. Then, it is extended / retracted via the corresponding port. In this example, the clean tunnel is a clean tunnel extension length that can extend the clean tunnel in any suitable direction, for example, to form a grid through which the carriage 2004C can pass to transport the substrate from the carrier 2100 to the processing module. 2005E can be included. As can be realized, there may be a plurality of transport paths for the carriage 2004C that can be followed while traversing the clean tunnel 2005 ', 2005E. In one example, the carriage path is adjusted vertically to allow the carriage to pass over its top / bottom or to align the carriage with the processing modules / transfer chambers stacked in a vertical stack. Can be arranged perpendicularly to each other. In an alternative embodiment, the carriage transport paths can be spaced horizontally from one another. The FEM 2004 ′ shown in FIG. 16A can be substantially similar to the FEM 2004 in FIG. 16, but the FEM 2004 ′ includes one or more load ports for coupling the carrier to the FEM. be able to. In this example, the load ports are shown spaced horizontally apart from each other, but in alternative embodiments the load ports can be vertically spaced from each other vertically. .

  Referring now to FIG. 16B, another exemplary processing tool is shown. In this example, the processing tool includes a clean tunnel 2005 "that can be substantially similar to clean tunnel 2005 ', 2005E. Similarly, the transfer module and the processing module can be coupled to the clean tunnel 2005 ''. In this example, the transfer device 2004C ′ is a passive or active carriage (including a substrate transfer arm / robot, etc.), a series of transfers configured to pass a substrate from the robot to the robot positioned in a substantially straight line within the clean tunnel. It can be any suitable transport device, such as a robot or other suitable device for transporting substrates through the clean tunnel 2005 ″. In another alternative embodiment, the clean tunnel can be formed by a series of transfer modules including a transfer arm configured to hold a substrate. The transfer modules can be coupled together to form a clean tunnel. The ports that allow passage between the process module, transfer module, clean tunnel, and carrier allow each part of the tool 2002 ′ to include different atmospheres in one or more of the various parts of the tool 2002 ′. It should be understood that it can be configured to be isolated.

  Referring once again to FIG. 16, in this exemplary embodiment, the clean tunnel transfer modules 2008, 2008A within the tool 2002 can share the common controlled (inert gas, very clean air, etc.) of the FEM. . In an alternative exemplary embodiment, one or more transfer modules 2008, 2008A may be used to allow each portion of the clean tunnel to maintain a different atmosphere (eg, the clean tunnel portion defined in the FEM may have an N2 environment). Part of the module 2008A can have a vacuum environment and the transfer module 20008 can be a load lock that can cycle the substrate between the inert gas atmosphere in the FEM and the vacuum atmosphere in the module 2008A) Can be configured as a load lock.

  As feasible, in addition to being able to interface with a FEM (similar to that shown in FIGS. 15-16), the carrier can interface directly to the vacuum portion of the process tool. Referring now to FIG. 17, a substrate process tool 3002 and a carrier 3100 connected thereto are shown. The carrier 3100 can be similar to the carrier 1100 described above. The processing tool 3002 is generally similar to the process tool described above, connected to the front load section 3004 (maintaining the previous convention that the tool is loaded from the front and the process section 2006 of the (process module) 3006). In the exemplary embodiment shown in FIG. 17, the front load 3104 can be configured to maintain a vacuum (or any other desired atmosphere). The load section 3104 has a chamber interface or load port 3010 that receives the carrier 3100 and can interface the carrier directly to the vacuum atmosphere in the load section, generally similar to the load port interfaces 10, 1010 described above, except as otherwise noted. be able to. It is feasible that a carrier opening-load port rim interface similar to that described above can be used when the carrier is integrated directly into it and opened (for example) to a vacuum atmosphere within the load 3004. Sufficient maintainability is provided so that there is no appreciable degradation in the clean tunnel extending from the atmosphere and from within the carrier through the carrier-load port interface, load section 3004, and process module 3006 in communication with the clean tunnel. Therefore, when the carrier is integrated with the clean tunnel, the substrate robot 3004R inside the vacuum load section picks up / places the substrate inside the carrier and the process module 3006, and directly transfers between them via the clean tunnel. Can do. The arrangement illustrated in FIG. 17 is merely illustrative. In this exemplary embodiment, the load portion can be positioned, for example, in front of a vacuum gate valve and can be interfaced with or connected to a port interface for carrier 3001 (similar to interface 101 described above, see also FIG. 3). Part 3012 can also be included. The front portion 3012 can have a closable opening (can be closed with a door similar to the door 8014 shown in FIG. 3) that allows the load portion to communicate with the interior of the carrier and extend the clean tunnel. As can be realized, the front part 3012 can interface the carrier and have a vacuum atmosphere when the carrier is opened. The front part can be configured, for example, so that the carrier door is removable from the carrier (similar to the previous one) into the front part via the load opening. In this exemplary embodiment, because the carrier 3100 can be a load lock (as described above), the front portion cannot be a load lock (although it is possible in alternative embodiments). Thus, the substrate can be held in the carrier, and the atmosphere (eg, an inert gas atmosphere that the carrier can hold during transfer between tools) is established in the process vacuum in the transfer chamber of the load section to establish a corresponding vacuum. (Such as a vacuum source 3010V similar to the vacuum source described above). With the desired vacuum established in the carrier, the vacuum gate valve can be opened so that the vacuum robot in the load section can pick up / place the substrate inside the carrier. The carrier door can be opened after pumping the carrier to vacuum (in this exemplary embodiment, the front portion facilitates the opening of a clean tunnel established to extend from the carrier door and the interior of the carrier through the interface opening. There may also be a vacuum environment, a forward section, a transfer chamber, and a processing module in communication therewith, in this exemplary embodiment, the forward section is pumped to the desired vacuum prior to opening the carrier door. A possible inert atmosphere can be provided between the carrier interfaces (to minimize the possibility of contaminant ingress) (possibly possible with a suitable vacuum source and gas supply in the front part) In an alternative embodiment, the carrier door may be opened before pumping the atmosphere from the carrier. (Such as opening the carrier door with the front part having an inert gas atmosphere), the atmosphere of both the carrier and the front part is coupled to a vacuum source in the front part or a vacuum orifice on the carrier (as described above). In this embodiment, after the carrier door is closed in anticipation of transfer to other tools, the carrier 3100 can be pumped through the supply device 3010G with a suitable inert gas (such as Nz). ).

As described above, the placement of the process tool 3002 and the carrier-tool interface can be any desired configuration. Referring now also to FIG. 18, a plan view of another process tool 4002 is shown in accordance with another exemplary embodiment. The tool 4002 in the exemplary embodiment shown in FIG. 18 is generally similar to the processing tool 3002 described above (like features are given like reference numbers) shown in FIG. The tool 4002 can have a processing module 4006, 4006A, and an FEM 4004 with, for example, a vacuum atmosphere (or in an alternative embodiment, inert gas or very clean and dry air). One or more process modules 4006 (eg, in a vertically stacked or offset arrangement), the vacuum transfer robot 4004R picks up a substrate in a process module similar to the embodiment shown in FIG. 16, shown in FIG. / Can be connected to a vacuum FEM so that it can be placed. The process modules 4006 and 4006a can share a common process vacuum with the load unit 4004. The FE 4004 may have a load interface or load port for loading and interfacing the carrier 4100 to the tool in an integrated manner similar to the previous embodiment. The vacuum transfer robot 4004R in this exemplary embodiment can pick up / place the substrate directly between the carrier 4100 and one or more process modules 4006, 4006A via a clean tunnel similar to that described above. In the exemplary embodiment shown in FIG. 18, the clean tunnel 4005 defined into the carrier via the FEM interfaces 4010, 4012 and extending into the process modules 4006, 4006A can be of various lengths and configurations. .

  Referring now to FIG. 18A, according to another exemplary embodiment, the processing tool can be configured such that the carrier 4100 is directly coupled to the clean tunnel 2005 ′ atmosphere described above with respect to FIG. . In this example, the transfer robot 4004R is adjacent to a carrier for transferring substrates from the carrier to the transfer carriage, such as a substrate transfer system that may be substantially similar to the transfer carriage described above with respect to FIGS. 16A and 16B. Can be positioned. As described above, the carriage is moved to a desired position in the clean tunnel 2005 ′ so that the transfer robot 4004R can transfer the substrate between the processing module 4006 and the clean tunnel in the transfer module communicating with the clean tunnel. Can be moved to. In this exemplary embodiment, the clean tunnel transport system can define multiple substrate transport paths (especially offsets, etc.) within the clean tunnel between the carrier and the process module 4006. In this exemplary embodiment, the process modules 4006 at each processing module station can be arranged in a vertically stacked manner. Thus, a substrate from a carrier at the load port can be transported to a corresponding processing module of the tool and returned to each carrier substantially independent of other process paths of the substrate from other carriers. . In an alternative embodiment, the trolley includes an articulated arm or movable transfer mechanism for telescoping the end effector to pick up or release the substrate directly from the processing module 4006 or the transfer robot 4004R adjacent to the clean tunnel 2005 ′. be able to. FIG. 18B illustrates another processing tool in which the carrier 4100 is directly coupled to the clean tunnel. In this example, the processing tool can be substantially similar to the clean tunnel described above with respect to FIG. 18A, while the transport system 2004C 'can be substantially similar to the transport system described above with respect to FIG. 16B. A clean tunnel (or part of a clean tunnel), as described above, transports substrates to different processing modules or carriers that can be stacked together or positioned side by side throughout the processing tool or vertically vertically. It should also be noted that it is possible to have transport paths that are vertically or horizontally spaced from each other to allow.

The disclosed system is:
Ease of crystal growth / corrosion inhibition waiting time rules and simplified storage management Removal of Et halogen, Et organic compounds and moisture from the air Reduced FAB secondary contamination risk Low CoO
Removal of molecular contaminants (AMC) floating in the air, such as HF, HCL, VOC, etc., in the carrier environment and on the substrate Active gas for both the protective substrate and carrier for several days from the contaminated environment of the carrier and the substrate in the carrier Inactivation protection POD environment regeneration and comprehensive gas measurements in protection spectrum feature analysis can be provided.

  It should be understood that the exemplary embodiments described herein can be used individually or in any suitable combination. It should also be understood that the foregoing description is only illustrative of the invention. Various alternatives and modifications can be devised by those skilled in the art without departing from the invention. Accordingly, the present invention is intended to embrace all such alternatives, modifications and variations.

Claims (1)

A substrate processing apparatus,
A load port that allows access to a processing environment of the substrate processing apparatus through at least one sealable load port opening that can be sealed by a load port door, the at least one sealable load port opening A load port whose part is arranged in the load port opening plane;
A load port BOLTS interface arranged substantially along the load port opening plane and defining the load port opening plane and configured to interface with a side of the carrier on which the carrier opening is arranged; Including,
The load port door interfaces with the carrier door,
The load port BOLTS interface has a common dynamic positioning mechanism that is common to the load port opening plane and engages the side of the carrier on which the carrier opening is disposed, and the common dynamic positioning mechanism A substrate processing apparatus, wherein a mechanism provides dynamic repeatable positioning of the carrier relative to the load port BOLTS interface in at least three vertical axes, independent of closure of the load port door.

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