JP2013079170A - Scribing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for scribing a brittle material substrate which suppresses defects such as "chipping", "splitting" and "intersection skipping" in scribing.SOLUTION: The scribing method is provided for forming on a substrate W lengthwise scribe lines and lateral scribe lines with a cutter wheel 6, wherein a plurality of lengthwise unit product arrays each formed by two lengthwise scribe lines S1, S2 by longitudinally scribing the substrate W are formed while leaving a longitudinal narrow space D1 which becomes waste, and then lateral scribe lines S3 which section unit products W1 are sequentially processed by laterally scribing the substrate W from the lengthwise scribe line S1 forming one side of the lengthwise unit product array to the lengthwise scribe line S2 forming the other side.

Description

  The present invention relates to a scribing method for a brittle material substrate such as a glass substrate, and more particularly to a scribing method for forming vertical and horizontal scribing lines (cut grooves) on a substrate along a planned division line.

  As shown in FIG. 11, a plurality of vertical and horizontal scribe lines Sa and Sb intersecting each other are formed by rolling while pressing a cutter wheel against a large-area mother substrate W, and along the scribe lines There is known a method of taking out the unit product W1 by breaking the substrate W into pieces for each unit product (for example, Patent Document 1, Patent Document 2, etc.).

  By the way, when such a vertical scribe line Sa and a horizontal scribe line Sb that cross each other are cross-scribed by the cutter wheel C, a process called “brick” or “sedge” is made at the intersection of the scribe lines Sa and Sb. Defects sometimes occurred.

  As shown in FIG. 12, “bake” refers to the cutting of the cutter wheel when the longitudinal scribe line Sa is first formed and then the cutter wheel C is pressed and rolled to form the lateral scribe line Sb. The board on the side where the pressure contact force (pressing force) is applied (the board on the left side of the figure) sinks as shown by the arrow from the board on the side where the pressure is not applied (the board on the right side of the figure), and the existing scribe line It refers to a fine chip (indicated by α in the figure) that occurs when a boarding on the right side of the board is exceeded.

  In addition, as shown in FIG. 13, the “sedge” means that the cutter wheel exceeds the existing scribe line Sa when the horizontal scribe line Sb is formed after the vertical scribe line Sa is first formed. By the way, it means that the crack K in the vertical direction of the scribe line Sa is formed in an oblique direction near the back surface of the substrate. This “sage” is indicated by β in the figure.

  Such “brick” and “sogee” naturally deteriorate the quality of the product after the division, and have been a major cause of lowering the production yield.

  Therefore, when cross-scribing a brittle material substrate, the pressing force is controlled so as to temporarily lower the scribe pressure of the cutter wheel near the intersection of the scribe lines so as to prevent the occurrence of “debris” and “sedge”. This method is disclosed in Patent Document 3.

JP 2001-328833 A JP 2004-359502 A JP 2009-132614 A

However, in the method described in Patent Document 3 in which the pressing force is controlled so as to temporarily lower the scribe pressure of the cutter wheel in the vicinity of the intersection of the scribe lines, a dedicated control program or mechanical operation for changing the pressing force in a complicated manner is used. A system is required, which is laborious and costly. In addition, depending on the thickness of the substrate and the material composition, the scribe pressure cannot be lowered so much that "brick" and "sedge" cannot be completely prevented.
Further, if the scribe pressure of the cutter wheel is lowered in the vicinity of the intersection of the scribe lines, an inconvenient phenomenon called “intersection jump” may occur. This phenomenon means that when a scribe line formed first and a second scribe line intersecting with the scribe line are formed by a cutter wheel, a scribe line to be formed later is not formed near the intersection. This is because stress remains on both sides of the groove of the scribe line that was initially formed, and the pressing force of the cutter wheel is scraped when the cutter wheel crosses the portion where this stress remains. It is thought that there is. When such a phenomenon of “intersection point jump” occurs, naturally, when the substrate is divided from the scribe line, a clean sectional surface cannot be obtained, and a high-quality product cannot be produced.

  Therefore, an object of the present invention is to provide a novel method for scribing a brittle material substrate that has solved the conventional problems such as “brick”, “sedge”, and “intersection jump”.

  In order to achieve the above object, the present invention takes the following technical means. That is, the scribing method of the present invention is a scribing method in which a vertical scribe line and a horizontal scribe line are formed on a substrate with a cutter wheel. First, by scribing the substrate in the vertical direction, the left side and the right side A plurality of vertical unit product rows formed by two vertical scribe lines are formed with a vertical gap serving as an end material. Then, by scribing in the horizontal direction from the vertical scribe line forming the left side or right side which is one side of the vertical unit product row to the vertical scribe line forming the right side or left side which is the other side Sequentially process the horizontal scribe lines that separate the products.

  According to the scribing method of the present invention, the horizontal scribe line forms the left side (or the right side) of the unit product row from the vertical scribe line so that the cutter wheel does not cross the scribe line during scribe. Since it is formed between the vertical scribe lines forming (or the left side), there is no intersection formed over the vertical scribe line. As a result, the occurrence of "brick" and "sedge" at the intersection mentioned above can be significantly reduced and the phenomenon of "intersection jump" can be eliminated, and a high-quality unit product with a clean sectional surface can be obtained. There is an effect that can be.

In the present invention, the same number of cutter wheels as the number of vertical unit product rows to be formed are used. First, vertical scribe lines that form the left side or the right side that are one side of each of the vertical unit product rows are formed. And then processing a vertical scribe line that forms the right or left side of the other side of each of the vertical unit product rows, and then laterally dividing the unit products in each vertical unit product row It is preferable to process the scribe lines simultaneously in rows.
As a result, a plurality of vertical unit product rows can be formed with a gap as an end material by two scribes, and a horizontal scribe line for dividing the unit products in each vertical unit product row is also provided. Rows can be formed simultaneously.

In the present invention, the horizontal scribe line may be processed so that a horizontal gap serving as an end material is formed between the unit products in the vertical unit product row.
Thereby, since a gap is formed between the vertical and horizontal sides of adjacent unit products, a higher quality unit product can be obtained by discarding the gap portion as an end material when dividing.

The figure which shows an example of the scribing apparatus for enforcing the scribing method of this invention. Explanatory drawing which shows the 1st process of the scribing method of this invention. Explanatory drawing which shows the 2nd process of the scribing method of this invention. Explanatory drawing which shows the 3rd process of the scribing method of this invention. Explanatory drawing which shows the 4th process of the scribing method of this invention. The top view which shows the mother board | substrate scribed by the scribing method of this invention. The top view which shows the mother board | substrate scribed by 2nd Example of this invention. Explanatory drawing which shows the 1st process of the scribing method in 2nd Example of this invention. Explanatory drawing which shows the 2nd process of the scribing method in 2nd Example of this invention. Explanatory drawing which shows another Example of the scribing method of this invention. The top view which shows the conventional mother board | substrate scribed in the grid | lattice form. The figure explaining the phenomenon of the "debris" produced at the time of the conventional cross scribe. The figure explaining the phenomenon of the "sedge" which arises at the time of the conventional cross scribe.

  Hereinafter, details of the scribing method according to the present invention will be described in detail with reference to FIGS. FIG. 1 is a perspective view showing an example of a scribing apparatus for carrying out the scribing method of the present invention. In the present embodiment, processing for taking out 12 unit products W1 having the same shape from one mother substrate W is performed.

  The scribing device 1 includes a pair of left and right support columns 2 and 2 and a horizontal beam (also referred to as a beam) 3 bridged by the support columns 2 and 2, and the horizontal beam 3 is disposed along the X direction. A plurality of, in the present embodiment, three scribe heads 4 are provided on the cross beam 3 so as to be movable along the guide 5 in the X direction. A cutter wheel 6 for processing vertical and horizontal scribe lines on the mother substrate W is attached to the lower end of the scribe head 4. The cutter wheel 6 can be switched by the well-known switching mechanism (not shown) provided in the scribe head 4 in both the X direction and the Y direction orthogonal to the X direction on the plane. It is.

  A table 7 for placing the mother substrate W is disposed below the scribe head 4, and air suction holes (not shown) for sucking and holding the mother substrate W are provided on the surface of the table 7. Yes. The table 7 is formed so as to reciprocate by a ball screw 9 along a rail 8 extending in the Y direction.

Next, the scribing method of the present invention using the scribing apparatus 1 will be described.
First, as shown in FIG. 2, the three scribing heads 4 of the scribing apparatus 1 are arranged with a predetermined interval (the sum of a pitch P described later and a vertical gap D1 which is the width of the end material). Next, the mother substrate W is placed and held on the table 7, and the table 7 is moved in the Y direction while pressing the cutter wheel 6 of the scribe head 4 against the mother substrate W. The vertical scribe line S1 which is the left side is processed.

Next, as shown in FIG. 3, the three scribing heads 4 are moved and arranged by the pitch P in the X direction. This pitch P corresponds to the horizontal width of the formed vertical unit product row. In this state, similarly to the scribe line S1, the table 7 is moved in the Y direction while pressing the cutter wheel 6 of the scribe head 4 against the mother substrate W, so that the vertical side serving as the right side of each vertically formed unit product row is obtained. The direction scribe line S2 is processed.
As a result, three vertical unit product rows separated by the left and right scribe lines S1 and S2 are formed across the vertical gap D1. Note that the vertical gap D1 is a portion that becomes a scrap and only needs to be subjected to a break treatment. Therefore, it is preferable that the area of the scrap is not so large, for example, 10 mm or less.

Next, as shown in FIG. 4, after the rolling direction of the cutter wheel 6 is switched to the X direction, the cutter wheel 6 moves until it comes on the scribe line S <b> 1. Further, the table 7 is sent in the Y direction and stopped on the position where the horizontal scribe line is to be formed. Thereafter, the cutter wheel 6 is moved along the guide 5 while pressing the cutter wheel 6 against the mother substrate W from the vertical scribe line S1 forming the substantial left side of the vertical unit product row to the scribe line S2 forming the right side. Thus, the horizontal scribe lines S3 that substantially divide the unit products in the vertical unit product row are processed simultaneously in the horizontal row. In this way, the horizontal scribe lines S3 are sequentially processed as shown in FIG. Thereby, the area | region used as the unit product W1 is formed in a grid | lattice form by the vertical and horizontal scribe lines S1, S2, and S3 as shown in FIG.
Note that the scribe line S3 may be moved in the reverse direction from the scribe line S2 to the scribe line S1. In this case, it is moved along the scribe line S1 from above the scribe line S2.

  Thereafter, the mother substrate W on which the scribe line is formed is sent to a break device, and is subjected to a break process along the vertical and horizontal scribe lines to be divided, and the unit product W1 is taken out.

  According to the above scribing method, the horizontal scribe line S3 is formed between the vertical scribe line S1 forming the right side from the vertical scribe line S1 forming the substantial left side of the vertical unit product row. Therefore, there are no intersections formed over the vertical scribe lines S1 and S2. As a result, the occurrence of “bitter” and “sedge” at the intersection described above can be remarkably suppressed, the phenomenon of “intersection jump” can be eliminated, and a high-quality unit product with a clean sectional surface can be obtained.

  In addition, even when a slight “depression” occurs in the vertical gap D1 when the vertical scribe line S2 is reached at the end of the horizontal scribe line S3 during scribing, the vertical gap D1 Since the portion is discarded as a scrap after division, there is no influence on the unit product W1 to be taken out.

In the present invention, as shown in FIG. 7, the horizontal scribe line S3 may be processed so that the horizontal gap D2 is formed between the unit products W1 in the vertical unit product row. In this case, as shown in FIG. 8 and FIG. 9, the feed pitch in the Y direction of the table 7 is set in advance in consideration of the width and narrowness of the unit product in the Y direction, and is the same as in the previous embodiment. Further, the scribing can be performed by scribing in the lateral direction with a plurality of cutter wheels 6 attached to the scribe head 4 and sequentially processing the scribe line S3.
In this embodiment, since the gaps D1 and D2 are formed between the vertical and horizontal sides of the adjacent unit products W1, a higher-quality unit product W1 is obtained by discarding the gaps as an end material at the time of division. be able to.

In the present invention, when the number of unit products W1 to be taken out is the same, if the number of vertical unit product rows is increased and the number of scribe heads is increased by the number of unit product rows, the work speed is further increased. Can be achieved.
For example, when the number of unit products W1 to be taken out is twelve, in the previous embodiment, there are three vertical unit product rows, so three scribe heads 4 are used to process the vertical scribes S1 and S2. In order to process the scribe line S3 in the Y direction and to process the scribe line S3 in the horizontal direction, it is necessary to scribe as many as the number of scribe lines S3, that is, in the embodiment of FIG. On the other hand, when processing the same mother substrate W shown in FIG. 7, as shown in FIG. 10, the mother substrate W is placed sideways, and the vertical unit product rows are arranged in four rows in the horizontal direction. When processing with four scribe heads 4, it can be formed by scribing twice in the Y direction for processing the vertical scribes S1 and S2, and by six scribes for processing the horizontal scribe line S3. . In other words, the horizontal scribing is six times compared to the former eight times, and the speed of the scribing work can be increased accordingly.

  In the above embodiment, the table 7 is moved in the Y direction to process the vertical scribes S1 and S2. On the contrary, the horizontal beam 3 and the column 2 supporting the scribe head 4 are moved so that the scribe can be performed. Also good. Further, the horizontal scribe line S3 can be performed so that the table 7 can be moved in the X direction.

  While typical examples of the present invention have been described above, the present invention is not necessarily limited to the above embodiments. For example, in the vertical scribe process, the left side and the right side may be processed in reverse order, or in the horizontal scribe process, the process may be performed from the right side to the left side. In addition, the object of the present invention can be achieved and modified or changed as appropriate without departing from the scope of the claims.

  The cutting method of the present invention is used in a scribing method for forming vertical and horizontal scribe lines along a planned break line on a substrate made of a brittle material such as a glass substrate.

DESCRIPTION OF SYMBOLS 1 Scribe device 4 Scribe head 6 Cutter wheel 7 Table D1, D2 Narrow space S1, S2 Vertical scribe line S3 Horizontal scribe line

Claims (3)

A scribing method for forming a vertical scribe line and a horizontal scribe line on a substrate with a cutter wheel,
By scribing the substrate in the vertical direction, a plurality of vertical unit product rows formed by two vertical scribe lines serving as the left side and the right side are formed with a vertical gap as an end material,
Next, by scribing in the horizontal direction from the vertical scribe line forming the left side or the right side of the vertical unit product row to the vertical scribe line forming the right side or the left side, the horizontal scribe that separates the unit products A scribing method characterized by sequentially processing lines. Use as many cutter wheels as there are vertical unit product rows to be formed,
First, process the vertical scribe line that forms the left or right side of each vertical unit product row,
Next, process the vertical scribe line forming the right side or the left side of the vertical unit product row,
2. The scribing method according to claim 1, wherein the horizontal scribe lines for dividing the unit products in each vertical unit product row are processed simultaneously in the horizontal row.   The scribing method according to claim 1 or 2, wherein the horizontal scribe line is processed so that a horizontal gap as an end material is formed between unit products in the vertical unit product row. .

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