JP2012234879A - Package for housing element, and semiconductor device including the package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem in which: when the size of a package for housing an element is reduced, block of the inside and outside of a package becomes difficult because inevitable displacement of an input output terminal occurs due to the resulting reduction of thickness of a standing wall part in a manufacturing process.SOLUTION: A package for housing an element comprises: a first insulation substrate; a second insulation substrate disposed on the first insulation substrate; a wiring conductor disposed between the first insulation substrate and the second insulation substrate; an internal terminal electrically connected to the wiring conductor and disposed inside a region surrounded by a frame in a plan view on a top surface of the second insulation substrate; and an external terminal electrically connected to the wiring conductor and disposed outside a region surrounded by the frame in a plan view on the top surface of the second insulation substrate.

Description

  The present invention relates to an element storage package for storing semiconductor elements typified by LD (laser diode) and PD (photodiode), and a semiconductor device including the same.

  For example, a package described in Patent Document 1 is known as an element storage package (hereinafter also simply referred to as a package) for storing semiconductor elements. The package described in Patent Document 1 includes a ceramic terminal member (input / output terminal) for electrically connecting a semiconductor element mounted in the package and an external electric circuit. The ceramic terminal member includes a flat plate portion made of ceramic, a metallized wiring layer formed on the upper surface of the flat plate portion so as to conduct inside and outside of the package, and a standing wall portion bonded to the upper surface of the flat plate portion to block the inside and outside of the package. It is equipped with.

  In the package described in Patent Document 1, the standing wall portion is formed between the central portion of the upper surface of the flat plate portion and the flat plate portion so as to overlap with the frame when viewed in plan. The metallized wiring layer is exposed in a region on the upper surface of the flat plate portion where the standing wall portion is not formed. The metallized wiring layer is electrically connected to the semiconductor element and the external electric circuit at the exposed portion.

JP 2001-102472 A

  In recent years, it has been required to reduce the size of an element storage package. Therefore, the input / output terminals are also required to be downsized. However, when the element storage package is made smaller than before, the thickness of the standing wall portion is reduced, and therefore the input / output terminals are inevitably displaced in the manufacturing process, making it difficult to block the inside and outside of the package. .

  Moreover, although the package described in the cited document 1 has a positioning groove on the input / output terminal, when the thickness of the standing wall is reduced, the thickness of the portion located on the side of the groove on the standing wall is It can be extremely small. For this reason, a crack occurs in the standing wall portion, and it becomes difficult to block the inside and outside of the package. On the other hand, when the thickness of the standing wall portion is increased, the exposed portion of the metallized wiring layer is reduced, so that it is difficult to electrically connect to the semiconductor element and the external electric circuit.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an element housing package that can be reduced in size and a semiconductor device using the same.

  An element storage package according to an aspect of the present invention includes a base having a mounting area on which a semiconductor element is mounted on an upper surface, and an upper surface of the base so as to surround the mounting area. And a frame having openings on the inner peripheral surface and the outer peripheral surface, and input / output terminals inserted into the openings.

The input / output terminal includes: a first insulating substrate; a second insulating substrate disposed on an upper surface of the first insulating substrate; and the first insulating substrate and the second insulating substrate. A wiring conductor disposed between the wiring conductor and an inner surface of a region surrounded by the frame when viewed from above on the upper surface of the second insulating substrate and electrically connected to the wiring conductor; And an external terminal disposed on the upper surface of the second insulating substrate and outside the region surrounded by the frame when viewed in plan and electrically connected to the wiring conductor It is equipped with.

  In the element storage package according to one aspect of the present invention, since the input / output terminals have the above-described configuration, the inside and outside of the element storage package can be stably blocked by the second insulating substrate. it can. Further, since the internal terminal and the external terminal are located on the upper surface of the second insulating substrate, it is possible to easily electrically connect to the semiconductor element and the external electric circuit.

1 is an exploded perspective view showing an element storage package and a semiconductor device including the same according to a first embodiment. It is X1-X1 sectional drawing of the element storage package shown in FIG. FIG. 3 is an enlarged cross-sectional view in which a region A1 of the element storage package shown in FIG. 2 is enlarged. It is X2-X2 sectional drawing of the element storage package shown in FIG. FIG. 3 is an enlarged cross-sectional view in which a region A2 of the element storage package shown in FIG. 2 is enlarged. FIG. 5 is an exploded perspective view showing a modification of the element storage package and the semiconductor device including the element storage package shown in FIG. 1. It is YY sectional drawing of the element storage package shown in FIG. It is the expanded sectional view which expanded the area | region B of the element storage package shown in FIG. It is a disassembled perspective view which shows the element storage package concerning 2nd Embodiment, and a semiconductor device provided with the same. FIG. 10 is a ZZ sectional view of the element storage package shown in FIG. 9. It is the expanded sectional view which expanded the area | region C1 of the element storage package shown in FIG. FIG. 10 is a plan view of the element storage package shown in FIG. 9. FIG. 13 is an enlarged plan perspective view of a region C2 of the element storage package shown in FIG.

  Hereinafter, an element storage package (hereinafter also simply referred to as a package) according to an embodiment of the present invention and a semiconductor device including the same will be described in detail with reference to the drawings. However, in the drawings referred to below, for convenience of explanation, among the constituent members of the embodiment, only the main members necessary for explaining the present invention are shown in a simplified manner. Therefore, the element storage package according to the present invention can include arbitrary constituent members not shown in the drawings referred to in this specification. Moreover, the dimension of the member in each figure does not represent the dimension of an actual structural member, the dimension ratio of each member, etc. faithfully.

  As shown in FIGS. 1 to 5, the package 1 according to the present embodiment includes a base 5 having a mounting area on which the semiconductor element 3 is mounted on the upper surface, and surrounds the mounting area on the upper surface of the base 5. And a frame body 7 having an opening 7 a that opens to the inner and outer peripheral surfaces, and an input / output terminal 9 that is inserted into the opening 7 a of the frame 7.

Further, the input / output terminal 9 includes a first insulating substrate 11, a second insulating substrate 13 disposed on the upper surface of the first insulating substrate 11, and the first insulating substrate 11 and the second insulating substrate 13. Between the wiring conductor 15 (hereinafter referred to as the first wiring conductor 15) disposed between and the upper surface of the second insulating substrate 13 and in the area surrounded by the frame body 7 when viewed in plan. And the inner terminal 17 electrically connected to the first wiring conductor 15 and the outer surface of the upper surface of the second insulating substrate 13 and surrounded by the frame 7 when viewed in plan. And an external terminal 19 electrically connected to the first wiring conductor 15.

  As described above, in the package 1 of the present embodiment, the second insulating substrate 13 is not formed only in a portion overlapping the frame body 7 when viewed in plan on the upper surface of the first insulating substrate 11. The insulating substrate 11 is formed on the entire top surface. Therefore, when the frame 7 and the input / output terminal 9 are downsized to reduce the size of the package 1, the input / output terminal 9 is inevitably displaced in the manufacturing process with respect to the frame 7. Also, the inside and outside of the package 1 can be stably blocked. As a result, the airtightness of the package 1 can be improved.

  In addition, since the internal terminal 17 and the external terminal 19 are located on the upper surface of the second insulating substrate 13, and it is not necessary to make the internal terminal 17 and the external terminal 19 extremely small, the semiconductor element 3 and the external electric circuit It is possible to easily electrically connect to (not shown).

  The base body 5 in the present embodiment has a square plate shape, and has a placement area on which the semiconductor element 3 is placed on the main surface. In the present embodiment, the placement region means a region that overlaps the semiconductor element 3 when the base 5 is viewed in plan.

  In the present embodiment, the placement region is formed at the center of the main surface. However, since the region where the semiconductor element 3 is placed is the placement region, for example, at the end of the main surface of the base 5. There is no problem even if the mounting area is formed. Moreover, although the base body 5 of the present embodiment has one placement area, the base body 5 may have a plurality of placement areas, and the semiconductor element 3 may be placed in each placement area. .

  The semiconductor element 3 is disposed in the mounting region on the main surface of the base body 5. Signals can be input / output between the semiconductor element 3 and an external electric circuit (not shown) via the input / output terminal 9 or the like. As described above, since the semiconductor element 3 is disposed on the main surface of the base body 5, the base body 5 is required to have high insulation properties at least in a portion where the semiconductor element 3 is disposed. It is done. The base 5 according to the present embodiment is produced by laminating a plurality of insulating members. The semiconductor element 3 is disposed in the mounting region of the base body 5. Examples of the insulating member include a ceramic material such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, and a silicon nitride sintered body, or a glass ceramic. Materials can be used.

  A mixing member is prepared by mixing the raw material powder containing these glass powder and ceramic powder, an organic solvent, and a binder. A plurality of ceramic green sheets are produced by forming the mixed member into a sheet. A plurality of laminated bodies are produced by laminating the produced ceramic green sheets. The base body 5 is produced by integrally firing a plurality of laminated bodies at a temperature of about 1600 degrees.

  The base 5 is not limited to a configuration in which a plurality of insulating members are stacked. The base 5 may be composed of one insulating member. Moreover, since it is calculated | required that the base | substrate 5 has high insulation at least in the part by which the semiconductor element 3 is arrange | positioned, it is good also as a structure which laminated | stacked the insulating member on the metal member, for example. In particular, when high heat dissipation is required for the base 5, the base 5 is preferably configured as described above. This is because the metal member has high heat dissipation. By adopting a configuration in which an insulating member is laminated on a metal member, the heat dissipation of the base 5 can be enhanced.

  Specifically, a metal member such as iron, copper, nickel, chromium, cobalt, and tungsten, or an alloy made of these metals can be used as the metal member. A metal member constituting the substrate 5 can be produced by subjecting such an ingot of the metal member to a metal working method such as a rolling method or a punching method.

  Further, as described above, since the base 5 is required to have high insulating properties at least in a portion where the semiconductor element 3 is disposed, the base 5 is provided as in the package 1 of the present embodiment. However, it is preferable that a mounting substrate 21 for mounting the semiconductor element 3 disposed on the mounting region is provided. This is because the difference in height between the semiconductor element 3 and the internal terminal 17 can be reduced, so that these electrical connections can be easily performed.

  As the mounting substrate 21, it is preferable to use a member having good insulation like the insulating member. For example, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, and an aluminum nitride material are used. Ceramic materials such as sintered bodies and silicon nitride-based sintered bodies, or glass ceramic materials can be used.

  The package 1 according to the present embodiment includes a frame body 7 having an inner peripheral surface and an opening 7 a that opens to the outer peripheral surface, which is disposed on the upper surface of the base body 5 so as to surround the mounting region. In the present embodiment, the opening 7 a is formed in the frame body 7 in order to insert the input / output terminal 9. Therefore, like the opening 7a in the present embodiment, recesses that open to the inner peripheral surface and the outer peripheral surface of the frame body 7 are formed on the lower surface side of the frame body 7, and through holes are formed by the upper surface of the recess and the base body 5. It is good also as the opening part 7a by forming. The opening 7 a may be formed on the upper surface side of the frame body 7 so as to open on the inner peripheral surface and the outer peripheral surface of the frame body 7. The input / output terminal 9 is fitted into the opening 7a so that the frame 7 and the upper surface of the second insulating substrate 13 are flush with each other, and a seal ring having the same planar shape as the frame 7 has a frame body. 7 is disposed on the upper surface of the second insulating substrate 13 so as to overlap with 7. And the input / output terminal 9 is arrange | positioned in the opening part 7a formed of the frame 7 and the seal ring through the brazing material. As a result, the rigidity of the upper end portion of the frame body 7 is improved by the input / output terminals 9, and deformation of the frame body 7 that occurs when the lid body 45 is bonded and fixed to the seal ring by seam welding is suppressed. Yield is improved. In addition, a through-hole that opens in the inner peripheral surface and the outer peripheral surface of the frame body 7 may be formed in the frame body 7 to form the opening 7a. The through hole can be formed in the frame body 7 by, for example, drilling.

  As the frame 7, for example, a metal member such as iron, copper, nickel, chromium, cobalt, and tungsten, or an alloy made of these metals can be used. The metal member constituting the frame body 7 can be manufactured by subjecting such an ingot of the metal member to a metal processing method such as a rolling method or a punching method. A ceramic member may be used as the frame body 7. Further, the frame body 7 may be composed of one member, but may be a laminated structure of a plurality of members.

  The element storage package 1 of this embodiment includes a joining member (not shown) that is located between the base body 5 and the frame body 7 and joins the base body 5 and the frame body 7. For example, a brazing material can be used as the joining member. Exemplary brazing materials include silver brazing.

An input / output terminal 9 is inserted and fixed in the opening 7a of the frame body 7 in the present embodiment. The input / output terminal 9 includes a first insulating substrate 11, a second insulating substrate 13 disposed on the upper surface of the first insulating substrate 11, and the first insulating substrate 11 and the second insulating substrate 13. A plurality of wiring conductors 15 (first wiring conductors 15) disposed between them and the upper surface of the second insulating substrate 13 and disposed inside the region surrounded by the frame 7 when viewed in plan. A plurality of internal terminals 17, and a plurality of external terminals 19 arranged on the upper surface of the second insulating substrate 13 and outside the region surrounded by the frame body 7 when viewed in plan. Yes.

  The first insulating substrate 11 in the present embodiment has a square plate shape, and a plurality of first wiring conductors 15 are disposed on the upper surface. As an exemplary size of the first insulating substrate 11, a square plate-shaped member having a side of about 1 to 20 mm and a thickness of about 0.5 to 2 mm when viewed in plan can be used. .

  As the first insulating substrate 11, it is preferable to use a member having good insulation like the insulating member. For example, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, a nitrided body A ceramic material such as an aluminum sintered body and a silicon nitride sintered body, or a glass ceramic material can be used.

  The second insulating substrate 13 in the present embodiment has a square plate shape like the first insulating substrate 11. Thus, it is preferable that the first insulating substrate 11 and the second insulating substrate 13 have substantially the same shape when viewed in plan. Thereby, since the area of the upper surface of the second insulating substrate 13 can be increased, the lead terminal 27 and the external terminal 19 can be stably bonded while the input / output terminal 9 is downsized.

  In addition, when the first insulating substrate 11 and the second insulating substrate 13 have substantially the same shape in plan view, the durability of the input / output terminal 9 can be improved for the reasons described later. When the input / output terminal 9 is inserted and fixed in the opening 7 a of the frame body 7, it is preferable that a pressing force is applied from the frame body 7 to the input / output terminal 9 in order to hermetically seal the package 1. On the other hand, when the first insulating substrate 11 and the second insulating substrate 13 have a configuration in which the second insulating substrate 13 is smaller than the first insulating substrate 11 when seen in a plan view, The stress from the frame body 7 tends to concentrate on the portion of the upper surface overlapping the second insulating substrate 13.

  However, when the first insulating substrate 11 and the second insulating substrate 13 have substantially the same shape when viewed in plan, the entire upper surface of the first insulating substrate 11 overlaps the second insulating substrate 13. Therefore, the possibility that stress from the frame body 7 is concentrated on a specific region on the upper surface of the first insulating substrate 11 can be reduced. Therefore, the durability of the input / output terminal 9 can be improved.

  A plurality of internal terminals 17 and external terminals 19 are disposed on the upper surface of the second insulating substrate 13 in the present embodiment. As an exemplary size of the second insulating substrate 13, a square plate-shaped member having a side of about 1 to 20 mm and a thickness of about 0.5 to 2 mm when viewed in plan can be used. .

  The second insulating substrate 13 has a plurality of through holes that open to the upper surface and the lower surface. Each of these through holes is filled with a through conductor 23. The first wiring conductor 15 and the internal terminal 17, and the first wiring conductor 15 and the external terminal 19 can be electrically connected to each other through these through conductors 23.

  As the second insulating substrate 13, it is preferable to use a member having good insulation like the insulating member. For example, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, nitriding A ceramic material such as an aluminum sintered body and a silicon nitride sintered body, or a glass ceramic material can be used.

The plurality of first wiring conductors 15 are respectively disposed between the upper surface of the first insulating substrate 11 and the lower surface of the second insulating substrate 13. The plurality of first wiring conductors 15 are located from the inside to the outside of the region surrounded by the frame body 7. Thereby, electrical connection can be achieved between the inside and the outside of the region surrounded by the frame body 7. The plurality of first wiring conductors 15 are arranged in parallel at predetermined intervals so as not to be electrically short-circuited with each other.

  The interval between the plurality of first wiring conductors 15 is about 0.3 to 1.5 mm in order to suppress an electrical short circuit between the first wiring conductors 15 while reducing the size of the input / output terminal 9. Preferably there is.

  As the first wiring conductor 15, it is preferable to use a member having good conductivity. Specifically, a metal material such as tungsten, molybdenum, nickel, copper, silver, and gold can be used as the first wiring conductor 15. The above metal materials may be used alone or as an alloy.

  The input / output terminal 9 includes a plurality of internal terminals 17 disposed on the inner surface of a region surrounded by the frame body 7 when viewed from above on the upper surface of the second insulating substrate 13. The plurality of internal terminals 17 are electrically connected to the first wiring conductor 15 and the through conductor 23 filled in the through hole of the second insulating substrate 13. The internal terminal 17 is a member for electrically connecting the first wiring conductor 15 and the semiconductor element 3. The internal terminal 17 and the semiconductor element 3 can be electrically connected by, for example, so-called wire bonding via the conductive wire 25.

  When the internal terminal 17 and the semiconductor element 3 are electrically connected via the conducting wire 25 or the like, it is necessary to stably join the conducting wire 25 to the internal terminal 17. In the package 1 of this embodiment, since the internal terminals 17 are disposed on the upper surface of the second insulating substrate 13 having a flat plate shape, the area of the upper surface of the internal terminals 17 can be easily secured. . Therefore, since the conducting wire 25 can be easily joined to the internal terminal 17, the conducting wire 25 and the internal terminal 17 can be stably joined.

  Further, the input / output terminal 9 includes a plurality of external terminals 19 arranged on the upper surface of the second insulating substrate 13 and outside the region surrounded by the frame 7 when viewed in plan. The plurality of external terminals 19 are electrically connected to the first wiring conductor 15 and the through conductors 23 filled in the through holes of the second insulating substrate 13 in the same manner as the internal terminals 17. The external terminal 19 is a member for electrically connecting the first wiring conductor 15 and the external electric circuit. The external terminal 19 and the external electric circuit can be electrically connected through the lead terminal 27, for example.

  When the external terminal 19 and the external electric circuit are electrically connected via the lead terminal 27 or the like, it is necessary to stably join the lead terminal 27 to the external terminal 19. In the package 1 of the present embodiment, since the external terminals 19 are disposed on the upper surface of the second insulating substrate 13 having a flat plate shape, the area of the upper surface of the external terminals 19 can be easily secured. . Therefore, since the lead terminal 27 can be easily joined to the external terminal 19, the lead terminal 27 and the external terminal 19 can be stably joined.

  Further, the external terminal 19 may be formed by a wiring conductor 15 formed on the upper surface of the first insulating substrate 11, which is exposed by cutting out the second insulating substrate 13 disposed outside the frame body 7. Good. As a result, the joint between the lead terminal 27 and the external terminal 19 is protected by a notch formed in the second insulating substrate 13, and damage to the joint due to external factors is suppressed. The bonding material between the lead terminal 27 and the external terminal 19 is prevented from spreading to the adjacent external terminal 19 and causing an electrical short circuit. Therefore, the yield of the semiconductor device 43 is improved, and the semiconductor device 43 can operate normally for a long time.

  As the through conductors 23, the internal terminals 17, the external terminals 19, the conductive wires 25, and the lead terminals 27, it is preferable to use members having good conductivity as in the case of the first wiring conductor 15. Specifically, metal materials such as tungsten, molybdenum, nickel, copper, silver, and gold can be used. The above metal materials may be used alone or as an alloy.

  In the package 1 of this embodiment, the first wiring conductor 15 and the internal terminal 17 are electrically connected through the through conductor 23 filled in the through hole of the second insulating substrate 13. The first wiring conductor 15 and the external terminal 19 are electrically connected, but the present invention is not limited to this.

  For example, as shown in FIGS. 6 to 8, the first wiring conductor 15, the internal terminal 17, and the external terminal 19 may be electrically connected. In the input / output terminal 9 shown in FIGS. 6 to 8, the first wiring conductor 15 is surrounded by the first side surface and the frame body 7 located inside the region surrounded by the frame body 7 in the input / output terminal 9. To the second side surface located outside the region. The input / output terminal 9 is disposed on the first side surface, and is disposed on the first side conductor 29a electrically connected to the first wiring conductor 15 and the internal terminal 17, and on the second side surface. And a second side conductor 29 b electrically connected to the first wiring conductor 15 and the external terminal 19.

  As described above, when the first wiring conductor 15 is electrically connected to the internal terminal 17 and the external terminal 19 via the first side conductor 29a and the second side conductor 29b, the second insulating substrate 13 is used. Since it is not necessary to form a through hole in the first wiring conductor 15, the first wiring conductor 15 can be easily electrically connected to the internal terminal 17 and the external terminal 19.

  Further, the input / output terminal 9 in the present embodiment has a groove portion that opens to the upper surface and the lower surface in a part of the side surface including a portion that overlaps the frame body 7 when seen in a plan view. When such a groove is provided, the input / output terminal 9 can be easily inserted into the opening 7 a of the frame body 7. Further, by making the width of the groove the same as the thickness of the frame body 7, the positional deviation of the input / output terminal 9 with respect to the frame body 7 can be reduced.

  The semiconductor element 3 and the internal terminal 17 may be directly connected via the conductive wire 25, but the mounting region and the input / output terminal 9 on the upper surface of the substrate 5 as in the package 1 of the present embodiment. A coplanar wiring board 31 may be provided between the semiconductor element 3 and the input / output terminal 9 to be electrically connected. The coplanar wiring substrate 31 includes an insulating substrate 33, a signal line 35 disposed on the upper surface of the insulating substrate 33, and a pair of coplanar disposed on the upper surface of the insulating substrate 33 so as to sandwich the signal line 35 therebetween. A conductor 37 is provided.

  As the insulating substrate 33, it is preferable to use a member having a good insulating property similarly to the insulating member constituting the base 5. For example, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body is used. Bodies, ceramic materials such as aluminum nitride sintered bodies and silicon nitride sintered bodies, or glass ceramic materials can be used. In particular, as the insulating substrate 33, it is preferable to use a member having a dielectric constant lower than that of the substrate in order to suppress transmission loss. Specifically, it is preferable to use a glass ceramic material, quartz, or a porous ceramic member.

  The line conductor is a member for electrically connecting the semiconductor element 3 and the internal terminal 17 in the input / output terminal 9. The coplanar wiring substrate 31 has a pair of coplanar conductors 37 disposed on the upper surface of the insulating substrate 33 so as to sandwich the line conductor therebetween. The coplanar conductor 37 has a reference potential by being electrically connected to a ground conductor (not shown) disposed on the base body 5.

  Next, the element storage package 1 of the second embodiment will be described in detail with reference to the drawings. In addition, in each structure concerning this embodiment, about the structure which has the same function as 1st Embodiment, the same referential mark is attached and the detailed description is abbreviate | omitted.

  As shown in FIGS. 9 to 13, the package 1 according to the present embodiment has an input / output terminal 9 disposed on the lower surface of the first insulating substrate 11 as compared with the package 1 according to the first embodiment. 3 insulating substrate 39 is further provided. As described above, the insulating substrate constituting the input / output terminal 9 is not only composed of the first insulating substrate 11 and the second insulating substrate, but is composed of three or more insulating substrates including the third insulating substrate 39. But there is no problem.

  The input / output terminal 9 in the package 1 of the present embodiment is disposed between the first insulating substrate 11 and the third insulating substrate 39 and is electrically connected to the internal terminal 17 and the external terminal 19 respectively. The second wiring conductor 41 is further provided.

  When the input / output terminal 9 is miniaturized as the package 1 is miniaturized, the interval between the plurality of first wiring conductors 15 is narrowed. When the interval between the plurality of first wiring conductors 15 becomes narrow, an electrical short circuit may occur between the first wiring conductors 15. On the other hand, when the width of the first wiring conductors 15 is reduced in order to ensure the interval between the plurality of first wiring conductors 15, it becomes difficult to transmit a large input / output signal to the semiconductor element 3.

  However, in the package 1 of the present embodiment, not only the first wiring conductor 15 disposed between the first insulating substrate 11 and the second insulating substrate 13 as the wiring conductor, but also the first insulation. A second wiring conductor 41 is provided between the substrate 11 and the third insulating substrate 39. Therefore, the space | interval of the wiring conductors 15 and 41 adjacent on the same plane can be enlarged. As a result, the widths of the first wiring conductor 15 and the second wiring conductor 41 can be increased while suppressing the possibility of an electrical short circuit between the wiring conductors 15 and 41.

  In particular, in the package 1 of the present embodiment, when the first wiring conductor 15 and the second wiring conductor 41 are viewed through, at least a part of the first wiring conductor 15 and the second wiring conductor 41 overlap each other. However, even if the widths of the first wiring conductor 15 and the second wiring conductor 41 are increased as described above, an electrical short circuit is caused between the adjacent wiring conductors 15 and 41. The possibility of occurring can be suppressed.

  The semiconductor device 43 including the element storage package 1 typified by the above embodiment includes an element storage package 1 typified by the above embodiment and an element storage, as shown in FIGS. The semiconductor element 3 placed in the placement area of the package 1 for use, and the lid 45 for sealing the semiconductor element 3 joined to the frame body 7 are provided.

  In the semiconductor device 43, the semiconductor element 3 is mounted on the mounting region of the substrate. Further, the semiconductor element 3 and the line conductor, and the line conductor and the internal terminal 17 are connected to each other by a conducting wire 25. A desired output can be obtained from the semiconductor element 3 by inputting an external signal to the semiconductor element 3 via the input / output terminal 9 or the like. Examples of the semiconductor element 3 include a light emitting element that emits light to an optical fiber, typified by an LD element, and a light receiving element that receives light to an optical fiber, typified by a PD element.

The lid body 45 is bonded to the frame body 7 and is provided so as to seal the semiconductor element 3. The lid body 45 is joined to the upper surface of the frame body 7. The semiconductor element 3 is sealed in a space surrounded by the base body 5, the frame body 7, and the lid body 45. By sealing the semiconductor element 3 in this way, it is possible to suppress the deterioration of the semiconductor element 3 due to the long-term use of the package 1. As the lid body 45, for example, a metal member such as iron, copper, nickel, chromium, cobalt, and tungsten, or an alloy made of these metals can be used. Further, the frame body 7 and the lid body 45 can be joined by, for example, a seam welding method. Further, the frame body 7 and the lid body 45 may be joined using, for example, gold-tin solder.

  The element storage package and the optical semiconductor device including the element storage package according to each embodiment of the present invention have been described above, but the present invention is not limited to the above-described embodiment. In other words, various modifications and combinations of embodiments may be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Element storage package 3 ... Semiconductor element 5 ... Base | substrate 7 ... Frame 7a ... Opening part 9 ... Input / output terminal 11 ... 1st insulating substrate 13 ...・ Second insulating substrate 15... Wiring conductor (first wiring conductor)
17 ... internal terminal 19 ... external terminal 21 ... mounting substrate 23 ... through conductor 25 ... conductive wire 27 ... lead terminal 29a ... first side conductor 29b ... first 2 side conductors 31... Coplanar wiring board 33... Insulating board 35... Signal line 37 .. coplanar conductor 39... Third insulating board 41. ..Semiconductor device 45 ... lid

Claims (7)

A substrate having a mounting region on which the semiconductor element is mounted;
A frame having openings on the inner peripheral surface and the outer peripheral surface, disposed on the upper surface of the base body so as to surround the placement region;
An element storage package comprising an input / output terminal inserted into the opening,
The input / output terminal includes a first insulating substrate, a second insulating substrate disposed on an upper surface of the first insulating substrate, and between the first insulating substrate and the second insulating substrate. The disposed wiring conductor and the upper surface of the second insulating substrate, which is disposed inside the region surrounded by the frame when viewed in plan, and is electrically connected to the wiring conductor. An internal terminal and an external terminal that is disposed on the upper surface of the second insulating substrate and outside the region surrounded by the frame when viewed in plan, and is electrically connected to the wiring conductor. An element storage package comprising the element storage package. The second insulating substrate further includes a through conductor having a plurality of through holes opened on the upper surface and the lower surface, and filling the through holes,
2. The element storage package according to claim 1, wherein the wiring conductor and the internal terminal, and the wiring conductor and the external terminal are electrically connected to each other through the through conductor. The wiring conductors are led out to a first side surface located inside the region surrounded by the frame body of the input / output terminal and a second side surface located outside the region surrounded by the frame body, respectively. And
A first side conductor disposed on the first side surface and electrically connected to the wiring conductor and the internal terminal; and a wiring conductor and the external terminal disposed on the second side surface. The device storage package according to claim 1, further comprising a second side conductor electrically connected to the first side conductor. The input / output terminal further includes a third insulating substrate disposed on a lower surface of the first insulating substrate,
When the wiring conductor is a first wiring conductor,
And further comprising a second wiring conductor disposed between the first insulating substrate and the third insulating substrate and electrically connected to the internal terminal and the external terminal, respectively. The device storage package according to claim 1.   The at least part of the first wiring conductor and the second wiring conductor overlap each other when the first wiring conductor and the second wiring conductor are seen through in plan view. The package for element storage as described.   2. The element storage package according to claim 1, wherein the first insulating substrate and the second insulating substrate have substantially the same shape when seen in a plan view. The device storage package according to any one of claims 1 to 6,
The semiconductor element placed in the placement area of the element housing package;
A semiconductor device comprising: a lid body that is bonded to the frame body and seals the semiconductor element.