JP2012063161A - Cleaning mending tool, cleaning method and inspection method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To remove such foreign matter as trash on a measurement terminal.SOLUTION: A cleaning mending tool 100 includes a plurality of cleaning parts 14 arranged corresponding to a plurality of measurement terminals of an electronic component inspection device having the plurality of measurement terminals so as to be brought into contact with the plurality of measurement terminals for cleaning the measurement terminals. The cleaning parts 14 are formed in the same shape as that of the external terminal of the electronic component to be inspected by the electronic component inspection device, and coated with binder 21.

Description

  The present invention relates to a cleaning jig, a cleaning method, and an inspection method of an electronic component inspection apparatus.

  An inspection device for an electronic component such as a semiconductor device has a plurality of measurement terminals arranged corresponding to a plurality of external terminals of the electronic component. At the time of inspection, the external terminal of the electronic component is brought into contact with the measurement terminal of the inspection device, and signals are exchanged between the inspection device and the electronic component.

  Patent Document 1 discloses an IC handler including a contactor that is in contact with an IC. A contactor cleaning tip formed in the same shape as the IC with a material including abrasive particles is brought into contact with the contactor, thereby dislocation deposits from the contactor. The IC handler to be removed is described. Dislocation deposits are those in which IC lead solder plating or the like melts and adheres to the contactor.

  Further, Patent Document 2 describes that, in a semiconductor IC lead, a contact pin is cleaned by processing a surface that contacts the contact pin into an uneven textured surface and polishing the contact pin at this textured portion. Yes.

  Japanese Patent Application Laid-Open No. H10-228561 describes that the contact pins of the socket for a semiconductor device are cleaned using a cleaning chip formed in an external shape approximate to that of the semiconductor device. The cleaning chip has a thin plate-like cleaning portion having a thickness approximate to the thickness of the lead of the semiconductor device. The cleaning unit is configured to absorb molten solder by capillary action, or configured to scrape off the solder attached to the contact pins by vibration.

JP 2002-168909 A Japanese Patent Laying-Open No. 2005-061978 JP 2001-305183 A

  By the way, if foreign matter such as dust adheres to the measurement terminal, it is difficult to properly perform the inspection. The techniques of Patent Documents 1 to 3 have a configuration in which solder or the like attached to a measurement terminal (contactor, contact pin) is removed by polishing or the like, or a configuration in which it is melted and adsorbed. For this reason, with these techniques, it is difficult to remove foreign matters such as dust on the measurement terminal.

The present invention provides a plurality of cleaning portions that are provided in an arrangement corresponding to each of the plurality of measurement terminals of an electronic component inspection apparatus having a plurality of measurement terminals, and that respectively contact the plurality of measurement terminals to clean the measurement terminals. Have
The cleaning section is formed in the same shape as an external terminal of an electronic component to be inspected by the electronic component inspection apparatus, and provides a cleaning jig that is coated with an adhesive.

  According to this cleaning jig, since the cleaning part is formed in the same shape as the external terminal of the electronic component to be inspected by the electronic part inspection apparatus, the cleaning part can be reliably brought into contact with the measurement terminal. And since the cleaning part is coated with the adhesive, the measurement terminal can be cleaned by entwining foreign matter such as dust on the measurement terminal with the adhesive. In addition, since the damage given to a measurement terminal is small compared with the technique which grind | polishes a measurement terminal, even if it cleans a measurement terminal with high frequency, the influence which it has on the lifetime of a measurement terminal can be suppressed.

Further, the present invention provides a plurality of cleanings provided in an arrangement corresponding to each of the plurality of measurement terminals of an electronic component inspection apparatus having a plurality of measurement terminals and cleaning the measurement terminals by being in contact with each of the plurality of measurement terminals. The cleaning section includes a cleaning jig that is formed in the same shape as an external terminal of an electronic component to be inspected by the electronic component inspection apparatus and is coated with an adhesive. A step of bringing a portion into contact with each of the plurality of measurement terminals;
Separating the plurality of cleaning portions from the plurality of measurement terminals, respectively.
A cleaning method is provided.

The present invention also includes a step of inspecting a semiconductor device using an electronic component inspection apparatus having a plurality of measurement terminals,
Cleaning the plurality of measurement terminals of the electronic component inspection device;
Have
In the step of cleaning the plurality of measurement terminals, each of the plurality of measurement terminals is provided in an arrangement corresponding to each of the plurality of measurement terminals, and has a plurality of cleaning portions that are in contact with the plurality of measurement terminals and clean the measurement terminals, The cleaning unit is formed in the same shape as an external terminal of an electronic component to be inspected by the electronic component inspection apparatus, and the plurality of cleaning units of the cleaning jig coated with an adhesive is measured with the plurality of Contacting each of the terminals;
Separating the plurality of cleaning portions from the plurality of measurement terminals, respectively.
An inspection method characterized in that is performed.

  According to the present invention, foreign matter such as dust on the measurement terminal can be removed.

It is a figure which shows the cleaning jig which concerns on 1st Embodiment. It is a perspective view which shows the socket of an electronic component inspection apparatus. It is a block diagram of an electronic component inspection apparatus. It is a figure which shows the semiconductor device to be examined. It is sectional drawing of the measurement terminal and the cleaning part in the state which has arrange | positioned the cleaning jig which concerns on 1st Embodiment in the socket. It is a flowchart which shows the cleaning method which concerns on 1st Embodiment. It is a flowchart which shows the operation | movement at the time of the measurement of a semiconductor device. It is a figure which shows the cleaning jig which concerns on 2nd Embodiment. It is a figure which shows the cleaning jig which concerns on 3rd Embodiment. It is a perspective view which shows the cleaning jig which concerns on a comparative example. It is sectional drawing which shows the cleaning operation | movement by the cleaning jig which concerns on a comparative example.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same components are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

[First Embodiment]
FIG. 1 is a view showing a cleaning jig 100 according to the first embodiment, in which (a) is a plan view and (b) is a cross-sectional view taken along the line AA of (a). FIG. 2 is a perspective view showing the socket 150 of the electronic component inspection apparatus 60 (FIG. 3). FIG. 3 is a block diagram of the electronic component inspection apparatus 60. 4A and 4B are diagrams showing a semiconductor device 80 to be inspected, in which (a) is a plan view and (b) is a cross-sectional view taken along the line AA of (a). FIG. 5 is a cross-sectional view of the contact pin 8 and the cleaning unit 14 in a state where the cleaning jig 100 according to the first embodiment is disposed in the socket 150.

  The cleaning jig 100 according to the present embodiment is provided in an arrangement corresponding to each of the plurality of measurement terminals of the electronic component inspection apparatus 60 having the plurality of measurement terminals (contact pins 8), and is in contact with each of the plurality of measurement terminals. The cleaning unit 14 has a plurality of cleaning units 14 for cleaning the measurement terminals, and the cleaning unit 14 has the same shape as an external terminal (for example, a lead 82) of an electronic component (for example, a semiconductor device 80) to be inspected by the electronic component inspection apparatus 60. And the adhesive 21 is coated. Details will be described below.

  First, the semiconductor device 80 to be inspected by the electronic component inspection apparatus 60 will be described. As shown in FIG. 4, the semiconductor device 80 includes a main body 81 having a rectangular shape in plan view, and a plurality of leads (external terminals) 82 held by the main body 81 and protruding from the main body 81. is doing. A plurality of leads 82 protrude from the four sides of the main body 81 toward the outside of the main body 81. The main body 81 includes, for example, a die pad 41, a semiconductor chip 42 die-bonded on the die pad 41, and a sealing resin 43 that seals the die pad 41 and the semiconductor chip 42. The base end portion of the lead 82 is embedded in the sealing resin 43. Although illustration is omitted, for example, the electrode provided on the upper surface of the semiconductor chip 42 and the base end portion of the lead 82 are wire-bonded via a bonding wire. In the case of this embodiment, as shown in FIG. 4B, the lead 82 is cut and separated from the outer frame of the lead frame (not shown in FIG. 4; see FIG. 8), and the lead 82 has a gull wing shape. The semiconductor device 80 after being formed into an object is an inspection object.

  The electronic component inspection apparatus 60 is for inspecting the electrical characteristics of the semiconductor device 80. As shown in FIG. 3, the electronic component inspection device 60 includes a socket 150 in which the semiconductor device 80 is disposed at the time of inspection, a control unit 70, and a moving mechanism 75. The socket 150 has a plurality of contact pins 8 arranged corresponding to the plurality of leads 82 included in the semiconductor device 80.

  The control unit 70 includes a drive control unit 71 that controls the operation of the moving mechanism 75 and an inspection unit 72 that inspects the semiconductor device 80. The inspection unit 72 includes an inspection signal output unit 73 and a determination unit 74. Among these, the inspection signal output unit 73 outputs a predetermined inspection signal (input data) to each of the predetermined contact pins 8a among the plurality of contact pins 8.

  The determination unit 74 receives an inspection result signal (output data) from each of the predetermined contact pins 8b different from the input data of the contact pins 8 of the socket 150. The determination unit 74 inspects the semiconductor device 80 based on these output data.

  The electronic component inspection apparatus 60 further includes a test board (not shown) to which the socket 150 is fixed. By fixing the socket 150 at a predetermined position on the test board, a plurality of terminals (not shown) included in the inspection signal output unit 73 and a plurality of terminals (not shown) included in the determination unit 74 are respectively obtained. The corresponding contact pin 8 is electrically connected to enable input / output of the above-described input data and output data.

  The moving mechanism 75 holds the semiconductor device 80. A detailed description of the holding mechanism of the moving mechanism 75 is omitted. The moving mechanism 75 moves (for example, descends) the held semiconductor device 80 toward the socket 150 under the control of the drive control unit 71, thereby causing each of the leads 82 of the semiconductor device 80 to correspond to the corresponding contact pin. 8 to contact.

  As shown in FIG. 2, the socket 150 includes a base 3 that is fixed to the test board and a cover 4 that is attached to the base 3 so as to be openable and closable. The semiconductor device 80 is accommodated in an internal space formed by the base 3 and the cover 4, and the locking claw 5 of the cover 4 is fitted to the protrusion 6 of the base 3 with the cover 4 closed. The closed state is maintained, and the semiconductor device 80 is fixed to the socket 150.

  The base 3 is provided with a space for accommodating the main body 81 of the semiconductor device 80 in the center. The four corners of the space abut the corners of the main body 81 to restrict the movement of the semiconductor device 80. A post 7 is provided for performing positioning. Around this space, a plurality of contact pins 8 are attached in accordance with the arrangement of the leads 82 arranged along the four sides of the semiconductor device 80.

  As shown in FIG. 5, the base 3 has guides 31 located on both sides of each contact pin 8, and the upper surface of the contact pin 8 is located below the upper surface of the guide 31. At the time of inspection, the lead 82 of the semiconductor device 80 enters the gap of the guide 31 and contacts the upper surface of the contact pin 8.

  As shown in FIG. 1, the cleaning jig 100 according to the present embodiment is for removing foreign matters such as dust adhering to the contact pins 8, and is held by the main body 13 and the main body 13. And a plurality of cleaning sections 14.

  The main body part 13 is formed in a rectangular shape in plan view, and a plurality of cleaning parts 14 protrude from the four sides of the main body part 13 toward the outside of the main body part 13.

  Each cleaning unit 14 is in contact with each of the plurality of contact pins 8 of the electronic component inspection apparatus 60 to clean each contact pin 8, and is provided in an arrangement corresponding to each of the plurality of contact pins 8. .

  The cleaning unit 14 is formed in the same size and shape as the lead 82 of the semiconductor device 80. As shown in FIG. 1B, the cleaning unit 14 is formed in the same gull wing shape as the lead 82 of the semiconductor device 80. And as shown in FIG.1 (b), the adhesive 21 is coated on the outer peripheral surface of the cleaning part 14. As shown in FIG.

  The adhesive 21 is, for example, an adhesive resin, and is preferably an adhesive urethane rubber. Furthermore, it is a preferable example that the adhesive 21 is conductive. For this reason, specifically, it is mentioned that the adhesive 21 is a conductive adhesive urethane rubber. A specific example of the pressure-sensitive adhesive is conductive urethane rubber used at the tip of a conductive peta spatula manufactured by Atom Kosan Co., Ltd., model number PE-12.

The main body 13 is also formed in the same size and shape as the main body 81 of the semiconductor device 80.
Therefore, for example, the entire cleaning jig 100 is formed in the same outer shape as the semiconductor device 80. Thus, since the cleaning jig 100 has the same outer shape as the semiconductor device 80 to be inspected, it can be called a cleaning chip.

  The cleaning jig 100 is configured, for example, by coating the lead 82 of the semiconductor device 80 with the adhesive 21.

  Therefore, the main body 13 includes, for example, a die pad 41, a semiconductor chip 42 die-bonded on the die pad 41, and a sealing resin 43 that seals the die pad 41 and the semiconductor chip 42. Further, the base end portion of the cleaning unit 14 is embedded in the sealing resin 43. Although not shown, for example, the electrode provided on the upper surface of the semiconductor chip 42 and the base end portion of the cleaning unit 14 (that is, the base end portion of the lead 82 of the semiconductor device 80) are connected via bonding wires. Wire bonded.

Coating of the adhesive 21 on the cleaning unit 14 can be performed, for example, as follows.
First, the cleaning jig 100 (specifically, for example, the semiconductor device 80) at the stage before the adhesive 21 is coated is placed in a mold (not shown). This mold has a main body accommodating portion that accommodates the main body portion 13 (for example, the main body portion 81) and a cleaning portion accommodating portion that accommodates each cleaning portion 14 (before coating of the adhesive 21; for example, the lead 82). is doing.
Next, after pouring a liquid adhesive (for example, conductive adhesive urethane rubber) into the cleaning section housing section and drying it at a high temperature, the thin film of the adhesive 21 is formed on the outer peripheral surface of the cleaning section 14 (for example, the lead 82). Coating.
Or you may dry, after apply | coating an adhesive to the outer peripheral surface of the cleaning part 14 using application members, such as a brush (brush).

  Next, an inspection method for the semiconductor device 80 will be described. This inspection method includes a step of inspecting the semiconductor device 80 using the electronic component inspection apparatus 60 having a plurality of measurement terminals (contact pins 8), and a step of cleaning the plurality of measurement terminals of the electronic component inspection apparatus 60. Have. Among these, the process of cleaning the plurality of measurement terminals of the electronic component inspection apparatus 60 corresponds to the cleaning method according to the present embodiment. The cleaning method according to the present embodiment includes a step (see FIG. 5) of bringing a plurality of cleaning portions 14 of the cleaning jig 100 having the above-described configuration into contact with a plurality of contact pins 8 of the electronic component inspection apparatus 60, And a step of separating the cleaning unit 14 from each of the plurality of contact pins 8. Details will be described below.

  FIG. 6 is a flowchart showing a flow of an inspection method including this cleaning method, and FIG. 7 is a flowchart showing a detailed operation flow of step S11 in FIG.

  First, inspection (measurement of electrical characteristics) of a plurality of semiconductor devices 80 manufactured in advance is sequentially performed (step S11 in FIG. 6). For this purpose, a plurality of semiconductor devices 80 are accommodated in a tray (not shown), and one semiconductor device 80 is sequentially transferred from the tray to the electronic component inspection device 60 by a transfer device (handler) not shown. The semiconductor device 80 is delivered from the transfer device to the moving mechanism 75. Next, the semiconductor device 80 is lowered by the moving mechanism 75 and attached to the socket 150. Thereby, each lead 82 of the semiconductor device 80 comes into contact with the corresponding contact pin 8. Further, the cover 4 is automatically closed by an opening / closing mechanism (not shown). Next, the semiconductor device 80 arranged in the socket 150 in this way is inspected.

  In this inspection, first, a test pattern is set in the inspection signal output unit 73. That is, data (input data) of a signal input to the semiconductor device 80 and a signal (output expected value) to be output from the semiconductor device 80 as a response to this signal input are set in the inspection signal output unit 73. (Step S21 in FIG. 7).

  Next, input data is output from the inspection signal output unit 73 (step S22 in FIG. 7). That is, predetermined input data is output from the inspection signal output unit 73 to each of the predetermined contact pins 8a of the socket 150, and input data is input to the corresponding leads 82 from the predetermined contact pins 8a. To do. Then, the output data is input from the corresponding lead 82 to each of the predetermined contact pins 8b other than the test signal input among the contact pins 8 of the socket 150. The output data is input from the contact pins 8b to the determination unit 74.

  The determination unit 74 compares the output data with the expected output value (step S23 in FIG. 7). If the output data matches the expected output value (OK in step S23), the determination unit 74 determines that the inspected semiconductor device 80 is a non-defective product (step S24 in FIG. 7). On the other hand, if the output data does not match the expected output value (NG in step S23), the determination unit 74 determines that the inspected semiconductor device 80 is defective (step S25 in FIG. 7).

  When the inspection of one semiconductor device 80 is completed, the cover 4 is automatically opened by the opening / closing mechanism, the semiconductor device 80 is lifted by the moving mechanism 75, and the semiconductor device 80 is removed from the socket 150. Then, the semiconductor device 80 is delivered from the moving mechanism 75 to the transport device, and the semiconductor device 80 is transported to a tray (not shown) for the semiconductor device 80 that has been inspected.

  Thereafter, the same process is repeated as many times as the number of semiconductor devices 80 to be inspected, whereby the inspection of the semiconductor device 80 to be inspected is completed (step S12 in FIG. 6).

  Further, when a predetermined time for cleaning the contact pins 8 of the electronic component inspection device 60 (for example, three times a day) arrives, a predetermined number (for example, for one tray) of the cleaning jigs 100 sequentially contacts. The pin 8 is cleaned (step S13 in FIG. 6). For this purpose, the cleaning jig 100 is sequentially transported to the socket 150 in the same manner as in the operation of sequentially transporting the semiconductor devices 80 to the socket 150 by the transport device and the moving mechanism 75 and sequentially inspecting them. Each of the cleaning portions 14 is brought into contact with the corresponding contact pin 8 and then separated. Since the cleaning part 14 is coated with the adhesive 21, foreign substances such as dust on the contact pins 8 can be entangled by the adhesive 21 by this operation. By repeating the same process for the predetermined number of cleaning jigs 100, a series of cleaning operations are completed (step S14 in FIG. 6).

  Thereafter, an appearance inspection of the cleaning unit 14 of each cleaning jig 100 subjected to the cleaning operation is performed to check the state of attached dust or foreign matter (step S15 in FIG. 6). In this appearance inspection, a limit sample in which the sticking effect cannot be obtained is created in advance, and a judgment is made as to whether or not to discard by comparing the appearance of the limit sample with the cleaning jig 100 after use using a microscope. Do. The cleaning jig 00 determined that the adhesion effect of the cleaning unit 14 is weakened by the appearance inspection is discarded (step S16 in FIG. 6).

  Thereafter, the process returns to step S11 again, and the semiconductor device 80 is inspected.

  FIG. 10 is a perspective view showing a cleaning jig 1000 according to a comparative example, and FIG. 11 is a cross-sectional view showing a cleaning operation by the cleaning jig 1000.

  As shown in FIG. 10, the cleaning jig 1000 includes a rectangular parallelepiped main body 1001 and an adhesive layer 1002 formed on the bottom surface of the main body 1001. The width of the main body 1001 is larger than the interval between the guides 31 of the base 3. For this reason, when the socket 150 of the electronic component inspection apparatus 60 is cleaned by the cleaning jig 1000, the adhesive layer 1002 reaches the contact pins 8 disposed between the guides 31 as shown in FIG. I can't. Therefore, it is difficult for the cleaning jig 100 to remove the foreign matter 30 such as dust on the contact pins 8.

  On the other hand, in this embodiment, the adhesive 21 is coated on each of the cleaning portions 14 having the same shape as the leads 82 of the semiconductor device 80. Therefore, the cleaning unit 14 is surely inserted into the space between the guides 31, the cleaning unit 14 is brought into contact with the contact pin 8, and foreign matters such as dust on the contact pin 8 are entangled with the adhesive 21, thereby 8 can be cleaned.

  According to the first embodiment as described above, the cleaning unit 14 is formed in the same shape as the lead 82 of the semiconductor device 80 to be inspected by the electronic component inspection device 60. The contact pin 8 can be contacted. Since the cleaning part 14 is coated with the adhesive 21, the contact 21 can be cleaned by entwining foreign matter such as dust on the contact pin 8 with the adhesive 21. In addition, since the damage given to a measurement terminal (contact pin 8) is small compared with the technique which grind | polishes a measurement terminal, even if it cleans a measurement terminal with high frequency, the influence which it has on the lifetime of a measurement terminal can be suppressed.

  Then, the cleaning jig 100 is supplied to the socket 150 using a handler or the like in the same manner as in the mass production environment, and the contact pin 8 is automatically cleaned by bringing the cleaning unit 14 into and out of contact with the contact pin 8. It is possible to reduce the number of man-hours for cleaning work.

  In addition, since the adhesive 21 is conductive, if the adhesive 21 is peeled off on the contact pin 8 during cleaning using the cleaning jig 100, the influence on the subsequent measurement should be reduced. Can do.

[Second Embodiment]
FIG. 8 is a view showing a cleaning jig 200 according to the second embodiment, in which (a) is a plan view and (b) is a cross-sectional view taken along line AA of (a).

In the first embodiment (FIG. 1), the semiconductor device 80 to be inspected does not have an outer frame around the lead 82, and the cleaning jig 100 also has an outer frame around the cleaning unit 14. An example that has not been explained.
On the other hand, in the second embodiment, the semiconductor device 80 to be inspected has an outer frame 201 (same as the outer frame 201 of the cleaning jig 200 shown in FIG. 8) around the lead 82, and the cleaning jig 200 also has an outer frame 201 around the cleaning unit 14. The semiconductor device 80 in this embodiment is in a state before the semiconductor device 80 of the first embodiment is cut and separated from the outer frame 201 of the lead frame. Similarly, the cleaning jig 200 in this embodiment is in a state before the cleaning jig 100 of the first embodiment is cut and separated from the outer frame 201 of the lead frame.

  In the manufacturing process of the semiconductor device, the electronic component inspection device 60 is in a state before the semiconductor device 80 is cut and separated from the outer frame 201 of the lead frame (that is, in the same shape as the cleaning jig 200 in FIG. 8). The semiconductor device 80 may be cut and separated from the outer frame 201 after the non-defective product and the defective product are selected based on the inspection result. The cleaning jig 200 according to the second embodiment can be applied for cleaning the electronic component inspection apparatus 60 used in such a manufacturing process. In the case of this embodiment, the shape of the socket 150 is also a shape that can accommodate the semiconductor device 80 including the outer frame 201 and the cleaning jig 200.

[Third Embodiment]
FIG. 9 is a cross-sectional view showing cleaning jigs 300A and 300B according to the third embodiment.

  In the first and second embodiments, the example in which the adhesive 21 is coated over the entire circumference of the cleaning unit 14 has been described. However, in the case of the third embodiment, the adhesive 21 is the cleaning unit. 14 is coated only on the portion that contacts the contact pin 8, that is, on the lower surface of the cleaning portion 14.

  The cleaning jig 300A shown in FIG. 9A is different from the cleaning jig 100 according to the first embodiment only in the area coated with the adhesive 21, and the other points are the cleaning jig 100. It is the same. On the other hand, the cleaning jig 300B shown in FIG. 9B is different from the cleaning jig 200 according to the second embodiment only in the area coated with the adhesive 21, and the other points are the cleaning jig. Similar to the tool 200.

  Thus, in order to coat the adhesive 21 only on the lower surface of the cleaning unit 14, for example, a liquid adhesive is put in a container, and the lower surface of the cleaning unit 14 is in close contact with the adhesive and dried at high temperature. To do. Or you may dry after apply | coating the adhesive 21 with a brush.

3 Base 4 Cover 5 Locking Claw 6 Protrusion 7 Post 8 Contact Pin 8a Contact Pin 8b Contact Pin 13 Main Body 14 Cleaning Unit 21 Adhesive 30 Foreign Material 31 Guide 41 Die Pad 42 Semiconductor Chip 43 Sealing Resin 60 Electronic Component Inspection Device 70 Control unit 71 Drive control unit 72 Inspection unit 73 Inspection signal output unit 74 Determination unit 75 Moving mechanism 80 Semiconductor device 81 Main body unit 82 Lead 100 Cleaning jig 150 Socket 200 Cleaning jig 201 Outer frame 300A Cleaning jig 300B Cleaning jig 1000 Cleaning jig 1001 Main body 1002 Adhesive layer

Claims (9)

Provided in an arrangement corresponding to each of the plurality of measurement terminals of an electronic component inspection apparatus having a plurality of measurement terminals, and having a plurality of cleaning portions that are in contact with the plurality of measurement terminals and clean the measurement terminals,
The cleaning jig is formed in the same shape as an external terminal of an electronic component to be inspected by the electronic component inspection apparatus, and is coated with an adhesive.   The cleaning jig according to claim 1, wherein the adhesive is adhesive urethane rubber.   The cleaning adhesive according to claim 1, wherein the pressure-sensitive adhesive is conductive.   The said cleaning jig further has a main-body part holding these cleaning parts, and the said several cleaning part protrudes from the said main-body part, The any one of Claim 1 thru | or 3 characterized by the above-mentioned. The cleaning jig described.   The cleaning jig according to claim 4, wherein the cleaning jig is formed in the same shape as the electronic component.   The said cleaning jig is comprised by coating the said adhesive to the said external terminal of the said electronic component, The cleaning jig of Claim 5 characterized by the above-mentioned.   The cleaning jig according to claim 1, wherein the electronic component is a semiconductor device, and the external terminal is a lead. Provided in an arrangement corresponding to each of the plurality of measurement terminals of the electronic component inspection apparatus having a plurality of measurement terminals, and having a plurality of cleaning portions that are in contact with the plurality of measurement terminals and clean the measurement terminals, The cleaning unit is formed in the same shape as an external terminal of an electronic component to be inspected by the electronic component inspection apparatus, and the plurality of cleaning units of the cleaning jig coated with an adhesive is measured with the plurality of Contacting each of the terminals;
Separating the plurality of cleaning portions from the plurality of measurement terminals, respectively.
The cleaning method characterized by having. A step of inspecting a semiconductor device using an electronic component inspection apparatus having a plurality of measurement terminals;
Cleaning the plurality of measurement terminals of the electronic component inspection device;
Have
In the step of cleaning the plurality of measurement terminals, each of the plurality of measurement terminals is provided in an arrangement corresponding to each of the plurality of measurement terminals, and has a plurality of cleaning portions that are in contact with the plurality of measurement terminals and clean the measurement terminals, The cleaning unit is formed in the same shape as an external terminal of an electronic component to be inspected by the electronic component inspection apparatus, and the plurality of cleaning units of the cleaning jig coated with an adhesive is measured with the plurality of Contacting each of the terminals;
Separating the plurality of cleaning portions from the plurality of measurement terminals, respectively.
Inspection method characterized by performing.

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