JP2013074048A - Semiconductor element housing package and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor element housing package, which has excellent bondability of a partially-folded lead terminal to a base substrate.SOLUTION: An element housing package 1 comprises a lead terminal 15 including a first part positioned on one end side and a second part positioned on another end side, which is folded at a part between the first part and the second part. The first part of the lead terminal 15 is covered with a solder 13 and fitted in a recess of a frame 9 so as to be bonded to a wiring conductor 11 via the solder 13.

Description

  The present invention relates to a semiconductor element storage package in which a semiconductor element is stored, and a semiconductor device using the same. Such a semiconductor device can be used for various electronic devices.

  As a package for housing a semiconductor element (hereinafter also simply referred to as a package) for housing a semiconductor element, for example, a package described in Patent Document 1 is known. In the package described in Patent Document 1, an electrode that is electrically connected to a semiconductor element is formed on the outer surface of a side wall portion of a base, and a lead terminal is brazed to the electrode. The lead terminal has its upper side brazed to the electrode and its lower side bent toward the outside of the substrate.

JP 2004-356340 A

  When the lead terminal described in Patent Document 1 is used, the direction in which the lower side of the lead terminal extends parallel to the direction of the outside of the base body (hereinafter referred to as the “extending direction” for convenience) when the package is manufactured or used. Stress on the lead terminal. In recent years, since it is required to energize a semiconductor element more, the stress tends to be larger.

  However, in the package described in Patent Document 1, only the side surface of the lead terminal facing the base is brazed. For this reason, the bondability of the lead terminal to the substrate with respect to the stress in the thickness direction of the substrate can be kept good, but the bondability of the lead terminal to the substrate with respect to the stress in the extending direction may be lowered.

  The present invention has been made in view of the above problems. That is, an object of the present invention is to provide a highly reliable package for housing a semiconductor element, which has good bondability to a base body of a lead terminal that is partially bent.

  A package for housing a semiconductor element according to one aspect of the present invention is provided on a top surface of the substrate so as to surround the mounting region, a substrate having a mounting region on which the semiconductor element is mounted on the top surface, A frame having a recess on the outer peripheral surface side, a wiring conductor that is led out from the region surrounded by the frame to the inner surface of the recess and electrically connected to the semiconductor element, and is located on one end side A first part that is positioned on the other end side and a second part that is bent between the first part and the second part, and the first part is covered with a brazing material. And a lead terminal that is fitted into the recess so as to be joined to the wiring conductor via the brazing material, and the second part is pulled out to the side of the frame. Yes.

  In the package of the above aspect, the frame has a recess on the outer peripheral surface side. The first portion of the lead terminal is fitted in the recess. At this time, the first portion is fitted into the recess while being covered with the brazing material, and is joined to the wiring conductor via the brazing material. That is, the first part of the lead terminal is physically fixed to the brazing material.

  Compared to the case where only the side surface of the lead terminal facing the housing is brazed to the flat outer surface of the housing, the lead terminal is physically fixed to the brazing material as described above. Therefore, peeling of the lead terminal from the brazing material can be suppressed. Therefore, it is possible to improve the bondability of the lead terminal to the frame body against the stress in the extending direction.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view showing a semiconductor element storage package and a semiconductor device including the same according to a first embodiment. FIG. 2 is an exploded perspective view of the semiconductor element storage package shown in FIG. 1 and a semiconductor device including the same. It is an expansion perspective view of the area | region A of the package for semiconductor element accommodation shown in FIG. It is sectional drawing in the XX cross section of the package for semiconductor element accommodation shown in FIG. FIG. 6 is an exploded perspective view of a first modification of the semiconductor element storage package and the semiconductor device including the same shown in FIG. 2. FIG. 5 is an exploded perspective view of a second modification of the semiconductor element storage package and the semiconductor device including the same shown in FIG. 2. FIG. 7 is a cross-sectional view corresponding to FIG. 4 in the semiconductor element storage package shown in FIG. 6. It is an expansion perspective view of the 3rd modification of the package for semiconductor element accommodation shown in FIG. FIG. 9 is an enlarged cross-sectional view of a portion horizontal to the upper surface of the substrate in the package for housing a semiconductor element shown in FIG. 8 and where a lead terminal is joined to a frame body. It is an expansion perspective view of the 4th modification of the package for semiconductor element accommodation shown in FIG. FIG. 11 is an enlarged cross-sectional view of a portion horizontal to the upper surface of the substrate in the package for housing a semiconductor element shown in FIG. 10 and in which a lead terminal is joined to a frame body. It is an expansion perspective view of the 5th modification of the package for semiconductor element accommodation shown in FIG. FIG. 13 is an enlarged cross-sectional view of a portion horizontal to the upper surface of the substrate in the package for housing a semiconductor element shown in FIG. 12 and in which a lead terminal is joined to a frame body. It is an expansion perspective view of the 6th modification of the package for semiconductor element accommodation shown in FIG. It is an expansion perspective view of the 7th modification of the package for semiconductor element accommodation shown in FIG.

  Hereinafter, a semiconductor element housing package (hereinafter also simply referred to as a package) and a semiconductor device including the same according to an embodiment will be described in detail with reference to the drawings. However, in the drawings referred to below, for convenience of explanation, among the constituent members of the embodiment, only the main members necessary for explaining the present invention are shown in a simplified manner. Therefore, the package and the semiconductor device according to the present invention can include arbitrary constituent members not shown in the drawings referred to in this specification. Moreover, the dimension of the member in each figure does not represent the dimension of an actual structural member, the dimension ratio of each member, etc. faithfully.

  As shown in FIGS. 1 to 4, the element storage package 1 according to the first embodiment includes a substrate 5 having a placement area on which a semiconductor element 3 is placed on an upper surface, and a substrate surrounding the placement area. 5 is disposed on the upper surface of the frame 5 and has a recess 9 on the outer peripheral surface side, and is electrically connected to the semiconductor element 3 drawn from the area surrounded by the frame 9 to the inner surface of the recess 7. The wiring conductor 11 and the lead terminal 15 joined to the wiring conductor 11 through the brazing material 13 are provided.

  At this time, the lead terminal 15 includes a first part 17 located on one end side and a second part 19 located on the other end side, so that the first part 17 and the second part 19 are provided. The structure is bent between the two. The first portion 17 of the lead terminal 15 is covered with the brazing material 13 and is fitted into the recess 7 so as to be joined to the wiring conductor 11 through the brazing material 13. Further, the second portion 19 of the lead terminal 15 is pulled out to the side of the frame body 9.

  In the package 1 of the present embodiment, the frame body 9 has a recess 7 on the outer peripheral surface side. A first portion 17 of the lead terminal 15 is fitted in the recess 7. At this time, the first portion 17 is fitted into the recess 7 while being covered with the brazing material 13, and is joined to the wiring conductor 11 via the brazing material 13. Specifically, the first portion 17 of the lead terminal 15 is three-dimensionally covered by the brazing material 13 from the vertical direction, the direction in which the second portion 19 is pulled out, and the direction perpendicular thereto. It has been broken. That is, the lead terminal 15 is not fixed to the brazing material 13 only by the adhesive force of the brazing material 13 to the lead terminal 15, but the first portion 17 of the lead terminal 15 is physically fixed to the brazing material 13. Yes.

  Therefore, as compared with the case where only the side surface of the lead terminal 15 facing the frame body 9 is brazed to the flat outer surface of the frame body 9, the direction in which the second portion 19 is pulled out (extended) Even when stress is applied to the lead terminal 15 from various directions including (direction), peeling of the lead terminal 15 from the brazing material 13 can be suppressed. As a result, signal input / output between the semiconductor element 3 and an external wiring circuit (not shown) can be stably performed via the lead terminal 15.

  The substrate 5 in the present embodiment has a square plate shape, and has a placement area on which the semiconductor element 3 is placed on the main surface. In the present embodiment, the placement region means a region that overlaps the semiconductor element 3 when the substrate 5 is viewed in plan. Specifically, the substrate 5 in the present embodiment has a shape having a square plate-shaped portion and a portion in which the screw holes 21 are formed by being pulled out to the four corners of the square plate-shaped portion. It has become. The package 1 can be screwed and fixed to a mounting substrate (not shown) by the screw holes 21.

  When the board | substrate 5 is flat plate shape, the magnitude | size can be set to 5 mm or more and 50 mm or less, for example. Moreover, as thickness of the board | substrate 5, it can set to 0.2 mm or more and 2 mm or less, for example.

  In the present embodiment, the placement region is formed at the center of the main surface, but since the region where the semiconductor element 3 is placed is the placement region, for example, at the end of the main surface of the substrate 5. There is no problem even if the mounting area is formed. Moreover, although the board | substrate 5 of this embodiment has one mounting area | region, the board | substrate 5 may have a some mounting area | region and the semiconductor element 3 may be mounted in each mounting area | region. .

  The semiconductor element 3 is disposed in the mounting region on the main surface of the substrate 5. The semiconductor element 3 can input / output signals to / from an external wiring circuit via the lead terminal 15 or the like. As described above, since the semiconductor element 3 is disposed on the main surface of the substrate 5, the substrate 5 is required to have high insulation at least in a portion where the semiconductor element 3 is disposed. It is done. The substrate 5 according to this embodiment is manufactured by stacking a plurality of insulating members. The semiconductor element 3 is placed on the placement region of the substrate 5. Examples of the insulating member include a ceramic material such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, and a silicon nitride sintered body, or a glass ceramic. Materials can be used.

  A mixing member is prepared by mixing the raw material powder containing these glass powder and ceramic powder, an organic solvent, and a binder. A plurality of ceramic green sheets are produced by forming the mixed member into a sheet. A plurality of laminated bodies are produced by laminating the produced ceramic green sheets. The substrate 5 is manufactured by integrally firing the plurality of laminated bodies at a temperature of about 1600 degrees.

  The substrate 5 is not limited to a configuration in which a plurality of insulating members are stacked. The board | substrate 5 may be comprised by one insulating member. Moreover, since it is calculated | required that the board | substrate 5 has high insulation in the part by which the semiconductor element 3 is arrange | positioned at least, it is good also as a structure which laminated | stacked the insulating member on the metal member, for example. In particular, when high heat dissipation is required for the substrate 5, the substrate 5 preferably has the above-described configuration. This is because the metal member has high heat dissipation. By setting it as the structure which laminated | stacked the insulating member on the metal member, the heat dissipation of the board | substrate 5 can be improved.

  Specifically, a metal member such as iron, copper, nickel, chromium, cobalt, and tungsten, or an alloy made of these metals can be used as the metal member. The metal member which comprises the board | substrate 5 is producible by giving metal processing methods, such as a rolling method and a punching method, to such an ingot of a metal member.

  When a metal member is used as a part of the substrate 5, the substrate 5 is arranged as shown in FIG. 5 so as not to cause an electrical short circuit with the wiring conductor 11, the brazing material 13, the lead terminal 15, and the like. It may be formed. In FIG. 5, the substrate 5 includes a first substrate 23 made of a metal member and a second substrate 25 made of an insulating member. At this time, the first substrate 23 is positioned so as to be separated from the wiring conductor 11, the brazing material 13, and the lead terminal 15, and is a portion in contact with the conductive member composed of the wiring conductor 11, the brazing material 13 and the lead terminal 15. The second substrate 25 is used for the above.

  In addition, the semiconductor element 3 may be directly mounted on the upper surface of the substrate 5, but the semiconductor element 3 disposed on the mounting region of the substrate 5 is placed as in the package 1 of the present embodiment. For example, the semiconductor element 3 may be mounted on the mounting substrate 27. As the mounting substrate 27, it is preferable to use a member having good insulation like the insulating member. For example, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, and an aluminum nitride material are used. Ceramic materials such as sintered bodies and silicon nitride-based sintered bodies, or glass ceramic materials can be used.

  The package 1 of the present embodiment includes a frame body 9 disposed on the upper surface of the substrate 5 so as to surround the mounting area. The frame body 9 is joined to the substrate 5 via a joining member (not shown). Examples of the joining member include gold-tin solder and silver solder.

  When the frame 9 has a cylindrical shape in which the shape of the outer periphery and the inner periphery when viewed in plan is a quadrangle as shown in FIGS. 1 and 2, for example, the outer periphery can be set to 5 mm to 50 mm on a side. Moreover, when the distance between an outer periphery and an inner periphery is made into the thickness of the frame 9, the thickness of the frame 9 can be set to 0.5 mm or more and 2 mm or less, for example. Moreover, as the height of the frame 9, it can set to 2 mm or more and 10 mm or less, for example.

As the frame body 9, for example, a member having good insulating properties can be used in the same manner as the substrate 5. Examples of members having good insulation include ceramic materials such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, and a silicon nitride sintered body, Or a glass ceramic material is mentioned. In addition to a member having good insulating properties, for example, a metal member such as iron, copper, nickel, chromium, cobalt, and tungsten, or an alloy made of these metals can be used. A metal member constituting the frame body 9 can be produced by subjecting such an ingot of the metal member to a metal working method such as a rolling method or a punching method. Further, the frame body 9 may be composed of one member, but may be a laminated structure of a plurality of members.

  When a metal member is used as a part of the frame body 9, the frame body as shown in FIG. 5 is used so as not to cause an electrical short circuit with the wiring conductor 11, the brazing material 13, the lead terminal 15, and the like. 9 may be formed. In FIG. 5, the frame body 9 is constituted by a first frame body 29 made of a metal member and a second frame body 31 made of an insulating member. At this time, the first frame body 29 is positioned so as to be separated from the wiring conductor 11, the brazing material 13 and the lead terminal 15, and is in contact with the conductive member composed of the wiring conductor 11, the brazing material 13 and the lead terminal 15. The second frame 31 is used for the part.

  The frame body 9 has a plurality of recesses 7 on the outer peripheral surface side. Specifically, a plurality of recesses 7 are formed on the side surfaces that are opposite to each other among the side surfaces constituting the outer peripheral surface. The plurality of recesses 7 formed on these side surfaces are arranged in parallel in a direction parallel to the upper surface of the substrate 5. Each recess 7 opens toward the side of the frame body 9. A lead terminal 15 to be described later is fitted in the recess 7.

  Further, the frame body 9 has openings that open to the inner peripheral surface and the outer peripheral surface. The input / output terminal 33 is inserted and fixed in this opening. In the package 1 of the present embodiment, the inner surface of the recess 7 is formed by the side surface of the input / output terminal 33 inserted and fixed to the frame body 9 and the inner surface of the opening of the frame body 9.

  The frame body 9 in the package 1 of the present embodiment has openings that open to the inner peripheral surface and the outer peripheral surface. A part of the input / output terminal 33 is inserted and fixed in the opening of the frame body 9. The input / output terminal 33 includes a first insulating member 35, a second insulating member 37, and a wiring member 39. The first insulating member 35 is disposed on the upper surface of the substrate 5. The wiring member 39 is disposed on the upper surface of the first insulating member 35. The second insulating member 37 is disposed on the upper surfaces of the first insulating member 35 and the wiring member 39 so that one end and the other end of the wiring member 39 are exposed. At this time, one end of the wiring member 39 is located within the region surrounded by the frame body 9, and the other end is drawn out to the inner surface of the recess 7.

  The wiring member 39 constitutes a part of the wiring conductor 11. One end of the wiring member 39 and the semiconductor element 3 are electrically connected via a bonding wire 41. Thereby, electrical connection can be achieved between the inside and the outside of the region surrounded by the frame body 9. The input / output terminal 33 in the package 1 of the present embodiment has a plurality of wiring members 39, and the plurality of wiring members 39 are arranged at predetermined intervals so as not to be electrically short-circuited with each other. Has been. The interval between the plurality of wiring members 39 may be about 0.3 to 1.5 mm.

  In the package 1 of the present embodiment, the wiring member 39 and the semiconductor element 3 are electrically connected via the bonding wires 41, but the present invention is not limited to this. For example, a connection conductor having one end electrically connected to the wiring member 39 and the other end routed to the placement area is disposed on the upper surface of the substrate 5, and The conductor and the semiconductor element 3 may be connected.

The first insulating member 35 in the present embodiment has a quadrangular plate shape, and a plurality of wiring members 39 are disposed on the upper surface. As an exemplary size of the first insulating member 35, the width of the short side direction parallel to the drawing direction of the wiring member 39 when viewed in plan is about 1 to 10 mm, and the wiring member 39 is drawn when viewed in plan. A rectangular plate-shaped member having a width in the longitudinal direction perpendicular to the direction of about 5 to 50 mm and a thickness of about 0.3 to 5 mm can be used.

  As the first insulating member 35, it is preferable to use a member having good insulation like the insulating member. For example, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, a nitrided body A ceramic material such as an aluminum sintered body and a silicon nitride sintered body, or a glass ceramic material can be used.

  The wiring member 39 is a member for electrically connecting an external wiring circuit and the semiconductor element 3 via the lead terminal 15 or the like fitted in the recess 7. Therefore, the wiring member 39 in the present embodiment is disposed only on the main surface of the substrate 5, but is not particularly limited thereto. For example, a part of the wiring member 39 may be embedded in the first insulating member 35.

  As the wiring member 39, a member having good conductivity is preferably used. Specifically, a metal material such as tungsten, molybdenum, nickel, copper, silver, and gold can be used as the wiring member 39. The above metal materials may be used alone or as an alloy.

  Since the second insulating member 37 hermetically seals the region surrounded by the frame body 9, the first insulating member 35 and the wiring are closed so as to close the opening of the frame body 9 with the first insulating member 35. It is provided on the member 39. At this time, the second insulating member 37 is not provided on the wiring member 39 but the one end and the other end of the wiring member 39 are exposed. It is provided above.

  The second insulating member 37 in the present embodiment has a square plate shape. As an exemplary size, the width in the short direction parallel to the drawing direction of the wiring member 39 when viewed in plan is about 0.5 to 9.5 mm, and is perpendicular to the drawing direction of the wiring member 39 when viewed in plan. A square plate-shaped member having a width in the longitudinal direction of about 5 to 50 mm and a thickness of about 0.3 to 5 mm can be used. As the second insulating member 37, it is preferable to use a member having good insulating properties like the first insulating member 35.

  The package 1 of the present embodiment includes a wiring conductor 11 drawn out from the region surrounded by the frame body 9 to the inner surface of the recess 7. Specifically, the wiring conductor 11 in the package 1 of the present embodiment is configured by the wiring member 39 of the input / output terminal 33 and the bonding wire 41 that electrically connects the wiring member 39 and the semiconductor element 3 as described above. ing. One end of the wiring conductor 11, that is, the bonding wire 41 is located in a region surrounded by the frame body 9 and is electrically connected to the semiconductor element 3. Further, the other end of the wiring conductor 11, that is, the other end of the wiring member 39 is drawn out to the inner surface of the recess 7 formed on the outer peripheral surface side of the frame body 9.

  When the width of the concave portion 7 in the thickness direction of the frame body 9 is the depth of the concave portion 7, the depth of the concave portion 7 is preferably 10 to 50% with respect to the thickness of the frame body 9. This is because when the above ratio is 10% or more, the brazing material 13 can be stably stored in the recess 7. Moreover, when said ratio is 50 or less, the airtightness of the area | region enclosed by the frame 9 can be made favorable.

As shown in FIGS. 6 and 7, the input / output terminal 33 is disposed so that the first insulating member 35 and the second insulating member 37 are in contact with the inner peripheral surface of the frame body 9, and the outer peripheral surface side of the frame body 9. If the recess 7 is formed on the outer peripheral surface of the frame body 9, the recess 7 having the above-described depth may be simply formed on the outer peripheral surface side of the frame body 9. Further, as in the package 1 of the present embodiment, when the frame body 9 has an opening, and a part of the input / output terminal 33 is inserted and fixed in the opening, the thickness of the frame body 9 is increased. The input / output terminal 33 may be inserted into the opening with a width of 50 to 90%. Thereby, the depth of the recessed part 7 can be 10 to 50% with respect to the thickness of the frame 9. Specifically, the depth of the recess 7 can be set to 0.2 mm or more and 2 mm or less.

  Moreover, it is preferable that the width | variety of the recessed part 7 in the direction parallel to the up-down direction of the frame 9 is 20% or more with respect to the width | variety (height) of the up-down direction of the frame 9. When the above ratio is 20% or more, a space in which the first portion 17 of the lead terminal 15 is fitted can be stably secured, so that the possibility of the lead terminal 15 peeling off can be further reduced. Specifically, the width of the recess 7 in the above direction can be set to 0.4 mm or more.

  Further, the width of the concave portion 7 in a direction perpendicular to the two directions and parallel to the outer peripheral surface of the frame body 9 and parallel to the upper surface of the substrate 5 may be equal to the depth of the concave portion 7. Specifically, it may be set to 0.2 mm or more and 2 mm or less.

  The package 1 of the present embodiment includes a lead terminal 15 joined to the wiring conductor 11 via a brazing material 13. The lead terminal 15 in the present embodiment is not a linear structure, but includes a first part 17 located on one end side and a second part 19 located on the other end side. The region 17 and the second region 19 are bent. More specifically, in the lead terminal 15 of the package 1 of the present embodiment, the linear portion located on one end side of the bent portion is the first portion 17, the other portion than the bent portion. A linear portion located on the end side and drawn out to the side of the frame body 9 is defined as a second portion 19.

  The first portion 17 of the lead terminal 15 is covered with the brazing material 13 and is fitted into the recess 7 so as to be joined to the wiring conductor 11 through the brazing material 13. Further, the second portion 19 of the lead terminal 15 is pulled out to the side of the frame body 9. Since the lead terminal 15 has the above-described configuration, as described above, only the side surface of the lead terminal 15 facing the frame body 9 is brazed to the flat outer surface of the frame body 9. In comparison, peeling of the lead terminal 15 from the brazing material 13 can be suppressed.

  As the lead terminal 15, a linear metal member whose cross section perpendicular to the longitudinal direction is circular, elliptical or polygonal can be used. By partially bending such a metal member, the lead terminal 15 having the first portion 17 and the second portion 19 and having a structure in which the portion is bent can be obtained.

  The first portion 17 of the lead terminal 15 is fitted into the recess 7 so that the longitudinal direction thereof is parallel to the vertical direction of the frame body 9. Therefore, the first portion 17 of the lead terminal 15 can be stably covered with the brazing material 13 and fitted into the recess 7. Further, the width in the longitudinal direction of the first portion 17 of the lead terminal 15 is such that the concave portion 7 in a direction parallel to the vertical direction of the frame body 9 in order to stably fit the first portion 17 into the concave portion 7. It is preferable that the width is slightly smaller than the width, specifically, 0.3 mm to 8 mm.

  The first portion 17 may be partially fitted in the recess 7 so that a part thereof is located on the side of the outer peripheral surface of the frame body 9, in other words, a part thereof protrudes from the recess 7. As shown in the figure, the entire first portion 17 is preferably fitted in the recess 7. Accordingly, the first portion 17 can be stably covered with the brazing material 13 and the bonding area between the brazing material 13 and the inner surface of the recess 7 can be increased without using an excessive amount of brazing material 13. Therefore, peeling of the lead terminal 15 from the frame body 9 can be further suppressed.

In the package 1 shown in FIGS. 1-4, the width | variety of the recessed part 7 in the direction parallel to the outer peripheral surface of the frame 9 and parallel to the upper surface of the board | substrate 5 is constant. In other words, the width in the direction parallel to the outer peripheral surface of the frame body 9 on the bottom side of the recess 7 and parallel to the upper surface of the substrate 5, and parallel to the outer peripheral surface of the frame body 9 on the opening side and parallel to the upper surface of the substrate 5. The width in the same direction is the same. The shape of the recess 7 may be such a shape, but is preferably a shape as shown in FIGS.

  That is, the concave portion 7 formed on the outer peripheral surface side of the frame body 9 has a tapered portion whose width decreases in the cross section parallel to the upper surface of the substrate 5 from the bottom side toward the opening side. Is preferred. Since the concave portion 7 has such a tapered portion, the brazing material 13 covering the first portion 17 of the lead terminal 15 and filled in the concave portion 7 is physically fixed to the concave portion 7. It will be. Since the brazing material 13 is physically fixed to the concave portion 7 and the lead terminal 15 is physically fixed to the brazing material 13 as described above, peeling of the lead terminal 15 from the concave portion 7 can be suppressed. Therefore, stable electrical connection between the lead terminal 15 and the semiconductor element 3 can be achieved.

  8 and 9, the entire inner surface is tapered, but the present invention is not limited to this. When the entire inner surface has a tapered shape, the brazing material 13 can be firmly fixed to the recess 7. For example, as shown in FIGS. 10 and 11, the inner surface of the recess 7 is partially Even when the lead terminal 15 has a taper shape, the lead terminal 15 is physically fixed to the brazing material 13, and therefore, the peeling of the lead terminal 15 from the recess 7 can be suppressed. Further, the brazing material 13 is difficult to leak from the recess 7 to the outer peripheral surface side of the frame body 9, and an electrical short circuit between the adjacent lead terminal 15 and the wiring conductor 11 can be suppressed.

  As shown in FIGS. 8 and 9, the concave portion 7 formed on the outer peripheral surface side of the frame body 9 has a taper whose width decreases in the cross section parallel to the top surface of the substrate 5 from the bottom side toward the opening side. It is also preferable to have a shape portion, but conversely, as shown in FIGS. 12 and 13, in the cross section parallel to the top surface of the substrate 5, the width of the recess 7 increases from the opening side toward the bottom side. You may have the taper-shaped part which becomes small.

  The portion where the lead terminal 15 and the wiring conductor 11 are joined via the brazing material 13 has a heat that melts the brazing material 13 when the lead terminal 15 is joined to the wiring conductor 11 via the brazing material 13. In addition to being added, heat is relatively easily generated when the semiconductor element 3 is energized. Therefore, there is a possibility that the brazing material 13 is largely thermally expanded, and stress due to a difference in thermal expansion between the lead terminal 15 and the wiring conductor 11 or the first insulating member 35 is caused by the solder material 13 and the bottom of the recess 7. It occurs at the corner with the inner peripheral surface. However, when the concave portion 7 has a tapered portion whose width decreases from the opening side toward the bottom side as shown in FIGS. 12 and 13, the brazing material 13 is located on the side of the frame body 9. And the stress is dispersed through the brazing material 13.

  Therefore, the thermal stress caused by the thermal expansion of the brazing material 13, the thermal stress caused by the thermal expansion difference between the lead terminal 15 and the wiring conductor 11 or the first insulating member 35, the bottom and inner circumference of the recess 7 The thermal stress generated at the corner with the surface can be released from the bottom of the recess 7 to the side of the frame body 9 along the opening. As a result, the package 1 with good durability can be obtained. That is, when making the package 1 with good durability, it is preferable that the concave portion 7 has a tapered portion whose width decreases as it goes from the opening side to the bottom side.

In the package 1 of the present embodiment, as shown in FIGS. 1 to 4, the recess 7 is opened on the outer peripheral surface and the lower surface of the frame body 9. Further, the substrate 5 has a cutout portion that is cut out in the vertical direction so as to overlap the concave portion 7 in the vertical direction. As shown in FIG. 14, the substrate 5 does not have a notch, and the recess 7 may be opened only on the outer peripheral surface side of the housing formed of the substrate 5 and the frame body 9. In the case where the recess 7 and the notch are formed as in the package 1, the influence of thermal stress caused by the thermal expansion of the brazing material 13 can be reduced. This is because the thermal stress caused by the thermal expansion of the brazing material 13 can be released not only to the side of the frame body 9 but also to the lower side of the substrate 5.

  Further, when a plurality of recesses 7 and lead terminals 15 are provided, the brazing material 13 filled in each recess 7 can be dispersed below the substrate 5. Therefore, it is possible to reduce the possibility that the brazing members 13 protruding from the respective recesses 7 come into contact with each other to cause an electrical short circuit.

  In the case where a metal member is used as the mounting substrate on which the package 1 is mounted, in order to reduce the possibility that the brazing material 13 protruding below the substrate 5 is electrically short-circuited through the mounting substrate. As shown in FIG. 14, it is preferable that the substrate 5 does not have a notch, and the recess 7 is opened only on the outer peripheral surface side of the housing formed of the substrate 5 and the frame body 9. Further, in FIG. 14, the substrate 5 does not have a notch, and the recess 7 is opened only on the outer peripheral surface side of the housing formed of the substrate 5 and the frame body 9. The same effect can be obtained even if the structure is opened only on the outer peripheral surface side of the frame body 9.

  In the package 1 of the present embodiment, a metallized layer (not shown) is disposed on the inner surface of the recess 7. Thereby, the wettability between the inner surface of the recess 7 and the brazing material 13 is improved, so that the bonding property between the frame body 9 and the brazing material 13 can be improved.

  Furthermore, the package 1 of the present embodiment includes a plurality of recesses 7 and lead terminals 15, and metallized layers are disposed on the inner surfaces of the plurality of recesses 7, and the recesses adjacent to each other on the outer peripheral surface of the frame body 9. 7 is exposed from the metallized layer. Thus, by providing the metallized layer, it is possible to reduce the possibility that the brazing materials 13 filled in the adjacent recesses 7 come into contact with each other to cause an electrical short circuit.

  Further, the metallized layer is disposed on the inner surfaces of the plurality of recesses 7, and is disposed around the opening of the recess 7 on the outer peripheral surface of the frame body 9, and a portion located between the recesses 7 adjacent to each other. It may be exposed from the metallization layer. Thus, by providing the metallized layer, the corners of the openings of the recesses 7 and the outer peripheral surface of the frame body 9 are covered with the brazing material 13, which is caused by stress concentrated on the corners. In addition to reducing peeling of the brazing material 13 from the metallized layer and cracks at the joint, it is possible to reduce the possibility that the brazing materials 13 filled in the adjacent recesses 7 come into contact with each other to cause an electrical short circuit.

  Moreover, the frame body 9 has a through-hole opened in the inner peripheral surface and outer peripheral surface. The through hole can be formed in the frame body 9 by, for example, drilling. A cylindrical fixing member 43 is fixed in the through hole. Specifically, the tubular fixing member 43 is fixed to the through hole by inserting one end of the fixing member 43 into the through hole and joining the fixing member 43 to the surface of the through hole. The cylindrical fixing member 43 is a member for fixing and positioning the optical fiber. In addition, since the fixing member 43 is cylindrical, light can be transmitted between the electronic component and the optical fiber through the cylindrical hollow portion.

  It is preferable that the fixing member 43 has a strength that can fix at least the optical fiber. Specifically, metal members such as stainless steel, iron, copper, nickel, chromium, cobalt, and tungsten, or alloys made of these metals can be used. The cylindrical fixing member 43 can be produced by subjecting such a metal member ingot to a metal processing method such as a rolling method or a punching method.

In particular, it is preferable that the frame body 9 and the fixing member 43 are formed using the same metal member. This is because the difference in thermal expansion between the frame body 9 and the fixing member 43 can be reduced, so that the stress generated between the frame body 9 and the fixing member 43 can be reduced.

  The fixing member 43 can be fixed to the frame body 9 by bonding to the frame body 9 using a bonding member. As the joining member, for example, gold-tin solder or silver solder can be used. Further, the fixing member 43 may be fixed to the frame body 9 by welding the fixing member 43 to the frame body 9.

  A translucent member may be disposed inside the tube of the fixing member 43 so as to close the hole of the fixing member 43. The translucent member closes the inside of the fixing member 43, maintains the airtightness of the element housing package 1, and attaches and connects the excited light of the semiconductor element 3 that transmits the internal space of the fixing member 43 to the fixing member 43 as it is. It acts to transmit to the optical fiber. As the translucent member, for example, lead-based amorphous silicon and borosilicate-based glass mainly composed of lead oxide and boric acid and silica sand can be used.

  When using the semiconductor device 101 of this embodiment, the ferrule is fixed to the other end of the fixing member 43. The ferrule has a through hole whose one end opens to the inside of the cylinder of the fixing member 43. Then, an optical fiber is inserted and fixed in this through hole. As described above, the ferrule is inserted and fixed to the fixing member 43, whereby the optical fiber and the semiconductor element 3 can be optically coupled.

  The semiconductor device 101 of the present embodiment is joined to the element housing package 1 typified by the above embodiment, the semiconductor element 3 placed in the placement area of the element housing package 1, and the frame body 9. In addition, a lid 45 for sealing the semiconductor element 3 is provided.

  In the semiconductor device 101 of this embodiment, the semiconductor element 3 is placed on the placement region of the substrate 5. In addition, the semiconductor element 3 and the line conductor, and the line conductor and the internal terminal are connected by a conducting wire, respectively. A desired output can be obtained from the semiconductor element 3 by inputting an external signal to the semiconductor element 3 via the input / output terminal 33 or the like. Examples of the semiconductor element 3 include a light emitting element that emits light to an optical fiber, typified by an LD element, and a light receiving element that receives light to an optical fiber, typified by a PD element.

  The lid body 45 is bonded to the frame body 9 and is provided so as to seal the semiconductor element 3. The lid body 45 is joined to the upper surface of the frame body 9. The semiconductor element 3 is sealed in a space surrounded by the base body, the frame body 9 and the lid body 45. By sealing the semiconductor element 3 in this way, it is possible to suppress the deterioration of the semiconductor element 3 due to the long-term use of the package 1. As the lid body 45, for example, a metal member such as iron, copper, nickel, chromium, cobalt, and tungsten, or an alloy made of these metals can be used. Further, the frame body 9 and the lid body 45 can be joined by, for example, a seam welding method. Moreover, you may join the frame 9 and the cover body 45, for example using gold- tin solder.

  The element storage package 1 and the semiconductor device 101 including the element storage package 1 according to an embodiment of the present invention have been described above, but the present invention is not limited to the above-described embodiment. In other words, various modifications and combinations of embodiments may be made without departing from the scope of the present invention.

1 ... Package for element storage (package)
3 ... Semiconductor element 5 ... Substrate 7 ... Recess 9 ... Frame 11 ... Wiring conductor 13 ... Brazing material 15 ... Lead terminal 17 ... First part 19 .... Second part 21 ... Screwing hole 23 ... First substrate 25 ... Second substrate 27 ... Mounting substrate 29 ... First frame 31 ... First 2 frame 33 ... input / output terminal 35 ... first insulating member 37 ... second insulating member 39 ... wiring member 41 ... bonding wire 43 ... fixing member 45 ... .Cover body 101 ... Semiconductor device

Claims (5)

A substrate having a mounting region on a top surface on which a semiconductor element is mounted;
A frame having a recess on the outer peripheral surface side disposed on the upper surface of the substrate so as to surround the placement area;
A wiring conductor that is drawn from the region surrounded by the frame body to the inner surface of the recess and is electrically connected to the semiconductor element;
A first portion located on one end side and a second portion located on the other end side, wherein the first portion and the second portion are bent between the first portion and the first portion; A lead terminal which is covered with the brazing material and is fitted into the recess so as to be joined to the wiring conductor via the brazing material, and the second portion is pulled out to the side of the frame body. A package for storing semiconductor elements.   2. The semiconductor element housing according to claim 1, wherein the concave portion has a tapered portion whose width decreases from the bottom side toward the opening side in a cross section parallel to the top surface of the substrate. For package. The recesses open to the outer peripheral surface and the lower surface of the frame,
2. The package for housing a semiconductor element according to claim 1, wherein the substrate has a cutout portion cut out in a vertical direction so as to overlap the concave portion in the vertical direction. A plurality of the recesses and the lead terminals, respectively,
The metallized layer is disposed on each of the inner surfaces of the plurality of recesses, and a portion of the outer peripheral surface of the frame located between the adjacent recesses is exposed from the metallization layer. Item 14. A package for housing a semiconductor element according to Item 1. A package for housing semiconductor elements according to claim 1;
A semiconductor element placed in the placement area of the semiconductor element storage package;
A semiconductor device comprising: a lid that is bonded to the upper surface of the frame and seals the semiconductor element.

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