JP2009058565A - Device and method for manufacturing electrooptical device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To press-bond a dust-proof glass substrate with respect to counter substrates adhered to a large board, without the occurrence of poor adhesion or unevenness in alignment, even if the large board is warped. <P>SOLUTION: The plurality of counter substrates 20 are adhered against the large substrate 110 which is formed so that a large number of TFT substrates 10 can be placed thereon. When press-bonding the dust-proof glass substrate 31 against the outer side of each counter substrate 20, the spacing distance hm from each counter substrate 20 to the reference position Lh is read (S11); and based on the spacing distance hm, the descent distance he from the reference position Lh to the proximate distance ho on the counter substrate 20 is determined (S12). A press-bonding head 47 is dropped at a quickly moving speed, until reaching this descent distance he (S13-S15). After reaching the proximate distance ho, the press-bonding head 47 is dropped by a very low speed (S17); and when the pressing force P to the counter board 20 of the dust-proof glass substrate 31 by the press-bonding head 47 reaches a set pressure Po, very low speed moving of the press-bonding head is stopped (S20). <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

The present invention relates to a manufacturing apparatus and a manufacturing method of an electro-optical device that can always make a glass substrate move at a low speed from a predetermined proximity distance to be bonded to a second substrate bonded to a large substrate.

Conventionally, among various electro-optical devices, display panels using an electro-optical material such as liquid crystal are used in a wide range of fields as light valves for projection display devices, display devices for various electronic devices, and the like. Here, the display panel is configured by sandwiching an electro-optical material such as liquid crystal between a counter substrate and an element substrate as an electrode substrate. The counter substrate is configured by disposing a counter electrode on the substrate, while the element substrate is provided with a plurality of scanning lines and a plurality of data lines intersecting with each other on the substrate. A switching element and a pixel electrode are arranged at each intersection of the data line and the data line.

Further, in the projection type display device, when dust or the like adheres to the vicinity of the surface of the display panel, it is enlarged by a projection lens or the like and projected onto the screen, and the display quality is significantly lowered. As a countermeasure, for example, as disclosed in Patent Document 1 (Japanese Patent Laid-Open No. 2003-140125), a transparent glass substrate having a dustproof function is bonded to the outer surface of the display panel.

By protecting the outer surface of the display panel with a glass substrate, dust and the like can be prevented from adhering to the display panel surface. Furthermore, even if dust or the like adheres to the outer surface of the glass substrate, the distance between the dust and the electro-optical material such as liquid crystal is increased by the thickness of the glass substrate, and the image of dust and the like is defocused, and the screen Since it is displayed with a large blur on the top, it becomes inconspicuous.

When the glass substrate is bonded to the surface of the display panel, as disclosed in, for example, Patent Document 2 (Japanese Patent Laid-Open No. 2006-11353), a large-sized substrate formed so that a large number of element substrates can be taken. In the so-called pre-process, a technology is known in which a counter substrate cut out in a chip shape is bonded to a region where an element substrate of this large substrate is formed, and a glass substrate is pressure-bonded to the outer surface of the counter substrate. It has been.
JP 2003-140125 A JP 2006-11353 A

By the way, the element substrates are manufactured in a lump on a large substrate that can be obtained in large numbers. The element substrate is formed by alternately laminating insulating films and metal films only on one side. The insulating film is annealed at a temperature of about 900 ° C. for planarization. Since the large substrate, the insulating film, and the metal film have different expansion coefficients, the stress balance is lost by the annealing process, and the large substrate is warped.

When liquid crystal is used as the electro-optic material, this liquid crystal is added by a drop injection method (ODF: O
In the case of injection by ne drop filling), before the large substrate is cut into a plurality of element substrates, liquid crystal is injected between the large substrate and the counter substrate bonded to the large substrate. Therefore, an isotropic process for eliminating variations in liquid crystal alignment is also performed in the state of a large substrate. In the isotropic treatment, the liquid crystal is once heated to the isotropic phase and then rapidly cooled to the nematic phase to rearrange the liquid crystal. This isotropic treatment also causes warping of the large substrate. The amount of warpage of the large substrate varies between several μm to several hundred μm, and the direction of warpage is not constant.

In the step of mounting the dust-proof glass substrate on the outer surface of the counter substrate bonded to the large substrate, first, a transparent adhesive is spotted on the center of the outer surface of the counter substrate, and then the dust-proof glass substrate is attached to the outer surface of the counter substrate. The transparent adhesive is spread and crimped without mixing bubbles.

In order to spread the transparent adhesive, it is necessary to apply a sufficient load to the dust-proof glass substrate, but if a load larger than necessary is applied, the counter substrate deforms, and the counter substrate and the large substrate The electro-optical material filled in between is pressed and uneven alignment occurs.

However, as described above, when warping occurs on a large substrate, the load applied to the dust-proof glass substrate is not constant, and in the case of insufficient load, adhesion failure occurs due to mixing of bubbles, etc. Causes orientation unevenness.

As a countermeasure, it is conceivable to gradually increase the pressure of the dust-proof glass substrate against the counter substrate and perform pressure bonding over a relatively long time, but there is a problem that the cycle time becomes long and the productivity is lowered.

In view of the above circumstances, the present invention allows a glass substrate to be bonded to a substrate bonded to the large substrate without causing poor adhesion or uneven alignment even when the large substrate is warped. An object of the present invention is to provide an electro-optical device manufacturing apparatus and a manufacturing method capable of improving productivity by reducing the cycle time required for pressure bonding of a glass substrate.

In order to achieve the above object, according to a first aspect of the present invention, a second substrate is bonded to a region where each first substrate is formed in a large substrate on which a large number of first substrates are formed. In the electro-optical device manufacturing apparatus in which the glass substrate supported by the pressure-bonding head is pressed against the outer surface of the second substrate, and the second substrate is bonded to the large-sized substrate. A distance measuring unit that measures a separation distance to a reference position, and the glass substrate supported by the pressure-bonding head is preset with respect to the second substrate based on the separation distance measured by the distance measuring unit. A movement control means for moving the object at a short speed after moving it to a close distance at a high speed,
Pressure detecting means for measuring the pressing force of the glass substrate against the second substrate by the pressure bonding head, and movement for stopping the slow movement of the pressure bonding head when the pressure detected by the pressure detection means reaches a set pressure. And a stop control means.

In such a configuration, the distance from the second substrate bonded to the large substrate to the reference position is measured by the distance measuring means, and the glass substrate supported by the pressure-bonding head and the second distance are measured based on the distance. The proximity distance to the substrate is calculated, the crimping head is moved at a high moving speed until the proximity distance is reached, and after reaching this proximity distance, it is moved at a slow speed, so the large substrate is warped. However, the glass substrate can be pressure-bonded to the second substrate bonded to the large substrate without causing adhesion failure or alignment unevenness. Further, since the pressure-bonding head can be moved at high speed until the proximity distance is reached, the cycle time required for pressure-bonding the glass substrate can be shortened, and productivity can be improved.

According to a second invention, in the first invention, the distance measuring means is a non-contact sensor.

In such a configuration, since the distance measuring means is a non-contact sensor, the surface of the second substrate is not damaged or soiled, and the occurrence of product defects can be reduced.

A third invention is characterized in that, in the first or second invention, the movement control means decelerates the moving speed during a set moving distance before reaching the proximity distance.

In such a configuration, the moving speed of the crimping head is decelerated between the set moving distances before reaching the proximity distance, so the moving speed before reaching the set moving distance can be set faster, and the glass The cycle time required for pressure bonding of the substrate can be further shortened.

According to a fourth aspect of the present invention, a second substrate is bonded to a region where each first substrate is formed on a large substrate on which a large number of first substrates can be taken. On the outer surface of the board,
In a method of manufacturing an electro-optical device that presses and presses a glass substrate supported by a pressure-bonding head, a first distance is measured from each second substrate bonded to the large-sized substrate to a reference position. A second step of moving the glass substrate supported by the pressure-bonding head to a proximity distance set in advance with respect to the second substrate at a high moving speed based on the separation distance; and the proximity distance A third step of moving the crimping head at a slow speed, a fourth step of measuring the pressing force of the glass substrate against the second substrate by the crimping head, and when the pressing force reaches a set pressure, And a fifth step of stopping the slow movement of the pressure-bonding head.

In such a configuration, the distance from each second substrate bonded to the large substrate to the reference position is measured, and the glass substrate supported by the pressure-bonding head and the second distance are measured based on the distance.
The proximity distance to the substrate is determined, the crimping head is moved at a high moving speed until this proximity distance is reached, and after reaching this proximity distance, it is moved at a slow speed, so the large substrate is warped. However, the glass substrate can be pressure-bonded to the second substrate bonded to the large substrate without causing adhesion failure or alignment unevenness. Further, since the pressure-bonding head can be moved at high speed until the proximity distance is reached, the cycle time required for pressure-bonding the glass substrate can be shortened, and productivity can be improved.

A fifth invention is characterized in that, in the fourth invention, the second step decelerates the moving speed during a set moving distance before reaching the proximity distance.

In such a configuration, the moving speed of the crimping head is decelerated between the set moving distances before reaching the proximity distance, so the moving speed before reaching the set moving distance can be set faster, and the glass The cycle time required for pressure bonding of the substrate can be further shortened.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a schematic sectional view of a liquid crystal display device, and FIG. 2 is a process diagram showing a process of mounting a dust-proof glass substrate on the outer surface of the liquid crystal panel.

First, the overall configuration of the liquid crystal display device will be briefly described with reference to FIG. FIG. 1 shows a TFT active matrix drive type liquid crystal display device with a built-in drive circuit.

Reference numeral 1 in FIG. 1 denotes a liquid crystal display device, which is a representative electro-optical device, and includes a liquid crystal panel 120 as a display panel and a transparent glass having a dustproof function that is bonded to both outer surfaces of the liquid crystal panel 120. Substrate (hereinafter referred to as “dust-proof glass substrate”) 30 and 31 are provided.

The liquid crystal panel 120 includes a thin film transistor (TFT) as a first substrate.
A liquid crystal panel 120 is formed by bonding a sistor) substrate 10 and a counter substrate 20 as a second substrate disposed opposite to each other via a sealing material 52, and both of the substrates formed by the sealing material 52 are formed. A liquid crystal 50 as an electro-optical material is placed in the gap between the opposing surfaces of the substrates 10 and 20.
Is enclosed.

Pixel electrodes (ITO) 9a constituting pixels are arranged in a matrix on the TFT substrate 10, and a counter electrode (ITO) 21 is provided on the entire surface of the counter substrate 20. Furthermore,
On the entire surface of the pixel electrode 9a of the TFT substrate 10 and the counter substrate 20, the alignment films 16 and 22 subjected to the rubbing process are formed. The alignment films 16 and 22 are made of a transparent organic film such as a polyimide film. A data line driving circuit 101 and an external connection terminal 102 are formed on one side outside the region where the sealing material 52 of the TFT substrate 10 is formed. Although not shown, a scanning line driving circuit is provided along two sides adjacent to the one side,
Further, a wiring pattern for connecting the scanning line driving circuits is formed on the remaining side.

Further, the dust-proof glass substrates 30 and 31 prevent dust and the like from adhering to the surface of the liquid crystal panel 120 and make the image such as dust inconspicuous by defocusing the dust and the like away from the liquid crystal display surface. It has a function to make it. In order to realize such a function, the dust-proof glass substrates 30 and 31 are formed to be relatively thick with a plate thickness of about 1 to 3 mm.
The same substrate 30 and counter substrate 20 are used. Also, dust-proof glass substrates 30, 31
Is a thermosetting type made of a silicon adhesive or an acrylic adhesive adjusted to the same refractive index as that of the TFT substrate 30 and the counter substrate 20 (and the dustproof glass substrates 30 and 31), or the surface of the liquid crystal panel 120. A transparent adhesive such as a photo-curing type is used to adhere the TFT substrate 30 and the outer surface of the counter substrate 20 with air bubbles removed.

The TFT substrate 10 and the counter substrate 20 are manufactured in a state of a large substrate in which a large number of each can be obtained in the previous process. First, only the counter substrate 20 is cut out in a chip shape from the large substrate. The counter substrate 20 cut out from the large substrate is bonded to each of the regions of the large substrate 110 on which the TFT substrate 10 can be obtained (FIG. 5).
reference). Note that liquid crystal is filled between the large substrate 110 and the counter substrate 20 by a drop injection method (ODF). In addition, chip-shaped TF that can be cut out from one large substrate 110
The number of T substrates 10 is determined by the size of the large substrate 110 and the size of the liquid crystal panel to be manufactured. Therefore, the number of cutouts (12) of the TFT substrate 10 illustrated in FIG. 5 is merely an example. Furthermore, although the large substrate 110 according to the present embodiment is formed in a disc shape, the shape is not limited to this and may be a rectangular shape.

Thereafter, the dust-proof glass substrates 31 and 300 are bonded to the outer surfaces of the counter substrate 20 and the large substrate 110. FIG. 2 shows a process of mounting the dust-proof glass substrates 31 and 300 on the outer surfaces of both the substrates 20 and 110, respectively. This work is performed in a clean room.

Step (a): First, the counter substrate 20 is positioned and bonded on the region of the large substrate 110 where the TFT substrate 10 is formed, and then the operation state and the like are inspected.

Step (b): Next, a dust-proof glass substrate 31 having substantially the same shape as the counter substrate 20 is bonded to the outer surface of each counter substrate 20. The dust-proof glass substrate 31 is adsorbed and supported on the lower end surface of the pressure-bonding head 47 (see FIG. 7).
(See FIG. 8). The lowering speed of the crimping head 47 is controlled by a servo mechanism (not shown).

Step (c): After cleaning the whole, a large-sized substrate 110 having a shape substantially the same as or slightly smaller than the large-sized substrate 110 is formed on the outer surface of the large-sized substrate 110 on the side opposite to the surface on which the counter substrate 20 is bonded. A dust-proof glass substrate 300 is attached.

Step (d): A scribe line is formed between the opposing substrates 20 on the surface of the large substrate 110 on which the counter substrate 20 is bonded, and the large substrate 110 is divided along the scribe lines to form a chip-like liquid crystal. The apparatus 100 is cut out. At this time, the large dustproof glass substrate 300 is also cut out into the chip-shaped dustproof glass substrate 30.

In the mounting process of the dustproof glass substrates 30 and 31, the process (b) and the process (c) are interchanged, and the large dustproof glass is applied to the large substrate 110 before the dustproof glass substrate 31 is attached to the counter substrate 20. The substrate 300 may be attached.

Next, a dust-proof glass substrate (hereinafter referred to as “small dust-proof glass substrate”) 3 shown in FIG.
The mounting process 1 will be described in more detail with reference to the flowcharts of FIGS. The small dustproof glass substrate 31 is bonded under normal pressure. Each control described below is performed by a control device (not shown).

First, a substrate distance measurement routine shown in FIG. 3 is executed. In this routine, step S
1, a large substrate 110 in which a counter substrate 20 is bonded to a predetermined region as shown in FIG. 5 in a region where the TFT substrate 10 is formed is mounted on the stage 200 shown in FIG. Then, in step S2, the distance measuring sensor 201 as the distance measuring means.
Scans the large substrate 110 in the XY direction (horizontal direction) (see FIG. 5).

As shown in FIG. 6, the distance measuring sensor 201 is a non-contact type using a measurement medium as light or ultrasonic waves, and measures a separation distance hm between the tip of the measurement head 201 a and the upper surface of the counter substrate 20. The tip height Lh of the measuring head 201 a of the distance measuring sensor 201 is set with reference to the mounting surface of the stage 200. In the following description, the tip height Lh is read as the reference position Lh.

Then, the distance measurement sensor 201 scans the large substrate 110 and all the counter substrates 20 are scanned.
The separation distance hm is measured. Incidentally, as described above, the large substrate 110 is warped due to the influence of heat treatment such as annealing or isotropic treatment, and the amount of warpage varies, and the warping direction is also constant. Not done. Accordingly, the separation distance hm measured by the distance measuring sensor 201 also shows a different value depending on the measurement position even in one counter substrate 20.

Then, when the measurement of all the counter substrates 20 is completed, the process proceeds to step S3 and the counter substrate 20 is reached.
The shortest value among the separation distances hm measured every time is stored as the separation distance hm of the counter substrate 20, and the routine is terminated.

Next, a transparent adhesive is spotted at the center of the outer surface of each counter substrate 20. When the transparent adhesive stippling is completed for all the counter substrates 20, a dust-proof glass bonding routine shown in FIG. 4 is executed.

In this routine, first, in step S11, the separation distance hm of the counter substrate 20 to be bonded is read, and then, in step S12, a preset pressure bonding head 47 is read.
On the basis of the proximity distance ho between the lower end surface of the small dust-proof glass substrate 31 adsorbed to the lower end surface and the upper end surface of the counter substrate 20 and the separation distance hm of the counter substrate 20, Of the lower end surface of the head, that is, a set movement distance from the reference position Lh to the proximity distance ho is calculated. The proximity distance ho is a distance (for example, about 10 [μm]) immediately before the small dust-proof glass substrate 31 adsorbed on the lower end surface of the pressure-bonding head 47 contacts the uppermost end of the counter substrate 20. The small dust-proof glass substrate 31 adsorbed on the lower end surface of the glass plate is lowered at a relatively high moving speed until the proximity distance ho is reached.

he ← hm-ho
As shown in FIG. 7, the descending distance he is the tip height (reference position) L of the measuring head 201a.
The distance is based on h, and is read when calculating backward until the lower end surface of the small dust-proof glass substrate 31 adsorbed by the pressure-bonding head 47 reaches the proximity distance ho.

Next, the process proceeds to step S13, where a drive signal is output to a servo mechanism (not shown) to start the lowering of the crimping head 47. The descent speed at this time is a relatively fast moving speed (for example, 100 to 1
50 [mm / sec]), and by increasing the descending speed, cycle time can be shortened and productivity can be improved.

Then, it progresses to step S14, it is investigated whether the lower end of the small dustproof glass substrate 31 adsorbed by the lower end of the crimping head 47 has reached the reference position Lh, and the crimping head 47 is compared until it reaches the reference position Lh. Descent at high speed. Whether or not the reference position Lh has been reached is determined from the amount of movement of the crimping head 47.

Then, when the lower end of the small dust-proof glass substrate 31 adsorbed to the lower end of the pressure bonding head 47 reaches the reference position Lh, the process proceeds to step S15 and the descending speed is reduced (for example, 50 to 70 [m
m / sec]). Next, the process proceeds to step S16, and the crimping head 47 is lowered from the reference position Lh to the lowering distance he at the reduced lowering speed.

When the pressure-bonding head 47 reaches the lowering distance he (state of FIG. 7), step S17.
Then, the lowering speed is set to a very small speed (for example, 1 to 5 [mm / sec]), and the pressure-bonding head 47 is lowered slightly. As shown in FIG. 7, when the pressure bonding head 47 is moved from the reference position Lh to the lowering distance he, the distance between the small dust-proof glass substrate 31 adsorbed on the lower end surface of the pressure bonding head 47 and the uppermost surface of the counter substrate 20. Becomes a proximity distance ho (for example, 10 [μm]), and the pressure-bonding head 47 is slowly lowered from here, whereby the small dust-proof glass substrate 31 can be brought into contact with the counter substrate 20 without giving an impact. Note that the processing in steps S13 to S17 corresponds to the movement control means of the present invention.

Next, the process proceeds to step S18, and the pressing force P applied to the counter substrate 20 from the pressure bonding head 47 is read. This pressing force P is detected based on a signal from a piezoelectric sensor (not shown) as pressure detecting means provided on the lower end surface of the crimping head 47, for example. In step S19, it is checked whether or not the pressing force P has reached a preset pressure (set pressure) Po (for example, 4 [Kgf]). This set pressure Po is such that when a load is gently applied to the small dustproof glass substrate 31 from above, the transparent adhesive drawn between the small dustproof glass substrate 31 and the counter substrate 20 creates bubbles. The pressure can be expanded without mixing, and is set in advance according to the area of the bonding surface between the small dust-proof glass substrate 31 and the counter substrate 20 to be bonded. As shown in FIG. 8, when the small dust-proof glass substrate 31 adsorbed by the pressure-bonding head 47 is pressed against the counter substrate 20, if the large-sized substrate 110 is warped in the direction away from the stage 200, the pressure-bonding head 47. The warping is restored by the pressing force P from the surface, and the joint surface between the small dust-proof glass substrate 31 adsorbed to the pressure-bonding head 47 and the counter substrate 20 becomes parallel to each other, and an equally distributed load is applied to the entire joint surface. Applied.

When the pressing force P reaches the set pressure Po, the process proceeds to step S20, and a signal for stopping the lowering of the pressure-bonding head 47 is output to the servo mechanism, and this stopped state is held for a certain time. This holding time is the time required for the transparent adhesive to spread over the entire joining surface,
It is set in advance by experiments.

After that, when the holding time has elapsed, a drive signal for raising the pressure bonding head 47 is output to the servo mechanism, and the pressure bonding head 47 is raised to complete the bonding of the small dustproof glass substrate 31 to one counter substrate 20. And exit the routine. Steps S18 to S20
The processing in the above corresponds to the movement stop control means of the present invention.

When the bonding of the small dustproof glass substrate 31 to one counter substrate 20 is completed, the dustproof glass bonding routine shown in FIG. 4 described above is executed on the adjacent small substrate 20 as shown in FIG. Then, the small dustproof glass substrate 31 is bonded. This is repeatedly performed on all the counter substrates 20, and the small dust-proof glass substrates 31 are bonded to all the counter substrates 20.

Thus, in this embodiment, when the small dust-proof glass substrate 31 is bonded to the chip-shaped counter substrate 20 bonded to the large substrate 110, the distance between each counter substrate 20 and the reference position Lh is individually set. Since the measurement is performed, even if the large substrate 110 is warped, the pressure-bonding head 47 that adsorbs the small dust-proof glass substrate 31 is lowered at a relatively high speed until it always reaches a certain proximity distance ho to each counter substrate 20. Can be made. As a result, the cycle time required for attaching the small dustproof glass substrate 31 is shortened, and the productivity can be improved.

Also, after reaching the proximity distance ho with respect to the counter substrate 20, the descent speed is set to a very small speed,
Since the small dust-proof glass substrate 31 is bonded to the counter substrate 20, the pressing force from the pressure-bonding head 47 does not cause insufficient load or overload, and it is possible to effectively avoid the occurrence of poor adhesion and uneven orientation. it can.

The distance measuring sensor 201 may be a contact type, but by adopting a non-contact type, the surface of the counter substrate 20 is not damaged or soiled, and the occurrence of product defects is reduced. Can do.

The electro-optical device in the present invention may be a liquid crystal device including a passive matrix type liquid crystal device or a TFD (thin diode) as a switching element in addition to a TFT active matrix driving type liquid crystal device. Not limited to, an electroluminescence device, an organic electroluminescence device, a plasma display device, an electrophoretic display device, a device using an electron-emitting device (Field Emission Display, and Surface-Co
nductin Electron-Emitter Display (DLP), DLP (Digital Light Processing) and DMD (Digital Micromirror Device), LCOS (Liquid
The present invention can be applied to various electro-optical devices in which a glass substrate having a dustproof function or the like is attached to a display surface.

Schematic sectional view of a liquid crystal display device Process diagram showing the process of mounting a dust-proof glass substrate on the outer surface of the liquid crystal panel Flow chart showing substrate distance measurement routine Flow chart showing dust-proof glass laminating routine A perspective view showing a state where a distance measuring sensor scans a large substrate on which a chip-like counter substrate is bonded. Side view showing a state where a distance measuring sensor scans a large substrate on which a chip-like counter substrate is bonded. Side view showing a state in which a dust-proof glass substrate is bonded to a counter substrate bonded to a large substrate Side view of another state of FIG. FIG. 7 is a side view of still another state.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... TFT substrate, 20 ... Counter substrate, 30, 31 ... Dust-proof glass substrate, 47 ... Crimp head,
110 ... large substrate, 200 ... stage, 201 ... ranging sensor, 201a ... measuring head, L
h: Reference position, P: Pressing force, Po: Set pressure, he ... Descent distance, hm ... Separation distance, ho ... Proximity distance

Claims (5)

A second substrate is bonded to a region where each first substrate is formed on a large substrate on which a large number of first substrates can be taken, and the outer surface of the second substrate is attached to the second substrate. In the manufacturing apparatus of the electro-optical device that presses and presses the glass substrate supported by the pressure bonding head,
Ranging means for measuring a separation distance from each of the second substrates bonded to the large substrate to a reference position;
Based on the separation distance measured by the distance measuring means, the glass substrate supported by the crimping head is moved at a fast moving speed to a preset proximity distance with respect to the second substrate, and then moved at a slow speed. Movement control means for causing
Pressure detecting means for measuring a pressing force of the glass substrate against the second substrate by the crimping head;
An electro-optical device manufacturing apparatus comprising: a movement stop control unit that stops the slow movement of the crimping head when the pressing force detected by the pressure detection unit reaches a set pressure. 2. The electro-optical device manufacturing apparatus according to claim 1, wherein the distance measuring means is a non-contact sensor. The electro-optical device manufacturing apparatus according to claim 1, wherein the movement control unit decelerates the moving speed during a set moving distance before reaching the proximity distance. A second substrate is bonded to a region where each first substrate is formed on a large substrate on which a large number of first substrates can be taken, and the outer surface of the second substrate is attached to the second substrate. In the method of manufacturing an electro-optical device that presses and presses the glass substrate supported by the pressure-bonding head,
A first step of measuring a separation distance from each second substrate bonded to the large substrate to a reference position;
A second step of moving the glass substrate supported by the pressure-bonding head based on the separation distance to a proximity distance set in advance with respect to the second substrate at a high moving speed;
A third step of moving the crimping head at a slow speed from the proximity distance;
4th which measures the pressing force with respect to the said 2nd board | substrate of the said glass substrate by the said crimping | compression-bonding head.
And the steps
And a fifth step of stopping the slow movement of the pressure-bonding head when the pressing force reaches a set pressure. 5. The method of manufacturing an electro-optical device according to claim 4, wherein in the second step, the moving speed is reduced during a set moving distance before reaching the proximity distance.

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