JP2009058571A - Manufacturing apparatus and manufacturing method for electro-optical device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain an image having high display quality by eliminating turbulence in an alignment state of liquid crystal molecules even if external force is applied to a glass substrate in sticking the glass substrate to an outer surface of a liquid crystal panel. <P>SOLUTION: Opposite substrates 20 are stuck through a sealing member 52 to areas where the respective TFT substrates 10 are formed in a large-sized substrate 110 from which a number of TFT substrates 10 can be obtained, and a void surrounded by the TFT substrate 10, the opposite substrate 20 and the sealing member 52 is filled with liquid crystal 50. In press-bonding a dust-proof glass substrate 31 to the outer surface of the opposite substrate 20 by a pressing surface 47a of a press-bonding head 47, the whole surface of the dust-proof glass substrate 31 is pressed to be substantially equally distributed by the pressing surface 47a of the press-bonding head 47. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electro-optical device manufacturing apparatus and a manufacturing method in which a glass substrate is bonded to the outer surface of a second substrate bonded to a large substrate.

  Conventionally, in a projection type display device that is representative of an electro-optical device, if dust or the like adheres to the vicinity of the surface of the display panel, it is enlarged by a projection lens or the like and projected onto a screen, thereby significantly reducing display quality. It will be. As a technique for preventing this, for example, as disclosed in Patent Document 1 (Japanese Patent Laid-Open No. 2003-140125), a technique of sticking a transparent glass substrate having a dustproof function to the outer surface of the display panel is often employed. ing.

  By protecting the outer surface of the display panel with a glass substrate, dust and the like can be prevented from adhering to the display panel surface. Furthermore, even if dust or the like adheres to the outer surface of the glass substrate, the distance between the dust and the electro-optical material such as liquid crystal is increased by the thickness of the glass substrate, and the image of dust and the like is defocused, and the screen Since it is displayed with a large blur on the top, it becomes inconspicuous.

When the glass substrate is bonded to the display panel surface, for example, as disclosed in Patent Document 2 (Japanese Patent Laid-Open No. 2006-11353), after spotting an adhesive on the surface of the substrate set on the table, A technique is often employed in which a glass substrate adsorbed to the lower end surface of the crimping head is brought into contact with the substrate from above and pressed to a predetermined pressure to crimp the glass substrate onto the substrate.
JP 2003-140125 A JP 2006-11353 A

  By the way, a liquid crystal panel, which is a representative display panel, has a pixel electrode, a TFT (Thin Film Transistor) element, a plurality of scanning lines (gate lines), a plurality of signal lines (source lines), a driver IC, and the like formed or mounted. The element substrate and the counter substrate on which the counter electrode and the like are formed are bonded to each other through a frame-shaped seal member, and liquid crystal as an electro-optical material is filled between both the substrates. The glass substrate is bonded to both outer surfaces of the TFT substrate and the counter substrate.

  11 and 12 show a process of bonding a glass substrate 31 on the counter substrate 20 cut out in a chip shape from a large substrate in the manufacturing process of the liquid crystal panel (so-called pre-process). On the stage 200, a large substrate 110 on which a large number of TFT substrates are formed is placed and fixed in a predetermined position, and is opposed to each TFT substrate region via a frame-shaped seal member 52. The substrate 20 is bonded. The liquid crystal is injected into the space surrounded by the substrates 20 and 110 and the seal member 52 by the drop injection method (ODF: One Drop Filling). In this state, the previous process has already been completed. The alignment state has also been adjusted.

  When the glass substrate 31 is bonded to the outer surface of the counter substrate 20, first, a transparent adhesive is spotted on the outer surface of the counter substrate 20, and then the glass substrate 31 is pressure-bonded from above. The glass substrate 31 is pressure bonded by the pressing force from the pressure bonding head 210. A pressing surface 210a for adsorbing the glass substrate 31 is formed at the lower end edge of the crimping head 210, and a suction recess 210b is formed on the inner periphery thereof. A suction pressure is applied to the suction recess 210b via the suction passage 210c. Has been introduced. Therefore, the glass substrate 31 is attracted to the pressing surface 210a by the suction pressure introduced into the suction recess 210b.

  When the glass substrate 31 is bonded to the surface of the counter substrate 20, it is necessary to spread the transparent adhesive drawn on the counter substrate 20 without introducing bubbles. The size of the image display area of the completed liquid crystal panel has various sizes depending on the application, and the size of the crimping head 210 is the smallest liquid crystal panel size so that it can be shared by all models. Is set to match.

  Therefore, in a relatively large liquid crystal panel, the size of the pressure bonding head 210 is relatively small, and the pressure bonding force is concentrated near the center of the counter substrate 20 as indicated by an arrow a in FIG. As a result, the vicinity of the center of the counter substrate 20 is pressed through the glass substrate 31. Since the counter substrate 20 is supported by the sealing member 52 at the outer edge and is filled with liquid crystal between the large substrate 110 near the center, bending stress is generated in the counter substrate 20 by the pressing force from the pressure bonding head 210. When the vicinity of the center is bent by this bending stress, the liquid crystal molecules are pressed.

  Since the pressed liquid crystal molecules move, the alignment state of the portion is disturbed. Even if the load applied to the counter substrate 20 by the pressure-bonding head 210 is released, the liquid crystal orientation is disturbed, and a part of the liquid crystal orientation may remain, causing the display quality of the image to be remarkably deteriorated.

  In view of the above circumstances, the present invention provides a display quality without disturbing the orientation state of the electro-optic material even when an external force is applied to the display panel when a glass substrate is bonded to the outer surface of the display panel. An object of the present invention is to provide an electro-optical device manufacturing apparatus and a manufacturing method capable of obtaining a high-quality image.

  In order to achieve the above object, according to a first aspect of the present invention, a second substrate has a sealing member in a region where each first substrate is formed in a large substrate on which a large number of first substrates are formed. And a gap surrounded by the first substrate, the second substrate, and the sealing member is filled with an electro-optical material, and an outer surface of the second substrate is a glass substrate. In the electro-optical device manufacturing apparatus in which the pressure is pressed by the pressing surface of the pressure-bonding head, the pressure surface of the pressure-bonding head is formed in a shape that is in surface contact with substantially the entire surface of the glass substrate. Features.

  In such a configuration, the pressing surface that presses the glass substrate of the crimping head in the second substrate direction is formed in a shape that comes into surface contact with substantially the entire surface of the glass substrate. A substantially uniform distribution is applied to the second substrate through the glass substrate. Therefore, bending stress does not act on the second substrate, and the second substrate is not curved. As a result, no external force is applied to the electro-optic material, and the orientation state of the electro-optic material is not disturbed, and an image with high display quality can be obtained.

  A second invention is characterized in that, in the first invention, the outer shape of the pressing surface of the crimping head is formed substantially the same as the outer shape of the glass substrate.

  In such a configuration, since the outer shape of the pressing surface of the crimping head is formed substantially the same as the outer shape of the glass substrate, the glass substrate can be crimped with a uniform pressing force.

  A third invention is characterized in that, in the first invention, an outer shape of the pressing surface of the crimping head is formed larger than an outer shape of the glass substrate.

In such a configuration, since the outer shape of the pressing surface of the crimping head is formed larger than the outer shape of the glass substrate, the glass substrate can be crimped with a uniform pressing force. In a third aspect of the present invention, a suction passage is formed in the center of the pressing surface of the suction head to introduce a suction pressure for attracting the glass substrate to the pressing surface.

  In such a configuration, since the suction passage for introducing the suction pressure for attracting the glass substrate to the pressing surface is formed in the center of the pressing surface of the suction head, the glass substrate can be attracted in a balanced manner at the central portion of the crimping head. it can.

  According to a fifth aspect of the present invention, a second substrate is bonded to a region where each first substrate is formed on a large substrate on which a large number of first substrates can be taken. In addition, an electro-optical material is filled in a space surrounded by the first substrate, the second substrate, and the seal member, and a glass substrate is pressed on the outer surface of the second substrate. In the method of manufacturing an electro-optical device that is pressed and pressure-bonded by the pressing surface of the pressure-bonding head, the entire surface of the glass substrate is pressed in a substantially equal distribution and the glass substrate is pressure-bonded to the second substrate. It is characterized by making it.

  In such a configuration, the entire surface of the glass substrate is pressed with substantially equal distribution on the pressing surface of the crimping head so that the glass substrate is crimped to the second substrate. A substantially uniform distribution is applied to the second substrate through the glass substrate. Therefore, bending stress does not act on the second substrate, and the second substrate is not curved. As a result, no external force is applied to the electro-optic material, and the orientation state of the electro-optic material is not disturbed, and an image with high display quality can be obtained.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[First Embodiment]
1 to 7 show a first embodiment of the present invention. 1 is a plan view of a liquid crystal panel, FIG. 2 is a liquid crystal device after the assembly process in which a TFT substrate and a counter substrate are bonded together to enclose liquid crystal, and is a cross-sectional view taken along the line HH ′ of FIG. It is a perspective view which shows the state by which the chip-shaped counter substrate was bonded with respect to the large sized board | substrate which can take many TFT substrates. In the following description, an active matrix liquid crystal device including a thin film transistor (TFT) as a pixel switching element will be described as an example.

  First, the overall configuration of a general liquid crystal device 100, which is an example of an electro-optical device, will be described with reference to FIGS. The liquid crystal device 100 includes a liquid crystal panel 120 and transparent glass substrates (hereinafter referred to as “dust-proof glass substrates”) 30 and 31 having a dustproof function, which are bonded to both outer surfaces of the liquid crystal panel 120. .

  The liquid crystal panel 120 includes a TFT substrate 10 as a first substrate and a counter substrate 20 as a second substrate disposed to face the TFT substrate 10, and an image display area 10 a between the opposing surfaces of both the substrates 10 and 20. A seal region provided around is bonded together with a seal member 52 interposed therebetween. Note that the outer shape of the seal member 52 and the outer shape of the counter substrate 20 are formed to be approximately the same size.

  Further, a liquid crystal 50, which is an electro-optical material, is filled in a space surrounded by the seal member 52 between the opposing surfaces of the substrates 10 and 20 by a drop injection method (ODF). Vertical conduction members 106 are provided at four corners of the counter substrate 20, and are electrically connected between the vertical conduction terminals 107 provided on the TFT substrate 10 and the counter electrode 21 provided on the counter substrate 20. ing.

  Further, a light-shielding peripheral light-shielding film 53 that defines the image display region 10a is provided on the counter substrate 20 side in parallel with the inside of the seal region where the seal member 52 is disposed. In addition, the data line driving circuit 101 and the external circuit connection terminal 102 are provided along one side of the TFT substrate 10 on the outer side of the seal area where the seal member 52 is arranged in the peripheral area extending around the image display area. The scanning line driving circuit 104 is provided along two sides adjacent to the one side.

  Further, on the remaining side of the TFT substrate 10, a plurality of wirings 105 are provided for electrically connecting the scanning line driving circuits 104 provided on both sides of the image display region 10a. Note that the scanning line driving circuit 104 and the wiring 105 are disposed at positions facing the peripheral light shielding film 53 inside the seal member 52.

  Further, on the TFT substrate 10, an alignment film 16 is formed on the pixel electrode 9 a after forming a pixel switching TFT element, which will be described later, and wiring such as a scanning line and a data line. On the other hand, on the counter substrate 20, in addition to the counter electrode (ITO) 21, an alignment film 22 is formed in the uppermost layer portion, and a predetermined alignment state is set between the pair of alignment films 16 and 22. . The alignment films 16 and 22 are made of a transparent organic film such as a polyimide film.

  The dust-proof glass substrates 30 and 31 bonded to both outer surfaces of the liquid crystal panel 120 prevent dust and the like from adhering to the surface of the liquid crystal panel 120 and defocus the dust and the like away from the liquid crystal display surface. Thus, it also has a function of making an image such as dust inconspicuous. In order to realize such a function, the dust-proof glass substrates 30 and 31 are formed to be relatively thick with a plate thickness of about 1 to 3 mm, and the material is the same as that of the TFT substrate 10 and the counter substrate 20. in use. Further, the dust-proof glass substrates 30 and 31 are a silicon-based adhesive or acrylic-based adhesive adjusted to the same refractive index as the TFT substrate 10 and the counter substrate 20 (and the dust-proof glass substrates 30 and 31) with respect to the surface of the liquid crystal panel 120 It is bonded to the outer surfaces of both substrates 10 and 20 through a transparent adhesive such as a thermosetting type or an ultraviolet curable type made of an agent.

  The TFT substrate 10 and the counter substrate 20 are manufactured in a state of a large substrate in which a large number of each can be obtained in the previous process. First, only the counter substrate 20 is cut out from the large substrate into a chip shape. The counter substrate 20 cut out from the large substrate is bonded to each region of the large substrate 110 on which the TFT substrate 10 can be obtained (see FIG. 3). Note that liquid crystal is filled between the large substrate 110 and the counter substrate 20 by a drop injection method (ODF). The number of chip-like TFT substrates 10 that can be cut out from one large substrate 110 is determined by the size of the large substrate 110 and the size of the liquid crystal panel to be manufactured. Therefore, the number of cutouts (12 pieces) of the TFT substrate 10 shown in FIG. 3 is merely an example. Furthermore, although the large substrate 110 according to the present embodiment is formed in a disc shape, the shape is not limited to this and may be a rectangular shape.

  A large dust-proof glass substrate 300 from which a large number of dust-proof glass substrates 30 can be taken is mounted on the bottom surface of the large substrate 110 with approximately the same size as the large substrate 110. The other dustproof glass substrate 31 is mounted on the counter substrate 20 bonded to the large substrate 110.

  FIG. 4 shows a process of mounting the dust-proof glass substrates 30 and 31 on the outer surface of the large substrate 110 and the outer surface of the counter substrate 20 bonded to the upper surface of the large substrate 110, respectively. This work is performed in a clean room.

  Step (a): First, the counter substrate 20 is positioned and bonded on the region of the large substrate 110 where the TFT substrate 10 is formed, and then the operation state and the like are inspected.

  Step (b): Next, a dust-proof glass substrate 31 having substantially the same shape as the counter substrate 20 is attached to the outer surface of each counter substrate 20.

  Step (c): After cleaning the whole, a large-sized substrate 110 having a shape substantially the same as or slightly smaller than the large-sized substrate 110 is formed on the outer surface of the large-sized substrate 110 on the side opposite to the surface on which the counter substrate 20 is bonded. The dust-proof glass substrate 300 is bonded.

  Step (d): A scribe line is formed between the opposing substrates 20 on the surface of the large substrate 110 on which the counter substrate 20 is bonded, and the large substrate 110 is divided along the scribe lines to form a chip-like liquid crystal. The apparatus 100 is cut out. At this time, the large dustproof glass substrate 300 is also cut out into the chip-shaped dustproof glass substrate 30.

  In the mounting process of the dustproof glass substrates 30 and 31, the process (b) and the process (c) are interchanged, and the large dustproof glass is applied to the large substrate 110 before the dustproof glass substrate 31 is attached to the counter substrate 20. The substrate 300 may be attached.

  Next, the mounting process of the dustproof glass substrate (hereinafter referred to as “small dustproof glass substrate”) 31 shown in FIG. 4B will be described in more detail with reference to the process diagram of FIG. The small dust-proof glass substrate 31 is bonded under normal pressure.

  Step (a): First, the large substrate 110 is placed and fixed on the stage 200 in a predetermined position. Next, a thermosetting or ultraviolet curable transparent adhesive 41 is dropped on the center of the upper surface of one counter substrate 20. The stage 200 may be a hot plate heated to a predetermined temperature. In this case, a thermosetting type is used as the transparent adhesive 41.

  The pressure bonding head 47 is waiting above the counter substrate 20. The crimping head 47 is detachably supported by an actuator such as an air cylinder (not shown), and can be moved up and down by the operation of the actuator. The pressure bonding head 47 and the stage 200 on which the large substrate 110 is placed are relatively movable in the horizontal direction, and the pressure bonding head 47 and the stage 200 are provided for each counter substrate 20 stored in advance. Positioning is automatically performed according to the XY coordinate data indicating the position.

  A pressing surface 47 a that adsorbs the small dustproof glass substrate 31 is formed on the lower end surface of the pressure bonding head 47. As shown in FIGS. 6 and 7, the outer shape of the pressing surface 47 a of the pressure-bonding head 47 is formed in substantially the same shape as the outer shape of the dust-proof glass substrate 31 and is finished flat. Therefore, the pressure bonding head 47 is dedicated for each size of the dust-proof glass substrate 31.

  A suction passage 47c having a relatively small diameter is formed at the center of the pressure bonding head 47, and the suction passage 47c communicates with a vacuum pump (not shown). When the small dustproof glass substrate 31 is brought into contact with the pressing surface 47a of the crimping head 47 in a predetermined position, suction pressure from a vacuum pump (not shown) is introduced into the suction passage 47c, and this suction The small dust-proof glass substrate 31 is adsorbed to the pressing surface 47a by the suction pressure generated at the end opening on the pressing surface 47a of the passage 47c. Since the pressing surface 47a is finished flat, the small dust-proof glass substrate 31 is in close contact with the pressing surface 47a. Furthermore, since the suction passage 47c is formed at the center of the pressure-bonding head 47, the suction state of the small dust-proof glass substrate 31 can be maintained in a well-balanced manner.

  Step (b): The pressure-bonding head 47 is lowered and the small dustproof glass substrate 31 adsorbed on the pressing surface 47a is brought into contact with the upper surface of the counter substrate 20 in a predetermined position (see FIGS. 6 and 7). . In this state, pressing is performed with a predetermined pressure (for example, about 0.15 [Kg / cm 2]) for a predetermined time (for example, about 10 to 20 [sec]), and the small dustproof glass substrate 31 is bonded to the counter substrate 20.

  Then, the transparent adhesive 41 diffuses to the surroundings while preventing air bubbles from entering, and the small dust-proof glass substrate 31 is bonded onto the counter substrate 20. Note that the pressure bonding time and the pressure bonding force of the pressure bonding head 47 are set according to the time required for the transparent adhesive 41 to diffuse throughout the air while preventing air bubbles from entering and the time required for the transparent adhesive 41 to cure.

  As shown in FIGS. 6 and 7, the entire outer surface of the small dust-proof glass substrate 31 is adsorbed to the pressing surface 47 a of the pressure-bonding head 47. Therefore, the load from the pressure bonding head 47 is applied to the outer surface of the small dust-proof glass substrate 31 at an equal distribution as shown by an arrow a in FIG. Since the suction passage 47c formed in the center of the crimping head 47 has a relatively small diameter, the load does not concentrate on the outer edge of the suction passage 47c.

  As a result, an evenly distributed load is applied to the counter substrate 20 via the small dust-proof glass substrate 31, so that no bending stress acts on the counter substrate 20 and the liquid crystal molecules filled therein are pressed. There is no. Therefore, there is no disturbance in the alignment state of the liquid crystal molecules, and an image with high display quality can be obtained.

  Step (c): After the pressure bonding time of the small dust-proof glass substrate 31 by the pressure bonding head 47 reaches a predetermined pressure bonding time, the transparent adhesive 41 is cured, and then the pressure bonding head 47 is raised. Then, since the small dustproof glass substrate 31 is bonded to the counter substrate 20 by the transparent adhesive 41, the small dustproof glass substrate 31 is separated from the pressing surface 47 a of the pressure bonding head 47, and the bonding of the small dustproof glass substrate 31 is completed.

  Next, the stage 200 and the pressure-bonding head 47 are moved relative to each other so that the pressure-bonding head 47 is provided on the adjacent counter substrate 20, and the same steps as the steps (a) to (c) described above are repeated. A small dust-proof glass substrate 31 is bonded to the counter substrate 20. By repeating this for the remaining counter substrates 20, the small dust-proof glass substrate 31 is bonded to the outer surface of all the counter substrates 20 bonded to the large substrate 110.

  Thus, according to this embodiment, in the process of mounting the small dustproof glass substrate 31 on the outer surface of the counter substrate 20, the pressing surface 47 a of the crimping head 47 sucks the entire outer surface of the small dustproof glass substrate 31. Thus, the pressing force from the pressure-bonding head 47 is applied to the entire counter substrate 20 with equal distribution. Accordingly, the counter substrate 20 is not curved, the liquid crystal molecules filled therein are not pressed, and the alignment state of the liquid crystal molecules is not disturbed, so that an image with high display quality can be obtained. .

  In the above-described embodiment, the single head method in which the small dust-proof glass substrates 31 are pressure-bonded to the counter substrate 20 one by one with one pressure-bonding head 47 has been described, but the present invention uses a plurality of arrayed pressure-bonding heads. A multi-head method in which a plurality of small dust-proof glass substrates 31 are simultaneously pressed may be used.

[Second Embodiment]
FIGS. 8 and 9 show a side view and a plan view corresponding to FIGS. 6 and 7 according to the second embodiment of the present invention. In the first embodiment described above, the pressure-bonding head 47 is dedicated for each size of the small dust-proof glass substrate 31 applied to the liquid crystal panel 120 to be manufactured. However, the outer shape of the pressing surface 48a of the pressure-bonding head 48 employed in this embodiment is used. Is used in common by forming it in accordance with the outer shape of the maximum size in the small dustproof glass substrate 31 applied to the liquid crystal panel 120 to be manufactured.

  Therefore, as shown in FIGS. 8 and 9, the small dust-proof glass substrate 31 having a small size is adsorbed to the pressing surface 48a of the pressure-bonding head 48 by the suction force introduced into the small-diameter suction passage 48c. When the glass substrate 31 is pressed against the counter substrate 20, the pressing force from the pressure bonding head 48 is transmitted to the counter substrate 20 in the same distribution as in the first embodiment. For this reason, the counter substrate 20 is not curved, and the alignment state of the liquid crystal molecules is not disturbed.

  Further, since the shape of the pressure bonding head 48 is formed in accordance with the maximum size of the applied small dustproof glass substrate 31, depending on the liquid crystal panel 120 to be manufactured, as shown in FIG. It is also conceivable that the pressing surface 48a overhangs on the side of the adjacent small dust-proof glass substrate 31 that has been bonded.

  However, since the height of the small dust-proof glass substrate 31 that has been bonded is the same as the height of the small dust-proof glass substrate 31 to be bonded this time, the adjacent small size that has been bonded by the pressing surface 48a of the pressure-bonding head 48. The outer surface of the dustproof glass substrate 31 is not damaged.

  Thus, according to the present embodiment, the pressure bonding head 48 is formed in accordance with the largest size among the small dustproof glass substrates 31 applied to the liquid crystal panel 120 to be manufactured. Can be realized. As a result, the setup time required for replacing the crimping head 48 is not required, and not only can the man-hours be reduced, but there is no need to prepare a plurality of types of crimping heads, which is economical.

  Note that the outer shape of the pressing surface 48a of the pressure-bonding head 48 may be larger than the maximum size of the small dust-proof glass substrate 31 applied to the liquid crystal panel 120 to be manufactured.

  The electro-optical device according to the present invention is not limited to a TFT active matrix driving type liquid crystal device, but can be applied to a passive matrix type liquid crystal device and a liquid crystal device including a TFD (thin diode) as a switching element.

The top view which looked at the liquid crystal device by a 1st embodiment from the counter substrate side with each component formed on it HH 'sectional view of Fig. 1 The perspective view of a state where a chip-like counter substrate is bonded to the large substrate Process diagram showing the process of mounting a dust-proof glass substrate on the outer surface of the liquid crystal panel Process diagram showing the mounting process of a small dustproof glass substrate Same as above, enlarged vertical sectional view of FIG. VII-VII sectional view of FIG. Enlarged longitudinal sectional side view corresponding to FIG. 6 according to the second embodiment IX-IX cross-sectional view of Fig. 8 FIG. 8 is a vertical sectional side view of another embodiment of FIG. Enlarged longitudinal sectional side view showing the mounting process of a conventional small dustproof glass substrate XII-XII sectional view of Fig. 11

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... TFT substrate, 20 ... Opposite substrate, 30, 31 ... Dust-proof glass substrate, 41 ... Transparent adhesive, 47, 48 ... Crimp head, 47a, 48a ... Press surface, 47c, 48c ... Suction passage, 50 ... Liquid crystal 52 ... Seal member, 100 ... Liquid crystal device, 110 ... Large substrate, 120 ... Liquid crystal panel

Claims (5)

A second substrate is bonded to a region where each first substrate is formed on a large substrate on which a large number of first substrates can be taken, and the first substrate is bonded to the first substrate. The space surrounded by the substrate, the second substrate, and the seal member is filled with an electro-optical material, and the glass substrate is pressed against the outer surface of the second substrate by the pressing surface of the crimping head. In an electro-optical device manufacturing apparatus for pressure bonding,
The electro-optical device manufacturing apparatus, wherein the pressing surface of the pressure-bonding head is formed in a shape that is in surface contact with substantially the entire surface of the glass substrate. The electro-optical device manufacturing apparatus according to claim 1, wherein an outer shape of the pressing surface of the crimping head is substantially the same as an outer shape of the glass substrate. The electro-optical device manufacturing apparatus according to claim 1, wherein an outer shape of the pressing surface of the crimping head is formed larger than an outer shape of the glass substrate. The suction path which introduces the suction pressure which makes the said glass substrate adsorb | suck to this press surface is formed in the center of the said press surface of the said suction head, The any one of Claims 1-3 characterized by the above-mentioned. Electro-optical device manufacturing equipment. A second substrate is bonded to a region where each first substrate is formed on a large substrate on which a large number of first substrates can be taken, and the first substrate is bonded to the first substrate. The space surrounded by the substrate, the second substrate, and the seal member is filled with an electro-optical material, and the glass substrate is pressed against the outer surface of the second substrate by the pressing surface of the crimping head. In the manufacturing method of the electro-optical device to be crimped,
A method for manufacturing an electro-optical device, comprising pressing the entire surface of the glass substrate with substantially equal distribution by the pressing surface of the pressure-bonding head to pressure-bond the glass substrate to the second substrate.

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