JPH0940068A - Test carrying tray for electronic parts and its testing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve semiconductor-device production efficiency by carrying, in a stored state, semiconductor packages and by enabling a test of the stored semiconductor devices to be carried out as they are. SOLUTION: A semiconductor package P into which a semiconductor device is integrated is placed on a storage recess formed in a tray main body 1, the lead of the semiconductor package P is brought into contact with the electrical connection terminal of the tray main body 1, and the tray main body 1 is carried to a burn-in testing machine 21. Then, the testing electrode part of the electrical connection terminal is connected to the connection part of the test board 22 provided in the burn-in testing machine 21. And a test is conducted by transmitting a test signal to the semiconductor device from the test board 22. Thus, the semiconductor device is tested while kept placed on the tray storing and carrying the semiconductor package P.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a test transfer technique for electronic parts used for transferring a semiconductor device enclosed in a package and for conducting a test such as an environmental test.

[0002]

2. Description of the Related Art A semiconductor device such as an LSI, that is, a semiconductor device, includes a dicing process for cutting a chip from a semiconductor wafer, a die bonding process for mounting the chip on a lead frame or a package, a connection electrode on a chip and a terminal for externally drawing out the package. It is manufactured through a wire bonding step of connecting with a bonding wire, a sealing step of sealing the chip to protect it from the outside, and the like.

After the semiconductor device is manufactured, various environmental stresses that occur during transportation, storage, and disposal are predicted, the effects thereof are investigated, and countermeasures for the cause thereof are taken. Has been done. This environmental test also has the purpose of selecting only non-defective products by non-destructive inspection testing, in order to remove potential defects of products in the manufacturing process of semiconductor devices.

The environmental test includes a burn-in test in which all of them are operated for a certain period of time while applying a stress higher than the rated value for the purpose of removing an initial failure, and a moisture resistance test exposed to a high humidity condition. For such an environmental test device, see, for example, Industrial Research Institute Co., Ltd.
Issued January 20, 1995 "VLSI manufacturing and testing equipment"
It is described in P193 to P197.

After such an environmental test is performed, the semiconductor device is transported to a function testing device to test whether or not the semiconductor device has a desired function, and only good products are selected. Become.

By the way, the inventor of the present invention has studied a technique for carrying out an environmental test and a functional test on a semiconductor device enclosed in a package. The following is the technique examined by the present inventor, and the outline thereof is as follows.

That is, the package in which the semiconductor device is enclosed is accommodated in a predetermined number in a transfer tray and is transferred to a burn-in tester, and is carried out one by one from the transfer tray to a test board of this tester. Is installed. After this test was completed, it was placed on the transport tray again and transported to the next functional tester, where it was assembled from the transport tray to the test board of the functional tester directly or via a socket. The test is conducted in the state.

[0008]

However, the package in which the semiconductor device is sealed after the sealing process is completed is transported to the tester by using the transport tray, and the semiconductor package is transferred between the transport tray and the tester. To change the
This takes a long time, which is a bottleneck in improving the final semiconductor device manufacturing efficiency.

An object of the present invention is to improve the manufacturing efficiency of a semiconductor device by transporting a plurality of semiconductor packages in a housed state and performing a test as they are in a housed state.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0011]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, the test transfer tray for electronic parts according to the present invention is a transferable tray main body having a plurality of accommodating recesses for accommodating semiconductor packages each incorporating a semiconductor device, and a semiconductor package provided in the tray main body. A plurality of electrical connection terminals that come into contact with the leads provided on the electrical connection terminals, the electrical connection terminals being exposed to the outside of the tray body, and not contacting when the semiconductor package is conveyed in the tray body. When the semiconductor device in the semiconductor package is tested, the connection portion of the test board has a test electrode portion to be electrically connected. The electronic component test transport tray of the present invention, in the state where the semiconductor package is accommodated in the tray body,
The semiconductor package includes a lid member that applies a pressing force to the semiconductor package. Further, the electrical connection terminal may be detachably attached to the tray body.

According to the method of testing an electronic component of the present invention, a semiconductor package in which a semiconductor device is incorporated is placed in a housing recess formed in a tray body, and the semiconductor is connected to an electrical connection terminal provided in the tray body. The step of contacting the package leads, the step of transporting the tray body to the tester, the step of connecting the test electrode part of the electrical connection terminal to the connection part of the test board provided in the tester, the test board And a step of sending a test signal to each of the semiconductor devices to test each of the semiconductor devices, and the semiconductor device is tested in a state of being mounted on a tray.

[0014]

In the test transfer tray for electronic parts of the present invention, the tray main body is provided with the accommodating recesses for accommodating the plurality of semiconductor packages, and each accommodating recess is electrically connected to the leads of the semiconductor package. The connection terminals are provided corresponding to the number of leads. Therefore, it is possible to store a predetermined number of semiconductor packages in a tray and to carry the semiconductor packages by using the tray, and to carry out a test such as a burn-in test with the semiconductor packages kept in the tray. It can be performed.

In the electronic component testing method of the present invention,
By connecting the connection part of the test board to the test electrode part that is exposed to the outside using the tray, the multiple semiconductor devices housed in the tray are electrically connected to the tester. Will be done. This allows
A semiconductor package whose manufacturing process has been completed can be stored in a tray, and the semiconductor package can be transported using the tray, and the semiconductor device can be installed in a test machine such as a burn-in test machine while being stored in the tray. Can be assembled.

In this way, the transfer tray, that is, the jig is also used as the test jig, so that the work of transferring the semiconductor device and transferring it to the testing machine is unnecessary,
The test work efficiency is greatly improved.

[0017]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a plan view showing a test carrying tray for electronic parts according to an embodiment of the present invention, and FIG. 2 is a front view with a part of FIG. 1 omitted.

As shown in FIG. 1, the tray main body 1 has a quadrilateral frame body 2 and partition sections 3 provided in a grid pattern inside the frame body, and a plurality of accommodation recesses 4 surrounded by the partition sections 3. As shown in FIG. 3, a semiconductor package P in which a semiconductor device, that is, an LSI is incorporated is housed in each housing recess 4.

This semiconductor package P is a surface mount type QF.
J (Quad Flat J-leaded Package) is shown, and leads L bent into a J shape are provided on four sides of the resin package body B, respectively. Semiconductor package P
The tray main body 1 is provided with an electrical connection terminal 5 that comes into contact with the lead L provided on the tray main body 1. The tray main body 1 shown in the drawing has a total of 24 accommodating recesses 4,
The number of housing recesses 4 can be set to any number.

FIG. 4 is an enlarged plan view showing the surface side of any one of the plurality of accommodation recesses 4 shown in FIG.
6 is a bottom view showing the back side of FIG. 4, and FIG.
FIG. 4 is a cross-sectional view of the tray body 1 with the semiconductor package P housed inside.

Each electrical connection terminal 5 is accommodated in the accommodation recess 4
A lead connecting portion 5a exposed inside and in contact with the lead L;
The tray main body 1 has a test electrode portion 5b which is exposed to the outside of the tray main body 1 so as to project to the back surface side. The test electrode portion 5b is electrically connected to the connecting portion of the stet board when the semiconductor device in the semiconductor package P is tested with the semiconductor package P housed in the tray body 1.
When the semiconductor package P is transferred in the tray body 1 in a housed state, the test electrode portion 5b is exposed to the outside and is in a non-contact state.

As shown in FIG. 6, the partition wall 6 provided for partitioning the front side and the back side in the central portion of the tray body 1 in the thickness direction is made to correspond to the central portions of the respective accommodation recesses 4. A through hole 7 is formed, the front side of the partition wall 6 serves as the accommodation recess 4, and the back side serves as the test board connecting portion 8. The tip of the test electrode portion 5b of the electrical connection terminal 5 is recessed from the lower surface of the tray body 1,
It is possible to prevent the test electrode portion 5b from coming into contact with the base even if it is placed on the base.

A lid member 10 is detachably attached to the tray body 1. With the semiconductor package P housed in the housing recess 4, the lid member 10 is attached to the tray body 1.
It can be attached to. In order to fasten the lid member 10 to the tray body 1, the tray body 1 is provided with a clamp member 11 as shown in FIGS. 1 and 2. The clamp member 11 is swingable around a pin 12, and a claw portion 14 that engages with a notch portion 13 formed in the lid member 10 is provided in the clamp member 11.

The clamp member 11 is a quadrilateral tray body 1.
Of the four sides, only two sides parallel to each other may be provided, or all the sides may be provided. Alternatively, the clamp member 11 may be provided on the lid member 10, and the notch portion 13 with which the claw portion 14 engages may be formed on the tray body 1.

When the lid member 10 is fastened to the tray body 1,
The semiconductor package P is pressed by the lid member 10,
Since the lead L is pressed against the lead connecting portion 5a, the lead L and the lead connecting portion 5a are surely brought into contact with each other. The contact force at this time is increased by forming the lead connecting portion 5a by bending the lead connecting portion 5a as shown in FIG. 6 so that the portion functions as a spring member.

As shown in FIG. 6, a large number of through holes 15 are formed in the lid member 10 so as to correspond to the through holes 7 formed in the tray body 1.

A step portion 16 is formed on the outer side of the bottom of the frame body 2 of the tray body 1 as shown in FIGS. 2 and 6, and the lid member 10 has a projection portion 17 which is fitted with the step portion 16. Is formed on the outer peripheral portion. Therefore, each of the lid members 1
Even when stacking a plurality of trays in a state where 0 is attached, the step portion 1 of the upper tray is attached to the protrusion portion 17 of the lower tray.
The fitting of 6 prevents the trays from being displaced from each other.

After the semiconductor device is sealed with resin, the lead L
The semiconductor package P which has been subjected to the bending process is stored in the above-described electronic component test transport tray. And
The tray is used to convey the semiconductor device to the next tester, and the semiconductor device is tested as it is.

In the illustrated embodiment, the electrical connection terminal 5 having the test electrode portion 5b is fixed to the tray body 1, but the electrical connection terminal 5 is attached to and detached from the tray body 1. By freely mounting, the type of the semiconductor package P to be accommodated is changed, and when the number or position of the leads is changed, the position of the electrical connection terminal 5 may be changed correspondingly. . At that time, a large number of holes or grooves to which the electrical connection terminals 5 are attached are provided in advance so as to correspond to the positions and the numbers of the leads of the semiconductor package to be accommodated, and the electrical connection terminals 5 are provided depending on the type of package. Change the position and number of.

FIG. 7 is a diagram showing a procedure for accommodating and testing the semiconductor package P using the tray. The completed semiconductor package P is a vacuum suction type suction head 20.
And is placed in the accommodating recess 4 of the tray body 1. Then, the lid member 10 is fastened to the tray body 1 in which a predetermined number of semiconductor packages P are accommodated. As a result, the lead L of the semiconductor package P is brought into contact with the lead connecting portion 5a of the electrical connecting terminal 5 provided on the tray body 1.

To carry out a burn-in test of the semiconductor device, the semiconductor device is transported to the burn-in tester 21 in the state of being accommodated in the tray. After loading the tray into the burn-in tester 21, the burn-in tester 2
The test electrode portion 5b is electrically connected to the connection portion of the test board 22 provided in the inside 1. This burn-in tester 2
1 has a heating chamber of an atmosphere for heating the semiconductor package P to a predetermined temperature.
Through the through hole 7 and the through hole 15 of the lid member 10 to contact the semiconductor package P. At the same time, a test pulse signal is supplied from the test board 22 through the electrical connection terminal 5. If a defective semiconductor device is found by this burn-in test, the position of the package P incorporating the semiconductor device is stored in the memory.

When the burn-in test is completed in this way, the semiconductor package P is taken out from the burn-in tester 21 together with the tray, and a functional test for testing whether each semiconductor device has a predetermined function or not. It is transported to the machine 23. After being transported, the tray is connected to the stethoboard 24 of the functional tester 23 at the test electrode portion 5b of the electrical connection terminal 5 provided in the tray body 1. After connection, a test pulse is supplied to each semiconductor device via the test board 24 to perform a functional test.

When the functional test is completed, the tray is transported to the next step while containing the respective semiconductor packages P. Thus, the tray is a semiconductor package P
Is used for accommodating and storing or transporting the same, and when performing various tests such as a burn-in test, the semiconductor device in the semiconductor package P is mounted on a test board incorporated in each tester. Functions as a connector for electrically connecting the.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, the illustrated lid member 10 is separate from the tray body 1 and is fastened by the clamp member 11. The lid member 10 is attached to the tray body 1 via the hinge portion so as to be openable and closable. The semiconductor package P may be fixed by opening and closing. Further, the illustrated semiconductor package P is a surface-mount type QFJ type, but the semiconductor package housed in the tray is not limited to this, and other surface-mount type IC packages can also be inserted such as DIP. Shaped IC package is also acceptable. However, the shape and the like of the electrical connection terminal are different according to each type.

[0037]

Advantageous effects obtained by typical ones of the inventions disclosed in the present application will be briefly described.
It is as follows.

(1) By providing electrodes on the tray for accommodating and carrying the semiconductor package, the tray can also be used as a jig for testing, and the semiconductor package can be held or the test can be quickly performed. .

(2) Since the transfer is eliminated, it is possible to prevent the quality deterioration of the semiconductor package due to the transfer.

(3) As a result, the working time can be shortened and the manufacturing efficiency of the semiconductor device is significantly improved.

(4). The number of jigs used for carrying and testing the semiconductor package can be reduced, and the cost can be reduced.

(5). By rearranging the positions of the electrical connection terminals according to the type of semiconductor package, various semiconductor packages can be transported and tested.

[Brief description of drawings]

FIG. 1 is a plan view showing a tray body of a test transport tray of an electronic component according to an embodiment of the present invention.

FIG. 2 is a partially omitted front view showing a state where a lid member is fastened to the tray body.

FIG. 3 is a perspective view showing an example of a semiconductor package.

FIG. 4 is an enlarged plan view showing one front side of a plurality of accommodation recesses provided in the tray body.

5 is a bottom view showing the back side of FIG. 4. FIG.

FIG. 6 is a cross-sectional view showing a part of the tray body.

7A to 7D are schematic diagrams showing a procedure of testing a semiconductor device using a tray.

[Explanation of reference symbols] 1 tray main body 2 frame 3 partition 4 accommodating recess 5 electric connection terminal 5a lead connection 5b test electrode 6 drawing wall 7 through hole 8 test board connection 10 lid member 11 clamp member 12 Pin 13 Notch part 14 Claw part 15 Through hole 16 Step part 17 Protrusion part 20 Suction head 21 Burn-in tester 22 Test board 23 Functional tester 24 Test board B Package body L Lead P Semiconductor package

Claims (4)

[Claims] 1. A transportable tray main body having a plurality of accommodating recesses for accommodating semiconductor packages each having a semiconductor device incorporated therein, and a lead provided on the tray main body and in contact with a lead provided on the semiconductor package. A plurality of electrical connection terminals, the electrical connection terminals are provided to be exposed to the outside of the tray main body, and when the semiconductor package is conveyed while being accommodated in the tray main body, it becomes non-contact, A test transport tray for electronic parts, which has a test electrode section to which a connecting section of a test board is electrically connected when a semiconductor device is tested. 2. The test transfer tray for electronic parts according to claim 1, further comprising a lid member for urging a pressing force on the semiconductor package under a state where the semiconductor package is accommodated in the tray body. A test transport tray for electronic parts, which has. 3. The electronic component test transport tray according to claim 1, wherein the electrical connection terminal is detachably attached to the tray body. . 4. A step of placing a semiconductor package, in which each semiconductor device is incorporated, in an accommodating recess formed in a tray body, and bringing a lead of the semiconductor package into contact with an electrical connection terminal provided in the tray body. A step of transporting the tray body to a testing machine, a step of connecting the test electrode portion of the electrical connection terminal to a connection portion of a test board provided in the testing machine, A test signal is sent to each of the semiconductor devices to test each of the semiconductor devices, and the semiconductor device is tested while being mounted on the tray body. Method.