JP4830296B2 - Method for manufacturing liquid crystal device, liquid crystal device, and electronic apparatus - Google Patents

Description

  The present invention relates to a method for manufacturing a liquid crystal device, a liquid crystal device, and an electronic apparatus.

An electro-optical device such as a liquid crystal device is used for a color image display unit in an electronic device such as a mobile phone. The liquid crystal device is configured by sandwiching a liquid crystal layer between a pair of transparent substrates.
In order to form this liquid crystal device, first, a sealing material (sealing material) is applied to the peripheral surface of one substrate. At that time, a liquid crystal injection port is formed in a part of the sealing material. Next, a spacer is sprayed inside the sealing material, and the other substrate is bonded through the sealing material. Thereby, a liquid crystal cell is formed in a region surrounded by the pair of substrates and the sealing material. Next, the inside of the liquid crystal cell is deaerated in a vacuum, and the whole is returned to atmospheric pressure in a state where the liquid crystal inlet is immersed in the liquid crystal tank. Then, the liquid crystal is filled in the liquid crystal cell by the pressure difference between the liquid crystal cell and the outside and the surface tension. However, when the liquid crystal is filled by the above-described method, the filling time becomes very long. In particular, when a large substrate having a diagonal of 1 m or more is used, it takes one day or more to fill the liquid crystal.

  Therefore, a dropping assembly method has been proposed in which liquid crystal is dropped onto a substrate provided with a frame-shaped sealing material that does not have the liquid crystal inlet, and the substrates are bonded together. In this method, first, a sealing material made of a thermosetting resin or the like is applied to the peripheral edge of the surface of one substrate. Next, a predetermined amount of liquid crystal is dropped inside the sealing material by a droplet discharge device. Finally, the other substrate is bonded in a vacuum atmosphere via a sealing material, released to an atmospheric pressure atmosphere, and the sealing material is irradiated with ultraviolet rays or heat-treated to form a liquid crystal device. is there. Therefore, unlike the conventional liquid crystal injection method, the sealing material is formed in an annular shape without an injection port.

  According to such a method, it is possible to obtain a predetermined cell gap by applying a uniform pressure from the surfaces of both substrates by releasing them to an atmospheric pressure atmosphere after bonding the both substrates. The cell gap can be determined by the amount of liquid crystal dropped. For example, if the amount of liquid crystal dropped is too small, the cell gap becomes thin and bubbles are likely to be generated, and if the amount of dropped liquid is too large, the cell gap becomes thick and cell gap unevenness is likely to occur. Therefore, a uniform cell gap can be obtained by optimally setting the liquid crystal dropping amount. Furthermore, unlike the conventional liquid crystal injection method, such a method can reduce the amount of liquid crystal used and shorten the tact time by omitting the injection / sealing process.

Moreover, as a method for forming the sealing material, a method using a dispenser has been proposed (for example, Patent Documents 1 to 3). This method is a method in which a sealant is discharged and formed in a predetermined pattern on a substrate while relatively moving the dispenser and the substrate. Here, the seal material discharged first and the seal material discharged later are polymerized at a part of the outer peripheral portion of the pattern so that the seal material discharged onto the substrate has an annular pattern. Thereby, when a board | substrate is bonded together after dripping a liquid crystal, it suppresses that a liquid crystal leaks outside the annular pattern of a sealing material.
JP 2002-98799 A JP 2003-222883 A Japanese Patent Laid-Open No. 2003-241204

However, the present inventors have difficulty in stably forming the sealing material in the liquid crystal device described in the above patent document, and it is necessary to provide a dummy space between adjacent panels. That is, it has been found that it is necessary to control the dispenser at the start and end of drawing in order to form one pattern in one drawing operation. Furthermore, it has been found that a cell gap defect is likely to occur in a method of forming a sealing material using a dispenser.
SUMMARY An advantage of some aspects of the invention is that it provides a method of manufacturing a liquid crystal device, a liquid crystal device, and an electronic apparatus that can realize a uniform cell gap.

The present inventors have found the following knowledge regarding a discharge method of a sealing material using a dispenser.
In such a discharge method, as shown in FIGS. 35 (a) and 35 (b), the thicknesses of the members of the drawing start portion 500 and the drawing end portion 510 of the sealing material are formed to the same thickness as other portions. There is a need to. The reason is that if it is too thick, the cell gap becomes thick and display unevenness occurs, and if it is too thin, the liquid crystal is liable to leak from that portion and the reliability is lowered. However, when drawing a sealing material with a dispenser, generally, as shown in FIGS. 35A and 35B, the drawing start part 500 and the drawing end part 510 tend to easily become thicker (jumped) or thinner. In order to make the joint portion 520 uniform in thickness, the drawing start unit 500 and the drawing end unit 510 are often overlapped as shown in FIG. In this case, the length of the overlapping portion needs to be about 4 mm, and the width W2 of the portion is about 0.1 to 0.2 mm (ΔW = W2−W1 = from the predetermined target width W1) due to variations in the viscosity of the sealing material. 0.1 to 0.2 mm) has been confirmed to be thick.

Further, in a liquid crystal device driven by TFD (Thin Film Transistor), a liquid crystal device that operates STN (Super Twisted Nematic) liquid crystal by passive drive, etc., a circuit board including driver ICs 600 and 610 as shown in FIGS. It is necessary to electrically connect (conduct) the lead wiring 601 formed on the surface of the lead wire 601 and the common electrode (hereinafter referred to as a COM electrode) 602 formed on the counter substrate at the conduction pad 603. In this case, the conductive particles plated on the spacer surface are dispersed in the sealing material, and the sealing material is disposed on the conductive pad 603, whereby the routing wiring 601 and the COM electrode 602 are connected via the conductive particles. Conduction is performed, and the output potential of the driver IC 600 is applied to the wiring of the counter substrate.
On the other hand, in the segment electrode (hereinafter referred to as SEG electrode) 604 routed from the driver IC 610 to the display area 620 and the lead wiring 601 routed from the driver IC 600 to the conductive pad 603, it is necessary to cross the sealing material. There is. In this case, in order to prevent each electrode in the routing wiring 601 and the SEG electrode 604 from being short-circuited with each other, a sealing material not containing conductive particles is traversed on the wiring 601 and the SEG electrode 604.
By the way, when both the sealing material containing conductive particles and the non-conductive sealing material are used, the COM electrode 601 crosses the sealing material from the end of the conductive pad 603 (A in FIG. 37). It is necessary to connect both the sealing materials up to the end portion (B in FIG. 37). In the TFD liquid crystal device and the STN liquid crystal device, the distance L of this portion is often set to 2 mm or less. Therefore, if the length of the overlapping portion shown in FIG. 35C is simply shorter than 4 mm, the length of the overlapping portion of the joint portion 520 becomes 1 mm as shown in FIG. 35D, and the width W3 is a predetermined target. It has been confirmed that the width W1 becomes thicker by about 0.5 to 0.6 mm (ΔW = W3−W1 = 0.5 to 0.6 mm), and this is likely to cause a cell gap defect. .

Further, Patent Document 1 sets the width dimension of the overlapping portion of the start end and the end forming the seal line to 0.4 to 0.6 times the seal line width. However, in this method, the dispenser is extremely controlled. Due to variations in the amount of sealing material remaining in the dispenser and variations in viscosity between lots of sealing materials, the seal shape tends to vary and management is extremely difficult. Have the problem of being difficult.
Further, Patent Document 2 starts drawing from any part outside the closed-loop seal member, and finishes drawing at a location outside the closed-loop seal member different from the part from which drawing has started. This method has a problem that it is necessary to provide a dummy space between adjacent panels. Further, in any of the methods of Patent Documents 1 to 3, since one member is formed by one drawing operation, it takes time to control the dispenser at the start and end of drawing, and the tact time becomes long. There is also a problem.
Therefore, the present inventors have arrived at the present invention having the following means based on the above.

That is, according to the method for manufacturing a liquid crystal device of the present invention, a first substrate and a second substrate which are disposed to face each other with a liquid crystal layer interposed therebetween, and a first seal which is formed on the peripheral edge of both the substrates and seals the liquid crystal layer. A liquid crystal device manufacturing method comprising: a sealing member including an annular portion formed of a member and the first sealing member, each of which includes an individual second sealing member, wherein the first sealing layer is provided at both ends. A position where the first seal member and the second seal member having the second seal layer at both ends are opposed to each other so that a region surrounded by the first seal member and the second seal member is formed inside. Forming the liquid crystal layer inside a region surrounded by the first seal member and the second seal member, and bonding the first substrate and the second substrate to each other. 1 seal member and the second seat By pressing the member, the joint between the first sealing layer and the second seal layer are joined, thereby forming respective outside the two sides facing the annular portion, the through the joint A step of connecting the first seal member and the second seal member.

Here, the first seal layer and the second seal layer are portions that are formed by the seal member forming step and are overlapped with each other and temporarily joined before the bonding step. Further, the first seal layer and the second seal layer are portions that become a joint portion while the mutual joint area is widened by the bonding process. Therefore, in other words, the first seal layer and the second seal layer are the front shape of the joint.
The bonding portion is a portion where the sealing materials formed on the substrate are bonded to each other, and the annular portion is closed to prevent the liquid crystal layer inside the annular portion from leaking to the outside. It is a part. Moreover, the said junction part includes the state where the sealing material overlapped and joined in the vertical direction of the substrate, and the state where the sealing material joined adjacently in the horizontal direction of the substrate. Moreover, since the said junction part is formed in the outer side of the annular part, the said junction part becomes what was formed toward the outer side of the annular part from the part which joined the annular part. Yes. Therefore, not all the joining portions are formed on the annular portion, but only a part of the joining portion is joined to the annular portion, and the other portions are formed toward the outside of the annular portion. ing.
Further, in the seal member forming step, a discharge method is used in which the seal material is discharged from the nozzle of the dispenser while relatively moving the dispenser filled with the seal material and the first substrate or the second substrate.

In this way, since the annular portion is closed by a part of the joint, leakage of the liquid crystal layer from the joint can be suppressed, and the reliability of the liquid crystal device can be improved. In addition, since the joining portion is formed toward the outside of the annular portion, when the bonding process is performed, it is only necessary to widen the joining portion on the outside of the annular portion, and the sealing member is provided inside the annular portion. Protruding can be suppressed. In addition, the cell gap can be kept uniform without affecting the cell gap inside the annular portion. More specifically, when the seal protrudes inside the annular portion, for example, the seal may run on a color filter in the display area of the liquid crystal device, which easily affects the cell gap. On the other hand, in the present invention, since the seal member is formed outside the annular portion, that is, in the region where the color filter is not formed, the seal does not run over the color filter. Therefore, the cell gap can be kept uniform.
Further, compared to the prior art, it is not necessary to adjust the member width of each of the annular portion and the joint portion, and the annular portion and the joint portion can be formed with a member having the same width, and the seal member can be easily formed. . Therefore, it becomes easy to control the dispenser, and drawing of the seal member can be completed in a short time. Further, it is not necessary to consider the variation in the amount of the sealing material remaining in the dispenser and the viscosity variation between lots of the sealing material, and the shape of the sealing member can be easily managed.

In the method for manufacturing a liquid crystal device of the present invention, in the sealing member forming step, the first side of the annular portion is formed on a straight line extending from the sealing member, and the first sealing layer or the second sealing layer is formed. One of the sealing layers is formed continuously with the first side.
If it does in this way, not only the effect similar to said manufacturing method will be acquired, but the 1st edge of an annular part can be formed on the straight line where a seal member extends. Further, the first seal layer or the second seal layer can be formed continuously with the first side.

Moreover, in the manufacturing method of the liquid crystal device of the present invention, the sealing member forming step forms a second side in an axial direction perpendicular to the axial direction of the first side in the annular portion, and the first sealing layer Alternatively, one of the second seal layers is formed continuously with the first side, and the other is formed continuously with the second side via a curved portion.
If it does in this way, not only the effect similar to said manufacturing method will be acquired, but one side and the 2nd side of the 2nd seal layer or the 1st seal layer can be connected via a curvilinear part.

In the liquid crystal device manufacturing method of the present invention, the line width of the seal member in the annular portion after the bonding step is set to w3, the center line of the first seal layer and the second seal layer When the distance from the center line is d3 and the radius of the curved portion is R3,
The relationship is established. Furthermore, in the present invention,
Is established, and
It is preferable that the relationship is established.

In this way, not only the same effects as in the above manufacturing method can be obtained, but also the liquid crystal layer can be prevented from leaking from the annular portion regardless of the thickness of the seal member.
In addition, in the conventional method, the seal member is thickened at the joint, or the distance between the overlapping portions needs to be increased in order to minimize the thickness, and the control of the apparatus becomes complicated. Thus, there is a problem that the drawing time of the seal member becomes long. On the other hand, according to the method of the present invention, it is possible to draw the seal member at the same speed in all portions, and the writing start portion and the writing end portion are also portions sufficiently away from the liquid crystal device. This eliminates the need for complicated control. Due to these effects, the drawing time can be significantly shortened to 1/2 to 1/3 of the conventional one, and the thickness of the sealing member toward the inside of the liquid crystal device at the joint portion of the sealing member can be eliminated.

Moreover, in the manufacturing method of the liquid crystal device of the present invention, the sealing member forming step forms a second side in an axial direction perpendicular to the axial direction of the first side in the annular portion, and the first sealing layer Alternatively, one of the second seal layers is formed continuously with the first side, and the other is formed continuously with the second side through an inclined portion.
If it does in this way, not only the same effect as the above-mentioned manufacturing method will be acquired, but either the 2nd seal layer or the 1st seal layer, and the 2nd side can be connected via an inclined part.

In the liquid crystal device manufacturing method of the present invention, the line width of the seal member in the annular portion after the bonding step is set to w3, the center line of the first seal layer and the second seal layer If the distance from the center line is d3 and the chamfering amount of the inclined portion is c3,
The relationship is established. Furthermore, in the present invention,
Is established, and
It is preferable that the relationship is established.

In this way, not only the same effects as in the above manufacturing method can be obtained, but also the liquid crystal layer can be prevented from leaking from the annular portion regardless of the thickness of the seal member.
In addition, the seal member can be drawn at the same speed in all portions, and the writing start portion and the writing end portion are portions sufficiently away from the liquid crystal device, so that complicated control is not necessary. Due to these effects, the drawing time can be significantly shortened to 1/2 to 1/3 of the conventional one, and the thickness of the sealing member toward the inside of the liquid crystal device at the joint portion of the sealing member can be eliminated.

In the method for manufacturing a liquid crystal device according to the present invention, the first substrate may be formed by dividing a first base material having a plurality of first element regions at a mutual boundary portion of the plurality of first element regions, and The second substrate is obtained for each first element region, and the second substrate is obtained by dividing a second base material having a plurality of second element regions at mutual boundary portions of the plurality of second element regions, and It is obtained for each second element region.
In this way, not only the same effect as the manufacturing method described above can be obtained, but also the first element region and the second element region can be divided and taken out from the first base material and the second base material. A plurality of liquid crystal devices composed of one substrate and a second substrate can be taken out. Therefore, a manufacturing method with excellent productivity can be realized.

In the method for manufacturing a liquid crystal device according to the present invention, the sealing member forming step may be one of the first seal layer and the second seal layer and a part of the annular portion. After the first seal member forming step for forming the seal member and the first seal member forming step, the other of the first seal layer and the second seal layer, and the remaining portion of the annular portion. And a second seal member forming step for forming the second seal member.
In this way, not only the same effects as in the above manufacturing method can be obtained, but also a liquid crystal device having a seal member formed by the first seal member and the second seal member can be manufactured. Further, in the case where the seal member is composed of only one member, it is difficult to form the annular portion or the joint portion by using different seal materials. However, according to the present invention, the first seal member and the second seal member A seal material can be selected for each. Thereby, either a 1st seal member or a 2nd seal member can be selected and formed only with respect to a specific site | part among the site | parts in which a seal member is formed.

In the method for manufacturing a liquid crystal device of the present invention, in the first seal member forming step, the first element regions are arranged with respect to the plurality of first element regions and the mutual boundary portions in the first base material. The first seal member is continuously directed toward the direction in which the second element regions are arranged with respect to the plurality of second element regions and the mutual boundary portions in the second base material. It is characterized in that it is formed in a batch.
Further, in the second seal member forming step, after the first seal member forming step is performed, the first element region is formed with respect to the plurality of first element regions and the mutual boundary portions in the first base material. The second seal member is continuously directed in the direction in which the second element regions are arranged with respect to the arrangement direction or with respect to the plurality of second element regions and the mutual boundary portions in the second base material. And forming them in a lump.

In this way, a plurality of first element regions or a plurality of second elements are obtained by a single process from the start of drawing the first seal member to the end of drawing and a single process from the start of drawing the second seal member to the end of drawing. Seal members can be collectively formed in the arrangement direction of the regions. Thereby, a sealing member can be formed easily and rapidly, and the manufacturing method excellent in productivity is realizable.
On the other hand, in the case of forming the seal member in each of the plurality of first element regions and the plurality of second element regions, drawing start and drawing end of the seal member must be performed for each region. Drawing start and drawing end must be repeated for the first element region and the plurality of second element regions. Accordingly, since the discharge and non-discharge of the sealing material occur continuously, it becomes difficult to stably flow the sealing material in the dispenser, and the amount of the sealing material to be discharged tends to vary. Further, the dispenser must be scanned on the first base material or the second base material, and the operation of the dispenser becomes complicated.
On the other hand, the present invention forms the first seal member and the second seal member collectively in a continuous manner in the arrangement direction of the first element region or the second element region. It is only necessary to start and end drawing for each column or row of the second element region, and therefore the number of drawing start and the number of drawing end can be reduced. Thereby, the 1st seal member and the 2nd seal member can be formed continuously and collectively, making the seal material in a dispenser flow stably. Further, the seal member can be formed in a short time. In addition, since the dispenser does not scan the first element region or the second element region in the non-ejection state, it is possible to prevent the sealing material filled in the dispenser from dripping inadvertently. Therefore, the operation of the dispenser can be simplified, and variations in the viscosity of the sealing material and variations in the discharge amount can be suppressed.
Further, since the seal members of the first element region and the second element region formed by such a method are connected via the joint portion, the liquid crystal material can be prevented from leaking between adjacent regions. .

In the method for manufacturing a liquid crystal device of the present invention, the first seal member forming step is performed on one of the first base material and the second base material, and the second base material is subjected to the second base material. A sealing member forming step is performed. Further, the first seal member forming step and the second seal member forming step are performed only on one of the first base material and the second base material.
If it does in this way, the effect similar to said manufacturing method will be acquired.

The liquid crystal device of the present invention is a liquid crystal device comprising a first substrate and a second substrate opposed to the liquid crystal layer is sandwiched, and a sealing member formed on the periphery of the two substrates, Listed first
It was manufactured by the manufacturing method of .
In this way, since the annular portion is closed by a part of the joint, leakage of the liquid crystal material from the joint can be suppressed, and the reliability of the liquid crystal device can be improved. In addition, since the joined portion is formed outside the annular portion except for the portion that closes the annular portion, even if the width of the joined portion is increased by bonding the first substrate and the second substrate, It is only necessary to widen the width outside the portion, and the seal member can be prevented from protruding inside the annular portion. Therefore, the cell gap can be kept uniform without affecting the cell gap inside the annular portion. Moreover, compared with the prior art, it is not necessary to adjust the member width of each of the annular portion and the joint portion, and the annular portion and the joint portion can be formed with members having the same width.

In the liquid crystal device according to the aspect of the invention, the seal member may be a single member, the annular portion may hold the liquid crystal layer in a portion that is annularly surrounded by the one member, and the joint portion may be One end and the other end of the one member are joined at one place.
Here, “the seal member is composed of one member” means that the seal material is continuously discharged from the start end to the end, unlike the case formed by the first seal member and the second seal member described later. It means that formed by discharging a sealing material by so-called one-stroke writing.
In this way, not only the same effect as the liquid crystal device described above can be obtained, but also a liquid crystal device having a seal member in which the seal material is formed of one member can be realized. In addition, since the annular portion is closed by a joint portion where one end and the other end of the seal member are joined at one place, the number of joint portions can be minimized, as compared with the case where a plurality of joint portions are provided. Thus, it is possible to realize a liquid crystal device in which cell gap defects are more reliably suppressed.

In the liquid crystal device according to the aspect of the invention, the seal member includes a first seal member and a second seal member, and the annular portion is annularly surrounded by the first seal member and the second seal member. The liquid crystal layer is held in a portion, and the joining portion joins one end of the first seal member and the second seal member and joins the other end of the first seal member and the second seal member. It is characterized by that.
In this way, not only the same effects as the above-described liquid crystal device can be obtained, but also a liquid crystal device having a seal member formed by the first seal member and the second seal member can be realized. Further, in the case where the seal member is composed of only one member, it is difficult to form the annular portion or the joint portion by using different seal materials. However, according to the present invention, the first seal member and the second seal member A seal material can be selected for each. Thereby, either a 1st seal member or a 2nd seal member can be selected and formed only with respect to a specific site | part among the site | parts in which a seal member is formed.

According to another aspect of the invention, an electronic apparatus includes the liquid crystal device described above.
ADVANTAGE OF THE INVENTION According to this invention, the electronic device provided with the display part which is excellent in reliability and can obtain a high quality display is provided.

  Hereinafter, embodiments of a liquid crystal device, a method for manufacturing a liquid crystal device, and an electronic apparatus according to the present invention will be described with reference to the drawings. In each drawing used in the following description, the scale is different for each layer and each member so that each layer and each member can be recognized on the drawing.

(First embodiment)
First, the liquid crystal device according to the first embodiment of the present invention will be described.
The liquid crystal device of the present embodiment shown below is an example of an active matrix liquid crystal device using a thin film diode (hereinafter abbreviated as TFD) as a switching element, and is a transmissive type that enables transmissive display. This is a liquid crystal device.
FIG. 1 is a plan view of each component of the liquid crystal device according to the present embodiment as viewed from the counter substrate side, and FIG. 2 is a cross-sectional view taken along the line HH ′ of FIG. 3 is an enlarged plan view showing a region C in FIG. 1, and FIG. 4 is a plan view for explaining the configuration of the seal member in detail. FIG. 5 is an equivalent circuit diagram of various elements and wirings in a plurality of pixels formed in a matrix in the image display region 4 of the liquid crystal device. FIG. 6 is a diagram for explaining an electrode planar structure (pixel structure) of the various elements. FIG.

As shown in FIGS. 1 to 3, the liquid crystal device 100 of this embodiment includes a TFD substrate (first substrate) 10, a counter substrate (second substrate) 20, a seal member 52, and a liquid crystal layer 50 as main components. As prepared. Further, the seal member 52 is formed on the peripheral edge portions of the TFD substrate 10 and the counter substrate 20 and is sandwiched between the two substrates. Further, the liquid crystal layer 50 is sealed and held between the TFD substrate 10 and the counter substrate 20 and inside the seal member 52.
Next, each component will be described in detail.

The TFD substrate 10 is made of a transparent member such as a glass substrate, and has an image display region 4, a seal member 52, a peripheral parting member 53, a conduction pad (first conduction portion, conduction region) 54, a scanning signal on the surface thereof. A driving circuit 110 and a data signal driving circuit 120 are provided.
In the image display area 4, a plurality of dots are formed in a matrix, and the pixel electrode 31 and the TFD element 40 are formed for each dot. The pixel electrode 31 is composed of a transparent electrode mainly composed of ITO (indium tin oxide). The TFD element 40 is connected to the scanning signal driving circuit 110 via the SEG electrode 56, and the driving signal of the scanning signal driving circuit 110 is applied to the pixel electrode 31 as a potential. The surface layer of the pixel electrode 31 is formed with an alignment film in which a film mainly composed of polyimide is rubbed, and the alignment of liquid crystal molecules of the liquid crystal layer 50 to which no voltage is applied is aligned in the rubbing direction. It is designed to align. The peripheral parting member 53 is made of a light shielding material, and is formed between the image display region 4 and the seal member 52. As shown in FIG. 3, the conductive pad 54 is connected to the data signal driving circuit 120 via the lead wiring 55, and is connected to a COM electrode (second conductive portion, conductive region) 57 formed on the counter substrate 20 described later. It comes to connect. The scanning signal driving circuit 110 and the data signal driving circuit 120 are formed on one side (left side of the paper) of the TFD substrate 10. The SEG electrode 56 extending from the scanning signal driving circuit 110 overlaps with the seal member 52 (52a) between the scanning signal driving circuit 110 and the image display region 4. Further, the routing wiring 55 extending from the data signal driving circuit 120 overlaps with the seal member 52 (52a) between the data signal driving circuit 120 and the conductive pad 54.
Note that only part of each of the routing wiring 55, the conductive pad 54, and the COM electrode 57 in FIG. 3 is shown. Actually, the number of the lead wirings 55 is the same as the number of terminals of the data signal driving circuit 120, and a plurality of conductive pads 54 and COM electrodes 57 are arranged in the horizontal direction in FIG. Yes.

  In the counter substrate 20, a light shielding film 23 called a black matrix or black stripe is formed in a region facing the boundary region of the pixel electrode 9 on the TFD substrate 10, and the pixel electrode 9 made of an ITO film is formed on the upper layer side. Is formed. Further, on the upper layer side of the pixel electrode 9, an alignment film is formed by rubbing a film mainly composed of polyimide. Further, as shown in FIG. 3, a COM electrode 57 is formed outside the image display area 4 at a position where the pixel electrode 9 extends. The COM electrode 57 is formed so as to face the conductive pad 54, and a sealing member 52 b (described later) containing conductive particles is sandwiched between the COM electrode 57 and the conductive pad 54. Therefore, the drive signal of the data signal drive circuit 120 is applied as a potential to the pixel electrode 9 through the lead wiring 55, the conductive pad 54, the conductive particles, and the COM electrode 57.

The seal member 52 is formed of an insulating seal member (second seal member) 52a and a conductive seal member (first seal member) 52b.
Here, the insulating seal member 52a is a seal member having electrical insulation, and the conductive seal member 52b is a seal member having conductivity. The insulating seal member 52a is formed in a non-conduction region on the surface of the routing wiring 55 and the SEG electrode 56, and makes the plurality of wirings and the electrodes in the routing wiring 55 and the SEG electrode 56 non-conductive. Is. On the other hand, the conductive seal member 52b is formed in a conductive region on the surface of the conductive pad 54 and the COM electrode 57, and makes the conductive pad 54 and the COM electrode 57 conductive.

In addition, the conductive seal member 52b contains conductive particles, whereas the insulating seal member 52a does not contain the conductive particles. As such conductive particles, particles having a conductive material such as metal particles, particles having a resin surface plated, and the like are employed. Since the conductive particles have elasticity, when the TFD substrate 10 and the counter substrate 20 are bonded, the conductive pads 54 and the COM electrodes 57 press the conductive particles, and the conductive pads 54 are elastically applied. The COM electrode 57 can be made conductive.
In either of the insulating seal member 52a and the conductive seal member 52b, the main seal material is a thermosetting or ultraviolet curable resin material, or both thermosetting and ultraviolet curing depending on the curing process. A resin material having the following characteristics is employed. In this embodiment, World Lock No. 717 (manufactured by Kyoritsu Chemical) is used for the seal member 52. The viscosity of the material is 400,000 mPa · s, and the thickness of the seal member 52 after bonding is 8 μm.

  Further, the insulating seal member 52a and the conductive seal member 52b are formed in a pattern as shown in FIG. 4, so that a single annular portion 58 for holding the liquid crystal layer 50 inside, the insulating seal member 52a, And a joint portion 59 to which the conductive seal member 52b is joined. The seal member 52 formed in such a pattern is formed in a closed frame shape in a region within the surface of the TFD substrate 10 and does not include a liquid crystal injection port. Further, the seal member 52 is crushed by being pressed by the TFD substrate 10 and the counter substrate 20 after discharging a seal material from the dispenser toward the TFD substrate 10 and the counter substrate 20 as will be described later. The cell gap is maintained.

In the annular portion 58, the insulating seal member 52a is formed so as to pass through the point RSTO in FIG. 4, and the conductive seal member 52b is formed so as to pass through the point OPQR in FIG. Yes.
In the joint portion 59, the insulating seal member 52a and the conductive seal member 52b are joined at points O and R. Accordingly, the joint portion 59 is formed at one place on the side TP side of the annular portion and at one place on the side SQ side. In other words, it is formed on each of the opposing sides of the annular portion 58.
Further, the joint portion 59 is formed continuously with the annular portion 58 and closes the annular portion 58 at points O and R. As a result, it is possible to prevent the liquid crystal layer 50 held inside the annular portion 58 from leaking to the outside of the seal member 52. Further, a part of the joint part 59 is integrated with the annular part 58 at the points O and R, and the other part of the joint part 59 is formed outside the annular part 58. In other words, the joint portion 59 is formed from the portion (points O and R) blocking the annular portion 58 toward the outside of the annular portion 58. Accordingly, the joining portion 59 is not formed so as to overlap the annular portion 58, but only a part of the joining portion 59 joins the annular portion 58 and the other portion is formed toward the outside of the annular portion 58. It has become.
Further, as shown in FIG. 3, the joint portion 59 extends from the end (reference A) of the conductive pad 54 to the end portion (reference B) where the routing wiring 55 crosses the seal member 52, that is, the reference L Is formed in the portion shown in FIG. In the liquid crystal device 100 of the present embodiment, the distance of the symbol L is set to 2 mm or less.
Further, as will be described later, the joint portion 59 discharges from the dispenser so that each of the insulating seal member 52a and the conductive seal member 52b overlaps, and then presses the seal members 52a and 52b through a bonding process. , Formed by bonding.

  The liquid crystal layer 50 is located inside the annular portion 58. For example, ejection is formed by an ink jet method (droplet ejection method) or a dispenser method. Further, the layer thickness of the liquid crystal layer 50 is determined so as to have a predetermined cell gap in relation to the thickness of the seal member 52. Further, the liquid crystal layer 50 depends on the operation mode of the liquid crystal device 100, for example, depending on the operation mode such as TN (Twisted Nematic) mode, STN (Super Twisted Nematic) mode, or normally white mode / normally black mode. A material is appropriately selected.

Next, the image display area 4 of the liquid crystal device 100 will be described in detail.
As shown in the equivalent circuit of FIG. 5, the liquid crystal device 100 is provided with a plurality of scanning lines 13 and a plurality of data lines (pixel electrodes) 9 intersecting the scanning lines 13, and the scanning lines 13 are driven by scanning signals. The data line 9 is driven by the data signal driving circuit 120 by the circuit 110. Here, the scanning line 13 is connected to the SEG electrode 56 outside the image display region 4. In each pixel region 150, the TFD element 40 and the liquid crystal display element 160 (liquid crystal layer 50) are connected in series between the scanning line 13 and the data line 9. In FIG. 5, the TFD element 40 is connected to the scanning line 13 side and the liquid crystal display element 160 is connected to the data line 9 side. On the contrary, the TFD element 40 is connected to the data line 9 side and the liquid crystal display element 160 is connected to the data line 9 side. The display element 160 may be provided on the scanning line 13 side.

  Further, as shown in the electrode plan view of FIG. 6, in the liquid crystal device 100, the pixel electrodes 31 having a rectangular shape in plan view connected to the scanning lines 13 via the TFD elements 40 are provided in a matrix. The pixel electrode 9 is provided in a strip shape (stripe shape) so as to face the pixel electrode 31 in the direction perpendicular to the paper surface. The pixel electrode 9 is formed of a data line and has a stripe shape that intersects the scanning line 13. In the present embodiment, each region in which each pixel electrode 31 is formed is one dot region, and each dot region arranged in a matrix is provided with a TFD element 40, and display is possible for each dot region. It has a structure.

Here, the TFD element 40 is a switching element that connects the scanning line 13 and the pixel electrode 31, and the TFD element 40 is formed on the surface of the first conductive film having Ta as a main component and the first conductive film. And an MIM structure including an insulating film containing Ta ₂ O ₃ as a main component and a second conductive film formed on the surface of the insulating film and containing Cr as a main component. The first conductive film of the TFD element 40 is connected to the scanning line 13 and the second conductive film is connected to the pixel electrode 31.

  Instead of forming the scanning signal driving circuit 110 and the data signal driving circuit 120 on the TFD substrate 10, for example, a TAB (Tape Automated Bonding) substrate on which a driving LSI is mounted and a peripheral portion of the TFD substrate 10 are formed. The terminal group thus formed may be electrically and mechanically connected via an anisotropic conductive film. In the liquid crystal device 100, depending on the type of the liquid crystal layer 50 to be used, that is, depending on the operation mode such as TN (Twisted Nematic) mode, STN (Super Twisted Nematic) mode, or normally white mode / normally black mode. A retardation plate, a polarizing plate, and the like are arranged in a predetermined direction, but the illustration is omitted here. In the case where the liquid crystal device 100 is configured for color display, for example, red (R), green (G), blue ( A color filter B) and a protective film for protecting the color filter are formed.

Next, a manufacturing method of the liquid crystal device according to the first embodiment of the present invention will be described.
First, in the following description, (1) a schematic description of a manufacturing method of a liquid crystal device, (2) a device manufacturing device, and (3) a detailed description of a manufacturing method of a liquid crystal device will be sequentially described.

(1) Schematic Description of Manufacturing Method of Liquid Crystal Device FIG. 7 is a diagram for schematically explaining a manufacturing method of a liquid crystal device.
First, as shown in FIG. 7A, a mother substrate (first base material) 10 ′ for a TFD substrate and a mother substrate (second base material) 20 ′ for a counter substrate are prepared.
In the mother substrate (first base material) 10 ′ for the TFD substrate, a plurality of TFD formation regions (first element regions) 11 are defined and formed. Further, the periphery of the partitioned TFD formation region 11 becomes a mutual boundary portion 12. Then, by performing a semiconductor manufacturing process including a well-known photolithography technique on the mother substrate 10 ′ for the TFD substrate, the TFD 40, the pixel electrode 31, the conductive pad 54, the lead wiring 55, and the SEG electrode 56 are formed in the TFD formation region 11. , An alignment film, and the like are formed. Note that the scanning signal driving circuit 110 and the data signal driving circuit 120 may be simultaneously formed in the TFD formation region 11.

On the other hand, the counter substrate mother substrate 20 ′ is formed by partitioning a plurality of counter electrode formation regions (second element regions) 21. Further, the periphery of the partitioned counter electrode forming region 21 is a mutual boundary portion 22. Then, by performing a semiconductor manufacturing process including a known photolithography technique on the counter substrate mother substrate 20 ′, the pixel electrode 9, the COM electrode 57, the alignment film, and the like are formed in the counter electrode formation region 21.
Here, the number of each of the TFD formation region 11 and the counter electrode formation region 21 is the same. In addition, when the TFD substrate mother substrate 10 ′ and the counter substrate mother substrate 20 ′ are bonded together, the regions 11 and 21 are aligned with each other with high accuracy.

Next, as shown in FIG. 7B, the mother substrate 10 ′ for the TFD substrate and the mother substrate 20 ′ for the counter substrate are bonded together. Here, the mother substrate 10 ′ for the TFD substrate and the mother substrate 20 ′ for the counter substrate are bonded together in a state where the seal member 52 and the liquid crystal layer 50 described later are sandwiched.
Next, as shown in FIG. 7C, in a state where the mother substrates 10 ′ and 20 ′ are bonded together, the mother substrates 10 ′ and 20 ′ are divided and cut out at the mutual boundary portions 12 and 22, so The liquid crystal device 100 is formed.

(2) Device Manufacturing Device Next, in the manufacturing of the liquid crystal device 100, a device manufacturing device that performs processes ranging from the formation of the sealing member 52 to the formation of the liquid crystal layer 50 by liquid crystal dropping, substrate bonding, and curing of the sealing member 52. Will be described.

FIG. 8 is a schematic configuration diagram of the device manufacturing apparatus 61.
As shown in FIG. 8, the device manufacturing apparatus 61 mainly includes a substrate supply / removal unit 62 that supplies and removes substrates, a material supply unit 63, a substrate bonding unit 64, and a precision alignment unit 164. Yes.

FIG. 9 is a schematic configuration diagram of the substrate supply / removal unit 62 and the material supply unit 63. In the following description, the direction along the surface of the substrate is defined as the X direction (for example, the left-right direction in FIG. 9) and the Y direction (for example, the direction perpendicular to the paper surface in FIG. 9), and the direction orthogonal to the XY plane is Z. This will be described as a direction.
As shown in FIG. 9, the material supply unit 63 holds a substrate and is movable in the X direction, the Y direction, and the θ direction (rotation direction around an axis parallel to the Z axis), and an upper portion of the table 65. A liquid droplet discharge head 66 that discharges and drops a liquid crystal material (electro-optical material), and seal material application portions 67a and 67b that are provided in the vicinity of the liquid droplet discharge head 66 and apply a seal material. It is configured.

The sealing material applied from the sealing material applying portions 67a and 67b includes a substantially spherical gap control material, and the diameter of the gap control material maintains the cell gap of the substrate at a predetermined thickness (for example, 3 μm). It is formed to a dimension that can be formed (for example, a diameter of 8 μm). The diameter of the gap control material (about 8 μm) is set to maintain the thickness (about 5 μm) and the cell gap (3 μm) of the color filter or the like in the display area.
The sealing material application part 67a applies the insulating sealing member 52a, and the sealing material application part 67b applies the conductive sealing member 52b.
In addition to the droplet discharge head 66, any device that can control the amount of liquid crystal material to be dropped, such as a precision chemical dispenser (measuring dispenser), may be used to drop the liquid crystal material. . In addition, the gap control material is formed in a substantially spherical shape, and is not limited to that included in the sealing material, but is formed in a fiber shape and included in the sealing material, or is not included in the sealing material and protrudes in a columnar shape from the substrate. However, it is preferable to use one that is fixed at a predetermined position on the substrate and does not move on the substrate when the substrates are bonded together.

Further, the substrate supply / removal unit 62 includes a carrier for transporting the substrate between the material supply unit 63 and the substrate bonding unit 64 and between the substrate bonding unit 64 and the precision alignment unit 164 as main components. .
In addition to the configuration shown in FIG. 9, the substrate supply / removal unit 62 includes a transfer robot and a unit having a transfer function for connecting the material supply unit 63, the substrate bonding unit 64, and the precision alignment unit 164. It may be comprised.

FIG. 10 is a schematic configuration diagram of the substrate bonding portion 64.
As shown in FIG. 10, the substrate bonding unit 64 includes a table 68 that holds the substrate and is movable in the X direction, the Y direction, and the θ direction, a lower chuck unit 69 installed on the table 68, and a lower chuck. A vacuum chamber 70 disposed above the portion 69, an upper chuck portion 71 disposed in the vacuum chamber 70 so as to face the lower chuck portion 69, and the upper chuck portion 71 movably supported in the Z direction. A lowering mechanism 72 that pressurizes the portion 69 is provided.
On the wall surface of the vacuum chamber 70, a viewing window 70a and an exhaust part 76 are disposed. Optical measurement provided with a bonding microscope 74 for enlarging and observing the alignment mark on the substrate via the sighting window 70a and a CCD camera 81 for capturing an image of the alignment mark observed under the sighting window 70a. Means are provided. A suction device 78 having a vacuum pump or the like for exhausting (evacuating) the gas in the accommodation space 70b is connected to the exhaust unit 76.

Further, the vacuum chamber 70 is provided with a UV irradiation unit 82. The UV irradiation unit 82 is provided with a UV lamp such as a mercury lamp that emits ultraviolet rays for temporarily curing the seal member 52, and is provided with a light guide means such as a fiber as necessary.
The UV irradiation unit 82 only needs to supply energy that increases the viscosity of the seal member 52. The means for applying energy to the seal member 52 is not limited to the UV lamp, and various devices such as a heating / cooling device and a visible light irradiation device can be used depending on the properties of the seal member 52.

  Further, the substrate bonding unit 64 controls the image processing unit 83 that processes the image captured by the CCD camera 81, and the table 68 and the lowering mechanism 72 based on the image information processed by the image processing unit 83. A control unit 84 is provided.

Further, the lower chuck portion 69 and the upper chuck portion 71 are provided with holding mechanisms (not shown) for holding the substrates by holding surfaces 69a and 71a facing each other.
The lower chuck portion 69 and the upper chuck portion 71 are mechanisms that can hold the substrate even in a substantially vacuum atmosphere, such as a chuck mechanism using electrostatic force or adhesive force, or a mechanical holding mechanism that mechanically holds the substrate. Any mechanism may be provided as long as it is present. Also, a holding method such as adhesive force, intermolecular force, vacuum force, or mechanical holding may be used.

FIG. 11 is a schematic configuration diagram of the precision alignment unit 164.
The precision alignment unit 164 includes a table 168 that holds the substrate and is movable in the X direction, the Y direction, and the θ direction, a lower chuck unit 169 that is installed on the table 168, and an upper surface that faces the lower chuck unit 169. A chuck unit 171, a pressurizing mechanism 172 that supports the upper chuck unit 171 so as to be movable in the Z direction and pressurizes the lower chuck unit 169, and an alignment microscope 174 that expands and observes the alignment mark on the substrate. , And a UV lamp 182 such as a mercury lamp that irradiates ultraviolet rays for curing the sealing member 52. The alignment microscope 174 constitutes the optical measurement means of the present apparatus together with the CCD camera 181 that captures the image of the alignment mark that has been observed in an enlarged manner.
Further, the precision alignment unit 164 is provided with an image processing unit 183 that processes an image captured by the CCD camera 181 and a control unit 184 that controls the table 168 based on the image information processed by the image processing unit 183. ing.

The lower chuck portion 169 and the upper chuck portion 171 are provided with suction mechanisms (not shown) for vacuum-sucking the substrate with the holding surfaces 169a and 171a facing each other.
Note that the lower chuck portion 169 and the upper chuck portion 171 are formed by attaching a bonded substrate such as a chuck mechanism using electrostatic force or adhesive force, or a mechanical holding mechanism that mechanically holds the substrate in the X-axis and Y-axis directions. Any mechanism may be provided as long as the mechanism can exhibit a sufficient holding force to move it.
The precision alignment unit 164 may not include the pressurizing mechanism 172 that pressurizes the upper chuck unit 171 toward the lower chuck unit 169.
The UV lamp 182 only needs to cure the seal member 52. In addition to the UV lamp 182, various devices such as a heating / cooling device and a visible light irradiation device may be used depending on the properties of the seal member 52. Can do.

As the droplet discharge head 66 shown in FIG. 9, for example, a droplet discharge head having the configuration shown in FIG. 12 can be used. A reservoir 95 and a plurality of ink chambers (pressure generation chambers) 93 are formed in the head main body 90 of the droplet discharge head 66. The reservoir 95 is a flow path for supplying ink containing an electro-optic material such as liquid crystal to each ink chamber 93. In addition, a nozzle plate constituting the ink ejection surface 66P is attached to one end surface of the head body 90. In the nozzle plate, a plurality of nozzles 91 for discharging ink are opened corresponding to each ink chamber 93. A flow path is formed from each ink chamber 93 toward the corresponding nozzle 91. On the other hand, a diaphragm 94 is attached to the other end surface of the head body 90.
This diaphragm 94 constitutes the wall surface of the ink chamber 93. Piezo elements (pressure generating means) 92 are provided outside the vibration plate 94 so as to correspond to the ink chambers 93. The piezo element 92 is obtained by sandwiching a piezoelectric material such as quartz with a pair of electrodes (not shown).

  FIG. 13 is a schematic diagram showing the drive voltage waveform W1 of the piezoelectric element and the operation of the droplet discharge head 66 corresponding to the drive voltage. Below, the case where the drive voltage of the waveform W1 is applied with respect to a pair of electrode which comprises the piezo element 92 is demonstrated. First, in the positive gradient portions a 1 and a 3, the piezo element 92 contracts to increase the volume of the ink chamber 93, and ink flows from the reservoir 95 into the ink chamber 93. In the negative gradient portion a <b> 2, the piezo element 92 expands to reduce the volume of the ink chamber 93, and the pressurized ink 99 is ejected from the nozzle 91. The amount of ink applied is determined by the amplitude of the drive voltage waveform W1 and the number of applications.

  The driving method of the droplet discharge head 66 is not limited to the piezo jet type using the piezo element 92, and for example, a thermal ink jet type using thermal expansion may be adopted. It is also possible to employ a coating means other than an ink jet head as the liquid crystal coating means. For example, a dispenser can be employed as the liquid crystal application means other than the inkjet head. Since the dispenser has a nozzle having a larger diameter than that of the ink jet head, it is possible to discharge liquid crystal having a high viscosity.

(3) Detailed Description of Manufacturing Method of Liquid Crystal Device Next, a procedure for manufacturing the liquid crystal device 100 by the device manufacturing apparatus 61 will be described with reference to FIGS.
In the following description, it is assumed that the pixel electrodes 9 and 31 described with reference to FIG. 7A are already formed on the mother substrate 10 ′ for the TFD substrate and the mother substrate 20 ′ for the counter substrate.

First, as shown in FIG. 14A, the mother substrate 10 ′ for the TFD substrate on which the pixel electrodes 31 and the like are formed is transported by the substrate supply / removal unit 62, and the material is placed with the sealing surface 10′a facing upward. The material is supplied onto the table 65 of the supply unit 63. Thereafter, while the table 65 is moved, the sealing material is applied from the sealing material application portion 67a onto the TFD substrate mother substrate 10 ', and further, the sealing material is applied from the sealing material application portion 67b, thereby the TFD substrate. A seal member 52 is formed on the mother substrate 10 '(seal member forming step). Here, the seal member 52 is formed by the insulating seal member 52a and the conductive seal member 52b. The insulating seal member 52a is applied by the seal material application part 67a, and the conductive seal member 52b is applied by the seal material application part 67b.
Here, a method for forming the seal member 52 will be described in detail.

  FIG. 17 is a plan view for explaining a method for forming the seal member 52. 18 is a plan view showing the sealing member 52 formed on the mother substrate, FIG. 18A is an external view of the mother substrate, and FIG. 18B is an enlarged view of the symbol E in FIG. 18A. FIG. 18C is an enlarged view of the symbol F in FIG.

As shown in FIG. 17A, an insulating seal member 52a is applied in the direction indicated by the symbol U on the mother substrate 10 'for a TFD substrate (second seal member forming step). Here, as described above, a plurality of TFD formation regions 11 and mutual boundary portions 12 are formed in advance on the TFD substrate mother substrate 10 ', and the insulating seal member 52a is continuously and collectively straddling them. Applied. Further, the direction indicated by the symbol U indicates the same direction as the direction in which the plurality of TFD formation regions 11 are arranged.
Here, by applying and forming the insulating seal member 52a, a first side 58a that becomes a part of the annular portion 58 is formed on the side of the TFD forming region 11, and the mutual boundary portion 12 includes the first side 58a. A first seal layer 59a formed continuously with 58a is formed. Here, the first seal layer 59a is formed in the recess W that is recessed toward the TFD formation region 11 with respect to the extending axis direction (reference symbol U) of the first side 58a in the mutual boundary portion 12. Yes. The concave portion W has a so-called “U” shape.

Next, as shown in FIG. 17B, a conductive seal member 52b is applied in the direction indicated by the reference symbol V on the TFD substrate mother substrate 10 '(first seal member forming step). Also in this step, the conductive seal member 52b is continuously and collectively applied so as to straddle the plurality of TFD formation regions 11 and the mutual boundary portions 12 in the same manner as described above. Further, the direction indicated by the reference sign V indicates the same direction as the direction in which the plurality of TFD formation regions 11 are arranged.
Here, when the conductive seal member 52b is applied and formed, the second side 58b which becomes a part of the annular portion 58 is formed in the axial direction orthogonal to the extending axis (reference numeral V) of the first side 58a. A third side 58c that is formed and is opposite to the first side 58a is formed on the side of the TFD formation region 11. Further, a second seal layer 59b formed continuously from the second side 58b is formed at the mutual boundary portion 12. Here, the second seal layer 59b is formed in the recess X that is recessed toward the TFD formation region 11 with respect to the extending axis direction of the third side 58c in the mutual boundary portion 12. The concave portion X has a so-called “U” shape.

  And in the recessed parts W and X formed in U shape, the 1st seal layer 59a and the 2nd seal layer 59b are formed so that it may mutually overlap. Further, the insulating seal member 52 a formed as described above constitutes a part of the annular portion 58, and the conductive seal member 52 b constitutes the remaining portion of the annular portion 58. Further, the first seal layer 59a and the second seal layer 59b are to be joined portions 59 formed in the mutual boundary portion 12 by performing a bonding process described later.

In the present embodiment, the insulating seal member 52a is applied in the direction indicated by the reference symbol U, and the conductive seal member 52b is applied in the direction indicated by the reference symbol V opposite to the reference symbol U. Not what you want. The insulating seal member 52a and the conductive seal member 52b may be applied and formed in the same direction.
Further, in this embodiment, as indicated by the symbols U and V, the insulating seal member 52a and the conductive seal member 52b are formed in the vertical direction on the paper surface, but these may be formed in the horizontal direction on the paper surface. In any case, the insulating seal member 52a and the conductive seal member 52b are formed in the direction in which the plurality of TFD formation regions 11 are arranged.
Further, in the present embodiment, the line widths of the seal members 52a and 52b are the same, but depending on the portion where the seal members 52a and 52b are formed or pasted. Each line width may be varied depending on the shape of the joint portion 59 formed by the alignment.
In the present embodiment, the first side 58a and the first seal layer 59a are formed first, and then the second side 58b and the second seal layer 59b are formed. However, this is limited. It is not a thing. The second side 58b and the second seal layer 59b may be formed first, and then the first side 58a and the first seal layer 59a may be formed.

  By such a method of forming the seal member 52, a plurality of TFD formation regions 11 in which the insulating seal member 52a and the conductive seal member 52b are applied and formed on the mother substrate 10 'for a TFD substrate shown in FIG. Is formed. Further, as shown in FIG. 18B, a part of the TFD formation region 11 is formed by the insulating seal member 52a, and the remaining part is formed by the conductive seal member 52b. As a result, the annular portion 58 including the seal members 52a and 52b is formed. Further, as shown in FIG. 18C, each of the insulating seal member 52a and the conductive seal member 52b has a first seal layer 59a and a second seal layer 59b that overlap each other in the recesses W and X. . The first seal layer 59a and the second seal layer 59b have symmetrical left and right curved portions 59c. As will be described later, the first seal layer 59a and the second seal layer 59b are crushed and joined by bonding the mother substrate 10 ′ for the TFD substrate and the mother substrate 20 ′ for the counter substrate, and the above-mentioned A joint portion 59 shown in FIG. 4 is formed.

Next, with reference to FIG.18 (c), the shape dimension of the 1st sealing layer 59a and the 2nd sealing layer 59b is demonstrated. Below,
R3: radius d3 of the curved portion 59c: distance w3 between the center lines of the first seal layer 59a and the second seal layer 59b: defined as the width of the seal members 52a, 52b after the bonding step. Then
In this embodiment,
The relationship is established. Furthermore,
The relationship is established.

  In this way, as will be verified in the examples described later, even if the thickness of the seal members 52a and 52b varies, the first seal layer 59a and the second seal layer 59b are reliably bonded. Thus, the joint portion 59 can be formed. In addition, it is possible to draw the seal members 52a and 52b at the same speed in all the parts, and the writing start part and the writing end part are parts sufficiently away from the liquid crystal device, so that complicated control is required. Disappear. With these effects, the drawing time can be significantly shortened to 1/2 to 1/3 of the conventional one, and the thickness of the sealing members 52a and 52b in the inner direction of the liquid crystal device 100 at the joint portion 59 can be eliminated.

Next, returning to FIG. 14, the manufacturing method of the liquid crystal device will be described.
As shown in FIG. 14B, the liquid crystal 50 is dropped from the droplet discharge head 66 in a state where the TFD substrate mother substrate 10 ′ is supplied on the table 65 in the material supply unit 63. Specifically, liquid crystal 50 is discharged and dropped from the droplet discharge head 66 while moving the table 65 with the sealing surface 10′a facing upward, and the liquid crystal 50 is placed at a predetermined position on the sealing surface 10′a. Place. The liquid crystal 50 is dropped on the annular portion 58 for each of the plurality of TFD formation regions 11.
Moreover, in this embodiment, it is preferable that the viscosity of the liquid crystal 50 dropped on the sealing surface 10′a of the mother substrate 10 ′ for the TFD substrate is 130 Pa · s to 250 Pa · s. By setting the viscosity of the liquid crystal 50 within the above range, it is possible to effectively prevent the liquid crystal 50 from spreading to the adhesion region between the sealing members 52a and 52b and the TFD substrate mother substrate 10 ′. ', 20' can be securely bonded.

Next, as shown in FIG. 14 (c), the counter substrate mother substrate 20 ′ is transported by the substrate supply / removal unit 62 and the upper and lower surfaces thereof are inverted, and the material is supplied to the upper chuck unit 71 of the substrate bonding unit 64. Is done. Then, it is held on the holding surface 71a by the holding mechanism.
On the other hand, the mother substrate 10 ′ for the TFD substrate on which the sealing members 52a and 52b and the liquid crystal 50 are arranged is transported by the substrate feeding / unloading unit 62, supplied to the chuck unit 69 of the substrate bonding unit 64, and held by the holding mechanism. 69a.

  In the case of the present embodiment, the material supply to the substrate bonding portion 64 of the counter substrate mother substrate 20 ′ is performed prior to the material supply of the TFD substrate mother substrate 10 ′. Accordingly, the mother substrates 10 ′ and 20 ′ can be bonded together while maintaining the cleanliness of the sealing surfaces 10′a and 20′a of the mother substrate 10 ′ for the TFD substrate and the mother substrate 20 ′ for the counter substrate. It is like that. If the TFD substrate mother substrate 10 ′ held by the lower chuck portion 69 is supplied to the substrate bonding portion 64 first, the supply of the counter substrate mother substrate 20 ′ to the upper chuck portion 71 is already performed. This is not preferable because foreign substances may accumulate on the liquid crystal 50 disposed on the mother substrate 10 ′ for the TFD substrate and the sealing surface 10′a.

In the present embodiment, the single material supply unit 63 performs the placement process of the seal members 52a and 52b and the placement process of the liquid crystal 50 on the mother substrate 10 'for the TFD substrate. An arrangement process of the sealing members 52 a and 52 b and the liquid crystal 50 can be performed using the supply unit 63. In this case, since the two steps can be performed in parallel, the throughput can be improved.
In this embodiment, the seal members 52a and 52b are formed on the mother substrate 10 ′ for the TFD substrate, but the seal members 52a and 52b may be formed on the mother substrate 20 ′ for the counter substrate. In this case, each of the sealing members 52 a and 52 b is continuously and collectively formed so as to straddle the plurality of counter electrode forming regions 21 and the mutual boundary portion 22. In this case, it is preferable that the reversing operation of the counter substrate mother substrate 20 ′ by the substrate supply / removal unit 62 is performed immediately after the substrate is discharged from the material supply unit 63. The sealing members 52a and 52b spread on the mother substrate 20 ′ for the counter substrate with the lapse of time after application, and the application height decreases. In particular, when the viscosity of the seal member 52 is 200,000 cps or less, the change in the coating height becomes significant. Therefore, the counter substrate mother substrate 20 ′ is inverted and held immediately after the application of the seal members 52a and 52b, thereby suppressing the spread of the seal members 52a and 52b and reducing the “sag” of the seal material. it can. As a result, the bonding strength between the counter substrate mother substrate 20 ′ and the TFD substrate mother substrate 10 ′ can be maintained, and a liquid crystal device with excellent reliability can be manufactured.
Further, one of the seal members 52a and 52b may be formed on the mother substrate 10 ′ for the TFD substrate, and the other may be formed on the mother substrate 20 ′ for the counter substrate. Also in this case, the TFD substrate mother substrate 10 ′ and the counter substrate mother substrate 20 ′ are bonded together while reducing the “sag” of the sealing material as described above. In addition, the bonding is performed after the sealing members 52a and 52b are positioned so as to be aligned.

Thereafter, as shown in FIG. 15A, the vacuum chamber 70 is lowered and brought into contact with the lower chuck portion 69 to close the housing space 70b in a sealed state. When the accommodation space 70b is in a sealed state, negative pressure is sucked from the exhaust part 76 to make the inside of the accommodation space 70b substantially vacuum (1.33 Pa to 1.33 × 10 ⁻² Pa).

  When the inside of the accommodation space 70b is in a substantially vacuum state, as shown in FIG. 15B, alignment marks (not shown) formed on the counter substrate mother substrate 20 ′ and the TFD substrate mother substrate 10 ′ are provided. The image is magnified using the bonding microscopes 74 and 74 and taken into the CCD camera 81. The image data of the alignment mark captured by the CCD camera 81 is input to the image processing unit 83, and the image processing unit 83 detects the relative position between the counter substrate mother substrate 20 ′ and the TFD substrate mother substrate 10 ′. The The control unit 84 drives the table 68 based on the relative position detected by the image processing unit 83 to horizontally move the counter substrate mother substrate 20 ′, and the deviation of the relative position with respect to the TFD substrate mother substrate 10 ′ is ±. Rough positioning is performed so that the distance is within 10 μm.

Note that the evacuation in the housing space 70b and the rough positioning of the mother substrates 10 ′ and 20 ′ may be performed simultaneously, or the rough positioning is performed first and the evacuation is performed later. May be. When evacuation and rough positioning are performed at the same time, the manufacturing time can be shortened.
Further, a through hole 71b is formed in the upper chuck portion 71 at a position directly below the bonding microscope 74 and the observation window 70a, and alignment marks of the mother substrates 10 ′ and 20 ′ are formed through the through hole 71b. Is supposed to be detected.

When the mother substrates 10 ′ and 20 ′ are roughly positioned, as shown in FIG. 15C, the lower chuck 72 lowers (relatively moves) the upper chuck portion 71 and attaches the opposing mother substrates 10 ′ and 20 ′. Match. Further, the upper chuck portion 71 is lowered toward the lower chuck portion 69, and pressurizes the mother substrates 10 'and 20' to compress the seal member 52 to a predetermined thickness.
When the bonding of the mother substrates 10 ′ and 20 ′ is completed, the UV irradiation unit 82 irradiates ultraviolet rays to temporarily cure the seal member 52, thereby increasing the viscosity of the seal material.

The pressurization after bonding the mother substrates 10 ′ and 20 ′ may not be performed depending on the manufacturing process and the selection of the seal members 52a and 52b. Similarly, the temporary curing of the sealing member 52 by the UV irradiation unit 82 may not be performed depending on the sealing member 52.
In addition, if the occurrence of positional deviation between the two substrates is expected between the pasting and the precise alignment described later, and the deviation width and direction are statistically expected, the mother substrate after the positional deviation has occurred Rough positioning may be performed by offsetting in advance so that the positional relationship of 10 ′ and 20 ′ falls within the above-described range.

  Thereafter, the atmosphere is introduced into the accommodation space 70b, and the pressure is returned from the substantially vacuum state to the atmospheric pressure. When the accommodating space 70b of the vacuum chamber 70 becomes atmospheric pressure, the mother substrates 10 'and 20' are pressed by the pressure difference, and the seal member 52 is further compressed. Thereafter, the holding of the upper chuck portion 71 and the lower chuck portion 69 is released, and the vacuum chamber 70 is raised as shown in FIG. Then, the substrate (in this case, the liquid crystal device 100 on which the mother substrates 10 ′ and 20 ′ are bonded together) placed in the non-holding state on the lower chuck portion 69 is removed by the substrate supply / removal unit 62.

The bonded mother substrates 10 ′ and 20 ′ are conveyed to the precision alignment unit 164 by the substrate supply / removal unit 62, and the counter substrate mother substrate 20 ′ is moved to the upper chuck unit 171 side as shown in FIG. The TFD substrate mother substrate 10 ′ is fed so as to be on the lower chuck portion 169 side. The upper chuck portion 171 and the lower chuck portion 169 vacuum-suck the counter substrate mother substrate 20 ′ and the TFD substrate mother substrate 10 ′ by a suction mechanism provided respectively.
When the holding of the mother substrate 10 'for the TFD substrate and the mother substrate 20' for the counter substrate is completed, alignment marks (not shown) formed on both the mother substrates 10 'and 20' are subjected to an alignment microscope under atmospheric pressure. The images are taken into the CCD cameras 181 and 181 via 174 and 174, respectively. The image data of the alignment mark captured by the CCD camera 181 is input to the image processing unit 183, and the relative position between the counter substrate mother substrate 20 ′ and the TFD substrate mother substrate 10 ′ is detected. The control unit 184 drives the table 168 based on the relative position detected by the image processing unit 183 so that the deviation of the relative position between the counter substrate mother substrate 20 ′ and the TFD substrate mother substrate 10 ′ is within ± 1 μm. Precise positioning so that
Further, a through hole 171b is formed in the upper chuck portion 171 at a position directly below the alignment microscope 174, and the alignment marks of the mother substrates 10 ′ and 20 ′ are detected via the through hole 171b. It has become.

When both the mother substrates 10 ′ and 20 ′ are precisely positioned, the upper chuck portion 171 is further lowered (relatively moved) by the pressurizing mechanism 172 to pressurize the mother substrates 10 ′ and 20 ′ that are opposed to each other. Then, the seal member 52 is further compressed, and the gap control member 52c included in the seal members 52a and 52b comes into contact with the mother substrates 10 ′ and 20 ′, so that the distance between the mother substrates 10 ′ and 20 ′ becomes approximately 3 μm or less. Adjusted as follows.
Note that the pressurizing method by the pressurizing mechanism 172 includes a pressurizing method that applies a pressing force in a lump, a pressurizing method that increases the pressing force stepwise, a pressurizing method that continuously increases the pressing force, Pressurization may be performed by various pressurization methods such as S-shaped pressurization in which the pressing force is temporarily held and then the pressing force is increased.

  In addition, the region where the upper chuck portion 171 and the lower chuck portion 169 are in contact with and press against the mother substrate 20 ′ for the counter substrate and the mother substrate 10 ′ for the TFD substrate may be pressed over the entire contact surface. Alternatively, only the region where the gap control member 52c included in the seal member 52 is disposed may be contacted and pressed. In the method of pressing only the region where the gap control material 52c is disposed, the region where the gap control material 52c is not disposed is not pressed, so that the gap between the substrates is reduced due to the bending of both the mother substrates 10 ′ and 20 ′, It is possible to prevent the structural members from being damaged by the spacers arranged on the substrate.

When the gap between the two mother substrates 10 ′ and 20 ′ is adjusted, the UV lamp 182 irradiates the sealing member 52 with ultraviolet rays to be cured, and holds the gap between the two mother substrates 10 ′ and 20 ′.
Note that the UV lamp 182 is irradiated immediately after the pressing force of the pressurizing mechanism 172 reaches a predetermined pressure, or left for a predetermined time, and waits until the liquid crystal 50 reaches every corner of the TFD formation region 11. Irradiation may be performed at various timings. Further, depending on the seal material used, a process for curing the seal member may be further added in order to obtain a necessary adhesive force.

When the curing of the seal members 52a and 52b is completed, the holding by the upper chuck portion 171 and the lower chuck portion 169 is sequentially released vertically or simultaneously, and the liquid crystal device 100 placed in the non-holding state on the lower chuck portion 69 is mounted on the substrate. The material is removed by the feeding / dispensing unit 62.
Then, as shown in FIG. 7C, the mother substrates 10 ′ and 20 ′ are cut out to complete the manufacture of the liquid crystal device 100.

In the present embodiment, the bonding process shown in the following [1] to [8] is performed using the device manufacturing apparatus 61.
[1] Mother boards 10 ′ and 20 ′ are set on a table [2] Vacuum is drawn in the accommodation space 70b [3] Mother boards 10 ′ and 20 ′ are roughly positioned [4] Temporary fixing by UV irradiation [5] Accommodation space 70b [6] The mother substrates 10 ′ and 20 ′ are fixed by precise positioning [8] UV irradiation. The present invention does not limit such a bonding step. Absent. For example, you may perform the bonding process shown to following [1]-[11].
[1] Set the mother substrates 10 ′ and 20 ′ on the table [2] Vacuum in the accommodation space 70b [3] Lower the upper chuck portion 71 to a certain position [4] Roughly position the mother substrates 10 ′ and 20 ′ [ 5] Lower upper chuck 71 [6] Precise positioning of mother boards 10 'and 20' [7] Pressure fixing [8] Temporary fixing by UV irradiation [9] Electrostatic chuck OFF, upper chuck 71 raised [10] Opening the accommodation space 70b to the atmosphere [11] Fixing by UV irradiation In such a bonding process of [1] to [11], precise alignment is not performed in the atmosphere, but the mother substrate 10 ′ is surely formed. 20 ′ can be bonded together.

As described above, in the liquid crystal device 100 according to the present embodiment and the manufacturing method thereof, the seal members 52a and 52b constitute the annular portion 58 and the joint portion 59. Therefore, the annular portion 58 is formed by a part of the joint portion 59. And the leakage of the liquid crystal layer 50 from the joint portion 59 can be suppressed, and the reliability of the liquid crystal device 100 can be improved. Further, since the joint portion 59 is formed toward the outer side of the annular portion 58, it is only necessary to widen the width of the joint portion 59 outside the annular portion 58 when the bonding process is performed. Further, the protrusion of the seal members 52a and 52b can be suppressed. In addition, the cell gap can be kept uniform without affecting the cell gap inside the annular portion 58.
Further, compared to the prior art, it is not necessary to adjust the member width of each of the annular portion 58 and the joint portion 59, and the annular portion 58 and the joint portion 59 can be formed of members having the same width, and can be easily sealed The members 52a and 52b can be formed. Accordingly, the dispenser can be easily controlled, and the drawing of the seal members 52a and 52b can be completed in a short time. Further, it is not necessary to consider the variation in the amount of the sealing material remaining in the dispenser and the variation in the viscosity between lots of the sealing material, and the shape of the sealing members 52a and 52b can be easily managed.

  In addition, since the conductive seal member 52b conducts the conduction pad 54 and the COM electrode 57, it not only holds the liquid crystal layer 50 inside the annular portion 58 but also conducts the conduction pad 54 and the COM electrode 57. Can be made. Further, since the insulating seal member 52a is formed in the non-conductive region on the surface of the routing wiring 55 and the SEG electrode 56, not only the liquid crystal layer 50 is held inside the annular portion 58 but also the non-conductive region. In this case, electrical insulation can be obtained.

  In addition, the insulating seal member 52a and the conductive seal member 52b can form an annular portion 58 having conductivity and electrical insulation, and a joint 59 where the conductive and electrical insulation members are joined is formed. Can be formed. In this case, the joint portion 59 is formed between the conducting region and the non-conducting region. Since the joint portion 59 is formed toward the outside of the annular portion 58, the bonding step is performed. When applied, it is only necessary to widen the width of the joint portion 59 outside the annular portion 58, and the seal members 52a and 52b can be prevented from protruding inside the annular portion 58. In addition, the cell gap can be kept uniform without affecting the cell gap inside the annular portion 58.

  Further, since the relationship of the above (Equation 7) to (Equation 9) is established, the first seal layer 59a and the second seal layer 59b are connected regardless of variations in the thickness of the seal members 52a and 52b. The joint portion 59 can be formed by reliably joining. Further, in the conventional method, it is necessary to increase the thickness of the seal members 52a and 52b at the joint portion 59, or to increase the distance between overlapping portions in order to suppress the thickness to a minimum. However, there is a problem that the drawing time of the seal member becomes longer due to the complexity. On the other hand, in this embodiment, the seal members 52a and 52b can be drawn at the same speed in all portions. Further, since the writing start portion and the writing end portion are portions sufficiently separated from the liquid crystal device 100, complicated control can be eliminated. Therefore, the drawing time can be greatly shortened, and the thickness of 52a and 52b in the inner direction of the liquid crystal device 100 at the joint portion 59 can be eliminated.

Further, the liquid crystal device 100 is manufactured by cutting out the mother substrate 10 ′ for the TFD substrate and the mother substrate 20 ′ for the counter substrate, and thus, a plurality of liquid crystal devices 100 can be taken out, and the productivity is excellent. Manufacturing method can be realized.
In the manufacturing method of the liquid crystal device 100, the insulating seal member 52a is continuously and collectively applied so as to straddle the TFD forming region 11 and the mutual boundary portion 12, and the conductive seal member 52b is also continuously and collectively applied. Since it is applied, an effect superior to the conventional one can be obtained.
Specifically, with respect to the arrangement direction of the plurality of TFD formation regions 11, a single process from the start of drawing of the conductive seal member 52b to the end of drawing and a single process from the start of drawing of the insulating seal member 52a to the end of drawing. The seal members 52a and 52b can be collectively formed. Thereby, the sealing members 52a and 52b can be formed easily and quickly, and a manufacturing method with excellent productivity can be realized.
On the other hand, when the seal members 52a and 52b are formed in each of the plurality of TFD formation regions 11 as in the prior art, drawing start and drawing end of the seal members 52a and 52b must be performed for each TFD formation region 11. Therefore, more drawing start and drawing end must be repeated. Accordingly, since the discharge and non-discharge of the sealing material occur continuously, it becomes difficult to stably flow the sealing material in the dispenser, and the amount of the sealing material to be discharged tends to vary. In addition, the dispenser must be scanned on the TFD substrate mother substrate 10 ', which complicates the operation of the dispenser.
On the other hand, in this embodiment, since the conductive seal member 52b and the insulating seal member 52a are formed continuously and collectively in the arrangement direction of the TFD formation region 11, the TFD formation region 11 It is only necessary to start and end drawing for each column or row, and therefore the number of drawing start and end of drawing can be reduced. Accordingly, the conductive seal member 52b and the insulating seal member 52a can be formed continuously and collectively while the seal material in the dispenser is stably flowed. Further, the seal members 52a and 52b can be formed in a short time. Further, since the dispenser is not ejected and does not scan the TFD substrate mother substrate 10 ', it is possible to prevent the sealing material filled in the dispenser from dripping inadvertently. Therefore, the operation of the dispenser can be simplified, and variations in the viscosity of the sealing material and variations in the discharge amount can be suppressed.
Further, since the seal members 52a and 52b of the TFD formation region 11 formed by such a method are connected via the joint portion 59, the liquid crystal 50 can be prevented from leaking at the mutual boundary portion 12.

Next, a second embodiment of a method for manufacturing a liquid crystal device will be described.
In the following description, a different part from said embodiment is demonstrated, the same code | symbol is attached | subjected about the same structure and the same process, and description is abbreviate | omitted.

(Second Embodiment)
FIG. 19 is a view for explaining the method for manufacturing the liquid crystal device according to the second embodiment of the invention. FIG. 19 is a plan view for explaining a method for forming the seal member 52. FIG. 19 is an enlarged view of the symbol F in FIG. 18B.

  In the first embodiment, the first seal layer 59a and the second seal layer 59b have a curved portion 59c. On the other hand, in the present embodiment, the first seal layer 59a and the second seal layer 59b are provided. The seal layer 59b has an inclined portion 59d. Then, as described above, the first seal layer 59a and the second seal layer 59b are crushed and joined by bonding the mother substrate 10 ′ for the TFD substrate and the mother substrate 20 ′ for the counter substrate. The joint portion 59 shown in FIG. 4 is formed.

Next, with reference to FIG. 19, the shape dimensions of the first seal layer 59a and the second seal layer 59b will be described. Below,
c3: Chamfering amount of the inclined portion 59d d3: distance between center lines of the first seal layer 59a and the second seal layer 59b w3: defined as the width of the seal members 52a and 52b after the bonding step. Then
In this embodiment,
The relationship is established. Furthermore,
The relationship is established.

  In this way, as will be verified in the examples described later, even if the thickness of the seal members 52a and 52b varies, the first seal layer 59a and the second seal layer 59b are reliably bonded. Thus, the joint portion 59 can be formed. In addition, it is possible to draw the seal members 52a and 52b at the same speed in all the parts, and the writing start part and the writing end part are parts sufficiently away from the liquid crystal device, so that complicated control is required. Disappear. With these effects, the drawing time can be significantly shortened to 1/2 to 1/3 of the conventional one, and the thickness of the sealing members 52a and 52b in the inner direction of the liquid crystal device 100 at the joint portion 59 can be eliminated.

  In the present embodiment, the inclined portion 59d is formed by the chamfering amount c3. In other words, the inclined portion 59d is formed to be inclined at an angle of 45 ° with respect to the center line direction of the second seal layer 59b. The present invention does not limit the formation of the inclined portion 59d at an angle of 45 ° in this way. The inclined portion 59d may be formed by swinging the angle to an acute angle side or an obtuse angle side from 45 °.

  Moreover, in said embodiment, although the thickness of the sealing members 52a and 52b is made the same, you may make this different. For example, the insulating seal member 52a may be 0.5 mm, the conductive seal member 52b may be 0.7 mm, and the conductive seal member 52b may be thicker than the insulating seal member 52a.

Next, third to seventh embodiments of the liquid crystal device will be described.
In the following description, a different part from said embodiment is demonstrated, the same code | symbol is attached | subjected to the same structure and description is abbreviate | omitted. Note that the liquid crystal devices shown in the third to seventh embodiments are manufactured using the manufacturing method of any one of the first and second embodiments.

(Third embodiment)
First, a liquid crystal device according to a third embodiment of the invention will be described.
FIG. 20 is a plan view of each component of the liquid crystal device according to the present embodiment as viewed from the counter substrate side. In the present embodiment, a conductive seal member 52b is formed between the image display region 4 and the scanning signal drive circuit 110, and an insulating seal member 52a is provided on the opposite side of the conductive seal member 52b via the joint portion 59. It has a formed configuration. That is, as compared with the first embodiment, the positions of the insulating seal member 52a and the conductive seal member 52b are opposite to each other.

On the TFD substrate 10, the conductive pad 54 is formed on the side of the data signal driving circuit 120 and is connected to the data signal driving circuit 120 through the lead wiring 55. On the other hand, in the counter substrate 20, the COM electrode 57 is formed outside the image display area 4 and extends toward the conductive pad 54. The conductive sealing member 52 b is sandwiched between the COM electrode 57 and the conductive pad 54, so that the conductive particles electrically connect the COM electrode 57 and the conductive pad 54. Here, since the conductive seal member 52b is formed on the wiring of the SEG electrode 56, a short circuit with the adjacent wiring of the wiring of the SEG electrode 56 is considered.
As described above, even when the conductive seal member 52b is formed between the image display region 4 and the scanning signal drive circuit 110, the same effect as the above-described embodiment can be obtained.

(Fourth embodiment)
Next, a liquid crystal device according to a fourth embodiment of the invention is described.
FIG. 21 is a plan view of each component of the liquid crystal device according to the present embodiment as viewed from the counter substrate side. In the present embodiment, similarly to the third embodiment, a conductive seal member 52b is formed between the image display region 4 and the scanning signal drive circuit 110, and the opposite side of the conductive seal member 52b via the joint portion 59. The insulating seal member 52a is formed on the surface.

In the present embodiment, unlike the first to third embodiments, the scanning signal driving circuit 110 and the data signal driving circuit 120 are formed on the counter substrate 20. Therefore, the scanning signal driving circuit 110 is connected to the SEG electrode 56 via the connection pad 54.
Accordingly, in the counter substrate 20, the conductive pad 54 is formed on the side of the scanning signal driving circuit 110 and is connected to the scanning signal driving circuit 110 through the lead wiring 60. Further, the data signal driving circuit 120 is connected to the pixel electrode 9 through the COM electrode 57. On the other hand, in the TFD substrate 10, the SEG electrode 56 is formed outside the image display region 4 and extends toward the conductive pad 54. The conductive seal member 52 b is sandwiched between the SEG electrode 56 and the conductive pad 54, so that the conductive particles electrically connect the SEG electrode 56 and the conductive pad 54. Here, since the conductive seal member 52b is formed on the wiring of the COM electrode 57, the short circuit between the wiring of the COM electrode 57 and the adjacent wiring is considered.
As described above, even when the conductive seal member 52b is formed between the image display region 4 and the scanning signal drive circuit 110, the same effect as the above-described embodiment can be obtained.
The liquid crystal device shown in the first and second embodiments is an active matrix type provided with the TFD element 40 as a switching element. However, the present invention is not limited to this and is a passive type liquid crystal device. Is also applicable.

(Fifth embodiment)
Next, a liquid crystal device according to a fifth embodiment of the invention is described.
The liquid crystal device of this embodiment is an active matrix type liquid crystal device using a thin film transistor (hereinafter abbreviated as TFT) as a switching element. FIG. 22 is a plan view of each component of the liquid crystal device according to the present embodiment as viewed from the counter substrate side.

Here, in the liquid crystal device having the TFD shown in the first and second embodiments, a potential is applied from the SEG electrode 56 of the TFD substrate 10 to the pixel electrode 31, and the pixel is applied from the COM electrode 57 of the counter substrate 20. By applying a potential to the electrode 9, a voltage is applied to the liquid crystal layer 50 between the pixel electrodes 31 and 9. That is, the TFD is composed of a two-terminal element.
On the other hand, in the crystal device including the TFT shown in this embodiment, a counter electrode in which a potential is applied to the pixel electrode by a signal applied from the data line and the gate line formed on the TFT substrate and the electrode is formed on the entire surface. Is applied to the liquid crystal layer 50. That is, the TFT is composed of a three-terminal element.

As shown in FIG. 22, the liquid crystal device 101 includes a data routing wiring 85, a gate routing wiring 86, an insulating seal member 52a, a conductive seal member 52b, and a dot conduction portion (first conduction portion, conduction) on the TFT substrate 102. Area) 87. Here, the insulating seal member 52a is formed on the left side of the portion indicated by the symbol Y, and the conductive seal member 52b is formed on the right side of the portion indicated by the symbol Y. The liquid crystal layer 50 is held inside the annular portion 58 surrounded by the seal members 52a and 52b, and the image display region 4 is formed. In addition, a joint 59 is formed on the line Y. Further, the conductive seal member 52b extends on the spot conduction portion 87. That is, the TFT substrate 102 and the counter substrate are bonded to each other, so that the TFT substrate 102 is electrically connected to the counter substrate through the spot conduction portion 87.
As described above, in the liquid crystal device 101 using the TFT, by forming the conductive seal member 52b on the spot conduction portion 87, the conventionally used spot seal for conduction between the upper and lower substrates is eliminated. Can do.

(Modification of the fifth embodiment of the liquid crystal device)
FIG. 23 is a diagram showing a modification of the fifth embodiment, and is a plan view of each component of the liquid crystal device as viewed from the counter substrate side.
In this modification, as shown in FIG. 23, the gate routing wiring 86 is formed only on one side of the image display area 4.
Even in such a configuration, the same effects as those of the fifth embodiment can be obtained.

(Sixth embodiment)
Next, a liquid crystal device according to a sixth embodiment of the invention will be described.
FIG. 24 is a plan view of each component of the liquid crystal device according to the present embodiment as viewed from the counter substrate side. In addition, the liquid crystal device of the present embodiment includes a TFT as in the fifth embodiment.
As shown in FIG. 24, in the liquid crystal device 101, in the annular portion 58, the lengths of the insulating seal member 52a and the conductive seal member 52b are equal. Other configurations are the same as those in the fifth embodiment. Specifically, the joint portion 59 is disposed at a substantially central portion of one side of the annular portion 58, and the conductive seal member 52b is formed on the right side of the portion indicated by the symbol Z, and the insulating seal member 52a is formed on the left side thereof. Is formed. Thereby, the lengths of the insulating seal member 52a and the conductive seal member 52b are equal.

  In such a configuration, when each of the seal members 52a and 52b is drawn with another dispenser, the tact time of the apparatus can be made uniform, and the liquid crystal device 101 can be produced efficiently. Further, the TFT substrate 102 and the counter substrate are electrically connected by a conductive seal member 52 b formed on the spot conduction portion 87.

(Seventh embodiment)
Next, a liquid crystal device according to a seventh embodiment of the invention will be described.
FIG. 25 is a plan view of each component of the liquid crystal device according to the present embodiment as viewed from the counter substrate side. In addition, the liquid crystal device of the present embodiment includes a TFT as in the fifth embodiment, and can be used for a large display such as a large TV.
As shown in FIG. 25, the liquid crystal device 103 includes one seal member 52. Specifically, in the first to sixth embodiments, the seal member 52 is formed by both the conductive seal member and the insulating seal member. However, in this embodiment, the seal member 52 is entirely formed by the insulating seal member. It has become.

Further, in the liquid crystal layer 103, the annular portion 58 has the liquid crystal layer 50 inside thereof, and the joint portion 59 closes the annular portion 58 at one place. The annular portion 58 and the joint portion 59 are formed continuously and collectively, and are formed by applying the seal member 52 by so-called “one-stroke writing”. In other words, the seal member 52 is formed from one end of one member toward the other end, and the one end and the other end are joined to form a joint portion 59. Further, the liquid crystal layer 50 is held inside the annular portion 58 surrounded by one member. Here, the joint portion 59 is formed toward the outside of the annular portion 58, and is not formed so as to overlap on the path of the annular portion 58.
In addition, a conductive member which is a member different from the seal member 52 is formed in the hit point conducting portion 87, and conduction between the TFT substrate 102 and the counter substrate is obtained in the hit point conducting portion 87.
In this way, since the annular portion 58 is closed by the joint portion 59 in which one end and the other end of the seal member 52 are joined at one place, the number of the joint portions 59 can be minimized. Compared with the case where a plurality of liquid crystal devices are provided, a liquid crystal device in which cell gap defects are more reliably suppressed can be realized. Further, since the joint portion 59 is formed toward the outer side of the annular portion 58, it is only necessary to widen the width of the joint portion 59 outside the annular portion 58 when the bonding process is performed. Further, the protrusion of the seal members 52a and 52b can be suppressed. In addition, the cell gap can be kept uniform without affecting the cell gap inside the annular portion 58.

Next, examples of the present invention will be described.
In this embodiment, the shape of the first seal layer 59a and the second seal layer 59b shown in the following <1> and <2>, the shape of the bonding portion 59 formed by the bonding step, the depth of the depression, The result of having verified the ratio of the width of a sealing member, and the state of a panel is shown.
<1> When the first seal layer 59a and the second seal layer 59b have curved portions 59c in the recesses W and X (FIG. 18C, the first embodiment described above).
<2> In the recesses W and X, the first and second seal layers 59a and 59b have inclined portions 59d (FIG. 19, the second embodiment described above).

<1> When the first seal layer 59a and the second seal layer 59b have curved portions 59c in the recesses W and X (FIG. 18C, the first embodiment described above).
Table 1 shows the shape of the first seal layer and the second seal layers 59a and 59b in the first embodiment, the width w3 of the seal member after bonding is fixed to 0.5 mm, the radius R3 of the curved portion 59c and the seal The result of investigating the depth h3 of the dent (FIG. 26), the ratio h3 / w3 of the width w3 of the seal member, and the panel state when the center line distance d3 of the member is changed is shown.

  In Table 1, the portion marked with * 1 has a ratio (h3 / w3) of the indentation depth h3 of the joint portion 59 to the width w3 of the seal member of 1.0 or less, which is a range in which the reliability of the panel can be secured. Further, the portion * 2 is a level where there is no practical problem in the joint portion 59, but the seal member is not recessed and a slight rise (FIG. 27) occurs. Further, in the portion * 3, h3 / w3 is larger than 0.1 and 0.5 or less, which is an ideal range.

  Further, in Table 1, when d3 / w3 and R3 / w3 of the boundary where the reliability can be ensured and the boundary where the protrusion is generated are plotted, the result is as shown in FIG. Here, the value of R3 / w3 when h3 / w3 serving as the boundary is 0.1, 0.5, and 1.0 was obtained by interpolation.

  Next, Table 2 shows the shapes of the first seal layer and the second seal layers 59a and 59b in the first embodiment, the width w3 of the seal member after bonding is fixed to 0.7 mm, and the radius of the curved portion 59c. The result of investigating the depth h3 of the dent, the ratio h3 / w3 of the width w3 of the seal member, and the panel state when the center line distance d3 of the seal member is changed is shown.

  In Table 2, the ratio * 1 is a range (h3 / w3) of the indentation depth h3 of the joint portion 59 and the width w3 of the seal member being 1.0 or less, which is a range in which the reliability of the panel can be secured. Further, the portion * 2 is a level where there is no practical problem in the joint portion 59, but the seal member is not recessed and a slight rise (FIG. 27) occurs. Further, in the portion * 3, h3 / w3 is larger than 0.1 and smaller than 0.5, which is an ideal range.

Further, in Table 2, when d3 / w3 and R3 / w3 of the boundary where the reliability can be ensured and the boundary where the protrusion is generated are plotted, the result is as shown in FIG.
Here, in the case where the width w3 of the seal member is 0.5 mm and 0.7 mm, the boundary where the reliability can be ensured and the boundary where the convex portion is generated at the joint portion are the boundaries between d3 / w3 and R3 / w3. When FIG. 28 and FIG. 29 are plotted on the same graph, FIG. 30 is obtained.
As shown in FIG. 30, even when the width w3 of the sealing member after bonding is 0.5 mm or 0.7 mm, even if the width w3 is other than that, Get on the 30th line.

From FIG. 30, it can be seen that the relationship between d3 / w3 and R3 / w3 is on the same straight line regardless of the width of the seal member.
From this, in order to ensure reliability regardless of the thickness of the seal member,
Ideally,
It will be necessary to satisfy.

Further, the convexity (thickness) of the sealing member at the joint portion is not a level that is practically problematic because it is 20% or less with respect to the width of the sealing member. However, in order to completely eliminate the swelling of the joint including the variation in the thickness of the seal member,
Is ideal.

  By defining the shapes of the first seal layer and the second seal layers 59a and 59b in this way, the same effect as the above embodiment can be obtained. On the other hand, in the conventional method, it is necessary to increase the thickness of the sealing member at the joint, or to increase the distance between the overlapping portions in order to suppress the thickness to a minimum, and the control of the apparatus becomes complicated. Thus, there is a problem that the drawing time of the seal member becomes long. On the other hand, in the method of this embodiment, it is possible to draw the seal member at the same speed in all parts, and the writing start part and the writing end part are parts sufficiently away from the panel, so that complicated control is performed. Is no longer necessary. With these effects, the drawing time can be greatly shortened to 1/2 to 1/3 of the conventional one, and the thickness of the sealing member toward the inner side of the panel at the joint portion of the sealing member can be eliminated.

<2> In the recesses W and X, the first and second seal layers 59a and 59b have inclined portions 59d (FIG. 19, the second embodiment described above).
Table 3 shows the shape of the first seal layer and the second seal layers 59a and 59b in the second embodiment, the width w3 of the seal member after bonding is fixed to 0.5 mm, and the chamfering amount c3 of the inclined portion 59d. The result of investigating the depth h3 of the dent, the ratio h3 / w3 of the width w3 of the seal member, and the panel state when the center line distance d3 of the seal member is changed is shown.

  In Table 3, the portion marked with * 1 has a ratio (h3 / w3) of the recess depth h3 of the joint portion 59 to the width w3 of the seal member of 1.0 or less, which is a range in which the reliability of the panel can be secured. Further, the portion * 2 is a level where there is no practical problem in the joint portion 59, but the seal member is not recessed and a slight rise (FIG. 27) occurs. Further, in the portion * 3, h3 / w3 is larger than 0.1 and 0.5 or less, which is an ideal range.

  In Table 3, when d3 / w3 and c3 / w3 of the boundary where the reliability can be ensured and the boundary where the protrusion is generated are plotted, the result is as shown in FIG. Here, the value of c3 / w3 when h3 / w3 serving as the boundary is 0.5 and 1.0 is obtained by interpolation.

  Next, Table 4 shows the shape of the first seal layer and the second seal layers 59a and 59b in the second embodiment, the width w3 of the seal member after bonding is fixed to 0.7 mm, and the chamfering of the inclined portion 59d. The change of the depth c3 of the dent when changing the amount c3 and the center line distance d3 of the seal member and the result of investigating the panel state are shown.

  In Table 4, the portion indicated by * 1 has a ratio (h3 / w3) between the recess depth h3 of the joint portion 59 and the width w3 of the seal member of 1.0 or less, and is within a range where the reliability of the panel can be secured. Further, the portion * 2 is a level where there is no practical problem in the joint portion 59, but the seal member is not recessed and a slight rise (FIG. 27) occurs. Further, in the portion * 3, h3 / w3 is larger than 0.1 and smaller than 0.5, which is an ideal range.

Also, in Table 4, when d3 / w3 and c3 / w3 of the boundary where the reliability can be ensured and the boundary where the protrusion is generated are plotted, the result is as shown in FIG. Here, the value of c3 / w3 when h3 / w3 serving as the boundary is 0.1, 0.5, and 1.0 was obtained by interpolation.
Here, in the case where the width w3 of the seal member is 0.5 mm and 0.7 mm, the boundaries of d3 / w3 and c3 / w3 that can ensure reliability (FIGS. 31 and 32) on the same graph. Is plotted as shown in FIG.
As shown in FIG. 33, even when the width w3 of the seal member after bonding is 0.5 mm or 0.7 mm, even if the width w3 is other than that, Get on line 33.

From FIG. 33, it can be seen that the relationship between d3 / w3 and c3 / w3 is plotted on the same straight line regardless of the width of the seal member.
From this, in order to ensure reliability regardless of the thickness of the seal member,
Ideally,
It will be necessary to satisfy.

Further, the convexity (thickness) of the sealing member at the joint portion is not a level that is practically problematic because it is 20% or less with respect to the width of the sealing member. However, in order to completely eliminate the swelling of the joint including the variation in the thickness of the seal member,
Is ideal.

  Thus, by defining the shapes of the first seal layer and the second seal layers 59a and 59b, the same effects as those of the above-described embodiment can be obtained. That is, the seal member can be drawn at the same speed in all the parts, and since the writing start part and the writing end part are sufficiently away from the panel, complicated control is not required. With these effects, the drawing time can be greatly shortened to 1/2 to 1/3 of the conventional one, and the thickness of the sealing member toward the inner side of the panel at the joint portion of the sealing member can be eliminated.

(Electronics)
Next, specific examples of the electronic device of the present invention will be described.
FIG. 34A is a perspective view showing an example of a mobile phone. In FIG. 34A, reference numeral 700 denotes a mobile phone main body, and reference numeral 701 denotes a liquid crystal display unit provided with the liquid crystal device of the above embodiment.
FIG. 34B is a perspective view showing an example of a portable information processing apparatus such as a word processor or a personal computer. In FIG. 34B, reference numeral 800 denotes an information processing device, 801 denotes an input unit such as a keyboard, 803 denotes an information processing body, and 802 denotes a liquid crystal display unit including the liquid crystal device of the above embodiment.
FIG. 34C is a perspective view showing an example of a wristwatch type electronic device. In FIG. 34C, reference numeral 900 denotes a watch body, and reference numeral 901 denotes a liquid crystal display unit including the liquid crystal device of the above embodiment.
Since the electronic devices shown in FIGS. 34A to 34C are provided with the liquid crystal device of the above-described embodiment, they are electronic devices having a display portion that is excellent in reliability and can display a high quality display.

1 is a plan view of a liquid crystal device according to a first embodiment of the present invention. FIG. 3 is a cross-sectional configuration diagram taken along the line H-H ′ of the liquid crystal device according to the first embodiment of the invention. 1 is a plan view of a main part of a liquid crystal device according to a first embodiment of the present invention. 1 is a plan view of a main part of a liquid crystal device according to a first embodiment of the present invention. 1 is an equivalent circuit diagram of a liquid crystal device according to a first embodiment of the present invention. FIG. 3 is a plan view of various elements of the liquid crystal device according to the first embodiment of the present invention. The figure for demonstrating schematically the manufacturing method of the liquid crystal device of this invention. The block diagram of the device manufacturing apparatus used with the manufacturing method of the liquid crystal device of this invention. The block diagram of the board | substrate supply / removal part and material supply part which are used with the manufacturing method of the liquid crystal device of this invention. The block diagram of the board | substrate bonding part used with the manufacturing method of the liquid crystal device of this invention. The block diagram of the precision alignment part used with the manufacturing method of the liquid crystal device of this invention. FIG. 3 is a configuration diagram showing an example of a droplet discharge head used in the method for manufacturing a liquid crystal device of the present invention. FIG. 13 is an explanatory diagram showing a drive voltage waveform and operation of a piezoelectric element of the droplet discharge head of FIG. 12. 4A and 4B illustrate a method for manufacturing a liquid crystal device of the present invention. 4A and 4B illustrate a method for manufacturing a liquid crystal device of the present invention. 4A and 4B illustrate a method for manufacturing a liquid crystal device of the present invention. The figure which shows the formation method of the sealing member in the manufacturing method of the liquid crystal device of this invention. FIG. 4 is an external view of a mother substrate in the method for manufacturing a liquid crystal device of the present invention. The top view which shows the principal part of the sealing member of the liquid crystal device which concerns on 2nd Embodiment of this invention. The top view of the liquid crystal device which concerns on 3rd Embodiment of this invention. The top view of the liquid crystal device which concerns on 4th Embodiment of this invention. The top view of the liquid crystal device which concerns on 5th Embodiment of this invention. The top view of the liquid crystal device which concerns on the modification of 5th Embodiment of this invention. The top view of the liquid crystal device which concerns on 6th Embodiment of this invention. The top view of the liquid crystal device which concerns on 7th Embodiment of this invention. The figure for demonstrating the Example of this invention. The figure for demonstrating the Example of this invention. The figure for demonstrating the Example of this invention. The figure for demonstrating the Example of this invention. The figure for demonstrating the Example of this invention. The figure for demonstrating the Example of this invention. The figure for demonstrating the Example of this invention. The figure for demonstrating the Example of this invention. FIG. 14 is a perspective view showing an electronic device of the invention. The figure for demonstrating a prior art. The figure for demonstrating a prior art. The figure for demonstrating a prior art.

Explanation of symbols

10 TFD substrate (first substrate), 10 ′ mother substrate for TFD substrate (first base material), 11 TFD formation region (first element region), 12, 22 mutual boundary portion, 20 counter substrate (second substrate), 20 'mother substrate for opposing substrate (second base material), 21 counter electrode forming region (second element region), 50 liquid crystal layer, 52 sealing member, 52a insulating sealing member (second sealing member), 52b conductive seal Member (first seal member), 58 annular portion, 59 joint portion, 59a first seal layer, 59b second seal layer, 58a first side, 58b second side, 59c curved portion, 59d inclined portion, 100, 101, 103 Liquid crystal device, 700, 800, 900 Electronic equipment

Claims (2)

A first substrate and a second substrate disposed opposite to each other with a liquid crystal layer interposed therebetween;
A sealing member formed on a peripheral portion of the two substrates, a first sealing member that seals the liquid crystal layer, and a sealing member that includes an annular portion that is configured by an individual second sealing member;
A method of manufacturing a liquid crystal device comprising:
A region surrounded by the first seal member and the second seal member is formed on the inner side of the first seal member having the first seal layer at both ends and the second seal member having the second seal layer at both ends. Forming at opposite positions so as to be formed;
Forming the liquid crystal layer inside a region surrounded by the first seal member and the second seal member;
When the first substrate and the second substrate are bonded together, the first seal layer and the second seal layer are pressed together to join the first seal layer and the second seal layer. Are formed on the outer sides of the two opposite sides of the annular portion, and the first seal member and the second seal member are connected via the joint portion;
A method for manufacturing a liquid crystal device, comprising: Manufactured by the method of manufacturing a liquid crystal device according to claim 1;
A liquid crystal device characterized by the above.